High-density server heat dissipation device

Abstract

The invention relates to a next-generation high-density server heat dissipation device and relates to the technical field of high-density servers, the heat dissipation device comprises a radiator, a capillary conveying mechanism and a heat dissipation fin set, a vaporization cavity and a steam cavity are formed in the radiator, and the vaporization cavity enables a cooling working medium to absorb heat of a high-density server to be evaporated to form steam; the steam cavity is used for temporarily storing steam, and the capillary conveying mechanism enables the steam to be conveyed upwards to the cooling fin set to be cooled and enables the steam to be condensed into liquid and then flow back into the steam cavity. The vaporization cavity is adjacent to the high-density server, so that more heat on the high-density server can be absorbed by the cooling working medium more quickly, the cooling working medium is vaporized into steam in an accelerated manner, and meanwhile, capillary force is generated through the capillary conveying mechanism to enable the steam to form a continuous and quick steam flow cycle; therefore, the heat dissipation efficiency and effect of the high-density server are greatly improved, and the service life of the high-density server is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of high-density servers, and in particular to a heat dissipation device for a high-density server. Background Art

[0002] High-density servers have a higher degree of integration than ordinary servers. The form of high-density servers is to accommodate multiple node servers in one chassis. With the rapid development of network communication technology, the power consumption of high-density servers has increased sharply, making the heat dissipation and cooling of high-density servers an urgent problem to be solved.

[0003] Existing network high-density server heat dissipation technologies mainly include vapor chamber heat dissipation technology. Vapor chamber heat dissipation technology is carried out through the cooperation of the vapor chamber and the auxiliary cooling structure. The auxiliary cooling structure is used to dissipate the heat of the vapor chamber, and the vapor chamber realizes effective heat transfer of the high-density server through phase change heat transfer. However, when the power consumption of the high-density server exceeds a certain threshold, its heat dissipation performance is limited by the insufficient heat transfer capacity of the vapor chamber itself, thereby reducing the heat dissipation effect of the high-density server. Summary of the invention

[0004] In order to improve the heat dissipation effect of a high-density server, the present application provides a high-density server heat dissipation device.

[0005] The high-density server heat dissipation device provided in this application adopts the following technical solution: A high-density server heat dissipation device includes a radiator, a capillary transport mechanism and a heat dissipation fin group. The radiator is located at the bottom of the heat dissipation fin group and has a vaporization chamber and a steam chamber inside and directly acts on the high-density server for heat dissipation. The vaporization chamber is adjacent to the high-density server and is located below the steam chamber. The capillary transport mechanism is arranged in the vaporization chamber and the steam chamber and adsorbs a cooling medium under the action of capillary force. The capillary transport mechanism transports the steam upward to the heat dissipation fin group for cooling and condenses into liquid and then flows back into the steam chamber. The liquid in the steam chamber continues to flow back into the vaporization chamber under the action of gravity and capillary force to form a cycle.

[0006] By adopting the above technical solution, the radiator directly acts on the main chip of the high-density server to dissipate heat. The heat on the main chip is transferred to the capillary side of the inner wall through the radiator shell. The capillary side is conducted to the capillary side of the vaporization cavity surface. The liquid working fluid on the capillary surface of the vaporization cavity absorbs heat and changes into steam. Under the vacuum of the entire system, the temperature difference in the vaporization cavity and the condenser forms a pressure difference. The steam enters the steam cavity under the action of the pressure difference. After the liquid evaporates into steam, the vacant liquid position will cause the liquid in other parts to move for replenishment under the capillary force of the capillary side of the area. At the same time, the steam is transported upward to the condenser tube along the steam transmission pipeline through the pressure difference, and the condenser A certain number of cooling fins are welded on the outside of the tube. The cooling fins generally dissipate heat and cool the steam in this area through auxiliary cooling methods such as air cooling or water cooling. This will cause the external cooling medium to condense the steam inside the condenser into liquid through convection. After the steam is condensed into liquid in the condenser, it flows back to the Wiener-scale porous capillary structure in the steam chamber along the liquid pipe under the triple action of capillary force, pressure difference and gravity. The liquid then continues to migrate to the wall of the vaporization chamber with a capillary structure under the action of capillary pump force, realizing the flow circulation of phase change heat transfer working fluid, forming a continuous and stable working fluid circulation, thereby achieving heat dissipation and cooling of the core components of high-density servers.

[0007] By placing the vaporization chamber close to the main chip of the high-density server, the heat on the high-density server can be absorbed more and faster by the cooling medium, so that the liquid cooling medium accelerates the heat absorption phase change and vaporizes into steam. At the same time, the steam pressure difference corresponding to the temperature difference generated by the condenser cooling forms a continuous and rapid steam flow circulation to the condenser, and the cooling fins of the condenser cool the steam and condense it into liquid to release heat. The cooling fins evenly dissipate the released heat through external convection heat dissipation, thereby greatly accelerating the heat dissipation efficiency and effect of the high-density server and improving the life of the high-density server.

[0008] Optionally, the capillary transport mechanism is arranged in multiple groups at intervals, and the capillary transport mechanism includes: A steam pipe and a liquid infusion pipe are both connected to the steam chamber and are used for inputting steam and liquid into the steam chamber respectively; A connecting pipe group, which is composed of multiple horizontal sections arranged at vertical intervals and a vertical section connecting two adjacent horizontal sections, wherein the horizontal sections all pass through the heat dissipation fin group horizontally; The inlet pipe has a bottom portion arranged on the steam pipe and a top portion vertically upwardly connected to the horizontal section at the highest position, and the liquid delivery pipe is connected to the horizontal section or the vertical section at the lowest position; The porous capillary component is arranged in the steam chamber and the vaporization chamber and causes the entering working medium to generate capillary force and cause the working medium to evaporate to form steam and enter the steam chamber, or causes the condensed liquid to return to the vaporization chamber under the action of gravity and capillary force.

[0009] By adopting the above technical solution, steam enters the input pipe through the steam pipe, and then enters the highest horizontal section through the input pipe first, then enters the vertical section and then enters the horizontal section below, and then circulates in sequence, so that the steam condenses to form liquid, and the liquid then enters the infusion pipe. The liquid eventually flows back into the vaporization chamber under the action of capillaries, and the liquid changes phase on the surface of the porous working medium to produce steam, thereby realizing the flow circulation of steam, thereby achieving heat dissipation and cooling of high-density servers.

[0010] Through the principle of steam rising and circulating flow, the steam first moves up to the highest point to contact the heat sink fin group for heat dissipation, and then moves downward gradually. At this time, even if the steam condenses into liquid, it is not easy to flow back and form a barrier to the steam. Furthermore, the input pipe is in a vertical state and the steam is introduced into the horizontal section at the highest point for input, thereby further shortening the time spent entering the highest horizontal section and further reducing the probability of steam condensing into liquid and flowing back, so that more steam can move along the set path for heat dissipation and cooling, thereby further improving the heat dissipation effect and increasing the life of the high-density server.

[0011] The liquid working medium in the vaporization chamber will evenly enter the porous capillary component. Because the liquid working medium and the porous capillary component are fully wetted, the capillary pores will generate capillary force on the liquid working medium, and the working medium originally gathered in the condenser or liquid tube will be dispersed in the porous capillary component, making it easier for the liquid working medium to evaporate to form steam and enter the steam chamber. At the same time, after the steam leaves the porous capillary component, the liquid working medium outside the porous capillary component is sucked into the phase change surface of the porous capillary component under the action of capillary force, thereby forming a cycle, greatly accelerating the flow rate of the steam and improving the heat dissipation effect.

[0012] The liquid flows back to the porous capillary component through the infusion tube, and the liquid is evenly absorbed under the action of capillary force. Then the liquid flows into the vaporization chamber under the action of gravity and capillary force, thereby greatly accelerating the flow rate of the working fluid, improving the heat dissipation effect of the high-density server, and increasing the life of the high-density server.

[0013] Optionally, the diameter of the steam pipe is larger than the diameter of the liquid delivery pipe, and the heat dissipation fin group is provided with an avoidance hole for the horizontal section to pass through and connected with the bottom of the heat dissipation fin group.

[0014] By adopting the above technical solution, the diameter of the steam pipe is larger than the diameter of the liquid infusion pipe, thereby further accelerating the movement rate of the steam and further improving the heat dissipation effect; the avoidance hole makes it easy to pass the horizontal section through the heat dissipation fin group, thereby improving the convenience of installing various structures of the heat dissipation device.

[0015] Optionally, the porous capillary component comprises: The porous capillary member 1 and the porous capillary member 2 are respectively arranged in the steam chamber and the vaporization chamber and are connected to each other so that the cooling medium is adsorbed therein. The porous capillary member 1 is provided with a plurality of liquid inlet holes connected to the liquid infusion tube and steam holes for discharging steam so that a continuous medium flow channel is formed in the capillary transport mechanism.

[0016] By adopting the above technical solution, the porous capillary element 2 can make the liquid working medium in the vaporization chamber be evenly absorbed, the liquid working medium can absorb the heat on the high-density server, the temperature of the liquid working medium gradually increases and approaches its phase change saturation temperature. Once the working medium reaches the saturated state, the liquid working medium begins to evaporate rapidly at a constant temperature on the Wiener scale porous capillary surface to form saturated steam. The steam is continuously generated on the porous capillary surface and continuously discharged into the steam chamber, and then flows into the steam pipe, and finally enters the condenser for heat dissipation.

[0017] The evaporated steam enters the steam chamber, and the liquid in the infusion tube enters the porous capillary component and is evenly absorbed, thereby evenly dispersing the liquid and generating capillary force, so that the liquid flows downward to the porous capillary structure on the surface of the vaporization chamber under the action of capillary force and gravity, so as to facilitate further phase change heat absorption, thereby forming a stable and continuous liquid working fluid flow channel, thereby greatly improving the heat dissipation effect of the high-density server and increasing the life of the high-density server.

[0018] Optionally, different steam spaces are formed in the steam chamber by a plurality of partition plates, and a porous capillary component 2 is mounted in each of the steam spaces.

[0019] By adopting the above technical solution, the liquid working medium is further dispersed, so that the liquid working medium can evaporate more easily to form steam after being heated, so that more steam can achieve heat dissipation and cooling with the heat sink fin group, further improving the life of the high-density server.

[0020] Optionally, the working fluid flow channel is in a vacuum state, and after the steam pipe and the liquid infusion pipe are connected to the radiator, they are first evacuated and then the cooling working fluid is injected; a cover is provided on the input pipe, and a connecting valve is provided on the cover that is connected to the input pipe and is used for evacuating the vacuum and injecting the cooling working fluid.

[0021] By adopting the above technical solution, the vacuum state can greatly improve the heat conduction efficiency, while making the capillary force of porous capillary member 1 and porous capillary member 2 larger and more efficient, and also reducing the adverse effects of air on the heat dissipation process, thereby further improving the heat dissipation effect and increasing the life of the high-density server.

[0022] The connecting pipe group is fixedly connected to the steam pipe and the liquid infusion pipe, and then the steam pipe and the liquid infusion pipe are fixedly installed on the radiator, and then the cover is welded and fixedly installed on the input pipe. Then, vacuuming and injection of cooling medium can be achieved through the connecting valve, thereby further improving the convenience of vacuuming and injection of working medium, and the subsequent extraction or re-injection of working medium can also be achieved through the connecting valve, thereby further improving the life of the high-density server.

[0023] Optionally, the radiator comprises: The heat dissipation housing is concave downward to form a heat dissipation portion for dissipating heat on the high-density server, and the vaporization cavity is located in the heat dissipation portion; The mounting shell is arranged on the upper surface of the heat dissipation shell and forms a steam chamber connected with the vaporization chamber inside. The area of ​​the steam chamber is larger than the area of ​​the vaporization chamber and the porous capillary component covers the entire vaporization chamber.

[0024] By adopting the above technical solution, the heat dissipation part can adapt to the size of the high-density server, so that the size of the vaporization chamber can also adapt to the size of the high-density server, and the amount of working fluid in the vaporization chamber can adapt to the size of the high-density server, that is, the amount of working fluid will not be too much, otherwise it will be difficult for the working fluid to heat up and vaporize quickly, or the amount of working fluid is too small. Although the working fluid can be vaporized quickly, the amount is too small to achieve the heat dissipation effect, thereby further improving the heat dissipation effect.

[0025] Because the Wiener-scale porous capillary component 2 needs to be sintered in the steam chamber and the steam needs to be temporarily stored, the shell is designed to make the steam chamber area larger than the vaporization chamber area. The above requirements are met through a split design, and the split design is also convenient for installing porous capillary components 1 and 2, thereby greatly improving the heat dissipation effect of the high-density server and increasing the life of the high-density server.

[0026] Optionally, the heat dissipation portion is formed by integral stamping, the vaporization chamber is formed with an arc-shaped guide fillet during stamping and is used to guide liquid into the vaporization chamber, and the second porous capillary member is provided with an arc portion that fits with the guide fillet.

[0027] By adopting the above technical solution and an integrated molding setting, the strength of multiple structures of the radiator is improved, and it is very easy to form a guide fillet during stamping. The guide fillet can be used to further accelerate the rate of liquid entry. The porous capillary component 2 is located in the vaporization chamber, so the porous capillary component 2 is also designed with an arc portion that fits with the guide fillet, thereby accelerating the rate at which liquid enters the porous capillary component 2 and further improving the life of the high-density server.

[0028] Optionally, the heat dissipation part further includes a heat-conducting thin plate arranged at the bottom of the heat dissipation part and used for heat conduction, and the thermal conductivity of the heat-conducting thin plate material is greater than or equal to the thermal conductivity of the heat dissipation housing.

[0029] By adopting the above technical solution, a porous capillary part is provided in the heat dissipation part and is filled with liquid which needs to be sealed. Therefore, the heat dissipation part needs a certain supporting strength. By acting on the high-density server through the heat-conducting thin plate, the heat-conducting thin plate only needs to conduct heat and has no supporting strength requirement. Therefore, the material and size of the heat-conducting thin plate are based on the ability to quickly express heat, thereby greatly improving the heat dissipation effect on the high-density server, allowing more heat on the high-density server to be conducted out for heat dissipation, and further improving the life of the high-density server.

[0030] Optionally, a mounting groove is formed at the bottom of the heat dissipation fin group, and the radiator is located at the mounting groove and connected to the heat dissipation fin group so that the bottoms of the radiator and the heat dissipation fin group are flush.

[0031] By adopting the above technical solution, the design of the mounting groove can bring the radiator closer to the cooling fin group, and the cooling fin group is flush with the bottom of the radiator. Therefore, when the bottom of the radiator acts on the high-density server, the cooling fin group can also provide support, thereby improving the stability during the heat dissipation process and increasing the life of the high-density server.

[0032] In summary, the present application includes at least one of the following beneficial technical effects: 1. By placing the vaporization chamber close to the high-density server, the heat on the high-density server can be absorbed more and faster by the cooling medium, so that the cooling medium is accelerated to vaporize into steam. At the same time, the capillary force generated by the capillary transport mechanism forms a continuous and rapid steam flow cycle, thereby greatly accelerating the heat dissipation efficiency and effect of the high-density server, and improving the life of the high-density server. There is no need to use structures such as fans, thereby reducing noise pollution, and also avoiding the high maintenance cost required by the use of fans.

[0033] 2. Through the principle of steam rising and circulating flow, the steam first moves up to the highest point to contact the heat sink fin group for heat dissipation, and then moves downward gradually. At this time, even if the steam condenses into liquid, it is not easy to flow back and form a barrier to the steam. In addition, the input pipe is in a vertical state and the steam is introduced into the horizontal section at the highest point for input, thereby further shortening the time spent entering the highest horizontal section, further reducing the probability of steam condensing into liquid and flowing back, so that more steam can move along the set path for heat dissipation and cooling, thereby further improving the heat dissipation effect and increasing the life of the high-density server. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1It is a three-dimensional structural schematic diagram of the heat dissipation device; Figure 2 yes Figure 1 Schematic diagram of the cross section of AA; Figure 3 yes Figure 2 The enlarged schematic diagram of the middle part B; Figure 4 It is a partial structural diagram of the heat dissipation device, mainly showing the capillary transport mechanism; Figure 5 It is a partial exploded view of the heat dissipation device, mainly showing the capillary transport mechanism; Figure 6 yes Figure 5 Enlarged schematic diagram of part C in the middle.

[0035] Figure numerals: 1. radiator; 11. vaporization chamber; 111. partition plate; 112. steam space; 12. steam chamber; 13. heat dissipation shell; 14. mounting shell; 15. heat-conducting thin plate; 16. heat dissipation part; 17. guide fillet; 2. heat dissipation fin group; 21. mounting groove; 22. avoidance hole; 3. capillary transport mechanism; 31. steam pipe; 32. infusion tube; 33. input pipe; 34. cover; 4. connecting pipe group; 41. horizontal section; 42. vertical section; 5. porous capillary assembly; 51. porous capillary part one; 52. porous capillary part two; 53. arc part. DETAILED DESCRIPTION

[0036] The present application is described in further detail below.

[0037] The embodiment of the present application discloses a high-density server heat dissipation device.

[0038] Reference Figure 1-Figure 3 The high-density server heat dissipation device includes a radiator 1, a capillary transport mechanism 3 and a heat dissipation fin group 2. The radiator 1 is located at the bottom of the heat dissipation fin group 2 and is provided with a vaporization chamber 11 and a steam chamber 12. The radiator 1 directly acts on the high-density server for heat dissipation. The vaporization chamber 11 is adjacent to the high-density server, and allows the cooling medium to actively absorb the heat of the high-density server to evaporate and form steam. The steam chamber 12 is located above the vaporization chamber 11 and is used to collect steam from the vaporization chamber 11; the capillary transport mechanism 3 is arranged in the vaporization chamber 11 and the steam chamber 12 and adsorbs the cooling medium under the action of capillary force. The cooling medium has different temperatures in the vaporization chamber 11 and the steam chamber 12, resulting in different pressure differences, so that the steam is transported upward to the heat dissipation fin group 2 under a small pressure difference for condensation and cooling, and the steam is condensed into liquid and then flows back into the steam chamber 12. The liquid in the steam chamber 12 continues to flow back into the vaporization chamber 11 under the action of gravity and capillary force to form a cycle.

[0039] The heat dissipation fin group 2 is in a rectangular parallelepiped structure. The heat dissipation fin group 2 is made of copper material and is prior art, which will not be described here. A mounting groove 21 is formed at the bottom of the heat dissipation fin group 2; the radiator 1 includes a heat dissipation shell 13, a mounting shell 14 and a heat conductive plate 15.

[0040] Reference Figure 4-Figure 6 A downwardly recessed heat dissipation portion 16 is formed in the middle of the heat dissipation housing 13 by stamping, and the vaporization cavity 11 is located in the heat dissipation portion 16. The vaporization cavity 11 is formed with an arc-shaped guide fillet 17 when stamping.

[0041] Reference Figure 2-Figure 4 The vaporization chamber 11 is located inside the heat dissipation portion 16 , the mounting shell 14 and the heat dissipation shell 13 are assembled with each other and welded and sealed on all sides, and the steam chamber 12 is formed by the mounting shell 14 and the heat dissipation shell 13 , and the area of ​​the steam chamber 12 is larger than the area of ​​the vaporization chamber 11 , so that the vaporization chamber 11 is located inside the steam chamber 12 .

[0042] The heat-conducting sheet 15 is fixedly mounted on the lower surface of the heat dissipation portion 16, and the thickness of the heat-conducting sheet 15 is less than the thickness of the mounting shell 14. The heat dissipation shell 13 and the mounting shell 14 are all made of the same heat-conducting material. The heat-conducting sheet 15 is made of heat-conducting material, and the heat-conducting performance of the heat-conducting sheet 15 is greater than or equal to the heat-conducting performance of both the mounting shell 14 and the heat dissipation shell 13. The material of the heat-conducting sheet 15 is copper, and the material of the mounting shell 14 is copper or aluminum; the heat-conducting sheet 15 is used to act on the high-density server, and the heat-conducting sheet 15 covers the entire high-density server and is used to achieve heat dissipation and cooling of the high-density server.

[0043] Reference Figure 1 , Figure 3 , Figure 4 A plurality of capillary transport mechanisms 3 are arranged at intervals along the width direction of the heat dissipation fin group 2, and the capillary transport mechanism 3 includes a steam pipe 31 and a liquid infusion pipe 32, a connecting pipe group 4, an input pipe 33 and a porous capillary component 5; the steam pipe 31 is fixedly installed on the side wall of one end of the mounting shell 14 and is connected to the steam chamber 12, the liquid infusion pipe 32 passes through the end of the mounting shell 14 away from the steam pipe 31 and is connected to the steam chamber 12, and the inner diameter of the liquid infusion pipe 32 is smaller than the inner diameter of the steam pipe 31; the input pipe 33 is in a vertical state and the bottom is fixedly connected to the steam pipe 31, and the top of the input pipe 33 extends vertically upward to near the top of the heat dissipation fin group 2.

[0044] The connecting tube group 4 is used to connect with the top of the input tube 33 and the infusion tube 32. The connecting tube group 4 consists of multiple layers of horizontal sections 41 and multiple vertical sections 42. The multiple layers of horizontal sections 41 are vertically spaced and all pass through the heat sink fin group 2 horizontally. The heat sink fin group 2 begins to have avoidance holes 22 that penetrate through both ends and the lower surface of the heat sink fin group 2. The multiple layers of horizontal sections 41 all pass through the avoidance holes 22 and contact with the heat sink fin group 2; the vertical section 42 is fixedly connected to one end of two adjacent horizontal sections 41 that are close to each other, so as to connect the horizontal sections 41 of two adjacent layers; the horizontal section 41 at the highest point is fixedly connected to the top of the input tube 33, and the horizontal section 41 at the lowest point or the bottom of the vertical section 42 at the lowest point is fixedly connected to the infusion tube 32.

[0045] The steam in the steam chamber 12 enters the input pipe 33 upward, and then enters the horizontal section 41 at the highest point. When the steam passes through, it exchanges heat with the heat sink fin group 2. Then the steam enters the vertical section 42 and enters the horizontal section 41 located below again. The steam continues to exchange heat with the heat sink fin group 2, and then circulates in sequence. At the same time, after the steam condenses into liquid, it can also flow with the steam under the action of gravity, so that both the steam and the liquid flow back to the steam chamber 12 through the infusion tube 32, and finally the liquid flows into the vaporization chamber 11, thereby forming a steam flow cycle, thereby achieving continuous heat dissipation and cooling of the high-density server.

[0046] Reference Figure 3 , Figure 4 , Figure 5 The porous capillary component 5 is arranged in the steam chamber 12 and the vaporization chamber 11, and the cooling medium is adsorbed therein and the medium is evaporated to form steam and enter the steam chamber 12, or the condensed liquid is returned to the vaporization chamber 11 under the action of gravity and capillary force. A plurality of partition plates 111 are integrally arranged in the vaporization chamber 11, and the plurality of partition plates 111 are in a vertical state and form a plurality of steam spaces 112.

[0047] Reference Figure 4 , Figure 5 , Figure 6 The porous capillary component 5 includes a porous capillary component 1 51 and a porous capillary component 2 52. The porous capillary component 1 51 and the porous capillary component 2 52 are made of the same material and the material can be sintered copper powder, wire mesh, nickel powder, or aluminum powder.

[0048] The porous capillary member 51 is fixedly mounted on the inner top wall of the steam chamber 12, and multiple porous capillary members 52 are arranged at intervals and correspond one to one with the multiple steam spaces 112. The porous capillary member 52 is snap-fitted and mounted in the multiple steam spaces 112. At the same time, the porous capillary member 52 is also provided with an arc portion 53 that fits with the guide fillet 17; the opposite ends of the porous capillary member 51 and the porous capillary member 52 extend into the vaporization chamber 11 and the steam chamber 12 and are connected to each other, so that the porous capillary member 52 can cover the entire vaporization chamber 11, so that the porous capillary member 51 and the porous capillary member 52 are connected to each other as a whole and the cooling medium is adsorbed therein under the action of capillary force.

[0049] A plurality of steam holes and a plurality of liquid inlet holes are evenly provided on the top of the porous capillary member 51 and above its own porous structure. The liquid inlet holes are located on the upper surface of the top of the porous capillary member or on the top side wall. At the same time, the steam holes and the liquid inlet holes are connected to the porous structure on the porous capillary member 51, so that the steam holes and the liquid inlet holes can be shared under certain working conditions. The plurality of liquid inlet holes are respectively arranged in a one-to-one correspondence with the plurality of liquid infusion pipes 32 and are connected to each other. The liquid refluxed by the liquid infusion pipes 32 enters the liquid inlet holes and then flows into the porous structure of the porous capillary member 51. Therefore, the porous structure on the porous capillary member 51 can generate capillary force on the inflowing liquid, and the liquid is evenly dispersed in the porous structure, so that the liquid can flow into the vaporization chamber 11 under the action of its own gravity and capillary force.

[0050] The liquid entering the vaporization chamber 11 enters the porous capillary member 2 52. The porous capillary member 2 52 and the porous capillary member 1 51 have the same principle, so the liquid working medium is evenly dispersed and generates capillary force on the liquid. The liquid absorbs heat to form steam, and the steam enters the steam chamber 12. Part of the steam can contact the liquid on the porous capillary member 1 51 to achieve heat transfer, so that the liquid on the porous capillary member 1 51 evaporates to form steam and is discharged through the steam hole, thereby accelerating the evaporation of the working medium to form steam. After the liquid is converted into steam, the vacant position will be supplemented by the cooling working medium in other parts, so that a continuous and stable working medium flow channel is formed in the entire capillary transport mechanism 3.

[0051] The working medium flow channel is in a vacuum state, a cover 34 is welded and fixedly installed on the top of the input pipe 33, and a connecting valve connected to the input pipe 33 is fixedly installed on the upper surface of the cover 34; the cover 34 is welded and fixedly installed on the input pipe 33 for sealing, and then the input pipe 33 is evacuated through the connecting valve, so that the entire working medium flow channel is evacuated, and the vacuum pressure value is designed according to the actual situation, and then the cooling working medium is filled in through the connecting valve, so that the cooling working medium flows into the vaporization chamber 11 for storage under the action of gravity.

[0052] The working principle of the embodiment of the present application is as follows: Vacuuming forms a vacuum environment in the capillary transport mechanism 3, and the heat-conducting thin plate 15 acts on the high-density server. The heat generated by the high-density server is conducted to the vaporization chamber 11. The porous capillary member 52 allows the working fluid to be sucked in and evenly dispersed, so that the working fluid is easily evaporated by heat to form steam and enter the steam chamber 12. The steam enters the multiple horizontal sections 41 and the vertical sections 42 through the input pipe 33, so as to achieve heat dissipation through the heat dissipation fin group 2. Finally, the steam condenses into liquid and flows back to the porous capillary member 51 through the input pipe 33. The liquid falls into the vaporization chamber 11 under the capillary force of the porous capillary member 51 and its own gravity, thereby forming a continuous and stable steam flow, thereby greatly improving the heat dissipation and cooling effect of the high-density server and increasing the life of the high-density server.

[0053] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A high-density server heat dissipation device, characterized in that: The invention comprises a heat sink (1), a capillary transport mechanism (3) and a heat sink fin group (2); the heat sink (1) is located at the bottom of the heat sink fin group (2) and is provided with a vaporization chamber (11) and a steam chamber (12) therein and directly acts on a high-density server to dissipate heat; the vaporization chamber (11) is adjacent to the high-density server and is located below the steam chamber (12); the capillary transport mechanism (3) is arranged in the vaporization chamber (11) and the steam chamber (12) and adsorbs a cooling medium under the action of capillary force; the capillary transport mechanism (3) transports the steam upward to the heat sink fin group (2) for cooling and condenses the steam into liquid before flowing back into the steam chamber (12); the liquid in the steam chamber (12) continues to flow back into the vaporization chamber (11) under the action of gravity and capillary force to form a circulation.

2. The high-density server heat dissipation device according to claim 1, characterized in that: The capillary transport mechanism (3) is arranged in multiple groups at intervals, and the capillary transport mechanism (3) comprises: A steam pipe (31) and a liquid infusion pipe (32), both of which are in communication with the steam chamber (12) and are used to respectively input steam and liquid into the steam chamber (12); A connecting pipe group (4) composed of multiple layers of horizontal sections (41) arranged at vertical intervals and a vertical section (42) connecting two adjacent horizontal sections (41), wherein the horizontal sections (41) all pass horizontally through the heat dissipation fin group (2); An inlet pipe (33), the bottom of which is arranged on the steam pipe (31) and the top of which is vertically connected to the horizontal section (41) located at the highest position, and the liquid delivery pipe (32) is connected to the horizontal section (41) or the vertical section (42) located at the lowest position; The porous capillary component (5) is arranged in the steam chamber (12) and the vaporization chamber (11) and absorbs a cooling medium under the action of capillary force and causes the cooling medium to evaporate to form steam that enters the steam chamber (12), or causes condensed liquid to return to the vaporization chamber (11) under the action of gravity and capillary force.

3. The high-density server heat dissipation device according to claim 2, characterized in that: The diameter of the steam pipe (31) is greater than the diameter of the liquid delivery pipe (32), and the heat dissipation fin group (2) is provided with an avoidance hole (22) for the horizontal section (41) to pass through and which is connected to the bottom of the heat dissipation fin group (2).

4. The high-density server heat dissipation device according to claim 2, characterized in that: The porous capillary component (5) comprises: The porous capillary member 1 (51) and the porous capillary member 2 (52) are respectively arranged in the steam chamber (12) and the vaporization chamber (11) and are connected to each other so that the cooling medium is adsorbed therein. The porous capillary member 1 (51) is provided with a plurality of liquid inlet holes connected to the liquid delivery tube (32) and steam holes for discharging steam, so that a continuous medium flow channel is formed in the capillary transport mechanism (3).

5. The high-density server heat dissipation device according to claim 4, characterized in that: Different steam spaces (112) are formed in the steam chamber (12) through a plurality of partition plates (111), and a second porous capillary component (52) is clamped and installed in each of the steam spaces (112).

6. The high-density server heat dissipation device according to claim 4, characterized in that: The working medium flow channel is in a vacuum state, and after the steam pipe (31) and the liquid infusion pipe (32) are connected to the radiator (1), vacuum is first drawn and then the cooling working medium is injected; the input pipe (33) is provided with a cover (34), and the cover (34) is provided with a connecting valve that is in communication with the input pipe (33) and is used for vacuum drawing and injecting the cooling working medium.

7. The high-density server heat dissipation device according to claim 4, characterized in that: The radiator (1) comprises: The heat dissipation housing (13) is recessed downward to form a heat dissipation portion (16) for dissipating heat on the high-density server, and the vaporization chamber (11) is located in the heat dissipation portion (16); A mounting housing (14) is arranged on the upper surface of the heat dissipation housing (13) and forms a steam chamber (12) in the interior thereof that is in communication with the vaporization chamber (11); the area of ​​the steam chamber (12) is larger than the area of ​​the vaporization chamber (11) and enables the porous capillary component (5) to cover the entire vaporization chamber (11).

8. The high-density server heat dissipation device according to claim 7, characterized in that: The heat dissipation portion (16) is formed by integral stamping, and the vaporization chamber (11) is formed with an arc-shaped guide fillet (17) during stamping for guiding liquid into the vaporization chamber (11), and the second porous capillary member (52) is provided with an arc portion (53) that fits the guide fillet (17).

9. The high-density server heat dissipation device according to claim 7, characterized in that: The heat dissipation portion (16) further comprises a heat-conducting thin plate (15) arranged at the bottom of the heat dissipation portion (16) and used for heat conduction, and the heat conductivity of the material of the heat-conducting thin plate (15) is greater than or equal to the heat conductivity of the heat dissipation housing (13).

10. The high-density server heat dissipation device according to claim 1, characterized in that: A mounting groove (21) is formed at the bottom of the heat dissipation fin group (2); the heat sink (1) is located at the mounting groove (21) and is connected to the heat dissipation fin group (2) so that the bottoms of the heat sink (1) and the heat dissipation fin group (2) are flush.

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