High-speed module three-temperature error code testing device

Abstract

The invention relates to a high-speed module three-temperature error code testing device which comprises a testing box, at least one testing mechanism arranged in the testing box, and a gas supply mechanism connected with the testing mechanism and used for supplying high-temperature or low-temperature gas, each testing mechanism comprises a testing plate, a mounting seat, a temperature supply assembly and a drying assembly, a testing cavity is formed in the mounting seat, and the temperature supply assembly is arranged in the testing cavity. One end of the mounting seat is provided with a socket for the high-speed module to be inserted and extend into the test cavity to be electrically connected with the test plate, the temperature supply assembly comprises a first air inlet and a first air outlet which are formed in the mounting seat and are communicated with the test cavity, and the drying assembly comprises a gas conveying piece which is fixed at one end of the mounting seat and is provided with a gas conveying channel; the gas conveying channel is provided with a second gas inlet connected with a dry gas source and a second gas outlet used for blowing out dry gas at the inserting opening. The high-speed module is prevented from being scratched or abraded, the heating and cooling efficiency is ensured, the test cost is reduced, the test efficiency is improved, and condensation and frosting in a low-temperature test are effectively avoided.

Description

Technical Field

[0001] The invention relates to a three-temperature bit error test device for a high-speed module, which is applicable to the technical field of electronic device testing. Background Art

[0002] The three-temperature error code test device is a device used to perform error code tests on high-speed optical modules (i.e., high-speed modules), and is widely used in the communication, semiconductor, aerospace and other industries. In the current three-temperature error code test equipment, most of them use semiconductor cooling sheets as a technical means to provide the test temperature for the module under test. When the module under test is plugged into the error code test board, the heat sink of the cooling sheet is attached to the module under test to provide the test temperature required by the module under test. However, there are many problems with this test method: first, in order to ensure efficient heat conduction, the cooling sheet needs to be in good contact with the module under test, which leads to a certain friction between the module under test and the cooling sheet during the process of plugging and unplugging the module under test, which makes it easy for the module under test or the cooling sheet to be scratched or worn; further, most of the existing test equipment will paste thermal conductive glue on the cooling sheet or the module under test to avoid scratches caused by plugging and unplugging the module, but in actual use, the thermal conductive glue will affect the efficiency of heat transfer, resulting in a longer time for heating and cooling, which greatly affects the test efficiency and test cost. Secondly, in order to ensure the effectiveness of the semiconductor refrigeration plate, a water cooling device is usually required to be fixed on it for heat dissipation. However, the pipes and other parts of the water cooling structure that transport the heat dissipation medium are in a high or low temperature environment for a long time, and are prone to aging and damage, which will lead to medium leakage, which will not only affect the normal use of the test device, but also cause problems such as short circuit and damage to the module under test. In addition, since low temperature can cause condensation or frost in the air, a sealing structure such as a cover is set around the semiconductor refrigeration plate and the module under test in the existing test device to prevent condensation or frost at low temperatures from affecting the test process. However, such sealing means will increase the equipment cost on the one hand; on the other hand, repeated plugging and unplugging of the module under test or long-term use of the test device will cause the sealing structure to be reduced or even destroyed, and it is impossible to effectively avoid condensation or frost during low-temperature testing. Summary of the invention

[0003] In order to solve the defects of the above-mentioned prior art, the present invention proposes a three-temperature bit error test device for a high-speed module.

[0004] The technical solution adopted by the present invention is a high-speed module three-temperature bit error test device, including a test box, at least one test mechanism arranged in the test box, and a gas supply mechanism connected to the test mechanism and used to supply high-temperature or low-temperature gas. Specifically, the gas supply mechanism includes a compressor, a condenser, a plate heat exchanger, an electric heater, a gas pipeline connected to an external gas source, etc. When performing a low-temperature test, cold energy is generated by the compressor and the condenser, and the cold energy is transferred to the gas in the gas pipeline through the plate heat exchanger to form a low-temperature gas, and then the low-temperature gas is provided to the test mechanism by the gas pipeline; when performing a high-temperature test, the gas in the gas pipeline is heated by the electric heater to form a high-temperature gas, and is transported to the test mechanism, thereby realizing the supply of high-temperature or low-temperature gas.

[0005] Each testing facility includes: Test board, used to perform bit error testing on high-speed modules; A mounting seat is fixed on the test board, the interior of the mounting seat has a test cavity, and one end of the mounting seat is provided with a socket for the high-speed module to be inserted and extended into the test cavity to be electrically connected with the test board; A temperature supply component is used to create a temperature test environment in the test cavity. The temperature supply component includes a first air inlet and a first air outlet which are opened on the mounting seat and communicated with the test cavity. The first air inlet and the first air outlet are respectively close to two ends of the test cavity. The first air inlet is also communicated with the air supply mechanism. The drying component is used to isolate the moist air at the socket (the moist air is the external air containing water vapor except the high-temperature or low-temperature gas supplied by the air supply mechanism and the dry gas supplied by the dry gas source). The drying component includes a gas conveying member fixedly connected to one end of the mounting seat and having a gas transmission channel. The gas transmission channel has a second air inlet for connecting to the dry gas source and a second air outlet for blowing out the dry gas at the socket.

[0006] A mounting base is provided so as to fix the high-speed module when the high-speed module is electrically connected to the test board. The test cavity opened in the mounting base not only provides a space for plugging in the high-speed module, but also creates a cavity for three-temperature testing around the high-speed module. High-temperature or low-temperature gas is then generated by an air supply mechanism, and guided by a heating component to be blown into the test cavity. The air supply mechanism, the heating component and the test cavity cooperate with each other, and gas is used as a medium for transferring temperature to the high-speed module to replace the semiconductor refrigeration sheet in the existing equipment. There is no need to make physical contact with the high-speed module, which not only avoids scratches or wear caused by plugging and unplugging the high-speed module, but also ensures the efficiency of heating and cooling. There is no need to provide a heat dissipation structure such as water cooling, which avoids the problem of device damage or module short circuit caused by water leakage, thereby reducing the test cost and improving the test efficiency. In addition, by setting a drying component to blow dry gas at the socket of the test cavity, dry gas is used to form a barrier to prevent water vapor in the external air from entering the test cavity to form a seal. This not only ensures the sealing effect and reduces the setting cost, but also avoids damage to the sealing structure caused by frequent plugging and unplugging of high-speed modules or long-term use of the test device, thereby increasing the service life and effectively avoiding the frosting problem of low-temperature testing.

[0007] Furthermore, the heating component further includes an air duct having one end connected to the first air inlet and the other end connected to the air supply mechanism, and the air duct is inclined from one end to the other end in a direction away from the first air outlet. The angle at which the airflow is blown into the test cavity is guided by the inclined air duct, so that the turbulence generated by the airflow being blocked by the inner wall of the test cavity after the airflow is blown into the test cavity is reduced, and the gas flow rate is increased, so that the airflow can blow through the test cavity smoothly and quickly, thereby increasing the rate of heating and cooling in the test cavity.

[0008] Furthermore, the air guide tube has a first tube section connected to the air supply mechanism and a second tube section connected to the first air inlet, the diameter of the second tube section gradually expands in the direction from the other end of the air guide tube to the one end thereof, and the maximum diameter of the second tube section is less than or equal to the diameter of the first air inlet. The gas flow can be diffused when flowing through the second tube section by the expanded second tube section, thereby increasing the coverage of the air flow, so that each position in the test chamber can be heated and cooled evenly and quickly, thereby ensuring that the temperature inside the test chamber is uniform and consistent.

[0009] Furthermore, the diameter of the first pipe section on one side close to one end of the air guide tube is larger than the diameter of the other side, and at the connection between the first pipe section and the second pipe section, the diameter of the first pipe section is larger than or equal to the diameter of the second pipe section. By changing the diameter of the first pipe section, the space for gas flow is gradually compressed, thereby further increasing the gas flow rate.

[0010] Furthermore, the gas conveying member cover is arranged in front of the socket and has a first plug-in slot corresponding to the socket in the middle thereof, and a plurality of second gas outlets are arranged, and the plurality of second gas outlets are all arranged in front of the gas conveying member and distributed around the first plug-in slot. By providing the first plug-in slot on the gas conveying member, it is convenient to arrange the plurality of second gas outlets around the socket of the test cavity, so as to form a dry gas barrier around the socket, thereby ensuring the isolation effect of external humid air.

[0011] Furthermore, the gas transmission channel further includes a dry gas cavity arranged around the first plug-in slot, and the second gas inlet and the second gas outlet are both connected to the dry gas cavity. The dry gas input from the second gas inlet will first fill the dry gas cavity, and then be transported from the dry gas cavity to the second gas outlet, so as to ensure that the gas flow of the plurality of second gas outlets is relatively uniform, and further improve the sealing performance of the barrier formed by the dry gas.

[0012] Furthermore, each second air outlet is arranged to be inclined from front to back and from inside to outside, so that the second air outlet can blow dry gas toward the high-speed module to avoid leakage, thereby further improving the sealing of the dry gas barrier.

[0013] Furthermore, the front of the gas delivery member is attached to the inner wall of the test box, and a second plug-in slot corresponding to the first plug-in slot is provided on the surface of the test box, the size of the second plug-in slot is larger than the first plug-in slot, and a plurality of second gas outlets are distributed between the edge of the second plug-in slot and the edge of the first plug-in slot. The second plug-in slot is provided to facilitate the test personnel to plug in and out the high-speed module, and the test can be done immediately without other operation steps, which simplifies the operation difficulty and improves the test efficiency.

[0014] Furthermore, the rear of the gas conveying component is in contact with the end surface of the fixing seat, and a sealing component surrounding the first plug-in slot is provided between the rear of the gas conveying component and the end surface of the fixing seat to prevent humid air from entering the test cavity through the gap between the gas conveying component and the mounting seat, thereby preventing frost or condensation problems.

[0015] Furthermore, the test box has a test area at the front and a control area at the rear, the test mechanism is located in the test area, the air supply mechanism is located in the control area, and a baffle is provided between the test area and the control area. By dividing the inside of the test box into the test area and the control area, the pipelines inside the test box are avoided from being cluttered, the cleanliness is improved, and the oil, dust and other dirt in the control area are avoided from contaminating the test area, ensuring the cleanliness of the test area.

[0016] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The high-speed module three-temperature bit error test device of the present invention adopts gas as a temperature carrier to replace the semiconductor refrigeration plate in the prior art, which not only avoids scratches or wear caused by plugging and unplugging the high-speed module, but also ensures the efficiency of heating and cooling; and there is no need to set up a heat dissipation structure such as water cooling, so as to avoid device damage or module short circuit caused by water leakage, thereby reducing the test cost and improving the test efficiency; at the same time, by setting up a drying component and using dry gas as a sealing barrier, not only the sealing effect is guaranteed and the setting cost is reduced, but also the damage to the sealing structure caused by frequent plugging and unplugging of the high-speed module or long-term use of the test device is avoided, the service life is improved, and the problems of condensation and frosting during low-temperature testing are effectively avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings: Figure 1 It is a structural schematic diagram of an embodiment of the present invention; Figure 2 yes Figure 1 A schematic diagram of the internal structure of the illustrated embodiment; Figure 3 yes Figure 1 A schematic diagram of the structure of the test mechanism in the illustrated embodiment; Figure 4 yes Figure 1 A schematic diagram of the state in which the test mechanism is loaded with a high-speed module in the illustrated embodiment; Figure 5 yes Figure 1 A schematic diagram of the structure of the mounting base in the illustrated embodiment; Figure 6 yes Figure 1 A perspective structural diagram of the air guide tube in the illustrated embodiment; Figure 7 yes Figure 1 A perspective structural diagram of a drying assembly in the illustrated embodiment; The reference numerals are described as follows: 1. Test box; 11. Second plug-in slot; 12. Test area; 13. Control area; 14. Baffle; 2. Test mechanism; 21. Test board; 22. Mounting seat; 23. Test cavity; 231. Socket; 24. Heating component; 241. First air inlet; 242. First air outlet; 25. Drying component; 251. Gas conveying member; 252. Second air inlet; 253. Second air outlet; 254. First plug-in slot; 255. Drying gas cavity; 26. Air duct; 261. First pipe section; 262. Second pipe section; 3. Air supply mechanism. DETAILED DESCRIPTION

[0018] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that the directional terms "front", "rear", "inside" and "outside" are defined according to the use direction of the test device. Specifically, when the test device is in normal use, the direction of the test cavity socket is "front", and vice versa; in each test mechanism, after the high-speed module is inserted into the test cavity, the side close to the high-speed module is "inside", and vice versa is "outside". The terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] Reference Figure 1-7 The present embodiment provides a high-speed module three-temperature bit error test device, including a test box 1, at least one test mechanism 2 arranged in the test box 1, and a gas supply mechanism 3 connected to the test mechanism 2 and used for supplying high-temperature or low-temperature gas. Specifically, the gas supply mechanism 3 includes a compressor, a condenser, a plate heat exchanger, an electric heater, a gas pipeline connected to an external gas source, etc. (not marked in the above structural drawings). When performing a low-temperature test, cold energy is generated by the compressor and the condenser, and the cold energy is transferred to the gas in the gas pipeline through the plate heat exchanger to form a low-temperature gas, and then the low-temperature gas is provided to the test mechanism by the gas pipeline; when performing a high-temperature test, the gas in the gas pipeline is heated by the electric heater to form a high-temperature gas, and is transported to the test mechanism. When performing a normal temperature test, the normal temperature gas can be directly introduced through the delivery pipeline and transported to the test mechanism, thereby realizing a high temperature, low temperature or normal temperature three-temperature test.

[0021] Each test facility2 consists of: A test board 21, used for performing a bit error test on the high-speed module; The mounting base 22 is fixed on the test board 21. The mounting base 22 has a test cavity 23 inside. One end of the mounting base 22 is provided with a socket 231 for the high-speed module to be inserted into the test cavity 23 and electrically connected to the test board 21. The temperature supply component 24 is used to create a temperature test environment in the test chamber 23. The temperature supply component 24 includes a first air inlet 241 and a first air outlet 242 which are opened on the mounting seat 22 and communicated with the test chamber 23. The first air inlet 241 and the first air outlet 242 are respectively close to the two ends of the test chamber 23, and the first air inlet 241 is also communicated with the air supply mechanism 3. Furthermore, a slot for installing a temperature sensor is also provided on the side of the test chamber 23 to monitor the temperature in the test chamber 23, so as to facilitate the adjustment of the temperature of the gas supplied by the air supply mechanism 3. The drying component 25 is used to isolate the moist air at the socket 231 (the moist air is the external air containing water vapor except the high-temperature or low-temperature gas supplied by the air supply mechanism and the dry gas supplied by the dry gas source). The drying component 25 includes a gas conveying member 251 fixedly connected to one end of the mounting seat 22 and having a gas transmission channel. The gas transmission channel has a second air inlet 252 for connecting to the dry gas source and a second air outlet 253 for blowing out the dry gas at the socket 231.

[0022] A mounting base 22 is provided to fix the high-speed module when the high-speed module is electrically connected to the test board 21. The test cavity 23 opened in the mounting base 22 not only provides a space for the high-speed module to be plugged in, but also creates a cavity for three-temperature testing around the high-speed module. High-temperature or low-temperature gas is then generated by the air supply mechanism 3, and is guided by the heating component 24 to be blown into the test cavity 23. The air supply mechanism 3, the heating component 24 and the test cavity 23 cooperate with each other, and gas is used as a medium for transferring temperature to the high-speed module to replace the semiconductor refrigeration plate in the existing equipment. There is no need to make physical contact with the high-speed module, which not only avoids scratches or wear caused by plugging and unplugging the high-speed module, but also ensures the efficiency of heating and cooling. There is no need to set up a heat dissipation structure such as water cooling to avoid device damage or module short circuit caused by water leakage, thereby reducing the test cost and improving the test efficiency. In addition, by setting a drying component to blow dry gas at the socket of the test cavity, dry gas is used to form a barrier to prevent water vapor in the external air from entering the test cavity to form a seal. This not only ensures the sealing effect and reduces the setting cost, but also avoids damage to the sealing structure caused by frequent plugging and unplugging of high-speed modules or long-term use of the test device, thereby increasing the service life and effectively avoiding the frosting problem of low-temperature testing.

[0023] In a more preferred embodiment, the temperature supply component 24 further includes an air guide tube 26 connected to the first air inlet 241 at one end and connected to the air supply mechanism at the other end, and the air guide tube 26 is inclined from one end to the other end in a direction away from the first air outlet 242. The angle of the airflow blowing into the test cavity 23 is guided by the inclined air guide tube 26, so as to reduce the turbulence generated by the airflow being blocked by the inner wall of the test cavity 23 after the airflow is blown into the test cavity 23, increase the gas flow rate, and allow the airflow to blow through the test cavity 23 smoothly and quickly, thereby increasing the rate of heating and cooling in the test cavity 23.

[0024] In a more preferred embodiment, the air guide tube 26 has a first tube section 261 connected to the air supply mechanism and a second tube section 262 connected to the first air inlet 241. The diameter of the second tube section 262 gradually expands in the direction from the other end of the air guide tube 26 to the one end thereof, and the maximum diameter of the second tube section 262 is less than or equal to the diameter of the first air inlet 241. The expanded second tube section 262 allows the gas stream to spread when passing through the second tube section 262, thereby increasing the coverage of the gas flow, so that each position in the test chamber 23 can be heated and cooled evenly and quickly, thereby ensuring that the temperature inside the test chamber 23 is uniform and consistent.

[0025] In a more preferred embodiment, the diameter of the first pipe section 261 on one side close to one end of the air guide tube 26 is larger than the diameter of the other side, and at the connection between the first pipe section 261 and the second pipe section 262, the diameter of the first pipe section 261 is larger than or equal to the diameter of the second pipe section 262. By changing the diameter of the first pipe section 261, the space for gas flow is gradually compressed, thereby further increasing the gas flow rate.

[0026] In a more preferred embodiment, the gas delivery member 251 is covered in front of the socket 231 and has a first plug-in slot 254 corresponding to the socket 231 in the middle thereof, and a plurality of second gas outlets 253 are provided, and the plurality of second gas outlets 253 are all provided in front of the gas delivery member 251 and distributed around the first plug-in slot 254. By providing the first plug-in slot 254 on the gas delivery member 251, it is convenient to arrange the plurality of second gas outlets 253 around the socket 231 of the test chamber 23, so as to form a dry gas barrier around the socket 231, thereby ensuring the isolation effect of external humid air.

[0027] In a more preferred embodiment, the gas delivery channel further includes a drying gas cavity 255 disposed around the first plug-in slot 254, and the second gas inlet 252 and the second gas outlet 253 are both connected to the drying gas cavity 255. The drying gas input from the second gas inlet 252 will first fill the drying gas cavity 255, and then be transported from the drying gas cavity 255 to the second gas outlet 252, so as to ensure that the gas flow rates of the plurality of second gas outlets 252 are relatively uniform, and further improve the sealing performance of the barrier formed by the drying gas.

[0028] In a more preferred embodiment, each second gas outlet 253 is tilted from front to back and from inside to outside, so that the second gas outlet 253 can blow dry gas toward the high-speed module to avoid leakage and further improve the sealing of the dry gas barrier.

[0029] In a more preferred embodiment, the front of the gas delivery member 251 is attached to the inner wall of the test box 1, and a second plug-in slot 11 corresponding to the first plug-in slot 254 is provided on the surface of the test box 1. The size of the second plug-in slot 11 is larger than that of the first plug-in slot 254, and a plurality of second gas outlets 253 are distributed between the edge of the second plug-in slot 11 and the edge of the first plug-in slot 254. The second plug-in slot 11 is provided to facilitate the test personnel to plug in and out the high-speed module, and the test can be plugged in and out without other operation steps, which simplifies the operation difficulty and improves the test efficiency.

[0030] In a more preferred embodiment, the rear portion of the gas delivery member 251 is in contact with the end surface of the mounting seat 22, and a seal (not shown in the drawings) surrounding the first plug-in slot 254 is provided between the rear portion of the gas delivery member 251 and the end surface of the mounting seat 22 to prevent humid air from entering the test cavity 23 through the gap between the gas delivery member 251 and the mounting seat 22, thereby preventing frost or condensation problems.

[0031] In a more preferred embodiment, the test box 1 has a test area 12 located in the front and a control area 13 located in the rear, the test mechanism 2 is located in the test area 12, the air supply mechanism 3 is located in the control area 13, and a baffle 14 is provided between the test area 12 and the control area 13. By dividing the interior of the test box 1 into the test area 12 and the control area 13, the internal pipelines of the test box 1 are avoided from being cluttered, the cleanliness is improved, and the oil dust and other dirt in the control area 13 are avoided from contaminating the test area 12, thereby ensuring that the test area 12 is clean.

[0032] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The high-speed module three-temperature bit error test device of the present invention adopts gas as a temperature carrier to replace the semiconductor refrigeration plate in the prior art, which not only avoids scratches or wear caused by plugging and unplugging the high-speed module, but also ensures the efficiency of heating and cooling; and there is no need to set up a heat dissipation structure such as water cooling, so as to avoid device damage or module short circuit caused by water leakage, thereby reducing the test cost and improving the test efficiency; at the same time, by setting up a drying component and using dry gas as a sealing barrier, not only the sealing effect is guaranteed and the setting cost is reduced, but also the damage to the sealing structure caused by frequent plugging and unplugging of the high-speed module or long-term use of the test device is avoided, the service life is improved, and the problems of condensation and frosting during low-temperature testing are effectively avoided.

[0033] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the contents of the present invention and implement them accordingly. They cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-speed module three-temperature bit error test device, characterized in that: The invention comprises a test box (1), at least one test mechanism (2) arranged in the test box (1), and a gas supply mechanism (3) connected to the test mechanism (2) and used for supplying high-temperature or low-temperature gas, wherein each of the test mechanisms (2) comprises: A test board (21), used for performing a bit error test on the high-speed module; A mounting seat (22) is fixed on the test board (21), the mounting seat (22) has a test cavity (23) inside, and one end of the mounting seat (22) is provided with a socket (231) for a high-speed module to be plugged in and extend into the test cavity (23) to be electrically connected to the test board (21); A temperature supply component (24) for creating a temperature test environment in the test cavity (23), the temperature supply component (24) comprising a first air inlet (241) and a first air outlet (242) which are opened on the mounting seat (22) and communicate with the test cavity (23), the first air inlet (241) and the first air outlet (242) being respectively close to two ends of the test cavity (23), and the first air inlet (241) is also communicated with the air supply mechanism (3); A drying component (25) is used to isolate the moist air at the socket (231), the drying component (25) comprising a gas conveying member (251) fixedly connected to one end of the mounting seat (22) and having a gas delivery channel, the gas delivery channel having a second gas inlet (252) for connecting to a dry gas source and a second gas outlet (253) for blowing out dry gas at the socket (231).

2. The high-speed module three-temperature bit error test device according to claim 1, characterized in that: The heating component (24) further comprises an air guide pipe (26) having one end connected to the first air inlet (241) and the other end connected to the air supply mechanism, wherein the air guide pipe (26) is inclined from one end to the other end in a direction away from the first air outlet (242).

3. The high-speed module three-temperature bit error test device according to claim 2, characterized in that: The air guide pipe (26) comprises a first pipe section (261) connected to the air supply mechanism and a second pipe section (262) connected to the first air inlet (241); the diameter of the second pipe section (262) gradually increases in a direction from the other end of the air guide pipe (26) to one end thereof, and the maximum diameter of the second pipe section (262) is less than or equal to the diameter of the first air inlet (241).

4. The high-speed module three-temperature bit error test device according to claim 3, characterized in that: The diameter of one side of the first pipe section (261) close to one end of the air guide tube (26) is larger than the diameter of the other side thereof, and at the connection between the first pipe section (261) and the second pipe section (262), the diameter of the first pipe section (261) is larger than or equal to the diameter of the second pipe section (262).

5. The high-speed module three-temperature bit error test device according to claim 1, characterized in that: The gas conveying member (251) is covered in front of the socket (231) and has a first plugging slot (254) corresponding to the socket (231) in the middle thereof; a plurality of second gas outlets (253) are provided, and the plurality of second gas outlets (253) are all opened in front of the gas conveying member (251) and distributed around the first plugging slot (254).

6. The high-speed module three-temperature bit error test device according to claim 5, characterized in that: The gas delivery channel further comprises a drying air cavity (255) arranged around the first plug-in slot (254), and the second air inlet (252) and the second air outlet (253) are both in communication with the drying air cavity (255).

7. The high-speed module three-temperature bit error test device according to claim 5, characterized in that: Each of the second air outlets (253) is arranged tilted from front to back and from inside to outside.

8. The high-speed module three-temperature bit error test device according to claim 5, characterized in that: The front portion of the gas conveying member (251) is in contact with the inner wall of the test box (1); a second plugging slot (11) corresponding to the first plugging slot (254) is provided on the surface of the test box (1); the second plugging slot (11) is larger than the first plugging slot (254); and a plurality of second gas outlets (253) are distributed between the edge of the second plugging slot (11) and the edge of the first plugging slot (254).

9. The high-speed module three-temperature bit error test device according to claim 5, characterized in that: The rear portion of the gas conveying member (251) is in contact with the end surface of the mounting seat (22), and a sealing member surrounding the first plug-in groove (254) is provided between the rear portion of the gas conveying member (251) and the end surface of the mounting seat (22).

10. The high-speed module three-temperature bit error test device according to claim 1, characterized in that: The test box (1) comprises a test area (12) located in the front and a control area (13) located in the rear, the test mechanism (2) is located in the test area (12), the air supply mechanism (3) is located in the control area (13), and a baffle (14) is provided between the test area (12) and the control area (13).

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