Heat dissipation device, optical module equipment, switch and server

Abstract

The invention provides a heat dissipation device, optical module equipment, a switch and a server, and relates to the technical field of heat dissipation devices, and the heat dissipation device comprises a first heat dissipation part which is configured to form heat conduction with a heating element; a second heat dissipation portion configured to form heat conduction with the cooling element; the elastic part is arranged on one of the first heat dissipation part and the second heat dissipation part and extends into the other one of the first heat dissipation part and the second heat dissipation part; wherein the elastic part has an original state and a compression state in which the elastic part is pressed to deform, the elastic part in the original state has a first contact area with the other one, the elastic part in the compression state has a second contact area with the other one, and the second contact area is larger than the first contact area, so that the elastic part is connected with the other one and forms heat conduction.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation devices, and in particular to a heat dissipation device. In addition, the present invention also relates to an optical module device, a switch and a server comprising the heat dissipation device. Background Art

[0002] As the speed of optical modules increases, the overall power consumption of optical modules also increases accordingly. Traditional air cooling can no longer meet the heat dissipation requirements of optical modules and devices equipped with optical modules. Therefore, the prior art also configures liquid cooling for optical modules.

[0003] Based on the requirements of liquid cooling, an elastic device that can apply pressure to the optical module close to the cooling element will be configured on the side of the optical module away from the cooling element, so that the optical module and the cooling element have good contact, thereby having a higher heat dissipation efficiency. However, due to factors such as the flatness of the contact surface between the optical module and the cooling element, assembly errors, and the uniformity of the pressure provided by the elastic device, it is easy to cause the optical module and the cooling element to fail to form a good surface contact, thereby reducing the heat dissipation efficiency.

[0004] In view of this, how to provide a heat dissipation device so that the optical module and the equipment equipped with the optical module can achieve good heat dissipation has become a technical problem that needs to be solved urgently. Summary of the invention

[0005] In order to solve at least one of the above-mentioned and other technical problems in the prior art, the present invention provides a heat dissipation device, an optical module device, a switch and a server. The heat dissipation device is located between a heating element and a cooling element. The elastic part applies opposite pressures to the first heat dissipation part and the second heat dissipation part so that the heat dissipation device and the heating element and the cooling element form good heat conduction. In addition, since the elastic part in a compressed state has a large contact area with the first heat dissipation part or the second heat dissipation part, the thermal resistance between the first heat dissipation part and the second heat dissipation part is also reduced.

[0006] An embodiment of the present invention provides a heat dissipation device, comprising: a first heat dissipation portion, configured to form heat conduction with a heating element; a second heat dissipation portion, configured to form heat conduction with a cooling element; an elastic portion, arranged on one of the first heat dissipation portion and the second heat dissipation portion, and extending into a receiving groove formed by the other; wherein the elastic portion has an original state and a compressed state of compression deformation, the elastic portion in the original state has a first contact area with the other, the elastic portion in the compressed state has a second contact area with the other, and the second contact area is greater than the first contact area, so that the elastic portion is connected to the other and forms heat conduction.

[0007] In some exemplary embodiments, the accommodating groove has a groove opening and a groove cavity; wherein the width of the groove opening is smaller than the width of the groove cavity.

[0008] In some exemplary embodiments, a through hole is formed by a portion surrounded by the elastic portion and the first heat dissipation portion, or a through hole is formed by a portion surrounded by the elastic portion and the second heat dissipation portion; when the elastic portion is in the compressed state, an area of ​​the through hole is larger than an area of ​​the elastic portion in the original state.

[0009] In some exemplary embodiments, at least a portion of the elastic portion is located in the accommodating groove; when the elastic portion is in the compressed state, the portion of the elastic portion located in the accommodating groove is compressed and deformed along a direction forming an angle with the pressure direction, and is confined to the accommodating groove.

[0010] In some exemplary embodiments, the elastic portion in the compressed state is configured to provide pressure to the first heat dissipation portion close to the heating element, so that the first heat dissipation portion is closely attached to the heating element.

[0011] In some exemplary embodiments, the first heat dissipation portion is detachably connected to the second heat dissipation portion via the elastic portion.

[0012] In some exemplary embodiments, the elastic portion is disposed on one of the first heat dissipation portion and the second heat dissipation portion, and the other of the first heat dissipation portion and the second heat dissipation portion is provided with a receiving groove; wherein the elastic portion faces the receiving groove and extends into the receiving groove.

[0013] In some exemplary embodiments, the elastic portion includes: a connecting end, which is arranged on the first heat dissipation portion or the second heat dissipation portion; a deformation end, which is arranged on the connecting end and extends into the accommodating groove; wherein at least the deformation end is made of elastic material so as to deform when subjected to pressure close to the connecting end, so that at least a portion of the deformation end fits tightly against the inner wall of the accommodating groove.

[0014] In some exemplary embodiments, the depth of the groove cavity is smaller than the height of the deformation end.

[0015] In some exemplary embodiments, the elastic portion is bent to form an elliptical arc segment with an opening to serve as the deformation end, and the opening portion of the elliptical arc segment is bent in a direction away from the opening to form the connection end.

[0016] In some exemplary embodiments, the width of the notch is smaller than the width of the groove cavity; wherein the length of the major axis of the deformation end is configured to be greater than the depth of the groove cavity, and the length of the minor axis of the deformation end is configured to be greater than the width of the notch and smaller than the width of the groove cavity.

[0017] In some exemplary embodiments, the length of the inner circumference of the above-mentioned groove cavity is configured to be less than or equal to the length of the above-mentioned elliptical arc segment.

[0018] In some exemplary embodiments, the cross-section of the groove cavity along the groove width direction is configured as one of a circle, an ellipse and a polygon.

[0019] In some exemplary embodiments, the elastic portion includes at least two connecting ends, one of which is provided with at least one deformation end; wherein at least two of the connecting ends are arranged side by side and at intervals on the first heat dissipation portion or the second heat dissipation portion.

[0020] In some exemplary embodiments, the heat dissipation device includes at least two of the above-mentioned deformation ends, and the at least two of the above-mentioned deformation ends are arranged side by side and at intervals on the above-mentioned connection end.

[0021] In some exemplary embodiments, the elastic portion is disposed on the first heat dissipation portion.

[0022] In some exemplary embodiments, the first heat dissipation portion has a first surface and a second surface that are opposite to each other; wherein the first surface faces the heating element, and the elastic portion is disposed on the second surface.

[0023] In some exemplary embodiments, the second heat dissipation portion has a third surface facing the first heat dissipation portion, and a portion of the third surface facing the elastic portion is provided with the accommodating groove; wherein the deformation end of the elastic portion extends into the accommodating groove.

[0024] In some exemplary embodiments, the second heat dissipation portion is formed on the cooling element; or, the second heat dissipation portion is connected to the cooling element.

[0025] In some exemplary embodiments, at least two of the second heat dissipation parts form heat conduction with the same cooling element; and at least two of the second heat dissipation parts are each configured with one of the first heat dissipation parts, so that at least two of the first heat dissipation parts are arranged in an array form; wherein the array form includes at least one of a row array, a column array and a ring array.

[0026] In some exemplary embodiments, the first heat dissipation portion and / or the second heat dissipation portion is configured as a plate-shaped structure.

[0027] In some exemplary embodiments, the cooling element includes: a substrate; a cold pipe, which is arranged on the substrate and forms heat conduction with the substrate, and the cold pipe has a circulating cooling medium; wherein the second heat dissipation part is formed on the substrate, or the second heat dissipation part is connected to the substrate.

[0028] In some exemplary embodiments, the cooling element further includes a cover plate, and the cover plate is disposed on the substrate.

[0029] The present invention also provides an optical module device, comprising: a bracket, provided with at least one installation position for installing the optical module; a cooling element, arranged above the above installation position; and a heat dissipation device, arranged at the bottom of the above cooling element and suspended above the above installation position.

[0030] In some exemplary embodiments, when the optical module is installed at the installation position, the second heat dissipation portion of the heat dissipation device, the first heat dissipation portion of the heat dissipation device and the optical module are stacked; the elastic portion of the heat dissipation device is located between the second heat dissipation portion and the first heat dissipation portion, and is in a compressed state, so as to be connected to the second heat dissipation portion and form heat conduction, and also to make the first heat dissipation portion fit tightly to the optical module.

[0031] In some exemplary embodiments, each of the mounting positions is used to mount one of the optical modules, and one of the optical modules abuts against one of the first heat dissipation parts.

[0032] In some exemplary embodiments, the bracket has a first mounting area and a second mounting area that are stacked; wherein the first mounting area and the second mounting area respectively have at least one mounting position; the optical module device includes at least two cooling elements, a portion of the cooling elements are arranged in the first mounting area, and another portion of the cooling elements are arranged in the second mounting area.

[0033] In some exemplary embodiments, the bracket includes a top plate and a bottom plate facing each other, and a side plate disposed between the top plate and the bottom plate, and the portion surrounded by the top plate, the bottom plate and the side plates forms a storage space; the bracket also includes a first partition plate disposed between the two opposite side plates to separate the storage space into the first installation area and the second installation area in a stacked manner.

[0034] In some exemplary embodiments, the top plate and the first partition are provided with a first mounting hole; wherein the first heat dissipation portion abuts against the first partition, and the elastic portion provided on the first heat dissipation portion is connected to the second heat dissipation portion via the first mounting hole.

[0035] In some exemplary embodiments, the support further includes a second partition plate, and the second partition plate is arranged on the first partition plate in parallel and spaced apart;

[0036] At least one of the cooling elements is located on the top plate, and at least another of the cooling elements is located between the second baffle plate and the first baffle plate.

[0037] In some exemplary embodiments, the bracket further includes a third partition, which is disposed between the top plate and the bottom plate, and the installation position is defined between the third partition, the first partition and the top plate or the bottom plate; wherein the side plate and the third partition both have a second installation hole extending along the first direction, and the cooling element is disposed on the side plate and the third partition through the second installation hole.

[0038] In some exemplary embodiments, the optical module device also includes: a wiring portion, configured to be electrically connected to the above-mentioned optical module to electrically connect the above-mentioned optical module to the circuit structure, and the above-mentioned wiring portion is arranged at the end of the above-mentioned bracket along the second direction; wherein the above-mentioned first direction is orthogonal to the above-mentioned second direction.

[0039] In some exemplary embodiments, the optical module device further includes a shunt element having at least two branches therein; each of the branches is respectively connected to one of the cooling elements and a liquid source storing a cooling medium to distribute the cooling medium between different cooling elements.

[0040] An embodiment of the present invention further provides a switch, comprising: an optical module device; and an optical module, which is arranged at the installation position of the optical module device.

[0041] An embodiment of the present invention further provides a server, comprising: an optical module device; and an optical module, which is arranged at the installation position of the optical module device.

[0042] According to the heat sink, optical module equipment, switch and server provided by the embodiments of the present invention, the heat sink is located between the heating element and the cooling element, wherein the first heat sink and the second heat sink are connected by an elastic portion to form heat conduction. The elastic portion also applies pressure close to the heating element to the first heat sink so that the first heat sink fits closely with the heating element, thereby reducing thermal resistance. In addition, the elastic portion in the compressed state is deformed, and through the deformation, it has a larger contact area with the first heat sink or the second heat sink than in the original state, so as to reduce the thermal resistance between the first heat sink and the second heat sink, thereby improving the heat dissipation capacity of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1is a cross-sectional schematic diagram of a heat dissipation device according to an exemplary embodiment of the present invention, showing the original state and the compressed state of the elastic part, Figure 1 (a) shows the elastic part in the original state, Figure 1 (b) shows the elastic portion in a compressed state;

[0044] Figure 2 is a cross-sectional schematic diagram of a heat dissipation device of another exemplary embodiment;

[0045] Figure 3 is a cross-sectional schematic diagram of a heat dissipation device of another exemplary embodiment;

[0046] Figure 4 yes Figure 1 A partial enlarged view of the X portion of the exemplary embodiment shown;

[0047] Figure 5 yes Figure 4 A perspective view of the elastic portion shown;

[0048] Figure 6 is a perspective view of an optical module device according to an exemplary embodiment of the present invention;

[0049] Figure 7 yes Figure 6 The optical module device shown is a stereoscopic diagram with circuit structure omitted;

[0050] Figure 8 yes Figure 7 A three-dimensional view of the upper first heat dissipation portion of the optical module device shown;

[0051] Fig. 9 yes Figure 7 A three-dimensional view of the lower first heat dissipation portion of the optical module device shown;

[0052] Fig.10 yes Figure 6 A three-dimensional view of a bracket of the optical module device shown in FIG. 1 from a top view;

[0053] Fig.11 yes Figure 6 A three-dimensional view of the first partition plate and the second partition plate of the optical module device shown;

[0054] Fig.12 yes Figure 8 The bracket of the optical module device shown is configured with a first heat dissipation portion and an elastic portion in a usage state;

[0055] Fig.13 yes Figure 6 An exploded view of the cooling element of the optical module device shown;

[0056] Fig.14 yes Figure 6 An exploded view of the parts of the shunt element of the optical module device is shown.

[0057] In the drawings, the meanings of the reference numerals are as follows:

[0058] 1. heat dissipation device; 11. first heat dissipation part; 111. first surface; 112. second surface; 11A. upper first heat dissipation part; 11B. lower first heat dissipation part; 12. second heat dissipation part; 121. receiving groove; 1211. notch; 1212. groove cavity; 122. third surface; 13. cooling element; 13A. first cooling element; 13B. second cooling element; 131. substrate; 132. cooling pipe; 133. cover plate; 14. elastic part; 141. connection end; 142. deformation end;

[0059] 2. Bracket; 21. Top plate; 211. First mounting hole; 22. Side plate; 221. Second mounting hole; 23. First partition plate; 24. Third partition plate; 25. Bottom plate; 26. Mounting position;

[0060] 3. flow dividing element; 31. water divider base; 32. water divider cover plate; 33. first water nozzle; 34. second water nozzle;

[0061] 4. Circuit structure;

[0062] 5. Optical module;

[0063] 6. Wiring section. DETAILED DESCRIPTION

[0064] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0065] The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0066] All terms used herein, including technical and scientific terms, have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0067] When using expressions such as "at least one of A, B, and C, etc.", it should generally be interpreted as the meaning of the expression generally understood by those skilled in the art. For example, "a system having at least one of A, B, and C" should include but not be limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc. When using expressions such as "at least one of A, B, or C, etc.", it should generally be interpreted as the meaning of the expression generally understood by those skilled in the art. For example, "a system having at least one of A, B, or C" should include but not be limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.

[0068] The prior art mainly sets the heat dissipation device on the side of the heating element away from the cooling element. At this time, the heat dissipation device mainly provides pressure to the heating element close to the cooling element, so that the heating element and the cooling element fit closely to form a larger contact area, thereby reducing the thermal resistance between the heating element and the cooling element.

[0069] However, due to the flatness of the contact surface between the heating element and the cooling element, assembly error, uniformity of the pressure provided by the elastic device and other factors, the pressure provided by the heat dissipation device on the heating element is often not perpendicular to the contact surface. Therefore, when observed from the outside, although the heating element and the cooling element are in the form of surface contact, the actual contact position may only form point contact or line contact. Therefore, the actual contact area between the heating element and the cooling element is often small, which leads to poor heat dissipation effect.

[0070] Therefore, how to provide a heat dissipation device that can achieve good heat conduction between the heating element and the cooling element has become a technical problem that needs to be solved urgently.

[0071] Figure 1 is a cross-sectional schematic diagram of a heat dissipation device according to an exemplary embodiment of the present invention, showing an original state and a compressed state of an elastic portion.

[0072] According to the heat dissipation device provided by the present invention, Figure 1As shown, it includes a first heat dissipation part 11, a second heat dissipation part 12 and an elastic part 14. The first heat dissipation part 11 is configured to form heat conduction with the heating element. The second heat dissipation part 12 is configured to form heat conduction with the cooling element 13. The elastic part 14 is arranged in one of the first heat dissipation part 11 and the second heat dissipation part 12, and extends into the receiving groove 121 formed by the other. Among them, the elastic part 14 has an original state and a compressed state of compression deformation. The elastic part 14 in the original state has a first contact area with the other, and the elastic part 14 in the compressed state has a second contact area with the other, and the second contact area is greater than the first contact area, so that the elastic part 14 is connected to the other and forms heat conduction.

[0073] In such an embodiment, the heat sink 1 is located between the heating element (such as the optical module in the following embodiment) and the cooling element 13 (or between the main bodies of the cooling element 13, which will be described in the following embodiment), and the heating element and the cooling element 13 indirectly form heat conduction through the heat sink 1. At this time, since the position where the elastic part 14 applies pressure is closer to the heating element and the cooling element 13 than in the prior art, the direction of applying the pressure is more conducive to being orthogonal to the heating element and the cooling element 13, and since the elastic part 14 applies pressure close to the heating element to the first heat sink 11, it is also conducive to making the first heat sink 11 and the heating element fit more closely.

[0074] In addition, the elastic portion 14 extends into the first heat dissipation portion 11 or the second heat dissipation portion 12, and also expands more space along the thickness direction of the first heat dissipation portion 11 or the second heat dissipation portion 12, which not only shortens the heat transfer distance but also expands the heat dissipation area. Therefore, it is more conducive to heat conduction, so that the heat dissipation device 1 has a better heat dissipation effect.

[0075] Reference Figure 1 As shown, according to an embodiment of the present invention, the elastic portion 14 is disposed on the first heat dissipation portion 11 .

[0076] Reference Figure 1 As shown, according to an embodiment of the present invention, the first heat dissipation portion 11 has a first surface 111 and a second surface 112 that are separated from each other. Figure 1 The lower end surface shown in FIG. 1 faces the heating element, and the elastic portion 14 is disposed on the second surface 112 (i.e. Figure 1 upper end surface shown).

[0077] Reference Figure 1 As shown, according to an embodiment of the present invention, the second heat dissipation portion 12 has a third surface 122 facing the first heat dissipation portion 11, and a portion of the third surface 122 facing the elastic portion 14 is provided with an accommodation groove 121. The deformation end 142 of the elastic portion 14 extends into the accommodation groove 121.

[0078] Reference Figure 1 As shown, in some exemplary embodiments, the second heat dissipation portion 12 and the first heat dissipation portion 11 are stacked, and the second heat dissipation portion 12 is located above the first heat dissipation portion 11. Figure 1 The elastic portion 14 may be disposed on the first heat dissipation portion 11 and extend into the second heat dissipation portion 12.

[0079] Continue to refer to Figure 1 As shown in (a), the elastic part 14 is in the original state. At this time, it can be considered that no heating element that needs to dissipate heat is arranged below the first heat dissipation part 11. In this state, the first heat dissipation part 11 is connected to the second heat dissipation part 12 through the elastic part 14, and the end faces of the second heat dissipation part 12 facing the first heat dissipation part 11 are separated, that is, it can be considered that the second heat dissipation part 12 is in contact with the first heat dissipation part 11 only through the portion where the elastic part 14 and the second heat dissipation part 12 are joined (the joined portion forms the first contact area).

[0080] According to an embodiment of the present invention, the elastic portion 14 in a compressed state is configured to provide pressure to the first heat dissipation portion 11 to approach the heating element, so that the first heat dissipation portion 11 is closely attached to the heating element.

[0081] Reference Figure 1 As shown in (b), the elastic part 14 in a compressed state is shown. At this time, it can be considered that a heating element is arranged below the first heat dissipation part 11.

[0082] In this state, the heating element presses against the first surface 111 (i.e., the lower end surface) of the first heat dissipation part 11, thereby causing the first heat dissipation part 11 to move upward as a whole, which causes the two ends (i.e., the upper end and the lower end) of the elastic part 14 to respectively press against the second heat dissipation part 12 and the first heat dissipation part 11, thereby causing the elastic part 14 to undergo elastic deformation. The elastic part 14 that undergoes elastic deformation further fits with the second heat dissipation part 12, thereby increasing the contact area between the elastic part 14 and the second heat dissipation part 12, i.e., changing from the first contact area to the second contact area. At the same time, since the first heat dissipation part 11 also moves upward as a whole, for this reason, the second surface 112 (i.e., the upper end surface) of the first heat dissipation part 11 also closely fits with the second heat dissipation part 12, thereby further and directly increasing the contact area between the first heat dissipation part 11 and the second heat dissipation part 12.

[0083] It should be noted that, since the portion where the elastic portion 14 is connected to the first heat dissipation portion 11 (ie, the connection end 141 in the following embodiment) is relatively thin, Figure 1As shown in (b), although the connection end 141 will block the first heat dissipation part 11 and the second heat dissipation part 12 when the first heat dissipation part 11 and the second heat dissipation part 12 are tightly attached, good contact and heat conduction can still be formed between the elastic part 14 and the first heat dissipation part 11, and between the elastic part 14 and the second heat dissipation part 12.

[0084] On this basis, in order to further prevent the connection end 141 of the elastic part 14 from blocking the first heat dissipation part 11 and the second heat dissipation part 12, resulting in the problem that the first heat dissipation part 11 and the second heat dissipation part 12 cannot form a good surface contact. A groove can be set on the third surface 122 of the second heat dissipation part 12, and the groove should face the connection end 141 of the elastic part 14, and the groove depth of the groove should be configured to be greater than or equal to the thickness of the connection end 141, so that when the elastic part 14 is in a compressed state, the connection end 141 is just embedded in the groove. In this way, the facing end surfaces of the first heat dissipation part 11 and the second heat dissipation part 12 (i.e., the second surface 112 and the third surface 122) can be closely fitted, so that the first heat dissipation part 11 and the second heat dissipation part 12 form a larger contact area for more effective heat conduction. It should be understood that the embodiments of the present invention are not limited to this.

[0085] Figure 2 is a cross-sectional schematic diagram of a heat dissipation device of another exemplary embodiment.

[0086] Reference Figure 2 As shown, in some other exemplary embodiments, the second heat dissipation portion 12 and the first heat dissipation portion 11 are stacked, and the second heat dissipation portion 12 is located above the first heat dissipation portion 11. Figure 1 (not shown in the figure, specifically, it may be an optical module 5, which will be described in detail in the following embodiments) located below the first heat dissipation portion 11. Figure 1 The embodiment shown is different in that the elastic portion 14 is disposed on the second heat dissipation portion 12 and extends into the first heat dissipation portion 11. In this embodiment, only the position of the elastic portion 14 is different from that of the embodiment shown in FIG. Figure 1 The embodiment shown is opposite, but the deformation mode based on the original state and the compression state of the elastic part 14 and the principle of increasing the contact area are similar to those of the above embodiment, so they are not described again.

[0087] Continue to refer to Figure 1 and Figure 2 As shown, according to an embodiment of the present invention, the second heat dissipation portion 12 is formed on the cooling element 13. That is, the second heat dissipation portion 12 can be a part of the cooling element 13, that is, there is no joint surface between the second heat dissipation portion 12 and the cooling element 13, and the third surface 122 of the second heat dissipation portion 12 can be regarded as the lower end surface of the cooling element 13. Among them, the main body of the cooling element 13 can be understood as the part of the substrate 131 provided with a groove to accommodate the cold pipe 132.

[0088] Reference Figure 1 and Figure 2 As shown, in some exemplary embodiments, the second heat dissipation part 12 and the cooling element 13 are formed integrally, including but not limited to. In this way, since there is no difference in thermal resistance between the second heat dissipation part 12 and the cooling element 13, good thermal conductivity is achieved.

[0089] Reference Figure 1 and Figure 2 As shown, according to an embodiment of the present invention, the cooling element 13 includes a substrate 131 and a cold pipe 132. The cold pipe 132 is disposed on the substrate 131 and forms heat conduction with the substrate 131, and a circulating cooling medium is contained in the cold pipe 132. The second heat dissipation portion 12 is formed on the substrate 131, or the second heat dissipation portion 12 is connected to the substrate 131.

[0090] Reference Figure 1 and Figure 2 As shown, according to an embodiment of the present invention, the cooling element 13 further includes a cover plate 133 , and the cover plate 133 is disposed on the base plate 131 .

[0091] Reference Figure 1 and Figure 2 As shown, in some exemplary embodiments, the cooling element 13 includes but is not limited to a cold plate, specifically including a substrate 131, a cold pipe 132 and a cover plate 133 arranged on the substrate 131 (and covering the cold pipe 132). In detail, the substrate 131 has a groove, which includes but is not limited to a U-shaped groove, an S-shaped groove and a groove of any other shape. Further, the cold pipe 132 is located in the above-mentioned groove, and has a cooling medium inside, which is connected to an external circulation mechanism (such as a liquid source, a pump and at least a part of the mechanism in the heat exchanger) to carry part of the heat of the heating element to the outside of the cooling element 13 through the cooling medium for heat exchange, and then circulate with the heating element again. Among them, the substrate 131 includes but is not limited to being configured as a plate-like structure; further, the substrate 131 and / or the cold pipe 132 include but are not limited to being made of copper, copper alloy, aluminum, aluminum alloy, stainless steel and other materials with good thermal conductivity.

[0092] In addition, the cold plate needs to be equipped with an interface (such as a water nozzle) to import or export the cooling medium from the cooling element 13. In addition, the cold plate can also be equipped with fins and other heat dissipation structures that increase the heat exchange area. Furthermore, the cover plate 133 is arranged on the end surface of the base plate 131 away from the second heat dissipation part 12 to protect the base plate 131 and the cold pipe 132, and make the cooling element 13 more integrated, so that it is more beautiful when observed from the outside.

[0093] Reference Figure 1 and Figure 2As shown, in some exemplary embodiments, the first heat dissipation portion 11 and / or the second heat dissipation portion 12 are also configured as a plate-like structure to adapt to the plate-like structure of the cooling element 13. In this way, the stacked cooling element 13, the first heat dissipation portion 11 and the heating element can be attached to each other to form a surface contact, thereby having a larger contact area.

[0094] In some exemplary embodiments, at least two second heat dissipation parts 12 form heat conduction with the same cooling element 13. Moreover, at least two second heat dissipation parts 12 are each configured with a first heat dissipation part 11, so that at least two first heat dissipation parts 11 are arranged in an array form. The array form includes at least one of a row array, a column array, and a ring array.

[0095] Continuing with the above-mentioned implementation of the cold plate as a cooling element as an example, the same cold plate can be connected to multiple (such as two or more) first heat dissipation parts 11 through the elastic part 14, so that each first heat dissipation part 11 can conduct the heat generated by the respective abutting heating element to the cooling element, thereby realizing cooling of the heating element. It should be understood that the embodiments of the present invention are not limited to this.

[0096] Figure 3 is a cross-sectional schematic diagram of a heat dissipation device of another exemplary embodiment.

[0097] Reference Figure 3 As shown, according to another embodiment of the present invention, the second heat dissipation portion 12 is connected to the cooling element 13 .

[0098] Reference Figure 3 As shown, in some exemplary embodiments, the second heat dissipation part 12 and the cooling element 13 have a joint surface, and the joint surface is arranged flat. In detail, the second heat dissipation part 12 and the cooling element 13 are connected including but not limited to bonding, riveting, welding or other methods; or, the second heat dissipation part 12 may also only abut against the cooling element 13, which can reduce the additional thermal resistance between different media (for example, the second heat dissipation part 12 is welded to the cooling element 13, and the solder introduces additional thermal resistance).

[0099] In such an embodiment, the second heat dissipation portion 12 independent of the cooling element 13 is less restricted in thickness, so it can be processed more conveniently.

[0100] For example, since the thickness of the cooling element 13 is insufficient, the cooling element 13 may be directly processed to form a Figure 1 and Figure 2 The illustrated joint structure that cooperates with the elastic portion 14 may cause leakage of the cooling medium in the cooling element 13. Therefore, the joint structure that cooperates with the elastic portion 14 is configured on the second heat dissipation portion 12, which can greatly reduce the difficulty of processing.

[0101] It should be noted that, based on the implementation method in which the second heat dissipation part 12 is independent of the cooling element 13, since the force is mutual, when the elastic part 14 in the compressed state provides pressure to the first heat dissipation part 11, since the position of the first heat dissipation part 11 is restricted by the heating element, the elastic part 14 also provides pressure in the opposite direction to the second heat dissipation part 12 at the same time, so that the second heat dissipation part 12 fits tightly against the cooling element 13.

[0102] Figure 4 yes Figure 1 A partial enlarged view of section X of the exemplary embodiment shown.

[0103] Reference Figure 4 As shown, according to an embodiment of the present invention, the elastic portion 14 is disposed on one of the first heat dissipation portion 11 and the second heat dissipation portion 12, and the other of the first heat dissipation portion 11 and the second heat dissipation portion 12 is provided with a receiving groove 121. The elastic portion 14 faces the receiving groove 121 and extends into the receiving groove 121.

[0104] Reference Figure 1 and Figure 4 As shown, according to an embodiment of the present invention, the elastic portion 14 includes a connecting end 141 and a deforming end 142. The connecting end 141 is disposed on the first heat dissipation portion 11 or the second heat dissipation portion 12. The deforming end 142 is disposed on the connecting end 141 and extends into the receiving groove 121. Among them, at least the deforming end 142 is made of elastic material, so that it deforms when subjected to pressure close to the connecting end 141, so that at least a portion of the deforming end 142 is closely attached to the inner wall of the receiving groove 121.

[0105] Reference Figure 4 As shown, according to an embodiment of the present invention, the elastic portion 14 is bent to form an elliptical arc segment with an opening to serve as a deformation end 142, and the opening portion of the elliptical arc segment is bent away from the opening to form a connection end 141. Figure 1 and Figure 4 The embodiment shown in the figure takes the embodiment in which the elastic part 14 is arranged on the first heat dissipation part 11 as an example. Among them, the elliptical arc segment can be understood as the deformation end 142 bending to form a semi-closed elliptical cylinder structure. Figure 4 In the perspective facing the paper, the lower part of the cross section of the deformed end 142 has an opening, such as the two ends of the opening along the Figure 4 The dotted line portion shown is extended to form a closed approximately elliptical projection, the projection of the ellipse having a major axis (i.e., Figure 4 A) and the short axis (i.e. Figure 4 B) shown.

[0106] Reference Figure 4As shown, the portion surrounded by the elastic portion 14 and the first heat dissipation portion 11 forms a through hole, or the portion surrounded by the elastic portion 14 and the second heat dissipation portion 12 forms a through hole. When the elastic portion 14 is in a compressed state, the area of ​​the through hole is greater than the area of ​​the elastic portion 14 in an original state.

[0107] Taking the above elastic part having the deformed end 142 of the elliptical arc segment and the connecting end 141 located at the opening of the elliptical arc segment as an example, the portion surrounded by the elastic part 14 and the first heat dissipation part 11 (or the second heat dissipation part 12) in the original state can be regarded as forming an approximately elliptical through hole. The receiving groove 121 has a notch 1211 and a groove cavity 1212. When the deformed end 142 of the elastic part 14 is subjected to pressure along the long axis direction, the deformed end 142 expands along the short axis direction until it is restricted by the groove cavity 1212 of the receiving groove 121, thereby forming an approximately circular through hole. At this time, it can be considered that the length of the deformation end 142 has not undergone any visible change. Based on the isoperimetric principle, when the circumference of the ring (i.e., the length of the deformation end 142) remains unchanged, the circle is the shape with the largest area among all closed curves under a given circumference. Therefore, the area of ​​the through hole formed by the elastic portion 14 in the compressed state and the enclosed portion of the first heat dissipation portion 11 (or the second heat dissipation portion 12) is larger than the area of ​​the through hole formed by the elastic portion 14 in the original state and the enclosed portion of the first heat dissipation portion 11 (or the second heat dissipation portion 12).

[0108] Reference Figure 4 As shown, in some exemplary embodiments, the elastic portion 14 is configured as a sheet structure, and a deformation end 142 (i.e., an elliptical segment) and a connecting end 141 (i.e., the end portion of the opening position of the elliptical segment bent toward both sides) are formed in one piece. In detail, the elastic portion 14 includes but is not limited to being made of beryllium copper alloy. Furthermore, the bottom of the connecting end 141 is flatly arranged to be connected to the end surface of the first heat dissipation portion 11 (or the second heat dissipation portion 12). Among them, the elastic portion 14 includes but is not limited to being connected to the first heat dissipation portion 11 (or the second heat dissipation portion 12) by riveting, welding, bonding, integral formation and any other methods, and the corresponding first heat dissipation portion 11 includes but is not limited to using a copper plate. It should be understood that the embodiments of the present invention are not limited to this.

[0109] For example, the deformable end 142 of the elastic portion 14 may be bent from a sheet-like structure to form a butterfly shape, an oblate shape, a racetrack shape, or other smooth cylindrical structures.

[0110] For another example, the elastic portion 14 and / or the first heat dissipation portion 11 may also be made of materials other than copper and copper alloys, specifically aluminum, aluminum alloy, silver, and other materials with good thermal conductivity.

[0111] Reference Figure 4As shown, in some exemplary embodiments, the receiving groove 121 has a groove opening 1211 and a groove cavity 1212 . The width of the groove opening 1211 is smaller than the width of the groove cavity 1212 .

[0112] Reference Figure 4 As shown, according to an embodiment of the present invention, the depth of the groove cavity 1212 is less than the height of the deformation end 142 .

[0113] Reference Figure 4 As shown, in some exemplary embodiments, at least a portion of the elastic portion 14 is located in the receiving groove 121. When the elastic portion 14 is in a compressed state, the portion of the elastic portion 14 located in the receiving groove 121 (which can be understood as the above-mentioned deformation end 142) is compressed and deformed in a direction forming an angle with the pressure direction, and is confined to the receiving groove 121. Figure 4 As shown, according to an embodiment of the present invention, the width of the notch 1211 is smaller than the width of the slot cavity 1212. The length of the major axis of the deformed end 142 is configured to be greater than the depth of the slot cavity 1212, and the length of the minor axis of the deformed end 142 is configured to be greater than the width of the notch 1211 and less than the width of the slot cavity 1212.

[0114] Continue to refer to Figure 4 As shown, according to the embodiment of the present invention, the first heat dissipation portion 11 is detachably connected to the second heat dissipation portion 12 via the elastic portion 14 .

[0115] In some exemplary embodiments, referring to Figure 4 As shown, the receiving groove 121 is configured as a through groove structure.

[0116] In some exemplary embodiments, when the elastic portion 14 is in the original state, the elastic portion 14 is configured to be detachable from the receiving groove 121 along the groove depth direction or the groove length direction of the receiving groove 121, so that the elastic portion 14 can be detached from the receiving groove 121. And / or, when the elastic portion 14 is in the compressed state, the elastic portion 14 is configured to be restricted along both the groove depth direction and the groove length direction of the receiving groove 121, so that the elastic portion 14 cannot be detached from the receiving groove 121.

[0117] Continue to refer to Figure 4 As shown, the deformed end 142 of the elastic portion 14 can be formed as follows: Figure 4The perspective shown is inserted from the opening formed by the receiving groove 121. At this time, since the width of the deformation end 142 is slightly larger than the width of the notch 1211, the two sides of the deformation end 142 facing each other will overlap the notch 1211 formed by the receiving groove 121 to form a first contact area. However, in this state, since there is no heating element configured below the first heat dissipation part 11, its lower part is suspended. That is, the position of the deformation end 142 of the elastic part 14 along the vertical direction is not restricted. When it moves downward under the action of its own weight and the self-weight of the first heat dissipation part 11, the deformation end 142 will move from the groove cavity 1212 to the position of the notch 1211, and then be squeezed and deformed. Therefore, the connection between the elastic part 14 and the receiving groove 121 in the original state is unstable. The elastic part 14 may be disengaged from the receiving groove 121 under the influence of vibration and other factors, that is, the elastic part 14 does not form an effective connection with the receiving groove 121.

[0118] Furthermore, when a heating element is disposed below the first heat dissipation portion 11, the elastic portion 14 will move upward along with the first heat dissipation portion 11. At this time, since the upper end of the deformed end 142 abuts against the top of the second heat dissipation portion 12 (i.e., the receiving groove 121), the elastic portion 14 will be subjected to Figure 4 The pressure in the up-down direction shown in the figure causes the deformable end 142 to deform in the left-right direction that is not yet restricted, which can be understood as gradually widening the short axis portion of the deformable end 142 (i.e., the deformable end 142 gradually expands in the short axis direction). In this state, since the positions of the upper and lower ends of the deformable end 142 are limited, it cannot rebound by its own elasticity until it is in close contact with the inner wall of the groove cavity 1212. At this time, since the displacement of the elastic part 14 in the up-down direction is limited, the elastic part 14 cannot be separated from the notch 1211 of the receiving groove 121. Furthermore, since the deformable end 142 is in close contact with the inner wall of the groove cavity 1212, the pressure of the deformable end 142 on the contact surface of the groove cavity 1212 is increased, and therefore, a greater friction force is formed between the elastic part 14 and the receiving groove 121. In this way, the elastic part 14 is effectively connected with the receiving groove 121, and the connection prevents the elastic part 14 from being easily separated from the second heat dissipation part 12.

[0119] Reference Figure 4 As shown, according to an embodiment of the present invention, the length of the inner circumference of the slot cavity 1212 is configured to be less than or equal to the length of the elliptical arc segment.

[0120] Further references Figure 1 and Figure 2As shown, the third surface of the second heat dissipation portion 12 may have multiple rows of receiving grooves 121. Correspondingly, the first heat dissipation portion 11 is configured with the same number of elastic portions 14 corresponding to each receiving groove 121. Further, each elastic portion 14 may include a connection end 141 and multiple deformation ends 142 formed on the same connection end 141, wherein the multiple deformation ends 142 may be arranged at intervals along the extension direction of the receiving groove 121, so that the multiple deformation ends 142 located at the same connection end 141 are extended into the same receiving groove 121.

[0121] Reference Figure 4 As shown, in some exemplary embodiments, the receiving groove 121 includes but is not limited to a through groove. Figure 4 In the perspective facing the paper, the inner wall of the groove cavity 1212 in the cross section of the receiving groove 121 forms an arc-shaped projection, and the arc-shaped projection is a major arc, and the unconnected part of the arc-shaped projection forms the notch 1211 of the receiving groove 121. Furthermore, the groove cavity 1212 and the notch 1211 form a smooth transition. Among them, the width of the notch 1211 (i.e., Figure 4 W) as shown should be configured to be smaller than the inner diameter of the approximately circular slot cavity 1212.

[0122] Continue to refer to Figure 4 As shown, with respect to the elastic portion 14 and the receiving groove 121, the height of the deformed end 142 (which can be regarded as the long axis, i.e. Figure 4 A) shown is greater than the depth of the groove cavity 1212 (i.e. Figure 4 D shown), that is, A>D. In this way, when the elastic portion 14 is in the original state, the upper end of the deformed end 142 can be pressed against the bottom of the groove cavity 1212 (that is, Figure 4 The top end shown in the figure) makes the lower end of the deformation end 142 (and the connecting end 141) exposed outside the receiving groove 121. In this way, when the heating element is assembled under the first heat dissipation part 11, the elastic part 14 will move upward with the first heat dissipation part 11 as a whole. At this time, since the upper end of the deformation end 142 is limited by the groove cavity 1212, it will be deformed immediately, so that the elastic part 14 will be deformed in time in the compressed state to make full use of the displacement of the first heat dissipation part 11.

[0123] In addition, since the length of the short axis of the deformable end 142 is configured to be greater than the width of the notch 1211 and less than the width of the groove cavity 1212, it can be seen that in the original state, most of the deformable end 142 is located in the receiving groove 121. Therefore, when the deformable end 142 is deformed, the groove cavity 1212 of the receiving groove 121 can play a guiding role to prevent the deformable end 142 from being separated from the receiving groove 121 or causing failure.

[0124] On this basis, based on the structural characteristics of the elliptical structure (i.e., the deformed end 142 configured as an elliptical segment), the major axis (i.e. Figure 4 When A) is compressed, it moves along the short axis (i.e. Figure 4 The inner periphery of the groove cavity 1212 (i.e., Figure 4 The length of P1 is configured to be less than or equal to the length of the elliptical arc segment (i.e. Figure 4 As shown in P2), and the inner wall of the groove cavity 1212 is configured as a major arc, for this reason, when the deformed end 142 is compressed to the point where the lengths of the minor axis and the major axis (which can be regarded as the inner diameter of the groove cavity 1212) are approximately the same (that is, without considering the wall thickness, it can be understood that the deformed end 142 forms an approximate circle), the deformed end 142 can fit the inner wall of the groove cavity 1212 as closely as possible, thereby having a larger contact surface (such as the second contact area mentioned above).

[0125] It should be understood that in some other embodiments of the present invention, the cross section of the groove cavity 1212 in the groove width direction can also be configured as one of a circle, an ellipse and a polygon. Among them, the cross section of the groove cavity 1212 in the groove width direction can be understood as the cross section formed by the minimum spacing position of the wall surfaces facing the groove cavity 1212.

[0126] On this basis, the cross section of the groove cavity 1212 in the groove width direction can also be configured as a circle, which can be understood as an approximate circle, that is, the circle is not closed, and the inner wall of the cross section of the groove cavity 1212 visually presents a continuous, relatively uniform curve, and has no obvious corners or protrusions. Similarly, the ellipse can be understood as an approximate ellipse.

[0127] Furthermore, the polygon can be understood as an approximate polygon, that is, the polygon is not closed, and the inner wall of the cross section of the groove cavity 1212 roughly presents a plurality of continuous line segments visually.

[0128] Figure 5 yes Figure 4 A three-dimensional view of the elastic portion shown.

[0129] Reference Figure 5 As shown, according to an embodiment of the present invention, the elastic portion 14 includes at least two deformation ends 142. The at least two deformation ends 142 are arranged side by side and spaced apart at the connection end 141.

[0130] Continue to refer to Figure 5 As shown, according to an embodiment of the present invention, the elastic portion 14 includes at least two connection ends 141, and one connection end 141 is provided with at least one deformation end 142. The at least two connection ends 141 are arranged side by side and spaced apart on the first heat dissipation portion 11 or the second heat dissipation portion 12.

[0131] Reference Figure 4 and Figure 5 As shown, the elastic part 14 includes a plurality of connection ends 141, and the plurality of connection ends 141 are arranged side by side and spaced apart. Furthermore, each connection end 141 also has a plurality of deformation ends 142, and the deformation ends 142 arranged on each connection end 141 are arranged evenly spaced apart in a direction orthogonal to the arrangement direction of the connection ends 141. Among them, the number of connection ends 141 arranged on the elastic part 14 should be consistent with the number of receiving grooves 121 arranged, that is, the plurality of deformation ends 142 arranged on each connection end 141 are arranged in the same receiving groove 121.

[0132] Continue to refer to Figure 4 and Figure 5 As shown, the same connection end 141 of each elastic part 14 is provided with a plurality of deformation ends 142. In detail, taking the above-mentioned receiving groove 121 configured as a through groove as an example, the length of the receiving groove 121 can be understood as the spacing between the openings formed at both ends of the through groove. Further, the connection end 141 of the elastic part 14 includes but is not limited to being configured to be substantially the same length as the receiving groove 121, and the number of deformation ends 142 should be as many as possible on the basis of ensuring that each deformation end 142 is located in the receiving groove 121.

[0133] For example, the plurality of connection ends 141 may also be integrally formed using a sheet structure, that is, the plurality of connection ends 141 are integral and continuous, and each connection end 141 is further formed with a plurality of deformation ends 142 .

[0134] Figure 6 is a perspective view of an optical module device according to an exemplary embodiment of the present invention.

[0135] Based on the same inventive concept, Figure 6 As shown, the present invention also provides an optical module device including a bracket 2, a cooling element 13 and a heat dissipation device 1. The bracket 2 is provided with at least one mounting position 26 for mounting the optical module 5. The cooling element 13 is arranged above the mounting position 26. The heat dissipation device 1 is arranged at the bottom of the cooling element 13 and suspended above the mounting position 26.

[0136] Reference Figure 6 As shown, the bracket 2 has a first direction (X direction), a second direction (Y direction) and a third direction (Z direction) described below. The first direction can be understood as the length direction of the bracket 2, the second direction can be understood as the width direction of the bracket 2, and the third direction can be understood as the height direction of the bracket 2. Unless otherwise specified, the first direction, the second direction and the third direction described below can all refer to Figure 6 shown.

[0137] Based on the above embodiment of the heat dissipation device 1 , the second heat dissipation portion 12 of the heat dissipation device 1 may be independent of the cooling element 13 . In this case, the heat dissipation device 1 is located between the optical module 5 and the cooling element.

[0138] In addition, the second heat dissipation portion 12 of the heat dissipation device 1 may also be a part of the cooling element 13 , but this part (ie, the second heat dissipation portion 12 ) should be arranged between the main body of the cooling element 13 and the optical module 5 .

[0139] For example, in an embodiment in which a cold plate is used as the cooling element 13, the second heat dissipation portion 12 may be formed on the bottom surface of the substrate 131 of the cold plate, and the main body of the substrate 131 may be understood as a portion of the substrate 131 where a groove is provided to accommodate the cold pipe 132. In this embodiment, the second heat dissipation portion 12 is located between the main body of the cold plate and the optical module 5.

[0140] In such an embodiment, the heat sink 1 is located between the optical module 5 and the cooling element 13 (or the body of the cooling element 13), and the optical module 5 and the cooling element 13 indirectly form heat conduction through the heat sink 1. At this time, since the position where the elastic part 14 applies pressure is closer to the optical module 5 and the cooling element 13 than in the prior art, the direction of applying the pressure is more conducive to being orthogonal to the optical module 5 and the cooling element 13, and since the elastic part 14 applies pressure close to the optical module 5 to the first heat sink 11, it is also conducive to making the first heat sink 11 and the optical module 5 fit more closely to form good heat dissipation.

[0141] Figure 7 yes Figure 6 The optical module device shown is a three-dimensional view with the circuit structure omitted.

[0142] Reference Figure 6 and Figure 7 As shown, according to an embodiment of the present invention, the bracket 2 has a first mounting area and a second mounting area which are stacked. The first mounting area and the second mounting area each have at least one mounting position 26. The optical module device includes at least two cooling elements 13, a portion of the cooling elements 13 is arranged in the first mounting area, and another portion of the cooling elements 13 is arranged in the second mounting area. The optical module 5 can also be called an optical transceiver or an optical fiber transceiver, which is an electronic device for sending and receiving optical signals in an optical communication system. Figure 7 The illustrated embodiment has two cooling elements 13 , which are arranged parallel and spaced apart in the height direction (Z direction) of the support 2 .

[0143] Reference Figure 7As shown, according to an embodiment of the present invention, the bracket 2 includes a top plate 21 and a bottom plate 25 disposed opposite to each other, and a side plate 22 disposed between the top plate 21 and the bottom plate 25, and the portion surrounded by the top plate 21, the bottom plate 25 and the side plate 22 forms a receiving space. The bracket also includes a first partition plate 23 disposed between two opposite side plates 22 to divide the receiving space into a first installation area and a second installation area in a stacked manner.

[0144] Reference Figure 7 As shown, according to an embodiment of the present invention, the bracket 2 further includes a third partition plate 24, and the third partition plate 24 is disposed between the top plate 21 and the bottom plate 25. The side plate 22 and the third partition plate 24 both have a second mounting hole 221 extending along the first direction, and the cooling element 13 is disposed on the side plate 22 and the third partition plate 24 through the second mounting hole 221.

[0145] Reference Figure 7 As shown, in some exemplary embodiments, the bracket 2 includes but is not limited to being a light cage, including two side panels 22 arranged in a plane along the second direction (Y direction) and the third direction (Z direction), and a top panel 21 and a bottom panel 25 arranged in a plane along the first direction (X direction) and the second direction (Y direction) between the two side panels 22, wherein the top panel 21 is located above the bottom panel 25, so that the bracket 2 forms a substantially cubic structure. Furthermore, in the accommodation space surrounded by the top panel 21, the side panels 22 and the bottom panel 25, a first partition 23 parallel to the top panel 21 and a third partition 24 parallel to the side panels 22 are also provided to divide the accommodation space into a plurality of (including but not limited to as Figure 7 8) mounting positions 26 shown in the figure, each mounting position 26 is suitable for mounting one optical module 5. In this way, each mounting position 26 can be independently mounted with an optical module 5 without affecting other mounting positions 26.

[0146] Reference Figure 7 As shown, according to an embodiment of the present invention, the optical module device further includes: a wiring portion 6 configured to be electrically connected to the optical module to electrically connect the optical module to the circuit structure 4, and the wiring portion 6 is arranged at the end of the bracket 2 along the second direction. The first direction is orthogonal to the second direction.

[0147] Reference Figure 7As shown, in some exemplary embodiments, the bracket 2 has a front end and a rear end, wherein the front end can be understood as an end having an opening for placing the optical module 5, and conversely, the rear end can be understood as an end provided with a wiring terminal. Furthermore, the bracket 2 also has an interface connected to the wiring terminal, so that when the optical module 5 is placed in the installation position through the front end of the bracket 2, the optical module 5 can be connected to the wiring portion 6 through the interface, and then form an electrical connection with the circuit structure 4 (such as a printed circuit board, i.e., PCB) arranged below the bracket to form a signal transmission.

[0148] Reference Figure 7 As shown, in some exemplary embodiments, the side plate 22 and the third partition plate 24 are further provided with a second mounting hole 221 penetrating along the second direction (Y direction). In detail, the second mounting hole 221 includes but is not limited to a substantially rectangular opening, and the shape and size of the second mounting hole 221 should be configured to be substantially the same as the external shape and size of the cooling element 13, so that the cooling element 13 can be inserted into the accommodation space through the second mounting hole 221.

[0149] Figure 8 yes Figure 7 A three-dimensional view of the upper first heat dissipation portion of the optical module device is shown. Fig. 9 yes Figure 7 A three-dimensional view of the lower first heat dissipation portion of the optical module device is shown.

[0150] Reference Figures 6 to 9 As shown, in some exemplary embodiments, to adapt to the following Figure 7 The double-layer bracket 2 shown in FIG. 1 (i.e., a bracket having a stacked first mounting area and a second mounting area) is respectively configured as follows: Figure 8 The first heat dissipation portion 11A shown in FIG. Fig. 9 The first heat dissipation portion 11B is shown.

[0151] The upper first heat dissipation portion 11A is disposed under the top plate 21, and the portion thereof facing the first mounting hole 211 disposed on the top plate 21 is provided with an elastic portion 14, and the elastic portion 14 extends out of the first mounting hole 211 to connect to the cooling element 13 ( Figures 6 to 9 The lower first heat dissipation portion 11B is disposed under the first baffle 23, and the portion thereof facing the first mounting hole 211 disposed on the first baffle 23 is provided with an elastic portion 14, and the elastic portion 14 extends out of the first mounting hole 211 to connect with the cooling element 13 ( Figures 7 to 9 , which is not shown, can be understood as the second cooling element 13B described below).

[0152] Fig.10 yes Figure 6A three-dimensional view of a bracket of the optical module device is shown from a top view.

[0153] Reference Fig.10 As shown, according to an embodiment of the present invention, the top plate 21 and the first partition plate 23 are provided with a first mounting hole 211 , wherein the first heat dissipation portion 11 abuts against the first partition plate 23 , and the elastic portion 14 provided on the first heat dissipation portion 11 is connected to the second heat dissipation portion 12 via the first mounting hole 211 .

[0154] Fig.11 yes Figure 6 A three-dimensional view of the first partition plate and the second partition plate of the optical module device is shown.

[0155] Reference Fig.11 As shown, according to an embodiment of the present invention, the first partition 23 divides the accommodation space in the bracket 2 into two areas, an upper area and a lower area (i.e., a first installation area and a second installation area). To meet the heat dissipation needs of the optical module 5 located in the two areas, the first partition 23 and the top plate 21 are provided with a substantially rectangular first installation hole 211, and the first installation hole 211 can be configured to be slightly smaller than the size of the first heat dissipation part 11 of the heat dissipation device 1. In this way, when the first heat dissipation part 11 (including the elastic part 14) is arranged in the first installation hole 211, the first heat dissipation part 11 can be supported by the top plate 21 or the first partition 23 to prevent it from falling from the first installation hole 211 (for details, please refer to Figure 7 status of use).

[0156] Reference Fig.11 As shown, according to an embodiment of the present invention, the bracket 2 further includes a second partition plate 27. The second partition plate 27 is arranged on the first partition plate 23 in parallel and spaced apart. At least one cooling element 13 is located on the top plate 21, and at least another cooling element 13 is located between the second partition plate 27 and the first partition plate 23.

[0157] Reference Fig.11 As shown, in some exemplary embodiments, the first partition plate 23, the second partition plate 27 and the third partition plate 24 are integrally formed and bent to form a substantially cubic box-like structure, wherein the second partition plate 27 is used as an upper plate of the box-like structure, the third partition plate 24 is used as a vertical plate, and the first partition plate 23 is used as a lower plate. In detail, the opening area formed between the first partition plates 23 is used as a first mounting hole of the first partition plate 23, and the third partition plate 24 is provided with a second mounting hole.

[0158] In such an embodiment, the cooling element 13 ( Fig.11 The portion of the optical module 5 (not shown) extending into the bracket 2 is arranged in the second mounting hole formed by the third partition plate 24, and extends to the first mounting hole formed by the first partition plate 23. Fig.11The second partition plate 27 (not shown) is abutted between the cooling element 13 and the first partition plate 23. The upper end surface of the second partition plate 27 is used to set another optical module 5 to be supported on the lower end surface of the optical module 5 located at the upper part. Fig.12 yes Figure 8 The bracket of the optical module device shown in the figure is configured with the first heat dissipation part and the elastic part in the use state

[0159] Reference Fig.12 As shown, according to an embodiment of the present invention, when the optical module 5 is installed at the installation position 26, the second heat dissipation portion 12 of the heat dissipation device 1, the first heat dissipation portion 11 of the heat dissipation device 1 and the optical module 5 are stacked. The elastic portion 14 of the heat dissipation device 1 is located between the second heat dissipation portion 12 and the first heat dissipation portion 11 and is in a compressed state to connect with the second heat dissipation portion 12 and form heat conduction, and also to make the first heat dissipation portion 11 closely fit the optical module.

[0160] Reference Fig.12 As shown, according to an embodiment of the present invention, one mounting position 26 is used to mount one optical module 5 , and one optical module 5 abuts against one first heat dissipation portion 11 .

[0161] Reference Fig.12 As shown, in some exemplary embodiments, the second heat dissipation portion 12 of the heat dissipation device 1 includes but is not limited to being a portion of the cooling element 13 (such as a portion of the substrate 131 of the cold plate), and the length of the cooling element 13 should be configured to be at least greater than the length of the two mounting positions 26, so that one cooling element 13 can extend to at least two mounting positions 26, and be connected to the first heat dissipation portions 11 configured in the two mounting positions through the elastic portions 14 (in a compressed state) configured respectively, and form heat conduction with the above-mentioned at least two first heat dissipation portions 11, thereby dissipating heat for multiple optical modules 5 located in the same area (i.e., the first mounting area or the second mounting area).

[0162] by Fig.12 Taking the illustrated embodiment as an example, the length (i.e., the dimension along the X direction) of each cooling unit 13 can be configured to be substantially the same as the dimension of the base plate 25 (or the top plate 21, which is blocked and not shown), so that each cooling unit 13 can pass through each installation position 26 located in the same area, thereby achieving heat exchange for the optical module 5 in each installation position 26.

[0163] Reference Fig.12As shown, in order to distinguish the cooling elements 13 arranged on the top plate 21 and the first partition plate 23, the cooling element 13 arranged on the top plate 21 is characterized as the first cooling element 13A, and the cooling element 13 arranged on the first partition plate 23 is characterized as the second cooling element 13B. In detail, the first cooling element 13A includes but is not limited to being connected to the top plate 21, and can be connected by welding, riveting, bonding, snap connection or any other method; similarly, the second cooling element 13B is limited to the first partition plate 23. In addition to the above connection method, since the second cooling element 13B is located in the bracket 2, there may be inconvenient operation. For this reason, the second cooling element 13B can be limited by configuring the size and shape of the second mounting hole 221, so that the positions of the first cooling element 13A and the second cooling element 13B along the third direction (Z direction) are limited.

[0164] In such an implementation, since the positions of the first cooling element 13A and the second cooling element 13B along the third direction (Z direction) are restricted, it can be considered that the position of the second heat dissipation portion 12 of the heat dissipation device 1 is restricted (the second heat dissipation portion 12 is a part of the cooling element 13). In this way, when the optical module 5 is inserted from the bracket opening, when the first heat dissipation portion 11 (including the elastic portion 14) of the heat dissipation device 1 moves upward, the second heat dissipation portion 12 will not be pressed upward by the elastic portion 14, thereby causing one end of the second cooling element 13 to tilt up. For this reason, the optical modules 5 in each installation position 26 can be installed without affecting each other, and good heat dissipation can be achieved. It should be noted that the matching method and heat dissipation principle of the first heat dissipation portion 11, the elastic portion and the second heat dissipation portion 12 have been explained in the above-mentioned implementation of the heat dissipation device 1, so it will not be repeated here.

[0165] Fig.13 yes Figure 6 An exploded view of the cooling element of the optical module device is shown. Fig.14 yes Figure 6 An exploded view of the parts of the shunt element of the optical module device is shown.

[0166] Reference Figure 6 , Fig.13 and Fig.14 As shown, according to an embodiment of the present invention, the optical module device further comprises a flow dividing element 3, wherein the flow dividing element 3 has at least two branches. Each branch is respectively connected to a cooling element 13 and a liquid source storing a cooling medium, so as to distribute the cooling medium among different cooling elements 13.

[0167] Reference Figure 6 and Fig.13As shown, in some exemplary embodiments, the cooling element 13 includes but is not limited to a cold plate, specifically including a base plate 131, a cold pipe 132, and a cover plate 133 that is arranged on the base plate 131 (and covers the cold pipe 132). In detail, the base plate 131 has a groove, which is U-shaped, and the corresponding cold pipe 132 is also configured as a U-shaped structure to be embedded in the groove. Among them, one end of the U-shaped cold pipe is used as a water inlet end, and the other end is used as a water return end.

[0168] Reference Fig.14 As shown, in some exemplary embodiments, the diverter element 3 includes a diverter base 31, a diverter cover 32, a first water nozzle 33 and a second water nozzle 34. In detail, the diverter element 3 is arranged outside the side plate of the bracket 2 having the second mounting hole 221, and covers the second mounting hole 221. Further, the diverter base 31 has a diverter trough and a return trough, the diverter cover 32 closes the diverter trough and the return trough, and is provided with a through hole connected to the cold pipe of the cold plate. Among them, the water inlet end and the return end of the cold pipe 132 are respectively connected to a through hole to respectively connect the diverter trough and the return trough. Furthermore, the first water nozzle 33 and the second water nozzle 34 are also connected to the beam splitter base 31 to introduce or lead the cooling medium into or out of the diverter element 3.

[0169] The present invention also provides a switch, comprising the optical module device in the above embodiment and an optical module 5, wherein the optical module 5 is arranged at the installation position of the optical module device. The optical module 5 is suitable for converting the electrical signal generated by the switch into an optical signal for transmission on the optical fiber; at the same time, the optical module 5 can also convert the received optical signal back into an electrical signal for use by the switch.

[0170] Based on similar inventive concepts, the present invention also provides a server, comprising the optical module device in the above embodiment and the optical module 5, wherein the optical module 5 is arranged at the installation position of the optical module device. The optical module 5 is suitable for converting the electrical signal generated by the switch into an optical signal for transmission on the optical fiber; at the same time, the optical module 5 can also convert the received optical signal back into an electrical signal for use by the switch.

[0171] Based on similar inventive concepts, in switches and servers, optical module devices have similar or identical features to the above-mentioned embodiments, and also have similar or identical functions based on these features, so they are not described in detail.

[0172] The groove includes but is not limited to a U-shaped groove, an S-shaped groove and any other grooves. Furthermore, the cold pipe 132 is located in the above-mentioned groove, and has a cooling medium inside, and the cooling medium is connected to an external circulation mechanism (such as a liquid source, a pump and at least a part of the mechanism in the heat exchanger) to carry the heat of the heating element to the outside of the cooling element 13 for heat exchange, and then circulate with the heating element again. Among them, the substrate 131 includes but is not limited to being configured as a plate-like structure; further, the substrate 131 and / or the cold pipe 132 are made of but are not limited to copper, copper alloy, aluminum, aluminum alloy, stainless steel and other materials with good thermal conductivity.

[0173] In addition, the cold plate needs to be equipped with an interface to import or export the cooling medium. In addition, the cold plate can also be equipped with fins and other heat dissipation structures to increase the heat exchange area. Furthermore, the cover plate 133 is arranged on the end surface of the substrate 131 away from the second heat dissipation part 12 to protect the substrate 131 and the cold pipe 132, and make the cooling element 13 more integrated and more beautiful.

[0174] It should also be noted that the directional terms mentioned in the embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only for reference to the drawings and are not intended to limit the scope of protection of the present invention. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or configurations will be omitted when they may cause confusion in the understanding of the present invention.

[0175] The embodiments of the present invention are described above. However, these embodiments are only for the purpose of illustration, and are not intended to limit the scope of the present invention. Although each embodiment is described above, it does not mean that the measures in each embodiment cannot be used in combination. The scope of the present invention is defined by the attached claims and their equivalents. Without departing from the scope of the present invention, those skilled in the art may make various substitutions and modifications, which should all fall within the scope of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A first heat dissipation portion (11) is configured to form heat conduction with the heating element; A second heat dissipation portion (12) configured to form heat conduction with the cooling element (13); an elastic portion (14) disposed on one of the first heat dissipation portion (11) and the second heat dissipation portion (12), and extending into a receiving groove (121) formed in the other; The elastic part (14) has an original state and a compressed state in which the elastic part (14) is deformed under pressure. The elastic part (14) in the original state has a first contact area with the other part. The elastic part (14) in the compressed state has a second contact area with the other part. The second contact area is greater than the first contact area, so that the elastic part (14) is connected to the other part and forms heat conduction.

2. The heat dissipation device according to claim 1, characterized in that: The containing groove (121) has a groove opening (1211) and a groove cavity (1212); Wherein, the width of the notch (1211) is smaller than the width of the groove cavity (1212).

3. The heat dissipation device according to claim 1, characterized in that: The portion surrounded by the elastic portion (14) and the first heat dissipation portion (11) forms a through hole, or the portion surrounded by the elastic portion (14) and the second heat dissipation portion (12) forms a through hole; When the elastic part (14) is in the compressed state, the area of ​​the through hole is larger than the area of ​​the elastic part (14) when it is in the original state.

4. The heat dissipation device according to claim 1, characterized in that: At least a portion of the elastic portion (14) is located in the accommodating groove (121); When the elastic portion (14) is in the compressed state, the portion of the elastic portion (14) located in the accommodating groove (121) is compressed and deformed in a direction forming an angle with the pressure direction, and is confined in the accommodating groove (121).

5. The heat dissipation device according to claim 1, characterized in that: The elastic portion (14) in the compressed state is configured to provide pressure to the first heat dissipation portion (11) close to the heating element, so that the first heat dissipation portion (11) is closely attached to the heating element.

6. The heat dissipation device according to claim 1, characterized in that: The first heat dissipation portion (11) is detachably connected to the second heat dissipation portion (12) via the elastic portion (14).

7. The heat dissipation device according to claim 2, characterized in that: The elastic portion (14) is arranged on one of the first heat dissipation portion (11) and the second heat dissipation portion (12), and the other of the first heat dissipation portion (11) and the second heat dissipation portion (12) is provided with a receiving groove (121); Wherein, the elastic portion (14) faces the accommodating groove (121) and extends into the accommodating groove (121).

8. The heat dissipation device according to claim 7, characterized in that: The elastic portion (14) comprises: A connection end (141) is arranged on the first heat dissipation portion (11) or the second heat dissipation portion (12); A deformation end (142) is arranged at the connection end (141) and extends into the accommodation groove (121); Wherein, at least the deformable end (142) is made of elastic material so as to deform when subjected to pressure close to the connecting end (141), so that at least a portion of the deformable end (142) fits tightly against the inner wall of the containing groove (121).

9. The heat dissipation device according to claim 8, characterized in that: The depth of the groove cavity (1212) is less than the height of the deformation end (142).

10. The heat dissipation device according to claim 9, characterized in that: The elastic portion (14) is bent to form an elliptical arc segment with an opening to serve as the deformation end (142), and the opening portion of the elliptical arc segment is bent in a direction away from the opening to form the connection end (141).

11. The heat dissipation device according to claim 10, characterized in that: The length of the major axis of the deformation end (142) is configured to be greater than the depth of the groove cavity (1212), and the length of the minor axis of the deformation end (142) is configured to be greater than the width of the notch (1211) and less than the width of the groove cavity (1212).

12. The heat dissipation device according to claim 11, characterized in that: The length of the inner circumference of the groove cavity (1212) is configured to be less than or equal to the length of the elliptical arc segment.

13. The heat dissipation device according to any one of claims 9 to 12, characterized in that: The cross-section of the groove cavity (1212) along the groove width direction is configured as one of a circular shape, an elliptical shape and a polygonal shape.

14. The heat dissipation device according to any one of claims 8 to 12, characterized in that: The elastic portion (14) comprises at least two deformation ends (142), and the at least two deformation ends (142) are arranged side by side and at intervals on the connection end (141).

15. The heat dissipation device according to any one of claims 8 to 12, characterized in that: The elastic portion (14) comprises at least two connecting ends (141), and one connecting end (141) is provided with at least one deforming end (142); Wherein, at least two of the connection ends (141) are arranged side by side and at intervals on the first heat dissipation portion (11) or the second heat dissipation portion (12).

16. The heat dissipation device according to any one of claims 8 to 12, characterized in that: The elastic portion (14) is arranged on the first heat dissipation portion (11).

17. The heat dissipation device according to claim 16, characterized in that: The first heat dissipation portion (11) has a first surface (111) and a second surface (112) which are opposite to each other; Wherein, the first surface (111) faces the heating element, and the elastic portion (14) is arranged on the second surface (112).

18. The heat dissipation device according to claim 17, characterized in that: The second heat dissipation portion (12) has a third surface (122) facing the first heat dissipation portion (11), and a portion of the third surface (122) facing the elastic portion (14) is provided with the accommodation groove (121); Wherein, the deformed end (142) of the elastic portion (14) extends into the accommodating groove (121).

19. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The second heat dissipation portion (12) is formed on the cooling element (13); Alternatively, the second heat dissipation portion (12) is connected to the cooling element (13).

20. The heat dissipation device according to claim 19, characterized in that: At least two of the second heat dissipation parts (12) form heat conduction with the same cooling element (13); Furthermore, at least two of the second heat dissipation parts (12) are each configured with one of the first heat dissipation parts (11), so that at least two of the first heat dissipation parts (11) are arranged in an array form; The array form includes at least one of a row array, a column array and a ring array.

21. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The first heat dissipation portion (11) and / or the second heat dissipation portion (12) are configured as a plate-shaped structure.

22. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The cooling element (13) comprises: substrate(131); A cooling pipe (132) is arranged on the substrate (131) and forms heat conduction with the substrate (131), wherein a circulating cooling medium is contained in the cooling pipe (132); Wherein, the second heat dissipation portion (12) is formed on the substrate (131), or the second heat dissipation portion (12) is connected to the substrate (131).

23. The heat dissipation device according to claim 22, characterized in that: The cooling element (13) further comprises a cover plate (133), wherein the cover plate (133) is disposed on the base plate (131).

24. An optical module device, characterized in that: include: A bracket (2) provided with at least one mounting position (26) for mounting an optical module (5); a cooling element (13) disposed above the mounting position (26); and The heat dissipation device (1) according to any one of claims 1 to 22, is arranged at the bottom of the cooling element (13) and is suspended above the installation position (26).

25. The optical module device according to claim 24, characterized in that: When the optical module (5) is installed at the installation position (26), the second heat dissipation portion (12) of the heat dissipation device (1), the first heat dissipation portion (11) of the heat dissipation device (1) and the optical module (5) are stacked; The elastic portion (14) of the heat dissipation device (1) is located between the second heat dissipation portion (12) and the first heat dissipation portion (11) and is in a compressed state so as to be connected to the second heat dissipation portion (12) and form heat conduction, and also to enable the first heat dissipation portion (11) to fit tightly to the optical module.

26. The optical module device according to claim 25, characterized in that: Each of the mounting positions (26) is used to mount one of the optical modules (5), and one of the optical modules (5) abuts against one of the first heat dissipation portions (11).

27. The optical module device according to claim 24, characterized in that: The bracket (2) comprises a first installation area and a second installation area which are stacked; Wherein, the first installation area and the second installation area respectively have at least one installation position (26); The optical module device comprises at least two cooling elements (13), a portion of the cooling elements (13) being arranged in the first installation area, and another portion of the cooling elements (13) being arranged in the second installation area.

28. The optical module device according to claim 27, characterized in that: The bracket (2) comprises a top plate (21) and a bottom plate (25) arranged facing each other, and a side plate (22) arranged between the top plate (21) and the bottom plate (25), wherein a portion surrounded by the top plate (21), the bottom plate (25) and the side plate (22) forms a receiving space; The bracket further comprises a first partition plate (23) arranged between two opposite side plates (22) to divide the accommodation space into the first installation area and the second installation area in a stacked manner.

29. The optical module device according to claim 28, characterized in that: The top plate (21) and the first partition plate (23) are provided with a first mounting hole (211); The first heat dissipation portion (11) abuts against the first partition plate (23), and the elastic portion (14) arranged on the first heat dissipation portion (11) is connected to the second heat dissipation portion (12) via the first mounting hole (211).

30. The optical module device according to claim 29, characterized in that: The support (2) further comprises a second partition (27), wherein the second partition (27) is arranged on the first partition (23) in parallel and at intervals; At least one of the cooling elements (13) is located above the top plate (21), and at least another of the cooling elements (13) is located between the second baffle plate (27) and the first baffle plate (23).

31. The optical module device according to claim 28, characterized in that: The bracket (2) further comprises a third partition plate (24), wherein the third partition plate (24) is arranged between the top plate (21) and the bottom plate (25), and the third partition plate (24), the first partition plate (23) and the top plate (21) or the bottom plate (25) define the installation position (26); The side plate (22) and the third partition plate (24) both have a second mounting hole (221) extending through the side plate (22) in a first direction, and the cooling element (13) is disposed on the side plate (22) and the third partition plate (24) through the second mounting hole (221).

32. The optical module device according to claim 31, characterized in that: Also includes: a wiring portion (6) configured to be electrically connected to the optical module (5) so as to electrically connect the optical module (5) to the circuit structure (4), and the wiring portion (6) is arranged at an end portion of the bracket (2) along the second direction; The first direction is orthogonal to the second direction.

33. The optical module device according to any one of claims 27 to 32, characterized in that: It also includes a shunt element (3), wherein the shunt element (3) has at least two branches; Each of the branches is respectively connected to one of the cooling elements (13) and a liquid source storing a cooling medium, so as to distribute the cooling medium between different cooling elements (13).

34. A switch, characterized in that: include: The optical module device as claimed in any one of claims 24 to 33; as well as The optical module (5) is arranged at the installation position (26) of the optical module device.

35. A server, characterized in that: include: The optical module device as claimed in any one of claims 24 to 33; as well as The optical module (5) is arranged at the installation position (26) of the optical module device.

Images