Mechanical behavior test device based on transient thermal load

By designing a mechanical behavior test device based on transient heat load, using high-temperature and high-pressure and low-temperature low-pressure loops to simulate the mechanical behavior of the reactor structure under transient quenching conditions, the problem of difficulty in effectively evaluating structural safety in such operating conditions is solved, and effective evaluation of structural integrity and safety and accident mitigation are achieved.

CN119845557AActive Publication Date: 2025-04-18NUCLEAR POWER INSTITUTE OF CHINA
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Patent Information

Application Number
CN202411889341.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-20
Publication Date
2025-04-18
Estimated Expiration
2044-12-20

AI Technical Summary

Technical Problem

The reactor first-loop structure may deform or crack under transient thermal loads, threatening the safety of the structure and posing a risk of radioactive material leakage. It is difficult for the prior art to effectively simulate and evaluate the mechanical behavior under such operating conditions.

Method used

A mechanical behavior test device based on transient heat load was designed. The test piece was applied to the test piece through the high-temperature and high-pressure circuit and the low-temperature and low-pressure circuit to simulate the transient quenching working condition and obtain the mechanical behavior of the test piece under transient heat load.

Benefits of technology

The device can effectively simulate the mechanical behavior of the reactor structure under transient thermal loads, provide theoretical and technical support for structural integrity, safety evaluation and accident mitigation, and reduce the risk of radioactive substance leakage.

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Abstract

The invention provides a transient thermal load-based mechanical behavior test device, which comprises a loading system, a second test piece, a low-temperature low-pressure loop, a high-temperature high-pressure loop and a first test piece, and is characterized in that the second test piece is mounted on the loading system, and an electric heating wire is wound on the second test piece; the second test piece is connected with the low-temperature low-pressure loop; the loading system applies an axial stress load to the second test piece, the electric heating wire applies a high-temperature load to the second test piece, and the low-temperature and low-pressure loop applies a low-temperature load to the second test piece so as to simultaneously apply the axial stress to the second test piece and simulate the mechanical behavior under the transient thermal load condition; the first test piece is connected with the high-temperature and high-pressure loop and the low-temperature and low-pressure loop. The transient thermal load borne by the test body can be simulated by using the high-temperature loop and the low-temperature loop, and theoretical technical support is provided for structural integrity evaluation, safety evaluation, accident alleviation and the like.
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Description

Technical Field

[0001] The present application belongs to the technical field of mechanical behavior testing of reactor pressure vessels, and in particular relates to a mechanical behavior testing device based on transient thermal loads. Background Art

[0002] The primary circuit of the reactor is the core part of a nuclear power plant, and the structural safety of the primary circuit determines the safe operation capability of the nuclear power plant. During the operation of the reactor, key structural equipment will inevitably be affected by thermal stress caused by transient thermal loads, posing a potential threat to the long-term operation safety of the structure. For example, when a nuclear power plant has a loss of coolant accident and the pressure vessel is safely filled with water, a huge transient sudden cooling condition will be generated. The thermal load under the above transient conditions may cause significant deformation or even cracking of key structural equipment in the primary circuit, which seriously threatens the safe operation of the structural equipment and poses a risk of leakage of radioactive materials. Summary of the invention

[0003] Therefore, the technical problem to be solved in this application is to provide a mechanical behavior testing device based on transient thermal load, which can utilize two sets of high and low temperature circuits to simulate the transient thermal load borne by the test body, and provide theoretical and technical support for structural integrity evaluation, safety evaluation and accident mitigation.

[0004] In order to solve the above problems, the present application provides a mechanical behavior test device based on transient thermal load, comprising:

[0005] A loading system and a second test piece, wherein the second test piece is mounted on the loading system and an electric heating wire is wound around the second test piece;

[0006] A low-temperature and low-pressure circuit, wherein the second test piece is connected to the low-temperature and low-pressure circuit;

[0007] The loading system applies an axial stress load to the second test piece, the electric heating wire applies a high temperature load to the second test piece, and the low temperature and low pressure circuit applies a low temperature load to the second test piece, so as to simultaneously apply axial stress to the second test piece and simulate the mechanical behavior under transient thermal load conditions.

[0008] Optionally, the loading system includes a support frame, a second test piece is mounted on the support frame, a driving member is provided on the top of the support frame, a pressure end of the driving member passes through the top of the support frame and is connected to a loading member located on the inner side of the support frame, and the driving member drives the loading member to move to apply an axial stress load to the second test piece.

[0009] Optionally, the support frame includes a support column, and a slider is provided on the outer peripheral surface of the loader, the slider is connected to the support column, and the slider slides relative to the support column.

[0010] Optionally, a first pressure measuring assembly is provided between the pressure-applying end of the driving member and the loading member.

[0011] Optionally, the low-temperature and low-pressure circuit includes a high-pressure cold water tank, and the high-pressure cold water tank is connected to the low-temperature medium inlet of the second test piece to apply a low-temperature load to the second test piece.

[0012] Optionally, the low-temperature and low-pressure circuit also includes a heat exchanger, a centrifugal pump and a normal-pressure water tank. The normal-pressure water tank outlet is connected to the heat exchanger through the centrifugal pump, and the heat exchanger outlet is connected to the high-pressure cold water tank. The normal-pressure water tank is used to replenish water to the high-pressure cold water tank.

[0013] Optionally, the test device also includes a high-temperature and high-pressure circuit and a first test piece, the first test piece being connected to the high-temperature and high-pressure circuit and the low-temperature and low-pressure circuit, respectively, the high-temperature and high-pressure circuit being used to pass a high-temperature liquid medium into the first test piece to apply a high-temperature load, and the low-temperature and low-pressure circuit being used to pass a low-temperature liquid medium into the first test piece to apply a low-temperature load, so as to form a transient thermal load in the first test piece, so as to simulate the mechanical behavior of the first test piece under the condition of applying a transient thermal load.

[0014] Optionally, the high-temperature and high-pressure circuit includes a heating pressurizer and a shielded pump, the first test piece includes a high-temperature and high-pressure medium inlet and a high-temperature and high-pressure medium outlet, the heating pressurizer outlet is connected to the high-temperature and high-pressure medium inlet of the first test piece through the shielded pump, and the high-temperature and high-pressure medium outlet of the second test piece is connected to the heating pressurizer inlet;

[0015] The first test piece also includes a low-temperature and low-pressure medium inlet and a low-temperature and low-pressure medium outlet. The high-pressure cold water tank and the heat exchanger are both connected to the low-temperature and low-pressure medium inlet of the first test piece, and the low-temperature and low-pressure medium outlet of the first test piece is connected to the normal pressure water tank.

[0016] Optionally, the low-temperature and low-pressure circuit further includes a regulating pipeline, one end of the regulating pipeline is connected to the atmospheric pressure water tank, and the other end of the regulating pipeline is connected to the heat exchanger.

[0017] Optionally, the test device further includes an air source and a water source, wherein the air source is connected to the heating voltage stabilizer and the high-pressure cold water tank respectively, and the water source is connected to the heating voltage stabilizer and the normal temperature water tank respectively.

[0018] Beneficial Effects

[0019] An embodiment of the present application provides a mechanical behavior testing device based on transient thermal loads, which applies high temperature and high pressure loads to a first test piece through a high temperature and high pressure circuit, and applies low temperature and low pressure loads to the first test piece through a low temperature and low pressure circuit, provides a transient sudden cooling condition to form a transient thermal load, and obtains the mechanical behavior of the first test piece under the transient thermal load, providing theoretical and technical support for integrity evaluation, safety evaluation and accident mitigation of the first test piece.

[0020] The embodiment of the present application provides a mechanical behavior testing device based on transient thermal load, which applies a high-temperature load to the second test piece by heating it with an electric heating wire, provides an axial stress load to the second test piece through a loading system, applies a low-temperature and low-pressure load to the second test piece through a low-temperature and low-pressure circuit, provides a transient sudden cooling condition to form a transient thermal load, and obtains the mechanical behavior of the second test piece under the transient thermal load, thereby providing theoretical and technical support for the integrity evaluation, safety evaluation and accident mitigation of the second test piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the structure of a mechanical behavior test device based on transient thermal load according to an embodiment of the present application;

[0022] Figure 2 This is a schematic diagram of the structure of a heating stabilizer according to an embodiment of the present application;

[0023] Figure 3 This is a schematic diagram of the structure of a high-pressure cold water tank according to an embodiment of the present application;

[0024] Figure 4 This is a schematic diagram of the structure of the first test piece of the embodiment of the present application;

[0025] Figure 5 This is a schematic diagram of the loading system structure of an embodiment of the present application.

[0026] The reference numerals are:

[0027] 1-loading system, 101-driving member; 102-top plate; 103-loading system pressure measuring assembly; 104-slider; 105-loading member; 106-bottom plate; 107-support column;

[0028] 2-heating stabilizer, 201-water inlet of heating stabilizer, 202-water outlet of heating stabilizer; 203-electric heating element; 204-air inlet of heating stabilizer; 205-pressure measuring component of stabilizer; 206-liquid level measuring component of stabilizer; 207-temperature measuring component of stabilizer;

[0029] 3-Shielded pump,

[0030] 4- Second test piece;

[0031] 5-first test piece, 501-high temperature medium inlet; 502-high temperature medium outlet; 503-low temperature medium inlet; 504-low temperature medium outlet; 505-first test piece temperature measuring component;

[0032] 6-high-pressure cold water tank; 601-water inlet of high-pressure cold water tank; 602-water outlet of high-pressure cold water tank; 603-pressure measuring assembly of high-pressure cold water tank; 604-gas inlet of high-pressure cold water tank;

[0033] 7-normal pressure water tank;

[0034] 8- Centrifugal pump;

[0035] 9-Heat exchanger;

[0036] 10- Gas source;

[0037] 11- Water source;

[0038] 1201 - the first valve; 1202 - the second valve; 1203 - the third valve; 1204 - the fourth valve; 1205 - the fifth valve; 1206 - the sixth valve; 1207 - the seventh valve; 1208 - the eighth valve; 1209 - the ninth valve; 1210 - the tenth valve. DETAILED DESCRIPTION

[0039] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0041] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0043] See also Figures 1 to 5 As shown, according to an embodiment of the present application, a mechanical behavior test device based on transient thermal load is provided, comprising a loading system 1, a low-temperature and low-pressure circuit, and a second test piece 4, wherein the second test piece 4 is mounted on the loading system 1; an electric heating wire is wound axially on the outer peripheral surface of the second test piece 4; and the second test piece 4 is connected to the low-temperature and low-pressure circuit;

[0044] The loading system 1 applies an axial stress load to the second test piece 4, the electric heating wire applies a high temperature load to the second test piece 4, and the low-pressure and low-temperature circuit applies a low-temperature load to the second test piece 4, so as to simultaneously apply axial stress to the second test piece 4 and simulate the mechanical behavior under transient thermal load conditions.

[0045] The second test piece 4 is heated by an electric heating wire to apply a high-temperature load, an axial stress load is provided to the second test piece 4 by the loading system 1, and a low-temperature and low-pressure load is applied to the second test piece 4 by a low-temperature and low-pressure circuit. A transient sudden cooling condition is provided to form a transient thermal load, and the mechanical behavior of the second test piece 4 under the transient thermal load is obtained, providing theoretical and technical support for the integrity evaluation, safety evaluation and accident mitigation of the second test piece 4.

[0046] The second test piece 4 includes a medium inlet, and the low-temperature and low-pressure circuit is connected to the medium inlet of the second test piece 4 to provide a sudden cooling condition.

[0047] Specifically, the second test piece 4 is a tubular normal pressure test piece. Furthermore, the second test piece 4 is provided with a second test piece temperature measuring component and a second test piece strain measuring component. The temperature and pressure of the second test piece 4 during the experiment are measured by the second test piece temperature measuring component and the second test piece strain measuring component.

[0048] Specifically, the design temperature of the low-temperature and low-pressure circuit is 355°C and the design pressure is 17MPa.

[0049] The loading system 1 includes a support frame, on which a second test piece 4 is mounted, and a driving member 101 is arranged on the top of the support frame. The pressure end of the driving member 101 passes through the top of the support frame and is connected to a loading member 105 located on the inner side of the support frame. The driving member 101 drives the loading member 105 to move so as to apply an axial stress load to the second test piece 4.

[0050] Among them, the driving member 101 is controlled by a hydraulic system to drive the piston rod of the driving member 101 to extend or retract. That is to say, the piston rod of the driving member 101 is controlled by the hydraulic system to extend and drive the loading member 105 to move toward the side of the normal pressure test piece 11, thereby applying an axial stress load to the normal pressure test piece 11; the piston rod of the driving member 101 is controlled by the hydraulic system to retract and drive the loading member 105 to move toward the side away from the normal pressure test piece 11, thereby separating from the normal pressure test piece 11. The loading system 1 in the present application has the advantages of simple structure, convenient operation and stable loading.

[0051] In this embodiment, the pressure test piece 101 is a hydraulic cylinder, and hydraulic oil is introduced into the cylinder body through a hydraulic system to realize the loading of axial stress.

[0052] The loading member 105 is a loading disc. In order to reduce the weight of the loading member 105, hollow portions are arranged at equal intervals along the circumferential direction on the loading disc.

[0053] The support frame includes a support column 107 . A slider 104 is disposed on the outer peripheral surface of the loading member 105 . The slider 104 is connected to the support column 107 , and the slider 104 slides relative to the support column 107 .

[0054] The slider 104 is provided on the loading member 105 to cooperate with the support column 107 to limit the rotational freedom of the loading member 105 , so that during the loading process, the loading member 105 can only move in the axial direction under the drive of the driving member 101 .

[0055] Specifically, the number of the sliders 104 is 4, which are arranged along the circumference of the loading member 105 .

[0056] The support frame further includes a top plate 102 and a bottom plate 106. Through holes are provided at the corners of the top plate 102 and the bottom plate 106. The two ends of the support column 107 pass through the through holes on the top plate 102 and the bottom plate 106, respectively, and then are fixed by bolts. The driving member 101, the loading member 105 and the second test member 4 are supported by the support frame.

[0057] Specifically, the number of the support columns 107 is 4, which is the same as the number of the sliders 104, so as to ensure that the force on each point of the loading member 105 is uniform during the loading process.

[0058] Specifically, in order to achieve lightweight support frame, the top plate 102 and the bottom plate 106 are provided with hollows.

[0059] A loading system pressure measuring component 103 is provided between the pressure-applying end of the driving component 101 and the loading component 105 , and the magnitude of the axial stress applied to the driving component 101 is measured by the loading system pressure measuring component 103 .

[0060] The loading system pressure measuring component 101 is a force sensor.

[0061] The low temperature and low pressure circuit includes a high pressure cold water tank 6, which is connected to the medium inlet of the second test piece 4 to apply a low temperature load to the second test piece 4. The high pressure cold water tank 6 is used to provide the second test piece 4 with a quenching condition.

[0062] Among them, the high-pressure cold water tank 6 includes a high-pressure cold water tank outlet 602, the low-temperature and low-pressure circuit includes a low-temperature and low-pressure main pipe, and the high-pressure cold water tank outlet 602 of the high-pressure cold water tank 6 is connected to the medium inlet of the second test piece 4 through the low-temperature and low-pressure main pipe.

[0063] Specifically, a tenth valve 1210 is provided on the low-temperature and low-pressure main pipe, and the flow rate of the fluid flowing from the high-pressure cold water tank 6 into the second test piece 4 is controlled by adjusting the opening of the tenth valve 1210 .

[0064] Specifically, the high-pressure cold water tank 6 is a vertical storage tank, and the high-pressure cold water tank 6 includes a high-pressure cold water tank water inlet 601. The high-pressure cold water tank 6 is replenished with water through the high-pressure cold water tank water inlet 601, and the medium in the high-pressure cold water tank 6 is discharged through the drain port.

[0065] Specifically, the high-pressure cold water tank 6 also includes a high-pressure cold water tank safety valve interface for installing a high-pressure cold water tank exhaust valve, exhausting air through the high-pressure cold water tank exhaust valve, and then adjusting the internal pressure of the high-pressure cold water tank 6.

[0066] Specifically, the high-pressure cold water tank 6 also includes a high-pressure cold water tank pressure measuring component 603 and a high-pressure cold water tank liquid level measuring component. The high-pressure cold water tank pressure measuring component 603 is used to monitor the internal pressure of the high-pressure cold water tank 6. If the pressure is higher than the allowable pressure value, the high-pressure cold water tank exhaust valve is opened to exhaust. The high-pressure cold water tank liquid level measuring component is used to monitor the liquid level of the liquid medium in the high-pressure cold water tank 6.

[0067] The low-temperature and low-pressure circuit also includes a heat exchanger 9, a centrifugal pump 8 and a normal-pressure water tank 7. The outlet of the normal-pressure water tank 7 is connected to the heat exchanger 9 through the centrifugal pump 8, and the outlet of the heat exchanger 9 is connected to the high-pressure cold water tank 6. The normal-pressure water tank 7 is used to replenish the medium to the high-pressure cold water tank 6.

[0068] Among them, a ninth valve 1209 is installed on the connecting pipeline between the heat exchanger 9 and the high-pressure cold water tank 6. By opening the ninth valve 1209, the medium can be replenished to the high-pressure cold water tank 6 through the normal pressure water tank 7, and the low-temperature medium in the high-pressure cold water tank 6 can also be passed into the first test piece 5 by opening the ninth valve 1209.

[0069] Specifically, the atmospheric pressure water tank 7 is a horizontal storage tank.

[0070] Specifically, the atmospheric pressure water tank 7 includes a water tank outlet, and the water outlet of the atmospheric pressure water tank 7 is connected to the inlet of the centrifugal pump 8.

[0071] The test device also includes a high-temperature and high-pressure circuit and a first test piece 5. The first test piece 5 is connected to the high-temperature and high-pressure circuit and the low-temperature and low-pressure circuit respectively. The high-temperature and high-pressure circuit is used to pass a high-temperature liquid medium into the first test piece 5 to apply a high-temperature load. The low-temperature and low-pressure circuit is used to pass a low-temperature liquid medium into the first test piece 5 to apply a low-temperature load, so as to form a transient thermal load in the first test piece 5, so as to simulate the mechanical behavior of the first experimental body 5 under the condition of applying a transient thermal load.

[0072] High temperature and high pressure loads are applied to the first test piece 5 through a high temperature and high pressure circuit, and low temperature and low pressure loads are applied to the first test piece 5 through a low temperature and low pressure circuit, so as to provide a transient sudden cooling condition to form a transient thermal load, and obtain the mechanical behavior of the first test piece 5 under the transient thermal load, so as to provide theoretical and technical support for the integrity evaluation, safety evaluation and accident mitigation of the first test piece 5.

[0073] The first test piece 5 is a pressure test piece, and the first test piece 5 and the second test piece 4 are not subjected to mechanical behavior simulation under transient thermal load conditions at the same time.

[0074] Among them, the high-temperature and high-pressure circuit has a design temperature of 355°C and a design pressure of 17MPa.

[0075] The high-temperature and high-pressure circuit includes a heating pressurizer 2 and a shielded pump 3. The first test piece 5 includes a high-temperature and high-pressure medium inlet 501 and a high-temperature and high-pressure medium outlet 502. The outlet of the heating pressurizer 2 is connected to the high-temperature and high-pressure medium inlet 501 of the first test piece 5 through the shielded pump 3, and the high-temperature and high-pressure medium outlet 502 of the first test piece 5 is connected to the inlet of the heating pressurizer 2. The shielded pump 3 provides a driving force to pass the high-temperature liquid medium into the first test piece 5, and a circulation is formed in the first test piece 5, so as to apply a high-temperature and high-pressure load to the first test piece 5.

[0076] The first test piece 5 also includes a low-temperature and low-pressure medium inlet 503 and a low-temperature and low-pressure medium outlet 504. The high-pressure cold water tank 6 and the heat exchanger 9 are both connected to the low-temperature and low-pressure medium inlet 503 of the first test piece 5. The low-temperature and low-pressure medium outlet 504 of the first test piece 5 is connected to the atmospheric pressure water tank 7. The low-temperature liquid medium is introduced into the first test piece 5 through the high-pressure cold water tank 6 to provide a sudden cooling condition to form a transient heat load condition; when the low-temperature medium in the high-pressure cold water tank 6 drops below the test set value, a low-temperature circulation loop is formed by the atmospheric pressure water tank 7, the centrifugal pump 3, the heat exchanger 9 and the first test piece 5, and the first test piece 5 continues to be cooled to form a transient heat load.

[0077] Among them, a sixth valve 1206 is arranged on the connecting pipeline between the heat exchanger 9 and the first test piece 5; a fifth valve 1205 is arranged on the connecting pipeline between the atmospheric pressure water tank 7 and the first test piece 5, and the flow rate of the low-temperature medium entering the first test piece 5 from the high-pressure cold water tank 6 can be controlled by adjusting the opening of the fifth valve 1205; a second valve 1202 is arranged on the connecting pipeline between the heating stabilizer 2 and the first test piece 5.

[0078] Specifically, the first test piece 5 and the second test piece 4 do not perform mechanical behavior simulations under transient thermal load conditions at the same time. That is, when the first test piece 5 is subjected to mechanical behavior simulations under transient thermal load conditions, the tenth valve 1210 on the low-temperature and low-pressure main pipe is always closed; when the second test piece 4 is subjected to mechanical behavior simulations under transient thermal load conditions, the fifth valve 1205 and the sixth valve 1206 are always closed.

[0079] The first test piece 5 also includes a first test piece temperature measuring assembly 505, a first test piece pressure measuring assembly and a first test piece side liquid level assembly, which are all arranged on the tank body of the first test piece 5. The temperature and pressure of the first test piece 5 are measured by the first test piece temperature measuring assembly 505 and the first test piece pressure measuring assembly, so as to monitor the temperature and pressure changes of the first test piece 5 in real time during the test. The first test piece side liquid level assembly is used to measure the liquid level of the liquid medium passed into the first test piece 5.

[0080] Among them, the atmospheric pressure water tank 7 includes a first water return port of the atmospheric pressure water tank 7, and the first water return port of the atmospheric pressure water tank 7 is connected to the first test piece 5, and is used to combine the centrifugal pump 8 and the heat exchanger 9 to form a low-temperature and low-pressure circulation loop.

[0081] The normal pressure water tank 7 further comprises a normal pressure water tank liquid level measuring component, through which the liquid level height of the liquid medium in the normal pressure water tank 7 is measured.

[0082] Among them, the heating stabilizer 2 includes a heating stabilizer water outlet 202, the heating stabilizer 2 is connected to the inlet of the shielding pump 3 through the heating stabilizer water outlet 202, and the high-temperature and high-pressure medium outlet 502 of the first test piece 5 is connected to the heating stabilizer return water port of the heating stabilizer 2.

[0083] Specifically, the heating stabilizer 2 further includes an electric heating element 203 , the heating end of the electric heating element 203 extends to the inner cavity of the heating stabilizer 2 , and is used to heat and increase the temperature of the liquid in the inner cavity of the heating stabilizer 2 .

[0084] Specifically, the heating pressurizer 2 also includes a heating pressurizer safety valve interface for installing a heating pressurizer exhaust valve, and the internal pressure of the heating pressurizer 2 is adjusted by opening the heating pressurizer exhaust valve.

[0085] Specifically, the heating rate of the heating stabilizer 2 is up to 40°C / h, the temperature control accuracy is ±5°C, and the pressure control accuracy is ±0.5MPa.

[0086] Among them, the heating stabilizer 2 also includes a heating stabilizer pressure measuring component 205, a heating stabilizer temperature measuring component 207 and a heating stabilizer liquid level measuring component 206. The heating stabilizer pressure measuring component 205, the heating stabilizer temperature measuring component 207 and the heating stabilizer liquid level measuring component 206 are respectively arranged on the shell of the heating stabilizer 2. The heating stabilizer pressure measuring component 205 is used to monitor the pressure in the heating stabilizer 2 in real time to avoid the danger caused by excessive pressure value in the heating stabilizer 2; the heating stabilizer temperature measuring component 207 is used to measure the liquid temperature in the heating stabilizer 2 to ensure that the heating stabilizer 2 heats its internal liquid to the set temperature; the heating stabilizer liquid level measuring component 206 is used to measure the liquid position in the heating stabilizer 2 so as to replenish the liquid in the heating stabilizer 2 in time.

[0087] A first valve 1201 is provided on the connecting pipeline between the shielded pump 3 and the first test piece 5 , and the flow rate of the high-temperature liquid medium flowing into the first test piece 5 is controlled by controlling the opening of the first valve 1201 .

[0088] A branch pipe is provided on the connecting pipeline between the heating stabilizer 2 and the shielded pump 3, and a third valve 1203 is installed on the branch pipe. During the circulation process, the third valve 1203 is used to fine-tune the liquid level and pressure in the heating stabilizer 2.

[0089] Specifically, the gas introduced into the high-pressure cold water tank 6 and the heating stabilizer 2 through the gas source 10 is nitrogen.

[0090] The low-temperature and low-pressure circuit also includes a regulating pipeline, one end of which is connected to the atmospheric pressure water tank 7 , and the other end of which is connected to the heat exchanger 9 .

[0091] The atmospheric pressure water tank 7 further comprises a second water return port of the water tank, and a regulating pipeline is arranged between the heat exchanger 9 and the second water return port of the atmospheric pressure water tank 7 .

[0092] Specifically, an eighth valve 1208 is provided on the regulating pipeline; when the first test piece 5 is cooled by circulating through the low-temperature and low-pressure circuit 2, the flow rate of the low-temperature medium entering the first test piece 5 is controlled by adjusting the eighth valve 1208, thereby controlling the cooling rate.

[0093] The test device also includes an air source 10 and a water source 11. The air source 10 is connected to the heating pressurizer 2 and the high-pressure cold water tank 6, respectively, and the water source 11 is connected to the heating pressurizer 2 and the normal temperature water tank 7, respectively. By introducing a gas medium into the heating pressurizer 2 and the high-pressure cold water tank 6, a high-pressure environment is formed in the heating pressurizer 2 and the high-pressure cold water tank 6. By introducing a liquid medium into the heating pressurizer 2 and the normal temperature water tank 7, water replenishment of the heating pressurizer 2 and the normal temperature water tank 7 is achieved.

[0094] Among them, the gas source 10 is connected to the heating stabilizer 2 and the high-pressure cold water tank 6 respectively, that is, the gas source 10 is connected to the heating stabilizer 2 and the high-pressure cold water tank 6 respectively through a gas pipeline; here the gas pipeline consists of a gas main pipe, a first gas branch pipe and a second gas branch pipe, wherein one end of the gas main pipe is connected to the gas source 10, and the other end is connected to the first gas branch pipe and the second gas branch pipe respectively.

[0095] Specifically, the high-pressure cold water tank 6 further includes a high-pressure cold water tank gas inlet, which is connected to the second gas branch pipe and is used to pass the gas medium into the high-pressure cold water tank 6 to form a high pressure inside the high-pressure cold water tank 6. The heating regulator 2 further includes a heating regulator air inlet 204, which is connected to the first gas branch pipe and is used to pass the gas medium into the heating regulator pump 2 to form a high pressure inside the heating regulator 2.

[0096] In this embodiment, the gas medium is nitrogen.

[0097] Among them, the water source 11 is respectively connected to the heating stabilizer 2 and the normal temperature water tank 7, that is, the water source 11 is respectively connected to the heating stabilizer 2 and the normal temperature water tank 7 through a water supply pipe; here the water supply pipe consists of a water supply main pipe, a first water supply branch and a second water supply branch, wherein one end of the water supply main pipe is connected to the water source 11, and the other end is respectively connected to the first water supply branch and the second water supply branch.

[0098] Specifically, the atmospheric pressure water tank 7 also includes a water tank inlet, which is connected to the second water replenishment branch for replenishing liquid medium into the atmospheric pressure water tank 7. While replenishing water into the atmospheric pressure water tank 7, liquid medium can be replenished into the high-pressure cold water tank 6; the heating stabilizer 2 also includes a heating stabilizer water inlet 201, which is connected to the first water replenishment branch for replenishing liquid medium into the heating stabilizer 2.

[0099] In this embodiment, the liquid medium is deionized water.

[0100] Specifically, a fourth valve 1204 is installed at the water inlet 201 of the heating pressurizer. When the fourth valve 1204 is opened, the supplementary medium can be introduced into the heating pressurizer 2 through the water source 11 .

[0101] The test device also includes a control system, the output end of the control system is respectively connected to the driving part 101, the heating stabilizer 2, the shielded pump 3, the centrifugal pump 8, the first valve 1201, the second valve 1202, the third valve 1203, the fourth valve 1204, the fifth valve 1205, the sixth valve 1206, the seventh valve 1207, the eighth valve 1208, the ninth valve 1209, and the tenth valve 1210, and the input end of the control system is respectively connected to the loading system pressure measuring component 103, the second test piece temperature measuring component, the second test piece strain measuring component, the stabilizer pressure measuring component 205, the stabilizer liquid level measuring component 206, the stabilizer temperature measuring component 207, the first test piece temperature measuring component 505, the first test piece pressure measuring component, the first test piece liquid level measuring component, the atmospheric pressure water tank liquid level measuring component, the high-pressure cold water tank pressure measuring component 603 and the high-pressure cold water tank liquid level measuring component to achieve automatic control and monitoring.

[0102] In this embodiment, the loading system pressure measuring assembly 103, the stabilizer pressure measuring assembly 205, the first test piece pressure measuring assembly, and the high-pressure cold water tank pressure measuring assembly 603 are all pressure sensors. In other embodiments, other types of pressure measuring sensors can be selected according to specific circumstances.

[0103] In this embodiment, the strain measuring component of the second test piece is a strain gauge.

[0104] In this embodiment, the second test piece temperature measuring component, the voltage regulator temperature measuring component 207, and the first test piece temperature measuring component 505 are all temperature sensors. In other embodiments, other types of temperature measuring sensors can be selected according to specific circumstances.

[0105] In this embodiment, the stabilizer liquid level measuring assembly 206, the first test piece liquid level measuring assembly, the atmospheric pressure water tank liquid level measuring assembly, and the high pressure cold water tank liquid level measuring assembly are all liquid level gauges. In other embodiments, other types of liquid level measuring sensors can be selected according to specific circumstances.

[0106] Specifically, the first test piece 5 is subjected to a mechanical behavior test under transient thermal load through a high-temperature and high-pressure circuit and a low-temperature and low-pressure circuit:

[0107] Step S1, connect the water supply pipe to the water source, open the fourth valve 1204, and supply deionized water to the heating stabilizer 2 through the water supply pipe; open the first valve 1201, and start the shielded pump 3 to supply deionized water to the first test piece 5;

[0108] When the liquid level in the heating stabilizer 2 reaches the test set value, the fourth valve 1204 is closed; when the liquid level in the first test piece 5 reaches the test set value, the first valve 1201 and the shielded pump 3 are closed;

[0109] Open the seventh valve 1207 and replenish deionized water into the atmospheric pressure water tank 7 through the water supply pipe;

[0110] Open the ninth valve 1209, start the centrifugal pump 8, the centrifugal pump 8 cools the deionized water in the atmospheric pressure water tank 7 through the heat exchanger 9, and then delivers it to the high-pressure cold water tank 8, replenishing the high-pressure cold water tank 8 with low-temperature deionized water. When the liquid levels in the high-pressure cold water tank 8 and the atmospheric pressure water tank 7 reach the test set value, close the ninth valve 1209 and the seventh valve 1207;

[0111] Step S2, supplying gas to the heating pressurizer 2 and the high-pressure cold water tank 6 respectively through a high-pressure nitrogen gas source, pressurizing the high-pressure cold water tank 6 and the heating pressurizer 2 to a test set value, and stopping pressurization;

[0112] Step S3, heating the deionized water in the heating stabilizer 2 by the electric heating element 203, starting the shielded pump 3, opening the first valve 1201 and the second valve 1202, forming a water medium circulation in the high temperature and high pressure loop, heating the first test piece 5, and fine-tuning the liquid level and pressure in the heating stabilizer 2 by the third valve 1203 during the circulation process;

[0113] When the internal temperature and pressure of the first test piece 5 reach the test set values, the electric heating element 203 is turned off, the shielded pump 3 is turned off, and the first valve 1201 and the second valve 1202 are closed;

[0114] A water medium circulation is formed in the high-temperature and high-pressure circuit. That is, the high-temperature deionized water in the heating stabilizer 2 enters from the inlet of the shielded pump 3, comes out from the outlet of the shielded pump 3, enters the first test piece 5 through the high-temperature medium inlet 501, flows out from the high-temperature medium outlet 502 of the first test piece 5, and returns to the heating stabilizer 2 through the return water port of the heating stabilizer 2, forming a high-temperature and high-pressure circuit.

[0115] Step S4, opening the ninth valve 1209 and the sixth valve 1206, discharging the low-temperature deionized water in the high-pressure cold water tank 6 into the first test piece 5 through the high-pressure cold water tank outlet 602, providing a sudden cooling condition for the first test piece 5, and forming a transient heat load; controlling the flow rate of the low-temperature deionized water from the high-pressure cold water tank 6 into the first test piece 5 by adjusting the fifth valve 1205;

[0116] When the internal liquid level of the high-pressure cold water tank 6 drops below the test set value, the ninth valve 1209 is closed, and the fifth valve 1205 is opened to form a circulation in the low-temperature and low-pressure circuit 2 to cool the first test piece 5 and form a transient heat load; the flow rate of low-temperature deionized water entering the first test piece 5 is controlled by adjusting the eighth valve 1208, thereby controlling the cooling rate;

[0117] Step S5, during the test, the internal temperature and pressure of the first test piece 5 are measured by the first test piece pressure measuring assembly and the first test piece temperature measuring assembly 505 to obtain the mechanical behavior of the first test piece 5 under transient thermal load conditions.

[0118] Specifically, the mechanical behavior test under transient thermal load is performed on the second test piece 4 by using the low temperature and low pressure circuit in conjunction with the loading system 1:

[0119] Step S1, open the seventh valve 1207 and the ninth valve 1209, and start the centrifugal pump 8 at the same time. The centrifugal pump 8 cools the deionized water in the atmospheric water tank 7 through the heat exchanger 9, and then transports the deionized water into the high-pressure cold water tank 8 to replenish the high-pressure cold water tank 8 with low-temperature deionized water. When the liquid level inside the high-pressure cold water tank 8 reaches the test set value, close the ninth valve 1209 and the seventh valve 1207;

[0120] Step S2, heating the second test piece 4 by means of a heating wire, and then keeping the temperature after the temperature reaches a test set value;

[0121] Step S3, applying an axial stress load to the second test piece 4 through the loading system 1, and stopping the loading when the test set value is reached;

[0122] Step S4, turning off the electric heating wire and opening the tenth valve 1210, passing the low-temperature deionized water in the high-pressure cold water tank 6 into the second test piece 4, providing a sudden cooling condition for the second test piece 4, and forming a transient heat load;

[0123] Step S5, during the test, the temperature of the second test piece 4 is measured by the second test piece temperature measuring assembly, and the local strain of the second test piece 4 is measured by the strain gauge pasted on the surface of the second test piece 4 to obtain the mechanical behavior of the second test piece 4 under transient thermal load conditions.

[0124] It is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous methods can be freely combined and superimposed.

[0125] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application. The above are only preferred implementations of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present application, and these improvements and variations should also be regarded as the protection scope of the present application.

Claims

1. A mechanical behavior test device based on transient heat load, characterized in that include: A loading system (1) and a second test piece (4), wherein the second test piece (4) is mounted on the loading system (1), and an electric heating wire is wound around the second test piece (4); A low-temperature and low-pressure circuit, wherein the second test piece (4) is connected to the low-temperature and low-pressure circuit; The loading system (1) applies an axial stress load to the second test piece (4), the electric heating wire applies a high temperature load to the second test piece (4), and the low temperature and low pressure circuit applies a low temperature load to the second test piece (4), so as to simultaneously apply axial stress to the second test piece (4) and simulate the mechanical behavior under transient thermal load conditions.

2. A mechanical behavior test device based on transient heat load according to claim 1, characterized in that, The loading system (1) comprises a support frame, a second test piece (4) is mounted on the support frame, a driving member (101) is arranged on the top of the support frame, a pressure-applying end of the driving member (101) passes through the top of the support frame and is connected to a loading member (105) located on the inner side of the support frame, and the driving member (101) drives the loading member (105) to move so as to apply an axial stress load to the second test piece (4).

3. A mechanical behavior test device based on transient heat load according to claim 2, characterized in that The support frame comprises a support column (107); a slider (104) is arranged on the outer peripheral surface of the loading member (105); the slider (104) is connected to the support column (107), and the slider (104) slides relative to the support column (107).

4. A mechanical behavior test device based on transient heat load according to claim 2 or 3, characterized in that, A first pressure measuring assembly (103) is provided between the pressure-applying end of the driving member (101) and the loading member (105).

5. A mechanical behavior test device based on transient heat load according to claim 1, characterized in that The low-temperature and low-pressure circuit comprises a high-pressure cold water tank (6), and the high-pressure cold water tank (6) is connected to the low-temperature medium inlet of the second test piece (4) to apply a low-temperature load to the second test piece (4).

6. A mechanical behavior test device based on transient heat load according to claim 5, characterized in that The low-temperature and low-pressure circuit further comprises a heat exchanger (9), a centrifugal pump (8) and a normal-pressure water tank (7); the outlet of the normal-pressure water tank (7) is connected to the heat exchanger (9) via the centrifugal pump (8); the outlet of the heat exchanger (9) is connected to the high-pressure cold water tank (6); and the normal-pressure water tank (7) is used to replenish water to the high-pressure cold water tank (6).

7. A mechanical behavior test device based on transient heat load according to claim 6, characterized in that The test device also includes a high-temperature and high-pressure circuit and a first test piece (5), wherein the first test piece (5) is connected to the high-temperature and high-pressure circuit and the low-temperature and low-pressure circuit respectively, wherein the high-temperature and high-pressure circuit is used to pass a high-temperature liquid medium into the first test piece (5) to apply a high-temperature load, and the low-temperature and low-pressure circuit is used to pass a low-temperature liquid medium into the first test piece (5) to apply a low-temperature load, so as to form a transient thermal load in the first test piece (5), so as to simulate the mechanical behavior of the first test piece (5) under the condition of applying a transient thermal load.

8. A mechanical behavior test device based on transient heat load according to any one of claim 7, characterized in that The high temperature and high pressure circuit comprises a heating pressurizer (2) and a canned pump (3); the first test piece (5) comprises a high temperature and high pressure medium inlet (501) and a high temperature and high pressure medium outlet (502); the outlet of the heating pressurizer (2) is connected to the high temperature and high pressure medium inlet (501) of the first test piece (5) through the canned pump (3); the high temperature and high pressure medium outlet (502) of the second test piece (5) is connected to the inlet of the heating pressurizer (2); The first test piece (5) further comprises a low-temperature and low-pressure medium inlet (503) and a low-temperature and low-pressure medium outlet (504); the high-pressure cold water tank (6) and the heat exchanger (9) are both connected to the low-temperature and low-pressure medium inlet (503) of the first test piece (5); and the low-temperature and low-pressure medium outlet (504) of the first test piece (5) is connected to the normal-pressure water tank (7).

9. A mechanical behavior test device based on transient heat load according to claim 7, characterized in that The low-temperature and low-pressure circuit also includes a regulating pipeline, one end of which is connected to the atmospheric pressure water tank (7), and the other end of which is connected to the heat exchanger (9).

10. A mechanical behavior test device based on transient heat load according to claim 9, characterized in that The test device also includes an air source (10) and a water source (11), wherein the air source (10) is connected to the heating stabilizer (2) and the high-pressure cold water tank (6) respectively, and the water source (11) is connected to the heating stabilizer (2) and the normal temperature water tank (7) respectively.

Citation Information

Patent Citations

  • Heat exchanger performance test platform

    CN103983464A

  • Multi-dimensional safety monitoring method and device for nuclear turbine, electronic equipment and storage medium

    CN114412591A

  • Automatic pressure control method and system for reactor thermal hydraulic transient test system

    CN115599150A

  • Double-loop circulating hydrothermal fatigue test device and hydrothermal fatigue test method

    CN116296972A

  • Nuclear power plant thermal fatigue monitoring method and system

    CN118675773A