Electronic device

Abstract

The invention discloses electronic equipment which comprises a frame body, a first side of the frame body is provided with a first mounting groove, a second side of the frame body is provided with a second mounting groove, the first mounting groove and the second mounting groove are oppositely arranged, the groove bottom wall of the first mounting groove is provided with a first concave part, or the groove bottom wall of the first mounting groove is provided with a through hole; the through hole penetrates through the groove bottom wall of the second mounting groove; the battery is arranged in the first mounting groove; a circuit board; the vapor chamber is arranged in the second mounting groove; when the groove bottom wall of the first mounting groove is provided with a first concave part, the circuit board is arranged in the first concave part; when the groove bottom wall of the first mounting groove is provided with a through hole, the circuit board is arranged in the through hole.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic devices, and specifically relates to an electronic device. Background Art

[0002] In the related art, a circuit board and a large-capacity battery are provided in an electronic device. The circuit board is located between the battery and the front of the frame of the electronic device. The front of the frame is a plane, and the circuit board creates a gap between the battery and the front of the frame. In order to ensure the safety and reliability of the battery, glue is filled in the gap between the battery and the front of the frame to effectively support and fix the battery with the frame. The electronic device is also equipped with a large-sized heat spreader, which is used to improve the heat dissipation performance of the electronic device. The heat spreader is located on the side of the frame away from the battery. The assembly structure of the battery, circuit board, frame and heat spreader results in a large thickness of the electronic device, which cannot meet the demand for thin and light electronic devices. Summary of the invention

[0003] The present application aims to provide an electronic device that solves the problem that, while the frame effectively supports and fixes the battery, the assembly structure of the battery, circuit board, frame and heat spreader in the related art is unreasonable, resulting in a large thickness of the electronic device and being unable to meet the demand for thin and light electronic devices.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] An embodiment of the present application proposes an electronic device, including: a frame, a first mounting groove is provided on a first side of the frame, a second mounting groove is provided on a second side of the frame, the first mounting groove and the second mounting groove are arranged back to back, a first recess is provided on a bottom wall of the first mounting groove, or a through hole is provided on the bottom wall of the first mounting groove, and the through hole passes through the bottom wall of the second mounting groove; a battery is provided in the first mounting groove; a circuit board; a heat spreader is provided in the second mounting groove; when the first recess is provided on the bottom wall of the first mounting groove, the circuit board is provided in the first recess; when the through hole is provided on the bottom wall of the first mounting groove, the circuit board is provided in the through hole.

[0006] In an embodiment of the present application, the electronic device includes a frame, a battery, a circuit board and a heat spreader.

[0007] The frame has a first side and a second side, and the first side of the frame is arranged opposite to the second side of the frame. The first side of the frame is provided with a first mounting groove, and the second side of the frame is provided with a second mounting groove. The first mounting groove has the function of mounting and fixing the battery, and the second mounting groove has the function of mounting and fixing the heat spreader.

[0008] The first mounting groove and the second mounting groove are arranged opposite to each other.

[0009] The bottom wall of the first mounting groove is provided with a first recess, and the circuit board is provided in the first recess, and the first recess has the function of installing and fixing the circuit board. In other words, the portion of the frame located between the first mounting groove and the second mounting groove is locally thinned so that the circuit board is provided in the first recess, so that the dimensions of the battery, frame, circuit board and heat spreader in the thickness direction of the electronic device can be reduced, the thickness of the electronic device is reduced, and a reliable structural support is provided for realizing the lightness and thinness of the electronic device.

[0010] Alternatively, a through hole is provided on the bottom wall of the first mounting groove, the through hole penetrates the bottom wall of the second mounting groove, the circuit board is provided in the through hole, and the through hole has the function of installing and fixing the circuit board. In this way, the size of the battery, frame, circuit board and heat spreader in the thickness direction of the electronic device can be reduced, the thickness of the electronic device is reduced, and a reliable structural support is provided for realizing the lightness and thinness of the electronic device.

[0011] It can be understood that the bottom wall of the first mounting groove is provided with a first recess, that is, a portion of the bottom wall of the first mounting groove is recessed toward the direction of the second mounting groove to form the first recess, and the non-recessed portion of the bottom wall of the first mounting groove is still in contact with the battery to support and fix the battery.

[0012] It can be understood that the bottom wall of the first mounting groove is provided with a through hole, that is, a portion of the bottom wall of the first mounting groove is removed to form a portion of the through hole, and the portion of the bottom wall of the first mounting groove that is not removed is still in contact with the battery to support and fix the battery.

[0013] In other words, the part of the frame between the first mounting groove and the second mounting groove is divided, one part of the area is supported between the battery and the heat spreader, and the other part of the area is provided with a first recess or through hole, and the part provided with the first recess or through hole can be used to install and fix the circuit board. This arrangement can ensure the contact area between the frame and the battery and the heat spreader, and can meet the use requirements of effectively supporting and fixing the battery and the heat spreader.

[0014] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 It is a schematic diagram of the first part of the structure of the electronic device of the first embodiment of the present application;

[0017] Figure 2 It is a schematic diagram of the second part of the structure of the electronic device of the first embodiment of the present application;

[0018] Figure 3 This is a partial structural schematic diagram of a vapor chamber according to the first embodiment of the present application;

[0019] Figure 4 is a schematic structural diagram of the first part of an electronic device according to a second embodiment of the present application;

[0020] Figure 5 is a schematic diagram of the second part of the structure of the electronic device of the second embodiment of the present application;

[0021] Figure 6 is a partial structural schematic diagram of a vapor chamber according to a second embodiment of the present application;

[0022] Figure 7 It is a partial structural diagram of an electronic device according to the third embodiment of the present application.

[0023] Reference numerals:

[0024] Figures 1 to 7 The corresponding relationship between the reference numerals and component names in the figure is:

[0025] 10 electronic device, 100 frame, 110 first mounting groove, 112 bottom wall of the first mounting groove, 120 second mounting groove, 122 bottom wall of the second mounting groove, 130 through hole, 140 first recess, 200 battery, 300 circuit board, 400 heat spreader, 410 first plate body, 412 second recess, 414 limiting structure, 420 second plate body, 430 heat spreader chamber, 500 first adhesive layer, 510 first adhesive section, 520 second adhesive section, 600 second adhesive layer. DETAILED DESCRIPTION

[0026] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0027] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] The following is combined with Figures 1 to 7 The electronic device 10 provided in the embodiment of the present application is described.

[0031] like Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 7 As shown, according to some embodiments of the present application, an electronic device 10 is proposed, including: a frame 100, a first mounting groove 110 is provided on a first side of the frame 100, a second mounting groove 120 is provided on a second side of the frame 100, the first mounting groove 110 and the second mounting groove 120 are arranged back to back, a groove bottom wall 112 of the first mounting groove is provided with a first recess 140, or a groove bottom wall 112 of the first mounting groove is provided with a through hole 130, and the through hole 130 passes through the groove bottom wall 122 of the second mounting groove; a battery 200, arranged in the first mounting groove 110; a circuit board 300; a heat spreader 400, arranged in the second mounting groove 120; when the groove bottom wall 112 of the first mounting groove is provided with a first recess 140, the circuit board 300 is arranged in the first recess 140; when the groove bottom wall 112 of the first mounting groove is provided with a through hole 130, the circuit board 300 is arranged in the through hole 130.

[0032] In the embodiment of the present application, the electronic device 10 includes a frame 100 , a battery 200 , a circuit board 300 and a heat spreader 400 .

[0033] The frame 100 has a first side and a second side, and the first side of the frame 100 and the second side of the frame 100 are arranged opposite to each other. The first side of the frame 100 is provided with a first mounting groove 110, and the second side of the frame 100 is provided with a second mounting groove 120. The first mounting groove 110 has the function of mounting and fixing the battery 200, and the second mounting groove 120 has the function of mounting and fixing the heat spreader 400.

[0034] The first mounting groove 110 and the second mounting groove 120 are disposed opposite to each other.

[0035] The bottom wall 112 of the first mounting groove is provided with a first recess 140, and the circuit board 300 is provided in the first recess 140. The first recess 140 has the function of installing and fixing the circuit board 300. In other words, the portion of the frame 100 located between the first mounting groove 110 and the second mounting groove 120 is locally thinned so that the circuit board 300 is provided at the first recess 140. In this way, the dimensions of the battery 200, the frame 100, the circuit board 300 and the heat spreader 400 in the thickness direction of the electronic device 10 can be reduced, the thickness of the electronic device 10 is reduced, and reliable structural support is provided for realizing the thinness of the electronic device 10.

[0036] Alternatively, the bottom wall 112 of the first mounting groove is provided with a through hole 130, the through hole 130 penetrates the bottom wall 122 of the second mounting groove, the circuit board 300 is provided in the through hole 130, and the through hole 130 has the function of installing and fixing the circuit board 300. In this way, the dimensions of the battery 200, the frame 100, the circuit board 300 and the heat spreader 400 in the thickness direction of the electronic device 10 can be reduced, the thickness of the electronic device 10 is reduced, and a reliable structural support is provided for realizing the lightness and thinness of the electronic device 10.

[0037] It can be understood that the bottom wall 112 of the first mounting groove is provided with a first recess 140, that is, a portion of the bottom wall 112 of the first mounting groove is recessed toward the direction of the second mounting groove 120 to form the first recess 140, and the non-recessed portion of the bottom wall 112 of the first mounting groove is still in contact with the battery 200 to support and fix the battery 200.

[0038] It can be understood that the bottom wall 112 of the first mounting groove is provided with a through hole 130, that is, a portion of the bottom wall 112 of the first mounting groove is removed to form a portion of the through hole 130, and the portion of the bottom wall 112 of the first mounting groove that is not removed is still in contact with the battery 200 to support and fix the battery 200.

[0039] In other words, the part of the frame 100 between the first mounting groove 110 and the second mounting groove 120 is divided, a part of the area is supported between the battery 200 and the heat spreader 400, and another part of the area is provided with a first recess 140 or a through hole 130, and the part provided with the first recess 140 or the through hole 130 can be installed to fix the circuit board 300. This arrangement can ensure the contact area between the frame 100 and the battery 200 and the heat spreader 400, and can meet the use requirements of effectively supporting and fixing the battery 200 and the heat spreader 400.

[0040] Exemplarily, the circuit board 300 includes a flexible circuit board and / or a printed circuit board.

[0041] It can be understood that the circuit board 300 is electrically connected to the controller of the electronic device 10 .

[0042] Exemplarily, the electronic device 10 can be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR (Augmented Reality) device), a virtual reality device (also known as a VR (Virtual Reality) device) and a handheld game console, etc.

[0043] Exemplarily, the circuit board 300 is entirely located in the first recess 140 .

[0044] Exemplarily, a portion of the circuit board 300 is located in the first recess 140 .

[0045] Exemplarily, the circuit board 300 is entirely located within the through hole 130 .

[0046] Exemplarily, a portion of the circuit board 300 is located in the through hole 130 .

[0047] In some embodiments, Figure 3 and Figure 6 As shown, the heat spreader 400 includes: a first plate body 410, the first plate body 410 is provided with a second recess 412 recessed toward the direction of the battery 200, the first plate body 410 is also provided with a limiting structure 414, the limiting structure 414 is connected to the open end of the second recess 412, the shape of the groove wall of the second mounting groove 120 is adapted to the shape of the first plate body 410, and the first plate body 410 is connected to the groove wall of the second mounting groove 120; a second plate body 420, the second plate body 420 is stacked on the side of the first plate body 410 away from the battery 200, and the first plate body 410 and the second plate body 420 enclose a heat spreader cavity 430.

[0048] In this embodiment, the vapor chamber 400 includes a first plate body 410 and a second plate body 420 .

[0049] The first plate 410 is provided with a second recess 412 that is recessed toward the battery 200. The first plate 410 is also provided with a limiting structure 414 that is connected to the open end of the second recess 412. The second plate 420 is stacked on a side of the first plate 410 that is away from the battery 200. Specifically, the second plate 420 is connected to the limiting structure 414.

[0050] The heat spreader 400 is disposed in the second mounting groove 120. The shape of the groove wall of the second mounting groove 120 is adapted to the shape of the first plate body 410, and the groove wall of the second mounting groove 120 is connected to the first plate body 410. The shape of the groove wall of the second mounting groove 120 is adapted to the shape of the first plate body 410 means that the shape of the groove wall of the second mounting groove 120 is the same as the shape of the first plate body 410, or the shape of the groove wall of the second mounting groove 120 is similar to the shape of the first plate body 410.

[0051] The second plate 420 is connected to the first plate 410 and is located on a side of the first plate 410 away from the battery 200. The first plate 410 and the second plate 420 enclose a heat-absorbing chamber 430.

[0052] When the controller of the electronic device 10 is working, heat is generated. The heat is conducted to the frame 100 through the thermal conductive gel, and the heat is conducted to the upper part of the heat spreader 400 through the frame 100. Then the heat is quickly conducted to the lower part of the heat spreader 400, and then conducted to the frame 100 through the heat spreader 400, thereby completing the uniform distribution of heat and achieving heat dissipation.

[0053] Exemplarily, the heat-sparing chamber 430 is filled with a heat exchange medium (eg, water) and a capillary structure, which can perform rapid heat transfer. The larger the volume of the heat-sparing chamber 430 is, the better the heat dissipation capacity is.

[0054] In some embodiments, the thickness of at least one of the first plate 410 and the second plate 420 is greater than or equal to 0.03 mm and less than or equal to 0.06 mm.

[0055] In this embodiment, the structure of the vapor chamber 400 is further defined.

[0056] The thickness of at least one of the first plate 410 and the second plate 420 is greater than or equal to 0.03 mm and less than or equal to 0.06 mm. That is, the thickness of the first plate 410 is greater than or equal to 0.03 mm and less than or equal to 0.06 mm, or the thickness of the second plate 420 is greater than or equal to 0.03 mm and less than or equal to 0.06 mm, or the thickness of the first plate 410 and the thickness of the second plate 420 are both greater than or equal to 0.03 mm and less than or equal to 0.06 mm.

[0057] This configuration further reduces the thickness of at least one of the first plate 410 and the second plate 420 , so as to further reduce the dimensions of the battery 200 , the frame 100 , the circuit board 300 and the heat spreader 400 in the thickness direction of the electronic device 10 .

[0058] The first direction is the thickness direction of the electronic device 10 .

[0059] In the thickness direction of the electronic device 10 , the length of the first plate body 410 is the thickness of the first plate body 410 , and the length of the second plate body 420 is the thickness of the first plate body 410 .

[0060] Exemplarily, the thickness of the first plate body 410 includes 0.035 mm, 0.04 mm, 0.045 mm, 0.05 mm or 0.055 mm, etc., which are not listed here one by one.

[0061] Exemplarily, the thickness of the second plate body 420 includes 0.035 mm, 0.04 mm, 0.045 mm, 0.05 mm or 0.055 mm, etc., which are not listed here one by one.

[0062] In some embodiments, Figure 2 As shown, the electronic device 10 further includes: a first adhesive layer 500 , and the first plate body 410 and the groove wall of the second installation groove 120 are connected through the first adhesive layer 500 .

[0063] In this embodiment, the electronic device 10 further includes a first adhesive layer 500 .

[0064] When the thickness of at least one of the first plate 410 and the second plate 420 is reduced, the structural strength and rigidity of the heat spreader 400 will be reduced, and the heat spreader 400 will be easily deformed, which will increase the probability of the heat spreader 400 touching the screen of the electronic device 10.

[0065] Therefore, by setting the first adhesive layer 500, the first plate body 410 and the groove wall of the second installation groove 120 are connected through the first adhesive layer 500. The first adhesive layer 500 assembles the heat spreader 400 and the frame 100 into a whole to enhance the structural strength of the heat spreader 400, reduce the deformation of the heat spreader 400, and reduce the probability of the heat spreader 400 touching the screen of the electronic device 10. While meeting the use requirements of the thinning of the electronic device 10, it is beneficial to improve the use performance and reliability of the electronic device 10.

[0066] In some embodiments, Figure 2 and Figure 5As shown, the first adhesive layer 500 includes: a first adhesive section 510 connected between the bottom wall 122 of the second installation groove and the outer surface of the first plate body 410; and a second adhesive section 520 connected between the groove wall of the second installation groove 120 and the limiting structure 414.

[0067] In this embodiment, the first adhesive layer 500 includes a first adhesive section 510 and a second adhesive section 520 .

[0068] The first bonding section 510 is located between the groove bottom wall 122 of the second installation groove and the outer surface of the first plate body 410 , and the groove bottom wall 122 of the second installation groove and the first plate body 410 are connected via the first bonding section 510 .

[0069] The second bonding section 520 is located between the groove wall of the second installation groove 120 and the limiting structure 414 , and the groove wall of the second installation groove 120 and the limiting structure 414 are connected through the second bonding section 520 .

[0070] In this embodiment, the first adhesive section 510 and the second adhesive section 520 are arranged at intervals along the thickness direction of the electronic device 10. That is, the first adhesive layer 500 does not spread over the outer surface of the first plate body 410, but is disposed on a portion of the outer surface of the first plate body 410. In this way, while ensuring the effectiveness of assembling the vapor chamber 400 and the frame body 100, the amount of the first adhesive layer 500 is reduced, the difficulty of assembling the vapor chamber 400 and the frame body 100 can be reduced, the disassembly efficiency of the electronic device 10 can be improved, and the production cost of the electronic device 10 can be reduced.

[0071] In some other embodiments, the first adhesive layer 500 is evenly distributed on the outer surface of the first plate body 410 , that is, the first adhesive layer 500 covers the outer surface of the first plate body 410 .

[0072] Exemplarily, the second plate body 420 includes at least one of a flat plate, a curved plate, and a folded plate.

[0073] Exemplarily, the thickness of the first plate body 410 is equal to the thickness of the second plate body 420 .

[0074] Exemplarily, the thickness of the first plate 410 is different from the thickness of the second plate 420. When the thickness of the first plate 410 is less than the thickness of the second plate 420, the size of the battery 200, the frame 100, the circuit board 300 and the heat spreader 400 in the thickness direction of the electronic device 10 can be further reduced. At the same time, since the second plate 420 is thicker and is provided with the first adhesive layer 500, the structural strength of the heat spreader 400 can be ensured, and the probability of the heat spreader 400 touching the screen of the electronic device 10 is reduced.

[0075] In some embodiments, the thickness of the second bonding section 520 is greater than the thickness of the first bonding section 510 .

[0076] In this embodiment, the thickness relationship between the first bonding section 510 and the second bonding section 520 is defined.

[0077] Since the second plate body 420 is stacked on the side of the first plate body 410 away from the battery 200, a part of the second plate body 420 is arranged opposite to and connected to the limiting structure 414. The thickness of the heat spreader 400 at the limiting structure 414 is relatively thin, and the heat spreader 400 is easily deformed at the limiting structure 414. Therefore, the thickness of the second bonding section 520 is made greater than the thickness of the first bonding section 510, so as to increase the thickness of the second bonding section 520 to improve the structural strength and rigidity of the heat spreader 400 at the limiting structure 414, reduce the deformation at various positions of the heat spreader 400, and ensure the safety and reliability of the electronic device 10.

[0078] In some embodiments, Figure 4 and Figure 5 As shown, when the bottom wall 112 of the first mounting groove is provided with a through hole 130, along the first direction, the depth of the through hole is greater than the thickness of the circuit board 300, and a portion of the first board body 410 protrudes and extends into the through hole.

[0079] In this embodiment, the matching structure of the through hole 130 , the circuit board 300 and the heat sink 400 is further defined.

[0080] When the bottom wall 112 of the first mounting groove is provided with a through hole 130, the depth of the through hole along the first direction is greater than the thickness of the circuit board 300. That is, part of the space in the through hole can be reused, so that a part of the first plate body 410 protrudes and extends into the through hole. In other words, a part of the through hole is used to accommodate the circuit board 300, and another part of the through hole is used to accommodate a part of the heat spreader 400. In this way, the size of the heat spreader 400 and the volume of the heat spreader cavity 430 can be increased, which is beneficial to improving the heat dissipation capacity of the heat spreader 400, the heat dissipation efficiency of the electronic device 10, and the performance and market competitiveness of the product.

[0081] It is understandable that when a portion of the first plate 410 protrudes and extends into the through hole, the first plate 410 needs to be bent multiple times to meet the matching structure of the first plate 410 and the frame 100. In this way, the structural strength and rigidity of the first plate 410 can be further improved, the structural strength and rigidity of the heat spreader 400 can be improved, the deformation of the heat spreader 400 can be reduced, and the probability of the heat spreader 400 touching the screen of the electronic device 10 is reduced, which is conducive to improving the performance and reliability of the electronic device 10 while meeting the use requirements of the thinned electronic device 10.

[0082] In some embodiments, a portion of the heat soaking chamber 430 is located within the through hole.

[0083] In this embodiment, the matching structure of the heat spreader 400 and the frame 100 is further limited so that a portion of the heat spreader cavity 430 is located in the through hole. This arrangement further increases the volume of the heat spreader cavity 430. More heat exchange medium can be accommodated in the heat spreader cavity 430, which can increase the amount of heat exchange medium in the heat spreader 400 and enhance the heat dissipation capacity of the heat spreader 400, thereby further improving the heat dissipation performance of the electronic device 10.

[0084] In some embodiments, Figure 1 As shown, the ratio of the width of the circuit board 300 in the second direction to the thickness of the circuit board 300 in the first direction is greater than or equal to 140 and less than or equal to 200.

[0085] In this embodiment, the structure of the circuit board 300 is limited, and the ratio of the width of the circuit board 300 in the second direction to the thickness of the circuit board 300 in the first direction is greater than or equal to 140 and less than or equal to 200 while ensuring that the number of wirings of the circuit board 300 remains unchanged. For example, along the second direction, the width of the circuit board 300 is d1, and along the first direction, the thickness of the circuit board 300 is d2, wherein 140≤d1 / d2≤200. In this way, the length of the first recess 140 or the aperture of the through hole 130 can be reduced in the second direction to increase the contact length of the frame 100 and the battery 200 along the second direction, thereby increasing the contact area between the frame 100 and the battery 200. In other words, while reducing the dimensions of the battery 200, the frame 100, the circuit board 300 and the heat spreader 400 in the thickness direction of the electronic device 10, the contact area between the battery 200 and the frame 100 can be increased, so that the stability and reliability of the assembly of the battery 200 can be further improved, which is conducive to improving the safety of the use of the battery 200.

[0086] It can be understood that the shape of the first recess 140 or the through hole 130 is adapted to the shape of the circuit board 300. When the width of the circuit board 300 is reduced and the thickness of the circuit board 300 is increased, the width of the first recess 140 or the through hole 130 in the second direction can be adaptively reduced. In this way, the contact area between the battery 200 and the frame 100 can be increased, and the connection area between the battery 200 and the frame 100 can be increased, thereby improving the safety performance of the battery 200.

[0087] Illustratively, d1 / d2=150, d1 / d2=160, d1 / d2=170, d1 / d2=180 and d1 / d2=190, etc., which are not listed here one by one.

[0088] In some embodiments, Figure 5As shown, the electronic device 10 further includes: a second adhesive layer 600 , and the circuit board 300 and the heat spreader 400 are connected via the second adhesive layer 600 .

[0089] In this embodiment, the structure of the electronic device 10 is further defined, so that the electronic device 10 further includes a second adhesive layer 600, the second adhesive layer 600 is located between the circuit board 300 and the heat spreader 400, and the circuit board 300 and the heat spreader 400 are connected through the second adhesive layer 600. In other words, the circuit board 300 and the heat spreader 400 are connected as a whole through the second adhesive layer 600, which is conducive to enhancing the structural strength and rigidity of the circuit board 300 and the heat spreader 400, and is conducive to improving the anti-deformation ability of the circuit board 300 and the heat spreader 400, and providing structural support for ensuring the safety and reliability of the use of the electronic device 10.

[0090] The present application reasonably arranges the structure of the electronic device 10 , which can reduce the thickness of the electronic device 10 , ensure the heat dissipation performance of the electronic device 10 , and at the same time ensure the safety of the battery 200 .

[0091] The following example takes the circuit board 300 as a flexible circuit board and the heat spreader 400 as a steam chamber heat spreader.

[0092] In the present application, the portion of the frame 100 opposite to the flexible circuit board is cut off to form a through hole 130, and the flexible circuit board is hidden in the through hole 130 of the frame 100. In this way, the position of the flexible circuit board is no longer the bottleneck of the thickness of the whole machine, and the thickness of the whole machine of the present application is reduced by about 0.13mm. In order to further optimize the thickness of the electronic device 10, the thickness of the first plate 410 and the second plate 420 of the heat spreader 400 are both thinned to 0.03mm, the total thickness of the heat spreader 400 is reduced by 0.06mm, and the weight of the heat spreader 400 is reduced by 3g. After the first plate body 410 and the second plate body 420 of the heat spreader 400 are thinned, the heat spreader 400 is more easily deformed, increasing the risk of the heat spreader 400 hitting the screen. Therefore, the main body of the heat spreader 400 is covered with a double-sided adhesive (i.e., the first adhesive layer 500) with a thickness of 0.01 mm, and the first adhesive layer 500 is connected to the frame 100, reducing the risk of the heat spreader 400 hitting the screen. The above improvements ultimately reduce the thickness of the electronic device 10 by 0.18 mm.

[0093] Furthermore, by narrowing the width of the flexible circuit board and increasing the thickness of the flexible circuit board, the contact width between the frame 100 and the battery 200 can be increased, thereby increasing the bonding area between the battery 200 and the frame 100, further improving the safety and reliability of the battery 200.

[0094] Furthermore, a portion of the vapor chamber 400 protrudes and extends into the through hole 130 of the frame 100 , thereby increasing the volume of the vapor chamber 430 of the vapor chamber 400 , thereby improving the heat dissipation performance of the entire device.

[0095] Exemplarily, the area on the frame 100 that overlaps with the flexible circuit board is formed into a long strip of through hole 130 by die casting or cutting with a CNC machine tool. The through hole 130 is used to avoid the flexible circuit board. The flexible circuit board is fixed to the heat spreader 400 by a backing glue with a thickness of 0.03 mm (i.e., the second adhesive layer 600). The flexible circuit board is hidden in the through hole 130, and the installation height of the battery 200 can be reduced by 0.13 mm (i.e., the thickness of the flexible circuit board).

[0096] For example, the thickness of the first plate 410 and the second plate 420 of the vapor chamber 400 are both reduced from 0.06 mm to 0.03 mm. The volume of the vapor chamber 430 of the vapor chamber 400 remains unchanged, so the heat dissipation performance of the vapor chamber 400 is not affected. The thickness of the vapor chamber 400 is reduced by 0.06 mm, and the weight of the vapor chamber 400 is also reduced by about 3 g. After the first plate body 410 and the second plate body 420 of the heat spreader 400 are thinned, the heat spreader 400 is easy to deform, which will increase the risk of the heat spreader 400 being hit by the top screen. Therefore, a back glue with a thickness of 0.01 mm is set on a partial area of ​​the heat spreader 400 (that is, the first adhesive section 510, and the area where the first adhesive section 510 is set is a thickness bottleneck, so a back glue with a thickness of 0.01 mm is used), and a back glue with a thickness of 0.03 mm is set on the limiting structure 414 of the heat spreader 400 (that is, the second adhesive section 520, the thickness of the heat spreader 400 at the position of the limiting structure 414 is thinner and more easily deformed, so a second adhesive section 520 with a larger thickness is set at the position of the limiting structure 414). The heat spreader 400 is bonded to the back of the frame 100 through the first bonding section 510 and the second bonding section 520. The overlapping area between the frame 100 and the heat spreader 400 is the thickness bottleneck of the whole machine. The frame 100 is designed according to the maximum thickness of 0.33 mm.

[0097] For example, the width of the flexible circuit board is reduced and the thickness of the flexible circuit board is increased. When the width of the flexible circuit board is narrowed, the wiring space of the flexible circuit board will become smaller, but by thickening the thickness of the flexible circuit board, the Z-direction wiring space of the flexible circuit board will increase. This design utilizes the extra Z-direction space to expand the contact area between the battery 200 and the frame 100, thereby increasing the area of ​​the double-sided tape used to bond the battery 200 and the frame 100, which can improve the safety performance of the battery 200.

[0098] Exemplarily, a portion of the heat spreader 400 protrudes and extends into the through hole 130 of the frame 100. Further, a portion of the heat spreader cavity 430 of the heat spreader 400 is located in the through hole 130 (the thickness of the portion of the first plate body 410 extending into the through hole 130 is still 0.03 mm), which increases the volume of the heat spreader cavity 430, and the heat spreader cavity 430 contains more water, so that the heat dissipation capacity of the heat spreader 400 is stronger, thereby further improving the heat dissipation performance of the whole machine.

[0099] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0100] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A frame, wherein a first mounting groove is provided on a first side of the frame, and a second mounting groove is provided on a second side of the frame, the first mounting groove and the second mounting groove are arranged opposite to each other, a first recess is provided on a bottom wall of the first mounting groove, or a through hole is provided on the bottom wall of the first mounting groove, and the through hole penetrates the bottom wall of the second mounting groove; A battery, arranged in the first mounting slot; Circuit boards; A heat spreader, disposed in the second mounting slot; When the first recess is provided on the bottom wall of the first installation slot, the circuit board is arranged in the first recess; When the through hole is provided on the bottom wall of the first installation slot, the circuit board is arranged in the through hole.

2. The electronic device according to claim 1, characterized in that: The heat sink comprises: A first plate body, wherein the first plate body is provided with a second recessed portion recessed toward the battery, the first plate body is further provided with a limiting structure, the limiting structure is connected to the opening end of the second recessed portion, the shape of the groove wall of the second mounting groove is adapted to the shape of the first plate body, and the first plate body is connected to the groove wall of the second mounting groove; The second plate is stacked on a side of the first plate away from the battery, and the first plate and the second plate enclose a heat-saturating chamber.

3. The electronic device according to claim 2, characterized in that: A thickness of at least one of the first plate body and the second plate body is greater than or equal to 0.03 mm and less than or equal to 0.06 mm.

4. The electronic device according to claim 2, characterized in that: Also includes: A first adhesive layer, the first plate body and the groove wall of the second installation groove are connected by the first adhesive layer.

5. The electronic device according to claim 4, characterized in that: The first adhesive layer comprises: A first bonding section connected between the bottom wall of the second mounting groove and the outer surface of the first plate body; The second bonding section is connected between the groove wall of the second installation groove and the limiting structure.

6. The electronic device according to claim 5, characterized in that: The thickness of the second bonding section is greater than the thickness of the first bonding section.

7. The electronic device according to claim 2, characterized in that: When the through hole is provided on the bottom wall of the first mounting groove, along the first direction, the depth of the through hole is greater than the thickness of the circuit board, and a portion of the first board body protrudes and extends into the through hole.

8. The electronic device according to claim 7, characterized in that: A portion of the heat-saturating chamber is located in the through hole.

9. The electronic device according to any one of claims 1 to 7, characterized in that: A ratio of a width of the circuit board in the second direction to a thickness of the circuit board in the first direction is greater than or equal to 140 and less than or equal to 200.

10. The electronic device according to any one of claims 1 to 7, characterized in that: Also includes: A second adhesive layer, the circuit board and the heat spreader are connected via the second adhesive layer.

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