A computer power supply and a power supply method

Abstract

The present invention relates to a computer power supply and a power supply method, belonging to the technical field of computer power supplies. The computer power supply and the power supply method include: a top shell of the power supply, on one side of which a power interface is embedded, and on the other side of which a module interface is embedded; a flow guiding mechanism, which is installed at the lower end of the top shell of the power supply, and the surface of which extends above the top shell of the power supply; wherein, the flow guiding mechanism includes an air flow guiding component installed inside the top shell of the power supply; maintaining the effect of continuously cooling the circuit board. The gas flow channel flows below the circuit board and upward to the top shell of the power supply, which can quickly take away the temperature of various parts inside the top shell of the power supply. At the same time, the cooperation of the temperature guiding tube and the heat dissipation cavity can form an auxiliary cooling effect on the inside of the top shell of the power supply, making the transmission of electrical data signals inside the power supply stable and ensuring the service life of the power supply.

Description

Technical Field

[0001] The present invention relates to the technical field of computer power supplies, and particularly to a computer power supply and a power supply method. Background Art

[0002] Computers have become an essential tool for people's life, entertainment and work. Especially for desktop computers, compared with laptops, they have faster running speeds, better heat dissipation and stable performance, so they are favored by office workers. Most desktop computers are directly connected to the mains voltage. In the field of computer power supplies, fully modular and semi-modular are two common power supply types;

[0003] Among them, the fully modular power supply is a high-level power supply type. Its biggest feature is that there are no output wires led out inside the power supply, and all power supply wires are connected to the power supply through expansion interfaces. This design allows users to freely select and connect the required power supply wires according to their own needs, thus avoiding the bondage of redundant wires and making the wiring inside the chassis more tidy;

[0004] After retrieving the Chinese patent "A spliced computer power supply" with the publication number "CN219320748U", the device dissipates heat from the power supply through a cooling fan installed at one end of the cooling cavity, and the hot air flow above the circuit board is taken away by the fan. However, when the internal electronic components of the device are working, heat is generated, and it is difficult to form a good air flow channel on the back of the circuit board, and the generated heat will not be dissipated in time. The accumulated heat caused by long-term overheating will affect the soldering ends on the back of the circuit board, making the transmission of electrical data signals inside the power supply unstable and reducing the service life of the power supply. Summary of the Invention

[0005] Based on this, it is necessary to provide a computer power supply and a power supply method for the problem that it is difficult to form a good air flow channel on the back of the circuit board, the generated heat will not be dissipated in time, the accumulated heat caused by long-term overheating will affect the soldering ends on the back of the circuit board, making the transmission of electrical data signals inside the power supply unstable and reducing the service life of the power supply.

[0006] A computer power supply, comprising: a power supply top shell, with a power supply interface embedded and installed on one side of the power supply top shell, and a module interface embedded and installed on the other side of the power supply top shell; a flow guiding mechanism, which is installed at the lower end of the power supply top shell, and the surface of the flow guiding mechanism extends above the power supply top shell; wherein, the flow guiding mechanism includes an air flow guiding component installed inside the power supply top shell, the upper end of the air flow guiding component penetrates above the power supply top shell, a temperature control and regulation component is installed inside the air flow guiding component, the temperature control and regulation component is located at the upper end of the power supply top shell, two low-temperature auxiliary components are arranged inside the air flow guiding component, the upper ends of the low-temperature auxiliary components penetrate above the power supply top shell, the surface of the temperature control and regulation component is in contact with the low-temperature auxiliary components, the temperature control and regulation component includes a top ring fixedly connected to the upper end of a circular ring positioning frame, an inner frame is fixedly connected to the inner wall of the top ring, an inner connecting ring is rotatably connected to the inner side of the top ring, an outer connecting ring is fixedly connected to the surface of the inner connecting ring, the outer connecting ring is rotatably connected to the surface of the top ring, a circular ring is embedded and installed at the upper end of the inner frame, two bimetallic spiral sheets are fixedly connected to the inner wall of the inner connecting ring, the low-temperature auxiliary component includes a heat dissipation cavity fixedly connected to the inner side of an outer frame, two conduits are communicated with the lower end of the heat dissipation cavity, a plurality of temperature guiding tubes are embedded and installed on the surface of the conduits, a nickel block is slidably connected to the inner wall of the temperature guiding tube, a magnetic block is slidably connected to the surface of the temperature guiding tube, and a moving frame is fixedly connected to the surface of the magnetic block;

[0007] A plurality of sheave wheels are arranged between two adjacent ones of the conduits, a rubber belt is sleeved on the surface of the sheave wheels, the moving frame is fixedly connected to the surface of the rubber belt, and a rotating shaft is fixedly connected to the upper ends of two of the sheave wheels, and the upper end surface of the rotating shaft is in contact with the outer edge surface of the temperature control and regulation component.

[0008] In one embodiment, the air flow guiding component includes a power supply bottom shell fixedly connected to the inner side of the power supply top shell, an outer frame is arranged outside the power supply bottom shell, a plurality of temperature guiding air flow plates are fixedly connected between the outer frame and the power supply bottom shell, an inner support frame is fixedly connected to the inner wall of the power supply bottom shell, a motor fan is fixedly connected to the upper end of the inner support frame, two sliding regulation plates are slidably connected to the inner bottom wall of the power supply bottom shell, and a circular ring positioning frame is sleeved outside the motor fan.

[0009] In one embodiment, a cooling air inlet is opened at the lower end of the power supply bottom shell, a parallel sliding tooth is fixedly connected to the lower end of the sliding regulation plate, the surface of the parallel sliding tooth is slidably connected to the inner wall of the cooling air inlet, and the parallel sliding tooth is slidably connected to the surface of the temperature guiding air flow plate.

[0010] In one embodiment, a clamping block is fixedly connected between the outer connecting ring and the inner connecting ring, an arc-shaped groove is formed on the inner wall of the top ring, and the clamping block is slidably connected to the inner wall of the arc-shaped groove.

[0011] In one of the embodiments, arc-shaped side shells are embedded and installed on both sides of the bottom shell of the power supply, and the two arc-shaped side shells are fixedly connected to the surface of the circular positioning frame.

[0012] In one of the embodiments, the other end of the bimetallic spiral sheet is fixedly connected to a middle positioning frame, and the middle positioning frame is fixedly connected to the inner wall of the annular ring.

[0013] A computer power supply method:

[0014] A1. The industrial frequency AC power sent from the substation is transmitted through a dedicated power supply line, which must not be connected to any power-consuming equipment that may cause interference;

[0015] A2. Send it directly to the computer equipment, and then distribute it to various parts of the computer to ensure the stable operation of the computer equipment;

[0016] A3. Add an isolation transformer after the AC line enters, and then send it to the internal circuit board of the power supply. The motor fan is powered by connecting the internal circuit board of the top shell of the power supply to the USB.

[0017] The computer power supply and power supply method described above can improve the heat generated by the power conversion rate inside the top shell of the power supply by setting the cooperation of the airflow guide component and the low-temperature auxiliary component, and can quickly remove the heat generated by the power conversion rate inside the top shell of the power supply when the diameter of the circular positioning frame is larger than the width of the top shell of the power supply, and cooperate with the air inlet flow channel of the airflow guide component to maintain the effect of continuous cooling of the circuit board. The gas flow channel flows from the bottom of the circuit board to the top of the top shell of the power supply, and can quickly remove the temperature of various places inside the top shell of the power supply. At the same time, the cooperation of the set temperature conducting pipe and the heat dissipation cavity can form an auxiliary cooling effect on the inside of the top shell of the power supply, so that the transmission of electrical data signals inside the power supply is stable, and the service life of the power supply is guaranteed;

[0018] The device can form a control effect according to the temperature inside the top shell of the power supply through the temperature control and regulation components and the low-temperature auxiliary components. The device is affected by the changes in the temperature output by the motor fan through the bimetallic spiral blades, which will drive the nickel block to rotate, so that the low-temperature liquid in the heat dissipation cavity is pushed into the interior of the temperature conducting tube, thereby reducing the temperature of the temperature conducting tube and improving the control of the intake temperature, ensuring the relatively low temperature effect inside the top shell of the power supply, making the transmission of electrical data signals inside the power supply stable, and ensuring the service life of the power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] To more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the attached drawings required for the description of the embodiments or the prior art. Obviously, the attached drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other attached drawings can also be obtained based on these attached drawings.

[0020] Figure 1 Structural schematic diagram of the present invention;

[0021] Figure 2 Internal structural schematic diagram of the present invention;

[0022] Figure 3 Structural schematic diagram of the diversion mechanism of the present invention;

[0023] Figure 4 Exploded cross-sectional view of the air flow guiding assembly of the present invention;

[0024] Figure 5 Schematic diagram of the connection between the sliding control plate and the parallel sliding teeth of the present invention;

[0025] Figure 6 Schematic diagram of the position of the motor fan and the circular ring positioning frame of the present invention;

[0026] Figure 7 Exploded cross-sectional view of the temperature control and regulation component of the present invention;

[0027] Figure 8 Schematic diagram of the connection between the internal frame and the annular ring of the present invention;

[0028] Figure 9 Structural schematic diagram of the low-temperature auxiliary component of the present invention;

[0029] Figure 10 Schematic diagram of the connection between the heat dissipation cavity and the conduit of the present invention;

[0030] Figure 11 Partial exploded structural schematic diagram of the low-temperature auxiliary component of the present invention;

[0031] Figure 12 Schematic diagram of the position of the nickel block of the present invention.

[0032] 100. Power top case; 200. Power interface; 210. Module interface; 300. Flow guiding mechanism; 310. Airflow guiding component; 311. External frame; 312. Power bottom case; 3121. Arc side case; 313. Temperature guiding air plate; 314. Inner support frame; 315. Motor fan; 316. Ring positioning frame; 317. Cooling air inlet; 318. Sliding control plate; 3181. Parallel sliding teeth; 320. Temperature control component; 321. Top ring; 322. Inner frame; 3221. Ring; 323. Inner connection ring; 324. Outer connection ring; 325. Clamping block; 326. Arc groove; 327. Bimetallic spiral; 328. Middle positioning frame; 330. Low temperature auxiliary component; 331. Heat dissipation cavity; 332. Duct; 333. Temperature guiding pipe; 334. Nickel block; 335. Magnet; 336. Moving frame; 337. Rotating shaft; 338. Grooved pulley; 3381. Rubber belt. Detailed implementation mode

[0033] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0034] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or there may also be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the description of the present invention are only for the purpose of illustration and do not represent the only implementation manner.

[0035] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0036] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first feature is in direct contact with the second feature, or the first feature is in indirect contact with the second feature through an intermediate medium. Moreover, the first feature being "above", "over" or "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" or "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0037] Unless otherwise defined, all technical and scientific terms used in the description of the present invention have the same meaning as commonly understood by those skilled in the technical field to which the present invention pertains. The terms used in the description of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the description of the present invention includes any and all combinations of one or more of the related listed items.

[0038] The following will be combined with Figures 1 - 12 Describe the computer power supply of the present invention, including: a power supply top shell 100, a power supply interface 200 is embedded and installed on one side of the power supply top shell 100, and a module interface 210 is embedded and installed on the other side of the power supply top shell 100; a flow guiding mechanism 300, the flow guiding mechanism 300 is installed at the lower end of the power supply top shell 100, and the surface of the flow guiding mechanism 300 extends above the power supply top shell 100; wherein, the flow guiding mechanism 300 includes an air flow guiding component 310 installed inside the power supply top shell 100, the upper end of the air flow guiding component 310 penetrates above the power supply top shell 100, a temperature control and regulation component 320 is installed inside the air flow guiding component 310, the temperature control and regulation component 320 is located at the upper end of the power supply top shell 100, two low-temperature auxiliary components 330 are arranged inside the air flow guiding component 310, the upper ends of the low-temperature auxiliary components 330 penetrate above the power supply top shell 100, and the surface of the temperature control and regulation component 320 is in contact with the low-temperature auxiliary components 330;

[0039] As Figures 1 - 7 As shown, the air flow guiding component 310 includes a power supply bottom shell 312 fixedly connected to the inner side of the power supply top shell 100, an external frame 311 is arranged outside the power supply bottom shell 312, a plurality of temperature guiding air flow plates 313 are fixedly connected between the external frame 311 and the power supply bottom shell 312, an inner support frame 314 is fixedly connected to the inner wall of the power supply bottom shell 312, a motor fan 315 is fixedly connected to the upper end of the inner support frame 314, two sliding regulation plates 318 are slidably connected to the inner bottom wall of the power supply bottom shell 312, and a circular ring positioning frame 316 is sleeved outside the motor fan 315;

[0040] At the lower end of the power supply bottom case 312, a cooling air inlet 317 is provided. At the lower end of the sliding control board 318, parallel sliding teeth 3181 are fixedly connected. The surface of the parallel sliding teeth 3181 is slidably connected to the inner wall of the cooling air inlet 317, and the parallel sliding teeth 3181 are slidably connected to the surface of the heat conduction air flow plate 313. Arc-shaped side cases 3121 are embedded and installed on both sides of the power supply bottom case 312, and the surface between the two arc-shaped side cases 3121 is fixedly connected to the surface of the circular ring positioning frame 316.

[0041] The power supply top case 100 and the power supply bottom case 312 are combined to form a relatively enclosed outer shell. Among them, two positioning nuts located in the middle are fixedly connected to the inner bottom wall of the power supply bottom case 312. The circuit board is installed on the two positioning nuts, and then the two sliding control boards 318 are moved. At this time, the parallel sliding teeth 3181 slide on the concave side of the heat conduction air flow plate 313, and the circuit board is assisted in positioning through the mounting nuts at the upper ends of the two sliding control boards 318;

[0042] And ventilation hole caps are provided on the circuit board. Driven by the motor fan 315 and cooperating with the circular ring positioning frame 316, the air flow moves through the heat conduction air flow plate 313 to the lower part of the power supply bottom case 312, and then the air flow blows towards the circuit board through the cooling air inlet 317. Among them, the air flow blows the electronic components on the circuit board through the ventilation hole caps. There is a gap between the circuit board and the inner bottom wall of the power supply bottom case 312, and the heat generated by the circuit board can be taken away when the air flow passes through. This device blows air flow on the circuit board to take away the heat generated during operation;

[0043] As Figure 1 、 Figure 2 、 Figure 3 、 Figure 7 、 Figure 8 、 Figure 9 shown, the temperature control component 320 includes a top ring 321 fixedly connected to the upper end of the circular ring positioning frame 316. An internal frame 322 is fixedly connected to the inner wall of the top ring 321. An inner connecting ring 323 is rotatably connected to the inner side of the top ring 321. An outer connecting ring 324 is fixedly connected to the surface of the inner connecting ring 323. The outer connecting ring 324 is rotatably connected to the surface of the top ring 321. An annular ring 3221 is embedded and installed at the upper end of the internal frame 322. Two bimetallic spiral sheets 327 are fixedly connected to the inner wall of the inner connecting ring 323;

[0044] A block 325 is fixedly connected between the outer connecting ring 324 and the inner connecting ring 323. An arc-shaped groove 326 is provided on the inner wall of the top ring 321. The block 325 is slidably connected to the inner wall of the arc-shaped groove 326. The other end of the bimetallic spiral sheet 327 is fixedly connected to a middle positioning frame 328. The middle positioning frame 328 is fixedly connected to the inner wall of the annular ring 3221;

[0045] When the air flow is driven by the motor fan 315 to blow upward, the hot air flow is caused to flow upward, and the air flow heated by the circuit board flows through the surface of the bimetallic spiral 327, forming a heating operation on the bimetallic spiral 327. The bimetallic spiral 327 is a bimetallic strip used in a thermometer. When the bimetallic spiral 327 is affected by heat, it drives the inner connection ring 323 to rotate. The inner connection ring 323 cooperates with the outer connection ring 324 to rotate synchronously on the surface of the top ring 321. A plurality of notches are provided on the surface of the outer connection ring 324;

[0046] While the outer connection ring 324 rotates, it drives the block 325 to rotate synchronously inside the arc-shaped groove 326. The rotation angle of the block 325 is restricted by the provided arc-shaped groove 326, and the setting of the annular ring 3221 prevents jamming when the bimetallic spiral 327 deforms. The internal frame 322 provided positions the annular ring 3221 and guides the air flow. Thus, when the motor fan 315 drives the air flow to be exported upward, when the air flow temperature is relatively low, the bimetallic spiral 327 drives the inner connection ring 323 and the outer connection ring 324 to remain unchanged on the surface of the top ring 321;

[0047] When the motor fan 315 exports the air flow and brings out a large amount of heat, at this time, the relatively high temperature causes the bimetallic spiral 327 to drive the inner connection ring 323 and the outer connection ring 324 to rotate on the surface of the top ring 321. When the outer connection ring 324 rotates, it drives the rotating shaft 337 to rotate synchronously;

[0048] As Figure 1 、 Figure 2 、 Figure 3 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 shown, the low-temperature auxiliary component 330 includes a heat dissipation cavity 331 fixedly connected to the inner side of the outer frame 311. Two conduits 332 communicate with the lower end of the heat dissipation cavity 331. A plurality of temperature conduction tubes 333 are embedded and installed on the surface of the conduit 332. A nickel block 334 is slidably connected to the inner wall of the temperature conduction tube 333. A magnetic block 335 is slidably connected to the surface of the temperature conduction tube 333. A moving frame 336 is fixedly connected to the surface of the magnetic block 335. A plurality of sheave wheels 338 are provided between adjacent two conduits 332. A rubber belt 3381 is sleeved on the surface of the sheave wheel 338. The moving frame 336 is fixedly connected to the surface of the rubber belt 3381. The upper ends of two of the sheave wheels 338 are fixedly connected with a rotating shaft 337. The upper end surface of the rotating shaft 337 contacts the outer edge surface of the temperature control and regulation component 320;

[0049] A rubber ring is sleeved on the upper end of the rotating shaft 337. The outer connecting ring 324 rotates to cooperate with the rubber ring on the upper end of the rotating shaft 337, so that the rotating shaft 337 rotates and drives the two fixedly connected groove wheels 338 to rotate synchronously. At this time, the rubber belt 3381 drives the moving frame 336 to move horizontally, and the movement of the moving frame 336 drives the magnetic block 335 to move on the surface of the temperature conducting tube 333.

[0050] In the process of the airflow moving through the temperature conducting tube 333 toward the rotating shaft 337, the airflow contacts the surface of the temperature conducting tube 333, and the temperature conducting tube 333 assists in cooling the lower part of the circuit board and the introduced airflow. At the same time, due to the heat generated by the circuit board, the temperature of the temperature conducting tube 333 gradually rises, affecting the cooling effect. At this time, the movement of the magnetic block 335 drives the nickel block 334 to move in the temperature conducting tube 333. At this time, the movement of the nickel block 334 pushes the relatively high-temperature liquid medium inside the temperature conducting tube 333 into the heat dissipation cavity 331 through the conduit 332 on one side, so that the relatively low-temperature medium in the heat dissipation cavity 331 can flow back to the interior of the temperature conducting tube 333 through the conduit 332 at the other end, thereby assisting in cooling the lower end of the circuit board and the incoming airflow.

[0051] The liquid inside the heat dissipation cavity 331 will then be auxiliary cooled when the airflow enters the temperature-conducting airflow plate 313, wherein the end of the heat dissipation cavity 331 can be set to a retractable rubber material, and after the temperature discharged by the motor fan 315 drops, the bimetallic spiral blade 327 can be reset, and the low-temperature auxiliary component 330 can guide the low-temperature liquid back again.

[0052] A computer power supply method:

[0053] A1. The industrial frequency AC power sent from the substation is transmitted through a dedicated power supply line, which must not be connected to any power-consuming equipment that may cause interference;

[0054] A2. Send it directly to the computer equipment, and then distribute it to various parts of the computer to ensure the stable operation of the computer equipment;

[0055] A3. Add an isolation transformer after the AC line enters, and then send it to the internal circuit board of the power supply. The motor fan 315 is directly powered by connecting the internal circuit board of the top shell 100 of the power supply to the USB.

[0056] When the device is in use: Install the circuit board on two positioning nuts, and then move two sliding control plates 318. The parallel sliding teeth 3181 slide on the concave side of the heat-conducting air flow plate 313. The mounting nuts on the two sliding control plates 318 position the circuit board. The driving motor fan 315 cooperates with the circular ring positioning frame 316 to blow air through the cooling air inlet 317 towards the circuit board, blowing and cooling the electronic components on the circuit board. There is a gap between the circuit board and the inner bottom wall of the power supply bottom case 312. When the air flow passes through, it takes away the heat generated by the circuit board; the motor fan 315 drives the air flow to blow upward. The air flow heated by the circuit board flows through the surface of the bimetallic spiral sheet 327. The heat affects the bimetallic spiral sheet 327 to drive the inner connecting ring 323 and the outer connecting ring 324 to rotate, and at the same time drives the block 325 to rotate synchronously inside the arc-shaped groove 326;

[0057] The internal frame 322 positions the annular ring 3221 and guides the air flow. When the motor fan 315 exports the air flow and takes away a large amount of heat, the relatively high temperature drives the inner connecting ring 323 and the outer connecting ring 324 to rotate on the surface of the top ring 321 through the bimetallic spiral sheet 327. The rotation of the outer connecting ring 324 cooperates with the rubber sleeve on the upper end of the rotating shaft 337. The rotating shaft 337 rotates and drives the two fixedly connected grooved pulleys 338 to rotate synchronously. The rubber belt 3381 drives the moving frame 336 to move horizontally. The movement of the moving frame 336 drives the magnet 335 to move on the surface of the heat-conducting pipe 333; the movement of the magnet 335 drives the nickel block 334 to move inside the heat-conducting pipe 333. The movement of the nickel block 334 will push the relatively high-temperature liquid medium inside the heat-conducting pipe 333 into the heat dissipation cavity 331 through a side conduit 332. The relatively low-temperature medium in the heat dissipation cavity 331 flows back into the inside of the heat-conducting pipe 333 through the conduit 332 at the other end, assisting in cooling the lower end of the circuit board and the incoming air flow.

[0058] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as within the scope described in this specification.

[0059] The above-described embodiments only express several implementation manners of the present invention. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A computer power supply, characterized in that, Including: A power supply top shell (100), on one side of the power supply top shell (100), a power supply interface (200) is embedded and installed, and on the other side of the power supply top shell (100), a module interface (210) is embedded and installed; A flow guiding mechanism (300), the flow guiding mechanism (300) is installed at the lower end of the power supply top shell (100), and the surface of the flow guiding mechanism (300) extends above the power supply top shell (100); Wherein, the flow guiding mechanism (300) includes an air flow guiding component (310) installed inside the power supply top shell (100), the upper end of the air flow guiding component (310) penetrates above the power supply top shell (100), a temperature control and regulation component (320) is installed inside the air flow guiding component (310), the temperature control and regulation component (320) is located at the upper end of the power supply top shell (100), two low-temperature auxiliary components (330) are arranged inside the air flow guiding component (310), the upper ends of the low-temperature auxiliary components (330) penetrate above the power supply top shell (100), the surface of the temperature control and regulation component (320) is in contact with the surface of the low-temperature auxiliary components (330), the temperature control and regulation component (320) includes a top ring (321) fixedly connected to the upper end of a circular ring positioning frame (316), an inner frame (322) is fixedly connected to the inner wall of the top ring (321), an inner connecting ring (323) is rotatably connected to the inner side of the top ring (321), an outer connecting ring (324) is fixedly connected to the surface of the inner connecting ring (323), the outer connecting ring (324) is rotatably connected to the surface of the top ring (321), an annular ring (3221) is embedded and installed at the upper end of the inner frame (322), two bimetallic spiral sheets (327) are fixedly connected to the inner wall of the inner connecting ring (323), the low-temperature auxiliary component (330) includes a heat dissipation cavity (331) fixedly connected to the inner side of an outer frame (311), two conduits (332) are communicated with the lower end of the heat dissipation cavity (331), a plurality of temperature guiding tubes (333) are embedded and installed on the surface of the conduit (332), a nickel block (334) is slidably connected to the inner wall of the temperature guiding tube (333), a magnetic block (335) is slidably connected to the surface of the temperature guiding tube (333), and a moving frame (336) is fixedly connected to the surface of the magnetic block (335); A plurality of sheave wheels (338) are arranged between two adjacent conduits (332), a rubber belt (3381) is sleeved on the surface of the sheave wheel (338), the moving frame (336) is fixedly connected to the surface of the rubber belt (3381), and the upper ends of two of the sheave wheels (338) are fixedly connected with a rotating shaft (337), and the upper surface of the rotating shaft (337) is in contact with the outer edge surface of the temperature control and regulation component (320).

2. The computer power supply according to claim 1, characterized in that, The air flow guiding assembly (310) includes a power supply bottom case (312) fixedly connected to the inner side of the top case (100) of the power supply. An external frame (311) is arranged outside the power supply bottom case (312). A plurality of temperature guiding air flow plates (313) are fixedly connected between the external frame (311) and the power supply bottom case (312). An inner support frame (314) is fixedly connected to the inner wall of the power supply bottom case (312). A motor fan (315) is fixedly connected to the upper end of the inner support frame (314). Two sliding control plates (318) are slidably connected to the inner bottom wall of the power supply bottom case (312). A circular ring positioning frame (316) is sleeved outside the motor fan (315).

3. The computer power supply according to claim 2, characterized in that, A cooling air inlet (317) is opened at the lower end of the power supply bottom case (312). A parallel sliding tooth (3181) is fixedly connected to the lower end of the sliding control plate (318). The surface of the parallel sliding tooth (3181) is slidably connected to the inner wall of the cooling air inlet (317). The parallel sliding tooth (3181) is slidably connected to the surface of the temperature guiding air flow plate (313).

4. The computer power supply according to claim 1, wherein A clamping block (325) is fixedly connected between the outer connecting ring (324) and the inner connecting ring (323). An arc-shaped groove (326) is opened on the inner wall of the top ring (321). The clamping block (325) is slidably connected to the inner wall of the arc-shaped groove (326).

5. The computer power supply according to claim 2, wherein Arc-shaped side cases (3121) are embedded and installed on both sides of the power supply bottom case (312). The surface of the circular ring positioning frame (316) is fixedly connected between the two arc-shaped side cases (3121).

6. The computer power supply according to claim 1, wherein The other end of the bimetallic spiral sheet (327) is fixedly connected to a middle positioning frame (328). The middle positioning frame (328) is fixedly connected to the inner wall of the annular ring (3221).

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