Connector and electronic equipment

Abstract

The connector (2) is provided with: a first spring structure (21), one end (21a) of which is connected to the connection section (3); a second spring structure (22) comprising a coil-shaped winding wire wound in the same direction as the first spring structure (21), one end (22a) of the second spring structure (22) being connected to the connection section (4a); a lead wire (23) that electrically connects the first spring structure (21) and the second spring structure (22); and a bypass capacitor (24), one electrode terminal of which is connected to the first spring structure (21) and the lead wire (23) and the other electrode terminal of which is grounded, the first spring structure (21) and the second spring structure (22) being alternately arranged in the same direction, with the windings being insulated from each other turn by turn.

Description

Technical Field

[0001] The present disclosure relates to connectors and electronic devices. Background Art

[0002] As an existing connector for connecting substrates of electronic equipment, there is a connector described in Patent Document 1, for example. In the connector described in Patent Document 1, coil-shaped spring components are respectively provided on two connection objects, and the windings of the two spring components are alternately arranged in the same direction. Since a conductive wire is wound around each spring component, the spring components are intertwined and conducted with each other due to the elasticity of the springs through the alternate arrangement. Thus, the connection objects are electrically connected to each other. Since the two spring components are in a state of being intertwined and conducted, they function as a coil-shaped connection component, and are therefore equivalent to an inductor arranged in series.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 10-247568 Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, since the filtering performance of the series inductor is low, there is a problem that, when the connection component functions as the series inductor, a filter for suppressing electromagnetic noise needs to be provided separately from the connector.

[0008] The present disclosure has been made to solve the above-mentioned problems, and an object of the present disclosure is to provide a connector capable of suppressing electromagnetic noise without separately providing a filter, and an electronic device using the connector.

[0009] Means for solving problems

[0010] The connector of the present disclosure connects a first object with a second object, and is characterized by comprising: a first spring structure, which is composed of a coil-shaped winding wire and one end of which is connected to the first object; a second spring structure, which is composed of a coil-shaped winding wire wound in the same direction as the first spring structure and one end of which is connected to the second object; a wire that electrically connects the other end of the first spring structure with the other end of the second spring structure; and a bypass capacitor, one electrode terminal of which is connected to the first spring structure and the wire, and the other electrode terminal is grounded, and the winding wires are insulated from each other for each turn of the first spring structure and are alternately arranged in the same direction.

[0011] Effects of the Invention

[0012] According to the present disclosure, regarding the first spring structure and the second spring structure that connect the first object and the second object, the windings are insulated from each other turn by turn, and are alternately arranged along the same direction. As a result, a negative inductance is equivalently generated as a mutual inductance formed by the magnetic coupling between the first spring structure and the second spring structure. For example, in the connector described in Patent Document 1, even if a bypass circuit including a bypass capacitor is provided, a negative inductance is not generated in the bypass circuit, and therefore the parasitic inductance generated in the bypass circuit cannot be offset. In the connector disclosed in the present disclosure, the negative inductance formed by the magnetic coupling between the first spring structure and the second spring structure offsets the parasitic inductance generated in the above-mentioned bypass circuit, and therefore, electromagnetic noise can be suppressed without the need to provide an additional filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a conceptual diagram schematically showing the structure of the electronic device according to the first embodiment.

[0014] Figure 2 is a circuit diagram schematically showing a mutual inductance circuit including a parasitic inductor generated in a first spring structure and a parasitic inductor generated in a second spring structure.

[0015] Figure 3 It is shown Figure 2 Circuit diagram of the T-type equivalent circuit of the mutual inductance circuit.

[0016] Figure 4 This is a circuit diagram schematically showing a main part of an equivalent circuit of the connector according to the first embodiment.

[0017] Figure 5 This is a conceptual diagram schematically showing the structure of an electronic device according to the second embodiment. DETAILED DESCRIPTION

[0018] Implementation method 1.

[0019] Figure 1 1 is a conceptual diagram schematically showing the structure of the electronic device 1 according to the first embodiment. Figure 1 In the embodiment, the electronic device 1 has a structure in which the connection portion 3 is connected to the connection portion 4a by the connector 2 of the first embodiment. The connection portion 3 is a first object electrically connected to the printed circuit board 5. The printed circuit board 5 is provided inside the housing 6 of the electronic device 1. In addition, the housing 6 is a constant potential, for example, a ground potential. The connection portion 4a is a second object such as an electrode terminal provided in the housing 6 of the electronic device 1, and the connection portion 4a is connected to the socket 4. The socket 4 is connected to the cable 7. By connecting the socket 4 to the connection portion 4a, the connection portion 4a is electrically connected to the core wire 8 in the cable 7.

[0020] The connector 2 connects the connection portion 3 and the connection portion 4 a , so that signals can be exchanged between the printed circuit board 5 and an external device connected to the cable 7 via the connector 2 .

[0021] For example, when the electronic device 1 is a high-frequency communication device, the connector 2 functions as a noise filter that removes high-frequency electromagnetic noise leaking from the circuit of the printed circuit board 5 .

[0022] like Figure 1 As shown, the connector 2 includes a first spring structure 21, a second spring structure 22, a lead 23, and a bypass capacitor 24. The first spring structure 21 is a spring structure composed of a coil-shaped winding wire, and one end 21a is connected to the connection portion 3. The second spring structure 22 is a spring structure composed of a coil-shaped winding wire wound in the same direction as the first spring structure 21, and one end 22a is connected to the connection portion 4a.

[0023] The first spring structure 21 and the second spring structure 22 are made of a conductor. Figure 1 In the figure, the first spring structure 21 is indicated by a white line, and the second spring structure 22 is indicated by a black line, but the first spring structure 21 and the second spring structure 22 are composed of conductive wires of the same material and size.

[0024] In addition, the outer peripheries of the first spring structure 21 and the second spring structure 22 are insulated from each other so that they are not directly conductive. For example, a non-conductive tape is wound around the outer peripheries of the first spring structure 21 and the second spring structure 22 .

[0025] The wire 23 electrically connects the other end 21b of the first spring structure 21 and the other end 22b of the second spring structure 22. The first spring structure 21 and the second spring structure 22 are indirectly connected via the wire 23. Figure 1 In the embodiment, the conductor 23 has a curved portion, but may also be a linear wiring pattern. In addition, the conductor 23 may also be a circular or elliptical wiring pattern.

[0026] One electrode terminal of the bypass capacitor 24 is connected to the first spring structure 21 and the wire 23, and the other electrode terminal is grounded. Figure 1 As shown, the bypass capacitor 24 is connected to the connection point between the end 21b of the first spring structure 21 and the wire 23 via the wire 25, and is connected to the housing 6 via the wire 26. Since the housing 6 is at the ground potential, the other electrode terminal of the bypass capacitor 24 is grounded. In addition, the wire 25 and the wire 26 can also be the lead wires of the bypass capacitor 24.

[0027] The first spring structure 21 and the second spring structure 22 have a coil shape and are configured so that the winding axes of the windings are consistent (coaxial). In addition, regarding the first spring structure 21 and the second spring structure 22, the windings are insulated from each other turn by turn and are alternately arranged in the same direction. By configuring in this way, the first spring structure 21 and the second spring structure 22 form a mutual inductance through magnetic coupling. The parasitic inductance of the bypass circuit including the bypass capacitor 24 is offset by the negative inductance that equivalently appears corresponding to the mutual inductance.

[0028] Furthermore, since the windings of the first spring structure 21 and the windings of the second spring structure 22 are not separated at regular intervals but are alternately arranged, the magnetic coupling between the two is greater than when the structures are separated from each other, and the negative inductance that occurs equivalently is also greater.

[0029] The first spring structure 21 and the second spring structure 22 have coil shapes wound in the same direction and are connected in series by the conductive wire 23. Therefore, current flows in the same direction in the first spring structure 21 and the second spring structure 22. In addition, due to parasitic inductance, the magnetic flux generated inside the first spring structure 21 and the second spring structure 22 also has substantially the same direction.

[0030] A parasitic inductance that causes electromagnetic noise is generated in the bypass capacitor 24. In addition, in the connector 2, a negative inductance is formed by magnetic coupling between the first spring structure 21 and the second spring structure 22. That is, the first spring structure 21 and the second spring structure 22 have a pair of parasitic inductances that generate mutual inductance by magnetic coupling. The above-mentioned parasitic inductance generated in the first spring structure 21 and the second spring structure 22 cancels the parasitic inductance generated in the bypass capacitor 24. Therefore, the connector 2 can suppress electromagnetic noise without separately providing a filter for suppressing electromagnetic noise.

[0031] Figure 2 is a circuit diagram schematically showing a mutual inductance circuit including a parasitic inductor 100 generated in the first spring structure 21 and a parasitic inductor 101 generated in the second spring structure 22 . Figure 3 It is shown Figure 2 The circuit diagram of the T-type equivalent circuit of the mutual inductance circuit. Figure 2 and Figure 3 In FIG. 1 , when a current i1 from a node a1 flows into the parasitic inductor 100 and a current i2 from a node a2 flows into the parasitic inductor 101 , a mutual inductance −M is formed between the parasitic inductor 100 and the parasitic inductor 101 .

[0032] When nodes b1 and b2 are at a common potential, it can be considered that Figure 2 The mutual inductance circuit shown is Figure 3 The equivalent circuit is shown. Figure 3 The equivalent circuit shown is an equivalent circuit composed of three inductors 102 , 103 , and 104 having inductances L1 +M, L2 +M, and −M, and is referred to as a T-type equivalent circuit.

[0033] When the number of turns of the first spring structure 21 is N1, the number of turns of the second spring structure 22 is N2, the cross-sectional area of ​​the second spring structure 22 is S2, and the vacuum magnetic permeability is μ0, the magnitude M of the mutual inductance between the first spring structure 21 and the second spring structure 22 can be expressed by the following formula (1).

[0034] M=μ0×N1×N2×S2 (1)

[0035] Figure 4 1 is a circuit diagram schematically showing a main part of an equivalent circuit of the connector 2 . Figure 4 The equivalent circuit shown has Figure 3 The T-type equivalent circuit shown in FIG. 1 includes the bypass capacitor 24 and the parasitic inductor 105 in the wiring inductance L4. Figure 4 In FIG. 1 , the equivalent inductance of the inductor 102 is L1+M, and the equivalent inductance of the inductor 103 is L2+M.

[0036] The bypass capacitor 24 includes a capacitor component 24 a having a capacitance C and a parasitic inductor 24 b having an equivalent series inductance (ESL), that is, a residual inductance Lp.

[0037] The parasitic inductor 105 is composed of Figure 1 The wires 25 and 26 are shown formed.

[0038] The connector 2 has a bypass circuit including a wire 25 and a bypass capacitor 24. In the bypass circuit, due to the magnetic coupling between the first spring structure 21 and the second spring structure 22, as shown in FIG. Figure 4 As shown, the inductor 104 having a negative inductance -M equivalently appears. That is, the inductor 104 is equivalently connected to the series connection point Np between the inductors 102 and 103.

[0039] Furthermore, in the bypass circuit, the inductor 104 having a negative inductance -M, the capacitor component 24a, and the parasitic inductor 24b are connected in series.

[0040] The wiring inductance L4 can be approximately calculated from the dimensions (for example, length and conductor diameter) of the wires 25 and 26. The residual inductance Lp can be calculated by measuring the characteristics of the bypass capacitor 24.

[0041] In the connector 2, the negative inductance -M is designed so that the impedances of the negative inductance -M, the wiring inductance L4, and the residual inductance Lp of the bypass capacitor 24 cancel each other out. As a result, the impedance of the bypass circuit is equivalent to the impedance of only the capacitor component 24a, so that the negative inductance -M can be designed to have an optimal value using the above formula (1).

[0042] As described above, in the connector 2 , the bypass path in the bypass circuit does not substantially include an inductance component, and therefore even if the frequency of electromagnetic noise propagating through the spring structure is high, a decrease in bypass performance can be suppressed.

[0043] In order to offset the parasitic inductance in the bypass circuit, it is generally considered to add electronic components such as inductors. However, the addition of new electronic components will increase the manufacturing cost of the electronic device, and the new electronic components may have an electromagnetic effect on the wiring or electronic components in the printed circuit board 5 and have adverse effects.

[0044] In contrast, the connector 2 can suppress the degradation of bypass performance without adding new electronic components to the printed circuit board 5. By providing the connector 2 with the function of a noise filter as described above, it is not necessary to install a noise filter on the printed circuit board 5, and the number of layers of the substrate and the number of components on the substrate can be reduced, thereby improving the degree of freedom in mounting other components.

[0045] As described above, the connector 2 of the first embodiment includes: a first spring structure 21, which is composed of a coil-shaped winding wire, and one end 21a is connected to the connection part 3; a second spring structure 22, which is composed of a coil-shaped winding wire wound in the same direction as the first spring structure 21, and one end 22a is connected to the connection part 4a; a wire 23, which electrically connects the other end 21b of the first spring structure 21 and the other end 22b of the second spring structure 22; and a bypass capacitor 24, one electrode terminal of which is connected to the first spring structure 21 and the wire 23, and the other electrode terminal is grounded, and the winding wires are insulated from each other for each turn and are alternately arranged in the same direction for the first spring structure 21 and the second spring structure 22. As a result, a negative inductance is equivalently generated as a mutual inductance formed by magnetic coupling between the first spring structure 21 and the second spring structure 22. For example, in the connector described in Patent Document 1, if a bypass circuit including a bypass capacitor 24 is provided, the inductance formed by the series inductor between the connected objects is small and cannot cancel the parasitic inductance generated in the bypass circuit. In the connector 2, the negative inductance formed by the magnetic coupling between the first spring structure 21 and the second spring structure 22 cancels the parasitic inductance generated in the bypass circuit, so that electromagnetic noise can be suppressed without providing a separate filter.

[0046] The electronic device 1 of the first embodiment includes the connection portion 3, the connection portion 4a, and the connector 2. Since the connector 2 suppresses electromagnetic noise without providing a noise filter on the printed circuit board 5, it is possible to provide the electronic device 1 which can be miniaturized.

[0047] Implementation method 2.

[0048] Figure 5 1 is a conceptual diagram schematically showing the structure of an electronic device 1A according to Embodiment 2. Figure 5 In the embodiment, the electronic device 1A has a structure in which the connection portion 3 and the connection portion 4a are connected by the connector 2A of the second embodiment. The connection portion 3 is a first object electrically connected to the printed circuit board 5. The printed circuit board 5 is provided inside the housing 6 of the electronic device 1A. In addition, the housing 6 is at a constant potential, for example, a ground potential.

[0049] The connection portion 4a is a second object such as an electrode terminal provided in the housing 6 of the electronic device 1A, and the connection portion 4a is connected to the socket 4. The socket 4 is connected to the cable 7. By connecting the socket 4 to the connection portion 4a, the connection portion 4a is electrically connected to the core wire 8 in the cable 7. The connector 2A has a function of suppressing electromagnetic noise similarly to the connector 2 of the first embodiment.

[0050] like Figure 5 As shown, the connector 2A includes a magnetic body 9, a first spring structure 21, a second spring structure 22, a lead wire 23, and a bypass capacitor 24. The first spring structure 21 is a spring structure composed of a coil-shaped winding wire, and one end 21a is connected to the connection portion 3. The second spring structure 22 is a spring structure composed of a coil-shaped winding wire wound in the same direction as the first spring structure 21, and one end 22a is connected to the connection portion 4a.

[0051] The magnetic body 9 is disposed inside the first spring structure 21 and the second spring structure 22. Figure 5 As shown, the first spring structure 21 and the second spring structure 22 are in contact with each other. As a result, a part of the magnetic path of the magnetic flux generated between the first spring structure 21 and the second spring structure 22 can be confined inside the magnetic body 9. Figure 5 As indicated by the middle dotted line, a magnetic path is formed inside the magnetic body 9 , through which the magnetic flux MF generated between the first spring structure 21 and the second spring structure 22 passes.

[0052] By arranging the magnetic body 9 inside the first spring structure 21 and the second spring structure 22, the magnetic flux MF is concentrated inside the magnetic body 9. Therefore, the amount of magnetic flux leaking into the air can be reduced. As a result, the above formula (1) is multiplied by the magnetic permeability μ of the magnetic body 9. r, so the magnitude M of the mutual inductance further increases. The cross-sectional area or the number of turns of the spring structure can be set to a smaller value according to the increase in the magnitude M of the mutual inductance.

[0053] For example, by placing the magnetic body 9 inside the first spring structure 21 and the second spring structure 22, the length of each winding of the first spring structure 21 and the second spring structure 22 can be shortened. That is, the size of the first spring structure 21 and the second spring structure 22 required to obtain the inductance -M can be reduced.

[0054] The magnetic body 9 is preferably a ferrite magnetic body having high magnetic permeability for high-frequency signals of several MHz or more. For example, a ferrite core in which soft magnetic metal powder is dispersed may be used as the magnetic body 9 .

[0055] As described above, the connector 2A of the second embodiment includes a magnetic body 9, which is provided inside the first spring structure 21 and the second spring structure 22. For example, the magnetic body 9 is a ferrite magnetic body. Thus, the connector 2A can set the cross-sectional area or the number of turns of the first spring structure 21 and the second spring structure 22 to a smaller value. In addition, it is possible to provide an electronic device 1A that can be more miniaturized than the first embodiment.

[0056] Furthermore, it is possible to combine the embodiments, modify arbitrary components of the embodiments, or omit arbitrary components in the embodiments.

[0057] Industrial Applicability

[0058] The connector of the present disclosure can be used in, for example, a high-frequency communication device.

[0059] Description of symbols

[0060] 1. 1A: electronic device; 2. 2A: connector; 3. 4a: connecting part; 4: socket; 5: printed circuit board; 6: housing; 7: cable; 8: core wire; 9: magnetic body; 21: first spring structure; 21a, 21b, 22a, 22b: end; 22: second spring structure; 23, 25, 26: wire; 24: bypass capacitor; 24a: capacitor component; 24b, 100, 101, 105: parasitic inductor; 102-104: inductor.

Claims

1. A connector for connecting a first object to a second object, characterized in that: The connector has: a first spring structure composed of a coil-shaped winding wire, one end of which is connected to the first object; a second spring structure, which is composed of a coil-shaped winding wire wound in the same direction as the first spring structure, and one end of which is connected to the second object; a wire electrically connecting the other end of the first spring structure with the other end of the second spring structure; and A bypass capacitor, one electrode terminal of which is connected to the first spring structure and the lead, and the other electrode terminal of which is grounded, Regarding the first spring structure and the second spring structure, the windings are insulated from each other turn by turn and are alternately arranged in the same direction.

2. The connector according to claim 1, characterized in that: The connector includes a magnetic body, and the magnetic body is provided inside the first spring structure and the second spring structure.

3. The connector according to claim 2, characterized in that: The magnetic body is a ferrite magnetic body.

4. An electronic device, characterized in that: The electronic device comprises: the first object; the second object; and The connector according to any one of claims 1 to 3, which connects the first object and the second object.

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