Method, system, device and equipment for controlling semiconductor manufacturing equipment

Abstract

The present invention discloses a method, system, device, and apparatus for controlling semiconductor manufacturing equipment. The method includes: upon determining that a semiconductor product has been unloaded at a material processing location of the semiconductor manufacturing equipment, controlling a visual inspection device to perform a semiconductor product debris detection at the material processing location; obtaining inspection result information corresponding to the material processing location sent by the visual inspection device, wherein the inspection result information includes debris residue anomaly information sent by the visual inspection device upon detecting a background color identical to that of the semiconductor product at the material processing location; and upon determining that the inspection result information includes debris residue anomaly information, stopping operation and performing an alarm process. In this way, automated detection of semiconductor product debris residue can be achieved, reducing equipment maintenance and labor costs, and increasing equipment production capacity.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a method, system, device and equipment for controlling semiconductor manufacturing equipment. Background Art

[0002] With the advancement of science and technology, semiconductor products are gaining increasing attention, and the level of automation in semiconductor manufacturing equipment is also increasing. This includes cleaning equipment, double-side polishing (DSP) equipment, etching equipment, deposition equipment, and more. Many semiconductor manufacturing equipment require manufacturing auxiliary equipment, such as robotic arms, which place semiconductor products in the corresponding material processing positions before performing the corresponding processing and then unload the semiconductor products from the material processing positions after the corresponding processing is completed. For example, a robotic arm can pick up a wafer and place it in the corresponding material processing position of the DSP, and can also pick up a wafer and unload it from the corresponding material processing position of the DSP.

[0003] At present, after unloading semiconductor products from the material processing position of semiconductor manufacturing equipment, the semiconductor manufacturing equipment needs to perform subsequent corresponding operations regardless of whether the semiconductor products unloaded from the material processing position are complete. However, when the semiconductor manufacturing equipment processes the semiconductor products, the semiconductor products may be broken, or the semiconductor itself may be broken. In this way, after the semiconductor products are unloaded from the material processing position, there may be residual semiconductor product fragments at the material processing position of the semiconductor manufacturing equipment, that is, during the unloading and unloading process of the semiconductor products, there are semiconductor product fragments remaining at the material processing position; and once there are residual semiconductor product fragments, if the semiconductor manufacturing equipment still performs subsequent operations, it may cause damage to the setting devices of the semiconductor manufacturing equipment, while also increasing the maintenance cost and labor cost of the equipment, affecting the equipment production capacity. Summary of the Invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a method, system, device and equipment for controlling semiconductor manufacturing equipment. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0005] A first aspect of an embodiment of the present invention provides a method for controlling semiconductor manufacturing equipment, comprising:

[0006] When it is determined that semiconductor products have been unloaded at a material processing location of the semiconductor manufacturing equipment, controlling the visual inspection equipment to perform a semiconductor product debris residue inspection at the material processing location;

[0007] Obtaining inspection result information corresponding to the material processing location sent by the visual inspection device, wherein the inspection result information includes debris residue abnormality information sent by the visual inspection device when the visual inspection device detects a background color identical to that of the semiconductor product at the material processing location;

[0008] When it is determined that the inspection result information includes abnormal information of debris residue, the operation is stopped and an alarm is processed.

[0009] A second aspect of an embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, comprising: semiconductor equipment, control equipment, and visual inspection equipment, wherein:

[0010] The control device is configured to, upon determining that a semiconductor product has been unloaded from a material processing location of the semiconductor manufacturing equipment, control the visual inspection device to perform a fragmentation detection of the semiconductor product at the material processing location; obtain inspection result information corresponding to the material processing location sent by the visual inspection device; and, upon determining that the inspection result information includes abnormal fragmentation, stop operation and perform an alarm process;

[0011] The visual inspection equipment is configured to perform debris residue detection on the material processing position, and send inspection result information including debris residue abnormality information when detecting that the material processing position has the same background color as the semiconductor product.

[0012] A third aspect of an embodiment of the present invention provides an apparatus for controlling semiconductor manufacturing equipment, comprising:

[0013] The first control module is configured to

[0014] When it is determined that semiconductor products have been unloaded at a material processing location of the semiconductor manufacturing equipment, controlling the visual inspection equipment to perform a semiconductor product debris residue inspection at the material processing location;

[0015] a detection acquisition module configured to acquire inspection result information corresponding to a material processing location sent by a visual inspection device, wherein the inspection result information includes debris residue anomaly information sent by the visual inspection device when a background color identical to that of the semiconductor product is detected at the material processing location;

[0016] The second control module is configured to stop running and perform alarm processing when it is determined that the inspection result information includes abnormal debris residue information.

[0017] A fourth aspect of an embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, which includes a processor and a memory storing program instructions. The processor is configured to execute the above-mentioned method for controlling semiconductor manufacturing equipment when executing the program instructions.

[0018] A fourth aspect of an embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, comprising: an equipment body; and the above-mentioned device for controlling semiconductor manufacturing equipment, which is installed on the equipment body.

[0019] Beneficial effects of the present invention:

[0020] During the semiconductor manufacturing process, after the semiconductor products have been unloaded from the material processing position of the semiconductor manufacturing equipment, the visual inspection equipment can be controlled to detect the residual semiconductor product fragments at the material processing position, and if it is determined that there are residual semiconductor product fragments at the material processing position, a shutdown alarm is performed. In this way, the automated detection of residual semiconductor product fragments can be achieved, reducing the chance of damage to the set components of the semiconductor manufacturing equipment due to continuous processing. At the same time, it also reduces the maintenance cost and labor cost of the equipment and improves the production capacity of the equipment.

[0021] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purposes and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0022] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 A schematic diagram of a system structure for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention;

[0025] Figure 2 A schematic flow chart of a method for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention;

[0026] Figure 3 A schematic diagram of the structure of DSP blanking provided by an embodiment of the present invention;

[0027] Figure 4 A schematic flow chart of a method for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention;

[0028] Figure 5 A schematic structural diagram of a semiconductor manufacturing control device provided by an embodiment of the present invention;

[0029] Figure 6A schematic structural diagram of a semiconductor manufacturing control device provided by an embodiment of the present invention;

[0030] Figure 7 A schematic diagram of a control device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0031] The present invention will be further described in detail below with reference to specific examples, but the embodiments of the present invention are not limited thereto.

[0032] With the development of science and technology, the degree of automation of semiconductor product manufacturing equipment, such as cleaning equipment, double-side polishing equipment (DSP), etching equipment, deposition equipment, etc., is becoming increasingly higher. Among them, cleaning equipment, DSP, etching equipment, etc. need to take out semiconductor products from the corresponding material processing position in the semiconductor manufacturing equipment, that is, unloading. Generally, manufacturing auxiliary equipment, such as robotic arms, can be used for automated unloading. In an embodiment of the present invention, during the semiconductor manufacturing process, after the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment, the visual inspection equipment can be controlled to detect the residual fragments of the semiconductor product at the material processing position, and if it is determined that there are residual fragments of the semiconductor product at the material processing position, a shutdown alarm process is performed. In this way, the probability of damage to the set components of the semiconductor manufacturing equipment due to continuous processing is reduced. At the same time, the maintenance cost and labor cost of the equipment are reduced, and the production capacity of the equipment is also improved.

[0033] like Figure 1 As shown, an embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, including: semiconductor manufacturing equipment 100, a control device 200, and a visual inspection device 300.

[0034] Semiconductor manufacturing equipment 100 may be a DSP, etching equipment, deposition equipment, etc. Control device 200 may be an Equipment Front End Module (EFEM) at the front end of the DSP, or other device with control capabilities, such as a desktop computer or handheld tablet computer. Visual inspection equipment 300 may include one, two, or more cameras, enabling acquisition of image information corresponding to the inspected area and performing corresponding image analysis to obtain inspection results.

[0035] The semiconductor manufacturing equipment 100 and the control equipment 200 can be connected by wire or wirelessly to perform data communication. In addition, the semiconductor manufacturing equipment 100 and the visual inspection equipment 300 can also be connected by wire or wirelessly to perform data communication.

[0036] Therefore, in an embodiment of the present invention, the control device 200 is configured to control the visual inspection device 300 to perform debris residue detection of the semiconductor product at the material processing position when determining that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment 100; obtain the inspection result information corresponding to the material processing position sent by the visual inspection device 300; stop running and perform alarm processing when determining that the inspection result information includes abnormal debris residue information; the visual inspection device 300 is configured to perform debris residue detection on the material processing position, and send inspection result information including abnormal debris residue information when detecting that the material processing position has the same background color as the semiconductor product.

[0037] Since the semiconductor manufacturing equipment 100 can process semiconductor products, for example, the DSP can perform double-sided grinding and polishing on wafers, it is necessary to load semiconductor products onto the semiconductor manufacturing equipment 100 or unload semiconductor products from the semiconductor manufacturing equipment 100. In some embodiments, Figure 1 As shown, the system for controlling semiconductor manufacturing equipment may also include: manufacturing support equipment 400, configured to absorb semiconductor products from the corresponding material processing position of the semiconductor manufacturing equipment and place them in the unloading buffer. Specifically, manufacturing support equipment 400 can be used to place semiconductor products into the corresponding material processing position of the semiconductor manufacturing equipment, or to remove processed products from the material processing position of the semiconductor manufacturing equipment for unloading or unloading. Manufacturing support equipment 400 may include: a robotic arm or a robot, etc. Of course, other equipment used to assist in semiconductor production may also be used. The control device 200 may also establish a wired or wireless connection with the manufacturing support equipment 400 to facilitate data communication.

[0038] In a system for controlling semiconductor manufacturing equipment, the control device 200 can control two or more of the semiconductor manufacturing equipment 100, the visual inspection equipment 300 and the manufacturing support equipment 400 to automatically detect residual debris of semiconductor products in the semiconductor manufacturing equipment.

[0039] Combine Figure 1 The embodiment of the present invention provides a method for controlling semiconductor manufacturing equipment, such as Figure 2 As shown, the process of semiconductor manufacturing equipment control includes:

[0040] Step 201: When it is determined that a semiconductor product has been unloaded from a material processing position of a semiconductor manufacturing device, control a visual inspection device to perform a semiconductor product debris residue inspection at the material processing position.

[0041] There may be many types of semiconductor manufacturing equipment, such as cleaning equipment, grinding and polishing equipment, etching equipment, deposition equipment, etc. These equipment have corresponding processing areas that can be used to place semiconductor products and then perform corresponding processing.

[0042] Among them, some semiconductor manufacturing equipment may have only one processing area, and there is only one material processing position in the processing area, or some semiconductor manufacturing equipment may have only one processing area, but there are one, two or more material processing positions in the processing area, or some semiconductor manufacturing equipment may have one, two or more processing areas, and each processing area has one, two or more material processing positions.

[0043] For example: semiconductor manufacturing equipment is DSP, such as Figure 3 As shown, the DSP has five processing areas: Carrier 1, Carrier 2, Carrier 3, Carrier 4, and Carrier 5. These five processing areas form a processing table, or lower grinding plate. The angle between two adjacent processing areas is 72°. Each processing area has three material processing positions: Hole 1, Hole 2, and Hole 3. Each material processing position can accommodate a wafer. The wafers in each material processing position are defined as Wafer 1, Wafer 2, and Wafer 3, respectively. Thus, the DSP has 15 material processing positions.

[0044] The semiconductor product can be manually taken out from the material processing position, that is, manual unloading, or, in some embodiments, automatic unloading can be performed through manufacturing auxiliary equipment. In this way, determining that the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment includes: controlling the manufacturing auxiliary equipment to adsorb the semiconductor product from the material processing position corresponding to the semiconductor manufacturing equipment and place it in the unloading buffer zone; upon receiving the unloading completion signal sent by the manufacturing auxiliary equipment, determining that the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment.

[0045] During the unloading process of the semiconductor manufacturing equipment, the control device can send unloading instructions to the manufacturing auxiliary equipment, so that the manufacturing auxiliary equipment can absorb the semiconductor products from the corresponding material processing position of the semiconductor manufacturing equipment according to the received unloading instructions and place them in the unloading buffer zone.

[0046] Since semiconductor manufacturing equipment may have two or more material processing positions, in some embodiments, controlling the manufacturing auxiliary equipment to absorb the semiconductor product from the material processing position corresponding to the semiconductor manufacturing equipment and place it in the unloading buffer includes: when it is determined that the manufacturing auxiliary equipment corresponds to the first processing area of ​​the semiconductor manufacturing equipment, sending a first unloading instruction to the manufacturing auxiliary equipment, so that the manufacturing auxiliary equipment absorbs one or more semiconductor products from the first processing area of ​​the semiconductor manufacturing equipment and places them in the unloading buffer, wherein the first processing area has one or more material processing positions; when receiving the first area unloading completion signal sent by the manufacturing auxiliary equipment, controlling the semiconductor manufacturing equipment to rotate the processing area so that the second processing area corresponds to the manufacturing auxiliary equipment.

[0047] The control device can control the manufacturing auxiliary equipment and the semiconductor manufacturing equipment so that the manufacturing auxiliary equipment corresponds to the first processing area of ​​the semiconductor manufacturing equipment. Then, the control device sends a first unloading instruction to the auxiliary equipment, so that the manufacturing auxiliary equipment adsorbs the semiconductor product from the material processing position of the first processing area and places it in the unloading buffer area. If the first processing area has two or more material processing positions, then the manufacturing auxiliary equipment can also simultaneously adsorb two or more semiconductor products from the corresponding material processing positions in the first processing area and place them in the unloading buffer area, that is, the manufacturing auxiliary equipment can unload materials to one processing area at one time. Of course, the present invention may not be limited to this. The manufacturing auxiliary equipment can also unload materials to one processing area twice or more times.

[0048] After the manufacturing support equipment completes unloading material from the first processing area, it sends a signal to the control device that unloading is complete for the first area. This allows the control device to control the semiconductor manufacturing equipment so that the second processing area of ​​the semiconductor manufacturing equipment corresponds to the manufacturing support equipment. The control device then continues to control the manufacturing support equipment to perform corresponding unloading operations, allowing the manufacturing support equipment to unload material from the second processing area once, twice, or multiple times. According to the above process, the semiconductor manufacturing equipment unloads the corresponding semiconductor product from each material processing position in each processing area. Alternatively, depending on the application scenario, the corresponding semiconductor product is unloaded from some material processing positions in some processing areas of the semiconductor manufacturing equipment.

[0049] like Figure 3As shown, DSP has five processing areas, namely Carrier1, Carrier2, Carrier3, Carrier4 and Carrier5. Each processing area has three material processing positions, namely Hole1, Hole2 and Hole3. Manufacturing support equipment may include robot 1, which corresponds to each processing area. Robot 1 has three suction cups, namely Sucker 1, Sucker 2, and Sucker 3, which pick up wafer 1, wafer 2, and wafer 3, respectively. In this way, after starting operation, Carrier 1 in the DSP corresponds to Robot 1, so that the DSP EFEM can send a first unloading instruction to Robot 1, and Robot 1 can then pick up wafers 1, wafer 2, and wafer 3 from Hole 1, Hole 2, and Hole 3 of Carrier 1 and place them in the unloading buffer UnLoad buffer. After placement is completed, Robot 1 sends a first area unloading completion signal to the DSP EFEM, so that the DSP EFEM controls the DSP to rotate the processing area, rotating the lower grinding plate 72° clockwise. In this way, Carrier 2 corresponds to Robot 1, and Robot 2 can unload Carrier 2. This cycle continues until a total of 15 wafers in 5 carriers are placed in the UnLoad buffer. The UnLoad buffer has 15 slots for wafers, which can place 15 wafers in sequence.

[0050] Depending on the scenario, after a semiconductor product has been unloaded from the material processing location of the semiconductor manufacturing equipment, the manufacturing auxiliary equipment can send a material unloading completion signal to the control device. Alternatively, after manual unloading is completed, the material unloading completion signal can be sent to the control device via a human-machine interface or terminal. Upon receiving the material unloading completion signal, the control device can determine that the semiconductor product has been unloaded from the material processing location of the semiconductor manufacturing equipment. At this point, the control device can control the visual inspection equipment to detect residual semiconductor product debris at the material processing location.

[0051] The visual inspection equipment is equipped with a camera that can collect image information within the action area and perform image analysis on the collected image information to obtain corresponding inspection results.

[0052] Some manufacturing auxiliary equipment has only one processing area, and the processing area has only one or two material processing positions. In this way, the visual inspection equipment can be equipped with only one camera, and the effective area of ​​the camera can cover each material processing position. That is, the control device can control the camera on the visual inspection equipment to collect image information of each material processing position of the unloaded semiconductor product, and perform image analysis based on the collected image information to obtain corresponding inspection results.

[0053] Some manufacturing auxiliary equipment has only one processing area, but the processing area has only two or more material processing positions, or some manufacturing auxiliary equipment has one or more processing areas, and each processing area has one or more material processing positions. In this case, the effective area of ​​​​a camera of the visual inspection equipment cannot cover every material processing position. Therefore, the visual inspection equipment may be configured with two or more cameras, and these two or more cameras can be used to detect semiconductor product debris residues at the material processing positions. In some embodiments, controlling the visual inspection equipment to detect semiconductor product debris residues at the material processing positions includes: when there are two or more material processing positions in the current processing area, controlling the first camera in the visual inspection equipment to capture first image information of one or more material processing positions in the current processing area; when it is determined that the first camera has completed shooting, controlling the semiconductor manufacturing equipment to rotate the processing area so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection equipment, and controlling the second camera in the visual inspection equipment to capture second image information of other material processing positions.

[0054] The DSP has five processing areas, each with three material processing locations. The DSPEFEM sends an inspection command to the visual inspection equipment, triggering the first camera in the visual inspection system. This camera then captures two holes in the current processing area (i.e., the current carrier), generating a first image. Once the first camera's image is complete, the DSPEFEM controls the DSP to rotate the lower grinding disk 72° clockwise, triggering the second camera in the visual inspection system. This camera then captures another hole in the current carrier, generating a second image. This allows the visual inspection system to detect residual semiconductor product debris in a group of material processing locations.

[0055] Step 202: Obtain inspection result information corresponding to the material processing position sent by the visual inspection equipment, wherein the debris residue abnormality information included in the inspection result information is sent by the visual inspection equipment when the same background color as the semiconductor product is detected at the material processing position.

[0056] Generally, the color of the material processing position of semiconductor manufacturing equipment is inconsistent with the color of the semiconductor product. Thus, after the semiconductor product in the material processing position is unloaded, the camera of the visual inspection equipment can only see the color of the material processing position after image acquisition, and cannot see the color of the semiconductor product, i.e., the background color. If the acquired image information includes the background color of the semiconductor product, then it can be indicated that there are residual semiconductor product fragments at the material processing position, and the residual semiconductor product fragments can be detected through color analysis.

[0057] As in the above example, the chassis PAD color of the material processing position of the DSP, that is, the material processing position is white, and the semiconductor product, that is, the wafer, is black, that is, the background color is black. If black wafers are unloaded on all 15 holes of the DSP, then when the visual inspection equipment performs debris residue detection, if there is black information in the image information obtained by the camera, it means that there are residual wafer fragments at the material processing position corresponding to the black information, that is, the visual inspection equipment can send an inspection result including abnormal information about residual debris to the control device. If there is no black information in the image information obtained by the camera, then the inspection result sent by the visual inspection equipment to the control device does not include abnormal information about residual debris.

[0058] In some embodiments, the visual inspection device sends inspection result information corresponding to each material processing position, including: when the same background color as the semiconductor product is detected in the image information detected by the debris residue, the visual inspection device determines the current material processing position corresponding to the background color; through the current communication address corresponding to the current material processing position, the visual inspection device sends the debris residue abnormality information.

[0059] The control device can communicate with the visual inspection device, and in some embodiments, in an image information taken by each camera in the visual inspection device, different material processing positions correspond to different communication addresses. Therefore, after the visual inspection device determines the current material processing position corresponding to the residual semiconductor product background color in the image information, the visual inspection device can send debris residue abnormality information through the current communication address corresponding to the current material processing position.

[0060] For example: if the current image information detected by the DSP contains black information, the current hole corresponding to the black information is determined, and the corresponding inspection result is determined to be "1". If the current image information detected does not contain black information, the inspection result corresponding to each hole in the image information is "0". The three holes in the carrier of any processing area of ​​the DSP have a separate communication address, which are defined as communication address 1, communication address 2 and communication address 3 respectively, for the DSP EFEM to receive the inspection results sent by the visual inspection equipment. Among them, if residual debris of wafer 1 is detected on Hole 1, the visual inspection equipment sends "1" to the DSP EFEM through its communication address 1; if residual debris of wafer 1 is not detected on Hole 1, the visual inspection equipment sends "0" to the DSP EFEM through its communication address 1; the inspection of wafers 2 and 3 is the same, so I will not repeat them one by one.

[0061] Step 203: When it is determined that the inspection result information includes abnormal information of residual debris, the operation is stopped and an alarm is processed.

[0062] The inspection result information obtained by the control device includes abnormal information on residual debris, which can determine that there are residual fragments of semiconductor products at the material processing location. At this time, the control device is shut down, and the semiconductor manufacturing equipment can also be controlled to shut down, and corresponding alarm processing can be performed. The semiconductor product fragment residual alarm can be prompted by one or more of the following methods: the indicator light turns red, the buzzer sounds, and the touch screen text prompts.

[0063] As mentioned above, if the DSP EFEM receives inspection result information including "1", it can be determined that there are residual wafer fragments on the DSP's carrier, and the DSP can no longer process other wafers. At this time, the DSP EFEM can send a stop operation command to the DSP, and can issue a fragment residual alarm through a buzzer sound and a touch screen text prompt.

[0064] It can be seen that in the embodiment of the present invention, during the semiconductor manufacturing process, after the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment, the visual inspection equipment can be controlled to perform a semiconductor product debris residue detection on the material processing position, and when it is determined that there are semiconductor product debris residues at the material processing position, a shutdown alarm process is performed. In this way, the automated detection of semiconductor product debris residues can be achieved, reducing the probability of damage to the setting components of the semiconductor manufacturing equipment due to continuous processing. At the same time, the maintenance cost and labor cost of the equipment are reduced, and the production capacity of the equipment is also improved.

[0065] The following examples illustrate a specific process for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention.

[0066] like Figure 3 As shown, the semiconductor manufacturing equipment control device can be a DSP. The grinding wheel below it has five processing areas: Carrier 1, Carrier 2, Carrier 3, Carrier 4, and Carrier 5. The angle between each adjacent processing area is 72°. Each processing area has three material processing positions: Hole 1, Hole 2, and Hole 3. The manufacturing support equipment includes Robot 1. Corresponding to each processing area, Robot 1 has three suction cups: Sucker 1, Sucker 2, and Sucker 3, which respectively pick up Wafer 1, Wafer 2, and Wafer 3. The control device can be a DSP EFEM. The visual inspection equipment has two cameras.

[0067] like Figure 4 As shown, the process of controlling semiconductor manufacturing equipment may include:

[0068] Step 401: DSP EFEM, DSP, and robot 1 are started and run respectively.

[0069] Step 402: The DSP EFEM determines a carrier at a position corresponding to the robot 1 in the DSP as the current carrier.

[0070] Step 403: DSP EFEM sends the current unloading instruction to robot 1, so that robot 1 absorbs three wafers from Hole 1, Hole 2 and Hole 3 of the current carrier and puts them into the unloading buffer Loadbuffer.

[0071] Step 404: DSP EFEM determines whether it has received the unloading completion signal sent by robot 1. If so, it executes step 405; otherwise, it returns to step 404.

[0072] Step 405: The DSP EFEM controls the DSP to rotate the lower grinding disc 72° clockwise.

[0073] Step 406: The DSP EFEM determines whether all carriers have been unloaded. If so, the process proceeds to step 407; otherwise, the process returns to step 402.

[0074] Step 407: The DSP EFEM controls the robot 1 to leave the set area, and controls the visual inspection equipment to start and move to the corresponding area.

[0075] Step 408: The DSP EFEM determines a carrier at a position in the DSP corresponding to the first camera in the visual inspection device as the current carrier.

[0076] Step 409: The DSP EFEM controls the first camera in the visual inspection device to capture first image information, wherein the first image information includes two holes on the current carrier.

[0077] Step 410: The DSP EFEM receives the inspection result information returned by the visual inspection equipment through the communication address corresponding to each hole.

[0078] Among them, if black is detected on the first image information, the visual inspection device determines the current hole corresponding to black, and then sends "1" to the DSP EFEM through the current communication address corresponding to the current hole. If black is not detected on the first image information, the visual inspection device sends "0" to the DSP EFEM through the communication addresses corresponding to the two holes respectively. The inspection result information includes: "00", "01", "10", or "11".

[0079] Step 411: Determine whether the inspection result information includes "1". If so, execute step 412; otherwise, execute step 413.

[0080] Step 412: The DSP EFEM controls the DSP to stop running, and issues a wafer fragment residue alarm by turning on the indicator light in red, the buzzer sounding, and the touch screen providing a text prompt.

[0081] Step 413: The DSP EFEM controls the DSP to rotate the lower grinding plate 72° clockwise, and controls the second camera to capture second image information, wherein the second image information includes image information of another hole on the current carrier.

[0082] Step 414: The DSP EFEM receives the inspection result information returned by the visual inspection equipment through the communication address corresponding to each Hole.

[0083] Among them, if black is detected on the second image information, the visual inspection device will send "1" to the DSP EFEM through the current communication address corresponding to the hole. If black is not detected on the second image information, the visual inspection device will send "0" to the DSP EFEM through the communication address corresponding to the hole. The inspection result information includes: "0" or "1".

[0084] Step 415: The DSP EFEM determines whether the inspection result information includes "1". If so, execute step 412; otherwise, execute step 416.

[0085] Step 416: The DSP EFEM determines whether all carriers have been inspected for residual debris. If so, the process ends. Otherwise, the process returns to step 408.

[0086] It can be seen that in this embodiment, during the wafer manufacturing process, after the wafer is unloaded from the hole of the DSP, the visual inspection equipment can be controlled to perform wafer fragment residue detection, and when it is determined that there are residual wafer fragments in the hole, the DSP is controlled to shut down and alarm processing is performed. In this way, automatic detection of residual wafer fragments can be achieved, reducing the chance of damage to the lower grinding disk in the DSP due to continuous processing. At the same time, it also reduces the maintenance cost and labor cost of the equipment and improves the production capacity of the equipment.

[0087] According to the above-mentioned semiconductor manufacturing control process, a device for controlling semiconductor manufacturing equipment can be constructed. Figure 5 The present invention provides a device for controlling semiconductor manufacturing equipment, which can be applied to a control device for a semiconductor manufacturing equipment control system, such as Figure 5 As shown, the device 500 includes: a first control module 510 , a detection and acquisition module 520 and a second control module 530 .

[0088] The first control module 510 is configured to control the visual inspection device to perform debris residue detection on the material processing position when it is determined that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment.

[0089] The detection acquisition module 520 is configured to obtain the inspection result information corresponding to the material processing position sent by the visual inspection equipment, wherein the debris residue abnormality information included in the inspection result information is sent by the visual inspection equipment when the same background color as the semiconductor product is detected at the material processing position.

[0090] The second control module 530 is configured to stop running and perform alarm processing when it is determined that the inspection result information includes abnormal debris residue information.

[0091] In some embodiments, the apparatus further comprises:

[0092] The unloading control module is configured to control the manufacturing auxiliary equipment to absorb the semiconductor products from the material processing position corresponding to the semiconductor manufacturing equipment and place them in the unloading buffer zone.

[0093] The state determination module is configured to determine that the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment when receiving the unloading completion signal sent by the manufacturing auxiliary equipment.

[0094] In some embodiments, the unloading control module is specifically configured to send a first unloading instruction to the manufacturing auxiliary equipment when it is determined that the manufacturing auxiliary equipment corresponds to the first processing area of ​​the semiconductor manufacturing equipment, so that the manufacturing auxiliary equipment absorbs one or more semiconductor products from the first processing area of ​​the semiconductor manufacturing equipment and places them in the unloading buffer area, wherein the first processing area has one or more material processing positions; and when receiving the first area unloading completion signal sent by the manufacturing auxiliary equipment, control the semiconductor manufacturing equipment to rotate the processing area so that the second processing area corresponds to the manufacturing auxiliary equipment.

[0095] In some embodiments, the first control module 520 includes:

[0096] A first control unit is configured to control a first camera in the visual inspection device to capture first image information of one or more material processing positions in the current processing area when there are two or more material processing positions in the current processing area;

[0097] The second control unit is configured to control the semiconductor manufacturing equipment to rotate the processing area when it is determined that the first camera has completed shooting, so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection equipment, and control the second camera in the visual inspection equipment to capture second image information of other material processing positions.

[0098] It can be seen that in the embodiment of the present invention, during the semiconductor manufacturing process, after the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment, the device for controlling the semiconductor manufacturing equipment can control the visual inspection equipment to perform residual semiconductor product fragments detection at the material processing position, and perform shutdown alarm processing when it is determined that there are residual semiconductor product fragments. In this way, automatic detection of residual semiconductor product fragments can be achieved, reducing the probability of damage to the setting components of the semiconductor manufacturing equipment due to continuous processing. At the same time, it also reduces the maintenance cost and labor cost of the equipment and improves the production capacity of the equipment.

[0099] Combine Figure 6 , an embodiment of the present invention provides an apparatus 600 for controlling semiconductor manufacturing equipment, comprising:

[0100] Processor 1000 and memory 1001 may also include a communication interface 1002 and a bus 1003. Processor 1000, communication interface 1002, and memory 1001 may communicate with each other via bus 1003. Communication interface 1002 may be used for information transmission. Processor 1000 may invoke logic instructions in memory 1001 to execute the method for controlling semiconductor manufacturing equipment according to the above-described embodiment.

[0101] In addition, the logic instructions in the memory 1001 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product.

[0102] Memory 1001, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions / modules corresponding to the methods in the embodiments of the present invention. Processor 1000 executes the program instructions / modules stored in memory 1001 to perform functional applications and data processing, thereby implementing the method for controlling semiconductor manufacturing equipment in the above-described method embodiments.

[0103] The memory 1001 may include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function; the data storage area may store data generated based on the use of the terminal device. Furthermore, the memory 1001 may include high-speed random access memory and non-volatile memory.

[0104] An embodiment of the present invention provides an apparatus for controlling semiconductor manufacturing equipment, comprising: a processor and a memory storing program instructions, wherein the processor is configured to execute a method for controlling semiconductor manufacturing equipment when executing the program instructions.

[0105] An embodiment of the present invention provides a storage medium storing program instructions, which, when run, execute the above-mentioned method for controlling semiconductor manufacturing equipment.

[0106] The embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, comprising: semiconductor manufacturing equipment, control equipment and visual inspection equipment, Figure 7 , the control device includes: a device body 700; and the above-mentioned device 500 (600) for controlling semiconductor manufacturing equipment. The device 500 (600) for controlling semiconductor manufacturing equipment is installed on the device body. The installation relationship described here is not limited to placement inside the product, but also includes installation connections with other components of the product, including but not limited to physical connections, electrical connections or signal transmission connections. It can be understood by those skilled in the art that the device 500 (600) for controlling semiconductor manufacturing equipment can be adapted to a feasible device body, thereby realizing other feasible embodiments.

[0107] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0108] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0109] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0110] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A method for controlling semiconductor manufacturing equipment, characterized in that: include: When it is determined that semiconductor products have been unloaded at a material processing location of the semiconductor manufacturing equipment, controlling the visual inspection equipment to perform a semiconductor product debris residue inspection at the material processing location; Obtaining inspection result information corresponding to the material processing location sent by the visual inspection device, wherein the inspection result information includes debris residue abnormality information sent by the visual inspection device when the visual inspection device detects a background color identical to that of the semiconductor product at the material processing location; If it is determined that the inspection result information includes abnormal information about residual debris, the operation is stopped and an alarm is processed; The controlling of the visual inspection equipment to detect semiconductor product debris residue at the material processing position includes: When there are two or more material processing positions in the current processing area, controlling the first camera in the visual inspection device to capture first image information of the one or more material processing positions in the current processing area; When it is determined that the first camera has completed shooting, the semiconductor manufacturing equipment is controlled to rotate the processing area so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection equipment, and the second camera in the visual inspection equipment is controlled to capture second image information of other material processing positions.

2. The method according to claim 1, wherein Determining that semiconductor products have been unloaded from a material processing location of semiconductor manufacturing equipment includes: Control the manufacturing auxiliary equipment to absorb the semiconductor products from the material processing position corresponding to the semiconductor manufacturing equipment and place them in the unloading buffer zone; When receiving the unloading completion signal sent by the manufacturing auxiliary equipment, it is determined that the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment.

3. The method according to claim 2, wherein The controlling of the manufacturing auxiliary equipment to absorb the semiconductor product from the material processing position corresponding to the semiconductor manufacturing equipment and place it into the unloading buffer zone includes: When it is determined that the manufacturing support equipment corresponds to the first processing area of ​​the semiconductor manufacturing equipment, a first unloading instruction is sent to the manufacturing support equipment, so that the manufacturing support equipment absorbs one or more semiconductor products from the first processing area of ​​the semiconductor manufacturing equipment and places them into an unloading buffer area, wherein the first processing area has one or more material processing positions; When receiving the first area unloading completion signal sent by the manufacturing auxiliary equipment, the semiconductor manufacturing equipment is controlled to rotate the processing area so that the second processing area corresponds to the manufacturing auxiliary equipment.

4. The method according to claim 1, wherein The visual inspection device sends inspection result information corresponding to the material processing position, including: In the case where a background color identical to that of the semiconductor product is detected in the image information of the debris residue detection, the visual inspection device determines the current material processing position corresponding to the background color; The visual inspection device sends debris residue abnormality information through the current communication address corresponding to the current material processing position.

5. A system for controlling semiconductor manufacturing equipment, characterized in that: include: Semiconductor equipment, control equipment, visual inspection equipment, among which, The control device is configured to, upon determining that a semiconductor product has been unloaded from a material processing location of the semiconductor manufacturing equipment, control the visual inspection device to perform a fragmentation detection of the semiconductor product at the material processing location; obtain inspection result information corresponding to the material processing location sent by the visual inspection device; and, upon determining that the inspection result information includes abnormal fragmentation, stop operation and perform an alarm process; A visual inspection device is configured to perform debris residue detection on a material processing location, and transmit inspection result information including debris residue abnormality information when detecting a background color identical to that of the semiconductor product on the material processing location; Among them, the control device is specifically configured to control the first camera in the visual inspection device to capture first image information of one or more material processing positions in the current processing area when there are two or more material processing positions in the current processing area; when it is determined that the first camera has completed shooting, control the semiconductor manufacturing equipment to rotate the processing area so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection device, and control the second camera in the visual inspection device to capture second image information of other material processing positions.

6. The system according to claim 5, wherein: Also includes: The manufacturing auxiliary equipment is configured to absorb semiconductor products from the material processing position corresponding to the semiconductor manufacturing equipment and place them in the unloading buffer zone.

7. A device for controlling semiconductor manufacturing equipment, characterized in that: include: The first control module is configured to control the visual inspection device to perform a semiconductor product debris residue detection at the material processing position when it is determined that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment; a detection acquisition module configured to acquire inspection result information corresponding to a material processing location sent by a visual inspection device, wherein the inspection result information includes debris residue anomaly information sent by the visual inspection device when a background color identical to that of the semiconductor product is detected at the material processing location; The second control module is configured to stop operation and perform alarm processing when determining that the inspection result information includes abnormal debris residue information; The first control module includes: A first control unit is configured to control a first camera in the visual inspection device to capture first image information of one or more material processing positions in the current processing area when there are two or more material processing positions in the current processing area; The second control unit is configured to control the semiconductor manufacturing equipment to rotate the processing area when it is determined that the first camera has completed shooting, so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection equipment, and control the second camera in the visual inspection equipment to capture second image information of other material processing positions.

8. A device for controlling semiconductor manufacturing equipment, comprising a processor and a memory storing program instructions, characterized in that: The processor is configured to perform the method for controlling semiconductor manufacturing equipment according to any one of claims 1 to 4 when executing the program instructions.

9. A device for controlling semiconductor manufacturing equipment, wherein: Equipment includes: Equipment body; The device for controlling semiconductor manufacturing equipment according to claim 7 or 8 is installed in the equipment body.

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