Vacuum compression mold for packaging large substrate

Abstract

The vacuum compression mold comprises an upper fixing plate and an upper base plate fixedly connected to the top of the upper fixing plate, an upper forming insert is arranged below the upper fixing plate, clamping jaw mechanisms are symmetrically connected to the two sides of the upper forming insert, and an upper surrounding plate is fixedly installed at the bottom of the upper forming insert; the bottom of the upper fixing plate is fixedly connected with a first lower fixing plate; a basic frame structure of the vacuum compression mold is formed by the upper base plate, the upper fixing plate, the upper forming insert, the upper surrounding plate, the lower surrounding plate, the first lower fixing plate, the second lower fixing plate and the lower forming insert, clamping of a frame is achieved through cooperation of the clamping jaw assemblies, elastic reset of the upper surrounding plate is achieved through arrangement of the upper limiting columns, rigid impact of the mold is reduced, and production efficiency is improved. The installation height of the mold is limited by arranging the installation limiting columns, safety and reliability of the mold are guaranteed while installation is facilitated, the lower surrounding plate is fixed by arranging the lower surrounding plate fixing plate, and accurate positioning of the lower forming insert is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of IC packaging and testing, in particular to a vacuum compression mold for packaging a large substrate. Background Art

[0002] With the advancement of technology, the integration of chips continues to increase, the number of I / O pins increases sharply, the power consumption also increases, and the requirements for integrated circuit packaging become more stringent; in order to meet the needs of development, BGA packaging began to be used in production. Compared with traditional packaging, BGA packaging has a faster and more effective heat dissipation path, and the thickness and weight are reduced compared with previous packaging technologies;

[0003] The existing packaging method is mainly injection molding, which has a low resin utilization rate and causes a lot of waste emissions, which is not conducive to cost savings. It cannot encapsulate large substrates and wafers, and has a limited scope of use. When encapsulating ultra-thin wafers, warping is easily caused, affecting product quality. Compression molding is a packaging method in which liquid resin or granular resin is placed in the mold cavity, and the product is immersed in the resin for molding while the resin is molten. Summary of the invention

[0004] The technical problems solved by this solution are:

[0005] (1) How to solve the problem that existing compression molds cannot package large substrates and wafers and are prone to warping during packaging.

[0006] The objective of the present invention can be achieved through the following technical scheme: a vacuum compression mold for encapsulating large substrates, comprising an upper fixed plate and an upper pad fixedly connected to the top thereof by bolts, an upper molding insert is arranged below the upper fixed plate, clamping mechanisms are symmetrically connected to the two sides of the upper molding insert, an upper enclosure plate is fixedly installed at the bottom of the upper molding insert, and the bottom of the upper fixed plate is fixedly connected to the first lower fixed plate by installing a limiting rod.

[0007] A further technical improvement of the present invention is that a limit plate is fixedly arranged on the top of the first lower fixed plate by a positioning column, a lower enclosure plate is fixedly installed on the top of the limit plate, a lower molding insert is arranged inside the lower enclosure plate, a second lower fixed plate is fixedly installed on the bottom of the first lower fixed plate, and a lower pad is fixedly installed on the bottom of the second lower fixed plate; the entire mold is placed stably on the table top, and the height of the lower pad can be adjusted to meet the requirements of different frame packaging.

[0008] A further technical improvement of the present invention is that: the clamping mechanism includes an upper clamping jaw fixing block fixedly connected to the bottom of the upper fixed plate, the interior of the upper clamping jaw fixing block is elastically connected to the upper clamping jaw through a pin shaft and a torsion spring, and a clamping jaw pressure block is arranged on the outer side of the upper clamping jaw fixing block, and the clamping jaw pressure block is fixedly installed on the top of the upper enclosure plate, and four groups of clamping jaw pressure blocks are arranged; when the mold is closed, the clamping jaw pressure block is subjected to force, and the upper clamping jaw moves slowly in the upper clamping jaw fixing block. At this time, the upper clamping jaw opens to release the clamping state of the frame. When the mold is opened, the force on the clamping jaw pressure block gradually decreases. At this time, the upper clamping jaw closes under the action of elastic force to clamp the frame to ensure that there is clamping force when the frame is suspended.

[0009] A further technical improvement of the present invention is that limiting grooves are provided around the first lower fixed plate, the second lower fixed plate and the limiting plate, a floating mechanism is arranged in the limiting groove, the floating mechanism includes a lower spring limiting block fixedly connected to the top of the lower pad, a lower spring bushing is fixedly connected above the lower spring limiting block, a buffer spring is sleeved on the outer side of the lower spring bushing, and sixteen groups of the floating mechanism are arranged; the floating mechanism is installed in the limiting groove by arranging the lower spring limiting block, elastic force and buffer force are provided by arranging the buffer spring, and the bending and deviation of the buffer spring are reduced by arranging the lower spring bushing.

[0010] A further technical improvement of the present invention is that insert air holes are opened on four sides of the lower molding insert, an insert air path groove is opened on the bottom of the lower molding insert, and the insert air holes are connected to the insert air path groove.

[0011] A further technical improvement of the present invention is that: the first lower fixed plate is provided with a first lower air hole, and the first lower air hole is connected to the insert air path groove; the second lower fixed plate is provided with a first lower air path groove, and the bottom of the first lower air path groove is provided with a second lower air hole, and the first lower air path groove is connected to the first lower air hole; the lower pad is provided with a third lower air hole, and the third lower air hole is connected to the second lower air hole.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] When the present invention is in use, the basic frame structure of the vacuum compression mold is formed by an upper pad, an upper fixing plate, an upper molding insert, an upper enclosure, a lower enclosure, a first lower fixing plate, a second lower fixing plate, and a lower molding insert. The frame is clamped by the cooperation of the clamping claw assembly. The upper limit column is provided to achieve elastic resetting of the upper enclosure and reduce the rigid impact of the mold. The installation limit column is provided to limit the installation height of the mold, which facilitates installation while ensuring the safety and reliability of the mold. The lower enclosure fixing plate is provided to fix the lower enclosure and ensure the precise positioning of the lower molding insert. The lower pad is provided to place the entire mold stably on the table. At the same time, the height of the lower pad can be adjusted to meet the requirements of different frame packaging.

[0014] When the present invention is in use, through the cooperation of the upper clamping jaw, the upper clamping jaw fixing block and the clamping jaw pressing block, when the mold is closed, the clamping jaw pressing block is subjected to force, and the upper clamping jaw moves slowly in the upper clamping jaw fixing block. At this time, the upper clamping jaw is opened to release the frame clamping state. When the mold is opened, the force on the clamping jaw pressing block gradually decreases. At this time, the upper clamping jaw is closed under the action of elastic force to clamp the column frame to ensure that there is clamping force when the frame is suspended.

[0015] When the present invention is in use, by setting a floating component, the rigid impact of the mold is reduced, the mold is ensured to be in a completely compressed state to prevent the entry of external gas and at the same time provide a reset elastic force, thereby ensuring the flatness of the product and preventing the product from warping. The floating component is installed in the mold limiting groove by setting a spring limit block, elastic force and buffer force are provided by setting a buffer spring, and the bending and deviation of the spring are reduced by setting a lower spring bushing.

[0016] When the present invention is in use, a V-shaped groove is provided at the air passage hole on the upper surface of the lower enclosure, which can accommodate part of the separation membrane during vacuum adsorption, flatten the separation membrane, and then make the separation membrane flat, thereby ensuring the flatness of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0018] Figure 1 The overall structure of the present invention is shown in three dimensions. Figure 1 ;

[0019] Figure 2 The overall structure of the present invention is shown in three dimensions. Figure 2 ;

[0020] Figure 3 It is a three-dimensional schematic diagram of the structure of the clamping mechanism of the present invention;

[0021] Figure 4 It is a three-dimensional exploded schematic diagram of the structure of the lower pad, the second lower fixing plate and the first lower fixing plate of the present invention;

[0022] Figure 5 It is a three-dimensional schematic diagram of the floating mechanism structure of the present invention;

[0023] Figure 6 It is a schematic structural stereoscopic diagram of the limit plate, the lower enclosure plate and the lower molding insert of the present invention.

[0024] In the figure: 1, connecting plate; 2, lower pad; 3, second lower fixing plate; 4, first lower fixing plate; 5, limit plate; 6, lower enclosure plate; 7, upper fixing plate; 8, upper pad; 9, clamping jaw mechanism; 10, upper molding insert; 11, floating mechanism; 12, positioning column; 13, lower molding insert; 91, upper clamping jaw; 92, clamping jaw pressure block; 93, upper clamping jaw fixing block; 111, lower spring bushing; 112, buffer spring; 113, lower spring limit block. DETAILED DESCRIPTION

[0025] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] See also Figure 1-Figure 6 As shown, a vacuum compression mold for packaging large substrates includes an upper fixed plate 7 and an upper pad 8 fixedly connected to the top thereof by bolts, an upper molding insert 10 is arranged below the upper fixed plate 7, clamping mechanisms 9 are symmetrically connected to the two sides of the upper molding insert 10, and an upper enclosure plate is fixedly installed on the bottom of the upper molding insert 10, and the bottom of the upper fixed plate 7 is fixedly connected to the first lower fixed plate 4 by installing a limiting rod.

[0027] See also Figure 1-Figure 2 As shown, a limiting plate 5 is fixedly installed on the top of the above-mentioned first lower fixed plate 4 through a positioning column 12, a lower enclosure plate 6 is fixedly installed on the top of the limiting plate 5, a lower molding insert 13 is arranged inside the lower enclosure plate 6, a second lower fixing plate 3 is fixedly installed on the bottom of the first lower fixed plate 4, and a lower pad 2 is fixedly installed on the bottom of the second lower fixing plate 3; the entire mold is stably placed on the table, and the height of the lower pad 2 can be adjusted to meet the requirements of different frame packaging.

[0028] See also Figure 2 and Figure 3 As shown, the above-mentioned clamping mechanism 9 includes an upper clamping jaw fixing block 93 fixedly connected to the bottom of the upper fixing plate 7, the interior of the upper clamping jaw fixing block 93 is elastically connected to the upper clamping jaw 91 through a pin shaft and a torsion spring, and a clamping jaw pressing block 92 is arranged on the outer side of the upper clamping jaw fixing block 93. The clamping jaw pressing block 92 is fixedly installed on the top of the upper enclosure plate, and four groups of clamping jaw pressing blocks 92 are arranged; when the mold is closed, the clamping jaw pressing block 92 is subjected to force, and the upper clamping jaw 91 moves slowly in the upper clamping jaw fixing block 93. At this time, the upper clamping jaw 91 is opened to release the frame clamping state. When the mold is opened, the force on the clamping jaw pressing block 92 gradually decreases. At this time, the upper clamping jaw 91 is closed under the action of elastic force to clamp the frame to ensure that there is clamping force when the frame is suspended.

[0029] See also Figure 4 and Figure 5 As shown, the first lower fixed plate 4, the second lower fixed plate 3 and the limiting plate 5 are all provided with limiting grooves on all sides, and a floating mechanism 11 is arranged in the limiting groove. The floating mechanism 11 includes a lower spring limiting block 113 fixedly connected to the top of the lower pad 2, a lower spring bushing 111 is fixedly connected above the lower spring limiting block 113, a buffer spring 112 is sleeved on the outer side of the lower spring bushing 111, and sixteen groups of the floating mechanism 11 are arranged; the floating mechanism 11 is installed in the limiting groove by arranging the lower spring limiting block 113, the buffer spring 112 is provided to provide elastic force and buffer force, and the lower spring bushing 111 is provided to reduce the bending and deviation of the buffer spring 112.

[0030] See also Figure 4 As shown, insert air holes are opened on four sides of the lower molding insert 13, and an insert air path groove is opened on the bottom of the lower molding insert 13, and the insert air holes are connected with the insert air path groove.

[0031] See also Figure 4 As shown, the first lower fixed plate 4 is provided with a first lower air hole, which is connected to the insert air path groove; the second lower fixed plate 3 is provided with a first lower air path groove, and the bottom of the first lower air path groove is provided with a second lower air hole, and the first lower air path groove is connected to the first lower air hole; the lower pad 2 is provided with a third lower air hole, and the third lower air hole is connected to the second lower air hole.

[0032] See also Figure 1 and Figure 6 As shown, the upper surface of the lower enclosure plate 6 is provided with a V-shaped groove, the bottom of the V-shaped groove is provided with enclosure plate air holes, and the V-shaped grooves are evenly distributed around the upper surface of the lower enclosure plate 6.

[0033] See also Figure 1 and Figure 2 As shown, the side surface of the upper fixing plate 7 and the side surface of the first lower fixing plate 4 are fixedly connected via a connecting plate 1 .

[0034] Working principle: When the present invention is in use, first, when the mold is running, the lower pad 2 slowly moves upward, at this time, the clamping jaw mechanism 9 is stressed, and the upper clamping jaw 91 slowly opens until the mold is safely closed. At this time, the upper clamping jaw 91 is fully opened, and the floating mechanism 11 is stressed to ensure that the frame is completely crushed; at this time, the product thickness changes, and the thickness of the lower pad 2 is replaced at this time to meet the needs of different product thicknesses. The entire vacuum compression mold runs smoothly, safely and reliably, the product is not easy to warp, and is suitable for packaging of large substrates; when the mold is used, the separation membrane evenly sprinkled with resin material is placed steadily on the lower molding insert 13, the vacuum device is started, the frame clamped by the upper molding insert 10 is adsorbed, and the vacuum air path of the lower mold is gradually started from the outside to the inside, so that the lower mold separation membrane and the resin material are adsorbed in the cavity formed by the lower molding insert 13 and the lower enclosure 6, and then the mold closing operation and the vacuum environment step are performed. After curing and molding, the vacuum environment air path is stopped at the same time when the mold is opened, the vacuum air path is stopped, and then other vacuum air paths are stopped, that is, one mold production is completed.

[0035] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A vacuum compression mold for packaging a large substrate, comprising an upper fixing plate (7) and an upper pad (8) fixedly connected to the top of the upper fixing plate, characterized in that: An upper molding insert (10) is provided below the upper fixing plate (7), the two sides of the upper molding insert (10) are symmetrically connected with clamping jaw mechanisms (9), and an upper enclosure plate is fixedly installed at the bottom of the upper molding insert (10), and the bottom of the upper fixing plate (7) is fixedly connected with a first lower fixing plate (4).

2. A vacuum compression mold for packaging a large substrate according to claim 1, characterized in that: A limiting plate (5) is fixedly arranged on the top of the first lower fixing plate (4), a lower enclosure plate (6) is fixedly installed on the top of the limiting plate (5), a lower molding insert (13) is arranged inside the lower enclosure plate (6), a second lower fixing plate (3) is fixedly installed on the bottom of the first lower fixing plate (4), and a lower pad (2) is fixedly installed on the bottom of the second lower fixing plate (3).

3. The vacuum compression mold for packaging a large substrate according to claim 1, characterized in that: The clamping mechanism (9) comprises an upper clamping jaw fixing block (93) fixedly connected to the bottom of the upper fixing plate (7); the interior of the upper clamping jaw fixing block (93) is elastically connected to the upper clamping jaw (91) via a pin shaft and a torsion spring; a clamping jaw pressing block (92) is arranged on the outer side of the upper clamping jaw fixing block (93); and the clamping jaw pressing block (92) is fixedly mounted on the top of the upper enclosure plate.

4. The vacuum compression mold for packaging a large substrate according to claim 1, characterized in that: The first lower fixing plate (4), the second lower fixing plate (3) and the limiting plate (5) are all provided with limiting grooves on their four sides, and a floating mechanism (11) is arranged in the limiting groove. The floating mechanism (11) comprises a lower spring limiting block (113) fixedly connected to the top of the lower pad (2), a lower spring bushing (111) is fixedly connected above the lower spring limiting block (113), and a buffer spring (112) is sleeved on the outer side of the lower spring bushing (111).

5. The vacuum compression mold for packaging a large substrate according to claim 2, characterized in that: Insert air holes are provided on four sides of the lower molding insert (13), and an insert air path groove is provided at the bottom of the lower molding insert (13), and the insert air holes are connected to the insert air path groove.

6. The vacuum compression mold for packaging a large substrate according to claim 2, characterized in that: The first lower fixing plate (4) is provided with a first lower air through hole, and the first lower air through hole is connected to the insert air path groove; the second lower fixing plate (3) is provided with a first lower air path groove, and the bottom of the first lower air path groove is provided with a second lower air through hole, and the first lower air path groove is connected to the first lower air through hole; the lower pad (2) is provided with a third lower air through hole, and the third lower air through hole is connected to the second lower air through hole.

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