Packaging structure and packaging method of electronic device

Abstract

The invention discloses a packaging structure and a packaging method of an electronic device. The packaging structure comprises a first substrate which is provided with a plurality of bonding pads; the conductive structure is positioned on the first substrate and is electrically connected with the bonding pad on the first substrate; the first insulation packaging body is located on the upper surface of the first substrate and at least wraps part of the side wall of the conductive structure; and the electronic device is fixed above the first insulation packaging body and is electrically connected with the bonding pad on the first substrate through the conductive structure. The conductive structure is arranged on the first substrate, and the top surface of the conductive structure is exposed out of the first insulating packaging body, so that the bonding pad on the first substrate can be electrically connected with the electronic device above the first insulating packaging body through the conductive structure, and the design and manufacturing difficulty and cost of a packaging mold can be reduced; and the difficulty and cost of a packaging process and an electronic device and bonding pad connecting process are reduced, and the yield is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic component packaging, and in particular to a packaging structure and a packaging method for an electronic device. Background Art

[0002] At present, plastic packaging is often used in electronic component packaging to provide protection and insulation, but some electronic components need to be placed above the plastic package or at least a portion of them needs to be exposed outside the plastic package. For example, optical devices that need to emit or receive light, pressure sensor chips, temperature sensor chips, sound sensor chips, etc. Different micro-electro-mechanical systems (MEMS) usually include various micro-sensors, micro-actuators, micro-structures and other components, some of which also need to be exposed outside the plastic package. Therefore, the prior art sometimes uses methods such as Figure 1 The special-shaped packaging structure 1' is shown.

[0003] Since the chip 40' needs to be exposed outside the plastic package 20', the pads 11' on the substrate 10' corresponding to the chip 40' also need to be exposed (see FIG. Figure 2 The top view of the package structure 1' shown in FIG. 1 ) results in the need for the plastic package body 20' to be provided with a recess 21', which greatly increases the difficulty and cost of the mold design of the plastic package body 20'. Moreover, the recess 21' is at a lower level, and during the plastic packaging process, the plastic packaging material is also easy to leak into the recess 21', covering or damaging the pad 11' or other electronic components in the recess 21'. In addition, the space in the recess 21' is small, making it difficult to wire the chip 40' and the pad 11', especially when the number of leads 42' is large, it is more likely to cause adhesion, affecting the yield.

[0004] Application Contents

[0005] The purpose of the present application is to improve the packaging structure and packaging method in the prior art to solve the problems of difficulty in plastic packaging and wire bonding, high cost and low yield caused by the concave part.

[0006] The present application provides a packaging structure for an electronic device, comprising: a first substrate having a plurality of solder pads thereon; a conductive structure located on the first substrate and electrically connected to the solder pads on the first substrate; a first insulating packaging body located on the upper surface of the first substrate and covering at least a portion of the side walls of the conductive structure; and an electronic device fixed above the first insulating packaging body and electrically connected to the solder pads on the first substrate through the conductive structure.

[0007] In some embodiments, the conductive structure includes: a second substrate and a conductive column located above the second substrate; the second substrate is electrically connected to the pad on the first substrate through a solder ball.

[0008] In the above embodiment, the conductive structure further includes a second insulating packaging body, which is disposed above the second substrate and packages at least a portion of the conductive column and exposes the top of the conductive column.

[0009] In the above embodiment, the second insulating packaging body and the first insulating packaging body are integrally formed.

[0010] In some embodiments, the top of the conductive structure is flush with or higher than the upper surface of the first insulating package body.

[0011] In some embodiments, the packaging structure further includes an outer cover, which is disposed on the first substrate or the first insulating packaging body and is used to surround the electronic device and the conductive structure.

[0012] In some embodiments, the outer cover is at least partially light-transmissive or is a non-sealed structure.

[0013] In some embodiments, other electronic devices are disposed on the first substrate and are enclosed by the first insulating package.

[0014] The present application also provides a packaging method for electronic devices, including: fixing a conductive structure on a first substrate and electrically connecting it to a solder pad on the first substrate; forming a first insulating packaging body above the first substrate through a molding process and exposing the top of the conductive structure; fixing the electronic device above the first insulating packaging body and electrically connecting it to the solder pad on the first substrate through the conductive structure.

[0015] In some embodiments, the method for manufacturing the conductive structure includes: forming a second insulating package body above the second substrate through a molding process; drilling a hole in the second insulating package body, one end of the hole is connected to the second substrate, and the other end passes through the upper surface of the second insulating package body; plating and / or filling a conductive material in the hole to form a conductive column located above the second substrate.

[0016] In some other embodiments, the method for manufacturing the conductive structure includes: disposing a conductive column above the second substrate.

[0017] In the above embodiment, the method for manufacturing the conductive structure further includes: forming a second insulating packaging body on the second substrate through a molding process, packaging at least a portion of the conductive column and exposing the top of the conductive column.

[0018] In the above embodiment, a first insulating package body may be formed on the first substrate and a second insulating package body may be formed on the second substrate simultaneously through a molding process to encapsulate at least a portion of the conductive column and expose the top of the conductive column.

[0019] In the above embodiments, after the electronic device is fixed above the first insulating package and electrically connected to the pad on the first substrate through the conductive structure, it also includes: setting an outer cover on the first substrate or the first insulating package, wherein the outer cover is used to surround the electronic device and the conductive structure.

[0020] In some embodiments, other electronic components are disposed on the first substrate, and the other electronic components are subsequently encapsulated by the first insulating package.

[0021] The present application sets a conductive structure on the first substrate, and the top surface of the conductive structure is exposed to the first insulating package body, so that the solder pad on the first substrate can form an electrical connection with the electronic device above the first insulating package body through the conductive structure, which can reduce the difficulty and cost of designing and manufacturing the packaging mold, and reduce the difficulty and cost of the packaging process and the process of connecting the electronic device and the solder pad, thereby improving the yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of an electronic device packaging structure 1' in the prior art is shown;

[0023] Figure 2 Shows Figure 1 A top view of the packaging structure 1';

[0024] Figure 3 A schematic diagram showing an embodiment of an electronic device packaging method 100 of the present application;

[0025] Figure 4 A top view of the first substrate 10 in the electronic device packaging method 100 of the present application is shown;

[0026] Figure 5 A schematic diagram showing step S10 in the electronic device packaging method 100 of the present application is shown;

[0027] Figure 6 Shows Figure 5 A top view of

[0028] Figure 7 A schematic diagram showing step S20 in the electronic device packaging method 100 of the present application is shown;

[0029] Figure 8 Shows Figure 7 A top view of

[0030] Fig. 9 A schematic diagram showing step S30 in the electronic device packaging method 100 of the present application is shown;

[0031] Fig.10 Shows Fig. 9 A top view of

[0032] Fig.11 A schematic diagram of an optional step S40 of the electronic device packaging method 100 of the present application is shown. DETAILED DESCRIPTION

[0033] The present application is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present application, but are not intended to limit the present application in any form. It should be noted that, for those of ordinary skill in the art, several variations and improvements can also be made without departing from the concept of the present application. These all belong to the protection scope of the present application.

[0034] Figure 3 A schematic diagram of an embodiment of an electronic device packaging method 100 of the present application is shown. Specifically, the method 100 includes the following steps:

[0035] S10, fixing the conductive structure on the first substrate and electrically connecting it to the pad of the first substrate.

[0036] S20, forming a first insulating package body on the first substrate through a molding process, and exposing the top of the conductive structure.

[0037] S30, fixing the electronic device on the first insulating package body, and electrically connecting the electronic device to the pad on the first substrate through the conductive structure.

[0038] Figure 4 The top view of the first substrate 10 is shown. The first substrate 10 in the present application can be a circuit board, a lead frame (LF), or a chip or electronic device stacked underneath, etc. As long as a pad 11 electrically connected to a conductive structure can be provided, it can be used as the first substrate 10.

[0039] Figure 5 The schematic diagram of step S10 in the electronic device packaging method 100 of the present application is shown. In the figure, the conductive structure 30 is fixed on the first substrate 10 through the solder ball 33, and is electrically connected to the solder pad 11 on the first substrate 10 through the solder ball 33. Each solder pad 11 that needs to be electrically connected to the conductive structure 30 needs to be connected to at least one solder ball. Depending on the situation, each solder pad 11 can also be connected to multiple solder balls. More solder balls can also be connected in addition to the solder pad 11 to play the role of fixing the conductive structure 30. For example Figure 4Only one row of pads 11 of the first substrate 10 is shown. Figure 5 Three rows of solder balls 33 are arranged below the middle conductive structure 30, and the two rows of solder balls on the right are not connected to the pads 11, but only play a role of fixing and balancing. In other embodiments, solder balls may not be used, and other connection methods such as plug-in welding may be used.

[0040] A method for manufacturing the conductive structure 30 is as follows:

[0041] S01a, forming a second insulating package 34 on the second substrate 31 through a molding process. The molding process specifically includes using a mold injection molding method, such as wrapping the second substrate 31 with a material such as epoxy resin to form the second insulating package 34.

[0042] S02a, drilling a hole in the second insulating package body 34 , with one end of the hole connected to the second substrate 31 and the other end penetrating the upper surface of the second insulating package body 34 . Figure 6 Shows Figure 5 , from which it can be seen that 5 holes in 2 rows are punched in the second insulating package body 34 along the direction perpendicular to the second substrate 31. The punching method can be mechanical drilling, physical cutting, chemical etching, etc., and the cross-sectional shape of the hole can be various shapes such as square, circle, rectangle, triangle, etc.

[0043] S03a, plating and / or filling the hole with conductive material to form a conductive column 32 located above the second substrate 31. The conductive material can be plated on the inner wall of the hole by chemical, physical or other means to form a hollow conductive column 32. Further, the plating layer can be continuously thickened to enhance the conductive performance. A solid conductive column 32 can also be directly formed by filling the hole with conductive material. In some embodiments, the plating and filling methods can also be used together. In some embodiments, the number of conductive columns 32 is equal to or greater than the pads 11 that need to be electrically connected on the first substrate 10, and the extra conductive columns 32 can be used to provide a spare electrical connection channel to improve the reliability and stability of the electrical connection. In some embodiments, the area of ​​the conductive column 32 located at the top of the upper surface of the second insulating package body 34 is larger than the area of ​​the pad 11, which is conducive to reducing the difficulty of wiring and improving the yield.

[0044] In some embodiments, the conductive structure 30 can be designed in advance according to the shape, size and position of the first substrate 10 and the shape, size and position of the pad 11, and can be manufactured before step S10 to simplify the process and shorten the manufacturing process. Since both the solder balls 33 and the conductive pillars 32 can be redundant, the conductive structure 30 can even be used as a modular structural component and is applicable to a variety of different packaging structures.

[0045] In some other embodiments, the conductive structure 30 may also be manufactured by other methods:

[0046] S01b, a conductive column 32 is arranged on the second substrate 31. The conductive column 32 can be made of various conductive materials, and in some embodiments, a copper column is used; the arrangement method can be welding, plugging, etc.

[0047] S02b. Form a second insulating package body 34 on the second substrate 31 through a molding process to package at least a portion of the conductive pillar 32 and expose the top of the conductive pillar 32.

[0048] In some embodiments, the above steps S01b and S02b are both completed before step S10; in other embodiments, steps S01b and S02b may be completed in whole or in part after step S10; in some embodiments, step S02b may be combined with step S20.

[0049] Figure 7 FIG. 1 is a schematic diagram showing step S20 in the electronic device packaging method 100 of the present application, Figure 8 Shows Figure 7 A top view of the conductive structure 30. As can be seen from the figure, a first insulating package 20 is formed on the first substrate 10 through a molding process. The first insulating package 20 at least covers part of the side wall of the conductive structure 30. The electronic devices such as chips, transistors, resistors, capacitors, etc. on the first substrate 10 are all encapsulated therein (schematically represented by 12 in the figure). Since the conductive structure 30 is located on the first substrate 10, and the pad 11 is electrically connected to the solder ball 33 at the bottom of the conductive structure 30, the packaging material cannot cover or damage the pad 11 and affect its electrical connection; at the same time, the packaging material can also flow into and fill the gap under the second substrate 31, protecting the connection between the solder ball 33 and the pad 11. The difficulty of designing and making the packaging mold is greatly reduced, and the difficulty of the packaging process is also reduced, which is conducive to saving costs and improving yield.

[0050] In some embodiments, the top of the conductive structure 30 is flush with or higher than the first insulating package body 20 to prevent the packaging material from covering or damaging the top of the conductive pillar 32 in the conductive structure 30 during the packaging process of step S20. When the top of the conductive structure 30 is flush with the first insulating package body 20, the tops of the two are located in the same plane, which facilitates the formation of the first insulating package body 20. In some embodiments, when the conductive structure 30 is located at the edge of the substrate 10, the first insulating package body 20 can also be added on the outer side of the conductive structure 30 and the substrate 10 to enhance the protection of the conductive structure 30.

[0051] In the embodiment where step S02b is combined with step S20, the second substrate 31 is fixed on the first substrate 10 and a conductive column 32 is provided on the second substrate 31, and then the first insulating package 20 and the second insulating package 34 are formed at the same time through a molding process, such as injection molding, and the top of the conductive column 32 is exposed. This can save a molding process, shorten the production time and cost, and make the conductive structure 30 and the first insulating package 20 integrated into a whole, thereby improving the structural strength. In some embodiments, the conductive column 32 can also be higher than the first insulating package to prevent the packaging material from covering the top of the conductive column 32.

[0052] Fig. 9 A schematic diagram showing step S30 in the electronic device packaging method 100 of the present application is shown; Fig.10 Shows Fig. 9 A top view of the insulating package 20. The electronic devices 40 that need to be exposed outside the insulating package 20, such as optical devices, pressure sensor chips, temperature-sensitive sensor chips, acoustic sensor chips, etc., are fixed above the first insulating package 20. The fixing method can be silver paste, die attach film (DAF), etc., and the fixing material is schematically represented by 41 in the figure. The electronic device 40 can be connected to the top of the conductive column 32 of the conductive structure 30 through the lead 42. Since the top of the conductive column 32 is flush with or higher than the upper surface of the first insulating package, the wire bonding operation is less difficult, which is conducive to improving the yield. In some embodiments, the area of ​​the top of the conductive column 32 is larger than the area of ​​the pad 11, which further reduces the difficulty of the wire bonding operation. In other embodiments, the number of conductive columns 32 is greater than the number of pads 11, and the extra conductive columns 32 can also be connected to the electronic device 40 as a spare electrical connection channel to improve the reliability and stability of the electrical connection.

[0053] In some embodiments, the electronic device 40 may also be connected to the top of the conductive pillar 32 in other ways. For example, the electronic device 40 is flipped on the conductive structure 30 and the first insulating package 20, so that the connection between the electronic device 40 and the top of the conductive pillar 32 is tighter, which can shorten the connection path, improve the structural strength, and reduce the failure rate.

[0054] In some embodiments, step S30 is followed by an optional step S40. Fig.11A schematic diagram of an optional step S40 of the electronic device packaging method 100 of the present application is shown. An outer cover 50 is arranged above the first substrate 10 or the first insulating package body 20, and the outer cover 50 is connected to the first substrate 10 or the first insulating package body 20 and is used to surround the electronic device 40 and the conductive structure 30. The outer cover 50 can protect the internal electronic components and leads, etc., and play the role of dustproof, moisture-proof, corrosion-resistant and impact-resistant. The outer cover 50 can be made of metal, resin, etc., and its material and design are selected according to actual needs. For example, when the electronic device 40 is an optical device that needs to be photosensitized, at least part of the outer cover 50 should be able to transmit light; when the electronic device 40 needs to contact the outside air, the outer cover 50 can be set as a non-sealed structure, such as providing at least one channel connected to the outside.

[0055] The present application also provides a packaging structure of an electronic device, which can be manufactured by the packaging method 100 of the electronic device, see Fig.11 The invention comprises: a first substrate 10 , a first insulating package body 20 , a conductive structure 30 and an electronic device 40 arranged thereon.

[0056] The first substrate 10 may be a circuit board, a lead frame (LF), or a chip or electronic device stacked below. In some embodiments, the first substrate 10 has a plurality of pads 11, where the pads 11 refer to pads required for connecting to the electronic device 40 outside the first insulating package 20. The conductive structure 30 is located on the first substrate 10 and is electrically connected to the pads 11 on the first substrate 10. In some embodiments, the conductive structure 30 includes a second substrate 31 and a conductive column 32 located above it. The second substrate 31 may be electrically connected to the pads 11 on the first substrate through a solder ball 33 at its bottom or other means. The conductive column 32 may be a solid conductive column or a hollow conductive column, and its cross section may be of various shapes. The specific structure has been described in the method for making the conductive structure 30. In some embodiments, the number of the conductive columns 32 is equal to or greater than the number of the pads 11. In some embodiments, the area of ​​the top of the conductive column 32 is greater than the area of ​​the pad 11.

[0057] The first insulating package 20 is formed on the upper surface of the first substrate 10. The first insulating package 20 is made of resin and can be made by mold injection molding or other methods. The first insulating package 20 at least covers part of the side wall of the conductive structure 30, and the electronic components, leads, pads, etc. that do not need to be exposed can be packaged in the first insulating package 20.

[0058] In some embodiments, the top of the conductive structure 30 is flush with or higher than the upper surface of the first insulating package body 20. When the top of the conductive structure 30 is flush with the first insulating package layer 20, the tops of both are located in the same plane, which facilitates the formation of the first insulating package body 20.

[0059] In some embodiments, the conductive structure 30 further includes a second insulating package body 34, which is disposed above the second substrate 31, encapsulates at least a portion of the conductive column 32, and exposes the top of the conductive column 32. The second insulating package body 34 can be an independent package body, or it can be integrally formed with the first insulating package body 20. When the second insulating package body 34 is an independent package body, the conductive structure 30 can be used as a modular structural part, which is designed and manufactured in advance according to the shape, size, and position of the first substrate 10 and the shape, size, and position of the pad 11 to simplify the process, shorten the process, and can even be applied to a variety of different packaging structures. When the second insulating package body 34 is integrally formed with the first insulating package body 20, a molding process can be saved, the manufacturing time and cost can be shortened, and the conductive structure 30 and the first insulating package layer 20 can be integrated into a whole to improve the structural strength.

[0060] The electronic device 40 can be fixed on the first insulating package body 20 by silver paste, chip bonding film, etc., and electrically connected to the pad 11 on the first substrate 10 through the conductive structure 30. In some embodiments, the solder pin 11 can be adjusted by setting the number, shape, top area, layout, etc. of the conductive pillars 32 to reduce the difficulty of connection with the electronic device 40 and improve the yield. The electronic device 40 can also be fixed on the first insulating package layer 20 by other means, such as flipping the electronic device 40 on the conductive structure 30 and the first insulating package layer 20, which can more closely connect the top of the conductive pillar 32.

[0061] In some embodiments, the packaging structure of the electronic device provided in the present application further includes an outer cover 50, which is disposed on the first substrate 10 or the first insulating packaging body 20 and is used to surround the electronic device 40 and the conductive structure 30. The outer cover 50 can be made of metal, resin, etc., and its material and design are selected according to actual needs. For example, when the electronic device 40 is an optical device that needs to be sensitive to light, at least part of the outer cover 50 should be able to transmit light; when the electronic device 40 needs to be exposed to the outside air, the outer cover 50 can be set as a non-sealed structure, such as providing at least one channel connected to the outside.

[0062] It should be pointed out that, although the present application is described using MEMS packaging as an example, the present application is not limited to MEMS packaging and can be applied to any similar packaging situation.

[0063] A person skilled in the art may understand and implement other changes to the disclosed embodiments by reading the specification, the disclosed contents, the drawings and the appended claims. In the claims, the wording "comprising" does not exclude other elements and steps, and the wording "a" or "an" does not exclude the plurality. In the practical application of this application, a part may perform the functions of multiple technical features cited in the claims. Any reference numerals in the claims should not be construed as limiting the scope.

Claims

1. A packaging structure of an electronic device, characterized in that: include: A first substrate having a plurality of pads thereon; a conductive structure, which is located on the first substrate and electrically connected to the pad on the first substrate; A first insulating package body, located on the upper surface of the first substrate and covering at least a portion of the side wall of the conductive structure; and The electronic device is fixed on the first insulating package body and is electrically connected to the pad on the first substrate through the conductive structure.

2. The packaging structure according to claim 1, characterized in that: The conductive structure comprises: a second substrate and a conductive pillar located thereon; The second substrate is electrically connected to the pads on the first substrate through solder balls.

3. The packaging structure according to claim 2, characterized in that: The conductive structure further includes a second insulating package body, which is disposed above the second substrate, packages at least a portion of the conductive column, and exposes the top of the conductive column.

4. The packaging structure as claimed in claim 3, characterized in that: The second insulating packaging body is integrally formed with the first insulating packaging body.

5. The packaging structure according to any one of claims 1 to 3, characterized in that: The top of the conductive structure is flush with or higher than the upper surface of the first insulating package body.

6. The packaging structure according to any one of claims 1 to 3, characterized in that: The packaging structure further includes an outer cover, which is disposed on the first substrate or the first insulating packaging body and is used to surround the electronic device and the conductive structure.

7. The packaging structure according to claim 6, characterized in that: The outer cover is at least partially light-transmissive or has a non-sealed structure.

8. The packaging structure according to claim 1, characterized in that: Other electronic components are arranged on the first substrate and are covered by the first insulating packaging body.

9. A method for packaging an electronic device, comprising: Fixing the conductive structure on the first substrate and electrically connecting it to the pad of the first substrate; forming a first insulating package body on the first substrate through a molding process, and exposing the top of the conductive structure; The electronic device is fixed on the first insulating package body and is electrically connected to the pad on the first substrate through the conductive structure.

10. The packaging method according to claim 9, characterized in that: The method for manufacturing the conductive structure comprises: forming a second insulating package body on the second substrate through a molding process; Drilling a hole in the second insulating package, wherein one end of the hole is connected to the second substrate and the other end of the hole passes through the upper surface of the second insulating package; Conductive material is plated and / or filled in the hole to form a conductive column located above the second substrate.

11. The packaging method according to claim 9, characterized in that: The method for manufacturing the conductive structure comprises: A conductive pillar is disposed above the second substrate.

12. The packaging method according to claim 11, characterized in that: The method for manufacturing the conductive structure further includes: A second insulating package body is formed on the second substrate by a molding process to package at least a portion of the conductive column and expose the top of the conductive column.

13. The packaging method according to claim 12, characterized in that: A first insulating package is formed on the first substrate and a second insulating package is formed on the second substrate simultaneously through a molding process to package at least a portion of the conductive column and expose the top of the conductive column.

14. The packaging method according to any one of claims 9 to 13, characterized in that: After the electronic device is fixed on the first insulating package body and electrically connected to the pad on the first substrate through the conductive structure, the method further includes: An outer cover is arranged on the first substrate or the first insulating package body, and the outer cover is used to surround the electronic device and the conductive structure.

15. The packaging method according to claim 9, characterized in that: Before forming a first insulating package body on the first substrate by a molding process, the method further includes: Other electronic components are arranged on the first substrate, and the other electronic components are subsequently enclosed by the first insulating package.

Images