Computer power supply and power supply method

Abstract

The invention relates to a computer power supply and a power supply method, and belongs to the technical field of computer power supplies. According to the computer power supply and the power supply method, the computer power supply comprises a power supply top shell, a power supply interface is installed on one side of the power supply top shell in an embedded mode, and a module interface is installed on the other side of the power supply top shell in an embedded mode; the flow guide mechanism is installed at the lower end of the power supply top shell, and the surface of the flow guide mechanism extends to the position above the power supply top shell; the flow guide mechanism comprises an airflow guide assembly installed in the power supply top shell. The gas flow channel flows to the upper part of the power supply top shell from the lower part of the circuit board, so that the temperature of all parts in the power supply top shell can be quickly taken away, and meanwhile, the heat conduction pipe is matched with the heat dissipation cavity, so that an auxiliary cooling effect can be formed in the power supply top shell; electric data signal transmission in the power supply is stable, and the service life of the power supply is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of computer power supply, and in particular to a computer power supply and a power supply method. Background Art

[0002] Computers have become an indispensable tool for people's daily life, entertainment and office work, especially desktop computers. Compared with laptops, they have faster running speed, better heat dissipation and more stable performance, so they are popular among office workers. Most desktop computers are directly connected to the mains voltage. In the field of computer power supplies, full-module and semi-module are two common types of power supplies; Among them, the fully modular power supply is a high-level power supply type. Its biggest feature is that there is no output wire inside the power supply, and all power cables are connected to the power supply through the expansion interface. This design allows users to freely choose and connect the required power cables according to their needs, thus avoiding the constraints of redundant wires and making the wiring inside the chassis neater; After searching the Chinese patent "A spliced ​​computer power supply", the announcement number is "CN219320748U". The device dissipates heat for the power supply through a cooling fan installed at one end of the heat dissipation cavity, and the hot air flow above the circuit board is taken away by the fan. However, the internal electronic components of the device generate heat when working, and it is difficult to form a good air flow channel on the back of the circuit board. The generated heat cannot be dissipated in time. The accumulated heat caused by long-term overheating will affect the welding end on the back of the circuit board, making the transmission of electrical data signals inside the power supply unstable and reducing the service life of the power supply. Summary of the invention

[0003] Based on this, it is necessary to provide a computer power supply and power supply method in order to solve the problem that it is difficult to form a good airflow channel on the back of the circuit board, the heat generated will not be able to dissipate in time, and the accumulated heat caused by long-term overheating will affect the welding end on the back of the circuit board, making the transmission of electrical data signals inside the power supply unstable and reducing the service life of the power supply.

[0004] A computer power supply comprises: a power supply top shell, one side of which is embedded with a power supply interface, and the other side of which is embedded with a module interface; an air guide mechanism, which is installed at the lower end of the power supply top shell, and the surface of which extends to the top of the power supply top shell; wherein the air guide mechanism comprises an airflow guide component installed inside the power supply top shell, the upper end of the airflow guide component passes through the top of the power supply top shell, a temperature control and regulation component is installed inside the airflow guide component, the temperature control and regulation component is located at the upper end of the power supply top shell, two low-temperature auxiliary components are arranged inside the airflow guide component, the upper end of the low-temperature auxiliary component passes through the top of the power supply top shell, and the temperature control and regulation component is in contact with the surface of the low-temperature auxiliary component.

[0005] In one embodiment, the airflow guide assembly includes a power supply bottom shell fixedly connected to the inner side of the power supply top shell, an external frame is provided on the outside of the power supply bottom shell, a plurality of temperature-conducting airflow plates are fixedly connected between the external frame and the power supply bottom shell, an inner support frame is fixedly connected to the inner wall of the power supply bottom shell, a motor fan is fixedly connected to the upper end of the inner support frame, two sliding control plates are slidably connected to the inner bottom wall of the power supply bottom shell, and a circular positioning frame is provided on the outer sleeve of the motor fan.

[0006] In one embodiment, the temperature control and regulation component includes a top ring fixedly connected to the upper end of the circular ring positioning frame, the inner wall of the top ring is fixedly connected to an internal frame, the inner side of the top ring is rotatably connected to an inner connecting ring, the surface of the inner connecting ring is fixedly connected to an outer connecting ring, the outer connecting ring is rotatably connected to the surface of the top ring, an annular ring is embedded in the upper end of the internal frame, and two bimetallic spiral sheets are fixedly connected to the inner wall of the inner connecting ring.

[0007] In one embodiment, the low-temperature auxiliary component includes a heat dissipation cavity fixedly connected to the inner side of an external frame, the lower end of the heat dissipation cavity is connected to two conduits, a plurality of thermal conductive tubes are embedded and installed on the surface of the conduits, a nickel block is slidably connected to the inner wall of the thermal conductive tube, a magnetic block is slidably connected to the surface of the thermal conductive tube, and a movable frame is fixedly connected to the surface of the magnetic block.

[0008] In one embodiment, a cooling air inlet is opened at the lower end of the bottom shell of the power supply, and a parallel sliding tooth is fixedly connected to the lower end of the sliding control plate, and the surface of the parallel sliding tooth is slidably connected to the inner wall of the cooling air inlet, and the parallel sliding tooth is slidably connected to the surface of the temperature-conducting air flow plate.

[0009] In one embodiment, a clamping block is fixedly connected between the outer connecting ring and the inner connecting ring, an arc-shaped groove is formed on the inner wall of the top ring, and the clamping block is slidably connected to the inner wall of the arc-shaped groove.

[0010] In one of the embodiments, a plurality of groove wheels are arranged between two adjacent conduits, a rubber belt is sleeved on the surface of the groove wheels, and the movable frame is fixedly connected to the surface of the rubber belt.

[0011] In one of the embodiments, arc-shaped side shells are embedded and installed on both sides of the bottom shell of the power supply, and the two arc-shaped side shells are fixedly connected to the surface of the circular positioning frame.

[0012] In one of the embodiments, the other end of the bimetallic spiral sheet is fixedly connected to a middle positioning frame, and the middle positioning frame is fixedly connected to the inner wall of the annular ring.

[0013] In one of the embodiments, the upper ends of the two groove wheels are fixedly connected with a rotating shaft, and the upper ends of the surfaces of the rotating shaft are in contact with the surface of the temperature control and regulation component.

[0014] A computer power supply method: A1. The industrial frequency AC power sent from the substation is transmitted through a dedicated power supply line, which must not be connected to any power-consuming equipment that may cause interference; A2. Send it directly to the computer equipment, and then distribute it to various parts of the computer to ensure the stable operation of the computer equipment; A3. Add an isolation transformer after the AC line enters, and then send it to the internal circuit board of the power supply. The motor fan is powered by connecting the internal circuit board of the top shell of the power supply to the USB.

[0015] The computer power supply and power supply method described above can improve the heat generated by the power conversion rate inside the top shell of the power supply by setting the cooperation of the airflow guide component and the low-temperature auxiliary component, and can quickly remove the heat generated by the power conversion rate inside the top shell of the power supply when the diameter of the circular positioning frame is larger than the width of the top shell of the power supply, and cooperate with the air inlet flow channel of the airflow guide component to maintain the effect of continuous cooling of the circuit board. The gas flow channel flows from the bottom of the circuit board to the top of the top shell of the power supply, and can quickly remove the temperature of various places inside the top shell of the power supply. At the same time, the cooperation of the set temperature conducting pipe and the heat dissipation cavity can form an auxiliary cooling effect on the inside of the top shell of the power supply, so that the transmission of electrical data signals inside the power supply is stable, and the service life of the power supply is guaranteed; The device can form a control effect according to the temperature inside the top shell of the power supply through the temperature control and regulation components and the low-temperature auxiliary components. The device is affected by the changes in the temperature output by the motor fan through the bimetallic spiral blades, which will drive the nickel block to rotate, so that the low-temperature liquid in the heat dissipation cavity is pushed into the interior of the temperature conducting tube, thereby reducing the temperature of the temperature conducting tube and improving the control of the intake temperature, ensuring the relatively low temperature effect inside the top shell of the power supply, making the transmission of electrical data signals inside the power supply stable, and ensuring the service life of the power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the internal structure of the present invention; Figure 3 It is a schematic diagram of the structure of the flow guiding mechanism of the present invention; Figure 4 It is a cross-sectional view of the exploded structure of the airflow guide assembly of the present invention; Figure 5 It is a schematic diagram of the connection between the sliding control plate and the parallel sliding gear of the present invention; Figure 6 It is a schematic diagram of the positions of the motor fan and the circular ring positioning frame of the present invention; Figure 7 It is a cross-sectional view of the exploded structure of the temperature control and regulation component of the present invention; Figure 8 It is a schematic diagram of the connection between the internal frame and the annular ring of the present invention; Fig. 9 It is a schematic diagram of the structure of the low temperature auxiliary component of the present invention; Fig.10 It is a schematic diagram of the connection between the heat dissipation cavity and the conduit of the present invention; Fig.11 This is a schematic diagram of the local explosion structure of the low-temperature auxiliary component of the present invention; Fig.12 It is a schematic diagram of the position of the nickel block of the present invention.

[0018] Reference numerals: 100, power supply top shell; 200, power supply interface; 210, module interface; 300, air guide mechanism; 310, air flow guide assembly; 311, external frame; 312, power supply bottom shell; 3121, arc-shaped side shell; 313, temperature-conducting air flow plate; 314, inner support frame; 315, motor fan; 316, circular positioning frame; 317, cooling air inlet; 318, sliding control plate; 3181, parallel sliding gear; 320, temperature control assembly; 3 21. Top ring; 322. Internal frame; 3221. Annular ring; 323. Inner connecting ring; 324. Outer connecting ring; 325. Block; 326. Arc groove; 327. Bimetallic spiral sheet; 328. Middle positioning frame; 330. Low temperature auxiliary component; 331. Heat dissipation cavity; 332. Conduit; 333. Temperature conducting tube; 334. Nickel block; 335. Magnetic block; 336. Moving frame; 337. Rotating shaft; 338. Grooved wheel; 3381. Rubber belt. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are for illustrative purposes only and do not represent the only implementation method.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0022] In the present invention, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0023] Unless otherwise defined, all technical and scientific terms used in the specification of the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the specification of the present invention includes any and all combinations of one or more related listed items.

[0024] Combine the following Figure 1-Figure 12 The computer power supply of the present invention is described, comprising: a power supply top shell 100, a power supply interface 200 is embedded and installed on one side of the power supply top shell 100, and a module interface 210 is embedded and installed on the other side of the power supply top shell 100; a guide mechanism 300, the guide mechanism 300 is installed at the lower end of the power supply top shell 100, and the surface of the guide mechanism 300 extends to the top of the power supply top shell 100; wherein the guide mechanism 300 includes an airflow guide component 310 installed inside the power supply top shell 100, the upper end of the airflow guide component 310 penetrates to the top of the power supply top shell 100, a temperature control and regulation component 320 is installed inside the airflow guide component 310, the temperature control and regulation component 320 is located at the upper end of the power supply top shell 100, two low-temperature auxiliary components 330 are arranged inside the airflow guide component 310, the upper end of the low-temperature auxiliary component 330 penetrates the top of the power supply top shell 100, and the temperature control and regulation component 320 contacts the surface of the low-temperature auxiliary component 330; like Figure 1-7 As shown, the airflow guide assembly 310 includes a power supply bottom shell 312 fixedly connected to the inner side of the power supply top shell 100, an external frame 311 is arranged outside the power supply bottom shell 312, a plurality of temperature-conducting airflow plates 313 are fixedly connected between the external frame 311 and the power supply bottom shell 312, an inner support frame 314 is fixedly connected to the inner wall of the power supply bottom shell 312, a motor fan 315 is fixedly connected to the upper end of the inner support frame 314, two sliding regulating plates 318 are slidably connected to the inner bottom wall of the power supply bottom shell 312, and a circular positioning frame 316 is sleeved outside the motor fan 315; A cooling air inlet 317 is provided at the lower end of the power supply bottom shell 312, and a parallel sliding tooth 3181 is fixedly connected to the lower end of the sliding control plate 318. The surface of the parallel sliding tooth 3181 is slidingly connected to the inner wall of the cooling air inlet 317, and the parallel sliding tooth 3181 is slidingly connected to the surface of the temperature-conducting air flow plate 313. Arc-shaped side shells 3121 are embedded and installed on both sides of the power supply bottom shell 312, and the two arc-shaped side shells 3121 are fixedly connected to the surface of the circular positioning frame 316.

[0025] The power supply top shell 100 and the power supply bottom shell 312 are combined to form a relatively closed shell, wherein the inner bottom wall of the power supply bottom shell 312 is fixedly connected with two positioning nuts located in the middle, the circuit board is installed on the two positioning nuts, and then the two sliding adjustment plates 318 are moved, at this time the parallel sliding teeth 3181 slide on the concave side of the heat conduction air flow plate 313, and the circuit board is auxiliary positioned by the installation nuts on the upper ends of the two sliding adjustment plates 318; A ventilation hole cap is provided on the circuit board. The motor fan 315 is driven to cooperate with the circular positioning frame 316, so that the airflow moves to the bottom of the power supply bottom shell 312 through the heat-conducting airflow plate 313, and then the airflow blows toward the circuit board through the cooling air inlet 317. The airflow assists the electronic components on the circuit board through the ventilation hole cap. A gap is provided between the circuit board and the inner bottom wall of the power supply bottom shell 312. The airflow can take away the heat generated by the circuit board when it flows through. The device takes away the heat generated during operation by blowing the airflow to the circuit board. like Figure 1 , Figure 2 , Figure 3 , Figure 7 , Figure 8 , Fig. 9 As shown, the temperature control and regulation component 320 includes a top ring 321 fixedly connected to the upper end of the circular ring positioning frame 316, the inner wall of the top ring 321 is fixedly connected to the inner frame 322, the inner side of the top ring 321 is rotatably connected to the inner connecting ring 323, the surface of the inner connecting ring 323 is fixedly connected to the outer connecting ring 324, the outer connecting ring 324 is rotatably connected to the surface of the top ring 321, the upper end of the inner frame 322 is embedded with an annular ring 3221, and the inner wall of the inner connecting ring 323 is fixedly connected to two bimetallic spiral sheets 327; A clamping block 325 is fixedly connected between the outer connecting ring 324 and the inner connecting ring 323. An arc groove 326 is formed on the inner wall of the top ring 321. The clamping block 325 is slidably connected to the inner wall of the arc groove 326. The other end of the bimetallic spiral sheet 327 is fixedly connected to a middle positioning frame 328. The middle positioning frame 328 is fixedly connected to the inner wall of the annular ring 3221. When the airflow is driven by the motor fan 315 to blow upward, the hot airflow flows upward, and the airflow heated by the circuit board flows through the surface of the bimetallic spiral sheet 327, forming a heating operation on the bimetallic spiral sheet 327, wherein the bimetallic spiral sheet 327 is a bimetallic sheet used in a thermometer, and when the bimetallic spiral sheet 327 is affected by heat, it drives the inner connecting ring 323 to rotate, and the inner connecting ring 323 cooperates with the outer connecting ring 324 to rotate synchronously on the surface of the top ring 321, wherein the surface of the outer connecting ring 324 is provided with a plurality of notches; When the outer connecting ring 324 rotates, it drives the block 325 to rotate synchronously inside the arc groove 326. The arc groove 326 is used to limit the rotation angle of the block 325. The setting of the annular ring 3221 prevents the occurrence of a jam when the bimetallic spiral sheet 327 is deformed. The internal frame 322 is used to position the annular ring 3221 and guide the airflow. Therefore, when the motor fan 315 drives the airflow to be guided upward, when the airflow temperature is relatively low, the bimetallic spiral sheet 327 drives the inner connecting ring 323 and the outer connecting ring 324 to remain unchanged on the surface of the top ring 321. When the motor fan 315 takes out a lot of heat in the process of extracting the airflow, the relatively high temperature drives the inner connecting ring 323 and the outer connecting ring 324 to rotate on the surface of the top ring 321 through the bimetallic spiral sheet 327. When the outer connecting ring 324 rotates, the rotating shaft 337 is driven to rotate synchronously. like Figure 1 , Figure 2 , Figure 3 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 As shown, the low-temperature auxiliary component 330 includes a heat dissipation cavity 331 fixedly connected to the inner side of the external frame 311, the lower end of the heat dissipation cavity 331 is connected to two conduits 332, a plurality of temperature conducting tubes 333 are embedded and installed on the surface of the conduits 332, a nickel block 334 is slidably connected to the inner wall of the temperature conducting tube 333, a magnetic block 335 is slidably connected to the surface of the temperature conducting tube 333, a movable frame 336 is fixedly connected to the surface of the magnetic block 335, a plurality of groove wheels 338 are arranged between two adjacent conduits 332, a rubber belt 3381 is sleeved on the surface of the groove wheel 338, and the movable frame 336 is fixedly connected to the surface of the rubber belt 3381, wherein the upper ends of the two groove wheels 338 are fixedly connected to the rotating shaft 337, and the upper end of the surface of the rotating shaft 337 contacts the surface of the temperature control and regulation component 320; A rubber ring is sleeved on the upper end of the rotating shaft 337. The outer connecting ring 324 rotates to cooperate with the rubber ring on the upper end of the rotating shaft 337, so that the rotating shaft 337 rotates and drives the two fixedly connected groove wheels 338 to rotate synchronously. At this time, the rubber belt 3381 drives the moving frame 336 to move horizontally, and the movement of the moving frame 336 drives the magnetic block 335 to move on the surface of the temperature conducting tube 333. In the process of the airflow moving through the temperature conducting tube 333 toward the rotating shaft 337, the airflow contacts the surface of the temperature conducting tube 333, and the temperature conducting tube 333 assists in cooling the lower part of the circuit board and the introduced airflow. At the same time, due to the heat generated by the circuit board, the temperature of the temperature conducting tube 333 gradually rises, affecting the cooling effect. At this time, the movement of the magnetic block 335 drives the nickel block 334 to move in the temperature conducting tube 333. At this time, the movement of the nickel block 334 pushes the relatively high-temperature liquid medium inside the temperature conducting tube 333 into the heat dissipation cavity 331 through the conduit 332 on one side, so that the relatively low-temperature medium in the heat dissipation cavity 331 can flow back to the interior of the temperature conducting tube 333 through the conduit 332 at the other end, thereby assisting in cooling the lower end of the circuit board and the incoming airflow. The liquid inside the heat dissipation cavity 331 will then be auxiliary cooled when the airflow enters the temperature-conducting airflow plate 313, wherein the end of the heat dissipation cavity 331 can be set to a retractable rubber material, and after the temperature discharged by the motor fan 315 drops, the bimetallic spiral blade 327 can be reset, and the low-temperature auxiliary component 330 can guide the low-temperature liquid back again.

[0026] A computer power supply method: A1. The industrial frequency AC power sent from the substation is transmitted through a dedicated power supply line, which must not be connected to any power-consuming equipment that may cause interference; A2. Send it directly to the computer equipment, and then distribute it to various parts of the computer to ensure the stable operation of the computer equipment; A3. Add an isolation transformer after the AC line enters, and then send it to the internal circuit board of the power supply. The motor fan 315 is directly powered by connecting the internal circuit board of the top shell 100 of the power supply to the USB.

[0027] When the device is in use: the circuit board is mounted on the two positioning nuts, and then the two sliding adjustment plates 318 are moved, and the parallel sliding teeth 3181 slide on the concave side of the temperature-conducting air flow plate 313, and the mounting nuts on the two sliding adjustment plates 318 position the circuit board, and the motor fan 315 cooperates with the circular ring positioning frame 316 to blow air through the cooling air inlet 317 toward the circuit board, so as to cool down the electronic components on the circuit board, and there is a gap between the circuit board and the inner bottom wall of the power supply bottom shell 312, and the air flow takes away the heat generated by the circuit board when it flows through; the motor fan 315 drives the air flow to blow upward, and the air flow heated by the circuit board flows through the surface of the bimetallic spiral sheet 327, and the heat affects the bimetallic spiral sheet 327 to drive the inner connecting ring 323 and the outer connecting ring 324 to rotate, and at the same time drives the block 325 to rotate synchronously inside the arc groove 326; The inner frame 322 positions the annular ring 3221 and guides the airflow. When the motor fan 315 guides the airflow and brings out a large amount of heat, the relatively high temperature drives the inner connecting ring 323 and the outer connecting ring 324 to rotate on the surface of the top ring 321 through the bimetallic spiral sheet 327. The rotation of the outer connecting ring 324 cooperates with the rubber sleeve on the upper end of the rotating shaft 337. The rotating shaft 337 rotates and drives the two fixedly connected groove wheels 338 to rotate synchronously. The rubber belt 3381 drives the moving frame 33 6 Horizontal movement, through the movement of the moving frame 336, drives the magnetic block 335 to move on the surface of the thermal tube 333; the movement of the magnetic block 335 drives the nickel block 334 to move inside the thermal tube 333, and the movement of the nickel block 334 will push the relatively high-temperature liquid medium inside the thermal tube 333 into the heat dissipation cavity 331 through the one side conduit 332, and the relatively low-temperature medium in the heat dissipation cavity 331 flows back to the interior of the thermal tube 333 through the other end of the conduit 332, so as to assist in cooling the lower end of the circuit board and the incoming airflow.

[0028] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0029] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A computer power supply, characterized in that: include: A power supply top shell (100), wherein a power supply interface (200) is embedded and installed on one side of the power supply top shell (100), and a module interface (210) is embedded and installed on the other side of the power supply top shell (100); A flow guiding mechanism (300), the flow guiding mechanism (300) being installed at the lower end of the top shell (100) of the power supply, and the surface of the flow guiding mechanism (300) extending to the top of the top shell (100) of the power supply; The air guide mechanism (300) comprises an airflow guide component (310) installed inside the top shell (100) of the power supply, the upper end of the airflow guide component (310) passes through the top of the top shell (100) of the power supply, a temperature control and regulation component (320) is installed inside the airflow guide component (310), the temperature control and regulation component (320) is located at the upper end of the top shell (100) of the power supply, two low-temperature auxiliary components (330) are arranged inside the airflow guide component (310), the upper end of the low-temperature auxiliary component (330) passes through the top of the top shell (100) of the power supply, and the temperature control and regulation component (320) contacts the surface of the low-temperature auxiliary component (330).

2. The computer power supply according to claim 1, characterized in that: The airflow guide component (310) comprises a power supply bottom shell (312) fixedly connected to the inner side of the power supply top shell (100); an external frame (311) is arranged outside the power supply bottom shell (312); a plurality of heat-conducting airflow plates (313) are fixedly connected between the external frame (311) and the power supply bottom shell (312); an inner support frame (314) is fixedly connected to the inner wall of the power supply bottom shell (312); a motor fan (315) is fixedly connected to the upper end of the inner support frame (314); two sliding control plates (318) are slidably connected to the inner bottom wall of the power supply bottom shell (312); and a circular positioning frame (316) is sleeved on the outer side of the motor fan (315).

3. The computer power supply according to claim 2, characterized in that: The temperature control and regulation component (320) comprises a top ring (321) fixedly connected to the upper end of the circular ring positioning frame (316); the inner wall of the top ring (321) is fixedly connected to an inner frame (322); the inner side of the top ring (321) is rotatably connected to an inner connecting ring (323); the surface of the inner connecting ring (323) is fixedly connected to an outer connecting ring (324); the outer connecting ring (324) is rotatably connected to the surface of the top ring (321); an annular ring (3221) is embedded and installed at the upper end of the inner frame (322); and two bimetallic spiral sheets (327) are fixedly connected to the inner wall of the inner connecting ring (323).

4. The computer power supply according to claim 2, characterized in that: The low-temperature auxiliary component (330) comprises a heat dissipation cavity (331) fixedly connected to the inner side of the external frame (311); the lower end of the heat dissipation cavity (331) is connected to two conduits (332); a plurality of heat conducting tubes (333) are embedded and installed on the surface of the conduits (332); a nickel block (334) is slidably connected to the inner wall of the heat conducting tube (333); a magnetic block (335) is slidably connected to the surface of the heat conducting tube (333); and a movable frame (336) is fixedly connected to the surface of the magnetic block (335).

5. The computer power supply according to claim 2, characterized in that: A cooling air inlet (317) is provided at the lower end of the power supply bottom shell (312); a parallel sliding tooth (3181) is fixedly connected to the lower end of the sliding control plate (318); the surface of the parallel sliding tooth (3181) is slidably connected to the inner wall of the cooling air inlet (317); and the parallel sliding tooth (3181) is slidably connected to the surface of the heat conduction air flow plate (313).

6. The computer power supply according to claim 3, characterized in that: A clamping block (325) is fixedly connected between the outer connecting ring (324) and the inner connecting ring (323); an arc-shaped groove (326) is provided on the inner wall of the top ring (321); and the clamping block (325) is slidably connected to the inner wall of the arc-shaped groove (326).

7. The computer power supply according to claim 4, characterized in that: A plurality of groove wheels (338) are provided between two adjacent conduits (332), a rubber belt (3381) is sleeved on the surface of the groove wheels (338), and the movable frame (336) is fixedly connected to the surface of the rubber belt (3381).

8. The computer power supply according to claim 2, characterized in that: Arc-shaped side shells (3121) are embedded and installed on both sides of the power supply bottom shell (312), and the two arc-shaped side shells (3121) are fixedly connected to the surface of the circular ring positioning frame (316).

9. The computer power supply according to claim 3, characterized in that: The other end of the bimetallic spiral sheet (327) is fixedly connected to a middle positioning frame (328), and the middle positioning frame (328) is fixedly connected to the inner wall of the annular ring (3221).

10. The computer power supply according to claim 7, characterized in that: The upper ends of the two groove wheels (338) are fixedly connected to a rotating shaft (337), and the upper surface of the rotating shaft (337) is in contact with the surface of the temperature control and regulation component (320).

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