LED support, LED device and side-entry backlight module

Abstract

The invention discloses an LED support, an LED device and a side-in type backlight module. The LED support comprises a lead frame, a bottom reflecting layer, a side reflecting layer and a placement cavity. The plurality of lead frames are combined with the bottom reflecting layer to form a base body of the LED bracket, and the plurality of lead frames are separated from one another after being combined with the bottom reflecting layer; the side reflecting layer is arranged on the base body, and a placement cavity is defined by the side reflecting layer; the LED device comprises a plurality of LED chips, an electric connection layer, a protection layer and the LED support. The plurality of LED chips are arranged in the placement cavity in an inverted manner, and are connected with the corresponding lead frames through the electric connection layers respectively; the protection layer is arranged in the placement cavity, covers the LED chip, covers the surface of the lead frame and the bottom reflection layer in the placement cavity, and covers the surface of the side reflection layer in the placement cavity; meanwhile, the LED device can be assembled with a PCB (Printed Circuit Board) to form a side-in type backlight module; according to the invention, the purpose of arranging a large flip chip with a long-strip-shaped small packaging size can be achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of LED lighting, and in particular relates to an LED bracket, an LED device and a side-entry backlight module. Background Art

[0002] Since the light source of the side-entry backlight is located on the side (such as the backlight module is set on the side of the electronic screen), there is no need to set a large number of lamp tubes or LED modules under the panel. Therefore, the overall structure is more compact and thin. In recent years, side-entry lamp beads have gradually developed in the direction of being smaller and thinner, and the demand for long strip lamp beads with small package size has gradually increased. Due to the increase in the demand for high brightness (lamp beads), the size of the chip (such as the light-emitting area) has shown an increasing trend. For the front-mounted chip, the welding wire requires a certain space, and the chip area cannot be increased much. Therefore, the flip chip becomes the preferred solution of the present invention. Because the lead frame in the previous long strip bracket is relatively narrow, it is difficult to connect the newly conceived dual-crystal flip chip in series. One way is to connect them in series through the lead frame of the bracket, but there is a problem of low yield in the design limit and the manufacturing process. If the solution of connecting two lamp beads in series in the module is adopted, the cost will increase. Therefore, it is currently necessary to solve the problem of connecting long strip flip chips in series with small package size.

[0003] From the above analysis, we can see that at present, there is a lack of a new type of LED bracket to achieve the purpose of setting up flip chips in long strips of small package size, to facilitate the mass production of brackets, and to ensure the quality of bracket use. At present, there is a lack of a new type of LED device to meet people's demand for high brightness. At present, there is a lack of a new type of side-entry backlight module to achieve the series connection of two flip chips inside each LED device to ensure the reliability of the entire module.

[0004] Therefore, a new technology is needed to solve the problem of lack of a new type of LED bracket in the prior art; a new technology is needed to solve the problem of lack of a new type of LED device in the prior art; a new technology is needed to solve the problem of lack of a new type of side-entry backlight module in the prior art. Summary of the invention

[0005] In order to solve the above problems in the prior art, the present invention provides an LED bracket, which is reliable and durable, has a reasonable structural design, is easy to form, has a high yield and better airtightness, and can achieve the purpose of setting up a flip chip in a long strip of small package size.

[0006] The present invention adopts the following technical solutions:

[0007] An LED bracket comprises a plurality of lead frames, a bottom reflection layer, a side reflection layer and an installation cavity; the plurality of lead frames are combined with the bottom reflection layer to form a substrate of the LED bracket, and the plurality of lead frames are spaced apart from each other after being combined with the bottom reflection layer; at least four lead frames are provided; the side reflection layer is provided on the substrate and surrounds the installation cavity, and the installation cavity is used to arrange an LED chip and a protective layer.

[0008] Furthermore, the plurality of lead frames include a first lead frame, a second lead frame, a third lead frame and a fourth lead frame; the side reflective layer includes a first side surface, a second side surface, a third side surface and a fourth side surface; one long side of the first lead frame and one long side of the second lead frame are respectively connected to the first side surface; one long side of the third lead frame and one long side of the fourth lead frame are respectively connected to the second side surface; one short side of the first lead frame and one short side of the third lead frame are respectively connected to the third side surface; one short side of the second lead frame and one short side of the fourth lead frame are respectively connected to the fourth side surface.

[0009] Furthermore, the placement cavity is in the shape of an elongated strip when viewed from above; the length of the first side surface is equal to the length of the second side surface; the length of the third side surface is equal to the length of the fourth side surface; the length of the first side surface is greater than the length of the third side surface; and the ratio of the long side of the LED bracket to the short side of the LED bracket is in the range of 1.25 to 4.5.

[0010] Furthermore, the first lead frame is equal in size to the fourth lead frame located diagonally opposite to it; the second lead frame is located on the same side of the first lead frame, and the second lead frame is equal in size to the third lead frame located on the side opposite to the first lead frame.

[0011] Furthermore, the height of the third side surface is equal to the height of the fourth side surface, the height of the first side surface is equal to the height of the second side surface; and the height of the third side surface is lower than or equal to the height of the first side surface.

[0012] Another object of the present invention is to provide a new type of LED device to meet people's demand for high brightness.

[0013] An LED device comprises a plurality of LED chips, an electrical connection layer, a protective layer and the LED bracket; the plurality of LED chips are flip-chip arranged in the placement cavity, and the plurality of LED chips are respectively connected to the corresponding lead frames through the electrical connection layer; the protective layer is arranged in the placement cavity, covering the LED chips, covering the surface of "the lead frame and the bottom reflection layer" in the placement cavity, and covering the surface of the side reflection layer in the placement cavity.

[0014] Furthermore, the protective layer is one of silicone and epoxy resin, or the protective layer is a mixed material of silicone and epoxy resin.

[0015] Furthermore, light conversion particles that can be excited by the LED chip are arranged in the protective layer.

[0016] Furthermore, filling particles are provided in the protective layer; the filling particles are one or more of SiO2, ZnO, and Al3O2.

[0017] Another object of the present invention is to provide a novel edge-entry backlight module to realize the series connection of two flip chips inside each LED device to ensure the reliability of the entire module.

[0018] A side-entry backlight module comprises at least one PCB board and an LED device; each of the LED devices has two LED chips; each of the LED devices has four lead frames; each of the PCB boards has a first solder pad, a second solder pad and a third solder pad; for each of the LED devices, the first solder pad is connected to the lead frame corresponding to the positive pole of the first LED chip; the second solder pad is connected to the lead frame corresponding to the negative pole of the second LED chip; the third solder pad is connected to the remaining two lead frames; each of the PCB boards has a connecting terminal, and the connecting terminal is used to connect to a power line.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] In the past, the series connection of flip chips in a long strip of small package size was extremely difficult for the design and mass production of the bracket, and the molding difficulty was high. There were problems such as insufficient filling, lack of plastic material, dark cracks in the bracket, low yield, and poor air tightness. The newly developed LED bracket of the present invention does not directly connect the chips in series through the design of the bracket, which can make the bracket easy to mold, with high yield and better air tightness. The LED bracket of the present invention is reliable and durable, with a reasonable structural design, and can achieve the purpose of setting a large flip chip or multiple flip chips in a long strip of small package size.

[0021] An LED device of the present invention has a plurality of LED chips arranged therein, which can increase the light-emitting area of ​​the chips and meet people's demand for high brightness.

[0022] The side-entry backlight module of the present invention realizes the series connection of two flip chips inside each LED device through each PCB board. This design makes the design of the new bracket of the present invention different from the past, reduces the difficulty of design and mass production, and enables the new bracket of the present invention to be formed with high quality, ensuring the reliability of the use of the entire module. The present invention realizes the series connection of two flip chips through the PCB board, and the presence of the two flip chips increases the light-emitting area of ​​the chip, so that the present invention can further improve the light-emitting brightness of the LED device in the case of a long strip of small package size, so that the present invention can better meet the needs of the market. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The technology of the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments:

[0024] Figure 1 is a top view of an LED device according to a first embodiment of the present invention;

[0025] Figure 2 yes Figure 1 A cross-sectional view of

[0026] Figure 3 yes Figure 1 A longitudinal section of

[0027] Figure 4 is a top view of an LED device according to a second embodiment of the present invention;

[0028] Figure 5 yes Figure 4 A cross-sectional view of

[0029] Figure 6 yes Figure 4 A longitudinal section of

[0030] Figure 7 is a top view of an LED device according to a third embodiment of the present invention;

[0031] Figure 8 yes Figure 7 Left view of (wherein the LED chip is indicated by a dotted line);

[0032] Fig. 9 yes Figure 7 A longitudinal section of

[0033] Fig.10 is a top view of a PCB board according to a first embodiment of the present invention;

[0034] Fig.11 yes Figure 3 LED device preparation and Fig.10 A schematic elevation diagram of the PCB boards combined together;

[0035] Fig.12 yes Figure 6 LED device preparation and Fig.10 A schematic elevation diagram of the PCB boards combined together;

[0036] Fig.13 yes Fig. 9 LED device preparation and Fig.10 A schematic elevation diagram of the PCB boards combined together;

[0037] Fig.14 is a top view of an LED device according to a fourth embodiment of the present invention;

[0038] Fig.15 yes Fig.14 A cross-sectional view of

[0039] Fig.16 yes Fig.14 A longitudinal cross-sectional view of

[0040] Fig.17 is a top view of a PCB board according to a second embodiment of the present invention;

[0041] Fig.18 yes Fig.16 LED device preparation and Fig.17 Schematic diagram of the elevation of the PCB boards combined together.

[0042] Reference numerals:

[0043] 1-lead frame; 11-first lead frame; 12-second lead frame; 13-third lead frame; 14-fourth lead frame;

[0044] 2-bottom reflection layer; 3-side reflection layer; 31-first side surface; 32-second side surface; 33-third side surface; 34-fourth side surface; C-inclined surface;

[0045] A-substrate; B-housing cavity;

[0046] 6-LED device; 61-LED chip; D-the first LED chip; E-the second LED chip; 62-protective layer; M-light conversion particles; N-filling particles; 63-LED bracket; L1-long side; L2-short side;

[0047] 7-PCB board; 71-first solder pad; 72-second solder pad; 73-third solder pad; 74-PCB insulation layer;

[0048] G- small pad; H- oblique pad. DETAILED DESCRIPTION

[0049] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other without conflict. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0050] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature, or it may be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, etc. used in the present invention are only relative to the relative positional relationship of the components of the present invention in the drawings.

[0051] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), an LED bracket 63, comprising a plurality of lead frames 1, a bottom reflection layer 2, a side reflection layer 3 and an accommodating cavity B; a plurality of the lead frames 1 combined with the bottom reflection layer 2 constitute a base A of the LED bracket, and after the plurality of the lead frames 1 are combined with the bottom reflection layer 2, they are spaced from each other; at least four lead frames 1 are arranged; the side reflection layer 3 is arranged on the base A, and is surrounded to form the accommodating cavity B, and the accommodating cavity B is used to arrange the LED chip 61 and the protective layer 62.

[0052] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13)(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), in one embodiment, the plurality of lead frames 1 include a first lead frame 11, a second lead frame 12, a third lead frame 13 and a fourth lead frame 14; the side reflective layer 3 includes a first side surface 31, a second side surface 32, a third side surface 33 and a fourth side surface 34; one long side of the first lead frame 11 and one long side of the second lead frame 12 are respectively connected to the first side surface 31; one long side of the third lead frame 13 and one long side of the fourth lead frame 14 are respectively connected to the second side surface 32; one short side of the first lead frame 11 and one short side of the third lead frame 13 are respectively connected to the third side surface 33; one short side of the second lead frame 12 and one short side of the fourth lead frame 14 are respectively connected to the fourth side surface 34.

[0053] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), in one embodiment, the placement cavity B is in the shape of an elongated strip when viewed from above (indicating a small elongated package size); the length of the first side surface 31 is equal to the length of the second side surface 32; the length of the third side surface 33 is equal to the length of the fourth side surface 34; the length of the first side surface 31 is greater than the length of the third side surface 33; the ratio of the long side L1 of the LED bracket 63 to the short side L2 of the LED bracket 63 is in the range of 1.25 to 4.5.

[0054] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), in one embodiment, the first lead frame 11 is equal in size to the fourth lead frame 14 located diagonally opposite to it; the second lead frame 12 is located on the same side of the first lead frame 11, and the second lead frame 12 is equal in size to the third lead frame 13 located on the side opposite to the first lead frame 11. Preferably, the length of the first lead frame 11 is greater than the length of the third lead frame 13.

[0055] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), in one embodiment, the height of the third side 33 is equal to the height of the fourth side 34, the height of the first side 31 is equal to the height of the second side 32; the height of the third side 33 is lower than or equal to the height of the first side 31.

[0056] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18), in one embodiment, the surface of the side reflection layer 3 facing the placement cavity B is a slope C, which is conducive to light extraction.

[0057] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), in one embodiment, the bottom reflection layer 2 and the side reflection layer 3 are made of the same material; during the injection molding process of the LED bracket 63, the bottom reflection layer 2 and the side reflection layer 3 are injection molded by the same mold. Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), this arrangement mode of the LED bracket of the present invention is conducive to the injection molding of the bottom reflection layer 2 and the side reflection layer 3 together, which is conducive to ensuring the molding quality of the LED bracket and is conducive to solving the problems of insufficient filling, lack of plastic material, dark cracks in the bracket, low yield, poor air tightness, etc. after the bracket is molded.

[0058] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), in one embodiment, the bottom reflection layer 2 and the side reflection layer 3 are one of polyphthalamide, "poly(1,4-cyclohexanedimethanol terephthalate)", and epoxy resin molding compound.

[0059] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), in one embodiment, several of the lead frames 1 are made of metal material.

[0060] Another object of the present invention is to provide a new type of LED device to meet people's demand for high brightness.

[0061] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18), an LED device 6, comprising a plurality of LED chips 61, an electrical connection layer, a protective layer 62 and the LED bracket 63; the plurality of LED chips 61 are flip-chip mounted in the placement cavity B, and the plurality of LED chips 61 are connected to the corresponding lead frame 1 through the electrical connection layer; the protective layer 62 is arranged in the placement cavity B, covering the LED chip 61, covering the surface of "the lead frame 1 and the bottom reflection layer 2" in the placement cavity B, and covering the surface of the side reflection layer 3 in the placement cavity B. The newly designed LED bracket 63 of the present invention has good air tightness, and after being combined with the protective layer 62, it can better protect the LED chip 61, which is conducive to improving the service life of the LED device 6.

[0062] In one embodiment, the electrical connection layer is solder paste.

[0063] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), in one embodiment, the protective layer 62 is one of silicone and epoxy resin, or the protective layer 62 is a mixed material of silicone and epoxy resin. Preferably, the protective layer 62 is not limited to the materials mentioned in the present invention, and any material that can be used to implement the encapsulation of the LED chip 61 of the present invention belongs to the scope protected by the protective layer 62 of the present invention.

[0064] Reference Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 In one embodiment, the protective layer 62 is provided with light conversion particles M (such as fluorescent powder) that can be excited by the LED chip 61.

[0065] Reference Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13In one embodiment, the protective layer 62 is provided with filling particles N; the filling particles are one or more of SiO2, ZnO, and Al3O2.

[0066] Another object of the present invention is to provide a novel edge-entry backlight module to realize the series connection of two flip chips inside each LED device to ensure the reliability of the entire module.

[0067] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 (or refer to Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12 )(or refer to Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 )(or refer to Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 ), a side-entry backlight module, comprising at least one PCB board 7 and one LED device 6; each of the LED devices 6 has two LED chips 61; each of the LED devices 6 has four lead frames 1; each of the PCB boards 7 is provided with a first solder pad 71, a second solder pad 72 and a third solder pad 73; for each of the LED devices 6, the first solder pad 71 is connected to the lead frame 1 corresponding to the positive pole of the first LED chip D; the second solder pad 72 is connected to the lead frame 1 corresponding to the negative pole of the second LED chip E; the third solder pad 73 is connected to the remaining two lead frames 1, connecting the two LED chips in series; each of the PCB boards 7 is provided with a connecting terminal (not shown in the drawings), and the connecting terminal is used to connect to a power line, so as to realize power supply to the LED chip.

[0068] In one embodiment, the edge-entry backlight module is composed of multiple PCB boards 7 and multiple LED devices 6, and each PCB board 7 is assembled corresponding to each LED device 6; the edge-entry backlight module can be arranged on the side of the electronic screen to achieve a side-entry setting.

[0069] Reference Fig.10 or Fig.17In one embodiment, the first pad 71, the second pad 72 and the third pad 73 are made of the same material; the first pad 71 is made of metal material, or a mixed material of "metal on ceramic". The first pad 71, the second pad 72 and the third pad 73 can achieve the functions of conducting electricity and dissipating heat.

[0070] Reference Fig.10 or Fig.17 In one embodiment, the PCB board 7 further includes a PCB insulating layer 74, and the first pad 71, the second pad 72 and the third pad 73 are spaced apart from each other after being combined with the PCB insulating layer 74.

[0071] Preferably, each soldering pad on the PCB board 7 is connected to the corresponding lead frame 1 on the LED bracket 63 through solder paste.

[0072] Reference Figure 1 , Figure 2 , Figure 3 , Fig.10 and Fig.11 In the first preferred embodiment, the length of the first side surface 31 is equal to the length of the second side surface 32; the length of the third side surface 33 is equal to the length of the fourth side surface 34; the ratio of the long side L1 of the LED bracket 63 to the short side L2 of the LED bracket 63 is 4.5; the plurality of LED chips 61 include a first LED chip D and a second LED chip E; the first LED chip D is flip-chip arranged in the placement cavity B, the positive electrode pad of the first LED chip D is connected to the first lead frame 11, and the negative electrode pad of the first LED chip D is connected to the third lead frame 13; the second LED chip E is flip-chip arranged in the placement cavity B, and the second LED chip E is flip-chip arranged in the placement cavity B. The negative electrode pad of the D chip E is connected to the second lead frame 12, and the positive electrode pad of the second LED chip E is connected to the fourth lead frame 14; the PCB board 7 is provided with a first pad 71, a second pad 72 and a third pad 73, the first pad 71 is connected to the first lead frame 11, and the second pad 72 is connected to the second lead frame 12; the third pad 73 connects the third lead frame 13 and the fourth lead frame 14; the two flip-chip LED chips 61 in the LED device 6 are connected in series through the PCB board 7; preferably, the third pad 73 is a continuous long strip pad, and its length is greater than "the sum of the length of the first pad 71 and the length of the second pad 72".

[0073] Reference Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.12The second preferred embodiment differs from the first preferred embodiment in that in the second preferred embodiment, light conversion particles M (such as phosphors) that can be excited by the LED chip 61 are added to the protective layer 62 of the LED device 6, thereby changing the light output color of the LED device 6.

[0074] Reference Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.13 The third preferred embodiment is different from the first preferred embodiment in that: the height of the third side surface 33 and the height of the fourth side surface 34 are less than the height of the first side surface 31 (Note: the height of the first side surface is equal to the height of the second side surface, and the height of the third side surface is equal to the height of the fourth side surface), thereby increasing the light output angle of the short side of the LED device 6; at the same time, in the third preferred embodiment, filling particles N are added to the protective layer 62 of the LED device 6.

[0075] Reference Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18In the fourth preferred embodiment, the length of the first side surface 31 is equal to the length of the second side surface 32; the length of the third side surface 33 is equal to the length of the fourth side surface 34; the ratio of the long side L1 of the LED bracket 63 to the short side L2 of the LED bracket 63 is 1.25; the plurality of LED chips 61 include a first LED chip D and a second LED chip E; the first LED chip D and the second LED chip E are flip-chip mounted in the placement cavity B, and the positive electrode of the first LED chip D and the positive electrode of the second LED chip E are respectively connected to the two lead frames 1 on the same side of the LED bracket 63; the negative electrode of the first LED chip D and the negative electrode of the second LED chip E are respectively connected to the two lead frames 1 on the other side of the LED bracket 63; the three pads of each PCB board 7 are adjusted corresponding to the positive and negative electrode arrangement positions of the two LED chips 61 in each LED device 6 to realize the series connection of the two LED chips 61 in each LED device 6, such as Specifically, the PCB board 7 is provided with a first solder pad 71, a second solder pad 72 and a third solder pad 73, the positive electrode of the first LED chip D is connected to the first lead frame 11, the negative electrode of the first LED chip D is connected to the third lead frame 13, the positive electrode of the second LED chip E is connected to the second lead frame 12, and the negative electrode of the second LED chip E is connected to the fourth lead frame 14, wherein the first solder pad 71 is connected to the first lead frame 11, the second solder pad 72 is connected to the fourth lead frame 14, The lead frame 14, the third solder pad 73 connects the second lead frame 12 and the third lead frame 13; the two flip-chip LED chips 61 in the LED device 6 are connected in series through the PCB board 7; preferably, the third solder pad 73 is composed of two small solder pads G and one oblique solder pad H; preferably, the first solder pad 71 and the second solder pad 72 have the same shape and surface area, and the surface area of ​​any one of the two small solder pads G in the third solder pad 73 is equivalent to the surface area of ​​the first solder pad 71.

[0076] The other contents of the LED bracket, LED device and edge-type backlight module described in the present invention can be found in the prior art and will not be described in detail here.

[0077] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. An LED bracket, characterized in that: It comprises a plurality of lead frames, a bottom reflection layer, a side reflection layer and an installation cavity; the plurality of lead frames are combined with the bottom reflection layer to form a substrate of the LED bracket, and the plurality of lead frames are spaced apart from each other after being combined with the bottom reflection layer; at least four lead frames are provided; the side reflection layer is provided on the substrate and surrounds the installation cavity, and the installation cavity is used to arrange the LED chip and the protective layer.

2. The LED bracket according to claim 1, characterized in that: The plurality of lead frames include a first lead frame, a second lead frame, a third lead frame and a fourth lead frame; the side reflective layer includes a first side surface, a second side surface, a third side surface and a fourth side surface; one long side of the first lead frame and one long side of the second lead frame are respectively connected to the first side surface; one long side of the third lead frame and one long side of the fourth lead frame are respectively connected to the second side surface; one short side of the first lead frame and one short side of the third lead frame are respectively connected to the third side surface; one short side of the second lead frame and one short side of the fourth lead frame are respectively connected to the fourth side surface.

3. The LED bracket according to claim 2, characterized in that: The placement cavity is in the shape of an elongated strip when viewed from above; the length of the first side is equal to the length of the second side; the length of the third side is equal to the length of the fourth side; the length of the first side is greater than the length of the third side; the ratio of the long side of the LED bracket to the short side of the LED bracket is in the range of 1.25 to 4.

5.

4. The LED bracket according to claim 2, characterized in that: The first lead frame is equal in size to the fourth lead frame located diagonally opposite to it; the second lead frame is located on the same side of the first lead frame, and is equal in size to the third lead frame located on the side opposite to the first lead frame.

5. The LED bracket according to any one of claims 2 to 4, characterized in that: The height of the third side surface is equal to the height of the fourth side surface, the height of the first side surface is equal to the height of the second side surface; and the height of the third side surface is lower than or equal to the height of the first side surface.

6. An LED device, characterized in that: It comprises a plurality of LED chips, an electrical connection layer, a protective layer and the LED bracket according to any one of claims 1 to 5; the plurality of LED chips are flip-chip arranged in the placement cavity, and the plurality of LED chips are respectively connected to the corresponding lead frames through the electrical connection layer; the protective layer is arranged in the placement cavity, covering the LED chip, covering the surface of "the lead frame and the bottom reflection layer" in the placement cavity, and covering the surface of the side reflection layer in the placement cavity.

7. The LED device according to claim 6, characterized in that: The protective layer is one of silica gel and epoxy resin, or a mixed material of silica gel and epoxy resin.

8. The LED device according to claim 6, characterized in that: The protective layer is provided with light conversion particles which can be excited by the LED chip.

9. The LED device according to claim 6, characterized in that: Filling particles are arranged in the protective layer; the filling particles are one or more of SiO2, ZnO, and Al3O2.

10. An edge-type backlight module, characterized in that: It comprises at least one PCB board and an LED device as claimed in any one of claims 6 to 9; each of the LED devices has two LED chips; each of the LED devices has four lead frames; each of the PCB boards has a first soldering pad, a second soldering pad and a third soldering pad; for each of the LED devices, the first soldering pad is connected to the lead frame corresponding to the positive pole of the first LED chip; the second soldering pad is connected to the lead frame corresponding to the negative pole of the second LED chip; the third soldering pad is connected to the remaining two lead frames; each of the PCB boards has a connecting terminal, and the connecting terminal is used to connect to a power line.

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