Non-conductive decorative coating structure and coating process for outer surface of non-planar product

Abstract

The invention relates to the technical field of coating, and discloses a non-conductive decorative coating structure and process for the outer surface of a non-planar product, the coating structure comprises a substrate layer and a coating layer, and the substrate layer is coated with the coating layer; the coating layer is a semiconductor layer, and the semiconductor layer is composed of a single element semiconductor and a binary compound semiconductor. The coating layer comprises a combined buffer layer, the combined buffer layer is formed by combining a plurality of groups of elemental amorphous silicon film layers, and the thickness of the combined buffer layer is 1-5 [mu] m. The coating layer comprises a combined color matching layer, a combined buffer layer and a protective layer. A 3D product plated by the film structure is good in surface decoration effect and color consistency, has no influence on signal transmission when being applied to communication equipment, and does not need to specially design an antenna position; not only can an attractive effect be achieved, but also convenience of antenna design of the communication equipment can be realized, cost is saved, and economic benefits are improved.

Description

Technical Field

[0001] The present invention relates to the field of coating technology, and in particular to a non-conductive decorative coating structure and coating process for the outer surface of a non-planar product. Background Art

[0002] Electronic products have naturally integrated into our lives. The appearance of our electronic products is colorful, soft, delicate, and uniform in color. The functions are becoming more and more diverse, and the performance is more perfect. Signal transmission cannot be affected by accessories. Just like the mobile phones and tablets we use all the time, the shell appearance and color are required to be beautiful, and the impact of the shell on signal transmission is required to be very small. In order to take into account other performance and appearance, the shell often has an irregular surface. That is, it is necessary to do a good job of matching the appearance color and consider that the transmission signal is not interfered. As an appearance part, the mobile phone case needs to match its color well, showing the color aesthetics that match its design, or colorful or metallic color.

[0003] There are two main solutions currently: 1) To maintain the local 3D aesthetic shape of the mobile phone, the coating selects a metal or nitride or carbide film with conductive properties to maintain the color consistency of the entire 3D surface. Since the conductive material used for decorative coating is used, this part will inevitably affect the signal transmission on the communication equipment, and it cannot be applied on a large area on the communication equipment, but can only be used locally; in order to accommodate this impact on signal transmission, the antenna of the communication equipment must be adjusted according to the position of this decorative part to minimize the impact on signal transmission; 2) In order to be able to use non-conductive oxides and nitrides for color decoration, abandon the use of rich 3D shapes and use flat surfaces for decorative coating instead; although non-conductive oxides and nitrides can be used for coating, only flat surfaces can be applied in appearance design, which has great limitations; in view of this, we propose a non-conductive decorative coating structure and coating process for the outer surface of non-planar products. Summary of the invention

[0004] The object of the present invention is to provide a non-conductive decorative coating structure and coating process for the outer surface of a non-planar product, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a non-conductive decorative coating structure on the outer surface of a non-planar product, the coating structure comprising a base layer and a coating layer, the coating layer being coated on the base layer; The coating layer is a semiconductor layer, and the semiconductor layer is composed of a single element semiconductor or a binary compound semiconductor.

[0006] Optionally, the coating layer includes a combined buffer layer, the combined buffer layer is composed of a plurality of groups of single-element amorphous silicon film layers, and the thickness of the combined buffer layer is 1-5 μm.

[0007] Optionally, the coating layer includes a combined color adjustment layer, a combined buffer layer and a protective layer.

[0008] Optionally, the protective layer is a high-transmittance silicon dioxide or silicon nitride film layer; and the combined color adjustment layer is composed of a single crystal silicon and an indium tin material film layer.

[0009] Optionally, the thickness of the combined color adjustment layer is si: 1-20nm / in: 1-200nm / si: 1-20nm.

[0010] Optionally, the protective layer has a thickness of 1-5 μm.

[0011] The present invention also proposes a coating process for non-conductive decoration on the outer surface of a non-planar product, the process comprising the following steps: S1. preparing semiconductor layer materials, mixing single element semiconductors and binary compound semiconductors, and coating them on a substrate layer to form a coating layer on the substrate layer; S2, coating a single amorphous silicon film on the coating layer on the basis of S1 to form a combined buffer layer, the coating thickness is 1-20nm; S3. Based on S1, single crystal silicon and indium tin material film layers are coated on the coating layer to form a combined color adjustment layer, and then high-transmittance silicon dioxide and silicon nitride film layers are coated on the side walls of the combined color adjustment layer to form a protective layer.

[0012] Compared with the prior art, the present invention provides a non-conductive decorative coating structure and coating process for the outer surface of a non-planar product, which has the following beneficial effects: The non-conductive decorative coating structure and coating process of the non-planar product outer surface provide a 3D product surface decoration effect with good color consistency. It has no effect on signal transmission when used in communication equipment and does not require special antenna position design. It can achieve both aesthetic effects and the convenience of communication equipment antenna design, saving costs and improving economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a partial schematic diagram of the film layer of the single absorption layer film system structure on the substrate of the present invention; Figure 2 It is a partial schematic diagram of the film layer of the multi-layer film system structure on the substrate of the present invention; In the figure: 1. base sub layer; 2. combined buffer layer; 3. combined color adjustment layer; 4. protective layer. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] Embodiment 1: like Figure 1 As shown, the present invention provides a technical solution: a non-conductive decorative coating structure on the outer surface of a non-planar product, the coating structure comprising a base layer 5 and a coating layer 1; The substrate layer 5 is made of glass, ceramic, or plastic, and the coating layer 1 is a semiconductor layer, which is composed of a single element semiconductor or a binary compound semiconductor. The coating layer 1 includes a combined buffer layer 2, which is composed of a plurality of single-element amorphous silicon film layers, and has a thickness of 1-5 μm.

[0016] Embodiment 2: like Figure 2 As shown, the coating layer 1 includes a combined color-adjusting layer 3, a combined buffer layer 2 and a protective layer 4. The protective layer 4 is a high-transmittance silicon dioxide and silicon nitride film layer; the thickness of the protective layer 4 is 1-5 μm; the combined color-adjusting layer 3 is composed of a single crystal silicon and an indium tin material film layer. The thickness of the combined color-adjusting layer 3 is si: 1-20nm / in: 1-200nm / si: 1-20nm.

[0017] The present invention also proposes a coating process for non-conductive decoration on the outer surface of a non-planar product, which comprises the following steps: S1. Prepare semiconductor layer materials, mix single element semiconductors and binary compound semiconductors, and apply them on the base layer 5 to form a coating layer 1 on the base layer 5.

[0018] S2. On the basis of S1, a single amorphous silicon film is coated on the coating layer 1 to form a combined buffer layer 2. The coating thickness is 1-20 nm. The combined buffer layer 2 improves the effect of the coating layer 1.

[0019] S3. Based on S1, single crystal silicon and indium tin material film layers are coated on the coating layer 1 to form a combined color adjustment layer 3, and then high-transmittance silicon dioxide and silicon nitride film layers are coated on the side walls of the combined color adjustment layer 3 to form a protective layer 4.

[0020] As an application of this embodiment: the conductivity of semiconductor materials is between that of conductors and non-conductors, and through the coating process, it has good non-conductive properties in the nano-thin film state; indium / tin also has non-conductive properties because its film structure is discontinuous when it is in the nano-scale film layer; most metal oxides and silicon nitride do not have conductive properties.

[0021] Semiconductor materials have a property similar to that of metal films that absorb light and display color. Therefore, after the film thickness reaches a certain level, the appearance color is not directly related to the film thickness. Indium / tin is originally a metal. Similarly, after the film thickness reaches a certain level, the appearance color is not directly related to the film thickness. Metal oxides and silicon nitride are transparent materials. When they are thin films, the reflected light from the upper and lower surfaces is interfering. However, when they are plated to a certain thickness, the coherence of the reflected light from the upper and lower surfaces disappears.

[0022] The surface decoration effect of the 3D product plated by the structure of the present invention has good color consistency, and the application in communication equipment has no effect on signal transmission, and there is no need to specially design the antenna position; it can achieve both an aesthetic effect and the convenience of communication equipment antenna design, saving costs and improving economic benefits.

[0023] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A non-conductive decorative coating structure on the outer surface of a non-planar product, characterized in that: The coating structure comprises a base layer (5) and a coating layer (1), wherein the coating layer (1) is coated on the base layer (5); The coating layer (1) is a semiconductor layer, and the semiconductor layer is composed of a single element semiconductor or a binary compound semiconductor.

2. The non-conductive decorative coating structure on the outer surface of a non-planar product according to claim 1, characterized in that: The coating layer (1) comprises a combined buffer layer (2), the combined buffer layer (2) is composed of a plurality of groups of single-element amorphous silicon film layers, and the thickness of the combined buffer layer (2) is 1-5 μm.

3. The non-conductive decorative coating structure on the outer surface of a non-planar product according to claim 1, characterized in that: The coating layer (1) comprises a combined color adjustment layer (3), a combined buffer layer (2) and a protective layer (4).

4. The non-conductive decorative coating structure on the outer surface of a non-planar product according to claim 3, characterized in that: The protective layer (4) is a high-transmittance silicon dioxide or silicon nitride film layer; the combined color adjustment layer (3) is composed of a single crystal silicon and an indium tin material film layer.

5. The non-conductive decorative coating structure on the outer surface of a non-planar product according to claim 4, characterized in that: The thickness of the combined color adjustment layer (3) is si: 1-20nm / in: 1-200nm / si: 1-20nm.

6. The non-conductive decorative coating structure on the outer surface of a non-planar product according to claim 5, characterized in that: The thickness of the protective layer (4) is 1-5 μm.

7. A coating process for non-conductive decoration on the outer surface of a non-planar product, characterized in that: The process comprises the following steps: S1, preparing semiconductor layer materials, mixing single element semiconductors and binary compound semiconductors, and coating them on a base layer (5), so that a coating layer (1) is formed on the base layer (5); S2, coating a single amorphous silicon film on the coating layer (1) on the basis of S1 to form a combined buffer layer (2), the coating thickness being 1-20 nm; S3. Based on S1, a single crystal silicon and an indium tin material film layer is coated on the coating layer (1) to form a combined color adjustment layer (3), and then a high-transmittance silicon dioxide and silicon nitride film layer is coated on the side wall of the combined color adjustment layer (3) to form a protective layer (4).

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