Electronic device including display

Abstract

The present disclosure relates to an electronic device including a display. An electronic device according to one embodiment may include: a hinge module; the first shell and the second shell are arranged on the two sides around a folding shaft; and a display module arranged to extend from one surface of the first housing to one surface of the second housing across the hinge module and including a first sheet metal layer in which a plurality of first reference holes and a plurality of slit holes are formed, the hinge module is coupled to the first housing and the second housing and may include a plurality of second reference holes.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including a driving element. Background Art

[0002] Electronic devices are being enhanced not only in design but also in functionality. In addition to a uniform bar-type shape, electronic devices are being manufactured in various shapes. In addition, for electronic devices equipped with displays, it is intended to realize a large-screen display within a limited device size. For this purpose, a display provided in an electronic device may work in a manner to be folded or unfolded together with the electronic device, and various structures for supporting such folding or unfolding need to be provided in the electronic device. Summary of the invention

[0003] Solutions to the problem

[0004] The electronic device may have various electronic components installed therein up to the side edge. As more electronic components are functionally installed in the side edge, the side edge may become thicker. Since the reduced width of the side edge may lead to an enhanced user's immersion in the display, it is necessary to install enough electronic components when the width of the side edge is reduced or maintained to the same level. In addition, the display module and other components constituting the electronic device may include various reference points (e.g., fiducial holes) to be aligned and connected to each other. In order to reduce the width of the side edge as described above, the reference point needs to be formed so as not to protrude beyond the average horizontal width and / or vertical width of the display module.

[0005] An electronic device according to an embodiment of the present disclosure may include: a hinge module; a first shell and a second shell, the first shell and the second shell are arranged on two opposite sides of a folding axis; and a display module, the display module including a first metal sheet layer, the first metal sheet layer is arranged to extend from one surface of the first shell through the hinge module to one surface of the second shell and has a plurality of first reference holes and a plurality of slit holes. The hinge module can be coupled to the first shell and the second shell and include a plurality of second reference holes. In an embodiment, the display module and the hinge module can be aligned and coupled to each other based on the plurality of first reference holes and the plurality of second reference holes. In an embodiment, in the folding axis direction, the width between the plurality of first reference holes can be formed to be smaller than the width of the first metal sheet layer, so that the first reference holes do not protrude outside the first metal sheet layer.

[0006] An electronic device according to an embodiment of the present disclosure may include: a display module, which is disposed on a plurality of housings; and a hinge module, which is operatively connected to the plurality of housings and the display module. In an embodiment, the display module may include a metal sheet layer having a plurality of first reference holes and a plurality of slit holes. In addition, in an embodiment, the plurality of first reference holes may be formed to be covered by a protective layer included in the display module. In an embodiment, the hinge module may include a plurality of second reference holes. In an embodiment, the display module and the hinge module may be aligned and connected to each other based on the plurality of first reference holes and the plurality of second reference holes.

[0007] An electronic device according to an embodiment of the present disclosure may include: a first housing and a second housing; a display module, the display module being disposed on the first housing and the second housing; and a hinge module, the hinge module being operatively coupled to the first housing, the second housing and the display module. According to an embodiment, the display module may include a metal sheet layer having a plurality of first reference holes. The plurality of first reference holes may be formed so as not to protrude outside a protective layer provided in the display module. In an embodiment, the hinge module may include a plurality of second reference holes. The display module and the hinge module may be aligned and coupled to each other based on the plurality of first reference holes and the plurality of second reference holes.

[0008] According to an embodiment of the present disclosure, the gap between the display module and the housing surrounding the display module, that is, the width of the side edge, can be reduced. More specifically, the gap between the display module and the housing that may be caused when the reference hole protrudes outside the display module can be removed.

[0009] The effects that can be achieved in the exemplary embodiments of the present disclosure are not limited to the above effects, but those skilled in the art to which the exemplary embodiments of the present disclosure relate can clearly derive and understand other effects not mentioned from the following description. That is, those skilled in the art can also derive from the exemplary embodiments of the present disclosure unexpected effects when practicing the embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0011] Figure 2a is a perspective view showing an electronic device in a flat state or an unfolded state according to an embodiment.

[0012] Figure 2b is a plan view showing a front surface of an electronic device in an unfolded state according to an embodiment.

[0013] Figure 2c is a plan view showing a rear surface of an electronic device in an unfolded state according to an embodiment.

[0014] Figure 3a is a perspective view showing an electronic device in a folded state according to an embodiment.

[0015] Figure 3b is a perspective view showing an electronic device in an intermediate state according to an embodiment.

[0016] Figure 4 is an exploded perspective view showing an electronic device according to an embodiment.

[0017] Figure 5 is an exploded perspective view showing a display according to an embodiment.

[0018] Figure 6 is a view schematically showing a first metal sheet layer according to an embodiment.

[0019] Figure 7 is a view schematically showing a state in which a first metal sheet layer and a second metal sheet layer are stacked according to an embodiment.

[0020] Figure 8a is a cross-sectional view of the electronic device according to the embodiment taken along II'.

[0021] Figure 8b is a cross-sectional view of the electronic device according to the embodiment taken along I-II'.

[0022] Figure 9a is a cross-sectional view of the electronic device according to the embodiment taken along II'.

[0023] Figure 9b is a cross-sectional view of the electronic device according to the embodiment taken along I-II'.

[0024] Fig.10 is a view schematically showing a state in which a first metal sheet layer and a second metal sheet layer are stacked according to an embodiment.

[0025] Fig.11a is an electronic device according to an embodiment of the present invention Fig.10 A cross-sectional view taken along line III-III'.

[0026] Fig.11b is a cross-sectional view of the electronic device according to the embodiment taken along IV-IV'.

[0027] Fig.11c is a cross-sectional view of the electronic device according to the embodiment taken along line VV'.

[0028] Fig.12 is a view schematically showing a first metal sheet layer according to an embodiment.

[0029] Fig.13 is a view schematically showing a state in which a first metal sheet layer and a second metal sheet layer are stacked according to an embodiment.

[0030] Fig.14a is an electronic device according to an embodiment of the present invention Fig.13 A cross-sectional view taken along line VI-VI'.

[0031] Fig.14b is a cross-sectional view of the electronic device according to the embodiment taken along line VII-VII'.

[0032] Fig.15a is an electronic device according to an embodiment of the present invention Fig.13 A cross-sectional view taken along line VI-VI'.

[0033] Fig.15b is a cross-sectional view of the electronic device according to the embodiment taken along line VII-VII'.

[0034] Fig.16 is a view schematically showing a state in which a first metal sheet layer and a second metal sheet layer are stacked according to an embodiment.

[0035] Fig.17a is an electronic device according to an embodiment of the present invention Fig.16 A cross-sectional view taken along line VIII-VIII'.

[0036] Fig.17b is a cross-sectional view of the electronic device according to the embodiment taken along line IX-IX'.

[0037] Fig.17c is a cross-sectional view of the electronic device according to the embodiment taken along line XX′.

[0038] Fig.18a is a front view showing a display module provided in the electronic device according to the embodiment.

[0039] Fig.18b is a rear view showing a display module provided in the electronic device according to the embodiment.

[0040] In the following description, reference may be made to the accompanying drawings, and specific examples that may be practiced are shown as examples within the accompanying drawings. Other examples may be utilized and structural changes may be made without departing from the scope of the various examples. DETAILED DESCRIPTION

[0041] Hereinafter, embodiments of the present disclosure are described in detail with reference to the accompanying drawings so that those skilled in the art to which the present disclosure relates can easily practice the present disclosure. However, the present disclosure can be implemented in various other forms and is not limited to the embodiments set forth herein. Throughout the specification and the accompanying drawings, the same or similar reference numerals may be used to refer to the same or similar elements. In addition, for clarity and brevity, well-known functions and configurations are not described in the accompanying drawings and related descriptions.

[0042] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0043] refer to Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In an embodiment, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. According to an embodiment, some of the above-mentioned components (for example, the sensor module 176, the camera module 180, or the antenna module 197) may be integrated into a single component (for example, the display module 160).

[0044] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 coupled to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121, or to be dedicated to a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0045] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated via machine learning. For example, such learning can be performed by the electronic device 101 where the artificial intelligence model is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0046] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0047] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0048] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0049] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records. The receiver may be used to receive incoming calls. Depending on the embodiment, the receiver may be implemented as a separate part from the speaker, or as part of the speaker.

[0050] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display 160 may include, for example, a display, a holographic device, or a projector, and a control circuit system for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the strength of a force generated by a touch.

[0051] The audio module 170 can convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) coupled to the electronic device 101 or wirelessly coupled.

[0052] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0053] The interface 177 may support one or more specific protocols that will be used to couple the electronic device 101 to an external electronic device (e.g., electronic device 102) (e.g., wired) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0054] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0055] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0056] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0057] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0058] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0059] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)), and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a communication module 192 (e.g., a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth™, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components (e.g., multiple chips) separated from each other. The communication module 192 can identify or authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0060] The communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0061] The antenna module 197 may send a signal or power to the outside (e.g., an external electronic device) or receive a signal or power from the outside (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiator, and the radiator is formed by a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may then be sent or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other parts (e.g., a radio frequency integrated circuit (RFIC)) other than the radiator may be further formed as a part of the antenna module 197. According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC, and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., a bottom surface) of the printed circuit board, or is adjacent to the first surface and is capable of supporting a designated high frequency band (e.g., a millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board, or is adjacent to the second surface and is capable of sending or receiving signals in the designated high frequency band.

[0062] At least some of the above components can be coupled to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicate signals (e.g., commands or data) therebetween.

[0063] According to an embodiment, instructions or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled to the second network 199. The external electronic device 102 or the external electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be run in the electronic device 101 may be run in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of running the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service in addition to running the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0064] Figure 2a is a perspective view showing an electronic device in a flat state or an unfolded state according to an embodiment. Figure 2b is a plan view showing a front surface of an electronic device in an unfolded state according to an embodiment. Figure 2cis a plan view showing a rear surface of an electronic device in an unfolded state according to an embodiment.

[0065] Figure 3a is a perspective view showing an electronic device in a folded state according to an embodiment. Figure 3b is a perspective view showing an electronic device in an intermediate state according to an embodiment.

[0066] Figure 4 is an exploded perspective view showing an electronic device according to an embodiment.

[0067] refer to Figures 2a to 3b , the electronic device 200 may include a hinge module (eg, Figure 4 According to an embodiment, the electronic device 200 may include a flexible display 300 (eg, a foldable housing) disposed in an area formed by the pair of housings 210 and 220. Figure 1 Display 160 or Figure 4 According to an embodiment, the first housing 210 and the second housing 220 may be disposed on two opposite sides of the folding axis (axis F) and may be substantially symmetrical in shape relative to the folding axis (axis F). According to an embodiment, the first housing 210 and the second housing 220 may form different angles or distances depending on whether the foldable electronic device 200 is in an unfolded state (or a flat state), a folded state, or an intermediate state.

[0068] The paired housings 210 and 220 may include a hinge module (eg, Figure 4 The hinge module 240 of the first housing 210 (eg, the first housing structure) and the hinge module 240 connected to the first housing 210 (eg, the first housing structure) Figure 4 According to an embodiment, in the unfolded state, the first housing 210 may include a first surface 211 facing a first direction (e.g., a front direction) (z-axis direction) and a second surface 212 facing a second direction (e.g., a rear direction) (-z-axis direction) opposite to the first surface 211.

[0069] According to an embodiment, in the unfolded state, the second housing 220 may include a third surface 221 facing the first direction (z-axis direction) and a fourth surface 222 facing the second direction (-z-axis direction). According to an embodiment, the electronic device 200 may operate in such a manner that in the unfolded state, the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 face substantially the same first direction (z-axis direction), and in the folded state, the first surface 211 and the third surface 221 face each other.

[0070] According to an embodiment, the foldable electronic device 200 may operate in such a manner that in the unfolded state, the second surface 212 of the first housing 210 and the fourth surface 222 of the second housing 220 face substantially the same second direction (-z-axis direction), and in the folded state, the second surface 212 and the fourth surface 222 face opposite directions to each other. For example, in the folded state, the second surface 212 may face the first direction (z-axis direction), and the fourth surface 222 may face the second direction (-z-axis direction).

[0071] According to an embodiment, the first housing 210 may include a first side frame 213 that at least partially forms an appearance of the electronic device 200 and a first back cover 214 that is coupled to the first side frame 213 and forms at least a portion of a second surface 212 of the electronic device 200. According to an embodiment, the first side frame 213 may include a first surface 213a, a second side surface 213b extending from one end of the first surface 213a, and a third surface 213c extending from the other end of the first surface 213a. According to an embodiment, the first side frame 213 may be formed in a rectangular (or square) shape by the first side surface 213a, the second side surface 213b, and the third side surface 213c.

[0072] According to an embodiment, the second housing 220 may include a second side frame 223 that at least partially forms the appearance of the electronic device 200 and a second back cover 224 that is coupled to the second side frame 223 and forms at least a portion of the fourth surface 222 of the electronic device 200. According to an embodiment, the second side frame 223 may include a fourth side surface 223a, a fifth side surface 223b extending from one end of the fourth side surface 223b, and a sixth side surface 223c extending from the other end of the fourth side surface 223a. According to an embodiment, the second side frame 223 may be formed in a rectangular shape by the fourth side surface 223a, the fifth side surface 223b, and the sixth side surface 223c.

[0073] According to an embodiment, the paired housings 210 and 220 are not limited to the shapes and connections shown, but can be implemented in other shapes or by a combination and / or connection of other components. For example, in an embodiment, the first side frame 213 can be formed integrally with the first rear cover 214, and the second side frame 223 can be formed integrally with the second rear cover 224.

[0074] According to an embodiment, in the unfolded state of the electronic device 200, the second side surface 213b of the first side frame 213 may be connected to the fifth side surface 223b of the second side frame 223 without a gap. According to an embodiment, in the unfolded state of the electronic device 200, the third side surface 213c of the first side frame 213 may be connected to the sixth side surface 223c of the second side frame 223 without a gap. According to an embodiment, in the unfolded state of the electronic device 200, the sum of the length of the second side surface 213b and the length of the fifth side surface 223b may be configured to be greater than the length of the first side surface 213a and / or the length of the fourth side surface 223a. In addition, the sum of the length of the third side surface 213c and the length of the sixth side surface 223c may be configured to be greater than the length of the first side surface 213a and / or the length of the fourth side surface 223a.

[0075] According to an embodiment, the first side frame 213 and / or the second side frame 223 may be formed of metal or may also include a polymer injected into the metal. According to an embodiment, the first side frame 213 and / or the second side frame 223 may include at least one conductive portion 216 and / or 226 electrically segmented by at least one segmenter 2161, 2162 and / or 2261 or 2262 formed of a polymer. In this case, at least one conductive portion may be electrically connected to a wireless communication circuit included in the electronic device 200, thereby serving as an antenna operating in at least one designated frequency band (e.g., a conventional frequency band).

[0076] According to an embodiment, the first back cover 214 and / or the second back cover 224 may be formed of at least one of laminated or tinted glass, ceramic, polymer, or metal (eg, aluminum, stainless steel (STS), or magnesium) or a combination of at least two thereof.

[0077] According to an embodiment, the flexible display DPM may extend from the first surface 211 of the first housing 210 across the hinge module (eg, Figure 4 The hinge module 240 of the second housing 220 is provided until at least a portion of the third surface 221 of the second housing 220. For example, the flexible display DPM may include a first flat portion 230a substantially corresponding to the first surface 211, a second flat portion 230b corresponding to the third surface 221, and a first flat portion 230a and a second flat portion 230b connected to the hinge module (for example, Figure 4According to an embodiment, the electronic device 200 may include a first protective cover 215 (e.g., a first protective frame or a first decorative member) coupled along an edge of the first shell 210. According to an embodiment, the electronic device 200 may include a second protective cover 225 (e.g., a second protective frame or a second decorative member) coupled along an edge of the second shell 220. According to an embodiment, the first protective cover 215 and / or the second protective cover 225 may be formed of a metal or polymer material. According to an embodiment, the first protective cover 215 and / or the second protective cover 225 may be used as a decorative member. According to an embodiment, the flexible display DPM may be positioned such that an edge of the first flat portion 230a is between the first shell 210 and the first protective cover 215. According to an embodiment, the flexible display DPM may be positioned such that an edge of the second flat portion 230b is between the second shell 220 and the second protective cover 225. According to an embodiment, the flexible display DPM may be positioned such that the edge of the flexible display DPM is between the protective cap (e.g., Figure 4 The edge corresponding to the protective cap 235 is provided on the hinge module (eg, Figure 4 The hinge module 240 is protected by a protective cap in a region corresponding to the hinge module 240. Therefore, the edge of the flexible display DPM can be substantially protected from external influences.

[0078] According to an embodiment, the electronic device 200 may include a hinge housing 241 (eg, a hinge cover) that supports a hinge module (eg, a hinge cover) in a folded state of the electronic device 200. Figure 4 The hinge module 240 is configured to be exposed to the outside, and in the unfolded state of the electronic device 200, is introduced into the first space and the second space and is not visible from the outside.

[0079] According to an embodiment, the electronic device 200 may include a sub-display 231 provided separately from the flexible display DPM. According to an embodiment, since the sub-display 231 is provided on the second surface 212 of the first housing 210 to be at least partially exposed, the sub-display 231 may display status information about the electronic device 200 in a folded state, which replaces the display function of the flexible display DPM. According to an embodiment, the sub-display 231 may be provided to be viewed from the outside through at least a partial area of ​​the first back cover 214. In an embodiment, the sub-display 231 may be provided on the fourth surface 222 of the second housing 220. In this case, the sub-display 231 may be provided to be visible from the outside through at least a partial area of ​​the second back cover 224.

[0080] According to an embodiment, the electronic device 200 may include at least one of an input device (e.g., microphone), sound output devices 201 and 202, a sensor module 204, camera devices 205 and 208, a key input device 206, or a connector port 207. In the illustrated embodiment, the input device (e.g., microphone), sound output devices 201 and 202, sensor modules 204, camera devices 205 and 208, key input device 206, or connector port 207 refers to a hole or shape formed in the first housing 210 or the second housing 220, but may be defined as including a substantial electronic component (e.g., input device, sound output device, sensor module, or camera device) that is disposed inside the electronic device 200 and operates through the hole or shape.

[0081] According to an embodiment, the input device may include at least one microphone 203 disposed in the second housing 220. In an embodiment, the input device may include a plurality of microphones 203 disposed to detect the direction of the sound. In an embodiment, the plurality of microphones 203 may be disposed at appropriate positions in the first housing 210 and / or the second housing 220. According to an embodiment, the sound output devices 201 and 202 may include a speaker. According to an embodiment, the speaker may include a call receiver 201 disposed in the first housing 210 and a speaker 202 disposed in the second housing 220. In an embodiment, the input device, the sound output devices 201 and 202, and the connector port 207 may be disposed in a space provided in the first housing 210 and / or the second housing 220 of the electronic device 200 and may be exposed to the external environment through at least one hole formed in the first housing 210 and / or the second housing 220. According to an embodiment, at least one connector port 207 may be used to send power and / or data to an external electronic device and receive power and / or data from an external electronic device. In an embodiment, at least one connector port (e.g., headphone jack) may receive a connector (e.g., headphone interface) for transmitting and receiving audio signals to and from an external electronic device. In an embodiment, a hole formed in the first housing 210 and / or the second housing 220 may be commonly used for an input device and the sound output devices 201 and 202. In an embodiment, the sound output devices 201 and 202 may include a speaker (e.g., a piezoelectric speaker) that operates without a hole formed in the first housing 210 and / or the second housing 220.

[0082] According to an embodiment, the sensor module 204 may generate an electrical signal or data value corresponding to an internal working state or an external environmental state of the electronic device 200. The sensor module 204 may detect, for example, an external environment through the first surface 211 of the first housing 210. In an embodiment, the electronic device 200 may further include at least one sensor module configured to detect an external environment through the second surface 212 of the first housing 210. According to an embodiment, the sensor module 204 (e.g., an illumination sensor) may be disposed under the flexible display DPM to detect an external environment through the flexible display DPM. According to an embodiment, the sensor module 204 may include at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, an illumination sensor, a proximity sensor, a biometric sensor, an ultrasonic sensor, or an illumination sensor.

[0083] According to an embodiment, the camera devices 205 and 208 may include a first camera device 205 (e.g., a front camera device) disposed on a first surface 211 of the first housing 210 and a second camera device 208 disposed on a second surface 212 of the first housing 210. The electronic device 200 may further include a flash 209 disposed near the second camera device 208. According to an embodiment, the camera devices 205 and 208 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 209 may include, for example, a light emitting diode or a xenon lamp. According to an embodiment, the camera devices 205 and 208 may be arranged so that two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and an image sensor are positioned on one surface (e.g., the first surface 211, the second surface 212, the third surface 221, or the fourth surface 222) of the electronic device 200. In an embodiment, the camera devices 205 and 208 may include a lens for time of flight (TOF) and an image sensor.

[0084] According to an embodiment, the key input device 206 (e.g., a key button) may be provided on the third side surface 213c of the first side frame 213 of the first housing 210. In an embodiment, the key input device 206 may be provided on at least one of the other side surfaces 213a and 213b of the first housing 210 and / or the side surfaces 223a, 223b, and 223c of the second housing 220. In an embodiment, the electronic device 200 may not include some or all of the key input devices 206, and the key input devices 206 not included may be implemented in other forms (such as soft keys) on the flexible display DPM. In an embodiment, the key input device 206 may be implemented using a pressure sensor included in the flexible display DPM.

[0085] According to an embodiment, the camera device 205 or the sensor module 204 of the camera devices 205 and 208 may be configured to be exposed through the flexible display DPM. For example, the first camera device 205 or the sensor module 204 may be configured to contact the external environment through an opening (e.g., a through hole) at least partially formed in the flexible display DPM in the internal space of the electronic device 200. In another embodiment, some sensor modules 204 may be configured to perform their functions in the internal space of the electronic device 200 without being visibly exposed through the flexible display DPM. For example, in this case, the area of ​​the flexible display DPM facing the sensor module may not require an opening.

[0086] refer to Figure 3b , can be achieved by hinge modules (e.g. Figure 4 In this case, the electronic device 200 can control the flexible display DPM to display different contents in the display area corresponding to the first surface 211 and the display area corresponding to the third surface 221. According to an embodiment, the electronic device 200 can operate the electronic device 200 through the hinge module (e.g., Figure 4 The hinge module 240 of FIG. 21 is configured to be in a substantially unfolded state (eg, Figure 2a folded state (e.g., Figure 3a For example, when the hinge module (e.g. Figure 4 When the hinge module 240 of the embodiment of the present invention provides a pressing force in the unfolding direction (direction B) at a predetermined angle in the unfolded state, the electronic device 200 can be operated to be transformed into the unfolded state (for example, Figure 2a For example, when a pressing force is provided in a folding direction (direction C) in a state where the electronic device 200 is unfolded at a predetermined corner, the hinge module (eg, Figure 4 The hinge module 240 of the electronic device 200 is operated to transform the electronic device 200 into a closed state (eg, Figure 3a In an embodiment, the hinge module (e.g., Figure 4 The hinge module 240) operates the electronic device 200 to maintain the unfolded state at various angles (not shown).

[0087] refer to Figure 4, the electronic device 200 may include a first side frame 213, a second side frame 223, and a hinge module 240 rotatably connecting the first side frame 213 and the second side frame 223. According to an embodiment, the electronic device 200 may include a first support plate 2131 extending at least partially from the first side frame 213 and a second support plate 2231 extending at least partially from the second side frame 223. According to an embodiment, the first support plate 2131 may be integrally formed with the first side frame 213 or may be structurally coupled to the first side frame 213. Similarly, the second support plate 2231 may be integrally formed with the second side frame 223 or may be structurally coupled to the second side frame 223.

[0088] According to an embodiment, the electronic device 200 may include a flexible display DPM configured to be supported by a first support plate 2131 and a second support plate 2231. According to an embodiment, the electronic device 200 may include a first back cover 214 coupled to the first side frame 213 and providing a first space between the first support plate 2131 and a second back cover 224 coupled to the second side frame 223 and providing a second space between the second support plate 2231. In an embodiment, the first side frame 213 and the first back cover 214 may be integrally formed. In an embodiment, the second side frame 223 and the second back cover 224 may be integrally formed. According to an embodiment, the electronic device 200 may include a first housing 210 (e.g., Figure 2a According to an embodiment, the electronic device 200 may include a second housing 220 (eg, a first housing structure) provided by a second side frame 223, a second support plate 2231, and a second rear cover 224. Figure 2a According to an embodiment, the electronic device 200 may include a sub-display 231 disposed to be visible from the outside through at least a partial area of ​​the first rear cover 214 .

[0089] According to an embodiment, the electronic device 200 may include a first board assembly 261 (e.g., a main printed circuit board), a camera assembly 263, a first battery 271, or a first bracket 251 disposed in a first space between the first side frame 213 and the first rear cover 214. According to an embodiment, the camera assembly 263 may include a plurality of camera devices (e.g., Figure 2a and Figure 3aAccording to an embodiment, the first bracket 251 may provide a support structure and enhance rigidity for supporting the first substrate assembly 261 and / or the camera assembly 263. According to an embodiment, the electronic device 200 may include a second board assembly 262 (e.g., a sub-printed circuit board), an antenna 290 (e.g., a coil member), a second battery 272, or a second bracket 252 disposed in a second space between the second side frame 223 and the second back cover 224. According to an embodiment, the electronic device 200 may include a wiring member 280 (e.g., a first printed circuit board (FPCB)) disposed from the first substrate assembly 261 through the hinge module 240 to a plurality of electronic components (e.g., the second substrate assembly 262, the second battery 272, or the antenna 290) disposed between the second side frame 223 and the second back cover 224 and providing electrical connections. According to an embodiment, the antenna 290 may include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the antenna 290 may perform short-range communication with an external device or may wirelessly transmit and receive power required for charging.

[0090] According to an embodiment, the electronic device 200 may include a hinge housing 241 (eg, a hinge cover) that supports the hinge module 240 and that is configured to be movable when the electronic device 200 is in a folded state (eg, Figure 3a When the electronic device 200 is in the unfolded state (for example, Figure 2a The device is introduced into the first space and / or the second space when in the expanded state (in the expanded state) and is not visible from the outside.

[0091] According to an embodiment, the electronic device 200 may include a first protective cover 215 coupled along an edge of the first side frame 213. According to an embodiment, the electronic device 200 may include a second protective cover 225 coupled along an edge of the second side frame 223. According to an embodiment, the first flat portion (e.g., Figure 2b The edge of the first flat portion 230a of the flexible display DPM may be protected by the first protective cover 215. According to an embodiment, the second flat portion (eg, Figure 2b The edge of the second flat portion 230a of the flexible display DPM may be protected by the second protective cover 225. According to an embodiment, the electronic device 200 may include a bendable portion (eg, Figure 2b A protective cap 235 is provided on the edge of the bendable portion 230c).

[0092] Figure 5 is an exploded perspective view showing a display according to an embodiment.

[0093] The display according to the exemplary embodiment of the present disclosure may include an unbreakable (UB) type OLED display (e.g., a curved display). However, without being limited thereto, the display (DPM) may include an on-cell touch active matrix organic light emitting diode (AMOLED) (OCTA) type flat display.

[0094] refer to Figure 5 , the display DPM (e.g., a flexible display) may include a window layer FGL, a polarizer POL (e.g., a polarizing film) sequentially disposed on a rear surface of the window layer FGL, a display panel DPL, a buffer layer CUL, a first metal sheet layer MP1, and a second metal sheet layer MP2. According to an embodiment, the window layer FGL may include a glass layer. According to an embodiment, the window layer FGL may include ultra-thin glass (UTG). In an embodiment, the window layer FGL may include a polymer. In this case, the window layer FGL may include polyethylene terephthalate (PET) or polyimide (PI).

[0095] According to an embodiment, the window layer FGL, the polarizing plate POL, the display panel DPL, the buffer layer CUL, the first metal sheet layer MP1 and the second metal sheet layer MP2 may be disposed to be aligned with the first housing (eg, Figure 2a The first surface 211 of the first surface (eg, Figure 2a and at least a portion of the first surface 211 of the housing (eg, Figure 2a The third surface of the second housing 220 (eg, Figure 2a intersects at least a portion of a third surface 221).

[0096] According to an embodiment, the window layer FGL, the polarizer POL, the display panel DPL, the buffer layer CUL, the first metal sheet layer MP1, and the second metal sheet layer MP2 may be attached to each other by an adhesive material (or adhesive). For example, the adhesive material may include at least one of an optically clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a common adhesive, or a double-sided tape.

[0097] According to an embodiment, the display DPM may include another adhesive member (e.g., a double-sided tape or a waterproof member) at least partially disposed on one surface of the second metal sheet layer MP2. According to an embodiment, the display DPM may be attached to the electronic device (e.g., Figure 4 The electronic device 200) has a support plate (eg, Figure 4 a first supporting plate 2131 and a second supporting plate 2231).

[0098] According to an embodiment, the polarizer POL may selectively transmit light generated from a light source of the display panel DPL and vibrating in a predetermined direction. According to an embodiment, the display panel DPL and the polarizer POL may be formed integrally. According to an embodiment, the display DPM may include a touch panel (not shown). Although not shown, the display panel DPL may include a control circuit. According to an embodiment, the control circuit may include a display driver IC (DDI) and / or a touch display driver IC (TDDI) arranged in a chip on panel (COP) or a chip on film (COF) manner.

[0099] According to an embodiment, the buffer layer CUL may include a polymer to absorb the electrical energy from the electronic device (eg, Figure 2a A buffer member (cushion) is provided to prevent damage to the display DPM by external impact of the electronic device 200).

[0100] According to an embodiment, the first metal sheet layer MP1 and the second metal sheet layer MP2 can help strengthen the electronic device (eg, Figure 2a The rigidity of the electronic device 200) is enhanced, and it is used to shield surrounding noise and disperse heat emitted from surrounding heat dissipation components.

[0101] According to an embodiment, the first metal sheet layer MP1 or the second metal sheet layer MP2 may include at least one of stainless steel (SUS) (e.g., stainless steel (STS)), Cu, Al, or CLAD (e.g., a stacking member in which SUS and Al are alternately arranged). In addition, the first metal sheet layer MP1 or the second metal sheet layer MP2 may include other alloy materials.

[0102] According to an embodiment, the first metal sheet layer MP1 or the second metal sheet layer MP2 may be integrally formed to face the electronic device ( Figure 2a The first housing 210 of the first housing (eg, Figure 2a The first housing 210) and the second housing (eg, Figure 2a The second housing 220 is connected to a portion formed on the hinge module (eg, Figure 4 A bendable portion in a portion of the hinge module 240).

[0103] In the embodiment, in the first metal sheet layer MP1 and the second metal sheet layer MP2, except for the hinge module (eg, Figure 4 The hinge module 240 is outside the portion facing the first housing (eg, Figure 2a The first housing 210) and the second housing (eg, Figure 2a Parts of the second shell 220) may be formed separately.

[0104] In an embodiment, the flexible display DPM may further include a metal reinforcing plate (not shown) disposed under the first metal sheet layer MP1 or the second metal sheet layer MP2 to enhance rigidity. According to an embodiment, the reinforcing plate may be disposed facing the first housing (e.g., Figure 2a The first housing 210 and the second housing (eg, Figure 2a The second housing 220).

[0105] According to an embodiment, the display DPM may include one or more protective layers PTL sequentially stacked on the window layer FGL. Without being limited thereto, the protective layer PTL may include or be formed of polyethylene terephthalate (PET) or polyimide (PI) having excellent optical properties. In addition, the protective layer PTL may include or be formed of thermoplastic polyurethane (TPU), which is advantageous in terms of elasticity.

[0106] Figure 6 is a view schematically showing a first metal sheet layer according to an embodiment.

[0107] In an embodiment, the first metal sheet MP1 may be divided into a bending area BA and a non-bending area UBA. The first metal sheet MP1 may have a bending portion over the bending area BA and may include a non-bending portion (or a flat portion) over the non-bending area UBA.

[0108] The first metal sheet layer MP1 of the bending area BA may be configured such that an electronic device (eg, Figure 2a The electronic device 200 of the embodiment works in a folded state, an unfolded state or an intermediate state. In the bending area BA of the first metal sheet MP1, a plurality of slit holes SLH1 and SLH2 may be provided so that the first metal sheet MP1 may be bent.

[0109] The first metal sheet MP1 of the unbending area UBA may be configured to have a flat surface even when the electronic device including the first metal sheet MP1 is held in a folded state, an unfolded state, or an intermediate state. Slit holes may not be formed in the unbending area UBA of the first metal sheet MP1 to obtain high rigidity.

[0110] In an embodiment, the first metal sheet layer MP1 may include one or more slit holes SLH1 and SLH2. The one or more slit holes SLH1 and SLH2 may be formed above the bending area BA. The one or more slit holes SLH1 and SLH2 may be formed in a first direction (eg, Figure 2a Extends in the x-axis direction or folding axis direction).

[0111] In an example, the slit holes SLH1 and SLH2 may include a first slit hole SLH1 and a second slit hole SLH2. The first slit hole SLH1 and the second slit hole SLH2 may be formed at different positions along the second direction. In an example, the first slit hole SLH1 and the second slit hole SLH2 may be formed in a manner that they are repeatedly aligned along the first direction. The first slit hole SLH1 and the second slit hole SLH2 may be formed in a manner that they are alternately aligned along the second direction.

[0112] In an example, the size of the second slit hole SLH2 may be determined based on the size of the first slit hole SLH1. For example, the size of the second slit hole SLH2 may be increased or decreased in proportion to the size of the first slit hole SLH1. In addition, the size of the second slit hole SLH2 may be determined independently regardless of the size of the first slit hole SLH1.

[0113] In an embodiment, the slit holes SLH1 and SLH2 may be formed in an elliptical shape of a long hole along the first direction, but are not limited thereto. In an embodiment, the slit holes SLH1 and SLH2 may be formed in the same or different shapes.

[0114] In embodiments, the slit holes SLH1 and SLH2 may be disposed regularly or at irregular intervals along the first direction and / or the second direction.

[0115] In an embodiment, at least some or all of the one or more slit holes SLH1 and SLH2 may alternatively be configured as a slit recess. The slit recess may be formed by forming a vertical direction (eg, Figure 2a The groove is formed in the same manner as a groove formed at a predetermined depth in the +z-axis direction or -z-axis direction.

[0116] In an embodiment, at least some of the slit holes SLH1 and SLH2 may be formed between the first peripheral holes FIH1 described below. More specifically, a plurality of slit holes SLH2 may be formed between at least some of the first peripheral holes FIH1 or at least two thereof. Figure 6 The case where the slit hole SLH2 is formed between the first reference holes FIH1 is shown, but it is not limited thereto. Here, a plurality of slit holes SLH1 and SLH2 positioned between the first reference holes FIH1 may be formed to extend in the folding axis direction. In addition, the first reference hole FIH1 positioned outside the slit holes SLH1 and SLH2 may be positioned on the same extension line as the slit holes SLH1 and SLH2.

[0117] In an embodiment, the first metal sheet MP1 may include one or more first reference holes FIH1. The first reference holes FIH1 may be formed in the edge of the bending area BA. The first reference holes FIH1 may be formed at four corner positions of the first metal sheet MP1 corresponding to the bending area BA.

[0118] In an example, the first reference hole FIH1 may be formed in a circular shape, but is not limited thereto.

[0119] In an example, the first reference hole FIH1 may be positioned on an extension line of a slit hole (eg, second slit hole SLH2) formed in an edge of the bending area BA in the second direction. In the present disclosure, a slit hole formed in an edge of the bending area BA in the second direction may be referred to as an edge slit hole.

[0120] In an example, the first reference hole FIH1 may be formed in the edge of the first metal sheet MP1 on an extension line of the edge slit hole (e.g., an imaginary line extending in the length direction of the edge slit hole). For example, an upper first reference hole FIH1 and a lower reference hole FIH1 may be formed in the first metal sheet MP1 on an extension line of the edge slit hole. Since the edge slit hole may exist at each corner of the bending area BA, four first reference holes FIH1 may be formed on the bending area BA.

[0121] In an embodiment, the first reference hole FIH1 may be formed through the protective layer (eg, Figure 5 The protective layer PTL) covers the front direction of the electronic device (for example, Figure 2a For example, the first reference hole FIH1 may be formed so as not to protrude in the outer direction of the display module DPM (e.g., the first direction or the x-axis direction). That is, the width between the first partial holes FIH1 in the first direction (e.g., the x-axis direction) may be formed to be smaller than the width of the bending area in the first direction. As described below, therefore, when the display module DPM is observed from the front, the first reference hole FIH1 may be covered by the upper stacked components such as the protective layer PTL and the filter layer PRL, and may be difficult to identify with the naked eye.

[0122] In an embodiment, a step may be formed between the bending area BA and the non-bending area UBA of the first metal sheet MP1. Here, the width of the step may be formed to be larger than the diameter of the first reference hole FIH1, but the present disclosure is not limited thereto. Due to the step, the width of the first metal sheet MP1 in the first direction may be formed to be smaller in the non-bending portion UBA than in the bending portion BA.

[0123] Figure 7is a view schematically showing a state in which a first metal sheet layer MP1 and a second metal sheet layer MP2 are stacked according to an embodiment.

[0124] In an embodiment, the first metal sheet layer MP1 may be stacked on the second metal sheet layer MP2, as described above with reference to Figure 5 as described.

[0125] In an embodiment, the first metal sheet layer MP1 may be formed to have at least a portion of the area of ​​the second metal sheet layer MP2. Figure 2a The width of the first metal sheet layer MP1 in the first direction may be formed to be substantially the same as the width of the second metal sheet layer MP2 in the first direction in the non-bending area UBA. In an embodiment, the width of the first metal sheet layer MP1 in the first direction may be formed to be substantially the same as the width of the second metal sheet layer MP2 in the first direction in the bending area BA.

[0126] In an embodiment, the second metal sheet layer MP2 may include an exposed portion FHA located in a central portion. The exposed portion FHA may be formed to extend along a first direction. In an example, the exposed portion FHA may be formed from one edge of the second metal sheet layer MP2 to another edge along the first direction, but is not limited thereto. For example, the exposed portion FHA is formed along the first direction, and a portion and another portion of the second metal sheet layer MP2 may be partially connected to each other with the center located therebetween.

[0127] In an embodiment, the first metal sheet layer MP1 may be partially exposed through an exposed portion FHA provided in the second metal sheet layer MP2. Specifically, at least a portion of the first metal sheet layer MP1 corresponding to the exposed portion FHA of the second metal sheet layer MP2 may be exposed.

[0128] In an embodiment, the width of the exposed portion FHA in the second direction may be formed based on the widths of the slit holes SLH1 and SLH2 formed in the first metal sheet layer MP1. Figure 2a In the y-axis direction, the width of the exposed portion FHA may be formed to be greater than the width of a single slit hole. In addition, in the second direction, the width of the exposed portion FHA may be formed in a size that at least one, at least two, or at least three slit holes SLH1 and SLH2 are exposed, but is not limited thereto.

[0129] In an embodiment, the second metal sheet layer MP2 may have a recess in a portion corresponding to the first reference hole FIH1. The portion formed with the recess may be referred to as a cutout portion FIH2. The second metal sheet layer MP2 may be formed by the cutout portion FIH2 so as not to cover at least a portion of the first metal sheet layer MP1 corresponding to the first main body hole FIH1. In an embodiment, the cutout portion FIH2 may be formed in a shape that is concave toward the inside of the second metal sheet layer MP2. For example, the cutout portion FIH2 may be formed in a U-shape or a square shape with one side omitted, but is not limited thereto. In addition, the width of the second metal sheet layer MP2 may be reduced in an area adjacent to the first reference hole FIH1 along the first direction, and the reduced width may be substantially the same as the width of the first metal sheet layer MP1 in the non-bending area UBA.

[0130] In addition, the first metal sheet layer MP1 and the second metal sheet layer MP2 can be used as Figure 5 The components of the display shown are provided. In the following disclosure, reference will be made to Figure 7 The cross-sectional reference lines shown (eg, II' and II-II') exemplarily describe cross-sections of the electronic device. Figure 7 The cross-sectional reference line is shown for the first metal sheet layer MP1 and the second metal sheet layer MP2, but is not limited thereto and can be used as a reference line for showing a cross section of each layer of the electronic device at that position. Figures 2a to 4 Understand the layer structure of electronic devices and refer to Figure 5 Understand the layer structure of a display provided in an electronic device.

[0131] Figure 8a is a cross-sectional view of the electronic device according to the embodiment taken along II'. Figure 8b is a cross-sectional view of the electronic device according to the embodiment taken along I-II'.

[0132] In the present disclosure, the cross section observed from II-I' may mean the second direction reference cross section of the electronic device, and the cross section observed from II-II' may mean the second direction inner cross section of the electronic device. The second direction reference cross section means a cross section including the first reference hole FIH1 in the second direction, and the second direction inner cross section means a cross section not including the first reference hole FIH1 in the second direction. The second direction reference cross section may mean, for example, an edge cross section of the electronic device that intersects perpendicularly with the folding axis.

[0133] More specifically, Figure 8a It is an electronic device along Figure 7 A cross-sectional view taken along line II' is shown. Figure 8b It is an electronic device along Figure 7The cross-section is taken along line II-II'. Here, the cross-section is related to the electronic device but not all components of the electronic device are shown. Instead, they are schematically shown to describe the structural relationship of various embodiments of the present disclosure.

[0134] For example, Figure 8a and Figure 8b Not only the first metal sheet layer MP1 and the second metal sheet layer MP2 are shown, but also the protection layer PTL, the window layer FGL, the polarizer POL, the display panel DPL and the buffer layer CUL are shown, and the optical sensor OSE and the hinge module HIN (for example, Figure 4 Hinge module 240) is shown to illustrate alignment using the first reference hole FIH1.

[0135] In an embodiment, the electronic device may include a display module (eg, Figure 1 The display module 160, Figure 4 and Figure 5 The display module may be configured to be detachable from the first housing (eg, Figure 2a The first surface 211 of the first surface (eg, Figure 2a The first surface 211 of the hinge module HIN (eg, Figure 4 The hinge module 240) extends to the second housing (eg, Figure 2a The third surface of the second housing 220 (eg, Figure 2a at least a portion of a third surface 221).

[0136] In an embodiment, the electronic device may include a hinged housing (eg, Figure 4 The hinge housing 241 supports the hinge module HIN, is exposed to the outside when the electronic device is in the folded state, and is configured to be invisible from the outside in the unfolded state.

[0137] The display module needs to be correctly connected to the first shell and the second shell and the hinge module. In particular, in the flexible display module DPM, the bent portion may include layer components with different structures or shapes, and in addition in the electronic device, the bent portion has a predetermined component such as the hinge module HIN. Therefore, the display module DPM needs to be accurately installed at a determined position in relationship with other components (e.g., hinge shell, hinge module HIN, first shell and second shell). For such accurate installation, the display module can be provided with a metal sheet layer (e.g., a first metal sheet layer MP1) having a first reference hole FIH1 as described above.

[0138] In embodiments, the protection layer PTL, the window layer FGL, the polarizer POL, the display panel DPL, the buffer layer CUL, the first metal sheet layer MP1 and / or the second metal sheet layer MP2 constituting the display module may be bonded by an adhesive material P.

[0139] In an embodiment, a plurality of slit holes SLH1 and SLH2 may be formed in the first metal sheet layer MP1. The plurality of slit holes SLH1 and SLH2 may be formed along the second direction (eg, Figure 2a The plurality of slit holes SLH1 and SLH2 may include first slit holes SLH1 and second slit holes SLH2, and the first slit holes SLH1 and the second slit holes SLH2 may be alternately formed with respect to each other along the second direction.

[0140] According to an embodiment, in a cross section including the first reference hole FIH1 in the second direction, the first metal sheet layer MP1 may include the first reference hole FIH1 and the first slit hole SLH1. According to an embodiment, in the cross section, the first metal sheet layer MP1 exists in a portion corresponding to the bending area BA, but may be deleted in a portion corresponding to the non-bending area UBA.

[0141] In an embodiment, the first reference hole FIH1 may be formed outside the first slit hole SLH1. Specifically, it may be formed at a position adjacent to the first slit hole SLH1 positioned at the outermost side among the plurality of first slit holes SLH1. The first reference hole FIH1 may be set to an opening. The corresponding opening of the first reference hole FIH1 may be filled with a breathable material, but the present disclosure is not limited thereto.

[0142] According to an embodiment, on a second direction cross section including the first reference hole FIH1, the second metal sheet layer MP2 may include a folding hole FOH and a cutout portion FIH2 for exposing the first reference hole FIH1. The cutout portion FIH2 may be formed at a position corresponding to the first reference hole FIH1 of the first metal sheet layer MP1. The cutout portion FIH2 may be formed to have a larger width than the first reference hole FIH1. The folding hole FOH may be formed to have a width that exposes at least one slit hole. The folding hole FOH may be formed in an exposed portion (e.g., Figure 7 above the exposed portion FHA).

[0143] According to an embodiment, the hinge module HIN and / or the hinge housing may be coupled to the display module below the second metal sheet layer MP2. One or more components may be additionally provided between the second metal sheet layer MP2 and the display module. The following disclosure is described by taking those disclosures related to the hinge module HIN as an example, but is not limited thereto, and the description of the hinge module HIN as an example may be replaced with the description related to the hinge housing.

[0144] In an embodiment, the hinge module HIN may be folded or unfolded based on the center. The central portion of the hinge module HIN may be formed to correspond to the central portion of the display module. Here, the central portion may be at least a portion used as a folding reference.

[0145] In an embodiment, the hinge module HIN may include one or more second reference holes FIH3. The second reference hole FIH3 may be formed at a position corresponding to the first reference hole FIH1 formed in the first metal sheet layer MP1. Specifically, the first reference hole FIH1 and the second reference hole FIH3 may be formed so that an imaginary line that straightly penetrates the first reference hole FIH1 straightly penetrates the second reference hole FIH3.

[0146] In an embodiment, the display module and the hinge module HIN can be aligned and connected using the first reference hole FIH1 and the second reference hole FIH3. In the process of connecting the display module and the hinge module HIN, one or more optical sensors OSE can be used. In the present embodiment, the optical sensor OSE of the IR band is shown and described, but is not limited to this. The optical sensor OSE can irradiate light in a third direction (e.g., the z-axis direction) perpendicular to the first direction and the second direction, and the optical sensor OSE can identify the first reference hole FIH1 and the second reference hole FIH3. As described above, the positions of the identified first reference hole FIH1 and the second reference hole FIH3 can be reference points for aligning the position of the display module and the position of the hinge module HIN. The display module and the hinge module HIN can be connected to each other based on the positions of the identified first reference hole FIH1 and the second reference hole FIH3.

[0147] In addition, in an embodiment, a filter layer PRL may be included between the protection layer PTL and the window layer FGL of the display module. For example, the filter layer (PRL) may be formed by printing a material having a predetermined wavelength band relative to the lower side of the protection layer PTL, but is not limited thereto. Figure 8a , the filter layer PRL may be formed over a predetermined area of ​​the lower surface of the protective layer PTL. Figure 8b , the filter layer PRL may not be formed between the protection layer PTL and the window layer FGL.

[0148] In an embodiment, the filter layer PRL may include a first filter portion PTP and a second filter portion BMP. The first filter portion PTP may be configured to transmit a predetermined band (e.g., an IR band), while the second filter portion BMP may not transmit a predetermined band (e.g., an IR band). In an example, the first filter portion PTP may be configured to transmit at least 90% or more of IR light. In an example, the second filter portion BMP may be configured not to transmit light, but may be a black matrix area but is not limited thereto.

[0149] refer to Figure 8a As shown in the cross section, in an embodiment, the first filter part PTP may be formed to include at least a region corresponding to the first reference hole FIH1. The first filter part PTP may be formed above the bending area BA or in a range wider than the bending area BA.

[0150] As referenced below Fig.10 and Fig.11a As described, in an embodiment, the first filter portion PTP may have a width substantially the same as the length of the recess (e.g., the cutout portion FIH2) provided in the second metal sheet layer MP2 in the first direction, and may be formed to extend in the second direction. In an embodiment, the first filter portion PTP may be formed to have a width greater than the length of the recess (e.g., the cutout portion FIH2) provided in the second metal sheet layer MP2 in the first direction. In an embodiment, the first filter portion PTP may be formed to have a width less than the length of the recess provided in the second metal sheet layer MP2 in the first direction, but the first filter portion PTP may be formed to have a width capable of covering the first reference hole FIH1 in a third direction (e.g., the z-axis).

[0151] In an embodiment, the first filter portion PTP may be formed over the bending area BA along the second direction while maintaining the width. In an embodiment, the first filter portion PTP may have the same width as the length of the first metal sheet layer MP1 or the second metal sheet layer MP1 in the first direction, and may be formed to extend in the second direction, but is not limited thereto.

[0152] In an embodiment, the first filter part PTP may be formed to have a greater width than the bending area BA. An edge of the first filter part PTP may be positioned further outward than an edge of the first metal sheet layer MP1 corresponding to the bending area BA.

[0153] In addition, in an embodiment, the first slit hole SLH1 provided in the first metal sheet layer MP1 may be provided with a reinforcing layer REL on the lower side (e.g., -z axis side) in the third direction. The reinforcing layer REL may be formed between the adhesive material P provided on one surface of the second metal sheet layer MP2, but is not limited thereto. In an embodiment, the reinforcing layer REL may be bonded to the first slit hole SLH1 and / or the second slit hole SLH2 to enhance durability in the bending area BA of the display module.

[0154] In an embodiment, the reinforcement layer REL may not be formed in a portion corresponding to the first reference hole FIH1. In an embodiment, the reinforcement layer REL may be formed on the lower side of the region where the first slit hole SLH1 and the second slit hole SLH2 are provided, and may be deleted from the lower side of the region where the first reference hole FIH1 is provided. Therefore, the reinforcement layer REL may be formed to have a smaller width than the first metal sheet layer MP1 on the second direction cross section including the first reference hole FIH1.

[0155] In addition, in one embodiment, the reinforcement layer REL may not be formed in a portion corresponding to the cutout portion FIH2 of the second metal sheet layer MP2. In an embodiment, the reinforcement layer REL may be formed on the lower side of the region where the first slit hole SLH1 and the second slit hole SLH2 are provided, and may be deleted from the lower side of the region where the cutout portion FIH2 is provided.

[0156] refer to Figure 8b In an embodiment, a plurality of slit holes SLH1 and SLH2 may be formed in the first metal sheet layer MP1. The plurality of slit holes SLH1 and SLH2 may be formed along the second direction (eg, Figure 2a The plurality of slit holes SLH1 and SLH2 may include first slit holes SLH1 and second slit holes SLH2, and the first slit holes SLH1 and the second slit holes SLH2 may be alternately formed with respect to each other along the second direction.

[0157] According to an embodiment, the first metal sheet layer MP1 may include the first slit hole SLH1 and the second slit hole SLH2 in the second direction cross section not including the first reference hole FIH1. According to an embodiment, in the cross section, the first metal sheet layer MP1 may exist in the bending area BA ( Figure 7 The bending area BA) and the part corresponding to the non-bending area UBA.

[0158] In an embodiment, the slit hole formed at the outermost side along the second direction (i.e., the edge slit hole) may be any one of the first slit hole SLH1 and the second slit hole SLH2. When a cross section including the first reference hole FIH1 is compared with a cross section not including the first reference hole FIH1 in the second direction, the edge slit hole may be provided at a position where the first reference hole FIH1 is formed.

[0159] According to an embodiment, the second metal sheet layer MP2 may include a folding hole FOH in a second direction cross section that does not include the first reference hole FIH1. However, according to an embodiment, the second metal sheet layer MP2 may not be formed. Figure 8a The cutout portion FIH2 is shown. The folding hole FOH may be formed in the exposed portion (e.g., Figure 7 above the exposed portion FHA).

[0160] According to an embodiment, the second metal sheet layer MP2 may be formed above the bending area BA and the non-bending area UBA in a second direction cross section not including the first reference hole FIH1. In cross section, the first metal sheet layer MP1 may also be formed above the bending area BA and the non-bending area UBA. In the bending area BA, the first metal sheet layer MP1 may include the first slit hole SLH1 and the second slit hole SLH2, and in the bending area BA, the second metal sheet layer MP2 may include a folding hole FOH.

[0161] According to an embodiment, on a second direction cross section not including the first reference hole FIH1, the first metal sheet layer MP1 does not include the first reference hole FIH1. In addition, the second metal sheet layer MP2 also does not include the cutout portion FIH2 on the cross section. Therefore, no singular point is identified in a portion corresponding to the cross section during sensing using the optical sensor OSE.

[0162] In addition, according to an embodiment, in a second direction cross section not including the first reference hole FIH1, the filter layer PRL may not include the first filter part PTP. Although not limited thereto, when the first filter part PTP has a length substantially the same as that of the first metal sheet layer MP1 or the second metal sheet layer MP2 in the first direction and extends in the second direction, it may be formed as described above with reference to Figure 8a As described, Figure 8a The first filter parts PTP are shown to be of substantially the same length.

[0163] Figure 9a is a cross-sectional view of the electronic device according to the embodiment taken along II'. Figure 9b is a cross-sectional view of the electronic device according to the embodiment taken along I-II'.

[0164] More specifically, Figure 9aIt is an electronic device along Figure 7 A cross-sectional view taken along line II' is shown. Figure 9b It is an electronic device along Figure 7 The cross-section is related to the electronic device but not all components of the electronic device are shown. Instead, the cross-section is schematically shown to describe the structural relationship of various embodiments of the present disclosure.

[0165] Figure 9a and Figure 9b The protective layer PTL, the window layer FGL, the polarizer POL, the display panel DPL, the buffer layer CUL, the first metal sheet layer MP1, the second metal sheet layer MP2, the reinforcement layer REL and the adhesive material P shown in the figure can be understood as the same as the reference Figure 8a and Figure 8b The described protection layer PTL, window layer FGL, polarizing plate POL, display panel DPL, buffer layer CUL, first metal sheet layer MP1, second metal sheet layer MP2, reinforcement layer REL, and adhesive material P are substantially the same.

[0166] refer to Figure 9a and Figure 9b In an embodiment, a filter layer PRL may be included between the protection layer PTL and the window layer FGL of the display module. For example, the filter layer (PRL) may be formed by printing a material having a predetermined wavelength band relative to the lower side of the protection layer PTL, but is not limited thereto.

[0167] In an embodiment, the filter layer PRL may include a first filter portion PTP and a second filter portion BMP. The first filter portion PTP may be configured to transmit a predetermined band (e.g., an IR band), while the second filter portion BMP may not transmit a predetermined band (e.g., an IR band). In an example, the first filter portion PTP may be configured to transmit at least 90% or more of IR light. In an example, the second filter portion BMP may be configured not to transmit light, but may be a black matrix area but is not limited thereto.

[0168] refer to Figure 9a In an embodiment, the first filter part PTP may be formed to include at least a region corresponding to the first reference hole FIH1 on a second direction cross section including the first reference hole FIH1. The first filter part PTP may be formed above a portion of the bent area BA, but the first filter part PTP may not be formed on a portion corresponding to the folding hole FOH, i.e., an exposed portion (e.g., Figure 7 Therefore, the filter layer PRL may include two or more first filter parts PTP spaced apart from each other and a second filter part BMP disposed with the first filter parts PTP interposed therebetween.

[0169] In an embodiment, the first filter portion PTP may have a width that is the same as the length of the recess (e.g., the cutout portion FIH2) provided by the second metal sheet layer MP2 in the first direction, and may be formed to extend in the second direction. In an embodiment, the first filter portion PTP may be formed to extend along the second direction while maintaining the width. In an embodiment, the first filter portion PTP may have a width that is the same as the length of the first metal sheet layer MP1 or the second metal sheet layer MP2 in the first direction, and may be formed to extend in the second direction, but is not limited thereto.

[0170] Furthermore, in an embodiment, an outer edge of the first filter part PTP may be positioned in the non-bending area UBA. Furthermore, an inner edge of the first filter part PTP may be positioned in the bending area BA.

[0171] refer to Figure 9b According to an embodiment, in the second direction cross section not including the first reference hole FIH1, the filter layer PRL may not include the first filter part PTP and the second filter part BMP.

[0172] Fig.10 is a view schematically showing a state in which a first metal sheet layer MP1 and a second metal sheet layer MP2 are stacked according to an embodiment.

[0173] Fig.10 The stacking state of the first metal sheet layer MP1 and the second metal sheet layer MP2 shown in FIG. Figure 7 In the following disclosure, reference will be made to Fig.10 The cross-sectional reference lines shown (eg, III-III', IV-IV', and V-V') exemplarily describe cross-sections of the electronic device. Fig.10 The cross-sectional reference line is shown for the first metal sheet layer MP1 and the second metal sheet layer MP2, but is not limited thereto and can be used as a reference line for showing a cross section of each layer of the electronic device at that position. Figures 2a to 4 Understand the layer structure of electronic devices and refer to Figure 5 Understand the layer structure of a display provided in an electronic device.

[0174] Fig.11a is an electronic device according to an embodiment of the present invention Fig.10 A cross-sectional view taken along line III-III'. Fig.11b is a cross-sectional view of the electronic device according to the embodiment taken along IV-IV'. Fig.11c is a cross-sectional view of the electronic device according to the embodiment taken along line VV'.

[0175] In the present disclosure, the cross section observed from III-III' may mean the first direction reference cross section of the electronic device. In addition, the cross section observed from IV-IV' may mean the first direction inner cross section of the electronic device. In addition, the cross section observed from V-V' may mean the first direction outer cross section of the electronic device. The first direction reference cross section may mean a cross section including the first reference hole FIH1 in the first direction, and the first direction inner / outer cross section may mean a cross section not including the first reference hole FIH1 in the second direction. The first direction inner cross section means a cross section closer to the folding axis than the first direction reference cross section, and the first direction outer cross section means a cross section farther away from the folding axis than the first direction reference cross section.

[0176] Each cross section does not show all components of the electronic device, but is schematically shown to describe the structural relationship of various embodiments of the present disclosure.

[0177] Figures 11a to 11c The protective layer PTL, filter layer PRL, window layer FGL, polarizer POL, display panel DPL, buffer layer CUL, first metal sheet layer MP1, second metal sheet layer MP2, reinforcement layer REL and adhesive material P shown in FIG. Figures 8a to 9b The described protection layer PTL, window layer FGL, polarizing plate POL, display panel DPL, buffer layer CUL, first metal sheet layer MP1, second metal sheet layer MP2, reinforcement layer REL, and adhesive material P are substantially the same.

[0178] Fig.11a A first direction reference cross section is shown.

[0179] In an embodiment, the first reference hole FIH1 may be positioned at an edge of the first metal sheet layer MP1 in a cross section along the first direction. In an embodiment, the first reference hole FIH1 may be positioned at a relatively outer side compared to the first slit hole SLH1. In an embodiment, the first reference hole FIH1 may be formed to have a diameter shorter than the length of the first slit hole SLH1 in the first direction.

[0180] In an embodiment, the second metal sheet layer MP2 may include a cutout portion FIH2 for exposing the first reference hole FIH1. The lower side of the first reference hole FIH1 may be opened by the cutout portion FIH2. Since the cutout portion FIH2 is used to expose the first reference hole FIH1, it may be formed in a portion corresponding to the first reference hole FIH1.

[0181] In an embodiment, the hinge module HIN may include a second reference hole FIH3. As described above, the second reference hole FIH3 may be formed at a position corresponding to the first reference hole FIH1.

[0182] In an embodiment, the filter layer PRL may be formed on the lower portion of the protective layer PTL. For example, the filter layer PRL may be printed on the lower portion of the protective layer PTL. The filter layer PRL may be formed along an edge of the protective layer PTL corresponding to a non-display area of ​​the display module DPM. In an embodiment, the filter layer PRL may have a characteristic of not transmitting at least a portion of the visible light band, and as a result, the filter layer PRL may not be formed in a portion corresponding to the display area of ​​the display module. Reference Fig.11a , a blank space may be formed between the first filter parts PTP. In addition, the width of the blank space between the first filter parts PTP may correspond to the height of the filter layer PRL. This may also be substantially applicable to the following Fig.11b , Fig.17a and Fig.17b .

[0183] The filter layer PRL may include a first filter part PTP.

[0184] In an example, the first filter part PTP may be formed in a portion corresponding to the first reference hole FIH1. The first filter part PTP may be formed to cover the first reference hole FIH1 from the top. In an embodiment, the first filter part PTP may be formed relative to Fig.11a The cross section shown has a width greater than the width of the first reference hole FIH1.

[0185] In an example, a reinforcement layer REL may be formed between the first metal sheet layer MP1 and the second metal sheet layer MP2 The reinforcement layer REL may be formed to cover at least some or all of the plurality of first slit holes SLH1 .

[0186] Fig.11b A cross section in the first direction is shown.

[0187] Fig.11b Related to the first direction inner cross section, and omitted with Fig.11a A description of the commonalities, with the description focusing primarily on the differences.

[0188] In the inner cross section according to the embodiment, the first metal sheet MP1 may not include the first reference hole FIH1. That is, two opposite edges of the first metal sheet MP1 may be set to a flat plane. In the example, the first reference hole FIH1 may be included only in the first direction reference cross section and the second direction reference cross section, and may not be included in the remaining cross sections.

[0189] Fig.11c Shows the outer cross section in the first direction.

[0190] Fig.11c Related to the first direction outer cross section, and omitted with Fig.11a A description of the commonalities, with the description focusing primarily on the differences.

[0191] In the outer cross section according to the embodiment, the first metal sheet MP1 may not include the first reference hole FIH1. That is, the two opposite edges of the first metal sheet MP1 may be set to a flat plane. In the example, the first reference hole FIH1 may be included only in the first direction reference cross section and the second direction reference cross section, and may not be included in other cross sections.

[0192] In the outer cross-section according to the embodiment, the filter layer PRL may include a second filter part BMP. In an example, the second filter part BMP may be formed at a position covering a step formed in the first metal sheet layer MP1. Unlike the first filter part PTP, the second filter part BMP may be configured not to transmit light of a predetermined wavelength band (e.g., light of an IR wavelength band).

[0193] In the outer cross-section according to the embodiment, steps may be formed at two opposite edges of the first metal sheet layer MP1. Fig.10 As shown, the steps formed at two opposite edges of the first metal sheet MP1 may extend in the second direction (eg, the +y-axis direction or the −y-axis direction).

[0194] Fig.12 is a view schematically showing a first metal sheet layer according to an embodiment.

[0195] In an embodiment, the first metal sheet MP1 may be divided into a bending area BA and a non-bending area UBA. The first metal sheet MP1 may have a bending portion over the bending area BA and may have a non-bending portion (or a flat portion) over the non-bending area UBA.

[0196] The first metal sheet MP1 of the bending area BA may be configured to enable the electronic device including the first metal sheet MP1 to operate in a folded state, an unfolded state or an intermediate state. In the bending area BA of the first metal sheet MP1, a plurality of holes may be provided so that the first metal sheet MP1 can be bent.

[0197] The first metal sheet MP1 of the unbending area UBA may be configured to have a flat surface even when the electronic device including the first metal sheet MP1 is held in a folded state, an unfolded state, or an intermediate state. No hole may be formed in the unbending area UBA of the first metal sheet MP1 to obtain high rigidity.

[0198] In an embodiment, the first metal sheet layer MP1 may include one or more slit holes. The one or more slit holes may be formed above the bending area BA. The one or more slit holes may be formed in a first direction (eg, Figure 2a Extends in the x-axis direction or folding axis direction).

[0199] In an example, the slit holes may include a first slit hole SLH1 and a second slit hole SLH2. The first slit hole SLH1 and the second slit hole SLH2 may be formed at different positions along the second direction. In an example, the first slit hole SLH1 and the second slit hole SLH2 may be formed in a manner that they are repeatedly aligned along the first direction. The first slit hole SLH1 and the second slit hole SLH2 may be formed in a manner that they are alternately aligned along the second direction.

[0200] In an example, the size of the second slit hole SLH2 may be determined based on the size of the first slit hole SLH1. For example, the size of the second slit hole SLH2 may be increased or decreased in proportion to the size of the first slit hole SLH1. In addition, the size of the second slit hole SLH2 may be determined independently regardless of the size of the first slit hole SLH1.

[0201] In an embodiment, the slit holes SLH1 and SLH2 may be formed in an elliptical shape of a long hole along the first direction, but are not limited thereto. In an embodiment, the slit holes SLH1 and SLH2 may be formed in the same or different shapes.

[0202] In embodiments, the slit holes SLH1 and SLH2 may be disposed regularly or at irregular intervals along the first direction and / or the second direction.

[0203] In an embodiment, at least some or all of the one or more slit holes may alternatively be configured as a slit recess. The slit recess may be formed by forming a vertical direction (eg, Figure 2a The groove is formed in the same manner as a groove formed at a predetermined depth in the +z-axis direction or -z-axis direction.

[0204] In an embodiment, at least some of the slit holes SLH1 and SLH2 may be formed between the first peripheral holes FIH1 described below. More specifically, a plurality of slit holes SLH2 may be formed between at least some of the first peripheral holes FIH1 or at least two thereof. Figure 6 The case where the slit hole SLH2 is formed between the first reference holes FIH1 is shown, but it is not limited thereto. Here, a plurality of slit holes SLH1 and SLH2 positioned between the first reference holes FIH1 may be formed to extend in the folding axis direction. In addition, the first reference hole FIH1 positioned outside the slit holes SLH1 and SLH2 may be positioned on the same extension line as the slit holes SLH1 and SLH2.

[0205] In an embodiment, the first metal sheet MP1 may include one or more first reference holes FIH1. The first reference holes FIH1 may be formed in the edge of the bending area BA. The first reference holes FIH1 may be formed at four corner positions of the first metal sheet MP1 corresponding to the bending area BA.

[0206] In an example, the first reference hole FIH1 may be formed in a circular shape, but is not limited thereto.

[0207] In an example, the first reference hole FIH1 may be positioned on an extension line of a slit hole (eg, the second slit hole SLH2 ) formed in an edge of the bending area BA in the second direction.

[0208] In an example, the first reference hole FIH1 may be formed in each edge of the first metal sheet layer MP1 based on the extension line of the edge slit hole. For example, an upper first reference hole FIH1 and a lower reference hole FIH1 may be formed in the first metal sheet layer MP1 based on the extension line of the edge slit hole. Since the edge slit hole may exist at each corner of the bending area BA, four first reference holes FIH1 may be formed on the bending area BA.

[0209] In an embodiment, the first reference hole FIH1 may be formed through the protective layer (eg, Figure 5 The protective layer PTL) covers the front direction of the electronic device (for example, Figure 2a For example, the first reference hole FIH1 may be formed so as not to protrude in the outer direction of the display module DPM (e.g., the first direction or the x-axis direction). That is, the width between the first partial holes FIH1 in the first direction (e.g., the x-axis direction) may be formed to be smaller than the width of the bending area in the first direction. As described below, therefore, when the display module DPM is observed from the front, the first reference hole FIH1 may be covered by the upper stacked components such as the protective layer PTL and the filter layer PRL, and may be difficult to identify with the naked eye.

[0210] In an embodiment, the first metal sheet MP1 may have substantially the same width in the bending area BA and the non-bending area UBA. Here, the width means the width in the first direction. Figure 6 and Figure 7 The first metal sheet MP1 shown is different in that it may not include a step between the bending area BA and the non-bending area UBA.

[0211] Fig.13 is a view schematically showing a state in which a first metal sheet layer MP1 and a second metal sheet layer MP2 are stacked according to an embodiment.

[0212] In an embodiment, the first metal sheet layer MP1 may be stacked on the second metal sheet layer MP2, as described above with reference to Fig.12 as described.

[0213] In an embodiment, the first metal sheet layer MP1 may be formed to have at least a portion of the area of ​​the second metal sheet layer MP2. Figure 2a The width of the first metal sheet layer MP1 in the first direction may be formed to be substantially the same as the width of the second metal sheet layer MP2 in the first direction in the non-bending area UBA. In an embodiment, the width of the first metal sheet layer MP1 in the first direction may be formed to be substantially the same as the width of the second metal sheet layer MP2 in the first direction in the bending area BA.

[0214] In an embodiment, the second metal sheet layer MP2 may include an exposed portion FHA located in a central portion. The exposed portion FHA may be formed to extend along a first direction. In an example, the exposed portion FHA may be formed from one edge of the second metal sheet layer MP2 to another edge along the first direction, but is not limited thereto. For example, the exposed portion FHA is formed along the first direction, and a portion and another portion of the second metal sheet layer MP2 may be partially connected to each other with the center located therebetween.

[0215] In an embodiment, the first metal sheet layer MP1 may be partially exposed through an exposed portion FHA provided in the second metal sheet layer MP2. Specifically, at least a portion of the first metal sheet layer MP1 corresponding to the exposed portion FHA of the second metal sheet layer MP2 may be exposed.

[0216] In an embodiment, the width of the exposed portion FHA in the second direction may be formed based on the widths of the slit holes SLH1 and SLH2 formed in the first metal sheet layer MP1. Figure 2a In the y-axis direction, the width of the exposed portion FHA may be formed to be greater than the width of a single slit hole. In addition, in the second direction, the width of the exposed portion FHA may be formed in a size that at least one, at least two, or at least three slit holes SLH1 and SLH2 are exposed, but is not limited thereto.

[0217] In an embodiment, the second metal sheet layer MP2 may have a recess (e.g., a cutout portion FIH2) in a portion corresponding to the first reference hole FIH1. The second metal sheet layer MP2 may be formed by the cutout portion FIH2 so as not to cover at least a portion of the first metal sheet layer MP1 corresponding to the first body hole FIH1. The width of the second metal sheet layer MP2 may be reduced in an area adjacent to the first reference hole FIH1 along the first direction, and the reduced width may be substantially the same as the width of the first metal sheet layer MP1 in the non-bending area UBA.

[0218] In addition, the first metal sheet layer MP1 and the second metal sheet layer MP2 can be used as Figure 5 The components of the display shown are provided. In the following disclosure, reference will be made to Fig.13 The cross-sectional reference lines shown (eg, VI-VI' and VII-VII') exemplarily depict cross-sections of the electronic device. Fig.13 The cross-sectional reference line is shown for the first metal sheet layer MP1 and the second metal sheet layer MP2, but is not limited thereto and can be used as a reference line for showing a cross section of each layer of the electronic device at that position. Figures 2a to 4 Understand the layer structure of electronic devices and refer to Figure 5 Understand the layer structure of a display provided in an electronic device.

[0219] Fig.14a is an electronic device according to an embodiment of the present invention Fig.13 A cross-sectional view taken along line VI-VI'. Fig.14b is a cross-sectional view of the electronic device according to the embodiment taken along line VII-VII'.

[0220] More specifically, Fig.14a It is an electronic device along Fig.13 A cross-sectional view taken along line VI-VI′ is shown. Fig.14b It is an electronic device along Figure 7 Here, the cross section is related to the electronic device but not all components of the electronic device are shown, but are schematically shown to describe the structural relationship of various embodiments of the present disclosure.

[0221] For example, Fig.14a and Fig.14b Not only the first metal sheet layer MP1 and the second metal sheet layer MP2 are shown, but also the protection layer PTL, the window layer FGL, the polarizer POL, the display panel DPL and the buffer layer CUL are shown, and the optical sensor OSE and the hinge module HIN (for example, Figure 4 Hinge module 240) is shown to illustrate alignment using the first reference hole FIH1.

[0222] In an embodiment, the electronic device may include a display module (eg, Figure 1 The display module 160, Figure 4 and Figure 5 The display module may be configured to be detachable from the first housing (eg, Figure 2a The first surface 211 of the first surface (eg, Figure 2a The first surface 211 of the hinge module HIN (eg, Figure 4 The hinge module 240) extends to the second housing (eg, Figure 2a The third surface of the second housing 220 (eg, Figure 2a at least a portion of a third surface 221).

[0223] In an embodiment, the electronic device may include a hinged housing (eg, Figure 4 The hinge housing 241 supports the hinge module HIN, is exposed to the outside when the electronic device is in the folded state, and is configured to be invisible from the outside in the unfolded state.

[0224] The following description mainly focuses on the reference to the electronic device Fig.14a and Fig.14b The differences described above are Figure 8a and Figure 8b The descriptions made are shared and replaced with the above descriptions.

[0225] refer to Fig.14a In an embodiment, the first metal sheet layer MP1 may be formed over the bending area BA and the non-bending area UBA. In particular, since the first metal sheet layer MP1 is formed over the non-bending area UBA, the first metal sheet layer MP1 may be joined in the non-bending area UBA to generally face the second metal sheet layer MP2. In an embodiment, the first metal sheet layer MP1 may be joined to the second metal sheet layer MP2 on the surface over the non-bending area UBA. In an embodiment, the first metal sheet layer MP1 may have the same width as the second metal sheet layer MP2 over the non-bending area UBA. Here, the width is the width in a first direction (e.g., the x-axis direction).

[0226] also, Fig.14b The cross section of the electronic device shown can be Figure 8b The cross sections of the electronic devices shown are formed substantially identically.

[0227] Fig.15a is an electronic device according to an embodiment of the present invention Fig.13 A cross-sectional view taken along line VI-VI'. Fig.15b is a cross-sectional view of the electronic device according to the embodiment taken along line VII-VII'.

[0228] More specifically, Fig.15a It is an electronic device along Fig.13 A cross-sectional view taken along line VI-VI′ is shown. Fig.15b It is an electronic device along Fig.13 Here, the cross section is related to the electronic device but not all components of the electronic device are shown, but are schematically shown to describe the structural relationship of various embodiments of the present disclosure.

[0229] Fig.15a and Fig.15b The protective layer PTL, the window layer FGL, the polarizer POL, the display panel DPL, the buffer layer CUL, the first metal sheet layer MP1, the second metal sheet layer MP2, the reinforcement layer REL and the adhesive material P shown in the figure can be understood as the same as the reference Figure 8a and Figure 8b The described protection layer PTL, window layer FGL, polarizing plate POL, display panel DPL, buffer layer CUL, first metal sheet layer MP1, second metal sheet layer MP2, reinforcement layer REL, and adhesive material P are substantially the same.

[0230] The following description mainly focuses on the reference to the electronic device Fig.15a and Fig.15b The differences described above are Figure 9a and Figure 9b The descriptions made are shared and replaced with the above descriptions.

[0231] refer to Fig.15a In an embodiment, the first metal sheet layer MP1 may be formed over the bending area BA and the non-bending area UBA. In particular, since the first metal sheet layer MP1 is formed over the non-bending area UBA, the first metal sheet layer MP1 may be joined in the non-bending area UBA to generally face the second metal sheet layer MP2. In an embodiment, the first metal sheet layer MP1 may be joined to the second metal sheet layer MP2 on the surface over the non-bending area UBA. In an embodiment, the first metal sheet layer MP1 may have the same width as the second metal sheet layer MP2 over the non-bending area UBA. Here, the width is the width in a first direction (e.g., the x-axis direction).

[0232] also, Fig.15b The cross section of the electronic device shown can be Figure 9b The cross sections of the electronic devices shown are formed substantially identically.

[0233] Fig.16 is a view schematically showing a state in which a first metal sheet layer MP1 and a second metal sheet layer MP2 are stacked according to an embodiment.

[0234] Fig.16 The stacking state of the first metal sheet layer MP1 and the second metal sheet layer MP2 shown in FIG. Fig.13 In the following disclosure, reference will be made to Fig.16 The cross-sectional reference lines shown (eg, VIII-VIII', IX-IX', and XX') exemplarily depict cross-sections of the electronic device. Fig.16 The cross-sectional reference line is shown for the first metal sheet layer MP1 and the second metal sheet layer MP2, but is not limited thereto and can be used as a reference line for showing a cross section of each layer of the electronic device at that position. Figures 2a to 4 Understand the layer structure of electronic devices and refer to Figure 5 Understand the layer structure of a display provided in an electronic device.

[0235] Fig.17a is an electronic device according to an embodiment of the present invention Fig.16 A cross-sectional view taken along line VIII-VIII'. Fig.17b is a cross-sectional view of the electronic device according to the embodiment taken along line IX-IX'. Fig.17c is a cross-sectional view of the electronic device according to the embodiment taken along line XX′.

[0236] In the present disclosure, the section observed from VIII-VIII' may refer to the first direction reference section of the electronic device. In addition, the section observed from IX-IX' may mean the first direction inner section of the electronic device. In addition, the section observed from XX' may mean the first direction outer section of the electronic device. The first direction reference section may mean a section including the first reference hole FIH1 in the first direction, and the first direction inner / outer section may mean a section not including the first reference hole FIH1 in the second direction. The first direction inner section means a section closer to the folding axis than the first direction reference section, and the first direction outer section means a section farther away from the folding axis than the first direction reference section.

[0237] Each cross section does not show all components of the electronic device, but is schematically shown to describe the structural relationship of various embodiments of the present disclosure.

[0238] Figures 17a to 17c The protective layer PTL, filter layer PRL, window layer FGL, polarizer POL, display panel DPL, buffer layer CUL, first metal sheet layer MP1, second metal sheet layer MP2, reinforcement layer REL and adhesive material P shown in FIG. Figures 14a to 15b The described protection layer PTL, window layer FGL, polarizing plate POL, display panel DPL, buffer layer CUL, first metal sheet layer MP1, second metal sheet layer MP2, reinforcement layer REL, and adhesive material P are substantially the same.

[0239] In an embodiment, Fig.17a The first direction reference section shown can be Fig.11a The first direction reference cross sections shown are substantially the same. Fig.17b The cross section in the first direction shown can be Fig.11b The cross-sections in the first direction shown are substantially the same.

[0240] In an embodiment, Fig.17c The outer cross section in the first direction shown has Fig.11c The first direction outer cross-sections shown have parts in common, but have some differences which are described below.

[0241] refer to Fig.17c In the outer cross-section according to the embodiment, the first metal sheet layer MP1 may be formed to have substantially the same length as the second metal sheet layer MP2. Specifically, since the first metal sheet layer MP1 does not include a step, the first metal sheet layer MP1 may be formed to have substantially the same length as the second metal sheet layer MP2. Therefore, the first metal sheet layer MP1 and the second metal sheet layer MP2 may be substantially joined to each other.

[0242] Fig.18a is a front view showing a display module provided in the electronic device according to the embodiment. Fig.18b is a rear view showing a display module provided in an electronic device according to an embodiment. In addition, as an example, Fig.18b The rear surface of the display module shown shows a state in which the second metal sheet layer is not provided, but the display module according to the embodiment of the present disclosure is not limited to the shown form.

[0243] As described above, the first metal sheet MP1 may include a plurality of slit holes SLH1 and SLH2 formed in a direction parallel to the folding axis. The plurality of slit holes may include, for example, first slit holes SLH1 and second slit holes SLH2. At least some of the first slit holes SLH1 may extend to the side edge of the first metal sheet MP1, but is not limited thereto.

[0244] The first filter portion PTP may be formed to cover at least a portion of the first metal sheet layer MP1 and at least a portion of the second metal sheet layer (not shown). The first filter portion PTP may be formed on an upper portion of the first metal sheet layer MP1 and an upper portion of the second metal sheet layer MP2, so that the first metal sheet layer MP1 and / or the second metal sheet layer MP2 are not exposed or do not protrude outside the display module.

[0245] The first filter portion PTP may be formed on the upper portion of the first metal sheet layer MP1 and the upper portion of the second metal sheet layer MP2, and may be formed of a material capable of transmitting light of a predetermined wavelength band, so that the first metal sheet layer MP1 and / or the second metal sheet layer MP2 may be identified by light of a predetermined wavelength band. In an example, the first filter portion PTP may be configured to transmit light of an IR wavelength band. When light of an IR wavelength band is irradiated to the first filter portion PTP, the first metal sheet layer MP1 positioned below the first filter portion PTP and the first reference hole FIH1 formed in the first metal sheet layer MP1 may be detected.

[0246] Although not limited thereto, in an embodiment, the remaining components except for the first filter part PTP may be removed from the upper portion of the first reference hole FIH1.

[0247] The electronic device according to various embodiments may be one of various types of electronic devices. For example, the electronic device may include a display device, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. The electronic device according to the embodiment is not limited to those devices described above.

[0248] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, and include various changes, equivalents or alternatives for corresponding embodiments. As used herein, unless the context clearly indicates otherwise, the singular forms "one", "an" and "the" are also intended to include plural forms. As used herein, the term "and / or" should be understood to encompass any and all possible combinations by one or more enumerated items. As used herein, the terms "include", "have" and "include" are only used to specify the presence of features, components, parts or combinations thereof described herein, but the use of the term does not exclude the possibility of the presence or addition of one or more other features, components, parts or combinations thereof. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" can include all possible combinations of the items listed together in the corresponding phrases. As used herein, terms such as “1st” and “2nd” or “first” and “second” may be used to simply distinguish a corresponding component from another part, and do not limit the components in other aspects (eg, importance or order).

[0249] As used herein, the term "part" or "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A part or module may be a single integral component or its smallest unit or portion adapted to perform one or more functions. For example, according to an embodiment, a "part" or "module" may be implemented in the form of an application specific integrated circuit (ASIC).

[0250] As used in various embodiments of the present disclosure, the term "if" may be interpreted as "when ...", "at ...", "in response to determining" or "in response to detecting" depending on the context. Similarly, "if A is determined" or "if A is detected" may be interpreted as "when determining A" or "in response to determining A" or "when detecting A" or "in response to detecting A" depending on the context.

[0251] The programs executed by the electronic devices described herein may be implemented as hardware components, software components, and / or a combination thereof. The programs may be executed by any system capable of executing computer-readable instructions.

[0252] Software may include a computer program, code, instructions, or a combination of one or more of them, and may configure the processing device as the processing device is operated, or may independently or collectively instruct the processing device. Software may be implemented as a computer program including instructions stored in a computer-readable storage medium. Computer-readable storage media may include, for example, magnetic storage media (e.g., read-only memory (ROM), random access memory (RAM), floppy disks, hard disks, etc.) and optically readable media (e.g., CD-ROMs or digital versatile disks (DVDs)). In addition, computer-readable storage media may be distributed to computer systems connected via a network, and computer-readable code may be stored and run in a distributed manner. Computer programs may be distributed via application stores (e.g., Play Store TM ), directly between two UEs (e.g., smart phones) or distributed online (e.g., downloaded or uploaded). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium such as a memory of a manufacturer's server, a server of an application store, or a relay server.

[0253] According to various embodiments, each component (e.g., module or program) in the above-mentioned components can include a single entity or multiple entities, and some entities in the multiple entities can be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components can be omitted, or one or more other components can be added. Alternatively or additionally, multiple components (e.g., module or program) can be integrated into a single component. In this case, according to various embodiments, the integrated component can still perform the one or more functions of each component in the multiple components in the same or similar manner as the corresponding one component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component can be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations can be run or omitted in different orders, or one or more other operations can be added.

Claims

1. An electronic device, comprising: Hinge module; a first shell and a second shell, wherein the first shell and the second shell are arranged on two opposite sides of the folding axis; as well as A display module, the display module comprising a first metal sheet layer having a plurality of first reference holes and a plurality of slit holes, the display module being arranged on the first shell and the second shell through the hinge module; wherein the hinge module is coupled to the first housing and the second housing and includes a plurality of second reference holes, wherein the display module and the hinge module are aligned based on the plurality of first reference holes and the plurality of second reference holes, and Wherein, in the folding axis direction, the width between the plurality of first reference holes is smaller than the width of the first metal sheet layer.

2. The electronic device according to claim 1, wherein: The plurality of first reference holes and the plurality of slit holes are formed in a bending region of the display module.

3. The electronic device according to claim 2, wherein: The plurality of first reference holes are respectively formed in four corners of the first metal sheet layer corresponding to the bending area.

4. The electronic device according to claim 1, wherein: The display module includes a second metal sheet layer bonded to the first metal sheet layer, and wherein the second metal sheet layer has an opening in a portion corresponding to each of the plurality of first reference holes, and wherein the opening is formed to have a width greater than a diameter of the corresponding first reference hole.

5. The electronic device according to claim 4, wherein: The second metal sheet layer includes an exposed portion formed along the folding axis, and The exposed portion is formed to expose at least some of the plurality of slit holes formed in the first metal sheet layer.

6. The electronic device according to claim 1, wherein: The display module includes a protective layer located at the uppermost side and a filter layer printed on the lower surface of the protective layer. The filter layer includes a first filter portion that transmits light of a predetermined wavelength band and a second filter portion that absorbs or reflects light of the predetermined wavelength band, and Wherein, the predetermined waveband includes infrared IR waveband.

7. The electronic device according to claim 6, wherein: The first filter portion is formed on an upper portion of the plurality of first reference holes so that light vertically irradiated from an upper side of the display module is vertically transmitted to the display module.

8. The electronic device according to claim 6, wherein: The first filter portion is formed to extend from a portion corresponding to a third reference hole formed on one side of the folding axis among the plurality of first reference holes to a fourth reference hole formed on the other side symmetrically across a bending area of ​​the display module among the plurality of first reference holes.

9. The electronic device according to claim 6, wherein: The first filter portion is formed so that a portion corresponding to a third reference hole formed on one side of the folding axis among the plurality of first reference holes is spaced apart from a portion corresponding to a fourth reference hole formed symmetrically on the other side among the plurality of first reference holes.

10. The electronic device according to claim 6, wherein: The first filter portion is formed to have a larger width than a bending area of ​​the display module in a direction perpendicular to the folding axis.

11. The electronic device according to claim 1, wherein: The plurality of slit holes include an outermost edge slit hole formed at a bending region of the display module in a direction perpendicular to the folding axis, wherein the edge slit hole extends in the direction of the folding axis, and At least some of the plurality of first reference holes are formed on the same line as an extension line of the edge slit hole.

12. The electronic device according to claim 1, wherein: The plurality of first reference holes are formed to be hidden inside the display module without protruding outside the display module.

13. The electronic device according to claim 1, wherein: A step is formed between the bending area and the non-bending area of ​​the first metal sheet layer, wherein the step is formed to have a larger width than a diameter of at least one first reference hole among the plurality of first reference holes, and The width of the first metal sheet layer is formed to be smaller in the bending region than in the non-bending region due to the step in a direction perpendicular to the folding axis.

14. An electronic device, comprising: A display module, wherein the display module is arranged on a plurality of housings; as well as a hinge module operatively coupled to the plurality of housings, wherein the display module comprises a metal sheet layer having a plurality of first reference holes and a plurality of slit holes, wherein the plurality of first reference holes are formed to be covered by a protection layer included in the display module, Wherein, the hinge module comprises a plurality of second reference holes, and Wherein, the display module and the hinge module are aligned based on the plurality of first reference holes and the plurality of second reference holes.

15. An electronic device, comprising: a first shell and a second shell; A display module, wherein the display module is disposed on the first shell and the second shell; as well as a hinge module operatively coupled to the first housing and the second housing, The display module includes a metal sheet layer having a plurality of first reference holes, wherein the plurality of first reference holes are formed so as not to protrude outside the protection layer included in the display module, Wherein, the hinge module comprises a plurality of second reference holes, and Wherein, the display module and the hinge module are aligned based on the plurality of first reference holes and the plurality of second reference holes.

Images