A Laser Drilling Positioning Control Method and Device for a Rigid-Flex Printed Circuit Board

Abstract

This embodiment provides a laser drilling positioning control method and device for a rigid-flex printed circuit board, including: obtaining an initial target position, controlling the device to fabricate a target image at the initial target position of the PCB substrate and then laminating the surface layer; controlling the device to remove the surface layer to expose the target image, and obtaining multiple target image positions through an image acquisition device; generating multiple auxiliary layer target circles according to the target image positions; determining the adjacent feature region as the tangent outer region of the multiple auxiliary layer target circles; determining the center reference coordinates of the adjacent feature region; determining the position of the positioning blind hole with the center reference coordinates as the positioning reference, and controlling the device to fabricate the blind hole; and controlling the device to fabricate the corresponding circuit with the center reference coordinates as the positioning reference, establishing a virtual point (center reference coordinates) according to the preset positioning points (target image positions), and calibrating the blind hole points or via holes of the actual drilling through the virtual point to improve the positioning accuracy.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a laser drilling positioning control method for a rigid-flexible board, a laser drilling positioning control device for a rigid-flexible board, a computer device and a storage medium. Background Art

[0002] As the technology of rigid-flex boards develops towards multi-layer and multi-tiered development, the production of HDI products is difficult and the yield rate is low, and the requirements for the precision of HDI blind holes are getting higher and higher; how to improve the precision of laser blind holes has become one of the important research topics for the breakthrough of rigid-flex boards. At present, laser positioning uses target hole positioning, and the machine precision and inter-layer alignment cumulative precision are poor, which can easily cause the laser blind hole to deviate. Summary of the invention

[0003] In view of the above problems, the present embodiment is proposed to provide a laser drilling positioning control device for a rigid-flexible board, a computer device and a storage medium that overcome the above problems or at least partially solve the above problems.

[0004] In order to solve the above problems, this embodiment discloses a laser drilling positioning control method for a rigid-flexible board, wherein the rigid-flexible board includes a PCB substrate; including:

[0005] After obtaining the initial target position, the control device produces a target image at the initial target position of the PCB substrate and then presses the surface layer;

[0006] The control device clears the surface layer to expose the target image, and acquires a plurality of target image positions through the image acquisition device;

[0007] Generating a plurality of auxiliary layer target circles according to the target image position;

[0008] The tangent outer areas of the target circles of the multiple auxiliary layers are determined as adjacent feature areas;

[0009] Determine the reference coordinates of the center of the adjacent feature area;

[0010] The position of the blind hole is determined by taking the circle center reference coordinate as the positioning reference, and the device is controlled to make the blind hole; and the corresponding circuit is controlled by taking the circle center reference coordinate as the positioning reference.

[0011] Preferably, the method further comprises:

[0012] The position of the through hole is determined by taking the position of the positioning blind hole as a positioning reference, and the control device is used to manufacture the through hole.

[0013] Preferably, the position of the positioning blind hole is determined based on the center reference coordinate as the positioning reference, and the control device is used to fabricate the blind hole, including:

[0014] The position of the through hole is obtained by the image acquisition device, and the through hole offset is calculated according to the position of the through hole and the preset through hole position;

[0015] The position of the positioning blind hole is determined based on the center reference coordinate as the positioning reference, the position of the positioning blind hole is calibrated according to the through hole offset to obtain the calibrated blind hole position, and the control device fabricates the blind hole according to the calibrated blind hole position.

[0016] Preferably, generating a plurality of auxiliary layer target circles according to the target image position includes:

[0017] Calculating the target offset between the target image position and the preset target image position;

[0018] Calibrating the preset target image position according to the target offset to generate a calibrated target image position, and generating a plurality of auxiliary layer target circles with the calibrated target image position as the center.

[0019] Preferably, determining the adjacent feature region by the tangent outer region of a plurality of auxiliary layer target circles includes:

[0020] Converting the regions corresponding to the plurality of auxiliary layer target circles into a plurality of circular order features, and converting the region surrounded by the edge feature set of the circular order features into an adjacent feature region.

[0021] Preferably, determining the center reference coordinate of the adjacent feature region includes:

[0022] According to the center point of the vertical and horizontal coordinates of the adjacent feature region, the center point of the vertical and horizontal coordinates is determined as the center reference coordinate.

[0023] This embodiment discloses a laser drilling positioning control device for a rigid-flex printed circuit board, and the rigid-flex printed circuit board includes a PCB substrate; it includes:

[0024] A first acquisition module, configured to acquire an initial target position, and control the device to fabricate a target image at the initial target position of the PCB substrate and then laminate the surface layer;

[0025] A target image position module, configured to control the device to remove the surface layer to expose the target image, and acquire a plurality of target image positions through an image acquisition device;

[0026] A generation module, configured to generate a plurality of auxiliary layer target circles according to the target image position;

[0027] A determination module, configured to determine the adjacent feature region through the tangent outer regions of multiple auxiliary layer target circles;

[0028] A center reference coordinate module, configured to determine the center reference coordinates of the adjacent feature region;

[0029] A control module, configured to determine the position of the positioning blind hole with the center reference coordinates as the positioning reference, and control the device to fabricate the blind hole; and, control the device to fabricate the corresponding circuit with the center reference coordinates as the positioning reference.

[0030] Preferably, the device further includes:

[0031] A through-hole fabrication module, configured to determine the position of the through-hole with the position of the positioning blind hole as the positioning reference, and control the device to fabricate the through-hole.

[0032] This embodiment also discloses a computer device, including a memory and a processor, where the memory stores a computer program, and when the processor executes the computer program, the steps of the laser drilling positioning control of the above-mentioned rigid-flex printed circuit board are implemented.

[0033] This embodiment also discloses a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the laser drilling positioning control of the above-mentioned rigid-flex printed circuit board are implemented.

[0034] This embodiment has the following advantages:

[0035] In the embodiment of the present invention, the laser drilling positioning control method for the rigid-flex printed circuit board includes: obtaining the initial target position, controlling the device to fabricate a target image at the initial target position of the PCB substrate and then laminating the surface layer; controlling the device to remove the surface layer to expose the target image, and obtaining multiple target image positions through an image acquisition device; generating multiple auxiliary layer target circles according to the target image positions; determining the adjacent feature region through the tangent outer regions of the multiple auxiliary layer target circles; determining the center reference coordinates of the adjacent feature region; determining the position of the positioning blind hole with the center reference coordinates as the positioning reference, and controlling the device to fabricate the blind hole; and, controlling the device to fabricate the corresponding circuit with the center reference coordinates as the positioning reference, establishing a virtual point (center reference coordinates) according to the preset positioning points (target image positions), and calibrating the actual blind hole points or through-hole points of the drilling through the virtual point, thereby improving the positioning accuracy. Description of the Drawings

[0036] To more clearly illustrate the technical solutions in this embodiment, the following briefly introduces the drawings required for the description of the embodiment. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0037] Figure 1 is a flowchart of the steps of an embodiment of a method for controlling laser drilling positioning of a rigid-flex printed circuit board in this embodiment;

[0038] Figure 2 is a schematic diagram of an auxiliary layer target image in an embodiment of the present invention;

[0039] Figure 3 is a schematic diagram of the position of a target image in an embodiment of the present invention;

[0040] Figure 4 is a schematic diagram of the generation of an auxiliary layer target circle in this embodiment;

[0041] Figure 5 is a schematic diagram of the division of an adjacent feature area in this embodiment;

[0042] Figure 6 is a block diagram of the structure of an embodiment of a device for controlling laser drilling positioning of a rigid-flex printed circuit board in this embodiment;

[0043] Figure 7 is an internal structure diagram of a computer device in an embodiment. Detailed implementation manners

[0044] In order to make the technical problems, technical solutions and beneficial effects solved by this embodiment more clearly understood, the following further details this embodiment in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0045] In a core concept of an embodiment of the present invention, a virtual point (center reference coordinate) is generated based on a preset positioning point (target image position), and the blind hole point or through hole point of the actual drilling is calibrated through the virtual point, so as to improve the positioning accuracy. Specifically, according to four initial positioning targets, the positioning blind position is determined, and subsequent drilling operations are carried out based on the positioning blind position, reducing four errors to one error, improving the device positioning accuracy, and further improving the positioning accuracy through the reverse deduction of the order of the neighborhood feature method, that is, the n-order neighborhood.

[0046] The laser drilling positioning control method for the rigid-flex printed circuit board provided by this embodiment can be applied to an application environment including a terminal and a server. Among them, the terminal communicates with the server through a network. The terminal can be, but is not limited to, various personal computers, laptop computers, smart phones, tablet computers, and portable wearable devices. The server can be implemented by an independent server or a server cluster composed of multiple servers. The terminal is connected to a variety of semiconductor devices, and the embodiments of the present invention do not impose too many restrictions on this.

[0047] Referring to Figure 1 , a step flowchart of an embodiment of the laser drilling positioning control method for a rigid-flex printed circuit board in this embodiment is shown. The rigid-flex printed circuit board includes a PCB substrate; specifically, it can include the following steps:

[0048] Step 101, obtain the initial target position, and control the device to make a target image at the initial target position of the PCB substrate and then press the surface layer.

[0049] In the embodiments of the present invention, the rigid-flex printed circuit board includes a PCB substrate. The PCB substrate can include a COER board and press-fit surface layers on the upper and lower surfaces of the COER board. Specifically, the press-fit surface layer can include a copper single-layer. The embodiments of the present invention do not impose too many restrictions on the type of the press-fit surface layer.

[0050] In the embodiments of the present invention, first, the design data of the rigid-flex printed circuit board can be obtained. The design data refers to the direction of the metal lines, the length and width of the metal lines, the line pitch, the hole diameter, the hole type, the hole position, the minimum distance from the grinding hole to the line, the size and pitch of the pads, the minimum width and font size of the silk thread, etc. Of course, the design data can also include the design drawing of the rigid-flex printed circuit board, and the embodiments of the present invention do not impose too many restrictions on this.

[0051] In the embodiments of the present invention, the terminal can control the laser drilling device to perform an inner layer image operation on the PCB substrate through the initial target position in the design data, that is, to make an auxiliary layer target. The auxiliary layer target image is as Figure 2 shown. After completing the production of the auxiliary layer target image, control the pressing device to make a target image at the initial target position of the PCB substrate and then press the surface layer, that is, press the copper surface layer after making the target image according to the initial target position.

[0052] The PCB substrate can refer to a PCB substrate that has gone through multiple semiconductor front steps. For example, the PCB substrate can be one that has gone through steps such as cutting and baking. The embodiments of the present invention do not impose too many restrictions on this.

[0053] Step 102, control the device to remove the surface layer to expose the target image, and obtain multiple target image positions through the image acquisition device.

[0054] Further applied to the embodiments of the present invention, after the operation of pressing the copper surface layer is completed, the device can be controlled to clean the surface layer to expose the target image. Multiple target image positions are obtained through an image acquisition device. For example, the image of the PCB substrate can be obtained through a CCD, and multiple target image positions are recognized from the image of the PCB substrate, such as Figure 3 shown;

[0055] Step 103: Generate multiple auxiliary layer target circles according to the target image positions;

[0056] In the embodiments of the present invention, after multiple target image positions are obtained, calibration can be performed according to the target image positions to obtain the calibrated target image positions, and multiple tangent auxiliary layer target circles are generated with the calibrated target image positions as the centers;

[0057] Specifically implemented in the embodiments of the present invention, as Figure 4 shown, the generating multiple auxiliary layer target circles according to the target image positions includes: calculating the target offset between the target image position and the preset target image position; calibrating the preset target image position according to the target offset to generate a calibrated target image position, and generating multiple auxiliary layer target circles with the calibrated target image position as the center.

[0058] The target image position refers to the coordinate position of the target image obtained by using a CCD after being calibrated by the target offset; and the auxiliary layer target circle refers to multiple auxiliary layer circles generated with the calibrated coordinate position as the center.

[0059] Step 104: Determine the adjacent feature region through the tangent outer region of multiple auxiliary layer target circles;

[0060] In actual application to the embodiments of the present invention, after multiple auxiliary layer target circles are obtained, the images of the multiple auxiliary layer target circles are obtained, and the tangent outer region formed by the edges of the auxiliary layer target circles is recognized through image processing. Specifically, the determining the adjacent feature region through the tangent outer region of multiple auxiliary layer target circles includes: converting the regions corresponding to the multiple auxiliary layer target circles into multiple circular order features, and converting the region surrounded by the edge feature set of the circular order features into the adjacent feature region. The circular order features may include -1 order pixel features, -2 order pixel features, -3 order pixel features, etc., and the embodiments of the present invention do not limit this too much.

[0061] In a specific implementation manner, the region surrounded by the edge feature set located by reverse neighborhood feature and fitted by the least squares function is the adjacent feature region;

[0062] In an embodiment of the present invention, the loss function C of the least squares function is set as follows:

[0063] ;

[0064] wherein, Ui represents the opposite of the neighborhood feature order, yi and xi represent the horizontal and vertical coordinates of the image pixels in the area enclosed by the edge feature set, n represents the number of edge feature sets, and i = 1, 2, 3 ······ n;

[0065] Minimize the above loss function through gradient descent, continuously iterate and update until the function converges, and convert the area enclosed by the edge feature set into a neighboring feature area. refers to any least squares function, which is a fitting function that can be used for tasks such as edge detection. By fitting the pixel value distribution of the image, the features of the image are extracted.

[0066] In an embodiment of the present invention, according to four or more initial positioning targets, the positioning blind spot is determined, and subsequent drilling operations are carried out based on the positioning blind spot, reducing four errors to one error, improving the device positioning accuracy. Through the division of the neighborhood feature method order, that is, the reverse deduction of the nth order domain, the positioning accuracy is further improved, and the positioning accuracy of blind holes and through holes is improved by means of image recognition.

[0067] Step 105, determine the center reference coordinates of the neighboring feature area;

[0068] In an embodiment of the present invention, after determining the neighboring feature area, the center reference coordinates of the neighboring feature area can be obtained; the determination of the center reference coordinates of the neighboring feature area includes: determining the center point of the horizontal and vertical coordinates of the neighboring feature area as the center reference coordinates.

[0069] Specifically applied to the embodiment of the present invention, the neighboring feature area can be represented in the form of horizontal and vertical coordinates, that is, the neighboring feature area refers to the area enclosed by the edge feature set represented by more accurate coordinate data;

[0070] Specifically, first divide the neighboring feature area into multiple triangles or polygons, calculate the areas of the multiple triangles or polygons, calculate the weighted average of the areas of the triangles or polygons, and obtain the total area and centroid coordinates of the neighboring feature area; determine the centroid coordinates as the center reference coordinates. In specific implementation, the calculate_area function can be used to calculate the areas of multiple triangles or polygons according to the coordinate data, and then the calculate_centroid function can be used to calculate the total area and geometric center coordinates of the multiple triangles or polygons, that is, the center reference coordinates are obtained.

[0071] Specifically in the embodiments of the present invention, the center coordinates of the horizontal and vertical coordinates of the adjacent feature region can also be calculated by other means, and the embodiments of the present invention do not impose too many restrictions on this.

[0072] Step 106, determine the position of the positioning blind hole with the center reference coordinates as the positioning reference, and control the device to make the blind hole; and, control the device to make the corresponding circuit with the center reference coordinates as the positioning reference.

[0073] After obtaining the center reference coordinates, set the center reference coordinates as the positioning reference of the laser drilling device, and control the laser drilling device to make the blind hole and the corresponding circuit under the condition of this positioning reference, which improves the manufacturing accuracy of the hole and the circuit, reduces the manufacturing error of the PCB board, does not require hardware modification, and reduces costs.

[0074] In a preferred embodiment of the embodiments of the present invention, the method further includes: determining the position of the through hole with the position of the positioning blind hole as the positioning reference, and controlling the device to make the through hole; that is, in the embodiments of the present invention, the position of the through hole can also be determined with the position of the fixed blind hole as the positioning reference to make the through hole, and the actual hole positions are further calibrated with each other to improve the convenience of making the through hole and further improve the positioning accuracy; in the embodiments of the present invention, a virtual point (center reference coordinates) is established according to the preset positioning point (target image position), and the blind hole point or through hole point of the actual drilling is calibrated through the virtual point to improve the positioning accuracy.

[0075] In another specific description, the determining the position of the positioning blind hole with the center reference coordinates as the positioning reference and controlling the device to make the blind hole includes: obtaining the position of the through hole through an image acquisition device, calculating the through hole offset according to the position of the through hole and the preset through hole position; determining the position of the positioning blind hole with the center reference coordinates as the positioning reference, calibrating the position of the positioning blind hole according to the through hole offset to obtain the calibrated blind hole position, and controlling the device to make the blind hole according to the calibrated blind hole position; in the embodiments of the present invention, the position of the blind hole on the laser drilling device can also be further calibrated through the through hole offset, and the actual hole positions are further calibrated with each other to improve the convenience of making the blind hole and further improve the positioning accuracy.

[0076] It should be noted that in the embodiments of the present invention, the above semiconductor device may include a material pre-baking device, an inner layer image device, a drilling device, an electroplating device, a browning device, a lamination device, a dry film pasting device, a UV laser device, an exposure device, a developing device, an etching device, etc., and the embodiments of the present invention do not impose too many restrictions on this.

[0077] Correspondingly, after the above-mentioned drilling operation, the device can also be controlled to perform electroplating operation, outer layer image etching operation, solder mask operation, immersion gold operation, thermosetting text operation, forming operation, opening operation, flexible board UV forming operation, electrical testing operation, etc. The embodiments of the present invention do not impose too many restrictions on this.

[0078] In the embodiments of the present invention, the laser drilling positioning control method for the rigid-flex board includes: obtaining the initial target position, controlling the device to make a target image at the initial target position of the PCB substrate and then laminating the surface layer; controlling the device to remove the surface layer to expose the target image, and obtaining multiple target image positions through an image acquisition device; generating multiple auxiliary layer target circles according to the target image positions; determining the adjacent feature region by the tangent outer region of the multiple auxiliary layer target circles; determining the center reference coordinates of the adjacent feature region; determining the position of the positioning blind hole with the center reference coordinates as the positioning reference, and controlling the device to make the blind hole; and controlling the device to make the corresponding circuit with the center reference coordinates as the positioning reference, establishing a virtual point (center reference coordinates) according to the preset positioning points (target image positions), and calibrating the blind hole points or via holes of the actual drilling through the virtual point to improve the positioning accuracy.

[0079] It should be noted that for the method embodiments, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that the embodiments of the present invention are not limited by the described action sequences, because according to the embodiments of the present invention, some steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily essential for the embodiments of the present invention.

[0080] Referring to Figure 6 , a structural block diagram of an embodiment of a laser drilling positioning control device for a rigid-flex board according to this embodiment is shown, which may specifically include the following modules:

[0081] The first acquisition module 301 is used to obtain the initial target position, and control the device to make a target image at the initial target position of the PCB substrate and then laminate the surface layer;

[0082] The target image position module 302 is used to control the device to remove the surface layer to expose the target image, and obtain multiple target image positions through an image acquisition device;

[0083] The generation module 303 is used to generate multiple auxiliary layer target circles according to the target image positions;

[0084] The determination module 304 is used to determine the adjacent feature region by the tangent outer region of the multiple auxiliary layer target circles;

[0085] The center reference coordinate module 305 is used to determine the center reference coordinates of the adjacent feature region;

[0086] The control module 306 is used to determine the position of the positioning blind hole with the center reference coordinates as the positioning reference, and control the device to make the blind hole; and, control the device to make the corresponding circuit with the center reference coordinates as the positioning reference.

[0087] Preferably, the device further includes:

[0088] The through-hole making module is used to determine the position of the through-hole with the position of the positioning blind hole as the positioning reference, and control the device to make the through-hole.

[0089] Preferably, the control module includes:

[0090] The through-hole offset calculation module is used to obtain the through-hole position through the image acquisition device, and calculate the through-hole offset according to the through-hole position and the preset through-hole position;

[0091] The blind hole making sub-module is used to determine the position of the positioning blind hole with the center reference coordinates as the positioning reference, calibrate the position of the positioning blind hole according to the through-hole offset, obtain the calibrated blind hole position, and control the device to make the blind hole according to the calibrated blind hole position.

[0092] Preferably, the generation module includes:

[0093] The calculation sub-module is used to calculate the target offset between the target image position and the preset target image position;

[0094] The generation sub-module is used to calibrate the preset target image position according to the target offset, generate the calibrated target image position, and generate a plurality of auxiliary layer target circles with the calibrated target image position as the center.

[0095] Preferably, the determination module includes:

[0096] The conversion sub-module is used to convert the regions corresponding to the plurality of auxiliary layer target circles into a plurality of circular order features, and convert the region surrounded by the edge feature set of the circular order features into an adjacent feature region.

[0097] Preferably, the center reference coordinate module includes:

[0098] The center point sub-module is used to determine the center reference coordinates by taking the center point of the vertical and horizontal coordinates of the adjacent feature region.

[0099] For the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and for the related parts, please refer to the partial description of the method embodiment.

[0100] For the specific limitations of the laser drilling positioning control device for the rigid-flex printed circuit board, reference can be made to the limitations of the laser drilling positioning control method for the rigid-flex printed circuit board in the above text, which will not be elaborated here. Each module in the above laser drilling positioning control device for the rigid-flex printed circuit board can be implemented in whole or in part by software, hardware, and their combination. The above modules can be embedded in the processor in the computer device in hardware form or be independent of it, or be stored in the memory in the computer device in software form, so as to facilitate the processor to call and execute the operations corresponding to the above modules.

[0101] The above provided laser drilling positioning control device for the rigid-flex printed circuit board can be used to execute the laser drilling positioning control method provided in any of the above embodiments, and has the corresponding functions and beneficial effects.

[0102] In one embodiment, a computer device is provided. The computer device can be a terminal, and its internal structure diagram can be as Figure 7 shown. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, it realizes a method for simulating the daylighting rate. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer covering the display screen, or a button, a trackball, or a touchpad provided on the housing of the computer device, or an external keyboard, touchpad, or mouse, etc.

[0103] Those skilled in the art can understand that Figure 7 the structure shown in

[0104] is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have a different component layout.

[0105] Obtain the initial target position, and after the device makes a target image at the initial target position of the PCB substrate, press the surface layer;

[0106] The control device clears the surface layer to expose the target image, and obtains multiple target image positions through the image acquisition device;

[0107] According to the target image positions, multiple auxiliary layer target circles are generated;

[0108] The tangent outer region of the multiple auxiliary layer target circles is determined as the adjacent feature region;

[0109] The center reference coordinates of the adjacent feature region are determined;

[0110] Taking the center reference coordinates as the positioning reference, the position of the positioning blind hole is determined, and the control device manufactures the blind hole; and, taking the center reference coordinates as the positioning reference, the control device manufactures the corresponding circuit.

[0111] Preferably, the method further includes:

[0112] Taking the position of the positioning blind hole as the positioning reference, the position of the through hole is determined, and the control device manufactures the through hole.

[0113] Preferably, the step of taking the center reference coordinates as the positioning reference to determine the position of the positioning blind hole and the control device manufacturing the blind hole includes:

[0114] The through hole position is obtained through the image acquisition device, and the through hole offset is calculated according to the through hole position and the preset through hole position;

[0115] Taking the center reference coordinates as the positioning reference, the position of the positioning blind hole is determined, the position of the positioning blind hole is calibrated according to the through hole offset to obtain the calibrated blind hole position, and the control device manufactures the blind hole according to the calibrated blind hole position.

[0116] Preferably, the step of generating multiple auxiliary layer target circles according to the target image positions includes:

[0117] The target offset between the target image position and the preset target image position is calculated;

[0118] The preset target image position is calibrated according to the target offset to generate a calibrated target image position, and multiple auxiliary layer target circles are generated with the calibrated target image position as the center.

[0119] Preferably, the step of determining the adjacent feature region by the tangent outer region of the multiple auxiliary layer target circles includes:

[0120] The regions corresponding to the multiple auxiliary layer target circles are converted into multiple circular order features, and the region surrounded by the edge feature set of the circular order features is converted into the adjacent feature region.

[0121] Preferably, determining the center reference coordinates of the adjacent feature region includes:

[0122] Based on the center point of the horizontal and vertical coordinates of the adjacent feature region, determining the center point of the horizontal and vertical coordinates as the center reference coordinates.

[0123] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0124] Obtain the initial target position, control the device to make a target image at the initial target position on the PCB substrate and then laminate the surface layer;

[0125] Control the device to remove the surface layer to expose the target image, and obtain multiple target image positions through an image acquisition device;

[0126] Generate multiple auxiliary layer target circles based on the target image positions;

[0127] Determine the adjacent feature region through the tangent outer region of the multiple auxiliary layer target circles;

[0128] Determine the center reference coordinates of the adjacent feature region;

[0129] Determine the position of the positioning blind hole with the center reference coordinates as the positioning reference, and control the device to make the blind hole; and, control the device to make the corresponding circuit with the center reference coordinates as the positioning reference.

[0130] Preferably, the method further includes:

[0131] Determine the position of the through hole with the position of the positioning blind hole as the positioning reference, and control the device to make the through hole.

[0132] Preferably, determining the position of the positioning blind hole with the center reference coordinates as the positioning reference and controlling the device to make the blind hole includes:

[0133] Obtain the through hole position through an image acquisition device, and calculate the through hole offset according to the through hole position and the preset through hole position;

[0134] Determine the position of the positioning blind hole with the center reference coordinates as the positioning reference, calibrate the position of the positioning blind hole according to the through hole offset to obtain the calibrated blind hole position, and control the device to make the blind hole according to the calibrated blind hole position.

[0135] Preferably, generating multiple auxiliary layer target circles based on the target image positions includes:

[0136] Calculate the target offset between the target image position and the preset target image position;

[0137] Calibrate the preset target image position according to the target offset to generate a calibrated target image position, and generate a plurality of auxiliary layer target circles with the calibrated target image position as the center.

[0138] Preferably, determining the adjacent feature region through the tangent outer region of the plurality of auxiliary layer target circles includes:

[0139] Convert the regions corresponding to the plurality of auxiliary layer target circles into a plurality of circular order features, and convert the region surrounded by the edge feature set of the circular order features into an adjacent feature region.

[0140] Preferably, determining the center reference coordinates of the adjacent feature region includes:

[0141] According to the center point of the vertical and horizontal coordinates of the adjacent feature region, determine the center point of the vertical and horizontal coordinates as the center reference coordinates.

[0142] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided in this application can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0143] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0144] Those skilled in the art should understand that the embodiments of this example can be provided as a method, an apparatus, or a computer program product. Therefore, this example can take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, this example can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0145] This example is described with reference to the flowcharts and / or block diagrams of the apparatus, terminal device (system), and computer program product according to this example. It should be understood that each flow and / or block in the flowchart and / or block diagram, as well as the combination of flows and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal devices to generate a machine, such that the instructions executed by the processor of the computer or other programmable data processing terminal devices generate an apparatus for implementing the functions specified in Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0146] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal devices to work in a specific manner, such that the instructions stored in the computer-readable memory generate a manufactured article including an instruction method that implements the functions specified in Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0147] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal devices, such that a series of operation steps are executed on the computer or other programmable terminal devices to generate a computer-implemented process, and thus the instructions executed on the computer or other programmable terminal devices provide steps for implementing the functions specified in Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0148] Although the preferred embodiments of this example have been described, those skilled in the art can make additional changes and modifications to these embodiments once they know the basic creative concepts. Therefore, the appended claims are intended to be construed as including the preferred embodiments and all changes and modifications that fall within the scope of this example.

[0149] Finally, it should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, device, article or terminal device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, device, article or terminal device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, device, article or terminal device including the said element.

[0150] The above has introduced in detail a laser drilling positioning control method for a rigid-flex printed circuit board, a laser drilling positioning control device for a rigid-flex printed circuit board, a computer device and a storage medium. In this article, specific examples are used to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A laser drilling positioning control method for a rigid-flex printed circuit board, characterized in that, The rigid-flex board includes a PCB substrate, comprising: Obtain the initial target position, and after the control device makes a target image at the initial target position of the PCB substrate, press the surface layer; The control device clears the surface layer to expose the target image, and obtains multiple target image positions through the image acquisition device; Generate multiple auxiliary layer target circles according to the target image positions; Determine the adjacent feature region by the tangent outer region of the multiple auxiliary layer target circles; Determine the center reference coordinates of the adjacent feature region; Determine the position of the positioning blind hole with the center reference coordinates as the positioning reference, and the control device makes the blind hole; and, with the center reference coordinates as the positioning reference, control the device to make the corresponding circuit; The target image position refers to the coordinate position calibrated by the target offset of the target image obtained by using a CCD; and the auxiliary layer target circle refers to generating multiple auxiliary layer circles with the calibrated coordinate position as the center; After obtaining multiple auxiliary layer target circles, obtain the images of the multiple auxiliary layer target circles, and identify the tangent outer region formed by the edges of the auxiliary layer target circles through image processing; specifically, determining the adjacent feature region by the tangent outer region of the multiple auxiliary layer target circles includes: converting the regions corresponding to the multiple auxiliary layer target circles into multiple circular order features, and converting the region surrounded by the edge feature set of the circular order features into an adjacent feature region. The circular order features include -1 order pixel features, -2 order pixel features, and -3 order pixel features; The region surrounded by the edge feature set located by the reverse neighborhood feature and fitted by the least squares function is the adjacent feature region; Set the loss function C of the least squares function as follows: ； Where, Ui represents the opposite number of the neighborhood feature order, yi and xi represent the horizontal and vertical coordinates of the image pixels of the region surrounded by the edge feature set, n represents the number of edge feature sets, and i = 1, 2, 3 ······ n; Minimize the loss function through gradient descent, continuously iterate and update until the function converges, and convert the region enclosed by the edge feature set into an adjacent feature region. Refers to the least squares function, which is a fitting function for edge detection tasks. By fitting the pixel value distribution of the image, the features of the image are extracted.

2. The method according to claim 1, wherein The method further includes: Determine the position of the through hole with the position of the positioning blind hole as the positioning reference, and the control device makes the through hole.

3. The method according to claim 1, characterized in that, The determining the position of the positioning blind hole with the center reference coordinates as the positioning reference and the control device making the blind hole includes: Obtain the through hole position through the image acquisition device, and calculate the through hole offset according to the through hole position and the preset through hole position; Determine the position of the positioning blind hole with the center reference coordinates as the positioning reference, calibrate the position of the positioning blind hole according to the through hole offset to obtain the calibrated blind hole position, and control the device to make the blind hole according to the calibrated blind hole position.

4. The method according to claim 1, characterized in that, The generating multiple auxiliary layer target circles according to the target image positions includes: Calculate the target offset between the target image position and the preset target image position; Calibrate the preset target image position according to the target offset to generate a calibrated target image position, and generate multiple auxiliary layer target circles with the calibrated target image position as the center.

5. The method according to claim 1, characterized in that, The determining the center reference coordinates of the adjacent feature region includes: Based on the center point of the horizontal and vertical coordinates of the adjacent feature region, determine the center point of the horizontal and vertical coordinates as the center reference coordinate.

6. A laser drilling positioning control device for a rigid-flexible printed circuit board, characterized in that, The rigid-flex printed circuit board includes a PCB substrate, including: A first acquisition module, configured to acquire an initial target position, and control the device to press the surface layer after making a target image at the initial target position of the PCB substrate; A target image position module, configured to control the device to clear the surface layer to expose the target image, and acquire a plurality of target image positions through an image acquisition device; A generation module, configured to generate a plurality of auxiliary layer target circles according to the target image positions; A determination module, configured to determine the adjacent feature region through the tangent outer region of the plurality of auxiliary layer target circles; A center reference coordinate module, configured to determine the center reference coordinate of the adjacent feature region; A control module, configured to determine the position of the positioning blind hole with the center reference coordinate as the positioning reference, and control the device to make the blind hole; and, control the device to make the corresponding circuit with the center reference coordinate as the positioning reference; The target image position refers to the coordinate position after calibrating the target image obtained by using a CCD through the target offset; and the auxiliary layer target circle refers to generating a plurality of auxiliary layer circles with the calibrated coordinate position as the center; After obtaining the plurality of auxiliary layer target circles, acquire the images of the plurality of auxiliary layer target circles, and identify the tangent outer region formed by the edges of the auxiliary layer target circles through image processing; specifically, determining the adjacent feature region through the tangent outer region of the plurality of auxiliary layer target circles includes: converting the regions corresponding to the plurality of auxiliary layer target circles into a plurality of circular order features, and converting the region surrounded by the edge feature set of the circular order features into the adjacent feature region, and the circular order features include -1 order pixel features, -2 order pixel features, and -3 order pixel features; The region surrounded by the edge feature set located by the reverse neighborhood feature and fitted by the least squares function is the adjacent feature region; Set the loss function C of the least squares function as follows: ； Wherein, Ui represents the opposite number of the neighborhood feature order, yi and xi represent the horizontal and vertical coordinates of the image pixels of the region surrounded by the edge feature set, n represents the number of edge feature sets, and i = 1, 2, 3 ······ n; Minimize the loss function by gradient descent, continuously iterate and update until the function converges, and convert the area enclosed by the edge feature set into a neighboring feature region. Refers to the least squares function, which is a fitting function for edge detection tasks. By fitting the pixel value distribution of the image, the features of the image are extracted.

7. The device according to claim 6, characterized in that, The device further includes: A via hole making module, configured to determine the position of the via hole with the position of the positioning blind hole as the positioning reference, and control the device to make the via hole.

8. A computer device, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the laser drilling positioning control method of the rigid-flex printed circuit board according to any one of claims 1 to 5.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the laser drilling positioning control method of the rigid-flex printed circuit board according to any one of claims 1 to 5.

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