Heat-conducting fin manufacturing method and heat-conducting fin

Abstract

The invention discloses a heat-conducting fin manufacturing method and a heat-conducting fin, and relates to the technical field of heat-conducting fin production, and the heat-conducting fin manufacturing method comprises the following steps: providing a conductor layer; a first covering film is attached to the first surface of the conductor layer; providing a second covering film, coating a first surface of the second covering film with a thermosetting adhesive to form a first bonding layer, and coating a second surface of the second covering film with the thermosetting adhesive to form a second bonding layer; the second covering film is attached to the second surface of the conductor layer, a substrate is obtained, and the first bonding layer is located between the conductor layer and the second covering film; pasting the substrate on the aluminum plate to form a heat-conducting sheet; and pressing and forming the heat-conducting sheet through pressing equipment. The two sides of the second covering film are coated with the thermosetting adhesive, the second covering film and the aluminum plate are pressed in a one-time mode, and the traditional second covering film pressing process and time are reduced; the defects that in the prior art, repeated transferring and repeated pressing are conducted, labor is consumed, and the production efficiency is low are overcome, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat conducting sheet production, and in particular to a heat conducting sheet manufacturing method and a heat conducting sheet. Background Art

[0002] Thermal conductive sheet is usually a soft electric heating film element made of organic materials with high temperature resistance, high thermal conductivity, good insulation performance and good strength, and metal heating film circuit. Because it is a thin sheet product, it has good softness, can be in full close contact with the heated or heat-conducting object, and the shape can be changed according to the requirements of heating or heat conduction. It can be more easily close to the heating / heat-conducting object, and it can more easily transfer heat to the required place.

[0003] With the application and development of power battery technology, the needs of customers are gradually tending towards more integrated heating film solutions to reduce labor and improve production efficiency. Due to the limitations of equipment, materials and other factors in the thermal conductive sheet production industry, the traditional heating film structure is a PI film (referred to as the A side) covered with brass or steel substrate structure, which is designed and etched to form a chip; usually a layer of covering film (referred to as the B side) is attached to the surface of the chip as an insulating layer on the surface.

[0004] As the application requirements are upgraded, another layer of aluminum plate needs to be attached to the B side. The general practice is: after the cover film is attached (B side), it is pressed and then baked for one hour; then a layer of glue is applied to the B side by a laminating machine, and then pressed at a certain temperature and 25 minutes to form an integral structure.

[0005] The process of the heat conducting sheet in the above-mentioned related technology is complicated, requiring multiple transfers and multiple pressings, which is labor-intensive and has low production efficiency. In addition, the multiple transfers and pressings result in a low yield. Summary of the invention

[0006] In order to solve the above problems and improve the production efficiency of thermal conductive sheets, the present application provides a thermal conductive sheet manufacturing method and a thermal conductive sheet.

[0007] On the one hand, the present application provides a method for manufacturing a thermal conductive sheet, which adopts the following technical solution:

[0008] A method for manufacturing a thermal conductive sheet comprises the following steps:

[0009] providing a conductor layer, the conductor layer comprising a first surface and a second surface opposite to each other;

[0010] Laminating a first covering film on the first surface of the conductor layer;

[0011] Providing a second covering film, coating a first surface of the second covering film with a thermosetting adhesive to form a first adhesive layer, and coating a second surface of the second covering film with a thermosetting adhesive to form a second adhesive layer;

[0012] Laminating the second covering film to the second surface of the conductor layer to obtain a substrate, wherein the first adhesive layer is located between the conductor layer and the second covering film;

[0013] The substrate is pasted on the aluminum plate to form a heat conducting sheet;

[0014] The thermal conductive sheet is pressed into shape by a pressing device.

[0015] Optionally, the providing of the second covering film, coating the first surface of the second covering film with a thermosetting adhesive to form a first adhesive layer, and coating the second surface of the second covering film with a thermosetting adhesive to form a second adhesive layer, further comprises:

[0016] A first release film is attached to the first adhesive layer, and a second release film is attached to the second adhesive layer.

[0017] Optionally, before pasting the substrate onto the aluminum plate to form the heat conducting sheet, the method further comprises:

[0018] Tear off the second release film;

[0019] Paste an isolation film on the half-broken groove of the aluminum plate corresponding to the second covering film;

[0020] The substrate is pasted on an aluminum plate to form a heat conducting sheet, and a half-segment groove is opened at the end of the aluminum plate, and the half-segment groove corresponds to the welding pad hole position of the substrate.

[0021] Optionally, a gasket is provided at the half-broken groove of the aluminum plate, and the thickness of the gasket is the same as the thickness of the aluminum plate.

[0022] Optionally, the isolation film is a PI film.

[0023] Optionally, the thickness of the first adhesive layer and the second adhesive layer is 30um-35um.

[0024] Optionally, after laminating the second covering film on the second surface of the conductor layer to obtain the substrate, the method further comprises:

[0025] The substrate is placed in a laminator for pre-pressing to discharge air bubbles in the thermosetting adhesive.

[0026] Optionally, the pre-pressing temperature is 80°C-100°C, the pressure is 10N-20N, and the pre-pressing time is 50s-90s.

[0027] Optionally, before laminating the second covering film on the second surface of the conductor layer to obtain the substrate, the method further includes:

[0028] Tear off the first release film.

[0029] On the other hand, the present application provides a heat conducting sheet, which adopts the following technical solution:

[0030] A heat-conducting sheet comprises a first covering film, a conductor layer, a second covering film and an aluminum plate which are stacked in sequence;

[0031] The second covering film includes a first surface close to the conductor layer and a second surface close to the aluminum plate. The first surface of the second covering film is coated with a first adhesive layer, and the second surface of the second covering film is coated with a second adhesive layer. The first adhesive layer and the second adhesive layer are both thermosetting adhesives. The first adhesive layer is used to bond the conductor layer and the first surface of the second covering film, and the second adhesive layer is used to bond the aluminum plate and the second surface of the second covering film.

[0032] In summary, the present application includes at least one of the following beneficial technical effects:

[0033] 1. Coat the second cover film on both sides with thermosetting adhesive, and press the second cover film and the pressed aluminum plate into one-step formation, which reduces the traditional second cover film pressing process and time; overcomes the defects of traditional multiple transfers and multiple pressings, labor-intensive, and slow production efficiency, improves production efficiency, and reduces the number of transfers and pressings, improves the yield rate, and reduces the difficulty and cost of foreign matter control.

[0034] 2. In the process of pasting the substrate on the aluminum plate, there is a half-broken groove at the end of the aluminum plate, which is used to leak out the pad hole position for easy connection. Therefore, when pressing down to paste the substrate, the substrate here will sag downward, affecting the overall quality of the thermal conductive sheet. Therefore, a gasket is set at the half-broken groove, and the thickness of the gasket is equal to the thickness of the aluminum plate, so that the upper surface of the gasket is flush with the aluminum plate. When pressing the substrate, the pad hole position of the substrate contacts the gasket, ensuring the overall flatness of the substrate and improving the overall quality. An isolation film is pasted at the pad hole position to prevent the second adhesive layer on the second covering film from adhering to the gasket. After the aluminum plate is pasted, it is easy to remove the gasket. In addition, the isolation film made of PI film also serves to further protect the pad hole position and improve the structural strength here. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a process flow chart of a method for manufacturing a thermal conductive sheet according to an embodiment of the present application;

[0036] Figure 2 is a schematic diagram of the structure of the heat conducting sheet according to an embodiment of the present application;

[0037] Figure 3 It is a schematic diagram of the structure of the aluminum plate of the embodiment of the present application;

[0038] Figure 4 It is a schematic diagram of the structure of the substrate of the embodiment of the present application.

[0039] Explanation of the reference numerals: 1. Conductor layer; 2. First covering film; 21. Thermosetting adhesive layer; 3. Second covering film; 31. First bonding layer; 32. Second bonding layer; 4. Aluminum plate; 41. Half-broken groove; 5. Substrate; 51. Isolation film; 10. Thermal conductive sheet. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0042] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0044] The embodiment of the present application discloses a method for manufacturing a thermal conductive sheet.

[0045] Reference Figure 1 and Figure 2 , a method for manufacturing a thermal conductive sheet, comprising the following steps:

[0046] S1. Provide a conductor layer 1, wherein the conductor layer 1 comprises a first surface and a second surface opposite to each other, and the conductor layer 1 may be copper or steel.

[0047] S2, attaching a first cover film 2 to the first surface of the conductor layer 1, the first cover film 2 being a PI film, and a thermosetting adhesive layer 21 being provided between the first cover film 2 and the conductor layer 1. Specifically, the film-like conductor layer 1 is placed flat on a workbench, the release film on the surface of the first cover film 2 is torn off, and then the first cover film 2 is attached to the first surface of the conductor layer 1. According to the circuit design pattern, the conductor layer 1 is etched to obtain a chip.

[0048] PI film, or polyimide film, is a polymer material with excellent properties and is widely used in electronics, aviation, automobiles, microelectronics and other industries. PI film has the following characteristics: High temperature resistance: PI film has very good high temperature resistance and can usually work stably in the temperature range of -200℃ to +400℃, and can even maintain its structure and performance at higher temperatures. Electrical insulation: PI film is a very excellent insulating material and is widely used in electrical insulation, electronic circuit boards, and protection of electronic components. Mechanical properties: PI film has high mechanical strength and flexibility and can adapt to various complex shapes and process requirements. Chemical stability: PI film is resistant to chemical corrosion and can resist the erosion of many common chemicals. Dimensional stability: PI film is not easy to deform at high temperatures and has good dimensional stability.

[0049] S3, providing a second covering film 3, coating a first surface of the second covering film 3 with a thermosetting adhesive to form a first adhesive layer 31, and coating a second surface of the second covering film 3 with a thermosetting adhesive to form a second adhesive layer 32. The thermosetting adhesive may be an epoxy adhesive.

[0050] Optionally, after providing the second covering film 3, applying thermosetting adhesive on the first surface of the second covering film 3 to form the first adhesive layer 31, and applying thermosetting adhesive on the second surface of the second covering film 3 to form the second adhesive layer 32, the method further includes: laminating a first release film on the first adhesive layer 31, and laminating a second release film on the second adhesive layer 32. The first release film and the second release film may be silicone release films, polyolefin release films, polyimide (PI) release films, etc.

[0051] Optionally, the thermosetting adhesive is coated on the second covering film 3 by a laminating machine, and the thickness of the first adhesive layer 31 and the second adhesive layer 32 is 30um-35um to ensure good adhesion.

[0052] In this embodiment, after the thermosetting adhesive is coated on both sides of the second cover film 3, a release film is then attached to protect the thermosetting adhesive of the first adhesive layer 31 and the second adhesive layer 32 and ensure the cleanliness of the thermosetting adhesive.

[0053] Release film, also known as demoulding film or isolation film, is a thin film material that plays an isolating role during the manufacturing and processing process. Its main function is to prevent the adhesion material or coating from adhering to the surface of the substrate during the product processing, so as to facilitate subsequent processing or processing. In particular, when demoulding, removal, bonding and other operations are required, the release film can protect the surface of the substrate from contamination or damage.

[0054] S4 , attaching the second covering film 3 to the second surface of the conductor layer 1 to obtain a substrate 5 , wherein the first adhesive layer 31 is located between the conductor layer 1 and the second covering film 3 .

[0055] S41, before laminating the second covering film 3 to the second surface of the conductor layer 1 to obtain the substrate 5, the method further includes: tearing off the first release film.

[0056] S42, after laminating the second covering film 3 to the second surface of the conductor layer 1 to obtain the substrate 5, the method further comprises:

[0057] The substrate 5 is placed in a laminator for pre-pressing to discharge air bubbles in the thermosetting adhesive.

[0058] Optionally, the pre-pressing temperature is 80°C-100°C, the pressure is 10N-20N, and the pre-pressing time is 50s-90s.

[0059] In this embodiment, the pressing roller in the laminator presses the substrate 5, thereby squeezing out the bubbles in the thermosetting adhesive on the first cover film 2 and the second cover film 3 in the substrate 5 at one time, thereby improving the bonding strength. The pre-pressing temperature in the laminator is maintained at 80°C-100°C, so that the thermosetting adhesive is firmly bonded.

[0060] S5. Paste the substrate 5 onto the aluminum plate 4 to form a heat conducting sheet 10. The heat conducting sheet 10 can be used in the new energy automobile industry for heating and / or dissipating heat of batteries.

[0061] See also Figure 3 and Figure 4 S51, before the substrate 5 is pasted on the aluminum plate 4 to form the heat conducting sheet 10, the method further includes:

[0062] Tear off the second release film;

[0063] Paste an isolation film 51 on the second covering film 3 at the position corresponding to the half-broken groove 41 of the aluminum plate 4;

[0064] The substrate 5 is pasted on the aluminum plate 4 to form a heat conducting sheet 10 . A half-segment groove 41 is opened at the end of the aluminum plate 4 . The half-segment groove 41 corresponds to the pad hole position of the substrate 5 .

[0065] Optionally, a gasket is provided at the half-broken groove 41 of the aluminum plate 4 , and the thickness of the gasket is the same as the thickness of the aluminum plate 4 .

[0066] Optionally, the isolation film 51 is a PI film, and the thickness of the isolation film 51 is 25 um.

[0067] In this embodiment, during the process of pasting the substrate 5 on the aluminum plate 4, there is a half-broken groove 41 at the end of the aluminum plate 4, which is used to expose the pad hole position for easy connection. Therefore, when pressing down to paste the substrate 5, the substrate 5 here will be concave downward, affecting the overall quality of the thermal conductive sheet 10. Therefore, a gasket is set at the half-broken groove 41, and the thickness of the gasket is equal to the thickness of the aluminum plate 4, so that the upper surface of the gasket is flush with the aluminum plate 4. When pressing the substrate 5, the pad hole position of the substrate 5 contacts the gasket, ensuring the overall flatness of the substrate 5 and improving the overall quality.

[0068] The isolation film 51 is pasted at the pad hole to prevent the second adhesive layer 32 on the second cover film 3 from adhering to the gasket. After the aluminum plate 4 is pasted, it is easy to remove the gasket. The isolation film 51 made of PI film also serves to further protect the pad hole and improve the structural strength here.

[0069] S6. The thermal conductive sheet 10 is pressed into shape by a pressing device, which is a laminator. The pressing device forms an integral structure by pressing at 180 degrees for 25 minutes.

[0070] The solution of the present application is to coat thermosetting adhesive on both sides of the second covering film 3, and press the second covering film 3 and the pressed aluminum plate 4 into one-time formation, thereby reducing the process and time of traditional pressing of the second covering film 3; it overcomes the defects of traditional multiple transfers and multiple pressings, which are labor-intensive and have low production efficiency, improves production efficiency, and because the number of transfers and pressings is reduced, the yield rate is improved, and the difficulty and cost of foreign matter control are reduced.

[0071] In this embodiment, the special-shaped hollow aluminum plate 4 structure is half-connected at the connection. After covering the second covering film 3, a 25UM PI film is used as an isolation film 51 to the position of the half-broken connection between the second covering film 3 and the aluminum plate 4, and then the excess aluminum plate 4 at the connection of the aluminum plate 4 is broken after a one-time pressing to expose the required design structure, and all the openings on the film surface are the same as the previous process; the process of the thermal conductive sheet 10 is advanced, which saves labor and improves production efficiency.

[0072] The embodiment of the present application also discloses a heat conductive sheet.

[0073] See also Figure 2A thermally conductive sheet 10 includes a first covering film 2, a conductor layer 1, a second covering film 3 and an aluminum plate 4 which are stacked in sequence.

[0074] The second covering film 3 includes a first surface close to the conductor layer 1 and a second surface close to the aluminum plate 4. The first surface of the second covering film 3 is coated with a first adhesive layer 31, and the second surface of the second covering film 3 is coated with a second adhesive layer 32. The first adhesive layer 31 and the second adhesive layer 32 are both thermosetting adhesives. The first adhesive layer 31 is used to bond the conductor layer 1 to the first surface of the second covering film 3, and the second adhesive layer 32 is used to bond the aluminum plate 4 to the second surface of the second covering film 3.

[0075] Optionally, the thickness of the first adhesive layer 31 and the second adhesive layer 32 is 30 um-35 um.

[0076] Optional, see Figure 3 and Figure 4 The end of the aluminum plate 4 is provided with a half-segment groove, and the half-segment groove 41 corresponds to the pad hole position of the substrate 5. An isolation film 51 is pasted on the second cover film 3 corresponding to the half-segment groove 41 of the aluminum plate 4, and the size of the isolation film 51 matches the half-segment groove 41, and the isolation film 51 is a PI film.

[0077] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for manufacturing a thermally conductive sheet, characterized in that: The following steps are involved: Providing a conductor layer (1), the conductor layer (1) comprising a first surface and a second surface opposite to each other; Laminating a first covering film (2) on the first surface of the conductor layer (1); Providing a second covering film (3), coating a thermosetting adhesive on a first surface of the second covering film (3) to form a first adhesive layer (31), and coating a thermosetting adhesive on a second surface of the second covering film (3) to form a second adhesive layer (32); The second covering film (3) is attached to the second surface of the conductor layer (1) to obtain a substrate (5), wherein the first adhesive layer (31) is located between the conductor layer (1) and the second covering film (3); The substrate (5) is adhered to the aluminum plate (4) to form a heat conducting sheet (10); The heat conducting sheet (10) is pressed into shape by a pressing device.

2. A method for manufacturing a thermally conductive sheet according to claim 1, characterized in that: The method further comprises: providing a second covering film (3), coating a thermosetting adhesive on the first surface of the second covering film (3) to form a first adhesive layer (31), and coating a thermosetting adhesive on the second surface of the second covering film (3) to form a second adhesive layer (32); A first release film is attached to the first adhesive layer (31), and a second release film is attached to the second adhesive layer (32).

3. A method for manufacturing a thermal conductive sheet according to claim 2, characterized in that: Before the substrate (5) is pasted onto the aluminum plate (4) to form the heat conducting sheet (10), the method further comprises: Tear off the second release film; Pasting an isolation film (51) on the second covering film (3) at the location corresponding to the half-broken groove (41) of the aluminum plate (4); The base plate (5) is pasted onto the aluminum plate (4) to form a heat conducting sheet (10), and a half-segment groove is provided at the end of the aluminum plate (4), and the half-segment groove (41) corresponds to the soldering pad hole position of the base plate (5).

4. A method for manufacturing a thermally conductive sheet according to claim 3, characterized in that: A gasket is provided at the half-broken groove (41) of the aluminum plate (4), and the thickness of the gasket is the same as the thickness of the aluminum plate (4).

5. A method for manufacturing a thermally conductive sheet according to claim 4, characterized in that: The isolation film (51) is a PI film.

6. A method for manufacturing a thermally conductive sheet according to claim 2, characterized in that: The thickness of the first adhesive layer (31) and the second adhesive layer (32) is 30 um-35 um.

7. A method for manufacturing a thermally conductive sheet according to claim 1, characterized in that: After the second covering film (3) is attached to the second surface of the conductor layer (1) to obtain the substrate (5), the method further comprises: The substrate (5) is placed in a laminating machine for pre-pressing to discharge air bubbles in the thermosetting adhesive.

8. A method for manufacturing a thermally conductive sheet according to claim 7, characterized in that: The pre-pressing temperature is 80℃-100℃, the pressure is 10N-20N, and the pre-pressing time is 50s-90s.

9. A method for manufacturing a thermally conductive sheet according to claim 2, characterized in that: Before laminating the second covering film (3) to the second surface of the conductor layer (1) to obtain the substrate (5), the method further comprises: Tear off the first release film.

10. A thermally conductive sheet (10) produced by the thermally conductive sheet manufacturing method according to any one of claims 1 to 9, characterized in that: It comprises a first covering film (2), a conductor layer (1), a second covering film (3) and an aluminum plate (4) which are stacked in sequence; The second covering film (3) comprises a first surface close to the conductor layer (1) and a second surface close to the aluminum plate (4); the first surface of the second covering film (3) is coated with a first adhesive layer (31), and the second surface of the second covering film (3) is coated with a second adhesive layer (32); the first adhesive layer (31) and the second adhesive layer (32) are both thermosetting adhesives; the first adhesive layer (31) is used to bond the conductor layer (1) and the first surface of the second covering film (3), and the second adhesive layer (32) is used to bond the aluminum plate (4) and the second surface of the second covering film (3).

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