Heat pipe radiator with metal phase change heat absorption and conduction functions

Abstract

The invention relates to a heat pipe radiator with metal phase change heat absorption and heat conduction functions, and relates to the technical field of radiators. The heat dissipation device comprises a heat dissipation assembly, a heat conduction pipe and stamping fins, the heat dissipation assembly comprises a heat dissipation base, a heat conduction block and a sealing plate, the heat dissipation base is provided with a containing cavity filled with liquid metal, the heat conduction block is fixed to the inner wall of the containing cavity and located in the middle of the containing cavity, and the sealing plate is arranged on the heat dissipation base and used for covering the containing cavity. One end of the heat conduction pipe abuts against the heat dissipation base, and the other end of the heat conduction pipe abuts against the stamping fins. The heat dissipation device has the advantages that quick response and effective heat dissipation are achieved in a short time, and the heat dissipation efficiency and stability are improved.

Description

Technical Field

[0001] The present application relates to the field of heat sinks, and in particular to a heat pipe heat sink with metal phase change heat absorption and heat conduction. Background Art

[0002] The CPU and other components of a computer will generate heat during high-speed operation. Heat dissipation is actually a heat transfer process, the purpose of which is to transfer the heat generated by the CPU to other media and control the CPU temperature within a stable range. According to the living environment, the heat of the CPU will eventually dissipate into the air. This process is computer heat dissipation.

[0003] The high temperature of the CPU chip seriously affects the computing performance of the CPU chip, and also reduces the service life of the CPU chip. Traditional chip cooling technologies mainly include: air cooling, water cooling, semiconductor cooling, heat pipe cooling, compressor cooling liquid nitrogen cooling, etc. However, with the user's pursuit of equipment integration and lightweight, the cooling performance of these traditional radiators cannot meet the cooling needs of existing CPU chips, the cooling efficiency is low, and the heat cannot be taken away in time, so it needs to be improved. Summary of the invention

[0004] In order to improve the problem of low heat dissipation efficiency of traditional radiators, the present application provides a heat pipe radiator with metal phase change heat absorption and heat conduction.

[0005] The present application provides a heat pipe radiator with metal phase change heat absorption and heat conduction, which adopts the following technical solution: A heat pipe radiator with metal phase change heat absorption and heat conduction, comprising a heat dissipation component, a heat pipe and a stamped fin. The heat dissipation component comprises a heat dissipation base, a heat conduction block and a sealing plate. The heat dissipation base is provided with a receiving cavity filled with liquid metal. The heat conduction block is fixed on the inner wall of the receiving cavity, and the heat conduction block is located in the middle of the receiving cavity. The sealing plate is arranged on the heat dissipation base for sealing the receiving cavity. One end of the heat conduction pipe is in contact with the heat dissipation base, and the other end is in contact with the stamped fin.

[0006] By adopting the above technical solution, in the initial state, the temperature of the heat conductive block is relatively low, so that the liquid metal is in a solid state. When in use, the heat-generating CPU chip transfers heat to the surrounding liquid metal through the heat conductive block, so that the temperature of the heat conductive block increases, and the liquid metal located around the heat conductive block melts due to the heat, so that the liquid metal changes from a solid state to a liquid state, wherein the melting process absorbs heat but the temperature remains unchanged, thereby controlling the heat conductive block to a certain suitable temperature. When the CPU chip is no longer working, that is, the heat conductive block will no longer continue to generate heat, the liquid metal gradually solidifies into a solid state in preparation for the next melting work. Compared with the traditional liquid cooling technology using water as the cooling medium, liquid metal cooling has better heat dissipation performance.

[0007] While the heat conducting block drives the liquid metal to melt, it also raises the temperature of the entire heat sink, thereby transferring the high temperature to the heat pipe, which then transfers it to the stamped fins. When the heat pipe transfers heat, the entire heat pipe is in contact with the air and can also dissipate heat. The stamped fins further expand the contact area with the air, thereby improving the heat dissipation effect on the CPU chip. The above works together through the melting and absorption of the liquid metal, and the heat dissipation of the heat pipe and the stamped fins to simultaneously dissipate the heat of the CPU chip, thereby being able to take away the heat in time and thus improving the heat dissipation efficiency.

[0008] Optionally, a mounting shell is provided on the side wall of the stamped fin, a fan is provided on the mounting shell, and the fan is parallel to the stamped fin.

[0009] By adopting the above technical solution, when the heat conductive block generates heat and the heat conductive pipe transfers the heat to the stamped fins, the fan is started. When the fan rotates, the gas is sucked into the center of the fan, and then the wind is discharged from the peripheral side of the fan, so that the gas passes through the stamped fins, thereby allowing the air cooling to drive the heat on the stamped fins and achieve heat dissipation of the stamped fins.

[0010] Optionally, the stamped fin includes two heat sinks and a plurality of heat sinks, the two heat sinks are arranged opposite to each other, the heat sinks are arranged in a direction perpendicular to the central axis of the fan, one end of the heat pipe is abutted against one of the heat sinks, a plurality of heat sinks are located between the two heat sinks, both ends of the heat sink are respectively fixed to the two heat sinks, and a plurality of heat sinks are arranged at intervals along the length direction of the heat sink.

[0011] By adopting the above technical solution, when the heat pipe transfers heat to one of the heat sinks, the heat on the heat sink is distributed and transferred to a number of heat sinks, and the several heat sinks increase the surface area of ​​the heat sink, that is, increase the contact area between the heat sink and the surrounding air, thereby facilitating air circulation, accelerating heat transfer, and achieving better heat dissipation effect.

[0012] Optionally, a cavity is provided in the stamped fin, a water inlet hole is provided on one of the heat sinks, and a water outlet hole is provided on the other heat sink, both the water inlet hole and the water outlet hole are connected to the cavity, a water storage box is provided on the mounting shell, the water storage box is connected to the water outlet hole, a cooling component is provided on the mounting shell, the cooling component is connected to the water storage box and the water inlet hole, and the cooling component is used to pump water in the water storage box into the cavity.

[0013] By adopting the above technical solution, after the heat pipe transfers the heat to the stamped fin, the cooling component is started to pump the water in the water storage box to the water inlet hole, so as to realize the spraying in the cavity. When the water splashes on the inner wall of the cavity, the water splashes into tiny water droplets, which evaporate rapidly in the cavity and absorb the surrounding heat during the evaporation process, thereby reducing the temperature of the stamped fin and improving the heat dissipation efficiency. The water in the cavity eventually reaches the bottom of the cavity and flows out from the water outlet hole into the water storage box, realizing water recovery and achieving the effect of recycling.

[0014] Optionally, the water storage box is located directly below the fan.

[0015] By adopting the above technical solution, the temperature of water will increase after absorbing heat in the cavity, that is, the temperature of water recovered into the water storage box is higher. At this time, the fan is in the starting state, and the gas is sucked in from one side of the fan. The water storage box is located on the exhaust surface of the fan, so that it can withstand the blowing of the wind and realize the cooling of the water in the water storage box, so as to facilitate the subsequent cooling component to extract the low-temperature water in the water storage box into the cavity for cooling the stamping fins.

[0016] Optionally, a guide plate is provided in the cavity, and one end of the guide plate close to the water outlet is arranged to be inclined downward.

[0017] By adopting the above technical solution, when water is sprayed into the cavity from the water inlet hole, the water, under the action of gravity, follows the heat sink and finally falls on the guide plate. The guide plate plays a guiding role, allowing the water to flow along the guide plate to the bottom of the guide plate until it reaches the water outlet hole, thereby facilitating the water in the cavity to flow back into the water storage box.

[0018] Optionally, the cooling component includes a water bag, a water outlet pipe and a water inlet pipe, the water bag is arranged on the mounting shell, one end of the water outlet pipe is connected to the water bag, and the other end is connected to the water inlet hole, one end of the water inlet pipe is connected to the water bag, and the other end is connected to the water storage box, one end of the water inlet pipe and the water outlet pipe are connected to the water bag at one end thereof, a one-way valve is provided, a spring is provided in the water bag, and the spring is used to expand the water bag, and a driving component for driving the water bag to contract is provided on the mounting shell.

[0019] By adopting the above technical solution, when the fan is started, the driving assembly is driven to move to the water storage bag, and the water storage bag is contracted, and the spring is compressed, so that the water in the water storage bag is squeezed into the cavity, so as to spray the inner wall of the cavity. The one-way valve in the water inlet pipe restricts the water in the water storage bag from flowing back into the water inlet pipe, so that when the water storage bag is squeezed, the water in the water storage bag can only enter the water outlet pipe. When the driving assembly is separated from the water storage bag, the spring recovers its deformation, so that the water storage bag gradually expands, so that the water in the water storage box is sucked into the water storage bag through the water inlet pipe. In this process, the one-way valve in the water outlet pipe restricts the airflow from the stamping fin to the water storage bag, so as to prevent the space in the water storage bag from being occupied by gas, so that the water storage bag is only connected to the water inlet pipe and is filled with water, so that water can be sprayed into the cavity next time.

[0020] Optionally, the driving assembly includes an abutment block, one end of which is fixed to the output end of the fan, and the other end of which can move to the water storage bag and squeeze the water storage bag.

[0021] By adopting the above technical solution, when the fan rotates, the abutment block is driven to move along the circumferential direction of the fan, so that the abutment block intermittently abuts against the water bag, realizing continuous compression and rebound of the water bag, and then realizing intermittent spraying of the inside of the stamping fin, so as to achieve a cooling effect and improve heat dissipation efficiency.

[0022] Optionally, an arc plate is fixed on the water storage bag, and the abutment block can abut against the arc plate.

[0023] By adopting the above technical solution, when the abutment block moves to the water bag, the abutment block will abut against the arc plate. When the abutment block pushes the arc plate, the water bag will shrink, thereby achieving the effect of spraying water into the cavity. The arc plate plays a protective role, so that the abutment block will not directly contact the side wall of the water bag, thereby making it difficult for the abutment block to damage the water bag, thereby extending the service life of the water bag.

[0024] Optionally, the heat conducting pipe is provided with spiral blades.

[0025] By adopting the above technical solution, the spiral blades increase the surface area of ​​the heat pipe to increase the contact area between the heat pipe and the air, thereby facilitating air circulation, accelerating heat transfer, and achieving better heat dissipation effects.

[0026] In summary, the present application includes at least one of the following beneficial effects: 1. By introducing the phase change mechanism of low-melting-point alloys into the heat dissipation components, when the chip generates a lot of heat, the liquid metal will quickly absorb the heat and undergo a phase change, turning into a gaseous state or a higher temperature liquid state, thereby quickly transferring the heat to the heat dissipation base and the heat conduction block. The heat pipe transfers the heat to the stamped fins, which dissipate the heat by contacting the air. At the same time, the cooling water circulates in the cavity, taking away more heat and further improving the heat dissipation effect. This design responds quickly and dissipates heat effectively in a short time, improving the heat dissipation efficiency and stability; 2. When the fan is running, it drives the abutment block to periodically squeeze the water storage bag, promoting the circulation of cooling water in the cavity to improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic structural diagram of a heat pipe radiator with metal phase change heat absorption and heat conduction according to an embodiment of the present application; Figure 2 is a schematic diagram of the structure of the heat dissipation component; Figure 3 is a schematic diagram of the structure of the heat pipe; Figure 4 It is a cross-sectional view of the structure of stamped fins and cooling components.

[0028] In the figure: 10, heat dissipation component; 11, heat dissipation base; 111, accommodating cavity; 12, heat conductive block; 13, sealing plate; 20, heat conductive pipe; 21, spiral blade; 30, stamped fin; 31, heat dissipation plate; 32, heat sink; 33, cavity; 34, water inlet hole; 35, water outlet hole; 36, guide plate; 40, mounting shell; 50, fan; 60, water storage box; 70, cooling component; 71, water storage bag; 711, spring; 712, arc plate; 72, water outlet pipe; 73, water inlet pipe; 80, driving component; 81, abutment block. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-4 This application is described in further detail.

[0030] The present application embodiment discloses a heat pipe radiator with metal phase change heat absorption and heat conduction. Figure 1 and Figure 2The heat pipe radiator with metal phase change heat absorption and heat conduction includes a heat dissipation component 10, a heat pipe 20 and a stamped fin 30. The heat dissipation component 10 includes a heat dissipation base 11, a heat conduction block 12 and a sealing plate 13. The heat dissipation base 11 is placed flat, and a receiving cavity 111 is opened on the top wall of the heat dissipation base 11. The heat conduction block 12 is fixed on the inner wall of the receiving cavity 111, and the heat conduction block 12 is located in the middle of the receiving cavity 111. Liquid metal is stored in the receiving cavity 111, that is, the liquid metal surrounds the heat conduction block 12, wherein the liquid metal is a cooling medium composed of low melting point alkali metals (such as sodium, potassium, lithium) and low melting point alloys (such as lead-bismuth alloy). The sealing plate 13 is installed on the top of the heat dissipation base 11 to cover the receiving cavity 111, so that the liquid metal is always stored in the heat dissipation base 11.

[0031] In the initial state, the temperature of the heat-conducting block 12 is relatively low, so that the liquid metal is in a solid state. When in use, the heat-generating CPU chip transfers heat to the surrounding liquid metal through the heat-conducting block 12, so that the temperature of the heat-conducting block 12 increases, and the liquid metal located around the heat-conducting block 12 melts due to the heat, so that the liquid metal changes from a solid state to a liquid state, wherein the melting process absorbs heat but the temperature remains unchanged, thereby controlling the heat-generating heat-conducting block 12 at a suitable temperature. When the CPU chip is no longer working, that is, the heat-conducting block 12 will no longer continue to generate heat, the liquid metal gradually solidifies into a solid state in preparation for the next melting operation. Compared with the traditional liquid cooling technology using water as the cooling medium, liquid metal cooling has better heat dissipation performance.

[0032] Reference Figure 1 and Figure 3 One end of the heat pipe 20 is in contact with the heat dissipation base 11, and the other end is in contact with the stamped fin 30. Specifically, the stamped fin 30 includes two heat dissipation plates 31 and a plurality of heat dissipation fins 32. The heat dissipation plates 31 are arranged horizontally, and the two heat dissipation plates 31 are arranged up and down. The plurality of heat dissipation fins 32 are located between the two heat dissipation plates 31. The two ends of the heat dissipation fins 32 are respectively fixed to the two heat dissipation plates 31, and the plurality of heat dissipation fins 32 are arranged at intervals along the length direction of the heat dissipation plates 31. The end of the heat pipe 20 away from the heat dissipation base 11 is in contact with the heat dissipation plate 31 below.

[0033] While the heat conducting block 12 drives the liquid metal to melt, the heat conducting block 12 also raises the temperature of the entire heat dissipation base 11, thereby transferring the high temperature to the heat conducting pipe 20, and then to the stamped fins 30, so that one of the heat sinks 31 is heated, and the heat on the heat sink 31 is distributed and transferred to a number of heat sinks 32, and the heat sinks 32 increase the surface area of ​​the heat sink 31, that is, increase the contact area between the heat sink 31 and the surrounding air, thereby facilitating air circulation, accelerating heat transfer, and achieving a better heat dissipation effect. The above works together through the melting and absorption of liquid metal, and the heat dissipation of the heat conducting pipe 20 and the stamped fins 30 to simultaneously dissipate the heat of the CPU chip, so that the heat can be taken away in time, thereby improving the heat dissipation efficiency.

[0034] Reference Figure 1 and Figure 2 The heat pipe 20 plays a role in transferring heat. A spiral blade 21 is sleeved on the heat pipe 20. When the heat pipe 20 transfers heat, the spiral blade 21 increases the surface area of ​​the heat pipe 20 to increase the contact area between the heat pipe 20 and the air, thereby facilitating air circulation and accelerating heat transfer, so that the heat pipe 20 also has a higher heat dissipation effect.

[0035] Reference Figure 3 and Figure 4 In order to improve the heat dissipation effect of the stamped fin 30, a mounting shell 40 is fixed on the side wall of the stamped fin 30, and a fan 50 is installed on the mounting shell 40. The fan 50 is arranged horizontally. When the heat conductive block 12 is heated and the heat conductive pipe 20 transfers the heat to the stamped fin 30, the fan 50 is started. When the fan 50 rotates, the gas is sucked into the center of the fan 50, and then the wind is discharged from the peripheral side of the fan 50, so that the gas passes through the stamped fin 30, so that the air cooling drives the heat on the stamped fin 30 to achieve the heat dissipation of the stamped fin 30.

[0036] Reference Figure 1 and Figure 4 In order to further improve the heat dissipation efficiency of the stamped fin 30, a cavity 33 is provided in the entire stamped fin 30, a water inlet hole 34 is provided on the upper heat sink 31, and a water outlet hole 35 is provided on the lower heat sink 31, and both the water inlet hole 34 and the water outlet hole 35 are connected to the cavity 33. A water storage box 60 is fixed on the mounting shell 40, and the water storage box 60 is located directly below the fan 50 and is connected to the water outlet hole 35. A guide plate 36 is provided in the lower heat sink 31, and the side wall of the guide plate 36 is fixed on the inner wall of the cavity 33, and one end of the guide plate 36 close to the water outlet hole 35 is tilted downward.

[0037] Reference Figure 1 and Figure 4The mounting shell 40 is provided with a cooling assembly 70, which is connected to the water storage box 60 and the water inlet 34. The cooling assembly 70 is used to pump water in the water storage box 60 into the cavity 33. In this way, the cooling water can circulate in the cavity 33, taking away more heat and improving the heat dissipation effect. The guide plate 36 can promote the flow of cooling water, avoid stagnation of water flow, and improve cooling efficiency.

[0038] Specifically, after the heat pipe 20 transfers heat to the stamped fin 30, the cooling component 70 is started to pump water in the water storage box 60 into the water inlet 34, thereby spraying the cavity 33. When the water splashes on the inner wall of the cavity 33, the water splashes into tiny water droplets, which evaporate rapidly in the cavity 33 and absorb the surrounding heat during the evaporation process, thereby reducing the temperature of the stamped fin 30 and improving the heat dissipation efficiency.

[0039] The water in the cavity 33 eventually reaches the bottom of the cavity 33 and flows out from the water outlet 35 into the water storage box 60, realizing water recovery and achieving the effect of recycling. After the water absorbs heat in the cavity 33, its temperature will rise, that is, the water temperature recovered into the water storage box 60 is relatively high. At this time, the fan 50 is in the start state, and the gas is sucked from one side of the fan 50. The water storage box 60 is located on the exhaust surface of the fan 50, so that it can withstand the wind and realize the cooling of the water in the water storage box 60, so that it is convenient for the subsequent cooling component 70 to extract the low-temperature water in the water storage box 60 into the cavity 33 to cool the stamping fins 30.

[0040] Reference Figure 2 and Figure 4 Specifically, the cooling component 70 includes a water bag 71, a water outlet pipe 72 and a water inlet pipe 73. The water bag 71 is installed on the mounting shell 40. One end of the water outlet pipe 72 is connected to the water bag 71, and the other end is connected to the water inlet hole 34. One end of the water inlet pipe 73 is connected to the water bag 71, and the other end is connected to the water storage box 60. The water inlet pipe 73 and the water outlet pipe 72 are both provided with a one-way valve at one end close to the water bag 71. The one-way valve can adopt an obliquely arranged baffle so that the baffle can only be opened in one direction to achieve the effect of one-way flow. This is the prior art and will not be described here. A spring 711 is also provided in the water bag 71. The end of the spring 711 is fixed to the inner wall of the water bag 71, and the spring 711 can support the water bag 71. A driving component 80 for driving the water bag 71 to shrink is provided on the mounting shell 40, and the driving component 80 is connected to the fan 50.

[0041] When the fan 50 is started, the driving assembly 80 is driven to move to the water bag 71, and the water bag 71 is contracted, and the spring 711 is compressed, so that the water in the water bag 71 is squeezed into the cavity 33, and the inner wall of the cavity 33 is sprayed. The one-way valve in the water inlet pipe 73 restricts the water in the water bag 71 from flowing back into the water inlet pipe 73, so that when the water bag 71 is squeezed, the water in the water bag 71 can only enter the water outlet pipe 72. When the driving assembly 80 is separated from the water bag 71, the spring 711 recovers its deformation, causing the water bag 71 to gradually expand, thereby sucking the water in the water storage box 60 into the water bag 71 through the water inlet pipe 73. During this process, the one-way valve in the water outlet pipe 72 limits the airflow from the stamping fin 30 to the water bag 71, preventing the space in the water bag 71 from being occupied by gas, so that the water bag 71 is only connected to the water inlet pipe 73 and is filled with water, so that the water can be sprayed into the cavity 33 next time.

[0042] Reference Figure 1 and Figure 4 The driving assembly 80 includes an abutment block 81, one end of which is fixed to the output shaft of the fan 50, and the other end of which can move to the water storage bag 71 and squeeze the water storage bag 71. An arc plate 712 is fixed to the water storage bag 71, and the abutment block 81 can abut against the arc plate 712. When the fan 50 is running, the abutment block 81 is driven to periodically squeeze the water storage bag 71, pushing the cooling water to circulate in the cavity 33, further improving the heat dissipation effect.

[0043] The implementation principle of a heat pipe radiator with metal phase change heat absorption and heat conduction in an embodiment of the present application is as follows: by introducing the phase change mechanism of a low melting point alloy in the heat dissipation component 10, when the chip generates a large amount of heat, the liquid metal will quickly absorb the heat and undergo a phase change, becoming a gas or a liquid with a higher temperature, thereby quickly conducting the heat to the heat dissipation base 11 and the heat conductive block 12. The heat pipe 20 transfers the heat to the stamped fins 30, and the stamped fins 30 dissipate the heat by contact with the air. At the same time, cooling water circulates in the cavity 33, taking away more heat and further improving the heat dissipation effect. This design responds quickly and dissipates heat effectively in a short time, improving the heat dissipation efficiency and stability.

[0044] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A heat pipe radiator with metal phase change heat absorption and heat conduction, characterized in that: The invention comprises a heat dissipation component (10), a heat conducting pipe (20) and a stamped fin (30); the heat dissipation component (10) comprises a heat dissipation base (11), a heat conducting block (12) and a sealing plate (13); a receiving cavity (111) filled with liquid metal is provided on the heat dissipation base (11); the heat conducting block (12) is fixed on the inner wall of the receiving cavity (111), and the heat conducting block (12) is located in the middle of the receiving cavity (111); the sealing plate (13) is arranged on the heat dissipation base (11) and is used for sealing the receiving cavity (111); one end of the heat conducting pipe (20) is in contact with the heat dissipation base (11), and the other end is in contact with the stamped fin (30).

2. The heat pipe radiator with metal phase change heat absorption and heat conduction according to claim 1, characterized in that: A mounting shell (40) is provided on the side wall of the stamped fin (30), a fan (50) is provided on the mounting shell (40), and the fan (50) is parallel to the stamped fin (30).

3. The heat pipe radiator with metal phase change heat absorption and heat conduction according to claim 2, characterized in that: The stamped fin (30) comprises two heat sinks (31) and a plurality of heat sinks (32); the two heat sinks (31) are arranged opposite to each other; the heat sinks (31) are arranged in a direction perpendicular to the central axis of the fan (50); one end of the heat pipe (20) is abutted against one of the heat sinks (31); a plurality of heat sinks (32) are located between the two heat sinks (31); two ends of the heat sink (32) are respectively fixed to the two heat sinks (31); and a plurality of heat sinks (32) are arranged at intervals along the length direction of the heat sink (31).

4. The heat pipe radiator with metal phase change heat absorption and heat conduction according to claim 3, characterized in that: A cavity (33) is provided in the stamped fin (30), a water inlet hole (34) is provided on one of the heat sinks (31), and a water outlet hole (35) is provided on the other heat sink (31), and both the water inlet hole (34) and the water outlet hole (35) are connected to the cavity (33); a water storage box (60) is provided on the mounting shell (40), and the water storage box (60) is connected to the water outlet hole (35); a cooling component (70) is provided on the mounting shell (40), and the cooling component (70) is connected to the water storage box (60) and the water inlet hole (34), and the cooling component (70) is used to pump water in the water storage box (60) into the cavity (33).

5. The heat pipe radiator with metal phase change heat absorption and heat conduction according to claim 4, characterized in that: The water storage box (60) is located directly below the fan (50).

6. The heat pipe radiator with metal phase change heat absorption and heat conduction according to claim 4, characterized in that: A guide plate (36) is provided in the cavity (33), and one end of the guide plate (36) close to the water outlet hole (35) is arranged to be inclined downward.

7. The heat pipe radiator with metal phase change heat absorption and heat conduction according to claim 4, characterized in that: The cooling component (70) comprises a water storage bag (71), a water outlet pipe (72) and a water inlet pipe (73); the water storage bag (71) is arranged on the mounting shell (40); one end of the water outlet pipe (72) is in communication with the water storage bag (71), and the other end is in communication with the water inlet hole (34); one end of the water inlet pipe (73) is in communication with the water storage bag (71), and the other end is in communication with the water storage box (60); one end of the water inlet pipe (73) and the water outlet pipe (72) close to the water storage bag (71) are both provided with a one-way valve; a spring (711) is arranged inside the water storage bag (71), and the spring (711) is used to expand the water storage bag (71); and a driving component (80) for driving the water storage bag (71) to contract is arranged on the mounting shell (40).

8. The heat pipe radiator with metal phase change heat absorption and heat conduction according to claim 7, characterized in that: The driving assembly (80) comprises an abutment block (81), one end of which is fixed on the output end of the fan (50), and the other end of which is capable of moving to the water storage bag (71) and squeezing the water storage bag (71).

9. The heat pipe radiator with metal phase change heat absorption and heat conduction according to claim 8, characterized in that: An arc plate (712) is fixed on the water storage bag (71), and the abutment block (81) can abut against the arc plate (712).

10. The heat pipe radiator with metal phase change heat absorption and heat conduction according to claim 1, characterized in that: The heat conducting pipe (20) is sleeved with spiral leaves (21).

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