Gas injection device and horizontal flow vapor deposition equipment

Abstract

The invention discloses a gas injection device and horizontal flow vapor deposition equipment. The gas injection device comprises a top plate; the supporting sleeve body is arranged at the bottom of the top plate, and partial side wall is exposed; the top heat uniformizing mechanism surrounds the exposed side wall of the supporting sleeve body and is located on the side where the bottom of the top plate is located. The bottom of the first rotary sealing assembly is arranged at the top of the top plate in a dynamic sealing mode, and the first rotary sealing assembly is connected with the supporting sleeve body so as to drive the top heat uniformizing mechanism to rotate; the bottom of the second rotary sealing assembly is arranged at the top of the first rotary sealing assembly; and the gas inlet device penetrates through the supporting sleeve body and the first rotary sealing assembly, is arranged on the second rotary sealing assembly, is used for providing process gas into the process chamber and rotates relative to the supporting sleeve body under the driving of the second rotary sealing assembly, and is beneficial to the temperature uniformity and gas concentration uniformity of the surface of the substrate.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing equipment, and in particular to a gas injection device and a horizontal flow gas phase deposition device. Background Art

[0002] In the semiconductor manufacturing process, a heating device is usually arranged under the susceptor to heat the wafer by transferring heat from the susceptor to the wafer.

[0003] In horizontal flow vapor deposition equipment, especially when the spray device is arranged above the susceptor, the process gas is sprayed from the spray device and flows through the surface of the wafer carried on the susceptor in a laminar flow manner and vapor deposition reaction occurs on the surface of the wafer to form a semiconductor film. In order to prevent the process gas from thermally decomposing or pre-reacting in the spray device, the temperature of the process gas entering the spray device is controlled to be low, and the process gas is further heated in the process of flowing toward the substrate after being sprayed.

[0004] However, since the process gas needs to be controlled to flow through the wafer in a laminar flow, the adjustable degree of the distance between the spray device outlet and the wafer is limited. In particular, when the process gas needs to be controlled to enter the spray device at a relatively low temperature, it is easy for the process gas to reach different gas temperatures at different locations on the wafer surface. For example, the temperature of the area on the wafer surface close to the spray device is low, or it is easy for the temperature of the process gas to reach the wafer surface is still lower than the process temperature, resulting in uneven temperatures on the upper and lower surfaces of the wafer, which is prone to wafer warping. In addition, when the process gas is ejected and flows through the wafer surface, there is a concentration gradient in the concentration of the process gas, which is not conducive to film uniformity.

[0005] Therefore, it is necessary to provide a new gas injection device and a vapor deposition equipment to solve the above problems existing in the prior art. Summary of the invention

[0006] The object of the present invention is to provide a gas injection device and a horizontal flow vapor deposition device, which are used to supply gas to a process chamber and are beneficial to the temperature uniformity and gas concentration uniformity of the substrate surface.

[0007] To achieve the above object, the gas injection device of the present invention comprises: roof; A support sleeve, disposed at the bottom of the top plate, with at least a portion of the side wall exposed; A top heat-uniformizing mechanism is disposed around the exposed side wall of the support sleeve and has a distance between the top plate; Rotating air supply assembly, comprising: A first rotating seal assembly, the bottom of which is disposed on the top of the top plate in a dynamic sealing manner and connected to the support sleeve to drive the top heat uniformizing mechanism to rotate; A second rotating seal assembly, the bottom of which is disposed on the top of the first rotating seal assembly; The air intake device penetrates the support sleeve and the first rotary seal assembly and is arranged on the second rotary seal assembly so as to rotate relative to the support sleeve under the driving of the second rotary seal assembly.

[0008] The horizontal flow vapor deposition equipment of the present invention comprises a process chamber, a base, a bottom heating device and a gas injection device; The susceptor is arranged inside the process chamber, the gas injection device is arranged at the top of the process chamber and is arranged opposite to the susceptor to provide laminar gas to the susceptor, and the bottom heating device is arranged below the susceptor to provide heat.

[0009] By adopting the above technical scheme, the support sleeve of the gas injection device is arranged at the bottom of the top plate and at least part of the side wall is exposed, the top uniform heating mechanism is surrounded by the exposed side wall of the support sleeve, the bottom of the first rotating seal component is arranged at the top of the top plate in a dynamic sealing manner and connected to the support sleeve to drive the top uniform heating mechanism to rotate, the bottom of the second rotating seal component is arranged at the top of the first rotating seal component, and the air intake device for providing process gas passes through the support sleeve and the first rotating seal component and is arranged at the second rotating seal component to rotate relative to the support sleeve under the drive of the second rotating seal component, so that the gas injection device is arranged in the process chamber. Since the gas injection device is arranged relative to the base for placing the substrate, the rotation of the top uniform heating structure driven by the first rotating seal component makes the temperature field above the substrate uniform, which is beneficial to the temperature uniformity of the substrate surface, and the rotation of the air intake device relative to the support sleeve driven by the second rotating seal component is beneficial to the uniformity of gas concentration above the substrate.

[0010] Optionally, a top heating device is provided between the top heat uniforming mechanism and the top plate to provide heat.

[0011] Optionally, the air intake device includes an air injection portion and an air supply shaft body connected to each other; The jetting portion extends out of the bottom of the supporting sleeve and away from the supporting sleeve; The air supply shaft sequentially penetrates the second rotary seal assembly and the first rotary seal assembly from the top of the second rotary seal assembly, and the air supply shaft is rotationally connected to the second rotary seal assembly to drive the jet part to rotate under the drive of the second rotary seal assembly.

[0012] Optionally, the second rotary seal assembly includes a fixed sleeve and a second driving mechanism; The air supply shaft is disposed on the fixed sleeve from the top of the fixed sleeve, passes through the first rotary seal assembly, and is connected to the air injection part; The top of the air supply shaft protrudes from the top of the fixed sleeve, and the second driving mechanism is disposed on the top of the fixed sleeve in a dynamic sealing manner and is rotatably connected to the top of the air supply shaft to drive the air supply shaft to rotate relative to the fixed sleeve.

[0013] Optionally, the first rotary sealing assembly includes a rotary sleeve and a first driving mechanism; The air supply shaft passes through the rotating sleeve and is connected to the air injection part; The bottom of the rotating sleeve is connected to the supporting sleeve, and the first driving mechanism is rotatably connected to the side wall of the rotating sleeve to drive the rotating sleeve to drive the supporting sleeve to rotate relative to the air supply shaft.

[0014] Optionally, the air supply shaft includes an upper air intake shaft and a lower air intake shaft; One end of the lower air intake shaft is connected to the air injection portion, and the other end is connected to the upper air intake shaft; The upper air inlet shaft penetrates the fixed sleeve body axially along the fixed sleeve body and extends into the rotating sleeve body; The top of the upper air intake shaft body protrudes from the fixed sleeve body, and the second driving mechanism is rotatably connected to the top of the upper air intake shaft body.

[0015] Optionally, the first rotary seal assembly further includes a sealing plate; The sealing plate is disposed on the top of the rotating sleeve in a dynamic sealing manner, the bottom of the rotating sleeve is connected to the supporting sleeve, and the first driving mechanism is rotatably disposed on the side wall of the rotating sleeve to drive the rotating sleeve to drive the supporting sleeve to rotate relative to the sealing plate; The bottom of the fixed sleeve is sealed on the sealing plate; The air supply shaft penetrates through the sealing plate and then extends into the rotating sleeve.

[0016] Optionally, the first rotary seal assembly further comprises a sealing sleeve disposed on the top plate, wherein the sealing sleeve is sleeved on the rotating sleeve in a dynamic sealing manner to strengthen the sealing relationship between the rotating sleeve and the top plate.

[0017] Optionally, the air intake device further includes an air guide channel, and the air guide channel sequentially passes through the air supply shaft and the air injection portion.

[0018] Optionally, the jet portion is configured to guide the gas to flow out in a radial direction of the jet portion.

[0019] Optionally, the top heat uniforming mechanism includes a heat conducting device connected to the exposed side wall of the support sleeve and having a distance between the top plate.

[0020] Optionally, it also includes a power supply stator, a rotor and an electric conduction device, and the top heat uniformity mechanism includes a heating device; The heating device is connected to the exposed side wall of the support sleeve and has a distance from the top plate; The rotor is arranged on the first rotating seal assembly, the electrical conduction device is electrically connected to the rotor, extends inside the first rotating seal assembly and the support sleeve and is electrically connected to the heating device, and the power supply stator is sleeved on the rotor and is stationary relative to the top plate, so as to provide electrical energy for generating heat for the heating device through the rotational friction between the rotor and the power supply stator.

[0021] Optionally, the power supply stator, the rotor and the electrical conduction device form a conductive slip ring.

[0022] Optionally, the first rotary sealing assembly includes a rotary sleeve, a sealing sleeve and a first driving mechanism; The bottom of the rotating sleeve is connected to the supporting sleeve; The sealing sleeve is arranged on the top plate, and is sleeved on the rotating sleeve in a dynamic sealing manner to strengthen the sealing relationship between the rotating sleeve and the top plate; The first driving mechanism is rotatably disposed on the side wall of the rotating sleeve to drive the rotating sleeve to drive the supporting sleeve to rotate; The rotor is arranged on the side wall of the rotating sleeve, and the electrical conduction device extends inside the rotating sleeve and the supporting sleeve and is electrically connected to the heating device.

[0023] Optionally, the rotating sleeve includes an inner rotating body and an outer rotating body which are sequentially sleeved from the inside to the outside, and the top side wall of the inner rotating body is exposed; The sealing sleeve is sleeved on the outer rotating body in a dynamic sealing manner so that a part of the outer wall of the outer rotating body is exposed, and the rotor is arranged on the exposed side wall of the outer rotating body; The first driving mechanism is rotatably disposed on the top side wall of the inner rotating body to drive the inner rotating body and the outer rotating body to rotate synchronously; At least one of the inner rotating body and the outer rotating body is connected to the supporting sleeve.

[0024] Optionally, the inner rotating body and the outer rotating body are detachably arranged, and at least one of the inner rotating body and the outer rotating body is detachably arranged with respect to the supporting sleeve.

[0025] Optionally, a bottom rotary sealing assembly is further included, wherein the bottom rotary sealing assembly is disposed at the bottom of the process chamber in a dynamic sealing manner and is rotatably connected to the base to drive the base to rotate.

[0026] Optionally, the gas injection device includes a top heat-uniform mechanism, and the top heat-uniform mechanism is located in the process chamber. The radial dimension of the top heat-uniform mechanism is not less than 95% of the radial dimension of the bearing surface of the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the structure of a gas injection device according to an embodiment of the present invention; Figure 2 It is a schematic diagram of the assembly structure of the second rotary seal assembly and the top of the first rotary seal assembly in the gas injection device according to an embodiment of the present invention; Figure 3 It is a schematic diagram of the assembly structure of the first rotary seal assembly, the top plate and part of the air intake device in the gas injection device according to an embodiment of the present invention; Figure 4 It is a schematic diagram of an assembly structure of a first rotating seal component, a top plate, an electrical conduction device, a part of an air intake device and a rotor in a gas injection device according to an embodiment of the present invention; Figure 5 It is another schematic diagram of the assembly structure of the first rotary seal assembly, the top plate, the electrical conduction device, part of the air intake device and the rotor in the gas injection device of the embodiment of the present invention; Figure 6 It is a schematic structural diagram of a horizontal flow vapor deposition device according to an embodiment of the present invention.

[0028] Reference numerals: 100, top plate; 200, process chamber; 210, base; 220, bottom heating device; 230, bottom rotary sealing assembly; 310, support sleeve; 320, top heat uniforming mechanism; 321, heat conducting device; 322, rotor; 323, electrical conduction device; 324, heating device; 360, top heating device; 400, rotary air supply assembly; 410, first rotary sealing assembly; 411, rotary sleeve; 412, first driving mechanism; 413, sealing plate; 414, sealing sleeve; 415, inner rotating body; 416, outer rotating body; 420, second rotary sealing assembly; 421, fixed sleeve; 422, second driving mechanism; 430, air inlet device; 431, jet section; 432, air supply shaft; 433, upper air inlet shaft; 434, lower air inlet shaft. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0030] Combine the following Figure 1-Figure 6 , the specific implementation modes of the present invention are further described in detail.

[0031] An embodiment of the present invention provides a horizontal flow vapor deposition device, which includes a process chamber 200, a base 210 is provided in the process chamber 200, a gas injection device is provided at the top of the process chamber 200, and is arranged opposite to the base 210 to provide laminar gas to the base 210, and a bottom heating device 220 is provided below the base 210 to provide heat.

[0032] Reference Figure 1 The embodiment of the present invention further provides a gas injection device, including a top plate 100, a rotating gas supply assembly 400, a support sleeve 310 and a top heat equalization mechanism 320. The rotating gas supply assembly 400 is dynamically sealed and arranged on the top plate 100, and is connected to the support sleeve 310 to drive the support sleeve 310 and the top heat equalization mechanism 320 to rotate relative to the top plate 100; the rotating gas supply assembly 400 is provided with an air inlet device 430 to provide process gas into the process chamber 200.

[0033] In some embodiments, the rotating air supply assembly 400 is dynamically sealed on the top plate 100 to ensure the air tightness of the assembly between the rotating air supply assembly 400 and the top plate 100 .

[0034] In some embodiments, the rotating gas supply assembly 400 is used to provide a horizontal laminar flow of process gas, that is, the process gas provided by the rotating gas supply assembly 400 can flow through the substrate in a horizontal laminar flow manner after being ejected.

[0035] In some embodiments, the top heat-uniform mechanism 320 is disposed around the side wall of the support sleeve 310 and is located at the side where the bottom of the top plate 100 is located. The support sleeve 310 is disposed at the bottom of the top plate 100 .

[0036] In some embodiments, the support sleeve 310 is cylindrical and hollow inside.

[0037] In some embodiments, a connection groove (not shown in the figure) is opened on the top plate 100, and the connection groove passes through the top plate 100, and the top of the support sleeve 310 is accommodated in the connection groove.

[0038] In some embodiments, the top heat-distributing mechanism 320 is disposed around the exposed side wall of the support sleeve 310 and is located on the side where the bottom of the top plate 100 is located. Part of the side wall of the support sleeve 310 is exposed, and the top heat-distributing mechanism 320 is disposed around the exposed side wall of the support sleeve 310, and there is a certain distance between the top heat-distributing mechanism 320 and the top plate 100.

[0039] The distance between the top heating mechanism 320 and the top plate 100 can be reasonably designed according to the heating requirements for the space above the substrate, so as to achieve a heating effect for the space above the substrate without affecting the normal deposition process of the process gas on the substrate, and without causing mutual interference between the top heating mechanism 320 and the top plate 100 during movement.

[0040] In some embodiments, the rotary air supply assembly 400 includes a first rotary seal assembly 410 , a second rotary seal assembly 420 , and an air intake device 430 .

[0041] In some embodiments, the support sleeve 310 can drive the top heat-uniform mechanism 320 to rotate under the action of the first rotating seal assembly 410 .

[0042] In some embodiments, the top heat dissipation mechanism 320 can transfer heat or generate heat, which will be described in detail later.

[0043] In some embodiments, the top heat-distributing mechanism 320 is an annular plate, which is sleeved on the support sleeve 310, that is, it is arranged around the exposed side wall of the support sleeve 310. In some embodiments, the top heat-distributing mechanism 320 and the support sleeve 310 can be fixedly connected or detachably connected, so that the rotation of the support sleeve 310 can drive the top heat-distributing mechanism 320 to rotate synchronously.

[0044] In some embodiments, the bottom of the first rotating seal assembly 410 is disposed on the top of the top plate 100 in a dynamic sealing manner and connected to the support sleeve 310 . The first rotating seal assembly 410 drives the top heat equalizing mechanism 320 to rotate.

[0045] In some embodiments, the bottom of the second rotating seal assembly 420 is disposed on the top of the first rotating seal assembly 410 .

[0046] In some embodiments, the air inlet device 430 penetrates the support sleeve 310 and the first rotating seal assembly 410 and is disposed on the second rotating seal assembly 420 for providing process gas and rotating relative to the support sleeve 310 when driven by the second rotating seal assembly 420 .

[0047] In an embodiment of the present invention, the process in which the air intake device 430 rotates under the drive of the second rotating seal assembly 420 and the process in which the first rotating seal assembly 410 drives the top heat equalizing mechanism 320 to rotate do not affect each other. According to process requirements, at least one of the top heat equalizing mechanism 320 and the air intake device 430 can be selectively controlled in rotation.

[0048] In some embodiments, the air inlet device 430 includes an air jet portion 431 and an air supply shaft 432 connected in sequence, and the air jet portion 431 extends out of the bottom of the support sleeve 310 and extends away from the support sleeve 310 to provide laminar process gas into the process chamber 200. In some embodiments, the air jet portion 431 is disposed in the middle of the top plate 100. In some embodiments, the air supply shaft 432 sequentially penetrates the second rotary seal assembly 420 and the first rotary seal assembly 410 from the top of the second rotary seal assembly 420, and the air supply shaft 432 is rotatably connected to the second rotary seal assembly 420 to drive the air jet portion 431 to rotate under the drive of the second rotary seal assembly 420. In this process, the first rotary seal assembly 410 is stationary relative to the top plate 100 and does not interfere with the rotation of the second rotary seal assembly 420 and the air jet portion 431. In some specific embodiments, the portion of the air supply shaft 432 extending inside the first rotating seal assembly 410 has a distance between its outer wall and the inner wall of the first rotating seal assembly 410, so that when the first rotating seal assembly 410 drives the top heat uniforming mechanism 320 to rotate, the first rotating seal assembly 410 will not interfere with the air supply shaft 432.

[0049] In some embodiments, reference Figure 1 and Figure 3 The first rotary seal assembly 410 includes a rotary sleeve 411 and a first driving mechanism 412. In some specific embodiments, the first driving mechanism 412 is a rotary motor.

[0050] In some embodiments, reference Figure 1 and Figure 2 The second rotary seal assembly 420 includes a fixed sleeve 421 and a second driving mechanism 422. In some specific embodiments, the second driving mechanism 422 is a rotary motor.

[0051] In some embodiments, the air supply shaft 432 is disposed on the fixed sleeve 421 from the top of the fixed sleeve 421, passes through the first rotating seal assembly 410, and is connected to the jet part 431; the top of the air supply shaft 432 protrudes from the top of the fixed sleeve 421, and the second driving mechanism 422 is disposed on the top of the fixed sleeve 421 in a dynamic sealing manner and is rotatably connected to the air supply shaft 432 to drive the air supply shaft 432 to rotate relative to the fixed sleeve 421.

[0052] In some embodiments, the bottom of the fixed sleeve 421 is arranged at the top of the rotating sleeve 411; the air supply shaft 432 passes through the rotating sleeve 411 and is connected to the jet part 431; the bottom of the rotating sleeve 411 is connected to the supporting sleeve 310, and the first driving mechanism 412 is rotatably connected to the side wall of the rotating sleeve 411 to drive the rotating sleeve 411 to drive the supporting sleeve 310 to rotate relative to the air supply shaft 432.

[0053] In some embodiments, there is a gap between the outer wall of the air supply shaft 432 and the inner wall of the rotating sleeve 411, so that the rotation process of the rotating sleeve 411 and the rotation process of the air supply shaft 432 driven by the second rotating seal assembly 420 will not interfere with each other. The air supply shaft 432 passes through the top plate 100 and is connected to the air injection part 431 to provide gas.

[0054] In some embodiments, the air intake device 430 further includes an air guide channel, which sequentially passes through the air supply shaft 432 and the air injection portion 431 .

[0055] In some embodiments, the gas supply channel in the gas supply shaft 432 is connected to the air cavity in the jet part 431, so that the gas can enter the process chamber 200 after passing through the gas supply channel and the air cavity in the gas supply shaft 432, so as to provide a process gas atmosphere to the process chamber 200 after the top plate 100 and the process chamber 200 are connected.

[0056] In some embodiments, the air supply shaft 432 includes an upper air intake shaft 433 and a lower air intake shaft 434, one end of the lower air intake shaft 434 is connected to the air injection part 431, and the other end is connected to the upper air intake shaft 433. The air passage in the lower air intake shaft 434 is connected to the air cavity in the air injection part 431.

[0057] In some embodiments, the lower air inlet shaft 434 is disposed in the rotating sleeve 411. Specifically, the lower air inlet shaft 434 extends from the rotating sleeve 411 to the air injection portion 431 until it is connected to the air injection portion 431.

[0058] In some embodiments, there is a distance between the outer wall of the lower air inlet shaft 434 and the inner wall of the rotating sleeve 411 , so that the lower air inlet shaft 434 will not interfere with the rotation of the rotating sleeve 411 .

[0059] In some embodiments, one of the lower air inlet shaft 434 and the air injection portion 431 passes through the top plate 100 .

[0060] The upper air intake shaft 433 axially penetrates the fixed sleeve 421 and extends into the rotating sleeve 411. The upper air intake shaft 433 is connected to the lower air intake shaft 434.

[0061] In some embodiments, the upper air intake shaft 433 and the lower air intake shaft 434 are an integrated structure.

[0062] In some embodiments, the upper air inlet shaft 433 and the rotating sleeve 411 are dynamically sealed or spaced from each other, so that the upper air inlet shaft 433 does not interfere with the rotation of the rotating sleeve 411. In some embodiments, the upper air inlet shaft 433 and the lower air inlet shaft 434 can be fixedly connected or detachably connected, which is not limited here, and the main purpose is to be able to conduct gas to the air supply channel for air supply.

[0063] In some embodiments, the top of the upper air intake shaft 433 protrudes from the fixed sleeve 421, and the second driving mechanism 422 is rotatably connected to the top of the upper air intake shaft 433 to drive the upper air intake shaft 433 to drive the lower air intake shaft 434 and the jet part 431 to rotate synchronously.

[0064] In some embodiments, the rotating sleeve 411 is hollow, and one end is connected to the supporting sleeve 310 to drive the supporting sleeve 310 to rotate; the first driving mechanism 412 is connected to the side wall of the rotating sleeve 411 to provide driving force.

[0065] In some embodiments, the first rotating seal assembly 410 further includes a sealing sleeve 414 disposed on the top plate 100 . The sealing sleeve 414 is mounted on the rotating sleeve 411 in a dynamic sealing manner to strengthen the sealing relationship between the rotating sleeve 411 and the top plate 100 .

[0066] In some embodiments, the first rotating seal assembly 410 further includes a sealing plate 413. The sealing plate 413 is disposed on the top of the rotating sleeve 411 in a dynamic sealing manner, the bottom of the rotating sleeve 411 is connected to the supporting sleeve 310, the first driving mechanism 412 is rotatably disposed on the side wall of the rotating sleeve 411 to drive the rotating sleeve 411 to drive the supporting sleeve 310 to rotate relative to the sealing plate 413; the bottom of the fixed sleeve 421 is sealed on the sealing plate 413; the air supply shaft 432 penetrates the sealing plate 413 and then extends into the rotating sleeve 411.

[0067] In some embodiments, reference Figure 5 and Figure 6 The rotating sleeve 411 includes an inner rotating body 415 and an outer rotating body 416 which are sequentially mounted from the inside to the outside. The inner rotating body 415 and the outer rotating body 416 are detachably arranged so as to rotate synchronously relative to the sealing sleeve 414 under the drive of the first driving mechanism 412.

[0068] In some embodiments, the inner rotating body 415 is hollow, the air supply shaft 432 passes through the inner rotating body 415 , and there is a gap between the outer wall and the inner wall of the inner rotating body 415 .

[0069] In some embodiments, the top side wall of the inner rotating body 415 is exposed, and the first driving mechanism 412 rotates the top side wall of the inner rotating body 415 to drive the inner rotating body 415 and the outer rotating body 416 to rotate synchronously.

[0070] In some embodiments, the sealing sleeve 414 is mounted on the outer rotating body 416 in a dynamic sealing manner and exposes a portion of the outer wall of the outer rotating body 416 , so that the rotor 322 can be disposed on the exposed side wall of the outer rotating body 416 .

[0071] In some embodiments, at least one of the inner rotating body 415 and the outer rotating body 416 is connected to the supporting sleeve 310 .

[0072] In some embodiments, the inner rotating body 415 and the outer rotating body 416 are an integrated structure.

[0073] In some embodiments, the inner rotating body 415 and the outer rotating body 416 are detachably arranged to facilitate replacement of rotors 322 of different specifications according to different heating requirements of the heating device 324, or disassembly and maintenance of the rotor 322.

[0074] In some embodiments, at least one of the inner rotating body 415 and the outer rotating body 416 is detachably disposed with respect to the supporting sleeve 310 .

[0075] In some embodiments, a top heating device 360 ​​is provided between the top heat-uniform mechanism 320 and the top plate 100 to provide heat. In some embodiments, the top heating device 360 ​​is selected to be a resistance heater or other devices capable of achieving temperature increase.

[0076] In some embodiments, reference Figure 3 The top heat-distributing mechanism 320 includes a heat-conducting device 321 connected to the support sleeve 310 to absorb and transfer heat. The material of the heat-conducting device 321 is heat-resistant and has good thermal conductivity, and the specific heat resistance is selected according to the process temperature requirements.

[0077] In some embodiments, the heat conducting device 321 absorbs and radiates the heat generated by the top heating device 360 ​​outwardly.

[0078] In some embodiments, the heat conducting device 321 is a graphite heat conducting device. In some specific embodiments, the graphite heat conducting device is a graphite plate. The heat conducting device 321 absorbs the heat of the top heating device 360 ​​and transfers the heat to the base 210, thereby improving the utilization efficiency of heat energy and reducing heat loss.

[0079] In some more specific embodiments, the surface of the heat conducting device 321 may be coated with a thermally conductive coating, such as silicon carbide.

[0080] In some embodiments, the heat conducting device 321 and the support sleeve 310 are detachably connected, such as by bolts. The specific detachable connection method is not limited herein, and it is necessary that the support sleeve 310 can drive the heat conducting device 321 to rotate synchronously.

[0081] In some embodiments, the heat conducting device 321 is fixedly connected to the support sleeve 310 , for example, integrally formed, and the specific fixed connection method is not limited here, as long as the support sleeve 310 can drive the heat conducting device 321 to rotate.

[0082] In some embodiments, the top heat distribution mechanism 320 includes a heating device 324 .

[0083] In some embodiments, the gas injection device further includes a power supply stator, and is further provided with a rotor 322 and an electrical conduction device 323 .

[0084] In some embodiments, reference Figure 4 The top heat-uniform mechanism 320 includes a main support member connected to the side wall of the support sleeve 310 ; a heating device 324 is provided on the main support member for heating the process chamber 200 .

[0085] In some specific embodiments, the heating device 324 is a resistance heating wire, and the main support member is a substrate supporting the resistance heating wire, and the substrate can be an insulating substrate, such as a boron nitride ceramic substrate, or a conductive substrate, such as a molybdenum silicide substrate. When the substrate is a heat-resistant conductive substrate, the resistance heating wire and the substrate are electrically insulated.

[0086] In some specific embodiments, the heating device 324 is a graphite plate, which generates heat by converting electrical energy into thermal energy.

[0087] In some embodiments, the power supply stator, the rotor 322 and the electrical conduction device 323 form a conductive slip ring.

[0088] In some specific embodiments, the rotor 322 includes a conductive ring and a brush wire, wherein the conductive ring fixed sleeve is arranged on the rotating sleeve body 411 and can rotate synchronously with the rotating sleeve body 411, the electric conduction device 323 is electrically connected to the conductive ring, and the power supply stator is sleeved on the rotor 322 and is stationary relative to the top plate 100, so as to provide electric energy for generating heat to the heating device 324 through the rotational friction between the rotor 322 and the power supply stator.

[0089] In the horizontal flow vapor deposition equipment, the susceptor 210 is disposed inside the process chamber 200, the gas jet 431 provides laminar gas to the susceptor 210, and the top heat uniformity mechanism 320 is disposed opposite to the susceptor 210 to mix the temperature field. The specific structure of the gas jet 431 is a conventional technical means in the art.

[0090] In some embodiments, the base 210 includes a bearing surface for bearing a substrate. The radial dimension of the top heat-uniform mechanism 320 is not less than % of the radial dimension of the bearing surface of the base 210 to ensure the temperature uniformity of each substrate carried on the fixed base 210. In some embodiments, the radial dimension of the top heat-uniform mechanism 320 is consistent with the radial dimension of the bearing surface of the base 210. In some embodiments, the radial dimension of the top heat-uniform mechanism 320 is larger than the radial dimension of the bearing surface of the base 210, and the specific dimension can be flexibly adjusted according to the inner diameter of the process chamber 200 according to the heat-uniform demand.

[0091] In some embodiments, the bottom wall dynamic seal of the process chamber 200 is provided with a bottom rotating seal assembly 230 to provide a driving force; the bottom rotating seal assembly 230 is connected to the base 210 so that the base 210 can rotate relative to the process chamber 200. During actual use, the rotation or stillness of the base 210 can be controlled according to actual conditions. Here, the bottom rotating seal assembly 230 is dynamically sealed in the process chamber 200 to ensure that the process gas in the process chamber 200 will not be leaked during the rotation of the bottom rotating seal assembly 230 on the process chamber 200.

[0092] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A gas injection device, characterized in that: include: Top plate (100); A support sleeve (310) is disposed at the bottom of the top plate (100), with at least a portion of the side wall exposed; A top heat-distributing mechanism (320) is disposed around the exposed side wall of the support sleeve (310) and has a distance between it and the top plate (100); The rotary air supply assembly (400) comprises: A first rotating seal assembly (410), the bottom of which is disposed on the top of the top plate (100) in a dynamic sealing manner and is connected to the support sleeve (310) to drive the top heat equalizing mechanism (320) to rotate; A second rotating sealing component (420), the bottom of which is arranged on the top of the first rotating sealing component (410); The air intake device (430) penetrates the support sleeve (310) and the first rotating seal assembly (410), and is arranged on the second rotating seal assembly (420) so as to rotate relative to the support sleeve (310) under the drive of the second rotating seal assembly (420).

2. The gas injection device according to claim 1, characterized in that: A top heating device (360) is provided between the top heat-uniformizing mechanism (320) and the top plate (100) to provide heat.

3. The gas injection device according to claim 1, characterized in that: The air intake device (430) comprises an air injection portion (431) and an air supply shaft (432) connected to each other; The jetting portion (431) extends out of the bottom of the supporting sleeve (310) and extends away from the supporting sleeve (310); The air supply shaft (432) passes through the second rotary seal assembly (420) and the first rotary seal assembly (410) in sequence from the top of the second rotary seal assembly (420), and the air supply shaft (432) is rotationally connected to the second rotary seal assembly (420) to drive the jet part (431) to rotate under the drive of the second rotary seal assembly (420).

4. The gas injection device according to claim 3, characterized in that: The second rotating sealing assembly (420) comprises a fixed sleeve (421) and a second driving mechanism (422); The air supply shaft (432) is disposed on the fixed sleeve (421) from the top of the fixed sleeve (421), penetrates the first rotary seal assembly (410), and is connected to the air injection portion (431); The top of the air supply shaft (432) protrudes from the top of the fixed sleeve (421), and the second driving mechanism (422) is disposed on the top of the fixed sleeve (421) in a dynamic sealing manner and is rotatably connected to the top of the air supply shaft (432) to drive the air supply shaft (432) to rotate relative to the fixed sleeve (421).

5. The gas injection device according to claim 4, characterized in that: The first rotating sealing assembly (410) comprises a rotating sleeve (411) and a first driving mechanism (412); The air supply shaft (432) passes through the rotating sleeve (411) and is connected to the air injection portion (431); The bottom of the rotating sleeve (411) is connected to the supporting sleeve (310), and the first driving mechanism (412) is rotatably connected to the side wall of the rotating sleeve (411) to drive the rotating sleeve (411) to drive the supporting sleeve (310) to rotate relative to the air supply shaft (432).

6. The gas injection device according to claim 5, characterized in that: The air supply shaft (432) comprises an upper air intake shaft (433) and a lower air intake shaft (434); One end of the lower air intake shaft (434) is connected to the air injection portion (431), and the other end is connected to the upper air intake shaft (433); The upper air intake shaft (433) axially penetrates the fixed sleeve (421) along the fixed sleeve (421) and extends into the rotating sleeve (411); The top of the upper air intake shaft (433) protrudes from the fixed sleeve (421), and the second driving mechanism (422) is rotatably connected to the top of the upper air intake shaft (433).

7. The gas injection device according to claim 5, characterized in that: The first rotating seal assembly (410) further comprises a sealing plate (413); The sealing plate (413) is disposed on the top of the rotating sleeve (411) in a dynamic sealing manner, the bottom of the rotating sleeve (411) is connected to the supporting sleeve (310), and the first driving mechanism (412) is rotatably disposed on the side wall of the rotating sleeve (411) to drive the rotating sleeve (411) to drive the supporting sleeve (310) to rotate relative to the sealing plate (413); The bottom of the fixed sleeve (421) is sealed on the sealing plate (413); The air supply shaft (432) penetrates the sealing plate (413) and then extends into the rotating sleeve (411).

8. The gas injection device according to claim 5, characterized in that: The first rotating seal assembly (410) further comprises a sealing sleeve (414) disposed on the top plate (100); the sealing sleeve (414) is sleeved on the rotating sleeve (411) in a dynamic sealing manner to strengthen the sealing relationship between the rotating sleeve (411) and the top plate (100).

9. The gas injection device according to claim 3, characterized in that: The air intake device (430) further comprises an air guide channel, wherein the air guide channel sequentially passes through the air supply shaft (432) and the air injection portion (431).

10. The gas injection device according to claim 3, characterized in that: The gas injection portion (431) is configured to guide the gas to flow out along the radial direction of the gas injection portion (431).

11. The gas injection device according to claim 1, characterized in that: The top heat-distributing mechanism (320) comprises a heat-conducting device (321), which is connected to the exposed side wall of the supporting sleeve (310) and has a distance between it and the top plate (100).

12. The gas injection device according to claim 1, characterized in that: It also includes a power supply stator, a rotor (322) and an electric conduction device (323), and the top heat uniformity mechanism (320) includes a heating device (324); The heating device (324) is connected to the exposed side wall of the support sleeve (310) and has a distance from the top plate (100); The rotor (322) is arranged on the first rotating seal component (410), the electric conduction device (323) is electrically connected to the rotor (322), extends inside the first rotating seal component (410) and the support sleeve (310) and is electrically connected to the heating device (324), and the power supply stator is sleeved on the rotor (322) and is stationary relative to the top plate (100) so as to provide electric energy for generating heat for the heating device (324) through the rotational friction between the rotor (322) and the power supply stator.

13. The gas injection device according to claim 12, characterized in that: The power supply stator, the rotor (322) and the electrical conduction device (323) form a conductive slip ring.

14. The gas injection device according to claim 13, characterized in that: The first rotating sealing assembly (410) comprises a rotating sleeve (411), a sealing sleeve (414) and a first driving mechanism (412); The bottom of the rotating sleeve (411) is connected to the supporting sleeve (310); The sealing sleeve (414) is disposed on the top plate (100) and is sleeved on the rotating sleeve (411) in a dynamic sealing manner to strengthen the sealing relationship between the rotating sleeve (411) and the top plate (100); The first driving mechanism (412) is rotatably disposed on the side wall of the rotating sleeve (411) to drive the rotating sleeve (411) to drive the supporting sleeve (310) to rotate; The rotor (322) is disposed on a side wall of the rotating sleeve (411), and the electrical conduction device (323) extends inside the rotating sleeve (411) and the supporting sleeve (310) and is electrically connected to the heating device (324).

15. The gas injection device according to claim 14, characterized in that: The rotating sleeve (411) comprises an inner rotating body (415) and an outer rotating body (416) which are sequentially sleeved from the inside to the outside, and the top side wall of the inner rotating body (415) is exposed; The sealing sleeve (414) is sleeved on the outer rotating body (416) in a dynamic sealing manner and exposes a portion of the outer wall of the outer rotating body (416); the rotor (322) is disposed on the exposed side wall of the outer rotating body (416); The first driving mechanism (412) rotates the top side wall of the inner rotating body (415) to drive the inner rotating body (415) and the outer rotating body (416) to rotate synchronously; At least one of the inner rotating body (415) and the outer rotating body (416) is connected to the supporting sleeve (310).

16. The gas injection device according to claim 15, characterized in that The inner rotating body (415) and the outer rotating body (416) are detachably arranged, and at least one of the inner rotating body (415) and the outer rotating body (416) is detachably arranged with respect to the supporting sleeve (310).

17. A horizontal flow vapor deposition apparatus, characterized in that: It comprises a process chamber (200), a base (210), a bottom heating device (220) and a gas injection device according to any one of claims 1 to 16; The base (210) is arranged inside the process chamber (200), the gas injection device is arranged at the top of the process chamber (200), and is arranged opposite to the base (210) to provide laminar gas to the base (210), and the bottom heating device (220) is arranged below the base (210) to provide heat.

18. The horizontal flow vapor deposition apparatus according to claim 17, characterized in that: It also includes a bottom rotating seal assembly (230), which is disposed at the bottom of the process chamber (200) in a dynamic sealing manner and is rotatably connected to the base (210) to drive the base (210) to rotate.

19. The horizontal flow vapor deposition apparatus according to claim 17, characterized in that: The gas injection device comprises a top heat-evening mechanism (320), wherein the top heat-evening mechanism (320) is located in the process chamber (200), and the radial dimension of the top heat-evening mechanism (320) is not less than 95% of the radial dimension of the bearing surface of the base (210).

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