Circuit board plane polishing device capable of planning polishing path

Abstract

The invention discloses a circuit board plane grinding device capable of planning a grinding path, and relates to the field of circuit board surface grinding, the circuit board plane grinding device comprises a grinding workbench, a rectangular groove is formed in the top of the grinding workbench, and a special-shaped tool mechanism is arranged in the rectangular groove; the special-shaped tool mechanism comprises a rotating tool plate, negative pressure supporting pipes and sliding supporting pipes, the rotating tool plate is rotationally connected with the grinding workbench, the rotating axis of the rotating tool plate is horizontally arranged, the negative pressure supporting pipes are fixedly arranged in the middle of the rotating tool plate in a penetrating mode, and the multiple sliding supporting pipes are arranged on the rotating tool plate in a sliding and penetrating mode; the multiple sliding supporting pipes are arranged in a rectangular array, the axial length of the negative pressure supporting pipes is equal to that of the sliding supporting pipes, in the normal state, the height of the top faces of the sliding supporting pipes is larger than that of the top faces of the negative pressure supporting pipes, the circuit board is suspended on the tool, the tool contact area of the circuit board is greatly increased, stability is higher, and stress is more uniform.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board surface polishing, and in particular to a circuit board plane polishing device capable of planning a polishing path. Background Art

[0002] Circuit boards are one of the important components of the electronics industry. Almost every electronic device, from electronic watches, calculators to computers, electronic communication equipment, military weapon systems and artificial intelligence equipment, requires the use of circuit boards. At present, under the general trend of electronic information manufacturing, digitalization, networking and intelligence, the use of circuit boards is becoming more and more extensive. At present, in the production process of circuit boards, it is necessary to grind the upper and lower surfaces of the circuit boards to remove burrs and make the friction of the circuit boards meet the requirements. Since the shape of the circuit board will be adjusted accordingly with the size of the space in the installation environment, the shape of the circuit board is not necessarily regular, and special-shaped circuit boards will be polished. However, the existing polishing device cannot plan the polishing path according to the shape of the circuit board. When polishing the plane of the circuit board, the length of each moving path of the polishing roller is the same. The size of the circuit board is covered by a large range of polishing, which causes the polishing roller to idle more, that is, the polishing roller is separated from the circuit board for polishing, thereby reducing the polishing efficiency of the circuit board; secondly, when polishing the circuit board, the circuit board needs to be suspended from the tooling so that the side walls and the upper surface of the circuit board are exposed for easy polishing operations. At present, the suspended tooling of the circuit board is performed by negative pressure adsorption, and the contact area of ​​the tooling of the circuit board is small. On the one hand, the tooling strength is low, and on the other hand, the local pressure of the circuit board is too large during the polishing operation, causing crushing, and the tooling of the circuit board is unevenly stressed. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a circuit board plane polishing device capable of planning a polishing path, so as to solve the deficiencies of the prior art.

[0004] The objective of the present invention is achieved through the following technical solutions: a circuit board plane grinding device capable of planning a grinding path, comprising a grinding workbench, a rectangular groove is provided on the top of the grinding workbench, a special-shaped tooling mechanism is arranged in the rectangular groove, the special-shaped tooling mechanism comprises a rotating tooling plate, a negative pressure support tube and a sliding support tube, the rotating tooling plate is rotatably connected to the grinding workbench, the rotation axis of the rotating tooling plate is horizontally arranged, the negative pressure support tube is fixedly penetrated in the middle of the rotating tooling plate, a plurality of the sliding support tubes are slidably penetrated on the rotating tooling plate, the plurality of the sliding support tubes are arranged in a rectangular array, the axial length of the negative pressure support tube is equal to the axial length of the sliding support tube, and under normal conditions, the top surface height of the sliding support tube is higher than the top surface height of the negative pressure support tube; The invention also includes a path grinding mechanism, which includes a fixed base plate, a sliding column, a lifting beam, a sliding beam, a high-precision slide plate and a grinding frame. Two fixed base plates are arranged in parallel, and the grinding workbench is located between the two fixed base plates. A first linear drive module is horizontally arranged on the top surface of the fixed base plate. The sliding column is installed on the slide seat of the first linear drive module. A first screw transmission pair is arranged on the side wall of the sliding column. Two ends of the lifting beam are respectively connected to two first screw transmission pairs. A second linear drive module is installed on the bottom surface of the lifting beam. The sliding beam is installed on the slide seat of the second linear drive module. A second screw transmission pair is arranged at the bottom of the sliding beam. The high-precision slide plate is installed on the second screw transmission pair. The grinding frame is a U-shaped structure with an opening facing downward. The grinding frame is fixedly installed at the bottom of the high-precision slide plate. A grinding roller is rotatably arranged in the opening of the grinding frame. The moving direction of the sliding beam is perpendicular to the moving direction of the sliding column, and the moving direction of the high-precision slide plate is parallel to the moving direction of the sliding column.

[0005] Further, the first screw transmission pair includes a first screw, a first screw slider and a first screw motor. The side wall of the sliding column is provided with a vertical slide groove. The first screw is rotatably installed in the vertical slide groove. The first screw slider is threadedly mounted on the first screw. The first screw slider is slidably adapted to the vertical slide groove. The first screw motor is installed on the top of the sliding column. The output shaft of the first screw motor is transmission-connected to the first screw.

[0006] Furthermore, the second screw transmission pair includes a second screw, a second screw slider and a second screw motor. A transverse groove is provided at the bottom of the sliding beam. The second screw is rotatably installed in the transverse groove. The second screw slider is threadedly mounted on the second screw. The second screw slider is slidably adapted to the transverse groove. The second screw motor is installed at one end of the sliding beam. The output shaft of the second screw motor is transmission-connected to the second screw. A grinding motor is installed on the side wall of the grinding frame. The output shaft of the grinding motor is transmission-connected to one end of the grinding roller.

[0007] Furthermore, the rotating tooling plate is provided with a tooling circular hole at the position where the sliding support tube is set, and the sliding support tube slides through the tooling circular hole. A limiting ring is fixedly sleeved on the sliding support tube, and a spring is sleeved on the sliding support tube. The two ends of the spring are respectively connected to the rotating tooling plate and the limiting ring.

[0008] The camming mechanism comprises a locking mechanism, wherein the locking mechanism comprises a locking rod, a locking block and a pressing block, and the locking rod is slidably arranged in the locking cavity. The side wall of the tooling circular hole is provided with a locking hole connected to the locking cavity, and the locking block is slidably arranged in the locking hole. Each of the locking blocks is correspondingly provided with a pressing block, and the pressing block is fixedly connected to the locking rod, and the pressing block is provided with a wedge surface at one end of the locking cavity, and the wedge surface is located in the moving path of the pressing block. A driving plate is provided on one side wall of the rotating tooling plate, and one end of the locking rod passes through the locking cavity and is connected to the driving plate. Both ends of the driving plate are provided with a pushing cylinder, and the cylinder body of the pushing cylinder is mounted on the rotating tooling plate, and the telescopic shaft of the pushing cylinder is connected to the driving plate.

[0009] Furthermore, spindles are fixed at both ends of the rotating tooling plate, and the spindles are rotatably connected to the grinding worktable. A spindle drive cavity is provided in the grinding worktable, and one of the spindles penetrates into the spindle drive cavity and is connected to a driven pulley. A spindle motor is provided in the spindle drive cavity, and the output shaft of the spindle motor is connected to a driving pulley, and the driving pulley is connected to the driven pulley through a synchronous belt drive.

[0010] Furthermore, the negative pressure support tube includes a support body and a pressure cover, a negative pressure hole is opened at the bottom of the support body, the support body is connected to a negative pressure pump through a negative pressure tube, the negative pressure tube is connected to the negative pressure hole, a detection groove is opened on the top of the support body, a pressure sensor is installed in the detection groove, the pressure axis of the pressure sensor is connected to the pressure cover, and the bottom surface of the pressure cover is located above the top surface of the support body.

[0011] Furthermore, the grinding workbench is provided with auxiliary clamping mechanisms on both sides of the rectangular groove, and the auxiliary clamping mechanisms include a lifting seat, a horizontally movable seat, a rotating column, a rotating shaft and a U-shaped clamping frame. The top surface of the grinding workbench is provided with a clamping mounting groove along its own height direction, the lifting seat is arranged in the clamping mounting groove, and the lifting seat has the freedom to move along the height direction of the grinding workbench, the horizontally movable seat is slidably arranged on the lifting seat, the rotating column is rotatably arranged on the top of the horizontally movable seat, and the rotation axis of the rotating column is vertically arranged, one end of the rotating shaft is rotatably connected to the rotating column, and the other end is connected to the U-shaped clamping frame, the bottom surface of the U-shaped opening of the U-shaped clamping frame is flush with the supporting surface of the negative pressure support tube, and a downward pressure cylinder is installed on the top of the U-shaped clamping frame, and the telescopic shaft of the downward pressure cylinder penetrates into the U-shaped opening and is connected to a downward pressure clamping block.

[0012] Furthermore, a lifting cylinder is vertically installed in the clamping installation groove, a telescopic shaft of the lifting cylinder is connected to the lifting seat, an adjusting cylinder is installed on the lifting seat, and the telescopic shaft of the adjusting cylinder is connected to the horizontal moving seat.

[0013] Furthermore, a rotating main shaft is fixed at the bottom of the rotating column, and the rotating main shaft is rotatably connected to the horizontal movable seat. A first motor is installed in the horizontal movable seat, and the output shaft of the first motor is transmission-connected to the rotating main shaft. A second motor is installed on the rotating column, and the output shaft of the second motor is transmission-connected to one end of the rotating shaft.

[0014] The beneficial effects of the present invention are: 1. The path grinding mechanism has three degrees of freedom of movement, that is, the grinding roller has the freedom to move quickly along the three directions of X, Y and Z axes in the spatial coordinate system. It can quickly drive the grinding roller to move to the grinding position according to the outer dimensions of the circuit board, and then drive the grinding roller to contact the surface of the circuit board for grinding through the second screw transmission pair. The transmission accuracy of the second screw transmission pair is high, so that the grinding roller moves slowly to complete the grinding operation. For special-shaped circuit boards, it drives the grinding roller to move quickly to the grinding position for grinding, which greatly shortens the invalid grinding path and improves the grinding efficiency.

[0015] 2. Place the circuit board on the sliding support tube, and press down the circuit board so that the circuit board squeezes the sliding support tube and moves downward until the circuit board contacts the negative pressure support tube and stops moving, so that the bottom of the sliding support tube that contacts the circuit board is flush with the bottom of the negative pressure support tube. Then remove the circuit board and rotate the rotating tooling plate 180°, and then place the circuit board on the sliding support tube that is flush with the negative pressure support tube, so that the circuit board is suspended in the air, which greatly increases the tooling contact area of ​​the circuit board, has stronger stability, and more uniform force. The sliding support tube that does not contact the circuit board is located below the circuit board and will not block the grinding operation of the grinding roller. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The structure of a circuit board plane grinding device capable of planning a grinding path according to the present invention is shown in FIG. Figure 1 ; Figure 2 It is a schematic diagram of the internal structure of a grinding workbench in a circuit board plane grinding device capable of planning a grinding path according to the present invention; Figure 3 for Figure 2 Enlarged view of point A in the middle; Figure 4 It is a schematic diagram of the internal structure of a rotating tooling plate in a circuit board plane polishing device capable of planning a polishing path according to the present invention; Figure 5 for Figure 4 Enlarged view of point B in the middle; Figure 6 The structure of a circuit board plane grinding device capable of planning a grinding path according to the present invention is shown in FIG. Figure 2 ; Figure 7 The structure of a circuit board plane grinding device capable of planning a grinding path according to the present invention is shown in FIG. Figure 3 ; Figure 8 The structure of a circuit board plane grinding device capable of planning a grinding path according to the present invention is shown in FIG. Figure 4 ; Fig. 9 A schematic diagram of the state of the circuit board in the tooling area of ​​the present invention; In the figure, 1-grinding workbench, 2-rectangular groove, 3-rotating tooling plate, 4-negative pressure support tube, 5-sliding support tube, 6-fixed base plate, 7-sliding column, 8-lifting beam, 9-sliding beam, 10-high-precision slide plate, 11-grinding frame, 12-first linear drive module, 13-second linear drive module, 14-grinding roller, 15-first screw rod, 16-first screw rod slider, 17-first screw rod motor, 18-vertical slide groove, 19-second screw rod, 20-second screw rod slider, 21-second screw rod motor, 22-horizontal slide groove, 23-grinding motor, 24-tooling round hole, 25-limiting ring, 26-spring, 27-lock rod, 28 -tightening block, 29-pressing block, 30-locking chamber, 31-locking hole, 32-wedge surface, 33-driving plate, 34-pushing cylinder, 35-spindle, 36-spindle driving chamber, 37-driven pulley, 38-spindle motor, 39-driving pulley, 40-synchronous belt, 41-support body, 42-pressure cover, 43-negative pressure hole, 44-detection groove, 45-pressure sensor, 46-horizontal moving seat, 47-rotating column, 48-rotating shaft, 49-U-shaped clamping frame, 50-pressing cylinder, 51-pressing clamping block, 52-clamping mounting groove, 53-adjusting cylinder, 54-rotating spindle, 55-second motor, 56-lifting seat, 57-lifting cylinder. DETAILED DESCRIPTION

[0017] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0018] Embodiment 1: like Figures 1 to 9As shown, a circuit board plane grinding device capable of planning a grinding path comprises a grinding workbench 1 and a path grinding mechanism, a rectangular groove 2 is provided on the top of the grinding workbench 1, a special-shaped tooling mechanism is arranged in the rectangular groove 2, the special-shaped tooling mechanism comprises a rotating tooling plate 3, a negative pressure support tube 4 and a sliding support tube 5, the rotating tooling plate 3 is rotatably connected to the grinding workbench 1, the rotation axis of the rotating tooling plate 3 is horizontally arranged, the negative pressure support tube 4 is fixedly penetrated in the middle of the rotating tooling plate 3, a plurality of sliding support tubes 5 are slidably penetrated on the rotating tooling plate 3, the plurality of sliding support tubes 5 are arranged in a rectangular array, the axial length of the negative pressure support tube 4 is equal to the axial length of the sliding support tube 5, and under normal conditions, the top surface height of the sliding support tube 5 is higher than the top surface height of the negative pressure support tube 4, reference Fig. 9 The tooling diagram is shown in the figure. The tooling method for the special-shaped circuit board is as follows: the circuit board is adsorbed and placed on the sliding support tube 5 by the robot arm, and the circuit board is pressed down so that the circuit board presses the sliding support tube 5 and moves downward. When the circuit board contacts the negative pressure support tube 4, the pressing of the circuit board is stopped. Since the axial length of the negative pressure support tube 4 is equal to the axial length of the sliding support tube 5, the sliding support tube 5 contacting the circuit board is arranged at the same height as the negative pressure support tube 4, so that multiple sliding support tubes 5 can adapt to the movement of the shape of the circuit board to provide the maximum support contact area according to the shape of the circuit board, and then the circuit board is removed and the rotating tool is moved. The mounting plate 3 is rotated 180° to form a tooling area for the shaped circuit board. The subsequent circuit boards can be directly loaded into the tooling area. The sliding support tube flush with the negative pressure support tube 4 and the negative pressure support tube 4 jointly support the circuit board. At the same time, the negative pressure support tube 4 generates negative pressure to adsorb the circuit board, thereby improving the tooling stability of the circuit board, thereby suspending the circuit board in the tooling, greatly increasing the tooling contact area of ​​the circuit board, making it more stable and more evenly stressed. The sliding support tube 5 that does not contact the circuit board is located below the circuit board and will not block the grinding operation of the path grinding mechanism, thereby ensuring that the path grinding mechanism and the special-shaped tooling mechanism do not interfere with each other.

[0019] Embodiment 2: Based on the first embodiment, Figure 1 , Figures 6 to 8As shown, the path grinding mechanism includes a fixed base plate 6, a sliding column 7, a lifting beam 8, a sliding beam 9, a high-precision slide plate 10 and a grinding frame 11. Two fixed base plates 6 are arranged in parallel, and the grinding workbench 1 is located between the two fixed base plates 6. A first linear drive module 12 is horizontally arranged on the top surface of the fixed base plate 6. The sliding column 7 is installed on the slide seat of the first linear drive module 12. A first screw transmission pair is arranged on the side wall of the sliding column 7. Two ends of the lifting beam 8 are respectively connected to two first screw transmission pairs. A second linear drive module 13 is installed on the bottom surface of the lifting beam 8. The sliding beam 9 is installed on the slide seat of the second linear drive module 13. A second screw transmission pair is arranged at the bottom of the sliding beam 9. The high-precision slide plate 10 is installed on the first linear drive module 13. On the two-screw transmission pair, the grinding frame 11 is a U-shaped structure with the opening facing downward. The grinding frame 11 is fixedly installed at the bottom of the high-precision slide 10. A grinding roller 14 is rotatably arranged in the opening of the grinding frame 11. The moving direction of the sliding beam 9 is perpendicular to the moving direction of the sliding column 7. The moving direction of the high-precision slide 10 is parallel to the moving direction of the sliding column 7. When grinding a certain type of special-shaped circuit board, the position of the negative pressure support tube 4 is used as the coordinate origin, and the size standard reference of the special-shaped circuit board is corresponding to the coordinate origin, so that the coordinate information of each corner of the special-shaped circuit board can be obtained. This coordinate information is used as the moving path of the path grinding mechanism. When the circuit board is loaded on the tooling area, the size standard reference of the circuit board roughly coincides with the coordinate origin. The coordinate information of each corner of the circuit board can provide a reference for the moving coordinates of the grinding roller 14, and the moving path of the grinding roller 14 can be planned in advance. The specific moving grinding path is: the sliding column 7 drives its linear movement through the first linear drive module 12, and has a faster response speed. The sliding crossbeam 9 drives its linear movement through the second linear drive module 13, so that the grinding roller 14 has the freedom to move along the X and Y axis in the horizontal plane. Both are driven by the linear drive module, which can drive the grinding roller 14 to move quickly, so that the grinding roller 14 moves quickly to a corner position of the circuit board, and then the lifting crossbeam 8 drives it to descend through the first screw transmission pair, so that the grinding roller 14 contacts the surface of the circuit board, and then through the second screw The transmission pair drives the grinding roller 14 to move in a straight line, so that the grinding roller 14 moves longitudinally for grinding operation. The first screw transmission pair and the second screw transmission pair have high movement accuracy and can realize high-precision grinding operation. Then, the sliding beam 9 drives the grinding roller 14 to move transversely. The moving distance is less than the axial length of the grinding roller 14, so that it can completely cover the surface of the circuit board to complete the grinding operation. Then, the second screw transmission pair drives the grinding roller 14 to move longitudinally for grinding operation again. After grinding in this direction, the sliding beam 9 drives the grinding roller 14 to move transversely again. When encountering the special-shaped position of the circuit board, the sliding column 7 and the sliding beam 9 move quickly to make the grinding roller 14 move quickly to the edge position of the circuit board.Then, the grinding roller 14 is driven by the second screw transmission pair to slowly move for grinding operation, and the overall grinding of the circuit board surface is completed repeatedly, so that the grinding operation can be quickly moved to the edge position according to the shape of the circuit board, which greatly shortens the invalid grinding path and improves the grinding efficiency.

[0020] Furthermore, the first screw transmission pair includes a first screw 15, a first screw slider 16 and a first screw motor 17. A vertical slide groove 18 is provided on the side wall of the sliding column 7. The first screw 15 is rotatably installed in the vertical slide groove 18. The first screw slider 16 is threadedly sleeved on the first screw 15. The first screw slider 16 is slidably adapted to the vertical slide groove 18. The top of the sliding column 7 is installed with a first screw motor 17. The output shaft of the first screw motor 17 is connected to the first screw 15 through transmission. The two ends of the lifting beam 8 are respectively connected to the two first screw sliders 16. The first screw motor 17 drives the first screw 15 to rotate, so that the first screw slider 16 moves linearly along the axial direction of the first screw 15, so that the first screw slider 16 drives the lifting beam 8 to move up and down, so that the grinding roller 14 moves upward and separates from the circuit board, or drives the grinding roller 14 to move downward to contact the circuit board for grinding operation; the second screw transmission pair includes a second screw 19, a second screw slider The second screw motor 21 is provided with a transverse groove 22 at the bottom of the sliding beam 9, and the second screw 19 is rotatably installed in the transverse groove 22. The second screw slider 20 is threadedly mounted on the second screw 19, and the second screw slider 20 is slidably adapted to the transverse groove 22. A second screw motor 21 is installed at one end of the sliding beam 9, and the output shaft of the second screw motor 21 is connected to the second screw 19 through transmission. A grinding motor 23 is installed on the side wall of the grinding frame 11, and the output shaft of the grinding motor 23 is connected to one end of the grinding roller 14 through transmission. When the grinding roller 14 contacts the circuit board for grinding operation, the horizontal linear movement of the grinding roller 14 is driven by the second screw transmission pair. Specifically, the second screw motor 21 drives the second screw 19 to rotate, so that the second screw slider 20 moves linearly along the axial direction of the second screw 19, so that the second screw slider 20 drives the high-precision skateboard 10 to move, and the high-precision skateboard 10 drives the grinding roller 14 to move linearly to complete the grinding operation.

[0021] Embodiment three: Since the intensity of grinding is relatively high, the impact on the circuit board is relatively large. It is not stable enough to limit the horizontal movement freedom of the circuit board by negative pressure alone. At the same time, after one side of the circuit board is polished, the circuit board needs to be turned 180° to polish the other side. Therefore, based on the second embodiment, Figures 1 to 8As shown, the grinding workbench 1 is provided with auxiliary clamping mechanisms on both sides of the rectangular groove 2, and the auxiliary clamping mechanisms include a lifting seat 56, a horizontal moving seat 46, a rotating column 47, a rotating shaft 48 and a U-shaped clamping frame 49. The top surface of the grinding workbench 1 is provided with a clamping installation groove 52 along its own height direction. The lifting seat 56 is arranged in the clamping installation groove 52. The lifting seat 56 has the freedom to move along the height direction of the grinding workbench 1. The horizontal moving seat 46 is slidably arranged on the lifting seat 56. The rotating column 47 is rotatably arranged on the top of the horizontal moving seat 46. The rotating axis of the rotating column 47 is vertically arranged. One end of the rotating shaft 48 is rotatably connected to the rotating column 47, and the other end is connected to the U-shaped clamping frame 49. The bottom surface of the U-shaped opening of the U-shaped clamping frame 49 is connected to the supporting surface of the negative pressure support tube 4. Flush, a downward pressure cylinder 50 is installed on the top of the U-shaped clamping frame 49, and the telescopic shaft of the downward pressure cylinder 50 penetrates into the U-shaped opening and is connected to the downward pressure clamping block 51, and a lifting cylinder 57 is vertically installed in the clamping installation groove 52, and the telescopic shaft of the lifting cylinder 57 is connected to the lifting seat 56, and an adjusting cylinder 53 is installed on the lifting seat 56, and the telescopic shaft of the adjusting cylinder 53 is connected to the horizontal moving seat 46, and a rotating spindle 54 is fixed to the bottom of the rotating column 47, and the rotating spindle 54 is rotatably connected to the horizontal moving seat 46, and a first motor is installed in the horizontal moving seat 46, and the output shaft of the first motor is connected to the rotating spindle 54, and a second motor 55 is installed on the rotating column 47, and the output shaft of the second motor 55 is connected to one end of the rotating shaft 48. Under normal circumstances, the U-shaped opening of the U-shaped clamping frame 49 The bottom surface of the opening is flush with the supporting surface of the negative pressure support tube 4. After the circuit board is loaded into the tooling area, the path grinding mechanism is processed from one end of the circuit board to the other end. In order to avoid interference with the auxiliary clamping mechanism, the auxiliary clamping mechanism away from the grinding roller 14 works, and the U-shaped clamping frame 49 is driven by the adjusting cylinder 53 to move close to the circuit board so that the circuit board is located in the U-shaped opening of the U-shaped clamping frame 49. Then the downward pressing cylinder 50 drives the downward pressing clamping block 51 to move close to the circuit board so that the downward pressing clamping block 51 contacts the circuit board. The clamping operation of the circuit board is completed through the joint action of the downward pressing clamping block 51 and the U-shaped clamping frame 49. At this time, the circuit board has a larger support contact area, and is limited by mechanical clamping and negative pressure to give the circuit board a strong tooling strength, ensuring To ensure that the circuit board will not deviate during the grinding process, the grinding effect is better. When the grinding roller 14 is close to the working auxiliary clamping mechanism, the other auxiliary clamping mechanism first moves to clamp the circuit board. After the clamping is completed, the auxiliary clamping mechanism close to the grinding roller 14 releases the circuit board to reset. At this time, the auxiliary clamping mechanism is not within the working range of the grinding roller 14, so it will not interfere with the auxiliary clamping mechanism. When one side of the circuit board is polished, the grinding roller 14 moves to one side of the circuit board, and the auxiliary clamping mechanism away from the grinding roller 14 moves, so that the downward clamping block 51 and the U-shaped clamping frame 49 work together to clamp the circuit board, and then the lifting cylinder 57 drives the lifting seat 56 to move upward, thereby driving the circuit board to move upward, so that the circuit board is separated from the sliding support tube 5.So that the circuit board will not collide with the sliding support tube 5 and the negative pressure support tube 4 when turning over, then the second motor 55 drives the rotating shaft 48 to rotate, so as to drive the U-shaped clamping frame 49 to rotate 180 degrees, and then the circuit board is rotated 180 degrees, and then the lifting cylinder 57 drives the lifting seat 56 to move downward, and the circuit board is placed in the tooling area, and then the pressing cylinder 50 drives the pressing clamping block 51 to move upward, so as to release the circuit board, and then the adjusting cylinder 53 drives the U-shaped clamping frame 49 to separate from the circuit board, and finally the second motor 55 drives the U-shaped clamping frame 49 to rotate 180 degrees to reset, and repeat the above polishing operation to complete the polishing of the other side of the circuit board.

[0022] Embodiment 4: Based on the third embodiment, Figures 1 to 5As shown, the rotary tooling plate 3 is provided with a tooling circular hole 24 at the position where the sliding support tube 5 is set, and the sliding support tube 5 slides through the tooling circular hole 24. A limiting ring 25 is fixedly sleeved on the sliding support tube 5, and a spring 26 is sleeved on the sliding support tube 5. The two ends of the spring 26 are respectively connected to the rotary tooling plate 3 and the limiting ring 25. All the sliding support tubes 5 in a longitudinal direction are a group of support components, and each group of support components corresponds to a locking mechanism. The locking mechanism includes a locking rod 27, a tightening block 28 and a pressing block 29. A locking cavity 30 is longitudinally opened in the rotary tooling plate 3, and the locking rod 27 is slidably set in the locking cavity 30. A locking hole 31 connected to the locking cavity 30 is opened on the side wall of the tooling circular hole 24, and a tightening block 28 is slidably set in the locking hole 31. Each tightening block 29 is provided with a locking hole 31. 8 are respectively provided with a pressing block 29, which is fixedly connected to the locking rod 27, and a wedge-shaped surface 32 is provided at one end of the pressing block 28 located in the locking cavity 30, and the wedge-shaped surface 32 is located on the moving path of the pressing block 29, and a driving plate 33 is provided on one side wall of the rotating tooling plate 3, and one end of the locking rod 27 passes through the locking cavity 30 and is connected to the driving plate 33, and a pushing cylinder 34 is provided at both ends of the driving plate 33, and the cylinder body of the pushing cylinder 34 is installed on the rotating tooling plate 3, and the telescopic shaft of the pushing cylinder 34 is connected to the driving plate 33. Under normal circumstances, the pressing block 29 is separated from the pressing block 28, so that the sliding support tube 5 and the negative pressure support tube 4 are arranged in an up-and-down staggered manner under the action of the spring 26, that is, the top surface of the sliding support tube 5 is higher than the top surface of the negative pressure support tube 4, When the circuit board is placed on the sliding support tube 5 and pressed downward, the sliding support tube 5 will stretch the spring 26 and move downward. When the circuit board contacts the negative pressure support tube 4, the cylinder 34 is pushed to drive the driving plate 33 to move close to the rotating tooling plate 3, so that the driving plate 33 simultaneously pushes the multiple locking rods 27 to move, so that the locking rods 27 drive the multiple pressing blocks 29 thereon to move, and the pressing blocks 29 move close to the pressing blocks 28. The pressing blocks 29 will squeeze the wedge surface 32 of the pressing blocks 28. Under the action of the wedge surface 32, the pressing blocks 28 move and press against the sliding support tube 5, thereby locking the position of the sliding support tube 5, so that the sliding support tube 5 will not be reset due to the reaction force of the spring 26, so that the tooling area is stable, and then the rotating tooling plate 3 is rotated 180°, and the same model can be The circuit board is polished. When a new type of circuit board needs to be polished, the cylinder 34 is pushed to drive the drive plate 33 to move away from the rotating tooling plate 3, so that the drive plate 33 drives the locking rod 27 to move, so that the pressing block 29 is separated from the tightening block 28. At this time, the sliding support tube 5 is reset under the reaction force of the spring 26, and then the rotating tooling plate 3 is rotated 180°, and the new type of circuit board is pressed down on the sliding support tube 5 again to obtain the tooling area of ​​the circuit board. Finally, the drive plate 33 is used to lock the tooling area, so that circuit boards of different shapes can be adapted to obtain corresponding tooling areas. The circuit board has a larger support contact area in the tooling area, and the circuit board tooling is more stably stressed, so that the circuit board is not easily damaged during the polishing process.

[0023] Furthermore, the negative pressure support tube 4 includes a support body 41 and a pressure cover 42. A negative pressure hole 43 is provided at the bottom of the support body 41. The support body 41 is connected to a negative pressure pump through a negative pressure tube. The negative pressure tube is connected to the negative pressure hole 43. A detection groove 44 is provided at the top of the support body 41. A pressure sensor 45 is installed in the detection groove 44. The pressure axis of the pressure sensor 45 is connected to the pressure cover 42. The bottom surface of the pressure cover 42 is located above the top surface of the support body 41. In the process of forming the tooling area, when the circuit board is pressed down to contact the negative pressure support tube 4, the circuit board will contact the pressure cover 42, and the pressure will be transmitted to the pressure sensor 45 through the pressure cover 42. According to the feedback information of the pressure sensor 45, it is judged whether the circuit board has been pressed down to contact the negative pressure support tube 4, so that it can accurately and quickly judge whether the circuit board is pressed into place; negative pressure is generated in the negative pressure hole 43 by the negative pressure pump. After the rotating tooling plate 3 is deflected 180°, the negative pressure hole 43 of the support body 41 acts upward on the circuit board, so that the circuit board can be negatively pressured. Adsorbed.

[0024] Embodiment five: Based on the fourth embodiment, Figure 1 and Figure 2 As shown, spindles 35 are fixed at both ends of the rotating tooling plate 3, and the spindles 35 are rotatably connected to the grinding workbench 1. A spindle driving cavity 36 is provided in the grinding workbench 1, and one of the spindles 35 penetrates into the spindle driving cavity 36 and is connected to a driven pulley 37. A spindle motor 38 is provided in the spindle driving cavity 36, and the output shaft of the spindle motor 38 is connected to a driving pulley 39, and the driving pulley 39 is connected to the driven pulley 37 through a synchronous belt 40. The spindle motor 38 drives the driving pulley 39 to rotate, and the driving pulley 39 drives the driven pulley 37 to rotate through the synchronous belt 40, and the driven pulley 37 drives the spindle 35 to rotate, and the spindle 35 drives the rotating tooling plate 3 to rotate, so that the rotating tooling plate 3 rotates 180 degrees each time. In order to avoid winding, the rotating tooling plate 3 is deflected and reset in a reciprocating 180-degree manner, and does not rotate a full circle.

Claims

1. A circuit board surface grinding device capable of planning a grinding path, comprising a grinding workbench (1), characterized in that: The top of the grinding workbench (1) is provided with a rectangular groove (2), and a special-shaped tooling mechanism is arranged in the rectangular groove (2), and the special-shaped tooling mechanism comprises a rotating tooling plate (3), a negative pressure support tube (4) and a sliding support tube (5), the rotating tooling plate (3) is rotatably connected to the grinding workbench (1), the rotation axis of the rotating tooling plate (3) is arranged horizontally, the negative pressure support tube (4) is fixedly penetrated in the middle of the rotating tooling plate (3), and a plurality of sliding support tubes (5) are slidably penetrated on the rotating tooling plate (3), and the plurality of sliding support tubes (5) are arranged in a rectangular array, the axial length of the negative pressure support tube (4) is equal to the axial length of the sliding support tube (5), and under normal conditions, the top surface height of the sliding support tube (5) is higher than the top surface height of the negative pressure support tube (4); The invention also comprises a path grinding mechanism, wherein the path grinding mechanism comprises a fixed base plate (6), a sliding column (7), a lifting beam (8), a sliding beam (9), a high-precision slide plate (10) and a grinding frame (11), wherein two fixed base plates (6) are arranged in parallel, and the grinding workbench (1) is located between the two fixed base plates (6). A first linear drive module (12) is horizontally arranged on the top surface of the fixed base plate (6), the sliding column (7) is mounted on a slide seat of the first linear drive module (12), a first screw transmission pair is arranged on the side wall of the sliding column (7), two ends of the lifting beam (8) are respectively connected to two of the first screw transmission pairs, and the bottom of the lifting beam (8) is connected to the first linear drive module (12). A second linear drive module (13) is installed on the surface, the sliding beam (9) is installed on the slide seat of the second linear drive module (13), the bottom of the sliding beam (9) is provided with a second screw transmission pair, the high-precision slide plate (10) is installed on the second screw transmission pair, the grinding frame (11) is a U-shaped structure with an opening facing downward, the grinding frame (11) is fixedly installed at the bottom of the high-precision slide plate (10), a grinding roller (14) is rotatably arranged in the opening of the grinding frame (11), the moving direction of the sliding beam (9) is perpendicular to the moving direction of the sliding column (7), and the moving direction of the high-precision slide plate (10) is parallel to the moving direction of the sliding column (7).

2. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: The first screw transmission pair comprises a first screw (15), a first screw slider (16) and a first screw motor (17); a vertical slide groove (18) is provided on the side wall of the sliding column (7); the first screw (15) is rotatably mounted in the vertical slide groove (18); a first screw slider (16) is threadedly mounted on the first screw (15); the first screw slider (16) is slidably adapted to the vertical slide groove (18); the first screw motor (17) is installed on the top of the sliding column (7); and the output shaft of the first screw motor (17) is drivingly connected to the first screw (15).

3. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: The second screw transmission pair comprises a second screw (19), a second screw slider (20) and a second screw motor (21); a transverse sliding groove (22) is provided at the bottom of the sliding crossbeam (9); the second screw (19) is rotatably mounted in the transverse sliding groove (22); the second screw slider (20) is threadedly mounted on the second screw (19); the second screw slider (20) is slidably adapted to the transverse sliding groove (22); the second screw motor (21) is mounted at one end of the sliding crossbeam (9); the output shaft of the second screw motor (21) is drivingly connected to the second screw (19); a grinding motor (23) is mounted on the side wall of the grinding frame (11); the output shaft of the grinding motor (23) is drivingly connected to one end of the grinding roller (14).

4. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: The rotating tooling plate (3) is provided with a tooling circular hole (24) at a position where the sliding support tube (5) is provided. The sliding support tube (5) slides through the tooling circular hole (24). A limiting ring (25) is fixedly sleeved on the sliding support tube (5). A spring (26) is sleeved on the sliding support tube (5). Two ends of the spring (26) are respectively connected to the rotating tooling plate (3) and the limiting ring (25).

5. A circuit board surface polishing device capable of planning a polishing path according to claim 4, characterized in that: All the sliding support tubes (5) in a longitudinal direction are regarded as a group of support components, each group of the support components corresponds to a locking mechanism, the locking mechanism comprises a locking rod (27), a clamping block (28) and a pressing block (29), a locking cavity (30) is provided in the longitudinal direction of the rotating tooling plate (3), the locking rod (27) is slidably arranged in the locking cavity (30), a locking hole (31) communicating with the locking cavity (30) is provided on the side wall of the tooling circular hole (24), the clamping block (28) is slidably arranged in the locking hole (31), each of the clamping blocks (28) is correspondingly provided with a pressing block (29), and the pressing block ( 29) is fixedly connected to the locking rod (27), one end of the pressing block (28) located in the locking cavity (30) is provided with a wedge-shaped surface (32), and the wedge-shaped surface (32) is located on the moving path of the pressing block (29), a side wall of the rotating tooling plate (3) is provided with a driving plate (33), one end of the locking rod (27) passes through the locking cavity (30) and is connected to the driving plate (33), and both ends of the driving plate (33) are provided with a pushing cylinder (34), the cylinder body of the pushing cylinder (34) is installed on the rotating tooling plate (3), and the telescopic shaft of the pushing cylinder (34) is connected to the driving plate (33).

6. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: A spindle (35) is fixed at both ends of the rotating tooling plate (3), and the spindle (35) is rotatably connected to the grinding workbench (1). A spindle drive cavity (36) is provided in the grinding workbench (1), and one of the spindles (35) penetrates into the spindle drive cavity (36) and is connected to a driven pulley (37). A spindle motor (38) is provided in the spindle drive cavity (36), and an output shaft of the spindle motor (38) is connected to a driving pulley (39), and the driving pulley (39) is connected to the driven pulley (37) through a synchronous belt (40).

7. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: The negative pressure support tube (4) comprises a support body (41) and a pressure cover (42); a negative pressure hole (43) is provided at the bottom of the support body (41); the support body (41) is connected to a negative pressure pump via a negative pressure tube; the negative pressure tube is connected to the negative pressure hole (43); a detection groove (44) is provided at the top of the support body (41); a pressure sensor (45) is installed in the detection groove (44); a pressure shaft of the pressure sensor (45) is connected to the pressure cover (42); and a bottom surface of the pressure cover (42) is located above a top surface of the support body (41).

8. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: The grinding workbench (1) is provided with auxiliary clamping mechanisms on both sides of the rectangular groove (2), and the auxiliary clamping mechanisms include a lifting seat (56), a horizontal movable seat (46), a rotating column (47), a rotating shaft (48) and a U-shaped clamping frame (49). The top surface of the grinding workbench (1) is provided with a clamping installation groove (52) along its own height direction. The lifting seat (56) is arranged in the clamping installation groove (52). The lifting seat (56) has the freedom to move along the height direction of the grinding workbench (1). The horizontal movable seat (46) is slidably arranged on the lifting seat (56). On the seat (56), the rotating column (47) is rotatably arranged on the top of the horizontally movable seat (46), the rotating axis of the rotating column (47) is vertically arranged, one end of the rotating shaft (48) is rotatably connected to the rotating column (47), and the other end is connected to the U-shaped clamping frame (49), the bottom surface of the U-shaped opening of the U-shaped clamping frame (49) is flush with the supporting surface of the negative pressure support tube (4), and a downward pressure cylinder (50) is installed on the top of the U-shaped clamping frame (49), and the telescopic shaft of the downward pressure cylinder (50) is inserted into the U-shaped opening and connected to a downward pressure clamping block (51).

9. A circuit board surface polishing device capable of planning a polishing path according to claim 8, characterized in that: A lifting cylinder (57) is vertically installed in the clamping installation groove (52), and the telescopic shaft of the lifting cylinder (57) is connected to the lifting seat (56). An adjusting cylinder (53) is installed on the lifting seat (56), and the telescopic shaft of the adjusting cylinder (53) is connected to the horizontal moving seat (46).

10. A circuit board surface polishing device capable of planning a polishing path according to claim 8, characterized in that: A rotating main shaft (54) is fixed at the bottom of the rotating column (47), and the rotating main shaft (54) is rotatably connected to the horizontal movable seat (46). A first motor is installed in the horizontal movable seat (46), and the output shaft of the first motor is drivingly connected to the rotating main shaft (54). A second motor (55) is installed on the rotating column (47), and the output shaft of the second motor (55) is drivingly connected to one end of the rotating shaft (48).

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