Seed crystal bonding method and seed crystal hot-pressing bonding mechanism

Abstract

The invention relates to a seed crystal bonding method which is based on a seed crystal hot-pressing bonding mechanism, the seed crystal hot-pressing bonding mechanism comprises a carrying table, a pressing disc assembly, a lifting part and a cooling assembly, and the seed crystal bonding method comprises the steps that after a seed crystal base located on the carrying table is heated and cured, a driving device is controlled to drive a pressing disc to drive the lifting part to move upwards; and then, the seed crystal seat is subjected to air injection cooling and / or heat radiation of the carrying table on the seed crystal seat is isolated. According to the seed crystal bonding method, after hot pressing is finished, the lifting piece is driven by the pressing disc to move upwards, so that the seed crystal seat is separated from the carrying table, thermal stress concentration caused by difference of thermal expansion coefficients in the cooling process of the carrying table and the seed crystal seat can be avoided, temperature changes of the seed crystal seat and the carrying table are more uniform, and the bonding quality of the seed crystal is improved. And heat insulation and air injection cooling of the cooling assembly are combined, so that the bonding quality of the seed crystal base is ensured, the heating rate of the seed crystal base is increased, and the production efficiency of bonding of the seed crystal base is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of seed crystal bonding, and in particular relates to a seed crystal bonding method and a seed crystal hot pressing bonding mechanism. Background Art

[0002] Silicon carbide (SiC), as a typical representative of the third generation of semiconductor materials, has the characteristics of wide band gap, high breakdown electric field strength and high thermal conductivity. It is one of the most important third generation semiconductor materials and can meet the high requirements of substrate materials under harsh conditions such as high power, high frequency and high temperature in the fields of aerospace, photovoltaic power generation, rail power grid and new energy trams. At present, the most mature and mainstream way to grow silicon carbide single crystals is the physical vapor transport method (PVT). The main steps of this method are: loading silicon carbide powder at the bottom of a graphite crucible, and bonding silicon carbide seed crystals to the top of the crucible, heating the graphite crucible by electromagnetic induction, so that the powder raw material sublimates at high temperature, and finally growing silicon carbide single crystals at the interface of the silicon carbide seed crystals.

[0003] The bonding effect between the silicon carbide seed crystal and the seed crystal seat directly affects the continuity of crystal growth and the quality of the crystal. Photoresist, epoxy resin, phenolic resin and other polymers are usually used as interface adhesives. The adhesive is applied to the bonding surface of the seed crystal seat and the silicon carbide seed crystal, and then the two are concentrically pressed and bonded, and then hot pressed to improve the curing effect of the adhesive. After the hot pressing is completed, it is taken out after naturally cooling to room temperature. However, the hot pressing temperature of commonly used silicon carbide seed crystals is relatively high (generally 300℃~600℃), and it takes a long time for the seed crystal and the seed crystal seat to cool to room temperature, resulting in long production time and low work efficiency, which will eventually affect the production efficiency of silicon carbide single crystal materials. Summary of the invention

[0004] The object of the present invention is to provide a seed crystal bonding method with high production efficiency.

[0005] Another object of the present invention is to provide a seed crystal hot-pressing bonding mechanism with high production efficiency.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is:

[0007] In one aspect, the present invention provides a seed crystal bonding method, based on a seed crystal hot-pressing bonding mechanism, the seed crystal hot-pressing bonding mechanism comprising: a heatable carrier for carrying a seed crystal seat, the seed crystal seat comprising a seed crystal seat body, a seed crystal sheet and an adhesive located therebetween;

[0008] A pressure plate assembly, the pressure plate assembly comprising a pressure plate disposed above the carrier and used to cooperate with the carrier to press the seed crystal seat located therebetween, and a driving device capable of driving the pressure plate to move in an up-and-down direction, the pressure plate comprising a pressure plate body and a pressure rod connected to the pressure plate body;

[0009] A lifting member, wherein the lifting member is detachably connected to the seed crystal seat body, is slidably connected to the pressure plate and can move under the drive of the pressure plate to separate the seed crystal seat from the carrier; and

[0010] A cooling component, the cooling component includes a cooling ring and / or a heat shield, the cooling ring is arranged on the outside of the seed crystal seat and is connected to the cooling gas source, and an air jet hole is opened on the inside of the cooling ring for ejecting cooling gas to cool the seed crystal seat, the heat shield is rotatably arranged above the carrier, and has a heat-insulating state between the carrier and the seed crystal seat and an initial state away from the carrier and the seed crystal seat,

[0011] The seed crystal bonding method includes, after heating and curing the seed crystal seat, controlling the driving device to drive the pressure plate with the pulling member to move upward to drive the seed crystal seat to separate from the carrier, and then controlling the cooling component to perform jet cooling on the seed crystal seat and / or isolate the seed crystal seat from heat radiation from the carrier.

[0012] Usually, after the seed wafer and the seed crystal seat body are bonded by an adhesive, it is necessary to apply a certain pressure to the bonded seed wafer in a hot press furnace, and heat and cure it by a heating platform, and then take it out after it naturally cools down to room temperature. However, the hot pressing temperature is generally between 300℃ and 600℃, and it takes a long time for the seed wafer and the seed crystal seat body to cool down to room temperature, resulting in a long production time for the bonding of the seed wafer and the seed crystal seat body, which is not convenient for industrial production. The cooling rate of the seed wafer and the seed crystal seat can be accelerated to a certain extent by only introducing cooling gas or coolant into the hot press furnace, but due to the large heat capacity of the heating platform, the center of the seed wafer and the seed crystal seat will cool down slowly and the edge will cool down quickly, resulting in local stress concentration at the bonding point between the seed wafer and the seed crystal seat, poor bonding quality, and affecting the subsequent crystal growth. The seed crystal bonding method of the present invention can avoid the concentration of thermal stress caused by the difference in thermal expansion coefficient between the carrier and the seed crystal seat during the cooling process by separating the seed crystal seat from the carrier through a pulling piece after the hot pressing is completed. The temperature change of the seed crystal seat and the carrier is more uniform and the generation of thermal stress can be further reduced. Combined with the cooling ring jet cooling and / or the heat shield plate isolating the heat radiation of the carrier to the seed crystal seat, while ensuring the bonding quality of the seed crystal seat, the heating rate of the seed crystal seat is accelerated, thereby improving the production efficiency of seed crystal plate bonding.

[0013] In some embodiments, the lifting member is a cylindrical body arranged in a ring around the seed crystal seat and the outer side of the pressure plate body, the cylindrical body having a cavity penetrating in the up-down direction, a blocking portion arranged at the upper part of the cavity, and a hanging portion arranged at the lower part of the cavity, the blocking portion is slidably connected to the pressure rod and limits the separation of the pressure plate body from the lifting member, and the hanging portion extends inwardly and is detachably connected to the seed crystal seat body.

[0014] Preferably, the seed crystal seat body has an outwardly protruding shoulder, and the hanging portion is located below the shoulder and can abut against the shoulder.

[0015] Preferably, the shoulder is located at the outer periphery of the seed seat body and is a truncated cone structure.

[0016] Preferably, the hoisting portion is in a circular ring structure.

[0017] Preferably, one or two loading and unloading ports are provided on the side of the lifting member for taking in and placing the seed crystal seat.

[0018] Preferably, a plurality of weight-reducing openings are provided on the lifting member.

[0019] In some embodiments, the lifting member is a hanging ring having an annular portion detachably connected to the seed crystal seat body and a guide column extending in the up and down directions, the guide column having a plurality of guide columns arranged circumferentially around the annular portion, one end of the guide column being connected to the annular portion, and the other end of the guide column passing through the pressure plate body and being slidably connected to the pressure plate body.

[0020] Preferably, the seed seat body has an outwardly convex shoulder, and the annular portion is located below the shoulder and can abut against the shoulder.

[0021] Further preferably, the shoulder is a pin plugged into the seed crystal seat body, and there are a plurality of the pins evenly arranged around the circumference of the seed crystal seat body.

[0022] Preferably, the pressure plate body is provided with a through hole, the other end of the guide column passes through the through hole and has an abutment portion thereon that can abut against the pressure plate body.

[0023] Preferably, the seed crystal hot-pressing bonding mechanism further comprises an induction coil disposed in the carrier, and the seed crystal seat is induction-heated by the induction coil, which has high heating efficiency and saves energy and reduces consumption.

[0024] Further preferably, the induction coil is a water-cooled electromagnetic coil, which can be cooled by passing cooling water to cool the carrier.

[0025] Preferably, the seed crystal hot-pressing bonding mechanism further comprises an ultrasonic generator arranged on the pressure rod or the pressure plate body.

[0026] Preferably, the seed crystal bonding method further comprises the following steps:

[0027] (1) Place the seed crystal seat on the carrier with the side bonded with the seed crystal facing upward;

[0028] (2) controlling the driving device to drive the pressure plate to move downward and press against the seed crystal seat, so that the seed crystal seat is in contact with the carrier body;

[0029] (3) The seed crystal seat is heated to bond the seed crystal sheet to the seed crystal seat body.

[0030] Further preferably, the seed crystal bonding method further comprises starting an ultrasonic generator while heating the seed crystal seat.

[0031] A second aspect of the present invention provides a seed crystal hot-pressing bonding mechanism, comprising:

[0032] A carrier, the carrier is used to carry a seed crystal seat, the seed crystal seat comprises a seed crystal seat body, a seed crystal sheet and an adhesive located therebetween;

[0033] A lifting member, the lifting member is a cylindrical body arranged around the seed crystal seat and the outer side of the pressure plate body, the cylindrical body has a cavity penetrating in the up-down direction, a blocking portion arranged at the upper part of the cavity, and a hanging portion arranged at the lower part of the cavity, the hanging portion is detachably connected to the seed crystal seat body;

[0034] The pressure plate assembly comprises a pressure plate arranged above the carrier and used to cooperate with the carrier to press the seed crystal seat located therebetween, and a driving device capable of driving the pressure plate to move in an up-and-down direction, the pressure plate comprises a pressure plate body arranged in the cavity and a pressure rod slidably connected to the blocking portion, the pressure rod being fixedly connected to the upper end of the pressure plate body and being controlled by the driving device, the pressure plate having a first state, a second state and a third state, when the pressure plate is in the first state, the pressure plate body abuts against the seed crystal seat and has a tendency to press the seed crystal seat downward; when the pressure plate is in the second state, the pressure plate body is not in contact with the seed crystal seat and the lifting member; when the pressure plate is in the third state, the blocking portion limits the separation of the pressure plate body and the lifting member, so that the pressure plate body abuts against the lifting member and has a tendency to pull the lifting member upward; and,

[0035] A cooling ring is arranged on the outside of the seed crystal seat and is connected to a cooling gas source. A gas injection hole is provided on the inside of the cooling ring for injecting cooling gas to cool the seed crystal seat.

[0036] The specific structure of the seed crystal hot pressing bonding mechanism is as described above and will not be repeated here.

[0037] A third aspect of the present invention provides another seed crystal hot-pressing bonding mechanism, comprising:

[0038] A carrier, the carrier is used to carry a seed crystal seat, the seed crystal seat comprises a seed crystal seat body, a seed crystal sheet and an adhesive located therebetween;

[0039] A lifting member, wherein the lifting member is a lifting ring, the lifting ring has an annular portion detachably connected to the seed crystal seat body and a guide column extending in the up-down direction, the guide column has a plurality of guide columns arranged circumferentially around the annular portion, and one end of the guide column is connected to the annular portion;

[0040] A pressure plate assembly, the pressure plate assembly comprising a pressure plate disposed above the carrier and used to cooperate with the carrier to press the seed crystal seat located therebetween, and a driving device capable of driving the pressure plate to move in an up-and-down direction, the pressure plate comprising a pressure plate body slidably connected to the guide column and a pressure rod connected above the pressure plate body, and controlled by the driving device, the pressure plate body having a pressing state of abutting against the seed crystal seat and pressing the seed crystal seat downward, and a lifting state of pulling the guide column upward so that the hanging ring brings the seed crystal seat away from the carrier;

[0041] The heat shield is rotatably disposed above the carrier, and has a heat insulating state between the carrier and the seed crystal seat and an initial state away from the carrier and the seed crystal seat.

[0042] The specific structure of the seed crystal hot pressing bonding mechanism is as described above and will not be repeated here.

[0043] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0044] The seed crystal bonding method of the present invention separates the seed crystal seat from the carrier by driving the lifting member upward through the pressure plate after the hot pressing is completed. This can avoid the concentration of thermal stress caused by the difference in thermal expansion coefficients between the carrier and the seed crystal seat during the cooling process. The temperature changes of the seed crystal seat and the carrier are more uniform, and the generation of thermal stress can be further reduced. Combined with the cooling ring jet cooling and / or the heat shield plate isolating the heat radiation of the carrier to the seed crystal seat, while ensuring the bonding quality of the seed crystal seat, the heating rate of the seed crystal seat is accelerated, thereby improving the production efficiency of seed crystal chip bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic structural diagram of a seed crystal hot-pressing bonding mechanism provided in Example 1 of the present invention, wherein the pressure plate is in a first state;

[0046] Figure 2 This is another structural schematic diagram of a seed crystal hot-pressing bonding mechanism provided in Example 1 of the present invention, wherein the pressure plate is in a third state;

[0047] Figure 3 A schematic diagram of the structure of a lifting member provided in Example 1 of the present invention;

[0048] Figure 4 A schematic structural diagram of a seed crystal hot-pressing bonding mechanism provided in Example 2 of the present invention, wherein the pressure plate is in a pressed state;

[0049] Figure 5 A schematic structural diagram of a seed crystal hot-pressing bonding mechanism provided in Example 2 of the present invention, wherein the pressure plate is in a lifting state;

[0050] Figure 6 A schematic structural diagram of a pressure plate body provided in Example 2 of the present invention;

[0051] Wherein: 1. stage; 11. groove; 12. induction coil;

[0052] 2. Lifting piece; 21. Loading and unloading port; 22. Weight reduction port; 23. Receiving cavity; 24. Lifting part; 25. Ring part; 26. Guide column;

[0053] 3. Cooling ring; 31. Jet hole;

[0054] 4. pressure plate; 41. pressure plate body; 411. through hole; 42. pressure rod;

[0055] 51, seed crystal seat body; 511, shoulder; 52, seed crystal plate;

[0056] 6. Ultrasonic generator;

[0057] 7. Heat shield. DETAILED DESCRIPTION

[0058] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0059] In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", etc. indicate positions or location relationships based on Figure 1The above directional terms are only used to facilitate the description of the embodiments of the present invention and simplify the description, and do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention.

[0060] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0061] In the embodiments of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0062] The disclosure below provides many different embodiments or examples to implement different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the embodiments of the present invention. In addition, the embodiments of the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0063] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0064] If not otherwise specified, the seed crystal seat described herein includes a seed crystal seat body 51 , a seed crystal piece 52 , and an adhesive therebetween (not shown in the figures, the adhesive is a conventional adhesive in the art and is not specifically limited).

[0065] Example 1

[0066] A seed crystal hot pressing bonding mechanism, such as Figure 1 and Figure 2 As shown, it includes a carrier 1, a lifting member 2, a pressure plate assembly and a cooling ring 3.

[0067] The carrier 1 is used to carry the seed crystal seat, which includes a seed crystal seat body 51, a seed crystal chip 52 and an adhesive located therebetween. The seed crystal seat body 51 has an outwardly protruding shoulder 511, which is used to cooperate with the lifting member 2 to controllably separate the seed crystal seat from the carrier 1. Preferably, the shoulder 511 is located at the periphery of the seed crystal seat body 51 and is a truncated cone structure. The seed crystal chip 52 includes but is not limited to a silicon carbide seed crystal chip. A groove 11 is provided at the bottom of the carrier 1, and an induction coil 12 is installed in the groove 11 for heating the carrier 1. Preferably, the induction coil 12 is a water-cooled electromagnetic coil, and cooling water can be passed through it to cool the carrier 1 after heating. The material of the carrier 1 includes but is not limited to any one of quartz glass, tempered glass, heat-resistant insulating ceramics, high-purity graphite, stainless steel, and carbon-carbon composite materials.

[0068] The lifting member 2 is a cylindrical body arranged around the seed crystal seat and the outer side of the pressure plate body 41. Figure 3 As shown, the cylindrical body has a cavity 23 penetrating in the up-down direction, a blocking portion provided at the upper part of the cavity 23, and a hanging portion 24 provided at the lower part of the cavity 23. The hanging portion 24 extends inward and preferably has a circular ring structure. The hanging portion 24 is located below the shoulder 511 and can abut against the shoulder 511. One or two loading and unloading ports 21 are provided on the side of the lifting member 2 for taking in and placing the seed crystal seat.

[0069] The pressure plate assembly includes a pressure plate 4 disposed above the carrier 1 and used to cooperate with the carrier 1 to press the seed crystal seat located between the two, and a driving device (not shown in the figure) capable of driving the pressure plate 4 to move in the up and down directions. The pressure plate 4 includes a pressure plate body 41 disposed in the cavity 23 and a pressure rod 42 slidably connected to the blocking portion, and the pressure rod 42 is fixed to the upper end of the pressure plate body 41. Controlled by the driving device, the pressure plate 4 has a first state, a second state and a third state. When the pressure plate 4 is in the first state, the pressure plate body 41 abuts against the seed crystal seat and has a tendency to press the seed crystal seat downward (such as Figure 1 ); when the pressure plate 4 is in the second state, the pressure plate body 41 is not in contact with the seed crystal seat and the lifting member 2; when the pressure plate 4 is in the third state, the blocking portion limits the pressure plate body 41 from separating from the lifting member 41, so that the pressure plate body 41 abuts against the lifting member 2 and has a tendency to pull the lifting member 2 upward (as shown in FIG. Figure 2 As shown in the figure, the upward movement of the pressure plate 4 can drive the lifting member 2 to move upward, thereby driving the seed crystal seat to move upward and separate from the carrier 1. In order to facilitate the driving of the lifting member 2, a plurality of weight-reducing openings 22 are provided at the upper end (i.e., the blocking portion) of the lifting member 2, and the pressure rod 42 passes through the weight-reducing opening 22 at the center of the lifting member 2 and is connected to the driving device.

[0070] The cooling ring 3 is arranged outside the seed crystal seat and is connected to a cooling gas source (usually an inert gas, such as nitrogen, argon, etc.). A jet hole 31 is provided inside the cooling ring 3 for ejecting cooling gas to cool the seed crystal seat. The jet holes 31 are provided in one group or multiple groups arranged in the vertical direction, and each group of jet holes 31 includes multiple holes evenly arranged along the inner circumference of the cooling ring 3.

[0071] In order to improve the bonding quality of the seed crystal 52 , the seed crystal hot-pressing bonding mechanism further includes an ultrasonic generator 6 disposed on the pressure rod 42 .

[0072] Working principle:

[0073] (1) Place the seed crystal seat with the seed crystal 52 bonded thereto on the carrier 1, with the side with the seed crystal 52 bonded thereto facing upwards;

[0074] (2) controlling the driving device to drive the pressure plate 4 to move downward and press against the seed crystal seat, so that the seed crystal seat and the carrier 1 are in contact with each other;

[0075] (3) starting the induction coil 12 to heat and selectively pressurize the seed crystal seat, and at the same time starting the ultrasonic generator 6 to bond the seed crystal sheet 52 to the seed crystal seat body 51;

[0076] (4) After the hot pressing is completed, the control driving device drives the pressure plate 4 to move upward. When it moves up a certain distance, the pressure plate 4 abuts against the lifting member 2 and drives the lifting member 2 to move up synchronously with the seed crystal seat. The seed crystal seat is separated from the carrier 1, and then cooling gas is introduced into the cooling ring 3 to jet cool the seed crystal seat. At the same time, the induction coil 12 that is introduced with cooling water is used to cool the carrier 1 until the cooling is completed. Then, the seed crystal seat can be taken out from the loading and unloading port 21.

[0077] Example 2

[0078] A seed crystal hot pressing bonding mechanism, such as Figure 4 and Figure 5 As shown, it includes a carrier 1, a lifting member 2, a pressure plate assembly and a heat shield 7.

[0079] The carrier 1 is used to carry the seed crystal seat, which includes a seed crystal seat body 51, a seed crystal chip 52 and an adhesive located therebetween. The seed crystal seat body 51 has an outwardly protruding shoulder 511 for cooperating with the lifting member 2 so that the seed crystal seat can be controllably separated from the carrier 1. Preferably, the shoulder 511 is a pin that is detachably plugged into the seed crystal seat body 51, and the pin has a plurality of pins arranged circumferentially along the seed crystal seat body 51. The seed crystal chip 52 includes but is not limited to a silicon carbide seed crystal chip. A heating device can be installed in the carrier 1 to heat the carrier 1, and the heating device refers to the prior art, such as an induction coil. The material of the carrier 1 includes but is not limited to any one of quartz glass, tempered glass, heat-resistant insulating ceramics, high-purity graphite, stainless steel, and carbon-carbon composite materials.

[0080] The pressure plate assembly includes a pressure plate 4 disposed above the carrier 1 and used to cooperate with the carrier 1 to press the seed crystal seat located between the two, and a driving device (not shown in the figure) capable of driving the pressure plate 4 to move in the up and down directions. The pressure plate 4 includes a pressure plate body 41 and a pressure rod 42 connected to the top of the pressure plate body 41.

[0081] The lifting member 2 is a lifting ring, which has an annular portion 25 and a guide column 26 extending in the up-down direction. The annular portion 25 is located below the shoulder 511 and can abut against the shoulder 511. There are multiple guide columns 26 arranged circumferentially around the annular portion 25, one end of the guide column 26 is connected to the annular portion 25, and the other end of the guide column 26 passes through the through hole 411 on the pressure plate body 41 and is slidably connected to the pressure plate body 41. The other end of the guide column 26 has an abutment portion extending outward and abutting against the pressure plate body, which is used to cooperate with the pressure plate body 41 to lift the lifting member 2 upward. In order to facilitate the disassembly of the pressure plate body 41 and the guide column 26, as shown in FIG. Figure 6 As shown, the through hole 411 is a waist-shaped hole and one end of the through hole has an enlarged area that allows the abutment portion of the guide column 26 to pass through. Controlled by the driving device, the pressure plate body 41 has a pressing state that abuts against the seed crystal seat and presses the seed crystal seat downward (such as Figure 4 ) and the pulling state in which the guide column 26 is pulled upward so that the lifting ring brings the seed crystal seat away from the carrier 1 (as shown in Figure 5 shown).

[0082] The heat shield 7 is rotatably disposed above the stage 1, and has a heat-insulating state between the stage 1 and the seed crystal seat and an initial state away from the stage 1 and the seed crystal seat. The heat shield 7 is preferably made of a heat-insulating material, and the details can be referred to the prior art.

[0083] Working principle:

[0084] (1) Place the seed crystal seat with the seed crystal 52 bonded thereto on the carrier 1, with the side with the seed crystal 52 bonded thereto facing upwards;

[0085] (2) controlling the driving device to drive the pressure plate 4 to move downward and press against the seed crystal seat, so that the seed crystal seat and the carrier 1 are in contact with each other;

[0086] (3) heating and selectively pressurizing the seed crystal seat to bond the seed crystal sheet 52 to the seed crystal seat body 51;

[0087] (4) After the hot pressing is completed, the driving device is controlled to drive the pressure plate 4 to move upward. When it moves up a certain distance, it is restricted by the abutment of the guide column 26, and the pressure plate body 41 drives the lifting member 2 to move up with the seed crystal seat, and the seed crystal seat is separated from the carrier 1. Then, the heat shield plate 7 is controlled to switch to the heat insulation state. After cooling is completed, the seed crystal seat can be taken out.

[0088] It has been proven that the above-mentioned seed crystal bonding method can ensure the bonding quality, while increasing the bonding efficiency by several times or even dozens of times, and is suitable for industrial production.

[0089] The above detailed description of the present invention is intended to enable persons familiar with the art to understand the contents of the present invention and implement them. It does not limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A seed crystal bonding method, characterized in that: Based on the seed crystal hot pressing bonding mechanism, the seed crystal hot pressing bonding mechanism includes: A heatable carrier (1) used for carrying a seed crystal seat, wherein the seed crystal seat comprises a seed crystal seat body (51), a seed crystal sheet (52) and an adhesive located therebetween; A pressure plate assembly, the pressure plate assembly comprising a pressure plate (4) disposed above the carrier (1) and used to cooperate with the carrier (1) to press the seed crystal seat located therebetween, and a driving device capable of driving the pressure plate (4) to move in an up-and-down direction, the pressure plate (4) comprising a pressure plate body (41) and a pressure rod (42) connected to the pressure plate body (41); a lifting member (2), the lifting member (2) being detachably connected to the seed crystal seat body (51), being slidably connected to the pressure plate (4) and being able to move under the drive of the pressure plate (4) to separate the seed crystal seat from the carrier (1); and A cooling component, the cooling component comprising a cooling ring (3) and / or a heat shield (7), the cooling ring (3) being arranged on the outside of the seed crystal seat and being connected to a cooling gas source, and having an injection hole (31) on the inside thereof for ejecting cooling gas to cool the seed crystal seat, the heat shield (7) being rotatably arranged above the carrier (1), and having a heat-insulating state between the carrier (1) and the seed crystal seat and an initial state away from the carrier (1) and the seed crystal seat, The seed crystal bonding method comprises, after the seed crystal seat is heated and cured, controlling the driving device to drive the pressure plate (4) to move upward with the pulling member (2) to drive the seed crystal seat to separate from the carrier (1), and then controlling the cooling component to perform jet cooling on the seed crystal seat and / or isolate the heat radiation of the carrier (1) to the seed crystal seat.

2. The seed crystal bonding method according to claim 1, characterized in that: The lifting member (2) is a cylindrical body arranged in a ring around the outer side of the seed crystal seat and the pressure plate body (41), and the cylindrical body has a cavity (23) penetrating in the up-down direction, a blocking portion arranged at the upper part of the cavity (23), and a hanging portion (24) arranged at the lower part of the cavity (23), the blocking portion is slidably connected to the pressure rod (42) and limits the separation of the pressure plate body (41) and the lifting member (2), and the hanging portion (24) extends inwardly and is detachably connected to the seed crystal seat body (51).

3. The seed crystal bonding method according to claim 2, characterized in that: The seed crystal seat body (51) has an outwardly protruding shoulder (511), and the hanging portion (24) is located below the shoulder (511) and can abut against the shoulder (511).

4. The seed crystal bonding method according to claim 3, characterized in that: The shoulder (511) is located on the outer periphery of the seed crystal seat body (51) and is a truncated cone structure; and / or, The hanging part (24) is in a circular ring structure.

5. The seed crystal bonding method according to claim 2, characterized in that: The side of the lifting member (2) is provided with one or two loading and unloading openings (21) for taking in and placing the seed crystal seat; and / or, The lifting member (2) is provided with a plurality of weight-reducing openings (22).

6. The seed crystal bonding method according to claim 1, characterized in that: The lifting member (2) is a hanging ring, which has an annular portion (25) detachably connected to the seed crystal seat body (51) and a guide column (26) extending in the up and down direction, and the guide column (26) has a plurality of guide columns (26) arranged circumferentially around the annular portion (25), one end of the guide column (26) is connected to the annular portion (25), and the other end of the guide column (26) passes through the pressure plate body (41) and is slidably connected to the pressure plate body (41).

7. The seed crystal bonding method according to claim 6, characterized in that: The seed crystal seat body (51) has an outwardly protruding shoulder (511), and the annular portion (25) is located below the shoulder (511) and can abut against the shoulder (511).

8. The seed crystal bonding method according to claim 6, characterized in that: The pressure plate body (41) is provided with a through hole (411), and the other end of the guide column (26) passes through the through hole (411) and has an abutment portion thereon that can abut against the pressure plate body (41).

9. The seed crystal bonding method according to claim 1, characterized in that: The seed crystal hot-pressing bonding mechanism further includes an induction coil (12) disposed in the carrier (1); and / or, The seed crystal hot-pressing bonding mechanism further comprises an ultrasonic generator (6) arranged on the pressure rod (42) or the pressure plate body (41).

10. A seed crystal hot pressing bonding mechanism, characterized in that: include: A carrier (1), the carrier (1) being used to carry a seed crystal seat, the seed crystal seat comprising a seed crystal seat body (51), a seed crystal sheet (52) and an adhesive located therebetween; A lifting member (2), the lifting member (2) being a cylindrical body arranged in a ring around the outer side of the seed crystal seat, the cylindrical body having a cavity (23) penetrating in the up-down direction, a blocking portion arranged at the upper part of the cavity (23), and a hanging portion (24) arranged at the lower part of the cavity (23), the hanging portion (24) being detachably connected to the seed crystal seat body (51); A pressure plate assembly, the pressure plate assembly comprising a pressure plate (4) arranged above the carrier (1) and used to cooperate with the carrier (1) to press the seed crystal seat located between the two, and a driving device capable of driving the pressure plate (4) to move in the up and down directions, the pressure plate (4) comprising a pressure plate body (41) arranged in the cavity (23) and a pressure rod (42) slidably connected to the blocking portion, the pressure rod (42) being fixed to the upper end of the pressure plate body (41) and being controlled by the driving device, the pressure plate (4) having a first state, a second state and a second state. The third state is that when the pressure plate (4) is in the first state, the pressure plate body (41) abuts against the seed crystal seat and has a tendency to press the seed crystal seat downward; when the pressure plate (4) is in the second state, the pressure plate body (41) is not in contact with the seed crystal seat and the lifting member (2); when the pressure plate (4) is in the third state, the blocking portion limits the separation of the pressure plate body (41) and the lifting member (2), so that the pressure plate body (41) abuts against the lifting member (2) and has a tendency to pull the lifting member (2) upward; and, A cooling ring (3) is arranged on the outside of the seed crystal seat and is connected to a cooling gas source, and an injection hole (31) is provided on the inside of the cooling ring for ejecting cooling gas to cool the seed crystal seat.

11. The seed crystal hot-pressing bonding mechanism according to claim 10, characterized in that: The seed crystal seat body (51) has an outwardly protruding shoulder (511), and the hanging portion (24) is located below the shoulder (511) and can abut against the shoulder (511).

12. The seed crystal hot-pressing bonding mechanism according to claim 11, characterized in that: The shoulder (511) is located on the outer periphery of the seed crystal seat body (51) and is a truncated cone structure; and / or, The hanging part (24) is in a circular ring structure.

13. The seed crystal hot-pressing bonding mechanism according to claim 10, characterized in that: The side of the lifting member (2) is provided with one or two loading and unloading openings (21) for taking in and placing the seed crystal seat; and / or, The lifting member (2) is provided with a plurality of weight-reducing openings (22).

14. A seed crystal hot pressing bonding mechanism, characterized in that: include: A carrier (1), the carrier (1) being used to carry a seed crystal seat, the seed crystal seat comprising a seed crystal seat body (51), a seed crystal sheet (52) and an adhesive located therebetween; A lifting member (2), the lifting member (2) being a lifting ring, the lifting ring comprising an annular portion (25) detachably connected to the seed crystal seat body (51) and a guide column (26) extending in the up-down direction, the guide column (26) comprising a plurality of guide columns (26) arranged in the circumferential direction around the annular portion (25), one end of the guide column (26) being connected to the annular portion (25); A pressure plate assembly, the pressure plate assembly comprising a pressure plate (4) disposed above the carrier (1) and used to cooperate with the carrier (1) to press the seed crystal seat located therebetween, and a driving device capable of driving the pressure plate (4) to move in an up-and-down direction, the pressure plate (4) comprising a pressure plate body (41) slidably connected to the guide column (26) and a pressure rod (42) connected above the pressure plate body (41), and controlled by the driving device, the pressure plate body (41) having a pressing state of abutting against the seed crystal seat and pressing the seed crystal seat downward, and a pulling state of pulling the guide column (26) upward so that the suspension ring brings the seed crystal seat away from the carrier (1); A heat shield (7), the heat shield (7) is rotatably arranged above the carrier (1), and has a heat insulating state between the carrier (1) and the seed crystal seat and an initial state away from the carrier (1) and the seed crystal seat.

15. The seed crystal hot-pressing bonding mechanism according to claim 14, characterized in that: The seed crystal seat body (51) has an outwardly convex shoulder (511), and the annular portion (25) is located below the shoulder (511) and can abut against the shoulder (511); and / or, The pressure plate body (41) is provided with a through hole (411), and the other end of the guide column (26) passes through the through hole (411) and has an abutment portion thereon that can abut against the pressure plate body (41).

16. The seed crystal hot-compression bonding mechanism according to any one of claims 10 to 15, characterized in that: The seed crystal hot-pressing bonding mechanism further includes an induction coil (12) disposed in the carrier (1); and / or, The seed crystal hot-pressing bonding mechanism further comprises an ultrasonic generator (6) arranged on the pressure rod (42) or the pressure plate body (41).

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