High-temperature superconducting device test rod assembly and manufacturing method thereof

Abstract

The invention provides a high-temperature superconducting test rod assembly, which comprises a top cover, an aviation joint seat connected with a vacuum valve, a safety valve and an aviation joint, a rod body and a chip bracket which are arranged in sequence, and is characterized in that the chip bracket is provided with a mounting groove for mounting a chip, and a sleeve is sleeved outside the chip bracket, so that the mounting groove is sealed and isolated relative to the outside of the sleeve; the aviation connector seat is hollow and is communicated with the mounting groove through an inner cavity of the rod body, so that vacuum maintenance and electrical connection between the aviation connector and the chip are realized, and the chip comprises a high-temperature superconducting device or a low-temperature superconducting device. The invention further provides a corresponding manufacturing method. The test rod can perform vacuumizing operation to ensure that the chip works in a vacuum environment, the high-temperature superconducting film is very sensitive to water and oxygen, so that the test rod can ensure the vacuum working environment, and the capability of working in liquid nitrogen and liquid helium is simultaneously considered; and the high-temperature superconducting chip can be effectively prevented from being damaged by condensed water and air oxygen in the heating, cooling and working processes.

Description

Technical Field

[0001] The invention relates to a high-temperature superconducting test rod assembly and a manufacturing method thereof, which can be used in a liquid nitrogen temperature range and is compatible with the use capability in a liquid helium temperature range. Background Art

[0002] High-temperature superconducting devices need to work in the liquid nitrogen temperature range, that is, under 77K conditions, so the device needs to be placed in liquid nitrogen through a test rod. High-temperature superconducting devices have poor tolerance to water and oxygen. During the temperature increase and decrease process of the device, if it is operated directly in the air, the surface of the device will frost due to the rapid temperature change, causing irreversible damage to the device.

[0003] Therefore, compared with low-temperature superconducting devices, the test rod used for high-temperature superconducting devices is not only required to have a certain mechanical strength and reliable electrical connection with low heat dissipation, but also requires a certain vacuum holding ability, which the existing test rods do not have.

[0004] Considering the increasingly huge application demand for high-temperature superconducting devices, the market urgently needs a high-temperature superconducting device test rod assembly that is portable, simple, has reliable electrical connections and has vacuum holding capabilities. Summary of the invention

[0005] The object of the present invention is to provide a high-temperature superconducting test rod assembly, which is portable and simple and can realize reliable electrical connection and vacuum maintenance.

[0006] In order to achieve the above-mentioned purpose, the present invention provides a high-temperature superconducting test rod assembly, comprising a top cover, an aviation joint seat connected with a vacuum valve, a safety valve, and an aviation joint, a rod body, and a chip holder, which are arranged in sequence from top to bottom. The chip holder has a mounting groove for mounting the chip and a sleeve is provided on the outside of the chip holder so that the mounting groove of the chip holder is sealed and isolated relative to the outside of the sleeve; the aviation joint seat is hollow and is connected to the mounting groove of the chip holder through the internal cavity of the rod body, so as to realize vacuum maintenance and electrical connection between the aviation joint and the chip, and the chip includes a high-temperature superconducting device or a low-temperature superconducting device.

[0007] The chip is attached to a PCB board, and the PCB board is fixed in a mounting groove of the chip bracket by means of hexagon socket screws.

[0008] A thermometer is also attached to the PCB board, and the aviation connector includes a thermometer aviation connector and an electrical test aviation connector. The PCB board and the thermometer aviation connector and the electrical test aviation connector are connected via a low-temperature twisted pair cable.

[0009] The low-temperature twisted pair is welded to the pin header, a female socket is welded on the PCB board, and the pin header is inserted into the female socket; and / or the number of the low-temperature twisted pair is 12; and / or the cable diameter of the low-temperature twisted pair is 34AWG, and the resistivity is 1.71μΩ·cm 2 / cm.

[0010] The rod body and the aviation joint seat are fixedly connected via a first flange joint and screws; the rod body and the chip bracket are fixedly connected via a second flange joint and screws.

[0011] The tops of the chip bracket and the sleeve are both provided with hexagon socket screw openings, and the chip bracket and the sleeve are both fixed to the openings of the second flange joint by means of hexagon socket screws.

[0012] The top cover, aviation joint seat, rod body and chip bracket are all made of metal materials, and the sleeve is made of brass or copper.

[0013] In another aspect, the present invention provides a method for manufacturing the high temperature superconducting test rod assembly as described above, comprising:

[0014] S1: Determine the test rod structure parameters according to the usage scenario;

[0015] S2: According to the test rod structure parameters, determine the parameters of the top cover, aviation joint seat, rod body, chip holder and sleeve;

[0016] S3: Process the components according to the parameters of the top cover, aviation connector seat, rod body, chip holder and sleeve;

[0017] S4: Provide vacuum valves, safety valves and aviation connectors for connecting to the openings of various valves of the aviation connector seat, and provide low-temperature twisted pair wires;

[0018] S5: Install the top cover, aviation connector seat, rod body, chip holder, sleeve, vacuum valve, safety valve and aviation connector in order, then install the chip, use low-temperature twisted pair wire for electrical connection, and obtain a high-temperature superconducting test rod assembly.

[0019] In step S5, the installation is performed in the following order: the vacuum valve, the safety valve, the aviation connector, and the top cover are fixed to the aviation connector seat with screws according to the opening position of the valve; the rod body is fixed relative to the aviation connector seat; the chip holder is fixed relative to the rod body; the low-temperature twisted pair wire is welded to the pin header, and then the pin header of the low-temperature twisted pair wire and the aviation connector are connected; the bonded chip and PCB board are fixed to the chip holder, and then the pin header of the low-temperature twisted pair wire is connected to the PCB board to complete the electrical connection.

[0020] The method for manufacturing the high-temperature superconducting test rod assembly also includes step S6: vacuum extraction through a vacuum valve; after reaching the required vacuum degree, liquid nitrogen is added so that the liquid level of the liquid nitrogen is higher than the top of the sleeve, and electrical measurement work is started after the temperature is lowered.

[0021] The high-temperature superconducting test rod assembly of the present invention can provide a stable vacuum, low-temperature working environment and a stable electrical connection for the chip to ensure the stability and accuracy of the test through strict material selection, optimized structural design, and control of processing accuracy. After comprehensively considering the characteristics of the test rod, the independent design and assembly of the components are finally adopted, which is easy to process, install, transport and maintain. Since the test rod is designed with a vacuum valve and the joints of each component are supplemented with a sealing design, the test rod can be in a vacuum state for a long time, which can effectively protect the high-temperature superconducting chip from being damaged by condensed water and oxygen in the air during work. And this Dewar has the ability of secondary development and transformation. In places with extremely strict requirements on volume, weight, etc., it can quickly perform scaling operations, re-determine the size of each component, and then process and assemble it for rapid practical application. In addition, the test rod is designed with 24 channels of electrical connection, which can meet special test requirements such as the need to test multiple chips at the same time.

[0022] Due to the above technical solution, the present invention has the following beneficial effects:

[0023] (1) The high-temperature superconducting test rod of the present invention is particularly suitable for application scenarios that require strict control of the volume, quality, and vacuum requirements of the test rod. After the requirements are determined, the structure can be quickly adjusted based on the standard template to meet the requirements.

[0024] (2) A high-temperature superconducting test rod of the present invention can be used for vacuum pumping to ensure that the chip works in a vacuum environment. Since the high-temperature superconducting film is very sensitive to water and oxygen, the test rod can ensure its vacuum working environment and simultaneously take into account the ability to work in liquid nitrogen and liquid helium, which can effectively prevent the high-temperature superconducting chip from being damaged by condensed water and air oxygen during the temperature rise and fall and operation process.

[0025] (3) A high-temperature superconducting test rod of the present invention is not only equipped with necessary interfaces such as vacuum valves and aviation joints, but also equipped with a separate chip rack. It can be compatible with chips of various specifications without adjusting the overall structure. At the same time, it is provided with 24-channel electrical connections, which can have the expansion capability of testing multiple devices and multiple chips at the same time.

[0026] (4) The high-temperature superconducting test rod of the present invention has the ability to work in a liquid helium environment. For low-temperature superconducting chips that do not need to be isolated from water and oxygen, that is, do not need to work in a vacuum environment, the vacuum pumping step can be skipped and the test rod can be used directly. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1The figure is a structural diagram of a high-temperature superconducting test rod assembly according to an embodiment of the present invention.

[0028] Figure 2 Yes Figure 1 A front view of the aerospace connector block of a high temperature superconducting test rod assembly is shown.

[0029] Figure 3 Yes Figure 1 A reverse view of the aerospace connector of the high temperature superconducting test rod assembly is shown.

[0030] Figure 4 Yes Figure 1 Schematic diagram of the structure of the top cover of the high-temperature superconducting test rod assembly shown.

[0031] Figure 5 Yes Figure 1 The schematic diagram of the structure of the first flange joint of the high-temperature superconducting test rod assembly is shown.

[0032] Figure 6 Yes Figure 1 A schematic structural diagram of the rod body of the high-temperature superconducting test rod assembly is shown.

[0033] Figure 7 Yes Figure 1 The schematic structural diagram of the second flange joint of the high-temperature superconducting test rod assembly is shown.

[0034] Figure 8 Yes Figure 1 A schematic structural diagram of a chip holder of a high-temperature superconducting test rod assembly is shown.

[0035] Fig. 9 Yes Figure 1 Schematic diagram of the structure of the sleeve of the high-temperature superconducting test rod assembly shown in FIG. DETAILED DESCRIPTION

[0036] The present invention is further described below in conjunction with specific examples. It should be understood that the following examples are only used to illustrate the present invention and are not used to limit the scope of the present invention.

[0037] like Figure 1-Figure 9 The figure shows a high temperature superconducting test rod assembly according to an embodiment of the present invention, which is suitable for high temperature superconducting devices and is also compatible with low temperature superconducting devices. In the present invention, both high temperature superconducting devices and low temperature superconducting devices are referred to as chips. Figure 1As shown, the high-temperature superconducting test rod assembly of the present invention includes a top cover 10, an aviation joint seat 20 connected with a vacuum valve, a safety valve, and an aviation joint, a rod body 30, and a chip holder 40, which are arranged in sequence from top to bottom. The chip holder 40 has a mounting groove for mounting the chip and a sleeve 50 is sleeved on the outside of the chip holder 40 so that the mounting groove of the chip holder 40 is sealed and isolated relative to the outside of the sleeve 50; the aviation joint seat 20 is hollow and communicates with the mounting groove of the chip holder 40 through the internal cavity of the rod body 30, so as to realize vacuum maintenance and electrical connection between the aviation joint and the chip. The chip includes a high-temperature superconducting device or a low-temperature superconducting device, and the aviation joint includes a thermometer aviation joint and an electrical test aviation joint.

[0038] Therefore, the high-temperature superconducting test rod assembly of the present invention not only has the mechanical strength and electrical connection function of the existing test rod assembly, but also has a special design for sealing to ensure that the test rod can maintain a vacuum for a long time and has the ability to isolate the chip from water and oxygen, thereby effectively protecting the chip.

[0039] The rod body 30 and the aviation joint seat 20 are fixedly connected via a first flange joint 61 and screws.

[0040] The rod body 30 and the chip holder 40 are fixedly connected by a second flange joint 62 and screws. Specifically, the tops of the chip holder 40 and the sleeve 50 are both provided with hexagon socket screw openings, and the chip holder 40 and the sleeve 50 are both fixed to the openings of the second flange joint 62 by hexagon socket screws.

[0041] In the present invention, the chip is attached to the PCB board, and the PCB board is fixed in the mounting groove of the chip bracket 40 by an inner hexagon screw; in addition, the thermometer is attached to the back of the PCB board, and the chip is attached to the front of the PCB board. Electrodes are designed on the chip and the PCB board, and wire bonding is performed through a bonding process (i.e., wire bonding process) to realize the electrical connection between the chip and the PCB board. The PCB board on the chip bracket and the thermometer aviation connector and the electrical test aviation connector of the aviation connector seat 20 are connected by a low-temperature twisted pair cable to realize the connection between the thermometer and the thermometer aviation connector, and the chip and the electrical test aviation connector, wherein the low-temperature twisted pair cable is welded to the pin header, and then a female socket is welded on the PCB board, and the pin header can be inserted into the female socket. Since the chip temperature measurement uses a thermometer of model PT100, it also uses 2 low-temperature twisted pairs to connect to the thermometer aviation connector, an external temperature measurement module, and a four-terminal method to perform real-time temperature measurement. The high-temperature superconducting test rod assembly of the present invention is provided with 24 channels, so a total of 12 low-temperature twisted-pair wires are required to connect the thermometer, the chip and the external source meter and the readout circuit.

[0042] In this embodiment, the cable diameter of the low-temperature twisted pair is relatively small, the cable diameter is 34AWG, and the resistivity is 1.71μΩ·cm 2 / cm, the main reason for choosing this low-temperature twisted pair is its lower thermal conductivity of 3.838watts / cm / Deg.C.

[0043] The overall height of the high-temperature superconducting test rod assembly is approximately 1.3-1.5m, and the diameter of the rod body 30 is 12mm±2mm. The weight is not a design parameter, but some scenes require weight control or the length of the rod needs to be shortened. In this embodiment, the maximum number of channels is 24.

[0044] Therefore, on the one hand, the internal cavity of the rod body 30 is used to connect the aviation connector seat 20 with the mounting groove of the chip holder 40 so as to achieve vacuum extraction through the aviation connector seat 20; on the other hand, the internal cavity of the rod body 30 enables the PCB board and chip placed at the mounting groove of the chip holder 40 to be connected to the electrical test aviation connector of the aviation connector seat 20 through the low-temperature twisted pair wire passing through the internal cavity of the rod body 30. Similarly, the thermometer placed at the mounting groove of the chip holder 40 is also connected to the thermometer aviation connector of the aviation connector seat 20 through the low-temperature twisted pair wire passing through the internal cavity of the rod body 30, thereby achieving electrical connection.

[0045] The aviation connector seat 20 is connected to the vacuum valve, the safety valve, the thermometer aviation connector and the electrical test aviation connector respectively through the opening 21 of the vacuum valve, the opening 22 of the safety valve, the opening 23 of the thermometer aviation connector and the opening 24 of the electrical test aviation connector. The vacuum valve of the aviation connector seat 20 can be used to connect a vacuum pump to perform a vacuum operation. When the vacuum degree is reached, the vacuum valve is closed and the vacuum degree should be able to be maintained for 24 hours. After vacuumization, the interior of the aviation connector seat 20, the interior of the rod body 30, and the interior of the sleeve 50 are all in a vacuum state; the chip holder 40 is in the sleeve 50, which is also in a vacuum state. In this way, lower heat dissipation is achieved and a stable low-temperature working environment is guaranteed.

[0046] In addition to the vacuum degree, stable and reliable electrical connection with low heat dissipation is also a necessary indicator of the test rod. The high-temperature superconducting test rod assembly adopts a full metal structure. The top cover 10, the aviation connector seat 20, the rod body 30, and the chip bracket 40 are all made of metal materials with sufficient mechanical strength. In this embodiment, steel pipes are used. In other embodiments, the metal material only needs to have sufficient mechanical strength and slightly poor thermal conductivity.

[0047] The sleeve 50 has extremely high requirements on heat conduction performance, and therefore is made of brass or copper, preferably copper, to achieve better heat conduction performance.

[0048] In this embodiment, the rod body 30 is made of 306 steel, with a diameter of 12 mm, a wall thickness of 2 mm, and an inner diameter of 8 mm, which can ensure sufficient mechanical strength and the required electrical connection space.

[0049] The sleeve 50 is coated on the bottom and side of the chip holder 40. In this embodiment, the sleeve 50 is made of brass material, with an outer diameter of 28 mm and a wall thickness of 1 mm. The brass material has good thermal conductivity to ensure that after the test rod is inserted into the liquid nitrogen, the sleeve 50 contacts the liquid nitrogen and can be quickly cooled to the liquid nitrogen temperature. In theory, as long as the liquid nitrogen level is higher than the top of the sleeve 50, the cooling effect can be achieved, but in actual application, the liquid nitrogen level is generally located in the middle or upper part of the rod body 30.

[0050] The inner diameter of the sleeve 50 is set to ensure sufficient space for accommodating the chip. Specifically, the chip is attached to the PCB board, and the PCB board is fixed in the mounting groove of the chip holder 40 by the hexagon socket screw. Then, the chip, the PCB board and the chip holder 40 are covered by the sleeve 50. Therefore, the internal space of the sleeve should be sufficient to contain the chip holder 40 and the chip.

[0051] In addition, the present invention provides a method for manufacturing a high-temperature superconducting test rod assembly, which has strong operability and high practicality. The specific steps are as follows:

[0052] Step S1: Determine the test rod structure parameters, such as height, diameter, weight, number of channels, etc., according to the usage scenario (size and shape of the chip);

[0053] The overall height of the high-temperature superconducting test rod assembly is approximately 1.3-1.5m, and the diameter of the rod body 30 is 12mm±2mm. The weight is not a design parameter, but some scenes require weight control or the length of the rod needs to be shortened. In this embodiment, the maximum number of channels is 24.

[0054] Step S2: Determine the parameters of the top cover 10, the aviation connector seat 20, the rod body 30, the chip holder 40 and the sleeve 50 according to the test rod structure parameters;

[0055] Each component involved in the present invention is structurally simulated by 3DMax software, the size of the test rod is strictly defined, and the position of the vacuum valve and aviation joint is reserved. Positioning marks are set at the joints of each component to facilitate subsequent assembly operations and also to reinforce the assembled test rod.

[0056] Among them, the parameters of the top cover 10, the aviation connector seat 20, the rod body 30, the chip bracket 40 and the sleeve 50 can be appropriately scaled according to the template, but it should be noted that the openings of the various valves of the aviation connector seat 20 (electrical test aviation connector, thermometer aviation connector, safety valve opening, vacuum valve opening) and the hexagon socket screw opening cannot be scaled, and sufficient fixing space must be reserved.

[0057] Step S3: performing assembly processing according to the parameters of the top cover 10, the aviation connector seat 20, the rod body 30, the chip holder 40 and the sleeve 50;

[0058] Among them, the top cover 10, the aviation joint seat 20, the rod body 30 and the chip bracket 40 are generally made of 316 steel, and the sleeve 50 is generally made of brass or copper.

[0059] The sleeve 50 needs to be processed separately, and the chip holder 40 needs to be designed separately according to the chip specifications. The influence of thermal radiation should also be considered. If the sleeve 50 is too small, the chip holder 40 and the chip cannot be inserted, and if it is too large, the temperature cannot be lowered to the required level.

[0060] Step S4: providing a vacuum valve, a safety valve and an aviation connector for connecting to the openings of each valve of the aviation connector seat 20, and providing a low-temperature twisted pair wire;

[0061] Vacuum valves, safety valves, and aviation joints must be purchased according to the reserved dimensions when the components are designed, and the aviation joints should have sealing properties.

[0062] Step S5: Install the top cover 10, aviation connector seat 20, rod body 30, chip holder 40, sleeve 50, vacuum valve, safety valve and aviation connector in order, then install the chip, use low-temperature twisted pair wire for electrical connection, and obtain a high-temperature superconducting test rod assembly.

[0063] In step S5, the installation is performed in the following order: the vacuum valve, the safety valve, the aviation connector, and the top cover 10 are fixed to the aviation connector seat 20 using hexagon socket screws according to the opening position of the valve, wherein attention should be paid to air tightness during the installation process to avoid air leakage during vacuuming in subsequent actual use; the rod body 30 is fixed relative to the aviation connector seat 20; the chip holder 40 is fixed relative to the rod body 30; the low-temperature twisted pair wire is welded to the pin header, and then the pin header of the low-temperature twisted pair wire is connected to the aviation connector; the bonded chip and PCB board are fixed to the chip holder 40, and then the pin header of the low-temperature twisted pair wire is connected to the PCB board to complete the electrical connection.

[0064] The test rod is cylindrical in shape, and the vacuum valve, aviation joint, top cover, chip holder, and sleeve are fixed with hexagon socket screws. The chip holder can be used to install chips with a size of less than 1cm*1cm. Since the chip uses a bonding process for electrical connection, there is a large degree of freedom in the positioning and installation of the chip.

[0065] It should be noted that the length of the low-temperature twisted pair cable should be appropriate and not too long to avoid loss of cold.

[0066] Step S6: vacuum extraction is performed through the vacuum valve; after reaching the required vacuum degree, liquid nitrogen is added so that the liquid level of the liquid nitrogen is higher than the top of the sleeve 50, and electrical measurement work is started after the temperature is lowered.

[0067] Specifically, the vacuum valve is connected to the vacuum pump, and the vacuum pump is used to perform vacuum operation through the vacuum valve; after the vacuuming is completed (i.e., the preset vacuum degree is reached), the vacuum valve is closed and the vacuum pump is disconnected to reduce the vibration and electromagnetic interference caused by the operation of the vacuum pump to the chip; the test rod is inserted into the liquid nitrogen dewar for cooling operation, and the preset liquid nitrogen temperature zone can be reached after being stationary for about half an hour, and the cooling is completed; after the cooling is completed, the source meter is connected through the aviation connector, and the chip starts working for testing; during the test, the test rod should be kept as stable as possible, and vibration will cause noise in the chip test data; after the test is completed, the test rod is pulled out of the liquid nitrogen and heated to room temperature. After the heating is completed, the sleeve can be removed and the chip can be removed. Subsequently, the test rod can be transported as a whole or the components can be separated and transported separately.

[0068] The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. The above embodiments of the present invention can also be modified in various ways. All simple, equivalent changes and modifications made according to the claims and the description of the present invention fall within the scope of protection of the claims of the present invention. The contents not described in detail in the present invention are all conventional technical contents.

Claims

1. A high temperature superconducting test rod assembly, characterized in that: It includes a top cover, a vacuum valve, a safety valve, an aviation joint seat connected to an aviation joint, a rod body, and a chip holder, which are arranged in sequence from top to bottom. The chip holder has a mounting groove for mounting the chip and a sleeve is provided on the outside of the chip holder so that the mounting groove of the chip holder is sealed and isolated relative to the outside of the sleeve; the aviation joint seat is hollow and is connected to the mounting groove of the chip holder through the internal cavity of the rod body, so as to realize vacuum maintenance and electrical connection between the aviation joint and the chip, and the chip includes a high-temperature superconducting device or a low-temperature superconducting device.

2. The high temperature superconducting test rod assembly according to claim 1, characterized in that: The chip is attached to a PCB board, and the PCB board is fixed in a mounting groove of the chip bracket by means of hexagon socket screws.

3. The high temperature superconducting test rod assembly according to claim 2, characterized in that: A thermometer is also attached to the PCB board, and the aviation connector includes a thermometer aviation connector and an electrical test aviation connector. The PCB board and the thermometer aviation connector and the electrical test aviation connector are connected via a low-temperature twisted pair cable.

4. The high temperature superconducting test rod assembly according to claim 3, characterized in that: The low-temperature twisted pair is welded to the pin header, a female socket is welded on the PCB board, and the pin header is inserted into the female socket; and / or the number of the low-temperature twisted pair is 12; and / or the cable diameter of the low-temperature twisted pair is 34AWG, and the resistivity is 1.71μΩ·cm 2 / cm.

5. The high temperature superconducting test rod assembly according to claim 1, characterized in that: The rod body and the aviation joint seat are fixedly connected via a first flange joint and screws; the rod body and the chip bracket are fixedly connected via a second flange joint and screws.

6. The high temperature superconducting test rod assembly according to claim 5, characterized in that: The tops of the chip bracket and the sleeve are both provided with hexagon socket screw openings, and the chip bracket and the sleeve are both fixed to the openings of the second flange joint by means of hexagon socket screws.

7. The high temperature superconducting test rod assembly according to claim 1, characterized in that: The top cover, aviation joint seat, rod body and chip bracket are all made of metal materials, and the sleeve is made of brass or copper.

8. A method for manufacturing a high temperature superconducting test rod assembly according to any one of claims 1 to 7, characterized in that: include: Step S1: determining the structural parameters of the test rod according to the usage scenario; Step S2: Determine the parameters of the top cover, aviation connector seat, rod body, chip holder and sleeve according to the test rod structure parameters; Step S3: performing assembly processing according to the parameters of the top cover, the aviation connector seat, the rod body, the chip holder and the sleeve; Step S4: providing a vacuum valve, a safety valve and an aviation connector for connecting to the openings of each valve of the aviation connector seat, and providing a low-temperature twisted pair wire; Step S5: Install the top cover, aviation connector seat, rod body, chip holder, sleeve, vacuum valve, safety valve and aviation connector in order, then install the chip, use low-temperature twisted pair wires for electrical connection, and obtain a high-temperature superconducting test rod assembly.

9. The method for manufacturing a high temperature superconducting test rod assembly according to claim 8, characterized in that: In step S5, the installation is performed in the following order: the vacuum valve, the safety valve, the aviation connector, and the top cover are fixed to the aviation connector seat with screws according to the opening position of the valve; the rod body is fixed relative to the aviation connector seat; the chip holder is fixed relative to the rod body; the low-temperature twisted pair wire is welded to the pin header, and then the pin header of the low-temperature twisted pair wire and the aviation connector are connected; the bonded chip and PCB board are fixed to the chip holder, and then the pin header of the low-temperature twisted pair wire is connected to the PCB board to complete the electrical connection.

10. The method for manufacturing a high temperature superconducting test rod assembly according to claim 8, characterized in that: The method further includes step S6: performing vacuum extraction through a vacuum valve; after reaching the required vacuum degree, adding liquid nitrogen so that the liquid level of the liquid nitrogen is higher than the top of the sleeve, and starting electrical measurement after the temperature is lowered.

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