Cooling system capable of adaptively adjusting flow of cooling liquid

By setting up sleeves and spring devices in the computer cooling system to adjust the cross-sectional area of ​​the coolant flow channel, the problem of inconsistent coolant flow is solved, and the uniform temperature distribution of each module and the efficient utilization of coolant is achieved.

CN119828869APending Publication Date: 2025-04-15XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
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Patent Information

Application Number
CN202411810230.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-10
Publication Date
2025-04-15

AI Technical Summary

Technical Problem

In computer cooling system, when coolant flows in the pipeline, due to the difference in the position of the inlet and outlet and branch, the cooling liquid flow rate of each module is inconsistent, resulting in uneven temperature and waste of coolant.

Method used

A system for adaptive adjustment of coolant flow is designed. By setting a sleeve and a spring device in the module, the natural frequency of the spring is matched with the basic frequency of the pump, and the cross-sectional area of ​​the coolant flow channel is adjusted, thereby realizing adaptive adjustment of the coolant flow rate of each module.

Benefits of technology

The cooling liquid flow rate in each module is achieved, the temperature distribution uniformity is improved, and the module temperature is too high or the waste of coolant flow rate is avoided.

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Abstract

The invention provides a cooling system with a cooling liquid flow self-adaptive adjustment function, and relates to the technical field of computer heat dissipation, and the cooling system comprises a case, a plurality of cooling assemblies arranged in the case, and a cooling liquid main inlet and a cooling liquid main outlet which are formed in a case shell, each cooling assembly comprises a sleeve connected with the cooling liquid branch inlets of the multiple cooling assemblies, a cooling liquid branch pipeline connected with the sleeve and used for cooling the electronic element, and a spring used for adjusting the sectional area of a cooling liquid flow channel between the sleeve and the cooling liquid branch pipeline. According to the system, the devices which sense and move along with the flow velocity of the cooling liquid are arranged in the modules, so that the flow of the cooling liquid flowing into the modules is adaptively adjusted, the cooling liquid flowing into the modules is kept consistent, the temperature distribution of the modules is more uniform, and the temperature of the modules is prevented from being too high or the waste of the flow of the cooling liquid is avoided.
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Description

Technical Field

[0001] The invention relates to the technical field of computer heat dissipation, and in particular provides a cooling system capable of adaptively regulating the flow rate of a coolant. Background Art

[0002] Computers generate heat when they are running, and this heat needs to be discharged to the environment through air, coolant or other cooling media to prevent the temperature of components from being too high and affecting the normal operation of the onboard computer. When the coolant is supplied to the computer from the outside, it first flows into the chassis through the fluid connector on the chassis. The chassis is generally designed with a manifold-type shunt pipeline to distribute the coolant to each module and flow into the module through the connector on the module; then, the coolant flows in the flow channel in the module cold plate, convects and exchanges heat with the module cold plate, and finally transfers the heat generated in the module to the coolant.

[0003] When the coolant flows in the pipeline, the coolant inlet and outlet pressures of each module are different due to the location of the inlet and outlet and the branch, as well as the local and extended pressure losses, resulting in different coolant flow rates flowing into each module. For example, modules with shorter total flow paths usually have higher flow rates, while modules with longer total flow paths have lower flow rates. Modules with low coolant flow rates are at risk of overheating, while modules with large flow rates waste coolant. Summary of the invention

[0004] The purpose of the present application is to provide a system to keep the coolant flow of each module of a computer that uses coolant for heat dissipation consistent, thereby making the temperature distribution of each module more uniform and avoiding excessive module temperature or waste of coolant flow.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a cooling system with adaptive adjustment of coolant flow, the system comprising: a chassis, a plurality of cooling components arranged in the chassis for cooling electronic components, and a total coolant inlet and a total coolant outlet arranged on the chassis shell, the coolant branch inlets of the plurality of cooling components are connected in parallel to a total coolant supply pipeline connected to the total coolant inlet, the coolant branch outlets of the plurality of cooling components are connected in parallel to a total coolant return pipeline connected to the total coolant outlet, the cooling component comprises a sleeve connected to the coolant branch inlet, a coolant branch pipeline for cooling electronic components connected to the sleeve, and a spring for adjusting the cross-sectional area of ​​the coolant flow channel between the sleeve and the coolant branch pipeline.

[0006] The cooling system with adaptively adjusted coolant flow provided by the present invention also has the following technical feature: the number of the cooling components is at least three, and the multiple cooling components are arranged in parallel.

[0007] The cooling system with adaptively adjusted coolant flow provided by the present invention also has a technical feature that the structures of the multiple cooling components are the same.

[0008] The cooling system with adaptively adjusted coolant flow provided by the present invention also has the following technical features: the cooling assembly also includes a box body for accommodating coolant branch pipes, a welding plate and a cover plate for sealingly mounting the coolant branch pipes on the box body; the electronic components to be cooled are placed in the box body; and a thermal interface material for heat conduction is provided between the electronic components to be cooled and the box body.

[0009] The cooling system with adaptively adjusted coolant flow provided by the present invention also has the following technical feature: the cooling assembly also includes a sealing box for accommodating the sleeve and the spring.

[0010] The cooling system with adaptive adjustment of coolant flow provided by the present invention also has the following technical features: one end of the sleeve is provided with a cylinder connected to the coolant branch inlet and an outlet hole connected to the coolant branch pipeline, the pipeline between the cylinder and the outlet hole is provided with an arc that turns the coolant flow direction by 90°, and the other end of the cylinder is provided with a cylinder that cooperates with the spring, when the spring is extended, the overlapping area between the outlet hole and the inlet of the coolant branch pipeline is the largest; when the spring is compressed, the position of the cylinder is offset, and the overlapping area between the outlet hole and the inlet of the coolant branch pipeline becomes smaller.

[0011] The cooling system with adaptively adjusted coolant flow provided by the present invention also has the following technical features: the natural frequency γ of the spring n for:

[0012] γ n >10γ r

[0013] or:

[0014]

[0015] Among them, γ r The fundamental frequency of the pump used to move liquid in the cooling system.

[0016] Beneficial Effects

[0017] The present invention proposes a cooling system with adaptive coolant flow rate regulation, which realizes adaptive adjustment of the coolant flow rate flowing into the module by arranging a device in the module that senses and moves with the coolant flow rate, so that the coolant flowing into each module remains consistent, thereby making the temperature distribution of each module more uniform and avoiding excessive module temperature or waste of coolant flow rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A schematic diagram of the structure of a system provided by an embodiment of the present invention;

[0020] Figure 2 A structural disassembly diagram of a cooling assembly of a system provided in an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of the structure of a cooling component of a system provided in an embodiment of the present invention;

[0022] Figure 4 A partial enlarged view of the system provided by an embodiment of the present invention;

[0023] Figure 5 A schematic diagram of a partial structure of a flow channel of a system provided in an embodiment of the present invention;

[0024] Figure 6 A schematic diagram of the structure of the system slot provided by an embodiment of the present invention;

[0025] Figure 7 A schematic diagram of the working example of the present invention is provided.

[0026] Among them, 1: chassis; 201: main coolant inlet; 202: main coolant outlet; 310: welding plate; 320: box body; 320a: mounting hole; 320b: round tube; 321: sealing box; 322: sleeve; 322a: cylinder; 322b: arc; 322c: cylinder; 322d: outlet hole; 323: spring; 330: electronic module; 340: cover plate; 351: sub-inlet of coolant; 352: sub-outlet of coolant. DETAILED DESCRIPTION

[0027] The present application is further described in detail below in conjunction with the accompanying drawings and examples, but it should be noted that these implementation methods are not limitations of the present application, and equivalent changes or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these implementation methods are all within the scope of protection of the present application.

[0028] In the description of the embodiments of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the creation of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the creation of the present application.

[0029] In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0030] The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention of this application can be understood by specific circumstances.

[0031] like Figure 1-7 As shown, an embodiment of the present application provides a cooling system with adaptive adjustment of coolant flow, the system comprising: a chassis 1, a plurality of cooling components arranged in the chassis 1 for cooling electronic components, and a total coolant inlet 201 and a total coolant outlet 202 arranged on the shell of the chassis 1, the coolant branch inlets 351 of the plurality of cooling components are connected in parallel to a total coolant supply pipeline connected to the total coolant inlet 201, the coolant branch outlets 352 of the plurality of cooling components are connected in parallel to a total coolant return pipeline connected to the total coolant outlet 202, the cooling component comprises a sleeve 322 connected to the coolant branch inlet 351, a coolant branch pipeline for cooling electronic components connected to the sleeve 322, and a spring 323 for adjusting the cross-sectional area of ​​the coolant flow channel between the sleeve 322 and the coolant branch pipeline.

[0032] In some embodiments, the number of the cooling components is at least three, and the multiple cooling components are arranged in parallel.

[0033] In some embodiments, the structures of the multiple cooling components are the same.

[0034] In some embodiments, the cooling assembly further includes a box body 320 for accommodating a cooling liquid branch pipeline, a welding plate 310 for sealing and mounting the cooling liquid branch pipeline on the box body 320, and a cover plate 340. The electronic components to be cooled are placed in the box body 320, and a thermal interface material for heat conduction is provided between the electronic components to be cooled and the box body 320. The box body 320 is provided with a mounting hole 320a for mounting a cooling liquid branch inlet 351, and the mounting hole 320a is connected to a round tube 320b in the module.

[0035] In some embodiments, the cooling assembly further includes a sealing box 321 for accommodating the sleeve 322 and the spring. The sealing box 321 can be sealedly connected to the box body 320 so that the coolant does not flow out of the sealing box 321.

[0036] In some embodiments, one end of the sleeve 322 is provided with a cylinder 320b connected to the coolant branch inlet 351 and an outlet hole 322d connected to the coolant branch pipeline, the pipeline between the cylinder 320b and the outlet hole 322d is provided with an arc 322b that turns the coolant flow direction by 90°, the other end of the cylinder 322a is provided with a cylinder 322c that cooperates with the spring 323, the spring 323 is installed outside the cylinder 322c, and the other end of the spring 323 is installed in the hole on the sealing box 321, when the spring 323 is extended, the overlapping area between the outlet hole 322d and the inlet of the coolant branch pipeline is the largest; when the spring 323 is compressed, the position of the cylinder 322a is offset, and the overlapping area between the outlet hole 322d and the inlet of the coolant branch pipeline becomes smaller.

[0037] In the above embodiment, the outlet hole 322d is connected to the module inlet hole 320b on the box body 320, and the coolant flowing into the module enters the module inlet hole 320b through the outlet hole 322d, then enters the groove 320c on the box body, and finally flows out of the module through the module outlet hole 320d and the joint 352.

[0038] In some embodiments, if the cooling system uses a centrifugal pump, a gear pump, etc. to transport the fluid, the liquid pressure will experience a sinusoidal pressure pulsation, which will propagate along the pipeline with a frequency of γ r It can be calculated as follows:

[0039] γ r =P×R / 60

[0040] Where P is the number of pump blades or gears, and R is the pump speed (r / min). r and the spring natural frequency γ n When close, it will cause harmful pipeline vibration.

[0041] Therefore, the natural frequency γ of the springn for:

[0042] γ n >10γ r

[0043] or:

[0044]

[0045] Among them, γ r The fundamental frequency of the pump used to move liquid in the cooling system.

[0046] The natural frequency of the spring is calculated as follows:

[0047]

[0048] Where: γ n - Spring natural frequency (Hz); d - spring wire diameter (mm); n - number of effective coils of the spring; D - spring median diameter (mm).

[0049] The working principle of the system provided in any of the above embodiments is as follows:

[0050] The coolant flowing into the computer flows into each module respectively. When the coolant flow into a module increases, the flow rate of the coolant in the module pipeline increases. Under the action of the inertial force and viscosity of the coolant, the sleeve 322 moves toward the spring side and compresses the spring 323. At this time, due to the movement of the sleeve 322, the sleeve outlet hole 322d and the module inlet hole 320b are misaligned, and the flow area is reduced. When the flow area is reduced to a certain extent, the fluid impact force on the sleeve 322 and the elastic force of the spring 323 reach a balanced state, and the sleeve 322 is in a balanced state.

[0051] If the coolant flow rate into the module decreases, the force applied by the coolant to the sleeve 322 will also decrease. At this time, under the action of the spring force, the sleeve will move away from the spring side, increasing the flow area until a new equilibrium state is reached or it moves to the maximum flow position. In this way, the coolant flow rate in multiple modules in the computer can be adaptively adjusted to keep the coolant flow rate in each module consistent.

[0052] The above is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application. The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present application, and these improvements and variations should also be regarded as the protection scope of the present application.

Claims

1. A cooling system with adaptive adjustment of coolant flow, characterized in that: The system comprises: a chassis, a plurality of cooling components arranged in the chassis for cooling electronic components, and a cooling liquid main inlet and a cooling liquid main outlet arranged on the chassis shell. The cooling liquid sub-inlets of the plurality of cooling components are connected in parallel to the cooling liquid supply main pipeline connected to the cooling liquid main inlet, and the cooling liquid sub-outlets of the plurality of cooling components are connected in parallel to the cooling liquid return main pipeline connected to the cooling liquid main outlet. The cooling assembly includes a sleeve connected to the coolant branch inlet, a coolant branch pipeline connected to the sleeve for cooling electronic components, and a spring for adjusting the cross-sectional area of ​​the coolant flow channel between the sleeve and the coolant branch pipeline.

2. The cooling system with adaptive coolant flow rate adjustment according to claim 1, characterized in that: The number of the cooling components is at least three, and the multiple cooling components are arranged in parallel.

3. The cooling system with adaptive coolant flow rate regulation according to claim 1, characterized in that: The structures of the multiple cooling components are the same.

4. The cooling system with adaptive coolant flow rate regulation according to claim 1, characterized in that: The cooling assembly also includes a box body for accommodating a cooling liquid branch pipeline, a welding plate and a cover plate for sealing and mounting the cooling liquid branch pipeline on the box body. The electronic components to be cooled are placed in the box body, and a thermal interface material for heat conduction is provided between the electronic components to be cooled and the box body.

5. The cooling system with adaptive coolant flow rate regulation according to claim 1, characterized in that: The cooling assembly also includes a sealed box for accommodating the sleeve and the spring.

6. The cooling system with adaptive coolant flow rate regulation according to claim 1, characterized in that: One end of the sleeve is provided with a cylinder connected to the coolant inlet and an outlet hole connected to the coolant pipeline. The pipeline between the cylinder and the outlet hole is provided with an arc that turns the coolant flow direction by 90°. The other end of the cylinder is provided with a cylinder that matches the spring. When the spring is extended, the overlap area between the outlet hole and the inlet of the coolant branch pipeline is the largest; when the spring is compressed, the position of the cylinder is offset, and the overlap area between the outlet hole and the inlet of the coolant branch pipeline becomes smaller.

7. The cooling system with adaptive coolant flow rate regulation according to claim 1, characterized in that: The natural frequency γ of the spring n for: c n >10g r or: Among them, γ r The fundamental frequency of the pump used to move liquid in the cooling system.

Citation Information

Patent Citations

  • Coolant distribution unit

    CN109922637A

  • Automatically regulated fluid cooling system for electronic devices

    CN116321914A

  • Rack-mounted server and heat dissipation system thereof

    CN218918064U

  • Liquid cooling energy storage system

    CN218996857U