Flexible assembly lossless stripping method in perovskite solar cell preparation

Abstract

According to the flexible assembly lossless stripping method in perovskite solar cell preparation, a flexible perovskite assembly, an overlying POE adhesive film and a flexible cover plate are attached to a rigid substrate, and the rigid cover plate is used for lamination, so that a laminated structure beneficial to lossless stripping is formed. Under the condition that a small part of flexibility is lost after hot pressing, the bonding force between the layers of the flexible perovskite assembly and between the flexible perovskite assembly and the flexible cover plate is obviously greater than the bonding force between the flexible perovskite packaging assembly and the rigid substrate; and the stripping of the flexible perovskite packaging assembly and the rigid substrate and the damage of bending and tension in an actual application scene to each functional layer are avoided. The flexible perovskite packaging assembly is prevented from being directly torn down, micro-deformation and damage generated by the assembly can be smaller, the overall structural strength of the flexible perovskite packaging assembly is improved, the packaging effect is achieved, stability is good, the yield is better, the long-term stability of the flexible assembly can be enhanced, and the flexible perovskite packaging assembly is suitable for large-area production.

Description

Technical Field

[0001] The present invention belongs to the field of structure, manufacturing method and application technology related to IPC classification H10K71 / 00 semiconductor devices, and in particular to a flexible perovskite packaging component stripping technology used in the preparation of perovskite solar cells. Background Art

[0002] As the global energy crisis and environmental pollution become increasingly serious, the development and utilization of renewable energy has become an important direction for global energy transformation. As a clean and renewable energy source, the development and utilization of solar energy has received widespread attention. As one of the main ways to utilize solar energy, photovoltaic technology has developed rapidly and has huge market potential. Under the background of energy transformation and the development of photovoltaic technology, perovskite components have gradually become an important development direction in the photovoltaic field with their unique advantages and potential.

[0003] Perovskite solar cell modules are a new type of solar cell modules with the advantages of high conversion efficiency, low cost, and short industrial chain. They are widely used in BIPV, distributed power sources, ground power stations and other fields.

[0004] Perovskite solar cell modules are mainly composed of perovskite layer, charge transport layer and electrode. Among them, the charge transport layer includes electron transport layer and hole transport layer. The working principle of perovskite solar cell modules is based on the photoelectric conversion effect of perovskite materials. When sunlight shines on the perovskite layer, photons are absorbed and stimulate electrons and holes. These carriers are then separated through the charge transport layer and collected on the electrode, thereby generating current.

[0005] The commercial application of perovskite solar cell modules still faces some challenges, such as the long-term stability of the modules, the uniformity of large-area preparation, and the cost and environmental protection of materials. In order to solve these problems, researchers are constantly working to explore new materials, processes and packaging technologies.

[0006] The conversion efficiency of perovskite solar cell modules has exceeded that of traditional silicon-based solar cells, and the efficiency at the laboratory level can even reach more than 25%. The raw materials of perovskite materials are abundant and the purity requirements are low. The preparation process is relatively simple, so the cost is low. It can be prepared by solution method and is suitable for large-scale production.

[0007] In recent years, research on perovskite solar cell modules has made significant progress. For example, some researchers have introduced dopants and additives to improve the quality and stability of perovskite films; others have used new preparation processes and equipment to achieve the preparation of large-area, high-quality perovskite films.

[0008] The stability of perovskite solar cell modules is one of the key issues in their commercial application. In order to improve the stability of the modules, researchers have adopted a variety of packaging technologies, such as POE film and butyl adhesive with strong water vapor barrier capabilities. These packaging materials can effectively block the intrusion of water vapor and other harmful substances, thereby extending the service life of the modules.

[0009] These research results provide strong support for the commercial application of perovskite solar cell modules.

[0010] Patent CN117750849A discloses a method for preparing a large-area flexible perovskite solar cell and a cell. A method for preparing a large-area flexible perovskite solar cell with a flexible substrate bonded to a rigid substrate, the preparation method comprising: bonding a flexible transparent conductive substrate with a protective film to a rigid substrate; removing part of the conductive layer on the flexible transparent conductive substrate by laser scribing; sequentially preparing a charge transfer layer, a perovskite active layer and a charge transfer layer; removing part of the charge transfer layer, the perovskite active layer and the charge transfer layer by laser scribing; preparing a metal electrode layer; removing part of the metal electrode layer, the charge transfer layer, the perovskite active layer and the charge transfer layer by laser scribing; separating the flexible transparent conductive substrate from the rigid substrate to obtain a large-area flexible perovskite solar cell. Among them, during the preparation process, the flexible transparent conductive substrate is bonded to the rigid substrate, although the flatness of the flexible transparent conductive substrate is effectively guaranteed. However, CN110518121A discloses that when the double-sided adhesive tape of the flexible component is peeled off, due to the strong adhesion of the double-sided adhesive tape, the flexible perovskite solar cell may be damaged during the transfer process under the action of external force, which inevitably causes a significant decline in the performance of the flexible component. In practical applications, especially after the preparation of large-area components, since the perovskite solar cell has various film layers inside, many of which are even at the nanometer level, it is particularly critical to peel the prepared flexible component from the rigid substrate without causing internal damage and performance degradation during the peeling process.

[0011] Patent application CN117915735A discloses a flexible perovskite solar cell module and a method for preparing the same, which discloses a method for peeling a flexible substrate from a rigid substrate, and a flexible substrate from a rigid cover plate by laser after packaging is completed. This includes peeling the rigid substrate and the rigid cover plate from the adjacent flexible substrate by laser, thereby obtaining a flexible perovskite solar cell module. For example, patent application CN119053213A discloses a method for directly peeling the entire flexible perovskite photovoltaic module from the surface of a rigid substrate after the micro-functional layer on the surface is prepared. For example, patent application CN116406216A discloses a method for bonding a flexible perovskite module and a rigid substrate using a double-sided adhesive tape. After the flexible perovskite solar cell is prepared, a simple mechanical method is used to separate the flexible perovskite solar cell from the rigid glass substrate. For example, patent application 201910619236.6 discloses a large-area flexible perovskite solar cell and a method for preparing the same. The method for preparing the large-area flexible perovskite solar cell includes: making a flexible perovskite battery assembly on a rigid substrate, separating the flexible perovskite battery assembly from the rigid substrate, and obtaining a discrete perovskite solar cell. This type of technology is due to the fact that the flexible perovskite components are relatively thin, such as PET, and the thickness of the flexible perovskite packaging component used is as low as 100 microns, and there is no great strength. Since the bottom of the flexible component is fixed, during the separation process of the flexible perovskite component and the rigid substrate, the direct separation by mechanical means will cause the flexible component to have a very small radius of curvature and thus a larger curvature, causing deformation inside the flexible component, ultimately resulting in a decrease in efficiency and performance, and even affecting the stability of the long-term use of the flexible component. Summary of the invention

[0012] The present invention proposes a method for non-destructive stripping of flexible components in the preparation of perovskite solar cells, which avoids the damage of various functional layers caused by bending and tension in the roll-to-roll process, so as to solve the above-mentioned problems of the prior art and greatly improve the preparation efficiency of perovskite solar cells.

[0013] To this end, in the present invention: a process for non-destructively peeling a flexible perovskite encapsulation component from a rigid substrate comprises:

[0014] (1) As the core part of the flexible perovskite packaging component, the flexible perovskite component is attached to the rigid substrate through adhesive or its own characteristics, and the bus bar led out from the flexible perovskite component is connected;

[0015] (2) preparing POE film and flexible cover plate, and cutting POE film and flexible cover plate of corresponding size;

[0016] (3) Laminating the POE film, the flexible cover plate and the rigid cover plate; laminating the POE film in the center of the flexible perovskite component so that the POE film can be slightly adsorbed on the top electrode surface of the flexible perovskite component, and then laminating the flexible cover plate on the upper surface of the POE film. If a flexible cover plate with a reinforcement layer is used, the reinforcement layer is brought into contact with the POE film, and finally a rigid cover plate of the same size as the rigid substrate is covered to obtain a laminated structure in which the flexible perovskite package component is non-destructively peeled off from the rigid substrate, referred to as a laminated structure;

[0017] (4) Lamination is performed after the laminator is accurately limited; the entire laminated structure is placed in the laminator limit block to prevent the displacement of the two rigid components of the rigid base and the rigid cover plate, and also to make the lamination effect more flat and uniform; the laminated structure is taken out after lamination for a certain period of time under the high temperature vacuum environment of the laminator;

[0018] (5) Peeling off the flexible perovskite packaging component, which includes a flexible perovskite component, a POE film and a flexible cover plate; after the flexible perovskite packaging component cools down, the POE film solidifies, and then the rigid cover plate pressing on it is first removed, the flexible perovskite component is found, and the entire flexible perovskite packaging component is torn off from the rigid substrate or the sticky glue on the surface of the rigid substrate along the flexible perovskite component.

[0019] Among them, the weight of POE film should be controlled at 200g / m 2 Up to 500g / m 2 , the POE film should be retracted 1-5mm from the edge of the flexible perovskite component.

[0020] The flexible perovskite component has a protective film; or the flexible perovskite component has the property of being able to be separated from the rigid substrate after being formed on the rigid substrate.

[0021] In the process of tearing off the entire flexible perovskite packaging component from the rigid substrate or the sticky glue on the surface of the rigid substrate, first slightly lift the four corners of the flexible perovskite component from the sticky glue on the surface of the rigid base, and then gradually tear off one edge. After one side edge is completely uncovered, tear off the entire component along this edge.

[0022] Further, to achieve the above-mentioned purpose, the present invention is configured as follows: the laminated structure includes: a rigid substrate, an adhesive, a flexible perovskite packaging component and a rigid cover plate, wherein the flexible perovskite packaging component includes a flexible perovskite component, a POE adhesive film and a flexible cover plate; specifically includes:

[0023] Rigid substrate: can provide support for flexible perovskite packaging components, and the rigid substrate is glass;

[0024] Adhesive glue: Adhesive glue is double-sided adhesive, PDMS, OCA adhesive, adhesive film, which bonds the flexible perovskite component to the rigid substrate;

[0025] Flexible perovskite components: Flexible perovskite components are the core part of flexible perovskite packaging components; flexible perovskite components are PI, PET, PEN, with a thickness of 100-200μm;

[0026] POE film: POE film is a thermoplastic film;

[0027] Flexible cover: The materials of flexible cover include PET (polyethylene terephthalate), PES (polyethersulfone resin), PEN (polyethylene naphthalate), PVA (polyvinyl alcohol), transparent PI (polyimide) and NOA63;

[0028] Rigid cover: glass; during lamination packaging, the film is laminated evenly, flatly and consistently.

[0029] In particular, the process of non-destructively peeling the flexible perovskite encapsulation component from the rigid substrate includes:

[0030] (1) After obtaining a flexible perovskite component bonded to a rigid substrate, copper tape is bonded to electrodes on both sides and directly led outward, with a lead-out length of 3-4 cm, and the copper tape on the surface of the flexible component is scraped flat; wherein the flexible perovskite component bonded to the rigid substrate is PI, and the flexible perovskite component is formed by evenly coating a polyamic acid solution on the rigid substrate, and then forming a film after annealing at high temperature and imidization;

[0031] (2) Prepare POE film with a gram weight of 435g / m 2 Prepare the film and cut it into 198mm×198mm size; prepare the PET with barrier layer and cut it into 200mm×200mm;

[0032] (3) Cover the flexible perovskite component, POE film, flexible cover plate, and rigid cover plate in sequence and clamp them with the laminator limit block; make sure that the barrier film coating of the flexible cover plate is in contact with the film;

[0033] (4) Place the laminate in a laminator for lamination, with a vacuuming time of 400 seconds, a first pressurization time of 70 kPa, a second pressurization time of 50 kPa, a third pressurization time of 30 kPa, a first pressure holding time of 50 seconds, a second pressure holding time of 50 seconds, a third pressure holding time of 500 seconds, and a temperature of 110° C.;

[0034] (5) After lamination, take it out and place it vertically to cool down; after cooling, remove the rigid cover plate, find the contact surface between the PI material flexible perovskite component and the rigid substrate, peel off the flexible perovskite packaging component, and complete the peeling of the flexible perovskite packaging component.

[0035] In particular, the process of non-destructively peeling the flexible perovskite encapsulation component from the rigid substrate includes:

[0036] (1) After obtaining the flexible perovskite component attached to the rigid substrate, in order to extract the power generation current of the component, copper tape is attached to the electrodes on both sides to directly lead out, and the lead-out length is 3-4 cm, so that it will have a smoother effect after the later lamination, and the copper tape on the surface of the flexible perovskite component is scraped flat; the flexible perovskite component attached to the rigid substrate is PET with a protective film;

[0037] (2) Prepare POE film with a weight of 275g / m 2 Prepare the film and cut it into 296mm×296mm size; prepare the PET with barrier layer and cut it into 300mm×300mm;

[0038] (3) Cover the flexible perovskite component, POE film, flexible cover plate and rigid cover plate in sequence and clamp them with the laminator limit block; make sure that the barrier film coating of the flexible cover plate is in contact with the film;

[0039] (4) Place the laminate in a laminator for lamination, with a vacuuming time of 400 seconds, a first pressurization time of 70 kPa, a second pressurization time of 50 kPa, a third pressurization time of 30 kPa, a first pressure holding time of 50 seconds, a second pressure holding time of 50 seconds, a third pressure holding time of 500 seconds, and a temperature of 110° C.;

[0040] (5) After lamination, take it out and place it vertically to cool down; after cooling, remove the rigid cover plate, find the contact surface between the protective film of the flexible perovskite component and the rigid substrate, pry it open slightly with tweezers and peel it off, completing the peeling of the flexible perovskite packaging component and the rigid substrate.

[0041] In particular, the process of non-destructively peeling the flexible perovskite encapsulation component from the rigid substrate includes:

[0042] (1) After obtaining a flexible perovskite component bonded to a rigid substrate, copper tape and bus bars are bonded to electrodes on both sides, and the bus bars are pressed downward by the copper tape to be in close contact with the copper film surface of the flexible perovskite component. The copper tape and the bus bars can both collect and transmit current, and the copper tape on the surface of the flexible perovskite component is scraped as flat as possible. The flexible perovskite component bonded to the rigid substrate is PET with a protective film, and the PET protective film surface is bonded to the rigid cover plate by OCA adhesive;

[0043] (2) Prepare POE film, the weight of which is 425 g / m 2 Prepare the film and cut it into 49mm×49mm size; the POE film is slightly smaller than the module size; prepare the PET with barrier layer and cut it into 50mm×50mm, the same size as the module structure;

[0044] (3) Place the flexible perovskite component, the cut POE film, the cut flexible cover plate, and the rigid cover plate in order from bottom to top, put them into the laminator, and clamp them around with the laminator limit block; make sure that the barrier film coating of the flexible cover plate is in contact with the film;

[0045] (4) Laminating after placing in a laminator, the vacuuming time is 400 seconds, the first pressurization time is 70 kPa, the second pressurization time is 50 kPa, the third pressurization time is 30 kPa, the first pressure holding time is 50 seconds, the second pressure holding time is 50 seconds, the third pressure holding time is 500 seconds, and the temperature is 110° C. After the lamination process, the flexible perovskite encapsulation component is internally combined together;

[0046] (5) After lamination, take it out and place it against the wall to cool down. Placing it vertically can make the temperature of different positions of the component drop more evenly. After cooling, remove the rigid cover plate, find the contact surface between the protective film of the flexible perovskite component and the rigid substrate, use tweezers to find the gap between the two, pry it open slightly and slowly peel it up. Due to the small size of 50mm*50mm, it can be torn off well and conveniently without the use of special auxiliary tools, completing the peeling of the flexible perovskite package component; after the component is peeled off, use scissors or a paper cutter to remove the excess POE glue around it; and obtain a complete flexible perovskite package component.

[0047] In particular, the process of non-destructively peeling the flexible perovskite encapsulation component from the rigid substrate includes:

[0048] (1) After obtaining a flexible perovskite component bonded to a rigid substrate, copper tape and bus bars are bonded to electrodes on both sides, the bus bars are pressed down by the copper tape to be in close contact with the copper film surface of the flexible perovskite component, and the copper tape on the surface of the flexible perovskite component is scraped flat as much as possible; wherein the flexible perovskite component is PI scraped on a rigid substrate: that is, a polyamic acid solution is cast into a film, and annealed at a high temperature to form imidization;

[0049] (2) Prepare POE film, the weight of which is 430 g / m 2 The film is cut into a size of 395mm×595mm; PET with a barrier layer is prepared;

[0050] (3) Place the flexible perovskite component, the cut POE film, the cut flexible cover plate, and the rigid cover plate in order from bottom to top, put them into the laminator, and clamp them around with the laminator limit block; make sure that the barrier film coating of the flexible cover plate is in contact with the film;

[0051] (4) After being placed in a laminator, lamination is performed, with a vacuuming time of 400 seconds, a first pressurizing time of 60 kPa, a second pressurizing time of 40 kPa, a third pressurizing time of 30 kPa, a first holding time of 60 seconds, a second holding time of 60 seconds, a third holding time of 600 seconds, and a temperature of 100° C. After the lamination process, the inside of the flexible component is combined together;

[0052] (5) After lamination, take it out and place it against the wall to cool. Placing it vertically can make the temperature of different positions of the component drop more evenly. The film will be pulled internally and bubbles will form due to different cooling times. After cooling, remove the rigid cover plate, tear up the PI along the four corners first, then tear up one edge along the edge, and then lift this edge to tear the entire surface. In this process, use a glass rod tool to assist in tearing. Lift the flexible perovskite package component, and use a glass rod to move horizontally across the place where the flexible perovskite package component contacts the rigid substrate. After the component is peeled off, use scissors or a paper cutter to remove the excess POE glue around it. At this time, a complete flexible perovskite package component is obtained.

[0053] Compared with the prior art, the present invention has the following beneficial effects:

[0054] By laminating the POE film and the flexible cover plate on the rigid substrate with the flexible perovskite component and pressing the rigid cover plate, a laminated structure is formed that is conducive to the lossless stripping of the flexible perovskite package component, and after hot pressing, with a small loss of flexibility, better overall strength is obtained, so that the interlayer bonding force of the flexible perovskite package component itself is significantly greater than the bonding force between the flexible perovskite component and the adhesive, which is suitable for popularization and promotion, avoiding directly tearing off the flexible perovskite package component, and can make the micro-deformation of the component smaller, less damaged, and will not cause the efficiency of the flexible device to decrease. In addition, compared with the use of laser and other methods, it has lower production costs, the stripping process is relatively independent, more operational, and improves the efficiency of the production line; and it has a packaging effect, good stability, and better yield, which simplifies the preparation process of the flexible perovskite solar cell component, can enhance the long-term stability of the flexible component, and is suitable for large-scale production. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] The following drawings are for illustration only and should not be construed as limiting the present invention in any way. By referring to the following drawings, readers can understand the embodiments of the present invention and further understand the advantages and technical features of the present invention.

[0057] Figure 1 This is a schematic diagram of the main steps of the preparation process of the flexible perovskite packaging component in the present invention.

[0058] Figure 2 Schematic diagram of the laminated structure of the present invention for losslessly peeling the flexible perovskite packaging component from the rigid substrate. DETAILED DESCRIPTION

[0060] It should be noted that:

[0061] In the description of the present invention, the terms "including" and "having" and any of their variations are intended to cover other possible choices under the same logic that are not listed; the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, or the directions or positional relationships in which the invention product is usually placed when in use, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In addition, the terms "horizontal", "vertical", "overhanging", etc. do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted. It should also be noted that, unless otherwise clearly stipulated and limited, the terms "set", "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements.

[0062] For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific circumstances. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those generally understood by those of ordinary skill in the art to which the present invention belongs. When there is a conflict, the definitions in this specification shall prevail.

[0063] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only embodiments of a part of the present invention, rather than all embodiments.

[0064] In this technical field, research has found that:

[0065] The main steps of the preparation process of flexible perovskite packaging components include:

[0066] Input FTO glass and coat the anode buffer layer using PVD equipment; this is the initial step in component preparation and provides the basis for subsequent perovskite layer deposition.

[0067] Laser scribing: Use laser technology to scribble specific patterns on components to facilitate subsequent stacking and connection.

[0068] Perovskite coating crystallization: The perovskite precursor solution is coated on the component and crystallized to form a perovskite layer by controlling the conditions.

[0069] The cathode buffer layer and the back electrode are plated; the charge transport layer and the electrode are further deposited on the perovskite layer to complete the preparation of the component.

[0070] The flexible component is peeled off from the rigid substrate with low loss.

[0071] Among them, the present invention mainly focuses on 5), that is, the low-loss peeling process of the flexible component from the rigid substrate involves the detection of the adhesive force overcome by the peeling operation, which is usually measured by a 180-degree peeling test.

[0072] The magnitude of adhesive force is related to adhesion, but adhesion emphasizes the bonding ability of the surface of the object, while adhesive force focuses more on the performance when peeling off. If the adhesive force is greater than the adhesion, the protective film may come off when it is torn off.

[0073] Among them, the methods for non-destructive peeling of flexible components of perovskite solar cells from rigid substrates mainly include:

[0074] Direct stripping method;

[0075] Principle: A peelable layer is introduced between the rigid substrate and the flexible perovskite component. After the perovskite component is prepared, the peelable layer is separated from the rigid substrate by mechanical or chemical methods to achieve the transfer of the flexible perovskite.

[0076] Advantages: simple operation, suitable for a variety of scenarios.

[0077] Disadvantages: May cause some damage to perovskite.

[0078] Optimization measures: Improve the material and structure of the strippable layer to reduce the difficulty of stripping and reduce damage to the perovskite.

[0079] 2. Laser peeling method;

[0080] Principle: Use laser energy to selectively heat and decompose the interface layer between the rigid substrate and the perovskite, thereby separating the two.

[0081] Advantages: higher precision and less damage to perovskite.

[0082] Disadvantages: The equipment cost is high and the operation is difficult.

[0083] Optimization measures: Optimize laser parameters to improve peeling accuracy and efficiency and reduce equipment costs.

[0084] 3. Stress-induced peeling method;

[0085] Principle: By applying stress on a rigid substrate, cracks are created between the perovskite and the substrate, causing separation.

[0086] Advantages: Suitable for large-area flexible perovskite transfer.

[0087] Disadvantages: The operation process is more complicated and difficult to control.

[0088] Optimization measures: Precisely control the way and magnitude of stress application to ensure uniformity and integrity of peeling.

[0089] 4. Thermoplastic film encapsulation and peeling method;

[0090] Principle: A flexible substrate is prepared on a rigid substrate and solidified, and then a conductive layer, a first carrier layer, a perovskite layer, a second carrier layer and a back electrode layer are sequentially prepared on the flexible substrate and corresponding laser scribing is performed to obtain a perovskite solar cell module; a flexible substrate is prepared on a rigid cover plate and solidified to obtain a cover plate module; the perovskite solar cell module is bonded to the cover plate module by thermoplastic film encapsulation to form a rigid component with a rigid substrate and a rigid cover plate facing outward; finally, the rigid substrate and the rigid cover plate are peeled off from the adjacent flexible substrate by laser to obtain a flexible perovskite solar cell module.

[0091] Advantages: The preparation process of flexible perovskite solar cell modules is greatly simplified, and the prepared flexible perovskite solar cell modules have good stability and good yield rate.

[0092] Disadvantages: Specific equipment and process support are required, and the operation is relatively complicated. There is a lack of applicable optimization measures.

[0093] 5. Chemical corrosion stripping method;

[0094] Principle: Use a specific corrosive solution to corrode the rigid substrate, thereby achieving the peeling of the flexible perovskite.

[0095] Advantages: High stripping efficiency and less damage to perovskite.

[0096] Disadvantages: It requires precise control of parameters such as the concentration, temperature and time of the corrosive liquid, making the operation difficult.

[0097] Optimization measures: By optimizing the etching solution formula and stripping process parameters, the stripping efficiency and success rate can be improved and the damage to perovskite can be reduced.

[0098] In summary, there are many methods to non-destructively peel the flexible components of perovskite solar cells from rigid substrates, and each method has its own characteristics and applicable scenarios.

[0099] The present invention provides a method for non-destructively peeling a flexible component from a rigid substrate in a flexible perovskite solar cell module encapsulated by a thermoplastic film with a high yield rate, selects a suitable peeling method according to specific circumstances, and takes corresponding optimization measures to ensure the peeling effect and module performance.

[0100] In particular, the presence of the flexible cover plate covered by the new stripping method in the present invention enables the flexible component finally removed from the rigid substrate to also have a packaging effect, that is, what is stripped off is a flexible perovskite packaging component.

[0101] In the present invention, a process for non-destructively peeling a flexible component from a rigid substrate in a flexible perovskite solar cell component encapsulated with a thermoplastic film having a high yield rate is provided. Figure 1 As shown, including:

[0102] After obtaining the core part of the flexible perovskite packaging component, that is, the flexible perovskite component, which is adhered to the rigid substrate by adhesive glue, that is, the flexible perovskite component is attached to the rigid substrate by adhesive glue and the lead-out bus bar is connected; there can be different lead-in methods, and the purpose of the lead-in is to continuously test the related items of the component in the later stage.

[0103] Prepare POE film, cut out POE film and flexible cover of corresponding size; the required POE film weight cannot be too high, high POE film weight will make the component lose its flexibility after cooling and solidification, and the POE film weight cannot be too low, too low POE film weight cannot achieve good packaging effect, and will also cause large deformation during peeling from the rigid substrate. For flexible perovskite packaging components, select POE film with low lamination temperature and high melt index, and the POE film weight should be controlled at 200g / m 2 Up to 500g / m 2 , which can achieve better results. The POE film should be 1-5mm inward of the edge of the flexible perovskite component. During lamination, it can reduce the overflow of the POE film and prevent the POE film from bonding the rigid substrate and the rigid cover together.

[0104] Laminating the POE film, the flexible cover plate and the rigid cover plate; laminating the POE film in the center of the flexible perovskite packaging component so that the POE film can be slightly adsorbed on the top electrode surface of the flexible perovskite component, and then laminating the flexible cover plate on the upper surface of the POE film. If a flexible cover plate with a reinforcement layer is used, the reinforcement layer is brought into contact with the POE film, and finally, a rigid cover plate of the same size as the rigid substrate is covered to obtain a laminated structure of the flexible perovskite packaging component that is peeled off from the rigid substrate with low loss, referred to as a laminated structure.

[0105] After the laminator is accurately limited, lamination is performed; the entire lamination structure is placed in the laminator limit block to prevent the displacement of the two rigid components of the rigid base and the rigid cover plate, and also to make the lamination effect more flat and uniform. The laminated structure is taken out after lamination for a certain period of time in the high temperature vacuum environment of the laminator.

[0106] Peel off the flexible perovskite package component, which includes a flexible perovskite component, a POE film and a flexible cover plate; after the flexible perovskite package component cools down and the POE film is cured, first remove the rigid cover plate pressing on it, find the flexible perovskite component, especially the flexible perovskite component with a protective film, and tear off the entire flexible perovskite package component from the sticky glue on the surface of the rigid base along the protective film of the flexible perovskite component. During the tearing process, the four corners of the flexible perovskite component can be slightly lifted from the sticky glue on the surface of the rigid base, and then, after one side is completely uncovered, tear it off along this side.

[0107] In the present invention, the laminated structure of the flexible perovskite package component is non-destructively peeled off from the rigid substrate to support the above process, as shown in the attached Figure 2 As shown, the entire laminate structure includes: a rigid substrate, an adhesive, a flexible perovskite packaging component and a rigid cover plate, wherein the flexible perovskite packaging component includes a flexible perovskite component, a POE adhesive film and a flexible cover plate.

[0108] Specifically include:

[0109] Rigid substrate: can provide support for the flexible perovskite packaging components, and the flexible perovskite packaging components can also be well attached to it without causing deformation. The rigid substrate is usually glass;

[0110] Adhesive glue: In the preparation of flexible perovskite devices, in order to obtain better flatness and to facilitate laser, vacuum coating, coating and other processes, adhesive glue generally uses double-sided adhesive, PDMS, OCA adhesive, adhesive film, etc. to bond the flexible perovskite components to the rigid substrate;

[0111] Flexible perovskite components: Flexible perovskite components are the core part of flexible perovskite packaging components; flexible perovskite packaging components require a series of process preparations to be completed on the flexible perovskite components. Commonly used flexible perovskite components are PI, PET, and PEN, with a thickness of more than 100 microns; the prepared flexible perovskite components usually have protective films on both sides;

[0112] POE film: POE film acts between the flexible perovskite component and the flexible cover plate. After lamination at a certain temperature, the two flexible films of the flexible perovskite component and the flexible cover plate can be tightly combined together. The POE film is a thermoplastic film. When it cools down after lamination, the flexible perovskite package component will gain better overall strength while losing a small part of its flexibility. At the same time, the POE film can effectively inhibit the infiltration of water vapor from the side through contact with the flexible cover plate and the flexible perovskite component, that is, the upper and lower flexible films, and play a role in packaging and bonding. After POE lamination, when the flexible perovskite package component is peeled off, due to the bonding force and post-curing strength of the POE film, the flexible perovskite package component will not be deformed to a large extent. Only slight deformation can bear a large peeling force, and it can be effectively peeled off from the rigid substrate;

[0113] Flexible cover: The materials of the flexible cover include PET (polyethylene terephthalate), PES (polyethersulfone resin), PEN (polyethylene naphthalate), PVA (polyvinyl alcohol), transparent PI (polyimide) and NOA63. It is the key to the entire flexible perovskite package. A good flexible cover can maintain flexibility and bendability and has a wide range of applications. At the same time, it plays the role of encapsulating and isolating water vapor. The flexible cover currently used has a layer of oxide on it, which can further prevent the infiltration of water vapor, increase the contact with the POE film, have a greater fit and is not easy to separate;

[0114] Rigid cover: During lamination packaging, it can better balance the pressure and make the film lamination uniform, flat and consistent;

[0115] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0116] The content of the present invention can be more easily understood by referring to the following preferred embodiments of the present invention.

[0117] Example 1: 200mm×200mm flexible perovskite packaging assembly;

[0118] After obtaining the flexible perovskite component attached to the rigid substrate, copper tape is attached to the electrodes on both sides and directly led outward, with a lead-out length of 3-4 cm, and the copper tape on the surface of the flexible component is scraped flat. Among them, the flexible perovskite component attached to the rigid substrate is PI.

[0119] Prepare POE film, using a certain weight of 435g / m 2 Prepare the film and cut it into 198mm×198mm size. Prepare the PET with barrier layer and cut it into 200mm×200mm.

[0120] Place the flexible perovskite component, POE film, flexible cover plate, and rigid cover plate in sequence, and clamp them with the laminator limit block; make sure that the barrier film coating of the flexible cover plate is in contact with the film;

[0121] Put it into the laminator for lamination, the vacuum time is 400 seconds, the first pressurization time is 70 kPa, the second pressurization time is 50 kPa, the third pressurization time is 30 kPa, the first pressure holding time is 50 seconds, the second pressure holding time is 50 seconds, the third pressure holding time is 500 seconds, and the temperature is 110°C.

[0122] After lamination, take it out and place it vertically to cool. After cooling, remove the rigid cover, find the contact surface between the PI flexible perovskite component and the rigid substrate, peel it off, and complete the peeling of the flexible perovskite encapsulation component.

[0123] Example 2: 300mm×300mm flexible perovskite packaging assembly;

[0124] After obtaining the flexible perovskite component attached to the rigid substrate, copper tape is attached to the electrodes on both sides and directly led out, with a lead-out length of 3-4 cm, and the copper tape on the surface of the flexible component is scraped flat. The flexible perovskite component is a flexible perovskite component with PET with a protective film on a rigid backplane.

[0125] Prepare POE film, using a weight of 275g / m 2 Prepare the film and cut it into 296mm×296mm size. Prepare the PET with barrier layer and cut it into 300mm×300mm.

[0126] Cover the flexible perovskite component, POE film, flexible cover plate and rigid cover plate in sequence and clamp them with the laminator limit block; pay attention to the contact between the barrier film coating of the flexible cover plate and the film.

[0127] Put it into the laminator for lamination, the vacuum time is 400 seconds, the first pressurization time is 70 kPa, the second pressurization time is 50 kPa, the third pressurization time is 30 kPa, the first pressure holding time is 50 seconds, the second pressure holding time is 50 seconds, the third pressure holding time is 500 seconds, and the temperature is 110°C.

[0128] After lamination, take it out and place it vertically to cool. After cooling, remove the rigid cover, find the contact surface between the protective film of the PET flexible perovskite component and the PET film, pry it open with tweezers, and peel it off to complete the peeling of the flexible perovskite encapsulation component.

[0129] Example 3: 50mm×50mm flexible perovskite package assembly;

[0130] After obtaining a flexible perovskite component bonded to a rigid substrate, copper tape and bus bars are attached to the electrodes on both sides. The copper tape is used to press the bus bar underneath to keep it in close contact with the copper film surface of the flexible perovskite component. Both the copper tape and the bus bar can collect and transmit current. The copper tape on the surface of the flexible perovskite component is scraped as flat as possible. After the entire preparation process is completed, the surface will be relatively flat when it is peeled off later, with almost no protrusions. Among them, the PET protective film surface is attached to the rigid backboard. PET is made by exchanging dimethyl terephthalate with ethylene glycol or esterifying terephthalic acid with ethylene glycol to synthesize dihydroxyethyl terephthalate, and then undergoing a condensation reaction. It has the following advantages: good mechanical properties, impact strength is 3 to 5 times that of other films, and good folding resistance; oil-resistant, fat-resistant, dilute acid-resistant, dilute alkali-resistant, and resistant to most solvents: can be used for a long time in the temperature range of 55-60°C, and can withstand high temperatures of 65°C for short-term use, and low temperatures of -70°C, and the mechanical properties are little affected by high and low temperatures: low gas and water vapor permeability, and excellent gas, water, oil and odor barrier properties; high transparency, can block ultraviolet rays, and has good gloss; non-toxic, odorless, hygienic and safe, and can be directly used for food packaging.

[0131] Prepare POE film, here we use a certain weight of 425g / m 2 The film is cut into 49mm×49mm size. Among them, the POE film is slightly smaller than the component size because after the high-temperature lamination operation, the POE will become molten and fluid. When the POE liquefies and overflows, it will flow to the side. After cooling and solidification, the structure will be bonded together, which will affect the later separation. Prepare PET with a barrier layer. Compared with ordinary PET, PET with a barrier layer has a better waterproof effect. Ordinary PET has a smooth surface and will not have a good contact effect when directly laminated with the POE film. When bending occurs, it may cause the PET film to separate from the film. PET with a barrier layer can better solve this problem. The dense oxide layer on its surface can produce a good connection effect with the film. Cut it into 50mm×50mm, the same size as the component structure. Among them, the POE film exhibits excellent sealing, which can effectively isolate the external moisture, dust and other harmful substances from the outside, and ensure the long-term stability of the battery cell. It has excellent waterproof performance, effectively resists the impact of rain, humidity and water vapor on the battery cell, and prolongs the life of the flexible perovskite package component. It can maintain stable physical properties under various environmental conditions, has excellent heat resistance and cold resistance, and adapts to various climatic conditions. The POE film can be adjusted according to actual needs, with a larger thickness and smaller weight, which helps to reduce the overall weight of the component.

[0132] Place the flexible perovskite component, the cut POE film, the cut flexible cover plate, and the rigid cover plate in order from bottom to top, put them into the laminator and clamp them on all sides with the laminator limit blocks. The purpose is to prevent the upper and lower rigid cover plates from shifting during the lamination process, thereby causing uneven lamination force, which will make the flexible component uneven and cause uneven force later; pay attention to the contact between the barrier film coating of the flexible cover plate and the film.

[0133] After being placed in the laminator, the lamination process is performed with a vacuuming time of 400 seconds, a pressurization time of 70 kPa, a second pressurization time of 50 kPa, a third pressurization time of 30 kPa, a first pressurization time of 50 seconds, a second pressurization time of 50 seconds, a third pressurization time of 500 seconds, and a temperature of 110°C. The laminator mainly uses heating and pressurization to tightly fit the various layers of materials of the flexible perovskite encapsulation component together. In this process, it is necessary to ensure uniform pressure and precise temperature control to ensure the quality and performance of the flexible perovskite encapsulation component. After this lamination process, the flexible perovskite encapsulation component is internally combined together.

[0134] After lamination, take it out and place it against the wall to cool. Placing it vertically can make the temperature of different positions of the flexible perovskite package component drop more evenly. The placement of the film will cause internal pulling and bubbles due to different cooling times. After cooling, remove the rigid cover plate and find the contact surface between the PET flexible perovskite component protective film and the PET film. Use tweezers to find the gap between the two, pry it open slightly and slowly lift it up. Due to the small size of 50mm*50mm, it can be torn off better and more conveniently without the use of special auxiliary tools, completing the peeling of the flexible perovskite package component. After the flexible perovskite package component is peeled off, use scissors or a paper cutter to remove the excess POE glue around it. At this time, a complete flexible perovskite package component is obtained.

[0135] Example 4: 400mm×600mm flexible perovskite packaging assembly;

[0136] After obtaining the flexible perovskite component attached to the rigid substrate, copper tape and bus bar are attached to the electrodes on both sides. The bus bar is pressed down by the copper tape to be in close contact with the copper film surface of the flexible perovskite component. The copper tape and bus bar can collect and transmit current, and the copper tape on the surface of the flexible component is scraped flat as much as possible, so that after the entire preparation process is completed, the surface will be relatively flat when it is peeled off later, and there can be almost no protrusions. Among them, (the component is PI scraped on a rigid substrate: polyamide acid solution is cast into a film, annealed at high temperature imidization. The film is yellow and transparent, with a relative density of 1.39 to 1.45, and has outstanding high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation properties, and can be used for a long time in air at 250 to 280°C. Thermosetting polyimide also has excellent thermal stability, chemical corrosion resistance and mechanical properties. Thermosetting polyimide has very small creep and high tensile strength. The operating temperature range of polyimide covers a wide range, from more than one hundred degrees below zero to two or three hundred degrees.

[0137] Prepare POE film, here we use a certain weight of 430g / m 2 The film is cut into 395mm×595mm size. Prepare PET with a barrier layer. Compared with ordinary PET, PET with a barrier layer has better water vapor resistance. Ordinary PET has a smooth surface and will not have a good contact effect when directly laminated with the POE film. When bending occurs, the PET film may separate from the film. PET with a barrier layer can better solve this problem. The dense oxide layer on its surface can produce a good connection effect with the film. Cut it into 400mm×600mm, the same size as the component structure. Among them, the POE film exhibits excellent sealing, which can effectively isolate the external moisture, dust and other harmful substances from the outside, ensuring the long-term stability of the battery cell. It has excellent waterproof performance, effectively resists the influence of rain, humidity and water vapor on the battery cell, and prolongs the life of the component. It can maintain stable physical properties under various environmental conditions, has excellent heat resistance and cold resistance, and adapts to various climatic conditions. It can be adjusted according to actual needs, with a larger thickness and a smaller gram weight, which helps to reduce the overall weight of the component. Among them, the POE film is slightly smaller than the component size because after the high-temperature lamination operation, POE will become molten and fluid. When POE liquefies and overflows, it will flow to the side. After cooling and solidifying, the structure will stick together, which will affect the subsequent separation.

[0138] Place the flexible perovskite component, the cut POE film, the cut flexible cover plate, and the rigid cover plate in order from bottom to top, put them into the laminator and clamp them on all sides with the laminator limit blocks. The purpose is to prevent the upper and lower rigid cover plates from shifting during the lamination process, thereby causing uneven lamination force, which will make the flexible component uneven and cause uneven force later; pay attention to the contact between the barrier film coating of the flexible cover plate and the film.

[0139] After being placed in the laminator, the lamination process is performed with a vacuuming time of 400 seconds, a first pressurization time of 60 kPa, a second pressurization time of 40 kPa, a third pressurization time of 30 kPa, a first pressurization time of 60 seconds, a second pressurization time of 60 seconds, a third pressurization time of 600 seconds, and a temperature of 100°C. The laminator mainly heats and pressurizes the layers of materials of the flexible perovskite encapsulation component to fit them tightly together. In this process, it is necessary to ensure uniform pressure and precise temperature control to ensure the quality and performance of the photovoltaic module. After this lamination process, the flexible perovskite encapsulation component is internally combined together.

[0140] After lamination, take it out and place it against the wall to cool. Placing it vertically can make the temperature of different parts of the component drop more evenly. Placing the film will cause internal pulling and bubbles due to different cooling time. After cooling, remove the rigid cover, tear up the PI along the four corners first, then tear up one edge along the edge, and then lift this edge to tear the entire surface. In this process, you can use tools to assist in tearing, such as glass rods, to lift the flexible perovskite package component, and use the glass rod to move horizontally over the place where the flexible perovskite package component contacts the rigid substrate. After the component is peeled off, use scissors or paper cutters to remove the excess POE glue around it. At this time, a complete flexible component is obtained.

[0141] Based on the above embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention, so as to avoid exhaustively listing all implementation methods that are unnecessary and impossible to list comprehensively.

Claims

1. A non-destructive stripping method for flexible components in the preparation of perovskite solar cells, characterized in that: The process of non-destructively peeling a flexible component from a rigid substrate includes: (1) As the core part of the flexible perovskite packaging component, the flexible perovskite component is attached to the rigid substrate through adhesive or its own characteristics, and the bus bar led out from the flexible perovskite component is connected; (2) Prepare POE film and flexible cover plate, and cut out POE film and flexible cover plate of corresponding size of the component; (3) Laminating the POE film, the flexible cover plate and the rigid cover plate; laminating the POE film in the center of the flexible perovskite component so that the POE film can be slightly adsorbed on the top electrode surface of the flexible perovskite component, and then laminating the flexible cover plate on the upper surface of the POE film. If a flexible cover plate with a reinforcement layer is used, the reinforcement layer is brought into contact with the POE film, and finally a rigid cover plate of the same size as the rigid substrate is covered to obtain a laminated structure in which the flexible perovskite package component is non-destructively peeled off from the rigid substrate, referred to as a laminated structure; (4) Lamination is performed after the laminator is accurately limited; the entire laminated structure is placed in the laminator limit block to prevent the displacement of the two rigid components of the rigid base and the rigid cover plate, and also to make the lamination effect more flat and uniform; the laminated structure is taken out after lamination for a certain period of time under the high temperature vacuum environment of the laminator; (5) Peeling off the flexible perovskite packaging component, which includes a flexible perovskite component, a POE film and a flexible cover plate; after the flexible perovskite packaging component cools down, the POE film solidifies, and then the rigid cover plate pressing on it is first removed, the flexible perovskite component is found, and the entire flexible perovskite packaging component is torn off from the rigid substrate or the sticky glue on the surface of the rigid substrate along the flexible perovskite component.

2. The method for non-destructive stripping of flexible components in the preparation of perovskite solar cells according to claim 1, characterized in that: The weight of POE film should be controlled at 200g / m 2 Up to 500g / m 2 , the POE film should be retracted 1-5mm from the edge of the flexible perovskite component.

3. The non-destructive stripping method for flexible components in the preparation of perovskite solar cells according to claim 1, characterized in that: The flexible perovskite component has a protective film; or after the flexible perovskite component is formed on a rigid substrate, it has the property of being able to be separated from the rigid substrate.

4. The method for non-destructive stripping of flexible components in the preparation of perovskite solar cells according to claim 1, characterized in that: In the process of tearing off the entire flexible perovskite packaging component from the rigid substrate or the sticky glue on the surface of the rigid substrate, first slightly lift the four corners of the flexible perovskite packaging component from the sticky glue on the surface of the rigid base, and then gradually tear off one side. After one side is completely uncovered, tear off the entire component along this side.

5. The method for non-destructive stripping of flexible components in the preparation of perovskite solar cells according to claim 1, characterized in that: The laminate structure includes: a rigid substrate, an adhesive, a flexible perovskite packaging component and a rigid cover plate, wherein the flexible perovskite packaging component includes a flexible perovskite component, a POE adhesive film and a flexible cover plate; specifically includes: Rigid substrate: can provide support for flexible perovskite packaging components, and the rigid substrate is glass; Adhesive glue: Adhesive glue is double-sided adhesive, PDMS, OCA adhesive, adhesive film, which bonds the flexible perovskite component to the rigid substrate; Flexible perovskite components: Flexible perovskite components are the core part of flexible perovskite packaging components; flexible perovskite components are PI, PET, PEN, with a thickness of 100-200μm; POE film: POE film is a thermoplastic film; Flexible cover: The materials of flexible cover include PET (polyethylene terephthalate), PES (polyethersulfone resin), PEN (polyethylene naphthalate), PVA (polyvinyl alcohol), transparent PI (polyimide) and NOA63; Rigid cover: glass; during lamination packaging, the film is laminated evenly, flatly and consistently.

6. The method for non-destructive stripping of flexible components in the preparation of perovskite solar cells according to claim 1, characterized in that: The process of non-destructively peeling a flexible component from a rigid substrate includes: (1) After obtaining a flexible perovskite component of a flexible perovskite package component attached to a rigid substrate, copper tape is attached to electrodes on both sides and directly led outward, with a lead-out length of 3-4 cm, and the copper tape on the surface of the flexible perovskite component is scraped flat; wherein the flexible perovskite component of the flexible perovskite package component attached to the rigid substrate is PI, and the flexible perovskite component is formed by evenly scraping a polyamic acid solution on the rigid substrate, and then forming a film after annealing at high temperature imidization; (2) Prepare POE film with a gram weight of 435g / m 2 Prepare the film and cut it into 198mm×198mm size; prepare the PET with barrier layer and cut it into 200mm×200mm; (3) Cover the flexible perovskite component, POE film, flexible cover plate, and rigid cover plate in sequence and clamp them with the laminator limit block; make sure that the barrier film coating of the flexible cover plate is in contact with the film; (4) Place the laminate in a laminator for lamination, with a vacuuming time of 400 seconds, a first pressurization time of 70 kPa, a second pressurization time of 50 kPa, a third pressurization time of 30 kPa, a first pressure holding time of 50 seconds, a second pressure holding time of 50 seconds, a third pressure holding time of 500 seconds, and a temperature of 110° C.; (5) After lamination, take it out and place it vertically to cool down; after cooling, remove the rigid cover plate, find the contact surface between the PI material flexible perovskite packaging component and the rigid substrate, peel off the flexible perovskite packaging component, and complete the peeling of the flexible perovskite packaging component.

7. The method for non-destructive stripping of flexible components in the preparation of perovskite solar cells according to claim 1, characterized in that: The process of non-destructively peeling the flexible perovskite package component from the rigid substrate includes: (1) After obtaining the flexible perovskite package component attached to the rigid substrate, in order to extract the power generation current of the component, copper tape is attached to the electrodes on both sides to directly lead out, and the lead-out length is 3-4 cm, so that it will have a smoother effect after the later lamination, and the copper tape on the surface of the flexible perovskite component is scraped flat; the flexible perovskite component attached to the rigid substrate is PET with a protective film; (2) Prepare POE film with a weight of 275g / m 2 Prepare the film and cut it into 296mm×296mm size; prepare the PET with barrier layer and cut it into 300mm×300mm; (3) Cover the flexible perovskite component, POE film, flexible cover plate and rigid cover plate in sequence and clamp them with the laminator limit block; make sure that the barrier film coating of the flexible cover plate is in contact with the film; (4) Place the laminate in a laminator for lamination, with a vacuuming time of 400 seconds, a first pressurization time of 70 kPa, a second pressurization time of 50 kPa, a third pressurization time of 30 kPa, a first pressure holding time of 50 seconds, a second pressure holding time of 50 seconds, a third pressure holding time of 500 seconds, and a temperature of 110° C.; (5) After lamination, take it out and place it vertically to cool down; after cooling, remove the rigid cover plate, find the contact surface between the protective film of the flexible perovskite component and the rigid substrate, pry it open slightly with tweezers and peel it off, completing the peeling of the flexible perovskite packaging component and the rigid substrate.

8. The method for non-destructive stripping of flexible components in the preparation of perovskite solar cells according to claim 1, characterized in that: The process of non-destructively peeling the flexible perovskite package component from the rigid substrate includes: (1) After obtaining a flexible perovskite component bonded to a rigid substrate, copper tape and bus bars are bonded to electrodes on both sides, and the bus bars are pressed downward by the copper tape to be in close contact with the copper film surface of the flexible perovskite component. The copper tape and the bus bars can both collect and transmit current, and the copper tape on the surface of the flexible perovskite component is scraped as flat as possible. The flexible perovskite component is PET with a protective film, and the protective film surface is bonded to the rigid cover plate by OCA adhesive; (2) Prepare POE film, the weight of which is 425 g / m 2 Prepare the film and cut it into 49mm×49mm size; the POE film is slightly smaller than the module size; prepare the PET with barrier layer and cut it into 50mm×50mm, the same size as the module structure; (3) Place the flexible perovskite component, the cut POE film, the cut flexible cover plate, and the rigid cover plate in order from bottom to top, put them into the laminator, and clamp them around with the laminator limit block; make sure that the barrier film coating of the flexible cover plate is in contact with the POE film; (4) Laminating after placing in a laminator, the vacuuming time is 400 seconds, the first pressurization time is 70 kPa, the second pressurization time is 50 kPa, the third pressurization time is 30 kPa, the first pressure holding time is 50 seconds, the second pressure holding time is 50 seconds, the third pressure holding time is 500 seconds, and the temperature is 110° C. After the lamination process, the flexible perovskite encapsulation component is internally combined together; (5) After lamination, take it out and place it against the wall to cool down. Placing it vertically can make the temperature of different positions of the component drop more evenly. After cooling, remove the rigid cover plate, find the contact surface between the flexible perovskite component protective film and the rigid substrate, use tweezers to find the gap between the two, pry it open slightly and slowly peel it up. Due to the small size of 50mm*50mm, it can be torn off well and conveniently without the use of special auxiliary tools, completing the peeling of the flexible perovskite package component; after the component is peeled off, use scissors or a paper cutter to remove the excess POE glue around it; at this time, a complete flexible perovskite package component is obtained.

9. The method for non-destructive stripping of flexible components in the preparation of perovskite solar cells according to claim 1, characterized in that: The process of non-destructively peeling the flexible perovskite package component from the rigid substrate includes: (1) After obtaining a flexible perovskite component bonded to a rigid substrate, copper tape and bus bars are bonded to electrodes on both sides, the bus bars are pressed down by the copper tape to be in close contact with the copper film surface of the flexible perovskite component, and the copper tape on the surface of the flexible perovskite component is scraped flat as much as possible; wherein the flexible perovskite component is PI scraped on a rigid substrate: that is, a polyamic acid solution is cast into a film, and annealed at a high temperature to form imidization; (2) Prepare POE film, the weight of which is 430 g / m 2 The film is cut into a size of 395mm×595mm; PET with a barrier layer is prepared; (3) Place the flexible perovskite component, the cut POE film, the cut flexible cover plate, and the rigid cover plate in order from bottom to top, put them into the laminator, and clamp them around with the laminator limit block; make sure that the barrier film coating of the flexible cover plate is in contact with the POE film; (4) Laminating after placing in a laminator, the vacuuming time is 400 seconds, the first pressurization time is 60 kPa, the second pressurization time is 40 kPa, the third pressurization time is 30 kPa, the first pressure holding time is 60 seconds, the second pressure holding time is 60 seconds, the third pressure holding time is 600 seconds, and the temperature is 100° C. After the lamination process, the flexible perovskite encapsulation component is internally combined together; (5) After lamination, take it out and place it against the wall to cool. Placing it vertically can make the temperature of different positions of the flexible perovskite packaging component drop more evenly. The film will be pulled internally and bubbles will form due to different cooling times. After cooling, remove the rigid cover plate, tear up the PI along the four corners first, then tear up one edge along the edge, and then lift this edge to tear the entire surface. In this process, use a glass rod tool to assist in tearing. Lift the flexible perovskite packaging component, and use a glass rod to move horizontally across the contact area between the flexible perovskite packaging component and the rigid substrate. After the component is peeled off, use scissors or a paper cutter to remove excess POE glue around it. At this time, a complete flexible perovskite packaging component is obtained.

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