Test seat with standby contact points

Abstract

The invention discloses a test seat with standby contact points, which comprises a test seat base, one side of the upper end of the test seat base is connected with a test seat cover plate, the middle part of the test seat cover plate is provided with a heat dissipation mechanism, and the heat dissipation mechanism comprises a heat dissipation pressing block, a heat dissipation hole, a spring III, a dustproof net, a heat dissipation fan and a connecting rod. The beneficial effects are that the standby contact assembly composed of the lateral ejector pin, the second spring and the standby contact pin is installed at one side of the main contact pin in the test seat pedestal, so that the standby contact pin and the main contact pin can be put into use at the same time when the test seat is used, and the standby contact pin can be used after the main contact pin is damaged and fails. The communication between the device body and the PCB is realized by means of the standby contact pin, so that the normal test use of the test seat under the condition that the main contact contact pin is damaged is facilitated, and the service life of the whole test seat is prolonged while the test efficiency of the device body is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of test sockets, and in particular to a test socket with spare contact points. Background Art

[0002] In the production process of new energy vehicles, in order to make new energy vehicles have multiple functions, some functional electronic integrated modules are often installed on new energy vehicles during production. After production, the electronic integrated modules need to be tested with the help of test sockets to determine whether the electronic integrated modules meet the standards.

[0003] The existing test socket for testing electronic integrated modules is mainly composed of a test socket base, a test socket groove cover, a PCB test board installed in the test socket base, and contact pins installed on the test socket base and in contact with the PCB test board. When in use, the test socket of this structure connects the pins of the device under test with the contact pins to achieve connectivity between the device under test and the PCB test board, which facilitates stable testing of the performance of the device under test after power is turned on.

[0004] Although the existing test socket can realize the test of electronic integrated modules, on the one hand, since there is only one row of contact pins on the base of the test socket, in the actual test process, it is often easy for a single contact pin to have poor contact with the PCB board, thereby causing the entire test socket to be scrapped, which is not only inconvenient for efficient testing of the electronic integrated module, but also reduces the service life of the test socket. On the other hand, since the existing test socket mainly dissipates heat through heat transfer when testing the electronic integrated module, it is easy for the heat on the heat dissipation component to dissipate to the outside slowly, resulting in low heat dissipation efficiency of the electronic integrated module during testing, affecting the accuracy of the measurement results of the electronic integrated module. Summary of the invention

[0005] The purpose of the present invention is to provide a test socket with spare contact points in order to solve the above problems.

[0006] The present invention achieves the above-mentioned purpose through the following technical solutions:

[0007] A test socket with spare contact points comprises a test socket base, a test socket cover is connected to one side of the upper end of the test socket base, a heat dissipation mechanism is installed in the middle of the test socket cover, the heat dissipation mechanism comprises a heat dissipation pressing block, a heat dissipation hole, a spring three, a dustproof net, a heat dissipation fan and a connecting rod, a device body is placed in the middle of the upper end of the test socket base, a main contact pin is installed in the contact position with the pin of the device body in the test socket base, a spring one is installed between the bottom end of the main contact pin and the test socket base, a PCB board is installed in the test socket base at the bottom end of the main contact pin, a spring one is installed at the bottom end of the main contact pin, and a main contact pin on the test socket base is installed at the bottom end of the main contact pin. A spare contact assembly is installed on one side of the pin, and the spare contact assembly includes a lateral ejector pin, a second spring and a spare pin, wherein the spare pin is located on one side of the main contact pin, the lateral ejector pin is located on the side of the spare pin facing away from the main contact pin, and the second spring is installed between the bottom end of the lateral ejector pin and the base of the test socket; the heat dissipation block is a convex table-shaped structure, the third spring is installed between the four corners of the convex edge of the heat dissipation block and the cover of the test socket, the heat dissipation hole is opened at the contact position between the heat dissipation block and the device body, the heat dissipation fan is installed on the upper inner part of the heat dissipation block through the connecting rod, and the dustproof net is installed on the upper inner part of the heat dissipation block.

[0008] Furthermore, the lateral ejector pin is composed of a vertical rod and a convex push rod vertically installed in the middle of the vertical rod, and the lateral ejector pin is made of insulating material.

[0009] By adopting the above technical solution, the lateral ejector pin does not contact the spare pin when the device body is not pressed down. When the device body is pressed down, the spare pin will be pressed on the upper part of the main contact pin under the action of the lateral ejector pin, thereby realizing that the main contact pin and the spare pin are put into use at the same time during testing.

[0010] Furthermore, the bottom end of the lateral ejector pin is plugged into the second spring, and the bottom end of the second spring is plugged into the test socket base.

[0011] By adopting the above technical solution, the bottom end of the lateral ejector pin is plugged into the second spring, which can ensure that the lateral ejector pin can buffer the second spring from moving up and down easily.

[0012] Furthermore, the spare pin is a bent structure, the bottom end of the spare pin contacts the PCB board, and the bent portion of the spare pin contacts the convex portion on the lateral ejector pin.

[0013] By adopting the above technical solution, the bottom end of the spare pin is always in contact with the PCB board, and the top end of the spare pin is in contact with the upper part of the main contact pin only during testing.

[0014] Furthermore, the main contact pin is plugged into the spring, and the main contact pin is slidably matched with the test socket base.

[0015] By adopting the above technical solution, the plug-in connection method enables the main contact pin to be conveniently buffered under the action of the spring.

[0016] Furthermore, one end of the spring three is plugged into the heat dissipation pressing block, and the other end of the spring three is plugged into the test seat cover, and the heat dissipation pressing block is a heat dissipation aluminum block.

[0017] By adopting the above technical solution, the spring three ensures that the heat dissipation pressing block has a certain buffering capacity, thereby preventing the heat dissipation pressing block from applying excessive force to the device body during testing.

[0018] Furthermore, the interior of the heat dissipation pressing block is a hollow structure, and the dustproof net is connected to the heat dissipation pressing block by bolts.

[0019] By adopting the above technical solution, the hollow portion inside the heat dissipation pressing block can ensure the reliable installation of the heat dissipation fan, which is an exhaust type heat dissipation fan.

[0020] Furthermore, one end of the connecting rod is connected to the heat dissipation fan bolt, and the other end of the connecting rod is connected to the heat dissipation pressing block bolt.

[0021] By adopting the above technical solution, the connecting rod is mainly used to realize the suspended installation of the heat dissipation fan inside the heat dissipation pressing block, so as to realize the reliable installation of the heat dissipation fan.

[0022] Furthermore, the test seat cover plate is rotatably matched with the test seat base, and the shells of the test seat cover plate and the test seat base are both made of insulating material.

[0023] By adopting the above technical solution, the rotating connection installation method makes the rotation adjustment of the test seat cover and the test seat base more convenient.

[0024] Furthermore, a hook is installed on one side of the top end of the test seat cover, and a clamping block is installed on the test seat base at a position cooperating with the hook.

[0025] By adopting the above technical solution, after the hook is engaged with the block, the test seat cover and the test seat base can be reliably closed.

[0026] The specific working principle is: during the test, the device body is first installed on the test seat base, and then the test seat cover is pressed on the test seat base, and the hook and the block cooperate with the lower limit, and then the test seat is only connected to the external detection equipment to test the performance of the device body. During the detection process, when the device body is pressed into the test seat base, the pins on the device body will contact the upper part of the main contact pin. At this time, as the device body is pressed, the lateral ejector pin will press the spare pin to contact the upper part of the main contact pin. Position, so that the main contact pin and the spare pin are put into use, which is convenient for the normal test use of the test socket when the main contact pin is damaged, ensuring the test efficiency of the device body while extending the overall service life of the test socket. During the test, the heat dissipated by the device body will enter the heat dissipation block through the heat dissipation holes, and the heat entering the heat dissipation block will be quickly discharged through the heat dissipation fan, thereby achieving rapid heat dissipation of the device body, ensuring the temperature stability of the device body during the test, and avoiding inaccurate final test results due to overheating of the device body during the test.

[0027] The beneficial effects of the present invention are:

[0028] 1. A spare contact assembly consisting of a lateral ejector pin, a second spring and a spare pin is installed on one side of the main contact pin in the test socket base, so that the spare pin and the main contact pin can be used at the same time when the test socket is in use, so that after the main contact pin is damaged and fails, the spare pin can be used to achieve the connection between the device body and the PCB board, thereby facilitating the normal test use of the test socket when the main contact pin is damaged, ensuring the test efficiency of the device body and extending the overall service life of the test socket;

[0029] 2. By installing a heat dissipation mechanism consisting of a heat dissipation block, heat dissipation holes, spring three, dustproof net, heat dissipation fan and connecting rod on the test seat cover, the heat dissipated by the device body can be quickly discharged through the heat dissipation fan and heat dissipation holes during the device body test, ensuring the temperature stability of the device body during the test process, avoiding inaccurate final test results due to overheating of the device body during the test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of a test socket with spare contact points according to the present invention;

[0031] Figure 2 It is a side sectional view of a test seat cover plate in a test seat with spare contact points according to the present invention;

[0032] Figure 3It is a usage diagram of the positional relationship between the device body, the spare contact assembly, the PCB board, and the main contact pin in a test socket with spare contact points in an unused state according to the present invention;

[0033] Figure 4 It is a usage diagram of the positional relationship between the device body, the spare contact assembly, the PCB board, and the main contact pin in a test socket with spare contact points described in the present invention when in use;

[0034] Figure 5 The present invention is a schematic structural diagram of a lateral ejector pin in a test socket with a spare contact point.

[0035] The following are the descriptions of the reference numerals:

[0036] 1. Hook; 2. Test socket cover; 3. Device body; 4. Test socket base; 5. Block; 6. Heat dissipation mechanism; 601. Heat dissipation block; 602. Heat dissipation hole; 603. Spring three; 604. Dustproof net; 605. Cooling fan; 606. Connecting rod; 7. Spare contact assembly; 701. Lateral ejector pin; 702. Spring two; 703. Spare pin; 8. PCB board; 9. Spring one; 10. Main contact pin. DETAILED DESCRIPTION

[0037] The present invention will be further described below in conjunction with the accompanying drawings:

[0038] like Figure 1-Figure 5 As shown, a test socket with spare contact points, such as Figure 1-Figure 5As shown, a test socket with a spare contact point includes a test socket base 4, a test socket cover 2 is connected to one side of the upper end of the test socket base 4, a heat dissipation mechanism 6 is installed in the middle of the test socket cover 2, and the heat dissipation mechanism 6 includes a heat dissipation pressing block 601, a heat dissipation hole 602, a spring three 603, a dustproof net 604, a heat dissipation fan 605 and a connecting rod 606. A device body 3 is placed in the middle of the upper end of the test socket base 4, and a main contact pin 10 is installed in the test socket base 4 at a position in contact with the pin of the device body 3, and the bottom end of the main contact pin 10 is connected to the bottom of the test socket A spring 9 is installed between the test socket 4, a PCB board 8 is installed at the bottom of the main contact pin 10 in the test socket base 4, a spring 9 is installed at the bottom of the main contact pin 10, and a spare contact assembly 7 is installed on the test socket base 4 at one side of the main contact pin 10. The spare contact assembly 7 includes a lateral ejector pin 701, a spring 2 702 and a spare pin 703. The spare contact assembly 7 enables the test socket to use the spare pin 703 and the main contact pin 10 at the same time when in use, so that after the main contact pin 10 is damaged and fails, the spare pin 703 can be used with the help of the spare pin 703. The spare pin 703 is used to realize the connection between the device body 3 and the PCB board 8, so as to facilitate the normal test use of the test socket when the main contact pin 10 is damaged, wherein the spare pin 703 is located on one side of the main contact pin 10, the side ejector pin 701 is located on the side of the spare pin 703 facing away from the main contact pin 10, and the spring 2 702 is installed between the bottom end of the side ejector pin 701 and the test socket base 4; the heat dissipation block 601 is a convex table-shaped structure, and the spring 3 603 is installed at the four corners of the convex edge of the heat dissipation block 601 and the Between the test seat cover plates 2, the heat dissipation holes 602 are opened at the contact position between the heat dissipation pressing block 601 and the device body 3, the heat dissipation fan 605 is installed in the upper inner part of the heat dissipation pressing block 601 through the connecting rod 606, and the dustproof net 604 is installed in the upper inner part of the heat dissipation pressing block 601. When the device body 3 is tested, the heat dissipated by the device body 3 is quickly discharged through the heat dissipation fan 605 and the heat dissipation holes 602, so as to ensure the temperature stability of the device body 3 during the test process and avoid the final test result being inaccurate due to overheating of the device body 3 during the test process.

[0039] In this embodiment, the lateral ejector pin 701 is composed of a vertical rod and a convex push rod vertically installed in the middle of the vertical rod. The lateral ejector pin 701 is made of insulating material. The lateral ejector pin 701 does not contact the spare pin 703 when the device body 3 is not pressed down. When the device body 3 is pressed down, the spare pin 703 will be pressed on the upper part of the main contact pin 10 under the action of the lateral ejector pin 701, so that the main contact pin 10 and the spare pin 703 are put into use at the same time during testing.

[0040] In this embodiment, the bottom end of the lateral ejector pin 701 is plugged into the spring 2 702, and the bottom end of the spring 2 702 is plugged into the test socket base 4, so that the bottom end of the lateral ejector pin 701 is plugged into the spring 2 702, which can ensure that the lateral ejector pin 701 can easily buffer the up and down movement of the spring 2 702.

[0041] In this embodiment, the spare pin 703 is a bent structure, the bottom end of the spare pin 703 contacts the PCB board 8, the bent portion of the spare pin 703 contacts the convex portion on the lateral ejector pin 701, the bottom end of the spare pin 703 always contacts the PCB board 8, and the top end of the spare pin 703 contacts the upper part of the main contact pin 10 only during testing.

[0042] In this embodiment, the main contact pin 10 is plugged into the spring 9, and the main contact pin 10 is slidably matched with the test socket base 4. The plug-in connection method allows the main contact pin 10 to be conveniently buffered under the action of the spring 9.

[0043] In this embodiment, one end of the spring three 603 is plugged into the heat dissipation block 601, and the other end of the spring three 603 is plugged into the test seat cover 2. The heat dissipation block 601 is a heat dissipation aluminum block. The spring three 603 ensures that the heat dissipation block 601 has a certain buffering capacity to avoid excessive force exerted by the heat dissipation block 601 on the device body 3 during testing.

[0044] In this embodiment, the heat dissipation block 601 has a hollow structure inside, and the dustproof net 604 is bolted to the heat dissipation block 601. The hollow part inside the heat dissipation block 601 can ensure the reliable installation of the heat dissipation fan 605, which is an exhaust type heat dissipation fan.

[0045] In this embodiment, one end of the connecting rod 606 is bolted to the heat dissipation fan 605, and the other end of the connecting rod 606 is bolted to the heat dissipation block 601. The connecting rod 606 is mainly used to realize the suspended installation of the heat dissipation fan 605 inside the heat dissipation block 601 to achieve reliable installation of the heat dissipation fan 605.

[0046] In this embodiment, the test seat cover 2 is rotatably matched with the test seat base 4. The shells of the test seat cover 2 and the test seat base 4 are both made of insulating materials. The rotating connection installation method makes the rotation adjustment of the test seat cover 2 and the test seat base 4 more convenient.

[0047] In this embodiment, a hook 1 is installed on one side of the top of the test seat cover 2, and a block 5 is installed on the test seat base 4 at a position that cooperates with the hook 1. After the hook 1 is engaged with the block 5, the test seat cover 2 and the test seat base 4 can be reliably closed.

[0048] The specific working principle is: during the test, the device body 3 is first installed on the test seat base 4, and then the test seat cover 2 is pressed onto the test seat base 4, and the hook 1 cooperates with the block 5 to limit the lower position, and then the test seat only needs to be connected to the external detection equipment to test the performance of the device body 3. During the detection process, when the device body 3 is pressed into the test seat base 4, the pins on the device body 3 will contact the upper part of the main contact pin 10. At this time, as the device body 3 is pressed, the lateral ejector pin 701 will press the spare pin 703 to the contact part with the upper part of the main contact pin 10. The main contact pin 10 and the spare pin 703 are in position, so that both the main contact pin 10 and the spare pin 703 are put into use, which is convenient for the normal test use of the test socket when the main contact pin 10 is damaged, ensuring the test efficiency of the device body 3 while extending the overall service life of the test socket. During the test, the heat dissipated by the device body 3 will enter the heat dissipation block 601 through the heat dissipation hole 602, and the heat entering the heat dissipation block 601 will be quickly discharged through the heat dissipation fan 605, thereby realizing rapid heat dissipation of the device body 3, ensuring the temperature stability of the device body 3 during the test, and avoiding inaccurate final test results due to overheating of the device body 3 during the test.

[0049] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. A test socket with spare contact points, characterized in that: The invention comprises a test seat base (4), wherein one side of the upper end of the test seat base (4) is connected to a test seat cover plate (2), a heat dissipation mechanism (6) is installed in the middle of the test seat cover plate (2), and the heat dissipation mechanism (6) comprises a heat dissipation pressing block (601), a heat dissipation hole (602), a spring three (603), a dustproof net (604), a heat dissipation fan (605) and a connecting rod (606), a device body (3) is placed in the middle of the upper end of the test seat base (4), and the test seat base (4) A main contact pin (10) is installed at a portion of the device body (3) in contact with the pin, a spring (9) is installed between the bottom end of the main contact pin (10) and the test seat base (4), a PCB board (8) is installed at the bottom end of the main contact pin (10) in the test seat base (4), a spring (9) is installed at the bottom end of the main contact pin (10), and a spare contact assembly (7) is installed on one side of the main contact pin (10) on the test seat base (4). ), the spare contact assembly (7) comprises a lateral ejector pin (701), a second spring (702) and a spare pin (703), wherein the spare pin (703) is located on one side of the main contact pin (10), the lateral ejector pin (701) is located on the side of the spare pin (703) facing away from the main contact pin (10), and the second spring (702) is installed between the bottom end of the lateral ejector pin (701) and the test socket base (4); the heat dissipation block (60 1) is a convex-shaped table-like structure, the spring three (603) is installed between the four corners of the convex edge of the heat dissipation pressing block (601) and the test seat cover (2), the heat dissipation hole (602) is opened at the contact position between the heat dissipation pressing block (601) and the device body (3), the heat dissipation fan (605) is installed on the upper inner part of the heat dissipation pressing block (601) through the connecting rod (606), and the dustproof net (604) is installed on the upper inner part of the heat dissipation pressing block (601).

2. The test socket with spare contact points according to claim 1, characterized in that: The lateral ejector pin (701) is composed of a vertical rod and a convex push rod vertically installed in the middle of the vertical rod. The lateral ejector pin (701) is made of insulating material.

3. The test socket with spare contact points according to claim 2, characterized in that: The bottom end of the lateral ejector pin (701) is plugged into the second spring (702), and the bottom end of the second spring (702) is plugged into the test seat base (4).

4. The test socket with spare contact points according to claim 2, characterized in that: The spare plug pin (703) is of a bent structure, the bottom end of the spare plug pin (703) contacts the PCB board (8), and the bent portion of the spare plug pin (703) contacts the convex portion on the lateral ejector pin (701).

5. The test socket with spare contact points according to claim 1, characterized in that: The main contact pin (10) is plugged into the spring 1 (9), and the main contact pin (10) is slidably matched with the test socket base (4).

6. The test socket with spare contact points according to claim 1, characterized in that: One end of the spring three (603) is plugged into the heat dissipation pressing block (601), and the other end of the spring three (603) is plugged into the test seat cover (2). The heat dissipation pressing block (601) is a heat dissipation aluminum block.

7. The test socket with spare contact points according to claim 1, characterized in that: The heat dissipation pressing block (601) has a hollow structure inside, and the dustproof net (604) is bolted to the heat dissipation pressing block (601).

8. The test socket with spare contact points according to claim 1, characterized in that: One end of the connecting rod (606) is bolted to the heat dissipation fan (605), and the other end of the connecting rod (606) is bolted to the heat dissipation pressing block (601).

9. The test socket with spare contact points according to claim 1, characterized in that: The test seat cover plate (2) is rotatably matched with the test seat base (4), and the shells of the test seat cover plate (2) and the test seat base (4) are both made of insulating material.

10. The test socket with spare contact points according to claim 9, characterized in that: A hook (1) is installed on one side of the top end of the test seat cover plate (2), and a clamping block (5) is installed on the test seat base (4) at a position matching with the hook (1).

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