Miniature LED device preparation method, miniature LED device and display device

Abstract

The invention provides a miniature LED device preparation method, a miniature LED device and a display device. The method comprises the following steps: obtaining a transparent substrate and a micro LED chip structure; a first reflecting layer is arranged on the transparent substrate, the first reflecting layer comprises a plurality of groups of first through holes, and the first reflecting layer is used for reflecting light emitted by the micro LED units; each group of first through holes is filled with a first light absorption layer, and the first light absorption layers are used for partially absorbing light emitted by the micro LED units; a first partition layer is arranged on the first reflecting layer, so that the first partition layer comprises a plurality of groups of second through holes; a second partition layer is arranged on the first partition layer, so that the second partition layer comprises a plurality of groups of third through holes; filling the third through holes, which do not correspond to the first through holes, in each group of third through holes with a photoluminescent material layer to obtain a first color conversion structure; and bonding one side, opposite to the transparent substrate, of the first color conversion structure with the light emitting side of the micro LED chip to obtain the micro LED device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor Micro LED, and in particular, to a method for preparing a Micro LED device, a Micro LED device and a display device. Background Art

[0002] Micro-LED is a comprehensive technology that integrates new display technology and light-emitting diode (LED) technology. It has the advantages of small size, high brightness, high resolution, and low power consumption. It is considered to be one of the most promising next-generation new display and light-emitting devices. Currently, Micro LED full-color display can be achieved in a variety of ways, one of which is the color conversion method. However, the full-color Micro LED device achieved by the color conversion method still has problems such as unsatisfactory display effects. Summary of the invention

[0003] The solution disclosed herein provides a method for preparing a micro LED device, a micro LED device, and a display device.

[0004] According to one aspect of an embodiment of the present disclosure, a method for preparing a micro LED device is provided, wherein the method comprises: obtaining a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; arranging a first reflective layer on the transparent substrate, so that the first reflective layer comprises a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, the first through hole array comprises a plurality of groups of first through holes, each group of first through holes comprises at least one first through hole, and the first reflective layer is used to reflect the light emitted by the micro LED unit; filling a first light absorbing layer in each group of first through holes to obtain a first intermediate structure, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit; arranging a first barrier layer on the first intermediate structure, so that the first barrier layer comprises a second through hole array, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of first through holes, and the number of second through holes in each group of second through holes is The number of the second through holes in each group of second through holes is greater than the number of the first through holes in the corresponding first through hole group, and part of the second through holes in each group of second through holes corresponds to the first through holes in the corresponding first through hole group; a second barrier layer is arranged on the first barrier layer, so that the second barrier layer includes a third through hole array, the third through hole array corresponds to the second through hole array, wherein the third through hole array includes a plurality of groups of third through holes corresponding to the plurality of first through holes and the plurality of second through holes, the number of the third through holes in each group of third through holes is the same as the number of the second through holes in each group of second through holes, and the third through holes in each group of third through holes correspond to the second through holes in the corresponding second through hole group, and part of the third through holes in each group of third through holes correspond to the first through holes in the corresponding first through hole group; a photoluminescent material layer is filled in the third through holes in each group of third through holes that do not correspond to the first through holes, to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; a side of the first color conversion structure opposite to the transparent substrate is bonded to the light emitting side of the micro LED chip, to obtain a micro LED device.

[0005] Further, a first reflective layer is provided on the transparent substrate, so that the first reflective layer includes a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, the first through hole array includes multiple groups of first through holes, each group of first through holes includes at least one first through hole, and the first reflective layer is used to reflect the light emitted by the micro LED unit, including: providing a first reflective layer on the transparent substrate and opening a first through hole array on the first reflective layer, so that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, each group of first through holes includes one first through hole, and the first reflective layer is used to reflect the third color of light emitted by the micro LED unit. Filling a first light absorbing layer in each group of first through holes to obtain a first intermediate structure, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit, including: filling a first light absorbing layer in a first through hole in each group of first through holes, wherein the first light absorbing layer is used to partially absorb the third color of light emitted by the micro LED unit. A first barrier layer is arranged on the first intermediate structure, so that the first barrier layer includes a second through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of first through holes, the number of second through holes in each group of second through holes is greater than the number of first through holes in the corresponding first through hole group, and part of the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group, comprising: a first barrier layer is arranged on the first intermediate structure and a second through hole array is opened on the first barrier layer, so that the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of first through holes, each group of second through holes includes three second through holes, the three second through holes include a first second through hole, a second second through hole and a third second through hole, and the third second through hole is aligned with the first through hole.A second barrier layer is arranged on the first barrier layer, so that the second barrier layer includes a third through hole array, the third through hole array corresponds to the second through hole array, wherein the third through hole array includes a plurality of groups of third through holes corresponding to the plurality of first through holes and the plurality of second through holes, the number of third through holes in each group of third through holes is the same as the number of second through holes in each group of second through holes, and the third through holes in each group of third through holes correspond to the second through holes in the corresponding second through hole group, and part of the third through holes in each group of third through holes correspond to the first through holes in the corresponding first through hole group, comprising: arranging the second barrier layer on the first barrier layer; A barrier layer is provided and a third through hole array is opened on the second barrier layer, so that the third through hole array corresponds to the second through hole array, wherein the third through hole array includes a plurality of groups of third through holes corresponding to the plurality of groups of first through holes and the plurality of groups of second through holes, each group of third through holes includes three third through holes, the three third through holes include a first third through hole aligned with the first second through hole, a second third through hole aligned with the second second through hole and a third third through hole aligned with the third second through hole, and the third third through hole is aligned with the first through hole aligned with the third second through hole. The photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color. The photoluminescent material layer is filled in the third through holes in each group of third through holes that do not have a corresponding first through hole to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the first third through hole in each group of third through holes with a photoluminescent material layer of the first color, and filling the second third through hole in each group of third through holes with a photoluminescent material layer of the second color, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

[0006] Further, before the second barrier layer is provided on the first barrier layer, the method further comprises a first filling step, wherein the first filling step comprises at least one of the following steps: filling a first filling portion in a first second through hole in each group of second through holes, wherein the first filling portion comprises a first filter layer that only allows light of the first color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of a third color; filling a second filling portion in a second second through hole in each group of second through holes, wherein the second filling portion comprises a second filter layer that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color; and filling a third filling portion in a third second through hole in each group of second through holes, wherein the third filling portion comprises a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color.

[0007] Furthermore, the first filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0008] Furthermore, a first reflective layer is arranged on the transparent substrate, so that the first reflective layer includes a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, the first through hole array includes multiple groups of first through holes, each group of first through holes includes at least one first through hole, and the first reflective layer is used to reflect the light emitted by the micro LED unit, including: a first reflective layer is arranged on the transparent substrate and a first through hole array is opened on the first reflective layer, so that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, each group of first through holes includes one first through hole, and the first reflective layer is used to reflect the third color of light emitted by the micro LED unit.

[0009] Filling a first light absorbing layer in each group of first through holes to obtain a first intermediate structure, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit, including: filling a first light absorbing layer in a first through hole in each group of first through holes, wherein the first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit. Arranging a first barrier layer on the first intermediate structure, so that the first barrier layer includes a second through hole array, wherein the second through hole array includes a plurality of second through holes corresponding to the plurality of first through holes, the number of second through holes in each group of second through holes is greater than the number of first through holes in the corresponding first through hole group, and part of the second through holes in each group of second through holes corresponds to the first through holes in the corresponding first through hole group, including: arranging a first barrier layer on the first intermediate structure and opening a second through hole array on the first barrier layer, so that the second through hole array includes a plurality of second through holes corresponding to the plurality of first through holes, each group of second through holes includes two second through holes, and one of the two second through holes is aligned with the first through hole filled with the first light absorbing layer. A second barrier layer is disposed on the first barrier layer, so that the second barrier layer includes a third through-hole array, the third through-hole array corresponds to the second through-hole array, wherein the third through-hole array includes a plurality of groups of third through-holes corresponding to the plurality of groups of first through-holes and the plurality of groups of second through-holes, the number of third through-holes in each group of third through-holes is the same as the number of second through-holes in each group of second through-holes, and the third through-holes in each group of third through-holes correspond to the second through-holes in the corresponding second through-hole group, and part of the third through-holes in each group of third through-holes correspond to the first through-holes in the corresponding first through-hole group. The through hole correspondence includes: arranging a second barrier layer on the first barrier layer and opening a third through hole array on the second barrier layer, so that the third through hole array corresponds to the second through hole array, wherein the third through hole array includes a plurality of groups of third through holes corresponding to the plurality of groups of first through holes and the plurality of groups of second through holes, each group of third through holes includes two third through holes respectively aligned with two second through holes in the corresponding second through hole group, and one third through hole in each group of third through holes is aligned with a first through hole in the corresponding first through hole group and a second through hole in the corresponding second through hole group. The photoluminescent material layer includes a photoluminescent material layer of a fourth color, and a third through hole in each group of third through holes that does not correspond to a first through hole is filled with a photoluminescent material layer to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer includes: a third through hole in each group of third through holes that is not aligned with the first through hole is filled with a photoluminescent material layer of a fourth color, and light corresponding to the fourth color and light corresponding to the third color are synthesized to obtain white light.

[0010] Further, before the second barrier layer is provided on the first barrier layer, the method further comprises a second filling step, wherein the second filling step comprises at least one of the following steps: filling a fourth filling portion in a second through hole in each group of second through holes that is not aligned with the first through hole, wherein the fourth filling portion comprises a fourth filter layer that only allows light of a fourth color to pass through, a second light absorbing layer or a transparent material that is used to partially absorb light of a third color; filling a fifth filling portion in a second through hole in each group of second through holes that is aligned with the first through hole, wherein the fifth filling portion comprises a third filter layer that only allows light of a third color to pass through, a second light absorbing layer or a transparent material that is used to partially absorb light of the third color.

[0011] Furthermore, the second filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0012] Furthermore, when a photoluminescent material layer is filled in a third through hole in each group of third through holes that has no corresponding first through hole, the method further includes: filling a sixth filling portion in a third through hole in each group of third through holes that corresponds to the first through hole, the sixth filling portion comprising a third light absorbing layer, a photoluminescent material layer of a third color, or a transparent material, and the third light absorbing layer is used to partially absorb light emitted by the micro LED unit.

[0013] Furthermore, after the photoluminescent material layer is filled in the third through holes in each group of third through holes that do not have corresponding first through holes, the method further includes: providing a second reflective layer on the second barrier layer and the photoluminescent material layer, wherein the second reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer.

[0014] Furthermore, after the third through holes in each group of third through holes that do not have corresponding first through holes are filled with a photoluminescent material layer, the method further includes: providing an insulating layer on the second barrier layer and the photoluminescent material layer. Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the micro LED chip.

[0015] Furthermore, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0016] According to another aspect of the present disclosure, a micro LED device is also provided.

[0017] The micro LED device comprises a second color conversion structure and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, wherein the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, wherein the second color conversion structure comprises: a first reflective layer, wherein the first reflective layer comprises a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, wherein each group of first through holes comprises at least one first through hole, and the first reflective layer is used to reflect the light emitted by the micro LED unit; a first light absorbing layer, wherein the first light absorbing layer is filled in each group of first through holes, and wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit; and a first barrier layer, wherein the first barrier layer is arranged below the first reflective layer and the first light absorbing layer, and wherein the first barrier layer comprises a second through hole array, wherein the second through hole array comprises a plurality of groups of first through holes corresponding to the plurality of groups of first through holes. a second through hole, the number of the second through holes in each group of second through holes is greater than the number of the first through holes in the corresponding first through hole group, and some of the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group; a second barrier layer, the second barrier layer is arranged below the first barrier layer and includes a third through hole array, the third through hole array corresponds to the second through hole array, wherein the third through hole array includes multiple groups of third through holes corresponding to the multiple groups of first through holes and the multiple groups of second through holes, the number of the third through holes in each group of third through holes is the same as the number of the second through holes in each group of second through holes, the third through holes in each group of third through holes correspond to the second through holes in the corresponding second through hole group, and some of the third through holes in each group of third through holes correspond to the first through holes in the corresponding first through hole group; a photoluminescent material layer, the photoluminescent material layer is filled in the third through holes in each group of third through holes that do not have the corresponding first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The second barrier layer and the photoluminescent material layer of the second color conversion structure are arranged on the light emitting side of the micro LED chip.

[0018] Further, each group of first through holes includes a first through hole, the first reflective layer is used to reflect the third color light emitted by the micro LED unit, the first light absorbing layer is filled in the first through hole in each group of first through holes, and the first light absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, each group of second through holes includes three second through holes, the three second through holes include a first second through hole, a second second through hole and a third second through hole, the third second through hole is aligned with the first through hole, and each group of third through holes includes three third through holes, the three third through holes include a first third through hole aligned with the first second through hole, and a third third through hole aligned with the first second through hole. The second third through hole aligned with the second second through hole and the third third through hole aligned with the third second through hole, and the third third through hole is aligned with the first through hole aligned with the third second through hole, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, the photoluminescent material layer of the first color is filled in the first third through hole in each group of third through holes, and the photoluminescent material layer of the second color is filled in the second third through hole in each group of third through holes, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

[0019] Further, the second color conversion structure also includes at least one of a first filling part, a second filling part and a third filling part, wherein: the first filling part is used to fill the first second through hole in each group of second through holes, and the first filling part includes a first filter layer that only allows light of the first color to pass through, and a second light absorbing layer or a transparent material that partially absorbs light of the third color; the second filling part is used to fill the second second through hole in each group of second through holes, and the second filling part includes a second filter layer that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material that partially absorbs light of the third color; the third filling part is used to fill the third second through hole in each group of second through holes, and the third filling part includes a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material that partially absorbs light of the third color.

[0020] Further, when there is an unfilled second through hole in each group of second through holes, the second color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0021] Further, the first color is red, the second color is green and the third color is blue.

[0022] Further, each group of first through holes includes a first through hole, the first reflective layer is used to reflect the light of the third color emitted by the micro LED unit, the first light absorbing layer is filled in the first through hole in each group of first through holes, and the first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, each group of second through holes includes two second through holes, one of the two second through holes is aligned with the first through hole filled with the first light absorbing layer, each group of third through holes includes two third through holes respectively aligned with the two second through holes in the corresponding second through hole group, one third through hole in each group of third through holes is aligned with the first through hole in the corresponding first through hole group and one second through hole in the corresponding second through hole group, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in the third through hole in each group of third through holes that is not aligned with the first through hole, and the light corresponding to the fourth color and the light of the third color are synthesized to obtain white light.

[0023] Further, the second color conversion structure also includes at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is used to fill the second through hole in each group of second through holes that is not aligned with the first through hole, and the fourth filling part includes a fourth filter layer that only allows light of the fourth color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color; the fifth filling part is used to fill the second through hole in each group of second through holes that is aligned with the first through hole, and the fifth filling part includes a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color.

[0024] Further, when there is an unfilled second through hole in each group of second through holes, the second color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0025] Further, the fourth color is yellow and the third color is blue.

[0026] Furthermore, the second color conversion structure also includes a sixth filling part, which includes a third light absorption layer, a photoluminescent material layer of a third color and a transparent material. The sixth filling part is filled in the third through hole corresponding to the first through hole in each group of third through holes, and the third light absorption layer is used to partially absorb the light emitted by the micro LED unit.

[0027] Furthermore, the second color conversion structure further includes a second reflective layer, which is disposed below the second barrier layer and the photoluminescent material layer, and is used to reflect light of a color corresponding to the photoluminescent material layer.

[0028] Furthermore, the second color conversion structure further includes an insulating layer, wherein the insulating layer is disposed below the second barrier layer and the photoluminescent material layer, and the insulating layer is disposed on the light emitting side of the micro LED chip.

[0029] Furthermore, the micro LED chip structure also includes a driver chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip, or the micro LED chip structure also includes a driver chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driver chip.

[0030] Further, the material of the first barrier layer and the material of the second barrier layer include visible light shielding materials, the material of the first color photoluminescent material layer and the material of the second color photoluminescent material layer include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer and the material of the second light absorption layer include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, the material of the first filter layer, the material of the second filter layer and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides, and the first reflective layer includes a distributed Bragg reflector film for reflecting light of the color corresponding to the photoluminescent material layer.

[0031] According to another aspect of the embodiments of the present disclosure, a display device is provided, comprising a micro LED device prepared by the above method.

[0032] The technical solution of the present disclosure is applied, by obtaining a transparent substrate and a micro LED chip, a first reflective layer is arranged on the transparent substrate, each group of first through holes included in the first reflective layer includes at least one first through hole, a first light absorbing layer is filled in each group of first through holes, and then a first barrier layer is arranged on the first reflective layer, the number of second through holes in each group of second through holes included in the first barrier layer is greater than the number of first through holes in the corresponding first through hole group, and part of the second through holes in each group of second through holes corresponds to the first through holes in the corresponding first through hole group, and then a first barrier layer is arranged on the first barrier layer. A second barrier layer, the number of third through holes included in each group of third through holes included in the second barrier layer is the same as the number of second through holes in each group of second through holes, and the third through holes in each group of third through holes correspond to the second through holes in the corresponding second through hole group, and some of the third through holes in each group of third through holes correspond to the first through holes in the corresponding first through hole group, and then the third through holes in each group of third through holes without corresponding first through holes are filled with a photoluminescent material layer to form a first color conversion structure, and the first color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0033] On the one hand, in the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. Due to the existence of the corresponding first through hole, the second through hole and the third through hole, the first light absorption layer filled in the first through hole corresponding to the second through hole and the third through hole can partially absorb the light emitted by the micro LED unit, thereby reducing the light overflow caused by the light emitted by the micro LED unit directly emitted from the micro LED device, thereby reducing the color deviation and poor color purity caused by the light overflow, thereby improving the balance of light of different colors emitted from the micro LED device, improving the color purity of the micro LED, and thereby improving the display effect of the micro LED device.

[0034] On the other hand, since the first reflective layer covers the photoluminescent material layer, when a portion of the light emitted by the micro LED unit does not participate in the excitation of the photoluminescent material layer and leaks out through the photoluminescent material layer, the first reflective layer can reflect the leaked portion of light back to the photoluminescent material layer and re-participate in the excitation of the photoluminescent material layer, thereby increasing the light participating in the excitation of the photoluminescent material layer, thereby increasing the light output of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and reducing the mixed output of the leaked portion of light and the different color lights emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0036] Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure;

[0037] Figures 2 to 13 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0039] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0040] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0041] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of the layers and regions is enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0042] The present invention provides a method for preparing a micro LED device. Figures 1 to 13 , Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure; Figures 2 to 13 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure.

[0043] like Figure 1 As shown, the method for preparing a micro LED device includes the following steps S101-S107.

[0044] Step S101: Obtain a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units.

[0045] Step S102: a first reflective layer is disposed on the transparent substrate, so that the first reflective layer includes a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes at least one first through hole, and the first reflective layer is used to reflect the light emitted by the micro LED unit.

[0046] Step S103: Filling a first light absorption layer in each group of first through holes to obtain a first intermediate structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit.

[0047] Step S104: a first barrier layer is disposed on the first intermediate structure, so that the first barrier layer includes a second through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, the number of second through holes in each group of second through holes is greater than the number of first through holes in the corresponding first through hole group, and part of the second through holes in each group of second through holes corresponds to the first through holes in the corresponding first through hole group.

[0048] Step S105: a second barrier layer is disposed on the first barrier layer, so that the second barrier layer includes a third through hole array, the third through hole array corresponds to the second through hole array, wherein the third through hole array includes multiple groups of third through holes corresponding to the multiple groups of first through holes and the multiple groups of second through holes, the number of third through holes in each group of third through holes is the same as the number of second through holes in each group of second through holes and the third through holes in each group of third through holes correspond to the second through holes in the corresponding second through hole group, and part of the third through holes in each group of third through holes correspond to the first through holes in the corresponding first through hole group.

[0049] Step S106: Filling a photoluminescent material layer in the third through holes in each group of third through holes that have no corresponding first through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0050] Step S107: Bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip to obtain a micro LED device.

[0051] According to the technical solution, a transparent substrate and a micro LED chip can be obtained, a first reflective layer is arranged on the transparent substrate, each group of first through holes included in the first reflective layer includes at least one first through hole, a first light absorbing layer is filled in each group of first through holes, and then a first barrier layer is arranged on the first reflective layer, the number of second through holes in each group of second through holes included in the first barrier layer is greater than the number of first through holes in the corresponding first through hole group, and some of the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group, and then a second barrier layer is arranged on the first barrier layer. A barrier layer, the number of third through holes included in each group of third through holes included in the second barrier layer is the same as the number of second through holes in each group of second through holes, and the third through holes in each group of third through holes correspond to the second through holes in the corresponding second through hole group, and some of the third through holes in each group of third through holes correspond to the first through holes in the corresponding first through hole group, and then a photoluminescent material layer is filled in the third through holes in each group of third through holes that do not have corresponding first through holes to form a first color conversion structure, and the first color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0052] On the one hand, in the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. Due to the existence of the corresponding first through hole, the second through hole and the third through hole, the first light absorption layer filled in the first through hole corresponding to the second through hole and the third through hole can partially absorb the light emitted by the micro LED unit, thereby reducing the light overflow caused by the light emitted by the micro LED unit directly emitted from the micro LED device, thereby reducing the color deviation and poor color purity caused by the light overflow, thereby improving the balance of light of different colors emitted from the micro LED device, improving the color purity of the micro LED, and thereby improving the display effect of the micro LED device.

[0053] On the other hand, since the first reflective layer covers the photoluminescent material layer, when a portion of the light emitted by the micro LED unit does not participate in the excitation of the photoluminescent material layer and leaks out through the photoluminescent material layer, the first reflective layer can reflect the leaked portion of light back to the photoluminescent material layer and re-participate in the excitation of the photoluminescent material layer, thereby increasing the light participating in the excitation of the photoluminescent material layer, thereby increasing the light output of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and reducing the mixed output of the leaked portion of light and the different color lights emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.

[0054] In step S101, a transparent substrate and a micro LED chip structure may be obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of a plurality of micro LED units.

[0055] According to an embodiment of the present disclosure, a transparent substrate and a micro LED chip structure may be first obtained. The transparent substrate may include any applicable substrate such as a glass substrate, a polyimide substrate or a sapphire substrate. The micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array for emitting light. Among them, the micro LED chip may be any micro LED chip suitable for preparing a micro LED device. For example, the structure of the micro LED chip may include a face-up structure, a flip-chip structure or a vertical structure, etc., which are not limited here. Each micro LED unit in the micro LED unit array may include an exposed first semiconductor layer on its light-emitting side. Depending on the type of micro LED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer. It is worth noting that the micro LED chip structure may also be obtained in any step before the subsequent step of using the micro LED chip structure.

[0056] Reference Figure 2-Figure 13 ,in Figure 2 FIG. 1 shows a side view of a transparent substrate 101 according to an embodiment of the present disclosure. Figure 2 As shown, the transparent substrate 101 may be, for example, a glass substrate.

[0057] Reference Figure 2-Figure 13 ,in Figure 3 FIG. 4 shows a side view of a micro LED chip structure according to an embodiment of the present disclosure. Figure 3 As shown, the micro LED chip structure includes a micro LED chip 20, and the micro LED chip 20 includes a micro LED unit array 201 composed of micro LED units 2011. Each micro LED unit 2011 in the micro LED unit array 201 includes a first semiconductor layer 20111 such as an N-GaN layer on the light emitting side. Figure 3 As shown, the first semiconductor layer 20111 is common to each micro LED unit 2011 in the micro LED unit array 201 , that is, the first semiconductor layer 20111 is integrated in the micro LED chip 20 .

[0058] In step S102, a first reflective layer can be set on the transparent substrate, so that the first reflective layer includes a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, the first through hole array includes multiple groups of first through holes, each group of first through holes includes at least one first through hole, and the first reflective layer is used to reflect the light emitted by the micro LED unit.

[0059] According to an embodiment of the present disclosure, after obtaining a transparent substrate, a first reflective layer may be disposed on the transparent substrate. The first reflective layer may include a distributed Bragg reflector for reflecting light emitted by the micro LED unit, and the first reflective layer may be, for example, a distributed Bragg reflector formed by alternately stacking silicon dioxide layers and titanium dioxide layers, and may also include any material layer for reflecting light emitted by the micro LED unit.

[0060] According to an embodiment of the first reflective layer disclosed in the present invention, a first reflective layer is arranged on a transparent substrate, so that the first reflective layer includes a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, the first through hole array includes multiple groups of first through holes, each group of first through holes includes at least one first through hole, and the first reflective layer is used to reflect the light emitted by the micro LED unit, including: a first reflective layer is arranged on a transparent substrate and a first through hole array is opened on the first reflective layer, so that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, each group of first through holes includes one first through hole, and the first reflective layer is used to reflect the third color of light emitted by the micro LED unit.

[0061] Reference Figure 2-Figure 13 ,in Figure 4 FIG. 1 shows a side view of a first reflective layer 102 disposed on a transparent substrate 101. Figure 4 As shown, a first reflective layer 102 such as a distributed Bragg reflector is disposed on a transparent substrate 101, and a first through hole array is provided on the first reflective layer 102, so that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array 201, and the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes a first through hole 1021, and the first through hole 1021 exposes the transparent substrate 101. The first reflective layer 102 is used to reflect the light of a third color such as blue emitted by the micro LED unit. For clarity and simplicity, Figure 4 Only a group of first through holes included in the first hole array is shown, and the group of first through holes includes a first through hole 1021, Figure 4 The number of groups of first through holes and the number of first through holes in each group of first through holes shown in the figure are merely illustrative and are not intended to be limiting herein.

[0062] In step S103 , a first light absorption layer may be filled in each group of first through holes to obtain a first intermediate structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit.

[0063] According to an embodiment of the present disclosure, after obtaining the above-mentioned first through-hole array, a first light absorption layer may be filled for the first through-hole array. The first light absorption layer may partially absorb the light emitted by the micro LED unit, so that a part of the light emitted by the micro LED unit is absorbed after passing through the first light absorption layer. The material of the first light absorption layer may include an organic dye, nano absorption particles or inorganic oxide for partially absorbing the light emitted by the micro LED unit, for example, zinc oxide nanoparticle photoresist.

[0064] Referring to the embodiment of the first reflective layer in step S102, according to the embodiment of the first through hole filling disclosed in the present invention, a first light absorption layer is filled in each group of first through holes to obtain a first intermediate structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, including: filling the first light absorption layer in the first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the third color of light emitted by the micro LED unit.

[0065] Reference Figure 2-Figure 13 ,in Figure 5 A side view schematic diagram of the first light absorbing layer filled in each group of first through holes is shown. Figure 4 ,like Figure 5 As shown, the first light absorbing layer 1031 is filled in the first through hole 1021 in each group of first through holes, and the result is as shown in FIG. Figure 5 The first intermediate structure 30 shown, wherein the first light absorption layer 1031 is used to partially absorb light of a third color such as blue, and the material of the first light absorption layer may include organic dyes, nano absorption particles or inorganic oxides for partially absorbing light such as blue light emitted by the micro LED unit.

[0066] In step S104, a first barrier layer may be provided on the first intermediate structure, so that the first barrier layer includes a second through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, the number of second through holes in each group of second through holes is greater than the number of first through holes in the corresponding first through hole group, and some of the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group.

[0067] According to an embodiment of the present disclosure, after obtaining the first intermediate structure, a first barrier layer can be set on the first intermediate structure, and the first barrier layer can include a visible light shielding material, which can include, for example, a matte material such as black photoresist, and a reflective material such as a metal layer.

[0068] Referring to the embodiment of the first reflective layer in step S102 and the embodiment of the first through-hole filling in step S103, according to an embodiment of the first barrier layer of the present disclosure, a first barrier layer is disposed on the first intermediate structure so that the first barrier layer includes a second through-hole array, wherein the second through-hole array includes a plurality of groups of second through-holes corresponding to the plurality of groups of first through-holes, the number of second through-holes in each group of second through-holes is greater than the number of first through-holes in the corresponding first through-hole group, and part of the second through-holes in each group of second through-holes corresponds to the first through-holes in the corresponding first through-hole group, including: a first barrier layer is disposed on the first intermediate structure and a second through-hole array is opened on the first barrier layer, so that the second through-hole array includes a plurality of groups of second through-holes corresponding to the plurality of groups of first through-holes, each group of second through-holes includes three second through-holes, the three second through-holes include a first second through-hole, a second second through-hole and a third second through-hole, and the third second through-hole is aligned with the first through-hole.

[0069] Referring to the embodiment of the first reflective layer in step S102 and the embodiment of the first through-hole filling in step S103, according to another embodiment of the first barrier layer of the present disclosure, a first barrier layer is disposed on the first intermediate structure so that the first barrier layer includes a second through-hole array, wherein the second through-hole array includes a plurality of groups of second through-holes corresponding to the plurality of groups of first through-holes, the number of second through-holes in each group of second through-holes is greater than the number of first through-holes in the corresponding first through-hole group, and part of the second through-holes in each group of second through-holes corresponds to the first through-holes in the corresponding first through-hole group, including: disposing a first barrier layer on the first intermediate structure and opening a second through-hole array on the first barrier layer, so that the second through-hole array includes a plurality of groups of second through-holes corresponding to the plurality of groups of first through-holes, each group of second through-holes includes two second through-holes, and one of the two second through-holes is aligned with the first through-hole filled with the first light absorbing layer.

[0070] Reference Figure 2-Figure 13 ,in Figure 6 FIG. 4 shows a side view schematic diagram of a first barrier layer disposed on the first reflective layer. Figure 6 As shown, the first barrier layer 104 can be, for example, a black photoresist layer, so the black photoresist layer can be coated on the first reflective layer 102 by spin coating, and then, for example, a second through hole array 1040 can be opened on the black photoresist layer by photolithography, so that the arrangement of the second through hole array 1040 corresponds to the arrangement of the micro LED unit array 201 to be used later and exposes the first reflective layer 102, wherein the second through hole array 1040 includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes includes a first second through hole 1041, a second second through hole 1042 and a third second through hole 1043. For clarity and simplicity, Figure 6Only a group of second through holes included in the second through hole array 1040 is shown, and the group of second through holes includes a first second through hole 1041, a second second through hole 1042 and a third second through hole 1043. Figure 6 The group of first through holes shown corresponds, and the third second through hole 1043 is aligned with the first through hole 1021 . Figure 6 The number of groups of second through holes and the number of second through holes in each group of second through holes shown in the figure are only for illustration and are not limited here. The first barrier layer 104 such as a black photoresist layer can make the screen appear black when the display device is powered off or turned off.

[0071] In step S105, a second barrier layer may be provided on the first barrier layer, so that the second barrier layer includes a third through hole array, the third through hole array corresponding to the second through hole array, wherein the third through hole array includes a plurality of groups of third through holes corresponding to the plurality of groups of first through holes and the plurality of groups of second through holes, the number of third through holes in each group of third through holes is the same as the number of second through holes in each group of second through holes and the third through holes in each group of third through holes correspond to the second through holes in the corresponding second through hole group, and some of the third through holes in each group of third through holes correspond to the first through holes in the corresponding first through hole group.

[0072] According to an embodiment of the present disclosure, after preparing the first barrier layer, a second barrier layer may be provided on the first barrier layer. The second barrier layer may function as a grid, and the interior of the grid may be filled with a corresponding material. In some embodiments, the second barrier layer may include a visible light shielding material, which may include, for example, a matte material such as black photoresist, or a reflective material such as a metal layer.

[0073] Referring to the embodiment of the first reflective layer in step S102, the embodiment of the first through-hole filling in step S103, and one embodiment of the first barrier layer in step S104, according to one embodiment of the second barrier layer of the present disclosure, a second barrier layer is disposed on the first barrier layer, so that the second barrier layer includes a third through-hole array, the third through-hole array corresponds to the second through-hole array, wherein the third through-hole array includes a plurality of groups of third through-holes corresponding to the plurality of groups of first through-holes and the plurality of groups of second through-holes, the number of the third through-holes in each group of the third through-holes is the same as the number of the second through-holes in each group of the second through-holes, the third through-holes in each group of the third through-holes correspond to the second through-holes in the corresponding second through-hole group, and each group of the third through-holes Part of the third through holes in the hole corresponds to the first through holes in the corresponding first through hole group, including: arranging a second barrier layer on the first barrier layer and opening a third through hole array on the second barrier layer, so that the third through hole array corresponds to the second through hole array, wherein the third through hole array includes multiple groups of third through holes corresponding to the multiple groups of first through holes and the multiple groups of second through holes, each group of third through holes includes three third through holes, the three third through holes include a first third through hole aligned with the first second through hole, a second third through hole aligned with the second second through hole and a third third through hole aligned with the third second through hole, and the third third through hole is aligned with the first through hole aligned with the third second through hole.

[0074] Further, before the second barrier layer is provided on the first barrier layer, the method further comprises a first filling step, wherein the first filling step comprises at least one of the following steps: filling a first filling portion in a first second through hole in each group of second through holes, wherein the first filling portion comprises a first filter layer that only allows light of the first color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of a third color; filling a second filling portion in a second second through hole in each group of second through holes, wherein the second filling portion comprises a second filter layer that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color; and filling a third filling portion in a third second through hole in each group of second through holes, wherein the third filling portion comprises a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color.

[0075] Furthermore, the first filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0076] In this embodiment, the light of the first color refers to the light of the wavelength range corresponding to the first color, the light of the second color refers to the light of the wavelength range corresponding to the second color, and the light of the third color refers to the light of the wavelength range corresponding to the third color. The first color, the second color and the third color can be three primary colors, for example, the first color is red, the second color is green and the third color is blue. The material of the second light absorption layer includes organic dyes, nano absorption particles or inorganic oxides for partially absorbing, for example, blue light, and the material of the second light absorption layer can be the same as the material of the first light absorption layer, for example, it can be zinc oxide nanoparticle photoresist, and the material of the first filter layer, the material of the second filter layer and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0077] Referring to the embodiment of the first reflective layer in step S102, the embodiment of the first through-hole filling in step S103, and another embodiment of the first barrier layer in step S104, according to another embodiment of the second barrier layer of the present disclosure, a second barrier layer is disposed on the first barrier layer, so that the second barrier layer includes a third through-hole array, the third through-hole array corresponds to the second through-hole array, wherein the third through-hole array includes a plurality of groups of third through-holes corresponding to the plurality of groups of first through-holes and the plurality of groups of second through-holes, the number of the third through-holes in each group of the third through-holes is the same as the number of the second through-holes in each group of the second through-holes, and the third through-holes in each group of the third through-holes correspond to the corresponding The method comprises: providing a second barrier layer on the first barrier layer and providing a third barrier layer on the second barrier layer, so that the third barrier layer corresponds to the second barrier layer, wherein the third barrier layer corresponds to the second barrier layer, wherein the third barrier layer corresponds to the second barrier layer, wherein the third barrier layer corresponds to the second barrier layer, wherein the third barrier layer corresponds to the second barrier layer, wherein the third barrier layer corresponds to the plurality of first barrier layers and the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of first barrier layers and the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of first barrier layers and the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of third barrier layers, wherein each third barrier layer corresponds to the plurality of first barrier layers and ... third barrier layers, wherein each third barrier layer corresponds to the plurality of first barrier layers and the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of third barrier layers, wherein each third barrier layer corresponds to the plurality of first barrier layers and the plurality of second barrier layers, wherein each third barrier layer corresponds to the plurality of third barrier layers and the plurality of third barrier layers, wherein each third barrier layer corresponds to the plurality of first barrier layers and the plurality of third barrier layers, wherein each third barrier layer corresponds to the plurality of first barrier layers and the plurality of third barrier layers, wherein each third barrier layer corresponds to the plurality of first barrier layers and the plurality of third barrier layers, wherein each third barrier layer corresponds to the plurality of first barrier layers and the plurality of third

[0078] Further, before the second barrier layer is provided on the first barrier layer, the method further comprises a second filling step, wherein the second filling step comprises at least one of the following steps: filling a fourth filling portion in a second through hole in each group of second through holes that is not aligned with the first through hole, wherein the fourth filling portion comprises a fourth filter layer that only allows light of a fourth color to pass through, a second light absorbing layer or a transparent material that is used to partially absorb light of a third color; filling a fifth filling portion in a second through hole in each group of second through holes that is aligned with the first through hole, wherein the fifth filling portion comprises a third filter layer that only allows light of a third color to pass through, a second light absorbing layer or a transparent material that is used to partially absorb light of the third color.

[0079] Furthermore, the second filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0080] In this embodiment, the light of the fourth color refers to the light of the wavelength range corresponding to the fourth color, the fourth color is yellow light and the third color is blue. The material of the second light absorption layer includes organic dyes, nano absorption particles or inorganic oxides for partially absorbing, for example, blue light, the material of the second light absorption layer can be the same as the material of the first light absorption layer, for example, zinc oxide nanoparticle photoresist, the material of the third filter layer and the material of the fourth filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0081] Reference Figure 2-Figure 13 ,in Figure 7 A side view schematic diagram of the filling portion filled in each group of second through holes is shown. Figure 6 ,like Figure 7 As shown, a first filling portion is filled in the first second through hole 1041 in each group of second through holes, and the first filling portion may include a first filter layer 1051 that only allows light of a first color, such as red, to pass through; a second filling portion is filled in the second second through hole 1042 in each group of second through holes, and the second filling portion may include a second filter layer 1052 that only allows light of a second color, such as green, to pass through; a second light absorbing layer 1053 is filled in the third second through hole 1043 in each group of second through holes, and the second light absorbing layer 1053 is used to partially absorb light of a third color, such as blue, to obtain the following: Figure 5 It is worth noting that in other embodiments, when there are unfilled second through holes in each group of second through holes, a transparent material may be filled in the unfilled second through holes to support the portion above the corresponding first through hole in the subsequent preparation process, and the transparent material may be any suitable material such as a transparent resin.

[0082] Reference Figure 2-Figure 13 ,in Figure 8 FIG. 2 shows a side view schematic diagram of a second barrier layer disposed on the first barrier layer. Figure 8 As shown, the second barrier layer 106 may be, for example, a black photoresist layer, so a black photoresist layer may be coated on the first barrier layer 104 and the filling portion by spin coating, and then, for example, a third through hole array 1060 may be opened on the black photoresist layer by photolithography, so that the third through hole array 1060 is aligned with the second through hole array 1040, and the third through hole array 1060 exposes the filling portion. The third through hole array 1060 includes a plurality of groups of third through holes corresponding to the plurality of groups of first through holes and the plurality of groups of second through holes, each group of third through holes includes a first third through hole 1061 aligned with the first second through hole 1041, a second third through hole 1062 aligned with the second second through hole 104, and a third third through hole 1063 aligned with the third second through hole 1043, and the third third through hole 1063 is aligned with the first through hole 1021, so as to obtain the following: Figure 8 The structure shown.

[0083] In step S106, a photoluminescent material layer may be filled in the third through holes in each group of third through holes that have no corresponding first through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0084] According to an embodiment of the present disclosure, after obtaining the third through hole array, a photoluminescent material layer may be filled into the third through hole array.

[0085] Referring to the embodiment of the first reflective layer in step S102, the embodiment of the first through hole filling in step S103, an embodiment of the first barrier layer in step S104, and an embodiment of the second barrier layer in step S105, according to an embodiment of the filled photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, and the photoluminescent material layer is filled in the third through holes without corresponding first through holes in each group of third through holes to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, comprising: filling the first third through hole in each group of third through holes with the photoluminescent material layer of the first color, and filling the second third through hole in each group of third through holes with the photoluminescent material layer of the second color, and synthesizing the light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color to obtain white light.

[0086] In this embodiment, the light of the first color refers to the light of the wavelength range corresponding to the first color, the light of the second color refers to the light of the wavelength range corresponding to the second color, and the light of the third color refers to the light of the wavelength range corresponding to the third color. The first color, the second color and the third color may be three primary colors, for example, the first color is red, the second color is green and the third color is blue. The material of the photoluminescent material layer of the first color and the material of the photoluminescent material layer of the second color include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots.

[0087] Referring to the embodiment of the first reflective layer in step S102, the embodiment of the first through hole filling in step S103, another embodiment of the first barrier layer in step S104, and another embodiment of the second barrier layer in step S105, according to another embodiment of the filled photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in the third through holes in each group of third through holes that do not correspond to the first through holes to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the photoluminescent material layer of the fourth color in the third through holes in each group of third through holes that are not aligned with the first through holes, and synthesizing the light corresponding to the fourth color and the light of the third color to obtain white light.

[0088] In this embodiment, the light of the fourth color refers to light of a wavelength range corresponding to the fourth color, the fourth color is yellow light and the third color is blue. The material of the photoluminescent material layer of the fourth color may include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots.

[0089] According to an embodiment of the present disclosure, when a photoluminescent material layer is filled in a third through hole in each group of third through holes that has no corresponding first through hole, the method further includes: filling a sixth filling portion in a third through hole in each group of third through holes that corresponds to the first through hole, the sixth filling portion comprising a third light absorbing layer, a photoluminescent material layer of a third color, or a transparent material, the third light absorbing layer being used to partially absorb light emitted by the micro LED unit.

[0090] According to an embodiment of the present disclosure, after the third through holes in each group of third through holes without corresponding first through holes are filled with a photoluminescent material layer, the method further includes: arranging a second reflective layer on the second barrier layer and the photoluminescent material layer, the second reflective layer being used to reflect light of a color corresponding to the photoluminescent material layer. The second reflective layer may include a distributed Bragg reflective film for reflecting light of a color corresponding to the photoluminescent material layer, and of course may also include any material layer for reflecting light of a color corresponding to the photoluminescent material layer. The second reflective layer may be, for example, a distributed Bragg reflective film formed by alternately stacking silicon dioxide layers and titanium dioxide layers. It is worth noting that although the second reflective layer and the first reflective layer are both distributed Bragg reflective films formed by alternately stacking silicon dioxide layers and titanium dioxide layers, the number of silicon dioxide layers and titanium dioxide layers in the second reflective layer and the thickness of each silicon dioxide layer and each titanium dioxide layer are different from those of the first reflective layer.

[0091] According to an embodiment of the present disclosure, after filling the third through holes in each group of third through holes without corresponding first through holes with a photoluminescent material layer, the method further includes: providing an insulating layer on the second barrier layer and the photoluminescent material layer.

[0092] Reference Figure 2-Figure 13 ,in Fig. 9 A schematic side view of a photoluminescent material layer filled in a third through hole without a corresponding first through hole in each group of third through holes is shown. Figure 8 ,like Fig. 9 As shown, the first third through hole 1061 in each group of third through holes is filled with a first color photoluminescent material layer 1071, such as red, and the second third through hole 1062 in each group of third through holes is filled with a second color photoluminescent material layer 1072, such as green.

[0093] Reference Figure 2-Figure 13 ,in Fig.10 A side view schematic diagram of a sixth filling portion filled in a third through hole corresponding to the first through hole in each group of third through holes is shown. Figure 8 and Fig. 9 ,like Fig.10As shown, the sixth filling part is, for example, a third light absorbing layer 1073, and the third light absorbing layer 1073 for absorbing, for example, blue light is filled in the third third through hole 1063 aligned with the first through hole 1021 and the third second through hole 1043. The material of the third light absorbing layer 1073 includes an organic dye, nano absorption particles or inorganic oxide for absorbing blue light, and the material of the third light absorbing layer 1073 can be the same as the material of the first light absorbing layer 1031 and the material of the second light absorbing layer 1053, for example, it can be a zinc oxide nanoparticle photoresist. It is worth noting that the above filling order of the first color photoluminescent material layer 1071, the second color photoluminescent material layer 1072 and the third light absorbing layer 1073 is only exemplary and is not limited here. The filling order of the first color photoluminescent material layer 1071, the second color photoluminescent material layer 1072 and the first light absorbing layer 1073 can be arbitrarily adjusted according to the actual preparation conditions such as specific processes and equipment. The sixth filling part may further include a photoluminescent material layer of a third color, such as blue, so that the light of a third color, such as blue light, emitted by the micro LED unit excites the photoluminescent material layer of the third color to emit light of a third color, such as blue light.

[0094] Reference Figure 2-Figure 13 ,in Fig.11 FIG. 4 is a side view schematic diagram showing an insulating layer disposed on the second barrier layer, the photoluminescent material layer and the sixth filling portion. Fig.11 As shown, a plasma enhanced chemical vapor deposition (PECVD) method can be used to deposit an insulating layer 108 such as a silicon dioxide layer on the second barrier layer 106, the first photoluminescent material layer 1071, the second photoluminescent material layer 1072 and the third light absorbing layer 1073 to obtain a Fig.11 The first color conversion structure 10 shown. Of course, the insulating layer may also include any other applicable materials, such as any applicable polymer organic materials and inorganic oxides, and any applicable preparation process may be used to prepare the insulating layer for different materials. The insulating layer is used to protect other parts of the first color conversion structure, and can be used as a surface layer of the first color conversion structure to make the surface of the first color conversion structure smoother, thereby facilitating the subsequent bonding of the first color conversion structure with the micro LED chip.

[0095] In step S107 , the side of the first color conversion structure opposite to the transparent substrate may be bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0096] According to an embodiment of the present disclosure, after obtaining the first color conversion structure, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0097] Furthermore, bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip includes: bonding an insulating layer of the first color conversion structure to the light emitting side of the micro LED chip.

[0098] Furthermore, each micro LED unit in the micro LED unit array includes a first semiconductor layer on the light emitting side, and bonding the insulating layer of the first color conversion structure to the light emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the first semiconductor layer.

[0099] According to an embodiment of the present disclosure, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0100] According to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0101] Reference Figure 2-Figure 13 ,in Fig.12 FIG. 4 shows a side view of bonding the first color conversion structure 10 to the micro LED chip 20 according to one embodiment of the present disclosure. Fig.12 As shown, the insulating layer 108 of the first color conversion structure 10 is bonded to the first semiconductor layer 20111 of the LED chip 20 of the micro LED chip structure to obtain Fig.12 The structure shown.

[0102] Reference Figure 2-Figure 13 ,in Fig.13 FIG. 4 shows a side view of a micro LED device 1 according to an embodiment of the present disclosure. Fig.13 As shown, remove Fig.12 The transparent substrate 101 of the first color conversion structure 10 in the structure shown in FIG. 1 is used to obtain the second color conversion structure 11 through the first color conversion structure 10. Fig.13 The micro LED device 1 is shown.

[0103] Reference Figures 2 to 13It should be understood that the light of the third color, such as blue light, emitted by the micro LED unit 2011 excites the photoluminescent material layer 1071 of the first color, such as red, to emit red light, and the light of the third color, such as blue light, emitted by the micro LED unit 2011 excites the photoluminescent material layer 1072 of the second color, such as green, to emit green light. Since the position corresponding to the first light absorption layer 1031 is used to emit blue light, the light of the third color, such as blue light, emitted by the micro LED unit is partially absorbed after passing through the first light absorption layer 1031, and some of the blue light still passes through the first light absorption layer 1031. The light of the first color, such as red light, the light of the second color, such as green light, and the light of the third color, such as blue light, emitted through the photoluminescent material layer and the first light absorption layer 1031 can be synthesized to obtain white light. Therefore, by providing a first light-absorbing layer that partially absorbs, for example, blue light emitted by the micro LED unit, the blue light overflow caused by the blue light emitted by the micro LED unit directly emitted from the micro LED device can be reduced, thereby reducing the color deviation and poor color purity caused by the blue light overflow, thereby improving the balance of different colors of light emitted from the micro LED device, enhancing the color purity of the micro LED, and further improving the display effect of the micro LED device.

[0104] Furthermore, since the first reflective layer 102 covers the photoluminescent material layer, when a portion of the light emitted by the micro LED unit 2011 does not participate in exciting the photoluminescent material layer and passes through the photoluminescent material layer and leaks out, the first reflective layer 102 can reflect part of the blue light leaked from the photoluminescent material layer 1071 of the first color, such as red, back to the red photoluminescent material layer and re-participate in exciting the red photoluminescent material layer, and the first reflective layer 102 can reflect part of the blue light leaked from the photoluminescent material layer 1072 of the second color, such as green, back to the green photoluminescent material layer and re-participate in exciting the green photoluminescent material layer, thereby increasing the light participating in exciting the photoluminescent material layer, thereby increasing the light output of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and reducing the mixed output of the leaked part of the light and the light of different colors emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.

[0105] In addition, since the third second through hole 1043 is aligned with the first through hole 1031 and the second light absorption layer 1053 is filled in the third second through hole 1043, the second light absorption layer 1053 can form a whole with the first light absorption layer 1031 to further enhance the absorption of the third color of light, such as blue light, emitted by the micro LED unit 2011, thereby further reducing the blue light overflow caused by the light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device.

[0106] In addition, since the third third through hole 1063 is aligned with the first through hole 1031 and the third second through hole 1043, and the third light absorption layer 1073 is filled in the third third through hole 1063, the third light absorption layer 1073 can form a whole with the first light absorption layer 1031 and the second light absorption layer 1053 to further enhance the absorption of the third color of light, such as blue light, emitted by the micro LED unit 2011, thereby further reducing the blue light overflow caused by the light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device.

[0107] Furthermore, regarding the second reflective layer, the second reflective layer is disposed on the second barrier layer and the photoluminescent material layer, and the insulating layer can be disposed on the second reflective layer and between the second reflective layer and the micro LED chip, so the second reflective layer can cover, for example, the photoluminescent material layer of the first color, the photoluminescent material layer of the second color, and the sixth filling portion of, for example, the third light absorbing layer. Since the second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer, light emitted from the micro LED unit, for example, blue light, can pass through the second reflective layer, and when the blue light emitted by the micro LED unit excites the photoluminescent material layer of the first color, for example, red, and emits red light, part of the excited red light will be emitted toward the direction of the micro LED unit, and the second reflective layer can reflect the part of the red light toward the direction of the photoluminescent material layer of the first color, for example, red, so as to increase the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED and preventing the red light from being emitted toward the micro LED unit. The part of the red light emitted in the direction of the D unit interferes with the blue light emitted by the micro LED unit; similarly, when the blue light emitted by the micro LED unit excites the photoluminescent material layer of the second color, such as green, to emit green light, part of the excited green light will be emitted in the direction of the micro LED unit, and the second reflective layer can reflect the part of the green light in the direction of the photoluminescent material layer of the second color, such as green, so as to increase the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED and preventing the part of the green light emitted in the direction of the micro LED unit from interfering with the blue light emitted by the micro LED unit. It is worth noting that when the first second through hole 1041 is filled with the first filter layer 1051 and the second second through hole 1042 is filled with the second filter layer 1052, the first filter layer 1051 only allows the light of the first color, such as red light, to pass through, and the first filter layer 1051 will reflect the light of the third color, such as blue light, in the direction of the photoluminescent material layer 1071 of the first color, such as red. The second filter layer 1052 only allows light of a second color, such as green light, to pass through, and the second filter layer 1052 reflects light of a third color, such as blue light, toward the direction of the photoluminescent material layer 1072 of the second color, such as green. Therefore, the first filter layer 1051 and the second filter layer 1052 function to reflect light other than the light of the corresponding color, which is different from the light absorption function of the first light absorption layer, the second light absorption layer and the third light absorption layer.

[0108] The present disclosure also provides a micro LED device.

[0109] like Figure 2-Figure 13As shown, the micro LED device 1 includes a second color conversion structure 11 and a micro LED chip structure, wherein the micro LED chip structure includes a micro LED chip 20, and the micro LED chip 20 includes a micro LED unit array 201 composed of a plurality of micro LED units 2011, wherein the second color conversion structure 11 includes: a first reflective layer 102, wherein the first reflective layer 102 includes a first through hole array 1020, wherein the arrangement of the first through hole array 1020 corresponds to the arrangement of the micro LED unit array 201, and the first through hole array 1020 The first through hole array 1040 includes a plurality of groups of first through holes, each group of first through holes includes at least one first through hole, the first reflective layer 102 is used to reflect the light emitted by the micro LED unit 2011; a first light absorbing layer 1031, the first light absorbing layer 1031 is filled in each group of first through holes, the first light absorbing layer 1031 is used to partially absorb the light emitted by the micro LED unit 2011; a first barrier layer 104, the first barrier layer 104 is arranged under the first reflective layer 102 and the first light absorbing layer 1031, the first barrier layer 104 includes a second through hole array 1040, wherein The second through hole array 1040 includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, the number of second through holes in each group of second through holes is greater than the number of first through holes in the corresponding first through hole group, and part of the second through holes in each group of second through holes corresponds to the first through holes in the corresponding first through hole group; a second barrier layer 106, the second barrier layer 106 is disposed below the first barrier layer 104 and includes a third through hole array 1060, the third through hole array 1060 corresponds to the second through hole array 1040, wherein the third through hole array 1060 includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes a plurality of groups of third through holes corresponding to the plurality of groups of second through holes, wherein the number of third through holes in each group of third through holes is the same as the number of second through holes in each group of second through holes and the third through holes in each group of third through holes correspond to the second through holes in the corresponding second through hole group, and part of the third through holes in each group of third through holes correspond to the first through holes in the corresponding first through hole group; a photoluminescent material layer, wherein the photoluminescent material layer is filled in the third through holes in each group of third through holes that do not correspond to the first through holes, wherein the color of light emitted by the micro LED unit 2011 is different from the color corresponding to the photoluminescent material layer. The second barrier layer 106 and the photoluminescent material layer of the second color conversion structure 11 are arranged on the light emitting side of the micro LED chip 20.

[0110] According to an embodiment of the present disclosure, each group of first through holes includes a first through hole 1021, the first reflective layer 102 is used to reflect the light of the third color emitted by the micro LED unit 2011, the first light absorbing layer 1031 is filled in the first through hole 1021 in each group of first through holes, and the first light absorbing layer 1031 is used to partially absorb the light of the third color emitted by the micro LED unit 2011, each group of second through holes includes three second through holes, the three second through holes include a first second through hole 1041, a second second through hole 1042 and a third second through hole 1043, the third second through hole 1043 is aligned with the first through hole 1021, and each group of third through holes includes three third through holes, the three third through holes include a first third through hole 1041 aligned with the first second through hole 1041 61, a second third through hole 1062 aligned with the second second through hole 1042 and a third third through hole 1063 aligned with the third second through hole 1043, and the third third through hole 1063 is aligned with the first through hole 1021 aligned with the third second through hole 1043, the photoluminescent material layer includes a photoluminescent material layer 1071 of a first color and a photoluminescent material layer 1072 of a second color, the photoluminescent material layer 1071 of the first color is filled in the first third through hole 1061 in each group of third through holes, and the photoluminescent material layer 1072 of the second color is filled in the second third through hole 1062 in each group of third through holes, and the light corresponding to the first color, the light corresponding to the second color and the light corresponding to the third color are synthesized to obtain white light.

[0111] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes at least one of a first filling portion, a second filling portion and a third filling portion, wherein: the first filling portion is used to fill the first second through hole 1041 in each group of second through holes, and the first filling portion includes a first filter layer 1051 that only allows light of the first color to pass through, and a second light absorption layer or a transparent material for partially absorbing light of the third color; the second filling portion is used to fill the second second through hole 1042 in each group of second through holes, and the second filling portion includes a second filter layer 1052 that only allows light of the second color to pass through, and a second light absorption layer or a transparent material for partially absorbing light of the third color; the third filling portion is used to fill the third second through hole 1043 in each group of second through holes, and the third filling portion includes a third filter layer that only allows light of the third color to pass through, and a second light absorption layer 1053 or a transparent material for partially absorbing light of the third color.

[0112] According to an embodiment of the present disclosure, when there is an unfilled second through hole in each group of second through holes, the second color conversion structure 11 further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0113] According to an embodiment of the present disclosure, the first color is red, the second color is green, and the third color is blue.

[0114] According to an embodiment of the present disclosure, each group of first through holes includes a first through hole, the first reflective layer is used to reflect the light of the third color emitted by the micro LED unit, the first light absorbing layer is filled in the first through hole in each group of first through holes, and the first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, each group of second through holes includes two second through holes, one of the two second through holes is aligned with the first through hole filled with the first light absorbing layer, each group of third through holes includes two third through holes respectively aligned with the two second through holes in the corresponding second through hole group, one third through hole in each group of third through holes is aligned with the first through hole in the corresponding first through hole group and one second through hole in the corresponding second through hole group, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in the third through hole in each group of third through holes that is not aligned with the first through hole, and the light corresponding to the fourth color and the light of the third color are synthesized to obtain white light.

[0115] According to an embodiment of the present disclosure, the second color conversion structure also includes at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is used to fill the second through hole in each group of second through holes that is not aligned with the first through hole, and the fourth filling part includes a fourth filter layer that only allows light of the fourth color to pass through, a second light absorption layer or a transparent material that is used to partially absorb light of the third color; the fifth filling part is used to fill the second through hole in each group of second through holes that is aligned with the first through hole, and the fifth filling part includes a third filter layer that only allows light of the third color to pass through, a second light absorption layer or a transparent material that is used to partially absorb light of the third color.

[0116] According to an embodiment of the present disclosure, when there is an unfilled second through hole in each group of second through holes, the second color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0117] According to an embodiment of the present disclosure, the fourth color is yellow and the third color is blue.

[0118] According to an embodiment of the present disclosure, the second color conversion structure 11 also includes a sixth filling portion, which includes a third light absorbing layer 1073, a photoluminescent material layer of a third color and a transparent material. The sixth filling portion is filled in the third through hole corresponding to the first through hole 1021 in each group of third through holes, and the third light absorbing layer 1073 is used to partially absorb the light emitted by the micro LED unit 2011.

[0119] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a second reflective layer, which is disposed below the second barrier layer 106 and the photoluminescent material layer, and is used to reflect light of a color corresponding to the photoluminescent material layer.

[0120] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes an insulating layer 108 , which is disposed below the second barrier layer 106 and the photoluminescent material layer, and is disposed on the light emitting side of the micro LED chip 20 .

[0121] According to an embodiment of the present disclosure, the micro LED chip structure 11 also includes a driving chip, and the side of the micro LED chip 20 opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip 20 opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0122] According to an embodiment of the present disclosure, the material of the first barrier layer 104 and the material of the second barrier layer 106 include visible light shielding materials, the material of the first color photoluminescent material layer 1071 and the material of the second color photoluminescent material layer 1072 include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer 1031 and the material of the second light absorption layer 1053 include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, the material of the first filter layer 1051, the material of the second filter layer 1052 and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides, and the first reflective layer 102 includes a distributed Bragg reflector film for reflecting light of a color corresponding to the photoluminescent material layer.

[0123] It is worth noting that any relevant description about the micro LED device in the above-mentioned micro LED device preparation method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro LED device disclosed in the present invention.

[0124] According to embodiments of the present disclosure, the pixel size in the micro LED device is typically less than 50 microns.

[0125] The present disclosure also provides a display device, which includes the above-mentioned type LED device. The display device can be applied to flexible electronic devices to realize technologies such as augmented reality (AR), virtual reality (VR), extended reality (XR), and mixed reality (MR). For example, the micro LED device can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the micro LED device can also be the display part of an electronic device, such as a smart phone, a smart watch, a laptop, a tablet computer, a driving recorder, a navigator, a head-mounted device, and any other device with a display screen.

[0126] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0127] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the serial number of each step / process mentioned above does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.

[0128] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0129] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A method for preparing a micro LED device, wherein: The method comprises: Obtaining a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; Disposing a first reflective layer on the transparent substrate, so that the first reflective layer includes a first through-hole array, wherein the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, the first through-hole array includes a plurality of groups of first through-holes, each group of first through-holes includes at least one first through-hole, and the first reflective layer is used to reflect light emitted by the micro LED unit; Filling a first light absorption layer in each group of first through holes to obtain a first intermediate structure, wherein the first light absorption layer is used to partially absorb light emitted by the micro LED unit; Disposing a first barrier layer on the first intermediate structure, so that the first barrier layer includes a second through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, the number of second through holes in each group of second through holes is greater than the number of first through holes in the corresponding first through hole group, and part of the second through holes in each group of second through holes corresponds to the first through holes in the corresponding first through hole group; Disposing a second barrier layer on the first barrier layer, so that the second barrier layer includes a third through hole array, the third through hole array corresponds to the second through hole array, wherein the third through hole array includes a plurality of groups of third through holes corresponding to the plurality of groups of first through holes and the plurality of groups of second through holes, the number of third through holes in each group of third through holes is the same as the number of second through holes in each group of second through holes, and the third through holes in each group of third through holes correspond to the second through holes in the corresponding second through hole group, and part of the third through holes in each group of third through holes correspond to the first through holes in the corresponding first through hole group; Filling a photoluminescent material layer in the third through holes in each group of third through holes that do not have a corresponding first through hole to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; The side of the first color conversion structure opposite to the transparent substrate is bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

2. The method for preparing a micro LED device according to claim 1, wherein: A first reflective layer is arranged on a transparent substrate, so that the first reflective layer includes a first through-hole array, wherein the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, the first through-hole array includes a plurality of groups of first through-holes, each group of first through-holes includes at least one first through-hole, and the first reflective layer is used to reflect the light emitted by the micro LED unit, comprising: a first reflective layer is arranged on a transparent substrate and a first through-hole array is opened on the first reflective layer, so that the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes a plurality of groups of first through-holes, each group of first through-holes includes one first through-hole, and the first reflective layer is used to reflect the light of the third color emitted by the micro LED unit, Filling a first light absorption layer in each group of first through holes to obtain a first intermediate structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, comprises: filling a first light absorption layer in a first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of a third color emitted by the micro LED unit, and arranging a first barrier layer on the first intermediate structure, so that the first barrier layer includes a second through hole array, wherein the second through hole array includes a plurality of second through holes corresponding to the plurality of first through holes, and the number of second through holes in each group of second through holes is greater than or equal to 1. The method comprises: providing a first barrier layer on the first intermediate structure and providing a second through hole array on the first barrier layer, so that the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, each group of second through holes includes three second through holes, the three second through holes include a first second through hole, a second second through hole and a third second through hole, the third second through hole is aligned with the first through hole, and providing a second barrier layer on the first barrier layer. The invention relates to a barrier layer, wherein the second barrier layer comprises a third through hole array, the third through hole array corresponds to the second through hole array, wherein the third through hole array comprises a plurality of groups of third through holes corresponding to the plurality of groups of first through holes and the plurality of groups of second through holes, the number of third through holes in each group of third through holes is the same as the number of second through holes in each group of second through holes, and the third through holes in each group of third through holes correspond to the second through holes in the corresponding second through hole group, and part of the third through holes in each group of third through holes correspond to the first through holes in the corresponding first through hole group, comprising: arranging a second barrier layer on the first barrier layer and A third through hole array is provided on the second barrier layer, so that the third through hole array corresponds to the second through hole array, wherein the third through hole array includes a plurality of groups of third through holes corresponding to the plurality of groups of first through holes and the plurality of groups of second through holes, each group of third through holes includes three third through holes, the three third through holes include a first third through hole aligned with the first second through hole, a second third through hole aligned with the second second through hole, and a third third through hole aligned with the third second through hole, and the third third through hole is aligned with the first through hole aligned with the third second through hole, The photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color. The photoluminescent material layer is filled in the third through holes in each group of third through holes that do not have a corresponding first through hole to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the first third through hole in each group of third through holes with a photoluminescent material layer of the first color, and filling the second third through hole in each group of third through holes with a photoluminescent material layer of the second color, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

3. The method for preparing a micro LED device according to claim 2, wherein: Before the second barrier layer is arranged on the first barrier layer, the method further comprises a first filling step, wherein the first filling step comprises at least one of the following steps: Filling a first filling portion in a first second through hole in each group of second through holes, wherein the first filling portion includes a first filter layer that allows only light of a first color to pass through, a second light absorption layer for partially absorbing light of a third color, or a transparent material; Filling a second filling portion in a second second through hole in each group of second through holes, wherein the second filling portion includes a second filter layer that allows only light of the second color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material; A third filling portion is filled in the third second through hole in each group of second through holes, wherein the third filling portion includes a third filter layer that allows only light of a third color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material.

4. The method for preparing a micro LED device according to claim 3, wherein: The first filling step further comprises: When there are unfilled second through holes in each group of second through holes, the unfilled second through holes are filled with a transparent material.

5. The method for preparing a micro LED device according to claim 1, wherein: A first reflective layer is arranged on a transparent substrate, so that the first reflective layer includes a first through-hole array, wherein the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, the first through-hole array includes a plurality of groups of first through-holes, each group of first through-holes includes at least one first through-hole, and the first reflective layer is used to reflect the light emitted by the micro LED unit, comprising: a first reflective layer is arranged on a transparent substrate and a first through-hole array is opened on the first reflective layer, so that the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes a plurality of groups of first through-holes, each group of first through-holes includes one first through-hole, and the first reflective layer is used to reflect the light of the third color emitted by the micro LED unit, Filling a first light absorbing layer in each group of first through holes to obtain a first intermediate structure, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit, including: filling a first light absorbing layer in a first through hole in each group of first through holes, wherein the first light absorbing layer is used to partially absorb the light of a third color emitted by the micro LED unit, arranging a first barrier layer on the first intermediate structure, so that the first barrier layer includes a second through hole array, wherein the second through hole array includes a plurality of second through holes corresponding to the plurality of first through holes, the number of second through holes in each group of second through holes is greater than the number of first through holes in the corresponding first through hole group, and some of the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group, including: arranging a first barrier layer on the first intermediate structure and opening a second through hole array on the first barrier layer, so that the second through hole array includes a plurality of second through holes corresponding to the plurality of first through holes, each group of second through holes includes two second through holes, and one of the two second through holes is aligned with the first through hole filled with the first light absorbing layer, A second barrier layer is disposed on the first barrier layer, so that the second barrier layer includes a third through-hole array, the third through-hole array corresponds to the second through-hole array, wherein the third through-hole array includes a plurality of groups of third through-holes corresponding to the plurality of groups of first through-holes and the plurality of groups of second through-holes, the number of third through-holes in each group of third through-holes is the same as the number of second through-holes in each group of second through-holes, and the third through-holes in each group of third through-holes correspond to the second through-holes in the corresponding second through-hole group, and part of the third through-holes in each group of third through-holes correspond to the first through-holes in the corresponding first through-hole group. The through-hole correspondence includes: arranging a second barrier layer on the first barrier layer and opening a third through-hole array on the second barrier layer, so that the third through-hole array corresponds to the second through-hole array, wherein the third through-hole array includes a plurality of groups of third through-holes corresponding to the plurality of groups of first through-holes and the plurality of groups of second through-holes, each group of third through-holes includes two third through-holes respectively aligned with two second through-holes in the corresponding second through-hole group, and one third through-hole in each group of third through-holes is aligned with a first through-hole in the corresponding first through-hole group and one second through-hole in the corresponding second through-hole group, The photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in the third through holes in each group of third through holes that do not have corresponding first through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the third through holes in each group of third through holes that are not aligned with the first through holes with a photoluminescent material layer of a fourth color, and synthesizing the light corresponding to the fourth color and the light of the third color to obtain white light.

6. The method for preparing a micro LED device according to claim 5, wherein: Before arranging the second barrier layer on the first barrier layer, the method further comprises a second filling step, wherein the second filling step comprises at least one of the following steps: Filling a fourth filling portion in the second through holes in each group of second through holes that are not aligned with the first through holes, wherein the fourth filling portion includes a fourth filter layer that allows only light of a fourth color to pass through, a second light absorption layer for partially absorbing light of a third color, or a transparent material; A fifth filling portion is filled in the second through holes aligned with the first through holes in each group of second through holes, wherein the fifth filling portion includes a third filter layer that allows only light of a third color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material.

7. The method for preparing a micro LED device according to claim 6, wherein: The second filling step further comprises: When there are unfilled second through holes in each group of second through holes, the unfilled second through holes are filled with a transparent material.

8. The method for preparing a micro LED device according to claim 1, wherein: When filling the photoluminescent material layer in the third through holes in each group of third through holes that have no corresponding first through holes, the method further comprises: A sixth filling portion is filled in the third through hole corresponding to the first through hole in each group of third through holes, wherein the sixth filling portion includes a third light absorption layer, a photoluminescent material layer of a third color or a transparent material, and the third light absorption layer is used to partially absorb the light emitted by the micro LED unit.

9. The method for preparing a micro LED device according to claim 1, wherein: After filling the photoluminescent material layer in the third through holes in each group of third through holes that have no corresponding first through holes, the method further includes: arranging a second reflective layer on the second barrier layer and the photoluminescent material layer, the second reflective layer being used to reflect light of a color corresponding to the photoluminescent material layer.

10. The method for preparing a micro LED device according to claim 1, wherein: After filling the photoluminescent material layer in the third through holes in each group of third through holes that do not have corresponding first through holes, the method further includes: providing an insulating layer on the second barrier layer and the photoluminescent material layer, Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the micro LED chip.

11. The method for preparing a micro LED device according to claim 1, wherein: After bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip, the method includes: The transparent substrate of the first color conversion structure is removed, and a second color conversion structure is obtained from the first color conversion structure.

12. A micro LED device, wherein: The micro LED device comprises a second color conversion structure and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, wherein the second color conversion structure comprises: a first reflective layer, the first reflective layer comprising a first through-hole array, wherein the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, the first through-hole array comprises a plurality of groups of first through-holes, each group of first through-holes comprises at least one first through-hole, and the first reflective layer is used to reflect light emitted by the micro LED unit; A first light absorbing layer, wherein the first light absorbing layer is filled in each group of first through holes, and the first light absorbing layer is used to partially absorb light emitted by the micro LED unit; a first barrier layer, the first barrier layer being arranged below the first reflective layer and the first light absorbing layer, the first barrier layer comprising a second through hole array, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, the number of second through holes in each group of second through holes is greater than the number of first through holes in the corresponding first through hole group, and part of the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group; a second barrier layer, the second barrier layer being disposed below the first barrier layer and comprising a third through-hole array, the third through-hole array corresponding to the second through-hole array, wherein the third through-hole array comprises a plurality of groups of third through-holes corresponding to the plurality of groups of first through-holes and the plurality of groups of second through-holes, the number of third through-holes in each group of third through-holes being the same as the number of second through-holes in each group of second through-holes, the third through-holes in each group of third through-holes corresponding to the second through-holes in the corresponding second through-hole group, and part of the third through-holes in each group of third through-holes corresponding to the first through-holes in the corresponding first through-hole group; a photoluminescent material layer, wherein the photoluminescent material layer is filled in the third through holes in each group of third through holes that do not have corresponding first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, The second barrier layer and the photoluminescent material layer of the second color conversion structure are arranged on the light emitting side of the micro LED chip.

13. The micro LED device according to claim 12, wherein: Each group of first through holes includes a first through hole, the first reflective layer is used to reflect the third color light emitted by the micro LED unit, the first light absorbing layer is filled in the first through hole in each group of first through holes, and the first light absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, each group of second through holes includes three second through holes, the three second through holes include a first second through hole, a second second through hole and a third second through hole, the third second through hole is aligned with the first through hole, each group of third through holes includes three third through holes, the three third through holes include a first third through hole aligned with the first second through hole, and a third third through hole aligned with the first second through hole. a second third through hole aligned with the second second through hole and a third third through hole aligned with the third second through hole, and the third third through hole is aligned with the first through hole aligned with the third second through hole, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, the photoluminescent material layer of the first color is filled in the first third through hole in each group of third through holes, and the photoluminescent material layer of the second color is filled in the second third through hole in each group of third through holes, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

14. The micro LED device according to claim 13, wherein: The second color conversion structure further includes at least one of a first filling portion, a second filling portion, and a third filling portion, wherein: The first filling part is used to fill the first second through hole in each group of second through holes, and the first filling part includes a first filter layer that only allows light of the first color to pass through, a second light absorption layer or a transparent material that is used to partially absorb light of a third color; The second filling part is used to fill the second second through hole in each group of second through holes, and the second filling part includes a second filter layer that only allows light of the second color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material; The third filling part is used to fill the third second through hole in each group of second through holes, and the third filling part includes a third filter layer that only allows light of a third color to pass through, a second light absorption layer or a transparent material for partially absorbing light of the third color.

15. The micro LED device according to claim 14, wherein: When there is an unfilled second through hole in each group of second through holes, the second color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

16. The micro LED device according to claim 14, wherein: The first color is red, the second color is green and the third color is blue.

17. The micro LED device according to claim 12, wherein: Each group of first through holes includes a first through hole, the first reflective layer is used to reflect the light of the third color emitted by the micro LED unit, the first light absorbing layer is filled in the first through hole in each group of first through holes, and the first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, each group of second through holes includes two second through holes, one of the two second through holes is aligned with the first through hole filled with the first light absorbing layer, each group of third through holes includes two third through holes respectively aligned with the two second through holes in the corresponding second through hole group, one third through hole in each group of third through holes is aligned with the first through hole in the corresponding first through hole group and one second through hole in the corresponding second through hole group, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in the third through hole in each group of third through holes that is not aligned with the first through hole, and the light corresponding to the fourth color and the light of the third color are synthesized to obtain white light.

18. The micro LED device according to claim 17, wherein: The second color conversion structure further includes at least one of a fourth filling portion and a fifth filling portion, wherein: The fourth filling part is used to fill the second through holes in each group of second through holes that are not aligned with the first through holes, and the fourth filling part includes a fourth filter layer that only allows light of a fourth color to pass through, a second light absorption layer for partially absorbing light of a third color, or a transparent material; The fifth filling part is used to fill the second through holes aligned with the first through holes in each group of second through holes, and the fifth filling part includes a third filter layer that only allows light of a third color to pass through, a second light absorption layer or a transparent material for partially absorbing light of the third color.

19. The micro LED device according to claim 18, wherein: When there is an unfilled second through hole in each group of second through holes, the second color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

20. The micro LED device according to claim 18, wherein: The fourth color is yellow and the third color is blue.

21. The micro LED device according to claim 12, wherein: The second color conversion structure also includes a sixth filling part, which includes a third light absorption layer, a photoluminescent material layer of a third color and a transparent material. The sixth filling part is filled in the third through hole corresponding to the first through hole in each group of third through holes, and the third light absorption layer is used to partially absorb the light emitted by the micro LED unit.

22. The micro LED device according to claim 12, wherein: The second color conversion structure further includes a second reflective layer, which is disposed below the second barrier layer and the photoluminescent material layer, and is used to reflect light of a color corresponding to the photoluminescent material layer.

23. The micro LED device according to claim 12, wherein: The second color conversion structure further includes an insulating layer, which is disposed below the second barrier layer and the photoluminescent material layer, and is disposed on the light emitting side of the micro LED chip.

24. The micro LED device according to claim 12, wherein: The micro LED chip structure further includes a driving chip, and a side of the micro LED chip opposite to the light emitting side is arranged on the driving chip. Alternatively, the micro LED chip structure further includes a driving chip and a flexible circuit board, the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

25. The micro LED device according to claim 14, wherein: The material of the first barrier layer and the material of the second barrier layer include visible light shielding materials, the material of the first color photoluminescent material layer and the material of the second color photoluminescent material layer include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer and the material of the second light absorption layer include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, the material of the first filter layer, the material of the second filter layer and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides, and the first reflective layer includes a distributed Bragg reflector film for reflecting light of the color corresponding to the photoluminescent material layer.

26. A display device, wherein: The display device comprises the micro LED device according to any one of claims 12 to 25.

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