Relief embroidery gold picture and processing method thereof

Abstract

The application provides a relief embroidery gold picture and a processing method, which comprises the following steps: coating a gold layer on a substrate after stamping is completed; coating and solidifying a photocuring adhesive layer on the gold layer, and opening a first micropore with a diameter of 50-200 nanometers on the gold layer by laser penetration of the photocuring adhesive layer; placing the substrate with the first micropore opened on the photocuring adhesive layer and the gold layer in an electrolyte solution for electrolysis, so that an oxidation reaction occurs at the inner wall of each first micropore to generate a gold trioxide layer; taking out the substrate in the electrolyte solution, and spraying an organic pigment to the outer surface of the photocuring adhesive layer, so that the organic pigment penetrates into the first micropore and bonds with the gold trioxide layer on the inner wall of the first micropore to be adsorbed on the inner wall of the first micropore. The inner wall of the first micropore is subjected to electrolytic oxidation to form a gold trioxide layer, so that the organic pigment layer is adsorbed in the first micropore by bonding reaction, and the adsorption force is enhanced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of gold picture processing, in particular to a relief embroidery gold picture and a processing method thereof. BACKGROUND

[0002] In the traditional micro-sculpture gold picture manufacturing process, because the color of gold is single, the ink pigment is often attached to the surface of gold, so that the ink pigment and gold are combined to become a gold picture, and the color of gold and the color of ink pigment are reflected each other, which can present special visual effect and artistic beauty.

[0003] However, due to the smoothness of the surface of gold and the extremely stable characteristics of gold, when the ink pigment is coated on the surface of gold, the adhesion between the ink pigment and the surface layer of gold is not enough, which leads to the problem that the ink layer is unstable and falls off.

[0004] Therefore, in the prior art, such as patent document CN212332260U, micro-holes are formed on the outer surface layer of gold, and the pigment is sprayed on the surface where the micro-holes are located, so that the pigment penetrates into the micro-holes, thereby increasing the adhesion area between the pigment and the gold layer, thereby increasing the adsorption force. However, the means of increasing the adsorption force by increasing the contact area also has the problem that the pigment layer is unstable and falls off when the gold picture is subjected to external friction. SUMMARY

[0005] Therefore, it is necessary to provide a relief embroidery gold picture and a processing method to solve the above problems.

[0006] Embodiments of the present application provide a relief embroidery gold picture processing method, comprising the following steps:

[0007] Coating a gold layer on the substrate after stamping is completed;

[0008] Coating and curing a photocuring adhesive layer on the gold layer, and forming first micro-holes with a diameter of 50-200 nanometers on the gold layer by laser penetration through the photocuring adhesive layer;

[0009] Placing the substrate with the first micro-holes formed on the photocuring adhesive layer and the gold layer in an electrolyte solution for electrolysis, so that an oxidation reaction occurs at the inner wall of each first micro-hole to generate a gold trioxide layer;

[0010] Taking out the substrate in the electrolyte solution, and spraying an organic pigment on the outer surface of the photocuring adhesive layer, so that the organic pigment penetrates into the first micro-holes and reacts with the gold trioxide layer on the inner wall of the first micro-holes to be adsorbed on the inner wall of the first micro-holes.

[0011] In at least one embodiment of the present application, the step of "coating and curing a photo-curing glue layer on the gold layer, and opening a first micro-hole with a diameter of 50-200 nm on the gold layer by laser penetrating the photo-curing glue layer" specifically comprises the steps of:

[0012] opening a second micro-hole with a diameter of 200-1000 nm and a depth of 300-500 nm coaxially arranged with the first micro-hole on the photo-curing glue layer and the gold layer;

[0013] spraying and curing a negative photo-resist on the inner wall of the first micro-hole and the second micro-hole;

[0014] using a photo-etching machine with a numerical aperture of 0.85 and an ultraviolet wavelength of 193 nm, and taking the top edge of the second micro-hole in contact with the photo-curing glue layer as the exposure reference line, only exposing the inner wall of the second micro-hole to form a mask for the negative photo-resist on the inner wall of the second micro-hole and the photo-curing glue layer to prevent electrolyte from penetrating to the outer surface of the gold layer;

[0015] using a developing solution to clean the inner wall of the first micro-hole and the second micro-hole to remove the photo-resist on the inner wall of the first micro-hole.

[0016] In at least one embodiment of the present application, the first micro-holes are opened on the gold layer in a matrix manner at equal intervals.

[0017] In at least one embodiment of the present application, the first micro-holes are opened on the gold layer in an equilateral triangle grid.

[0018] In at least one embodiment of the present application, the organic pigment is a combination of one or more of hydroxyl compound pigment, amino compound pigment, thiol compound pigment, and phosphoric acid compound pigment.

[0019] A relief embroidery gold picture is processed by the relief embroidery gold picture processing method as described above, comprising:

[0020] a substrate;

[0021] a gold layer coated on the substrate;

[0022] a photo-curing glue layer coated on the outer surface of the gold layer, and the photo-curing glue layer and the gold layer together opening a first micro-hole with a diameter of 50-200 nm;

[0023] a tri-oxide gold layer arranged on the inner wall of the first micro-hole;

[0024] an organic pigment layer partially bonded to the tri-oxide gold layer in the first micro-hole, and partially extending out of the first micro-hole and adhering to the surface of the photo-curing glue layer.

[0025] In at least one embodiment of the present application, the light-cured adhesive layer and the gold layer are further provided with a second micropore coaxial with the first micropore and having a diameter of 200-1000 nanometers;

[0026] The second micropore is further provided with a mask on the inner wall of the second micropore, and the mask covers the inner wall of the second micropore to isolate the electrolyte.

[0027] The gold trioxide layer is arranged on the inner wall of the first micropore to bond with the organic pigment to adsorb the organic pigment.

[0028] In at least one embodiment of the present application, the depth of the second micropore ranges from 300 to 500 nanometers.

[0029] In at least one embodiment of the present application, a step surface is further formed between the first micropore and the second micropore, and the gold trioxide layer is arranged on the inner wall of the first micropore and the step surface.

[0030] In at least one embodiment of the present application, the organic pigment is one or a combination of hydroxyl compound pigment, amino compound pigment, thiol compound pigment, and phosphoric acid group compound pigment.

[0031] The present application has at least the following beneficial effects:

[0032] 1. The present application coats and fixes a light-cured adhesive layer on a gold layer first, then co-opens a first micropore between the light-cured adhesive layer and the gold layer, and since the light-cured adhesive layer covers the surface of the gold layer, it can cover and stop the contact between the gold surface and the electrolyte to prevent oxidation and blackening. And by electrolytic oxidation of only the inner wall of the first micropore to form a gold trioxide layer, it facilitates the bonding reaction with the subsequently coated organic pigment layer to adsorb the organic pigment layer in the first micropore. The bonding reaction enhances the adsorption force of the inner wall of the first micropore to the organic pigment, increasing its stability.

[0033] 2. The present application opens a second micropore coaxial with the first micropore, and exposes the photoresist coated on the inner wall of the second micropore to form a mask, and the mask completely covers the light-cured adhesive layer and the gold layer, thereby preventing the electrolyte from penetrating between the light-cured adhesive layer and the gold layer during electrolysis in the electrolyte solution, preventing oxidation and blackening of the gold layer, and increasing the gloss of the relief gold. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 It is a structural schematic diagram of the relief embroidery gold painting in Embodiment One of the present application.

[0035] Figure 2 It is Figure 1A cross-sectional view of the embossed embroidery gold painting when the negative photoresist is coated.

[0036] Figure 3 For Figure 1 A cross-sectional view of the embossed embroidery gold painting when the negative photoresist is coated.

[0037] Figure 4 For Figure 1 A cross-sectional view of the embossed embroidery gold painting after the negative photoresist in the first micropore is removed.

[0038] Figure 5 For Figure 1 A cross-sectional view of the embossed embroidery gold painting when the photoresist is exposed to form a mask.

[0039] Figure 6 For Figure 1 A cross-sectional view of the embossed embroidery gold painting when the photoresist is exposed to form a mask.

[0040] Figure 7 A flow chart of the processing method of the embossed embroidery gold painting in Embodiment Two of the present application.

[0041] Main component symbol explanation

[0042] 100, embossed embroidery gold painting; 10, substrate; 20, gold layer; 30, photocured glue layer; 10a, first micropore; 10b, second micropore; 101, step surface; 40a, photoresist; 40b, mask; 50, gold trioxide layer; 60, organic pigment layer. DETAILED DESCRIPTION

[0043] The embodiments of the present application will be described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of, but not all of the embodiments of the present application.

[0044] It should be noted that when one component is considered to be "connected" to another component, it can be directly connected to the other component or can exist simultaneously with a middle component. When one component is considered to be "provided on" another component, it can be directly provided on the other component or can exist simultaneously with a middle component. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and the like used herein are for illustrative purposes only.

[0045] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments and features in the embodiments can be combined with each other without conflict.

[0046] Embodiment One

[0047] For ease of understanding, please refer to Figures 1-6The first embodiment of the present application provides a relief embroidery gold painting 100, comprising a substrate 10;

[0048] a gold layer 20 coated on the substrate 10;

[0049] a photocuring adhesive layer 30 coated on the outer surface of the gold layer 20, and the photocuring adhesive layer 30 and the gold layer 20 are provided with a first micropore 10a with a diameter of 50-200 nanometers;

[0050] wherein the gold layer 20 is further provided with a trioxide gold layer 50 at the inner wall of the first micropore 10a, and the trioxide gold layer 50 is provided with an organic pigment layer 60 adsorbed thereon by bonding reaction.

[0051] Specifically, the organic pigment layer 60 is partially bonded on the trioxide gold layer 50 in the first micropore 10a, and partially extends out of the first micropore 10a and adheres to the surface of the photocuring adhesive layer 30, so that when the organic pigment layer 60 is coated, it can be partially attached to the first micropore 10a to increase the adsorption area and the chemical bonding force, thereby increasing its adsorption property, and partially overflow and adhere to the photocuring adhesive layer 30 to display the color effect of the pigment.

[0052] It should be noted that the relief embroidery gold painting 100 referred to in the first embodiment is a kind of embroidery pattern, which is created by coating a gold layer 20 and a pigment layer on a base material (such as paperboard, plastic board or metal plate, etc.) to create an artistic work with the coexistence of gold and pigment aesthetics.

[0053] In a specific embodiment, the above-mentioned substrate 10 is a metal plate (such as an aluminum plate, etc.), which is placed in a specific cavity and manufactured by a punch with a three-dimensional effect through a punch with a pre-designed punch die.

[0054] Since gold is a smooth inert metal, it has stable chemical properties and a smooth surface. Therefore, when making the relief embroidery gold painting 100, the pigment layer is often difficult to adhere to the surface of the gold layer 20. Or when the pigment layer adheres to the surface of the gold layer 20, due to the smooth properties of gold, it often causes the pigment layer to separate from the gold layer 20 when the gold painting is subjected to external friction or impact. In order to solve the above problems, the prior art (such as patent document CN212332260U) by opening micro-holes on the gold layer 20, then spraying the pigment on the surface of the gold layer 20, so that the pigment penetrates into the micro-holes, thereby increasing the contact area between the pigment layer and the gold layer 20, thereby increasing the physical adhesion between them. However, by increasing the adhesion between the gold layer 20 and the pigment layer to increase the stability of the pigment layer relative to the gold layer 20, when subjected to external force, the pigment layer and the gold layer 20 are only physically attached, and the adhesion between them is relatively small, thereby also causing the pigment layer to fall off.

[0055] Based on this, the first embodiment of the present embodiment is to coat the gold layer 20 on the substrate 10, and set the gold trioxide layer 50 at the inner wall of the first micro-hole 10a by opening the first micro-hole 10a on the gold layer 20 by laser, and replace the pigment with organic pigment that can bond with the gold trioxide layer 50. When the pigment is sprayed on the surface of the gold layer 20 and the pigment penetrates into the micro-holes, the organic pigment and the gold trioxide layer 50 bond, thereby forming a chemical connection to increase the adhesion between the pigment layer and the gold layer 20, thereby increasing the stability of the pigment layer on the surface of the gold painting. In a specific embodiment, the gold trioxide layer 50 is generated by the oxidation reaction of the gold layer 20 in the first micro-hole 10a.

[0056] Specifically, it is known from common knowledge that when a metal undergoes an oxidation reaction, the oxidized metal surface will turn black, thereby affecting the gloss of the gold painting. Based on this, before the first micropore 10a is formed in the gold layer 20, a light-cured adhesive layer 30 is coated on the surface of the gold layer 20, and is cured by ultraviolet light irradiation. After the light-cured adhesive layer 30 is cured, the light-cured layer and the gold layer 20 are punched together by laser to form the first micropore 10a. After the light-cured adhesive layer 30 and the gold layer 20 are punched with the first micropore 10a, they are placed in an electrolyte solution and subjected to electrolysis (the conditions for gold electrolysis are known and will not be described here). At this time, due to the increased inner surface area of the first micropore 10a and the narrowness of the micropore, according to the current concentration effect, the flow of the electrolyte in the first micropore 10a is blocked, causing the current to be unevenly distributed and mainly concentrated in the first micropore 10a. Therefore, the oxidation reaction in the electrolyte mainly occurs in the first micropore 10a. And because the light-cured adhesive layer 30 is coated on the outer surface of the gold layer 20, the electrolyte cannot penetrate to the surface of the gold layer 20, and thus cannot undergo an oxidation reaction on the surface of the gold layer 20. Therefore, most of the oxidation of the gold layer 20 occurs in the first micropore 10a, and accordingly generates gold trioxide (not all of the oxidation is gold trioxide, but other oxides can be ignored, which will not be listed here). The oxidation reaction on the outer surface of the gold layer 20 is almost negligible, so when gold trioxide is generated in the first micropore 10a, the outer surface of the gold layer 20 will not be oxidized and turned black, thereby ensuring the gloss of the gold painting. Further, because the inner wall of the first micropore 10a is oxidized to generate gold trioxide, when the organic pigment penetrates into the first micropore 10a, it will chemically react with the oxidized gold trioxide to increase its adsorption. Since the micropore is not directly displayed to the reader for appreciation, the gold painting combined by the above method not only has good gold gloss, but also has strong adhesion between the pigment layer and the gold layer 20, and is not easy to cause the pigment layer to fall off due to external force.

[0057] Further, by setting the diameter of the first micropore 10a to 50-200 nanometers, the above scheme can also facilitate the penetration of pigment molecules. This avoids the problem of low pigment penetration rate caused by micropores being too small.

[0058] Further, please refer to Figures 2-6 , Figures 2-6 shows the process of opening holes in the gold layer 20, oxidation, exposure, and pigment penetration. As known from the above scheme, after coating the light-cured adhesive layer 30 on the gold layer 20 and laser punching the light-cured adhesive layer 30 and the gold layer 20 together, there will be a gap between the light-cured adhesive layer 30 and the gold layer 20, thereby causing the electrolyte to penetrate between the light-cured adhesive layer 30 and the gold layer 20 during the electrolysis process, and thus causing oxidation reaction on the outer surface of the gold layer 20, which will turn black and affect the gloss of the gold painting.

[0059] Based on this, in the embodiment, the light curing adhesive layer 30 and the gold layer 20 are also provided with a second micro-hole 10b coaxially arranged with the first micro-hole 10a, and the diameter of the second micro-hole 10b is 200-1000 nanometers.

[0060] The light curing adhesive layer 30 and the gold layer 20 are also provided with a mask 40b on the inner wall of the first micro-hole 10a, and the mask 40b covers the inner wall of the second micro-hole 10b, which is used to isolate the electrolyte.

[0061] It should be noted that in the process of opening the first micro-hole 10a and the second micro-hole 10b, a relatively deep first micro-hole 10a is first opened on the light curing layer 30 and the gold layer 50. Then, on the basis of the first micro-hole 10a, a second micro-hole 10b coaxial with the first micro-hole 10a but larger in diameter is opened. In this embodiment, the depth of the first micro-hole 10a is greater than the depth of the second micro-hole 10b.

[0062] Further, since the second micro-hole 10b is opened after the light curing adhesive layer 30 and the gold layer 50 are bonded, the second micro-hole 10b is a blind hole formed on the gold layer 50 by punching through the light curing adhesive layer 30. That is, the gap between the light curing adhesive layer 30 and the gold layer 50 is located on the inner wall of the second micro-hole 10b. When the negative photoresist 40a is exposed at the inner wall of the second micro-hole 10b to form the mask 40b, the mask can cover the gap between the light curing adhesive layer 30 and the gold layer 50 to block and prevent the electrolyte from entering and oxidizing the gold layer 50 through the above gap, thereby preventing the surface of the gold layer 50 from being oxidized and blackened, thereby ensuring the gold luster.

[0063] The gold trioxide layer 50 is arranged on the inner wall of the first micro-hole 10a, and is used to bond with the organic pigment to adsorb the organic pigment.

[0064] It should be noted that for details, please refer to Figure 5, by setting a mask 40b on the inner wall of the second micropore 10b to cover the gold layer 20 and the light-cured glue layer 30, thereby plugging the gap between the light-cured glue layer 30 and the gold layer 20, thereby stopping and blocking the electrolyte from entering during the electrolysis process, thereby ensuring that the outer surface of the gold layer 20 will not appear black due to oxidation and affect the problem of gold painting. Further, by setting a gold trioxide layer 50 in the first micropore 10a, thereby ensuring that when the pigment flows into the first micropore 10a and the second micropore 10b, the pigment layer can chemically react with the gold trioxide layer 50 on the inner wall of the first micropore 10a to increase its adhesion. And because the first micropore 10a is deeper than the second micropore 10b, therefore, when the pigment layer bonds in the deep of the gold layer 20, it can greatly increase the adhesion between the gold layer 20 and the pigment layer. The generation process of gold trioxide is not described here, please refer to Example 2 for details.

[0065] Further, by setting the diameter of the second micropore 10b to be 200-1000 nanometers, to facilitate the entry of the pigment, to avoid the problem of less pigment penetration due to too small pore size. Further, by setting the diameter of the second micropore 10b to be larger than the first micropore 10a, to avoid the problem of excessive concentration of current density due to too small micropore diameter, which can cause economic loss due to excessive oxidation of gold.

[0066] Further, the depth of the second micropore 10b is 300-500 nanometers. It should be noted that the above scheme sets the depth of the second micropore 10b to the above range to facilitate the entry of the organic pigment. Preferably, by setting the depth of the second micropore 10b to the above size, to avoid the problem of instability of the organic pigment layer 60 and the gold layer 20 due to insufficient adhesion caused by the generation of too little gold trioxide in the first micropore 10a during the subsequent exposure operation due to the second micropore 10b being too small.

[0067] Further, a step surface 101 is provided between the first micropore 10a and the second micropore 10b, and the gold trioxide layer 50 is provided on the inner wall of the first micropore 10a and the step surface 101.

[0068] It should be noted that the diameter difference between the first micropore 10a and the second micropore 10b causes the above-mentioned step surface 101 to appear between the first micropore 10a and the second micropore 10b. Preferably, by setting the gold trioxide layer 50 on the inner wall of the first micropore 10a and the step surface 101, to increase the coating area of the gold trioxide, thereby increasing the adsorption area of the gold layer 20 and the organic pigment layer 60, and increasing the stability between the organic pigment layer 60 and the gold layer 20.

[0069] In one embodiment, the organic pigment is one or more of a combination of a hydroxyl compound pigment, an amino compound pigment, a thiol compound pigment, and a phosphoric acid group compound pigment.

[0070] It is noted that the hydroxyl group (-OH) in the hydroxyl compound pigment can react with the metal oxide of the auric oxide to form a coordination bond or a hydrogen bond. The basic chemical equation of the reaction is as follows:

[0071] R-OH + Au2O3→ R-O-Au2O3 + H2O

[0072] The amino group (-NH2) in the amino compound pigment can form a coordination with the surface of the auric oxide to form a chemical bond between the amino group and the metal oxide. The basic equation of the reaction is as follows:

[0073] R-NH2+ Au2O3→ R-NH-Au2O3

[0074] The thiol group (-SH) in the thiol compound pigment can form a sulfur metal bond with the metal center of the surface of the auric oxide. The basic chemical equation of the reaction is as follows:

[0075] R-SH + Au2O3→ R-S-Au2O3 + H2O

[0076] The phosphoric acid group (-PO4H2) in the phosphoric acid group compound pigment can form a coordination reaction with the surface of the auric oxide. The basic chemical equation of the reaction is as follows:

[0077] R-PO4H2+ Au2O3→ R-PO4Au2O3 + H2O

[0078] Example Two

[0079] For details, please refer to Figure 7 The present embodiment two provides a processing method of the embossed embroidery gold painting 100, which specifically comprises the following steps:

[0080] S10: coating a gold layer 20 on the substrate 10 after stamping.

[0081] For details, please refer to Figure 1 The substrate 10 is stamped. After the substrate 10 is stamped, the gold layer 20 is sprayed or coated on the surface of the substrate 10 to show the protruding shape characteristics of the substrate 10 and show the gold luster.

[0082] S20: coating and curing a photocuring adhesive layer 30 on the gold layer 20, and opening a first micropore 10a with a diameter of 50-200 nanometers on the gold layer 20 by laser penetrating the photocuring adhesive layer 30.

[0083] It should be noted that in order to set the mask 40b in the second micropore 10b where the photocuring adhesive layer 30 and the gold layer 20 are located, and to expose the gold layer 20 in the first micropore 10a to the air to facilitate the oxidation reaction to generate the gold trioxide, the step S20 specifically includes the following steps:

[0084] S21: A second micropore 10b with a diameter of 200-1000 nanometers and a depth of 300-500 nanometers is formed on the photocuring adhesive layer 30 and the gold layer 20 coaxially with the first micropore 10a;

[0085] S22: The negative photoresist 40a is sprayed and cured on the inner wall of the first micropore 10a and the second micropore 10b;

[0086] S23: The photolithography machine with a numerical aperture of 0.85 and an ultraviolet wavelength of 193 nanometers is used to perform exposure processing on the inner wall of the second micropore 10b only, with the top edge of the second micropore 10b in contact with the photocuring adhesive layer 30 as the irradiation reference line, so that the negative photoresist 40a on the inner wall of the second micropore 10b and the photocuring adhesive layer 30 forms a mask 40b for preventing the electrolyte from penetrating to the outer surface of the gold layer 20;

[0087] S24: The inner wall of the first micropore 10a and the second micropore 10b is cleaned with a developing solution to remove the photoresist 40a on the inner wall of the first micropore 10a.

[0088] It should be noted that the diameter and depth of the second micropore 10b are set to the above range to facilitate the entry of the organic pigment. Preferably, by setting the depth of the second micropore 10b to the above size, the problem of instability caused by the insufficient adsorption force between the organic pigment layer 60 and the gold layer 20 due to the small amount of gold trioxide generated in the first micropore 10a when the negative photoresist 40a on the inner wall of the first micropore 10a is exposed to form a mask 40b during subsequent exposure operation is avoided.

[0089] It should be noted that the negative photoresist 40a is a type of photoresist 40a that undergoes chemical changes after exposure, which is different from the positive photoresist 40a. The main feature of the negative photoresist 40a is that after ultraviolet (UV) exposure, the photoresist 40a in the exposed area becomes more solid through cross-linking reaction, while the unexposed area is dissolved by the developing solution.

[0090] Further, the exposure equipment of the negative photoresist 40a is a photoetching machine. In the photoetching machine, the numerical aperture (NA) of the photoetching machine is a unitless quantity, which represents the focusing ability and optical resolution of the optical system, and is defined as: NA=n*sin(θ), wherein NA is the numerical aperture, n is the refractive index of the medium, for air, n≈1, and θ is the half-aperture angle of the lens or optical element. The focal depth (DOF) of the photoetching machine is related to the wavelength of the light source and the numerical aperture, and the formula is as follows:

[0091]

[0092] In the embodiment, the numerical aperture NA=0.85 and the foreign line wavelength λ=193 nanometers are used, which are substituted into the above formula to obtain the focal depth DOF≈271.2 nanometers. The focal depth represents the range in which the ultraviolet light of the photoetching machine can clearly irradiate. Therefore, by setting the depth of the second micropore 10b to be between 300-500 nanometers, when the ultraviolet light of the photoetching machine is used for exposure, the ultraviolet light can only irradiate on the inner wall of the second micropore 10b, but cannot clearly irradiate on the inner wall of the first micropore 10a. Since the negative photoresist 40a hardens when irradiated by ultraviolet light and cannot be washed away by the developing solution. Therefore, when the negative photoresist 40a is sprayed on the inner walls of the first micropore 10a and the second micropore 10b, the ultraviolet light of the photoetching machine is used for irradiation to harden the negative photoresist 40a in the second micropore 10b and make it not affected by the developing solution, while the negative photoresist 40a in the first micropore 10a remains in a softened state. After exposure, the softened negative photoresist 40a in the first micropore 10a is washed away by the developing solution to produce a state as shown in Figure 4 , at this time, the hardened negative photoresist 40a forms a mask 40b as shown in Figure 4 .

[0093] Further, specific reference can be made to Figure 2 and Figure 3 , the ultraviolet light emitted from the photoetching machine is a point light source, which is a circular purple light circle when irradiated in the second micropore 10b. In order to ensure the irradiation range of the purple light source, in a specific embodiment, the purple light source emitted from the photoetching machine is used as the irradiation reference line of the top edge of the second micropore 10b in contact with the photocuring adhesive layer 30 to only perform exposure treatment on the inner wall of the second micropore 10b. That is, the upper vertex of the circular purple light source irradiated on the second micropore 10b is tangent to the top edge of the second micropore 10b in contact with the photocuring adhesive layer 30. Combined with the cross-sectional view, it can be obtained that the vertex of the photocuring adhesive layer 30 is used as the starting point of irradiation, and the inner wall of the second micropore 10b is used as the irradiation range for exposure treatment, so as to obtain the mask 40b structure only in the second micropore 10b.

[0094] Further, the thickness of the photo-cured adhesive layer 30 is less than the length of the mask 40b, i.e. when the mask 40b is formed, the mask 40b can block the gap between the photo-cured adhesive layer 30 and the gold layer 20.

[0095] In a specific embodiment, the thickness of the photo-cured adhesive layer 30 is less than 271.2 nanometers, i.e. when a photo-curing machine with a numerical aperture of 0.85 and an ultraviolet light wavelength of 193 nanometers is used and the top edge of the second micro-hole 10b in contact with the photo-cured adhesive layer 30 is used as the exposure reference line to only expose the inner wall of the second micro-hole 10b, the mask 40b formed by the exposure can completely cover the gap between the photo-cured adhesive layer 30 and the gold layer 20, thereby preventing the electrolyte from flowing into the gold layer 20 through the above-mentioned gap.

[0096] S30: The substrate 10 with the first micro-hole 10a opened on the photo-cured adhesive layer 30 and the gold layer 20 is placed in the electrolyte solution for electrolysis, so that an oxidation reaction occurs at the inner wall of each first micro-hole 10a to form a gold trioxide layer 50.

[0097] It should be noted that after the above steps, the gold layer 20 in the first micro-hole 10a is directly exposed to the air, and when the above-mentioned substrate 10, gold layer 20 and photo-cured adhesive layer 30 are placed in the electrolyte solution for electrolysis, the electrolyte can directly enter the first micro-hole 10a and contact the exposed gold layer 20 to occur oxidation reaction, thereby forming a gold trioxide layer 50 on the inner wall of the first micro-hole 10a.

[0098] S40: The substrate 10 in the electrolyte solution is taken out, and an organic pigment is sprayed on the outer surface of the photo-cured adhesive layer 30, so that the organic pigment penetrates into the first micro-hole 10a and occurs a bonding reaction with the gold trioxide layer 50 on the inner wall of the first micro-hole 10a to be adsorbed on the inner wall of the first micro-hole 10a.

[0099] It should be noted that when the gold trioxide layer 50 is formed on the inner wall of the first micro-hole 10a, and the mask 40b is blocked between the photo-cured adhesive layer 30 and the gold layer 20 on the inner wall of the second micro-hole 10b, the organic pigment penetrates into the first micro-hole 10a and occurs a bonding reaction with the gold trioxide layer 50 in the first micro-hole 10a to adhere together. In the second micro-hole 10b, due to the blocking of the mask 40b, the electrolyte and the organic pigment cannot enter the surface of the gold layer 20 through the gap between the photo-cured adhesive layer 30 and the gold layer 20, thereby preventing the surface of the gold layer 20 from being oxidized and causing the problem of darkening of the gold painting.

[0100] In order to ensure that the organic pigment layer 60 can be stressed at multiple locations after permeating into the first micropores 10a and the second micropores 10b and solidifying, thereby increasing the stability of the organic pigment layer 60, in an embodiment, the first micropores 10a are arranged on the gold layer 20 in a matrix pattern at equal intervals.

[0101] In another embodiment, the first micropores 10a are arranged on the gold layer 20 in a grid pattern of equilateral triangles.

[0102] In an embodiment, the organic pigment is a combination of one or more of a hydroxyl compound pigment, an amino compound pigment, a thiol compound pigment, and a phosphoric acid group compound pigment.

[0103] The above merely illustrates the embodiments of the present application, and it should be noted that, for those skilled in the art, improvements can be made without departing from the concept of the present application, and these improvements shall fall within the protection scope of the present application.

Claims

1. A method for processing a relief embroidery gold picture, characterized in that, The method comprises the following steps: coating a gold layer on the substrate after stamping; coating and curing a photo-curing adhesive layer on the gold layer, and opening a first micropore with a diameter of 50-200 nm on the gold layer by penetrating the photo-curing adhesive layer with laser; placing the substrate with the first micropore opened on the photo-curing adhesive layer and the gold layer in an electrolyte solution to generate a gold trioxide layer on the inner wall of each first micropore by oxidation reaction; taking out the substrate in the electrolyte solution, and spraying an organic pigment on the outer surface of the photo-curing adhesive layer to make the organic pigment penetrate into the first micropore and bond with the gold trioxide layer on the inner wall of the first micropore to be adsorbed on the inner wall of the first micropore; the step of "coating and curing a photo-curing adhesive layer on the gold layer, and opening a first micropore with a diameter of 50-200 nm on the gold layer by penetrating the photo-curing adhesive layer with laser" specifically comprises the following steps: opening a second micropore with a diameter of 200-1000 nm and a depth of 300-500 nm coaxially with the first micropore on the photo-curing adhesive layer and the gold layer, and the gap between the photo-curing adhesive layer and the gold layer is located on the inner wall of the second micropore; spraying and curing a negative photoresist on the inner wall of the first micropore and the second micropore; using a photoetching machine with a numerical aperture of 0.85 and an ultraviolet wavelength of 193 nm to perform exposure treatment on the inner wall of the second micropore only with the top edge of the second micropore in contact with the photo-curing adhesive layer as the irradiation reference line, so that the negative photoresist on the inner wall of the second micropore forms a mask for preventing the electrolyte from penetrating to the outer surface of the gold layer; using a developing solution to clean the inner wall of the first micropore and the second micropore to remove the photoresist on the inner wall of the first micropore.

2. The method of claim 1, wherein the gold painting is a relief embroidery gold painting. The first micropores are opened on the gold layer in a matrix manner with equal intervals.

3. The method of claim 1, wherein the gold painting is a relief embroidery gold painting. The first micropores are opened on the gold layer in an equilateral triangle grid.

4. The method of claim 1, wherein the gold painting is a relief embroidery gold painting. The organic pigment is one or a combination of hydroxyl compound pigment, amino compound pigment, thiol compound pigment, and phosphoric acid group compound pigment.

5. A relief embroidery gold picture, processed by the method according to any one of claims 1 to 4, characterized in that, The method comprises the following steps: a substrate; a gold layer coated on the substrate; a photo-curing adhesive layer coated on the outer surface of the gold layer, and the photo-curing adhesive layer and the gold layer jointly opening a first micropore with a diameter of 50-200 nm; a gold trioxide layer arranged on the inner wall of the first micropore; an organic pigment layer partially bonded to the gold trioxide layer in the first micropore and partially extending out of the first micropore and adhering to the surface of the photo-curing adhesive layer.

6. The embossed embroidery gold painting according to claim 5, characterized in that, The first micropore and the second micropore further form a step surface, and the gold trioxide layer is arranged on the inner wall of the first micropore and the step surface.

Images