Bonding alignment device and method

Abstract

The invention discloses a bonding alignment device and method, and the device comprises a first workbench which comprises a first surface and is used for fixing a first to-be-aligned part; the second workbench comprises a second surface and is used for fixing a second to-be-aligned piece, and the second surface and the first surface are opposite in the first direction and are arranged at an interval; the gap adjusting mechanism is used for adjusting the gap between the second surface and the first surface in the first direction; the first light-transmitting structure penetrates through the first workbench in the first direction; the second light-transmitting structure penetrates through the second workbench in the first direction; the transmission light source is located on the side, away from the first workbench, of the second workbench. The transmission light collector is located on the side, away from the second workbench, of the first workbench. The transmission light collector is adopted to capture the first mark and the second mark at the same time, only one workbench needs to be moved in one direction, repeated movement for avoiding the capture space is not needed, and the alignment precision is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a bonding alignment device and method. Background Art

[0002] The wafer bonding process mainly achieves bonding accuracy by positioning and aligning the nested marks on two different wafers. With the development of semiconductor technology, the bonding requirements are constantly improving, and it is necessary to develop a better alignment technology. Summary of the invention

[0003] The invention discloses a bonding alignment device and method for improving alignment accuracy.

[0004] In order to achieve the above object, the present invention provides the following technical solutions:

[0005] In a first aspect, the present invention provides a bonding alignment device, comprising:

[0006] A first workbench, comprising a first surface, for fixing a first piece to be aligned;

[0007] A second workbench includes a second surface for fixing a second member to be aligned, and the second surface and the first surface are arranged opposite to each other and spaced apart along a first direction;

[0008] a gap adjustment mechanism, used for adjusting the gap between the second surface and the first surface along the first direction;

[0009] A first light-transmitting structure, penetrating the first workbench along the first direction, and configured to transmit light;

[0010] A second light-transmitting structure, penetrating the second workbench along the first direction, and configured to transmit light;

[0011] a transmission light source, located at a side of the second workbench away from the first workbench, and configured to emit light toward the second light-transmitting structure;

[0012] The transmitted light collector is located on the side of the first workbench away from the second workbench, and is used to simultaneously capture the first mark on the first piece to be aligned and the second mark on the second piece to be aligned when the light emitted by the transmitted light source passes through the second light-transmitting structure, the second piece to be aligned, the first piece to be aligned and the first light-transmitting structure in sequence.

[0013] Before using the bonding alignment device provided by the present invention to perform alignment operation, the first workbench and the second workbench are both in the initial position, the first light-transmitting structure and the second light-transmitting structure are arranged along the first direction, and along the first direction, there is a first gap between the first workbench and the second workbench, and the first gap is greater than 7 cm, so as to facilitate the installation of the first to-be-aligned member and the second to-be-aligned member, the first to-be-aligned member includes a first mark for bonding, and the second to-be-aligned member includes a second mark for bonding. During the alignment operation, the first to-be-aligned member is fixed to the first surface of the first workbench, and the first mark on the first to-be-aligned member needs to correspond to the position of the first light-transmitting structure on the first workbench; exemplarily, the orthographic projection of the first light-transmitting structure on the first workbench on the first surface covers and is greater than the orthographic projection of the first mark on the first to-be-aligned member on the first surface; similarly, the second to-be-aligned member is fixed to the second surface of the second workbench, and the second mark on the second to-be-aligned member needs to correspond to the position of the second light-transmitting structure on the second workbench; exemplarily, the orthographic projection of the second light-transmitting structure on the second workbench on the second surface covers and is greater than the orthographic projection of the second mark on the second to-be-aligned member on the second surface. The gap between the first to-be-aligned member and the second to-be-aligned member is adjusted along the first direction by the gap adjustment mechanism, and the first to-be-aligned member and the second to-be-aligned member are located at the bonding position. The light emitted by the transmission light source sequentially passes through the second light-transmitting structure, the second to-be-aligned member, the first to-be-aligned member and the first light-transmitting structure and is captured by the transmission light collector. Since the first mark corresponds to the position of the first light-transmitting structure and the second mark corresponds to the position of the second light-transmitting structure, the transmission light collector can capture the first mark and the second mark at the same time.

[0014] The present invention uses a transmitted light collector to simultaneously capture the first mark on the first piece to be aligned and the second mark on the second piece to be aligned, which can reduce the number of captures and reduce the error caused by the capture; at the same time, the present invention only needs to move the first workbench or the second workbench in one direction, and does not need the first workbench and the second workbench to move repeatedly to avoid the capture space, which reduces the error caused by movement and saves the process cycle. In addition, the present invention directly uses the bonded mark as a reference for alignment, and the final accuracy will be much higher than the coordinates obtained by calculation and simulation.

[0015] In some embodiments, the gap adjustment mechanism comprises:

[0016] A lifting motor is drivingly connected to the second workbench and is used for driving the second surface to approach or move away from the first surface along the first direction.

[0017] In some embodiments, the first workbench further comprises:

[0018] A first bearing platform, slidably disposed on the first surface, and used for bearing the first to-be-aligned member;

[0019] a first alignment assembly, fixedly mounted on the first surface and drivingly connected to the first carrier platform, for driving the first carrier platform to slide; and / or,

[0020] The second workbench also includes:

[0021] A second bearing platform, slidably disposed on the second surface, and used for bearing the second piece to be aligned;

[0022] The second alignment assembly is fixed on the second surface and is transmission-connected to the second bearing platform for driving the second bearing platform to slide.

[0023] In some embodiments, the first alignment assembly includes a plurality of first piezoelectric units for driving the first support platform to move two-dimensionally on the first surface; the second alignment assembly includes a plurality of second piezoelectric units for driving the second support platform to move two-dimensionally on the second surface.

[0024] In some embodiments, the first light-transmitting structure and / or the second light-transmitting structure is a through hole.

[0025] In some embodiments, the first light-transmitting structures and the second light-transmitting structures are the same in number and are arranged in a one-to-one correspondence.

[0026] In some embodiments, the transmitted light sources and the transmitted light collectors are the same in number and are arranged in a one-to-one correspondence.

[0027] In some embodiments, the bonding alignment device further includes a first bracket, the first bracket includes a first fixed end and a first movable end, the first fixed end is slidably disposed on the second workbench; the transmission light source is slidably disposed on the first movable end.

[0028] In some embodiments, the bonding alignment device further includes: a base and a second bracket, the second bracket includes a second fixed end and a second movable end, the second fixed end is slidably disposed on the base, and the transmitted light collector is fixed to the second movable end.

[0029] In some embodiments, the light emitted by the transmissive light source is near-infrared light.

[0030] In a second aspect, the present invention further provides a bonding alignment method based on the bonding alignment device described in the first aspect, comprising:

[0031] Fixing the first piece to be aligned to the first surface of the first workbench so that the orthographic projection of the first light-transmitting structure on the first workbench on the first surface covers and is larger than the orthographic projection of the first mark on the first piece to be aligned on the first surface;

[0032] Fixing the second piece to be aligned to the second surface of the second workbench so that the orthographic projection of the second light-transmitting structure on the second workbench on the second surface covers and is larger than the orthographic projection of the second mark on the second piece to be aligned on the second surface;

[0033] adjusting the gap between the first to-be-aligned member and the second to-be-aligned member along a first direction by a gap adjustment mechanism;

[0034] Turning on the transmission light source, and the transmission light collector simultaneously captures the first mark and the second mark;

[0035] Based on the relative positional relationship between the first mark and the second mark, the first to-be-aligned component and the second to-be-aligned component are bonded.

[0036] In some embodiments, based on the relative position relationship between the first mark and the second mark, bonding of the first to-be-aligned component and the second to-be-aligned component is achieved, including: based on a transmission image acquired by a transmission light collector, acquiring an alignment position deviation value of the first mark and the second mark in the transmission image, adjusting the position of the first to-be-aligned component on the first surface according to the deviation value, and / or adjusting the position of the second to-be-aligned component on the second surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the structure of a traditional transmission lens;

[0038] Figure 2a-2d The process flow chart for the traditional alignment technology;

[0039] Figure 3 A schematic diagram of the structure of one side of a bonding alignment device provided by an embodiment of the present invention;

[0040] Figure 4 A schematic diagram of the structure of the other side of a bonding alignment device provided by an embodiment of the present invention;

[0041] Figure 5 A schematic diagram of the structure of the other side of a bonding alignment device provided by an embodiment of the present invention;

[0042] Figure 6 A schematic diagram of the structure of the other side of a bonding alignment device provided by an embodiment of the present invention;

[0043] Figure 7 is a schematic diagram of assembling the transmitted light collector and the second bracket;

[0044] Figure 8 is a structural schematic diagram of the first workbench;

[0045] Fig. 9is a schematic diagram of the structure of the second workbench;

[0046] Fig.10 A flow chart of a bonding alignment method provided by an embodiment of the present invention;

[0047] Figure 11-13 A process flow chart of a bonding alignment method provided by an embodiment of the present invention.

[0048] Icons: 1-upper lens group; 2-lower lens group; 3-top workbench; 4-bottom workbench; 5-wafer; 11-upper lens; 12-upper light source; 21-lower lens; 22-lower light source; 100-first workbench; 101-first surface; 110-first light-transmitting structure; 120-first carrier; 130-first piezoelectric ceramic motor; 140-second piezoelectric ceramic motor; 200-second workbench; 201-second surface; 210-second light-transmitting structure Structure; 220-second supporting platform; 230-third piezoelectric ceramic motor; 240-fourth piezoelectric ceramic motor; 300-gap adjustment mechanism; 310-lifting motor; 400-base; 500-transmitted light source; 510-first bracket; 600-transmitted light collector; 610-second bracket; 611-second fixed end; 612-second movable end; 700-first piece to be aligned; 710-first mark; 800-second piece to be aligned; 810-second mark. DETAILED DESCRIPTION

[0049] The following will combine the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Among them, in the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in the text is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" refers to two or more than two.

[0050] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as suggesting or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features, and in the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

[0051] The alignment technology currently used uses two sets of opposing lenses to capture the bonding marks of the two wafers. This requires the work platform carrying the two wafers to move continuously to avoid the space for the reflective lens to capture the bonding marks. In addition, this design requires the coordinates of the two bonding marks to be calculated and simulated. Excessive movement and multiple captures of bonding marks will increase the error, which also limits the final bonding accuracy. Figure 1 As shown, the two groups of camera lenses include an upper lens group 1 and a lower lens group 2, wherein the upper lens group 1 includes an upper lens 11 and an upper light source 12, and the lower lens group 2 includes a lower lens 21 and a lower light source 22. For the specific alignment process, please refer to Figure 2a-2d .like Figure 2a As shown, the top workbench 3 and the bottom workbench 4 are arranged left and right, the top workbench 3 is located below and slightly to the left of the upper lens group 1, and the bottom workbench 4 is located directly below the upper lens group 1. The two wafers 5 to be bonded are loaded onto the top workbench 3 and the bottom workbench 4 respectively, and the bonding mark in the wafer 5 on the bottom workbench 4 is captured by the upper lens 11 and its coordinate value is recorded, which is defined as the first coordinate value; at the same time, the horizontal position of the bottom workbench is recorded by another lens. Figure 2b As shown, the bottom workbench 4 is horizontally moved to the left to below the top workbench 3 to make room for the calibration of the upper lens 11 and the lower lens 21. Through the calibration of the lens, the upper lens 11 sends the first coordinate value to the lower lens 12. Figure 2c As shown, the top workbench 3 is moved horizontally to the right, and the top workbench 3 is adjusted to the alignment position according to the horizontal position of the bottom workbench recorded by another lens, the bonding mark in the wafer 5 on the top workbench 3 is captured by the lower lens 21, and the position of the wafer 5 on the top workbench 3 is fine-tuned by the fine-tuning unit on the top workbench 3 according to the first coordinate value, so that the coordinates of the bonding mark of the wafer 5 on the top workbench 3 coincide with the first coordinate value. Figure 2d As shown, the bottom workbench 4 is moved horizontally to the right until it is located directly below the upper lens group 1, and the horizontal position of the bottom workbench 4 is recorded again by another lens, and this position is compared with Figure 2a The error generated by the horizontal position comparison is fine-tuned by the fine-tuning unit on the bottom workbench 4 to complete the alignment operation before bonding.

[0052] The embodiments of the present application provide a bonding alignment device and method, which improves alignment accuracy by changing hardware structure and alignment logic.

[0053] First, as Figures 3 to 6 As shown, an embodiment of the present invention provides a bonding alignment device, comprising:

[0054] A first workbench 100 includes a first surface 101 for fixing a first piece to be aligned;

[0055] The second workbench 200 includes a second surface 201, which is used to fix the second piece to be aligned, and the second surface 201 and the first surface 101 are opposite to each other and spaced apart along the first direction;

[0056] The gap adjustment mechanism 300 is used to adjust the gap between the second surface 201 and the first surface 101 along the first direction;

[0057] A first light-transmitting structure 110, penetrating the first workbench 100 along a first direction, for transmitting light;

[0058] A second light-transmitting structure 210, penetrating the second workbench 200 along the first direction, for transmitting light;

[0059] A transmission light source 500 is located on a side of the second workbench 200 away from the first workbench 100 and is used to emit light toward the second light-transmitting structure 210;

[0060] The transmitted light collector 600 is located on the side of the first workbench 100 away from the second workbench 200, and is used to simultaneously capture the first mark on the first piece to be aligned and the second mark on the second piece to be aligned when the light emitted by the transmitted light source 500 passes through the second light-transmitting structure 210, the second piece to be aligned, the first piece to be aligned and the first light-transmitting structure 110 in sequence.

[0061] Before using the bonding alignment device provided by the present invention to perform an alignment operation, the first workbench 100 and the second workbench 200 are both in initial positions, the first light-transmitting structure 110 and the second light-transmitting structure 210 are arranged along a first direction, and along the first direction, there is a first gap L1 between the first workbench 100 and the second workbench 200, and the first gap is greater than 7 cm, which is convenient for installing the first part to be aligned and the second part to be aligned, the first part to be aligned includes a first mark for bonding, and the second part to be aligned includes a second mark for bonding. During the alignment operation, the first piece to be aligned is fixed to the first surface 101 of the first workbench 100, and the first mark on the first piece to be aligned needs to correspond to the first light-transmitting structure 110 on the first workbench 100; illustratively, the orthographic projection of the first light-transmitting structure 110 on the first workbench 100 on the first surface 101 covers and is larger than the orthographic projection of the first mark on the first piece to be aligned on the first surface 101; similarly, the second piece to be aligned is fixed to the second surface 201 of the second workbench 200, and the second mark on the second piece to be aligned needs to correspond to the second light-transmitting structure 210 on the second workbench 200; illustratively, the orthographic projection of the second light-transmitting structure 210 on the second workbench 200 on the second surface 201 covers and is larger than the orthographic projection of the second mark on the second piece to be aligned on the second surface 201. The gap between the first piece to be aligned and the second piece to be aligned is adjusted along the first direction by the gap adjustment mechanism 300, and the first piece to be aligned and the second piece to be aligned are located at the bonding position. The light emitted by the transmitted light source 500 passes through the second light-transmitting structure 210, the second piece to be aligned, the first piece to be aligned and the first light-transmitting structure 110 in sequence and is captured by the transmitted light collector 600. Since the first mark corresponds to the position of the first light-transmitting structure 110 and the second mark corresponds to the position of the second light-transmitting structure 210, the transmitted light collector 600 can capture the first mark and the second mark at the same time.

[0062] The present invention uses a transmission light collector 600 such as a transmission lens to simultaneously capture the first mark on the first to-be-aligned part and the second mark on the second to-be-aligned part, thereby reducing the number of lenses and the number of captures, thereby reducing the error caused by capture. At the same time, the present invention only needs to capture in one direction (such as Figure 3 By moving the first workbench 100 or the second workbench 200 in the Z direction, the first workbench 100 and the second workbench 200 do not need to move repeatedly to avoid the capture space, which reduces the error caused by movement and saves process time. In addition, the present invention directly uses the bonded mark as a reference for alignment, and the final accuracy is much higher than the coordinates obtained by calculation and simulation.

[0063] One possible implementation method is Figure 3As shown, the first workbench 100 and the second workbench 200 are arranged along a first direction, i.e., the Z-axis direction. The first light-transmitting structure 110 penetrates the first workbench 100 along the Z-axis direction, i.e., the thickness direction of the first workbench 100, for transmitting light. The second light-transmitting structure 210 penetrates the second workbench 200 along the Z-axis direction, i.e., the thickness direction of the second workbench 200, for transmitting light. The first light-transmitting structure 110 and the second light-transmitting structure 210 are arranged along the Z-axis direction, and along the Z-axis direction, the transmitted light source 500 is located on the side of the second light-transmitting structure 210 away from the first light-transmitting structure 110, and the transmitted light collector 600 is located on the side of the first light-transmitting structure 110 away from the second light-transmitting structure 210. The transmitted light collector 600 can be a transmission lens, combined with Figure 7 A transmission lens is used to capture the first mark and the second mark at the same time, and the coaxiality of the transmission lens and the transmission light source 500 is adjusted during the machine adjustment stage to ensure the uniformity of the transmitted light.

[0064] It can be understood that the first part to be aligned and the second part to be aligned can both be wafers, and the first mark and the second mark are marks of nested design, such as when the first mark and the second mark are aligned, in the transmission image captured by the transmission light collector 600, the outer contour of the first mark is located inside the inner contour of the second mark; or, in the transmission image captured by the transmission light collector 600, the outer contour of the second mark is located inside the inner contour of the first mark. Exemplarily, the first mark is a solid cross, and the second mark is a hollow cross. When the first mark and the second mark are aligned, the first mark is located inside the second mark in the transmission image captured by the transmission light collector 600. Exemplarily, the first mark is a hollow circle, and the second mark is a cross. When the first mark and the second mark are aligned, the second mark is located inside the first mark in the transmission image captured by the transmission light collector 600.

[0065] The first mark and the second mark are nanoscale marks. In comparison, the first light-transmitting structure 110 and the second light-transmitting structure 210 are larger in size. When loading the wafer, it is easy to ensure that the first mark and the second mark are both within the coverage range of the first light-transmitting structure 110 and the second light-transmitting structure 210. Therefore, the bonding alignment device provided in the embodiment of the present invention can be applied to a wider variety of wafer pre-bonding alignment operations.

[0066] It should be noted that the main function of the gap adjustment mechanism 300 is to adjust the gap between the first workbench 100 and the second workbench 200 along the first direction, so the gap adjustment mechanism 300 can be connected to the first workbench 100 to drive the first workbench 100 to approach or move away from the second workbench 200 along the first direction, and can also be connected to the second workbench 200 to drive the second workbench 200 to approach or move away from the first workbench 100 along the first direction. Therefore, any structure that can achieve the above functions can be used as the gap adjustment mechanism 300 in this embodiment, such as a linear motor, a cylinder, a hydraulic cylinder, an electric push rod, etc.

[0067] In some embodiments, the gap adjustment mechanism 300 includes:

[0068] The lifting motor 310 is in transmission connection with the second workbench 200 and is used for driving the second surface 201 to approach or move away from the first surface 101 along the first direction.

[0069] One possible implementation method is Figure 3 As shown, and refer to Figure 6 The gap adjustment mechanism 300 includes three lifting motors 310, and the three lifting motors 310 are arranged in a triangle and are all connected to the second workbench 200 for driving. Figure 3 The first workbench 100 is moved closer to or farther from the first workbench 100 in the Z direction, and the first workbench 100 is fixed. It should be noted that the fixing structure of the first workbench 100 is not shown in the figure, and its specific structure is not specifically limited as long as the position of the first workbench 100 can be fixed. The three lifting motors 310 simultaneously drive the second workbench 200 to move along the Figure 3 When the second workbench 200 approaches the first workbench 100 in the middle Z direction, the second to-be-aligned component carried by the second surface 201 gradually approaches the first to-be-aligned component carried by the first surface 101 as the second workbench 200 moves.

[0070] It can be understood that the transmitted light collector 600 captures the first mark and the second mark at the same time. When there is an error between the first mark and the second mark in the transmitted image, there is no need to move the first workbench 100 or the second workbench 200 in the XY plane. It is only necessary to fine-tune the first part to be aligned or the second part to be aligned on the first workbench 100 or the second workbench 200. In other words, the fine-tuning drive of the first part to be aligned can be set only on the first workbench 100, or the fine-tuning drive of the second part to be aligned can be set only on the second workbench 200. It is also possible to set the fine-tuning drive of the first part to be aligned on the first workbench 100 and the fine-tuning drive of the second part to be aligned on the second workbench 200, thereby avoiding the motion error caused by the large movement of the first workbench 100 and the second workbench 200. At the same time, it can also save beats and increase the number of wafers per hour (Wafer Per Hour, abbreviated as WPH).

[0071] Specifically, in some embodiments, the first workbench 100 further includes:

[0072] A first carrying platform 120 is slidably disposed on the first surface 101 and is used to carry a first object to be aligned;

[0073] The first alignment assembly is fixed on the first surface 101 and is in transmission connection with the first carrier 120, and is used to drive the first carrier 120 to slide in the first plane to adjust the relative position of the first carrier 120 and the second workbench 200; wherein the first plane is perpendicular to the first direction, such as Figure 4 XY plane; and / or,

[0074] The second working table 200 also includes:

[0075] A second carrying platform 220 is slidably disposed on the second surface 201 and is used to carry a second object to be aligned;

[0076] The second alignment assembly is fixed on the second surface 201 and is in transmission connection with the second carrier 220, and is used to drive the second carrier 220 to slide in the second plane to adjust the relative position of the second carrier 220 and the first workbench 100; wherein the second plane is perpendicular to the first direction, such as Figure 4 Mid XY plane.

[0077] It should be noted that the first piece to be aligned is fixedly mounted on the first carrier 120, for example, the first carrier 120 fixes the first piece to be aligned by vacuum adsorption. Similarly, the second piece to be aligned is fixedly mounted on the second carrier 220, for example, the second carrier 220 fixes the second piece to be aligned by vacuum adsorption. The vacuum adsorption structure is not shown in the figure, and its specific structure is not specifically limited as long as it can fix the first piece to be aligned or the second piece to be aligned.

[0078] It can be understood that according to the position error of the first mark and the second mark on the XY plane in the transmission image captured by the transmission light collector 600, the relative position of the first workbench 100 and the second workbench 200 is adjusted by the first alignment component and / or the second alignment component to align the first mark and the second mark.

[0079] Since the main function of the first alignment assembly and the second alignment assembly is to fine-tune the relative positions of the first to-be-aligned member and the second to-be-aligned member, the sensitivity requirements of the first alignment assembly and the second alignment assembly are relatively high.

[0080] In some embodiments, the first alignment assembly includes a plurality of first piezoelectric units for driving the first carrier to move two-dimensionally on the first surface; the second alignment assembly includes a plurality of second piezoelectric units for driving the second carrier to move two-dimensionally on the second surface.

[0081] In one possible implementation, the first alignment component includes:

[0082] A first piezoelectric ceramic motor 130 is transmission-connected to the first carrier platform 120 and is used to drive the first carrier platform 120 to move along the second direction;

[0083] The second piezoelectric ceramic motor 140 is transmission-connected to the first carrier 120, and is used to drive the first carrier 120 to move along a third direction, wherein the second direction and the third direction are both perpendicular to the first direction; and / or,

[0084] The second alignment assembly includes:

[0085] A third piezoelectric ceramic motor 230 is transmission-connected to the second carrier platform 220 and is used to drive the second carrier platform 220 to move along the second direction;

[0086] The fourth piezoelectric ceramic motor 240 is transmission-connected to the second carrier platform 220 and is used for driving the second carrier platform 220 to move along a third direction, wherein the second direction and the third direction are both perpendicular to the first direction.

[0087] It is understandable that the precision of piezoelectric ceramic motors reaches the nanometer level, with instant response capability and no hysteresis problem. Figure 8 As shown, there are two first piezoelectric ceramic motors 130, and the two first piezoelectric ceramic motors 130 are arranged along the second direction. Figure 8 The second piezoelectric ceramic motors 140 are arranged in the X-axis direction, and are used to adjust the position of the first carrier 120120 along the X-axis direction; there are two second piezoelectric ceramic motors 140, and the two second piezoelectric ceramic motors 140 are arranged in the third direction, that is, Figure 8 The X-axis is arranged in the Y-axis direction, and is used to adjust the position of the first carrier 120 along the Y-axis direction. The X-axis is perpendicular to the Y-axis.

[0088] One possible implementation method is Fig. 9 As shown, there are two third piezoelectric ceramic motors 230, and the two third piezoelectric ceramic motors 230 are arranged along the second direction. Fig. 9 The fourth piezoelectric ceramic motors 240 are arranged in the X-axis direction, and are used to adjust the position of the second carrier 220 along the X-axis direction; there are two fourth piezoelectric ceramic motors 240, and the two fourth piezoelectric ceramic motors 240 are arranged in the third direction, that is, Fig. 9 The X-axis is arranged in the Y-axis direction, and is used to adjust the position of the second carrying platform 220 along the Y-axis direction. The X-axis is perpendicular to the Y-axis.

[0089] The working principle of the piezoelectric ceramic motor is as follows: the piezoelectric effect in piezoelectric ceramics converts the electric field into mechanical strain. Under the special electrical excitation drive and the ceramic geometry of the piezoelectric ceramic motor, the longitudinal and transverse bending oscillation modes are excited at close frequencies. The simultaneous excitation of the longitudinal extension mode and the transverse bending mode produces a small elliptical trajectory of the ceramic edge, thus realizing a dual-mode standing wave motor. By coupling the ceramic edge to a precision worktable, a resultant driving force is applied to the worktable, causing the worktable to move. At a frequency much higher than the mechanical resonance of the platform, the periodic nature of the driving force allows continuous and smooth motion over an infinite stroke while maintaining the high resolution and positioning accuracy of the piezoelectric device. In the absence of an applied driving voltage, the ceramic plate is stationary and generates a holding torque on the stage. Unlike any other braking device, the holding torque of the nano-motion motor does not cause any position shift.

[0090] It should be noted that the main function of the first light-transmitting structure 110 and the second light-transmitting structure 210 is to transmit light, so the first light-transmitting structure 110 can be a solid transparent structure embedded in the first workbench 100, or it can be a hole structure; similarly, the second light-transmitting structure 210 can be a solid transparent structure embedded in the second workbench 200, or it can be a hole structure.

[0091] In some embodiments, the first light-transmitting structure 110 and / or the second light-transmitting structure 210 is a through hole.

[0092] One possible implementation method is Figure 8 As shown, the first light-transmitting structure 110 is a through-hole structure. To facilitate the identification of the through-hole structure of the first light-transmitting structure 110, Figure 8 Along the negative direction of the Z axis, the first workbench 100 has a first through hole, the first carrier 120 has a second through hole, and the first through hole and the second through hole are connected to form a first light-transmitting structure 110 .

[0093] One possible implementation method is Fig. 9 As shown, the second light-transmitting structure 210 is a through-hole structure. To facilitate the identification of the through-hole structure of the second light-transmitting structure 210, Fig. 9Along the positive direction of the Z axis, the second workbench 200 has a third through hole, the second carrying platform 220 has a fourth through hole, and the third through hole and the fourth through hole are connected to form a second light-transmitting structure 210 .

[0094] It can be understood that since the first light-transmitting structure 110 and / or the second light-transmitting structure 210 are through-hole structures, the order of magnitude of the processed dimensions of the through-holes is significantly greater than the nanometer order of magnitude of the bonding marks. Therefore, when the bonding marks on different models of wafers have different sizes or position shifts, the same bonding alignment device is also applicable.

[0095] In some embodiments, in order to ensure that the light emitted by the transmission light source 500 can sequentially pass through the second light-transmitting structure 210 and the first light-transmitting structure 110, the first light-transmitting structure 110 and the second light-transmitting structure 210 are the same in number and are arranged in a one-to-one correspondence. Exemplarily, the first light-transmitting structure 110 and the second light-transmitting structure 210 arranged in a one-to-one correspondence are a group of light-transmitting structures, and each group of light-transmitting structures corresponds to a group of bonding marks, wherein the group of bonding marks includes the first mark and the second mark of the corresponding bonding.

[0096] In some embodiments, in order to ensure the uniformity of the light source, the number of the transmitted light sources 500 and the transmitted light collectors 600 is the same and they are arranged one by one. Exemplarily, the transmitted light sources 500 and the transmitted light collectors 600 arranged one by one are a group of capture structures, and each group of capture structures corresponds to a group of light-transmitting structures.

[0097] In one possible implementation, refer to Figure 3 and Figure 4 The bonding alignment device includes two groups of capture structures and two groups of light-transmitting structures. Accordingly, the first piece to be aligned and the second piece to be aligned are provided with two groups of bonding marks. The light emitted by the first transmitted light source 500 passes through the first second light-transmitting structure 210, the second piece to be aligned, the first piece to be aligned and the first first light-transmitting structure 110 and is finally captured by the first transmitted light collector 600, and the first group of bonding marks on the first piece to be aligned and the second piece to be aligned are captured at the same time. The light emitted by the second transmitted light source 500 passes through the second second light-transmitting structure 210, the second piece to be aligned, the first piece to be aligned and the second first light-transmitting structure 110 and is finally captured by the second transmitted light collector 600, and the second group of bonding marks on the first piece to be aligned and the second piece to be aligned are captured at the same time.

[0098] It should be noted that in order to further ensure the uniformity of light, the coaxiality of the transmission lens and the transmission light source 500 needs to be adjusted during the machine adjustment stage. Therefore, the position of the transmission lens relative to the transmission light source 500 needs to be adjustable, and the implementation method can be that the transmission lens is fixed and the position of the transmission light source 500 is adjustable; or the position of the transmission light source 500 is fixed and the position of the transmission lens is adjustable; of course, preferably, both the transmission lens and the transmission light source 500 are adjustable.

[0099] In some embodiments, in order to ensure that the position of the transmission light source 500 is adjustable, the bonding alignment device further includes:

[0100] The first bracket 510 includes a first fixed end and a first movable end. The first fixed end is slidably disposed on the second workbench 200, and the transmission light source 500 is slidably disposed on the first movable end.

[0101] In one possible implementation, continue to refer to Figure 3 , the transmission light source 500 is installed on the side of the second workbench 200 away from the second surface 201 through the first bracket 510. The first fixed end of the first bracket 510 is slidably connected to the second workbench 200, and the first fixed end can slide relative to the second workbench 200 along the third direction, i.e., the Y-axis direction. The first movable end of the first bracket 510 can move relative to the first fixed end along the first direction, i.e., the Z-axis direction, and the transmission light source 500 can slide relative to the first movable end along the second direction, i.e., the X-axis direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other, thereby realizing that the position of the transmission light source 500 can be adjusted in three-dimensional space. It should be noted that the sliding connection structure between the first bracket 510 and the second workbench 200 and the sliding connection structure between the transmission light source 500 and the first bracket 510 are not clearly shown in the figure, and their specific structures are not specifically limited as long as the position of the transmission light source 500 can be adjusted in three-dimensional space.

[0102] In some embodiments, in order to ensure that the position of the transmission lens is adjustable, the bonding alignment device also includes: a base 400 and a second bracket 610, the second bracket 610 includes a second fixed end 611 and a second movable end 612, the second fixed end 611 is slidably disposed on the base 400, and the transmission light collector 600 is fixed to the second movable end 612.

[0103] In one possible implementation, refer to Figure 3 and Figure 4 , the transmitted light collector 600 is mounted on the base 400 through the second bracket 610, and is located on the side of the first workbench 100 away from the first surface 101. Exemplarily, the second fixed end 611 of the second bracket 610 can slide relative to the base 400 along the X-axis direction, and can also slide relative to the base 400 along the Y-axis direction, and the second movable end 612 of the second bracket 610 can move relative to the second fixed end 611 along the Z-axis direction, thereby achieving adjustable position of the transmitted light collector 600 in three-dimensional space. It should be noted that the sliding connection structure between the second fixed end 611 of the second bracket 610 and the base 400 and the connection structure between the second movable end 612 of the second bracket 610 and the second fixed end 611 are not clearly shown in the figure, and the specific structure is not specifically limited as long as the position of the transmitted light collector 600 can be adjusted in three-dimensional space.

[0104] In some embodiments, the light emitted by the transmission light source 500 is near-infrared light. Accordingly, the transmission light collector 600 is a near-infrared transmission lens. Near-infrared light has a strong penetrating ability. When detecting a sample, no pre-treatment is required and it can penetrate glass and plastic. Exemplarily, the wavelength of the transmission light source 500 is 1030nm.

[0105] Second, as Fig.10 As shown, the embodiment of the present invention also provides a bonding alignment method, which specifically includes the following steps:

[0106] S1001, fixing a first piece to be aligned to a first surface of a first workbench so that the orthographic projection of a first light-transmitting structure on the first workbench on the first surface covers and is larger than the orthographic projection of a first mark on the first piece to be aligned on the first surface;

[0107] S1002, fixing the second piece to be aligned to the second surface of the second workbench so that the orthographic projection of the second light-transmitting structure on the second workbench on the second surface covers and is larger than the orthographic projection of the second mark on the second piece to be aligned on the second surface;

[0108] S1003, adjusting the gap between the first to-be-aligned member and the second to-be-aligned member along the first direction by a gap adjustment mechanism;

[0109] S1004, turning on the transmission light source, and the transmission light collector simultaneously captures the first mark and the second mark;

[0110] S1005 , based on the relative positional relationship between the first mark and the second mark, realize bonding between the first to-be-aligned component and the second to-be-aligned component.

[0111] The above S1001 and S1002 can be performed simultaneously in any order, and in S1001 and S1002, refer to Fig.11 , the second workbench 200 is in the initial position, and there is a first gap L1 between the second workbench 200 and the first workbench 100, and the first gap is greater than 7cm, which is convenient for installing the first to-be-aligned part 700 and the second to-be-aligned part 800. In the above S1003, during the specific operation, the second workbench 200 can be driven by the lifting motor 310 to approach the first workbench 100 along the positive direction of the Z axis, and the second workbench 200 reaches the alignment position. At this time, there is a second gap L2 between the second workbench 200 and the first workbench 100, as shown in FIG. Fig.12In the above S1004, the transmitted light source 500 is turned on, and the light sequentially passes through the second light-transmitting structure 210, the second to-be-aligned member 800, the first to-be-aligned member 700 and the first light-transmitting structure 110 and is captured by the transmitted light collector 600. Since the first mark 710 corresponds to the first light-transmitting structure 110, and the second mark 810 corresponds to the second light-transmitting structure 210, the transmitted light collector 600 can capture the first mark 710 and the second mark 810 at the same time.

[0112] In the above S1005, based on the relative positional relationship between the first mark and the second mark, bonding the first to-be-aligned component and the second to-be-aligned component is achieved, including:

[0113] Based on the transmission image acquired by the transmission light collector, the alignment position deviation value of the first mark and the second mark in the transmission image is acquired, and the position of the first part to be aligned on the first surface and / or the position of the second part to be aligned on the second surface are adjusted according to the deviation value.

[0114] In one possible implementation, based on the position error of the first mark 710 and the second mark 810 captured by the transmitted light collector 600 on the XY plane, the relative positions of the first to-be-aligned part 700 and the second to-be-aligned part 800 are adjusted by the first calibration component and / or the second calibration component to align the first mark 710 and the second mark 810, thereby facilitating the subsequent bonding process. Fig.13 FIG. 1 is a schematic diagram of the first alignment member 700 and the second alignment member 800 after bonding. Fig.13 As shown, the lifting motor 310 drives the second workbench 200 to return to the initial position, so as to facilitate the removal of the first to-be-aligned member 700 and the second to-be-aligned member 800 .

[0115] In some embodiments, the first mark 710 and the second mark 810 are both in an aligned position, including:

[0116] In the transmission image captured by the transmission light collector, the outer contour of the first mark 710 is located inside the inner contour of the second mark 810; or,

[0117] In the transmission image captured by the transmission light collector, the outer contour of the second mark 810 is located inside the inner contour of the first mark 710 .

[0118] In a possible implementation, the first mark 710 and the second mark 810 are marks of a nested design. Exemplarily, the first mark 710 is a solid cross, and the second mark 810 is a hollow cross. When the first mark 710 and the second mark 810 are aligned, the first mark 710 is located inside the second mark 810 in the transmission image captured by the transmission light collector. Exemplarily, the first mark 710 is a hollow circle, and the second mark 810 is a cross. When the first mark 710 and the second mark 810 are aligned, the second mark 810 is located inside the first mark 710 in the transmission image captured by the transmission light collector.

[0119] The bonding alignment method provided by the embodiment of the present invention is concise and efficient, with simple steps, and can improve WPH by about 33% compared with the traditional process. In addition, the bonding mark can be directly used for alignment, and there is only a large movement in a single direction such as the Z-axis direction during the alignment process, which avoids the error caused by the capture and movement of the lens, and can improve the bonding accuracy by about 30%.

[0120] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A bonding alignment device, characterized in that: include: A first workbench, comprising a first surface, for fixing a first piece to be aligned; A second workbench includes a second surface for fixing a second member to be aligned, and the second surface and the first surface are arranged opposite to each other and spaced apart along a first direction; a gap adjustment mechanism, used for adjusting the gap between the second surface and the first surface along the first direction; A first light-transmitting structure, penetrating the first workbench along the first direction; A second light-transmitting structure, penetrating the second workbench along the first direction; a transmission light source, located at a side of the second workbench away from the first workbench; The transmitted light collector is located on a side of the first workbench away from the second workbench.

2. The bonding alignment device according to claim 1, characterized in that: The first workbench also includes: A first bearing platform, slidably disposed on the first surface, and used for bearing the first to-be-aligned member; a first alignment assembly, fixedly mounted on the first surface and drivingly connected to the first carrier platform, for driving the first carrier platform to slide; and / or, The second workbench also includes: A second bearing platform, slidably disposed on the second surface, and used for bearing the second piece to be aligned; The second alignment assembly is fixed on the second surface and is transmission-connected to the second bearing platform for driving the second bearing platform to slide.

3. The bonding alignment device according to claim 2, characterized in that: The first alignment assembly includes a plurality of first piezoelectric units for driving the first carrier platform to move two-dimensionally on the first surface; the second alignment assembly includes a plurality of second piezoelectric units for driving the second carrier platform to move two-dimensionally on the second surface.

4. The bonding alignment device according to any one of claims 1 to 3, characterized in that: The first light-transmitting structure and / or the second light-transmitting structure is a through hole.

5. The bonding alignment device according to any one of claims 1 to 3, characterized in that: The first light-transmitting structures and the second light-transmitting structures are the same in number and are arranged in a one-to-one correspondence; or, The number of the transmitted light sources and the transmitted light collectors is the same and they are arranged in one-to-one correspondence.

6. The bonding alignment device according to any one of claims 1 to 3, characterized in that: The bonding alignment device further comprises a first bracket, the first bracket comprises a first fixed end and a first movable end, the first fixed end is slidably disposed on the second workbench, and the transmission light source is slidably disposed on the first movable end.

7. The bonding alignment device according to any one of claims 1 to 3, characterized in that: The bonding alignment device further comprises: a base and a second bracket; the second bracket comprises a second fixed end and a second movable end, the second fixed end is slidably disposed on the base, and the transmitted light collector is fixedly disposed on the second movable end.

8. The bonding alignment device according to any one of claims 1 to 3, characterized in that: The light emitted by the transmission light source is near infrared light.

9. A bonding alignment method based on the bonding alignment device according to any one of claims 1 to 8, characterized in that: include: Fixing the first piece to be aligned to the first surface of the first workbench so that the orthographic projection of the first light-transmitting structure on the first workbench on the first surface covers and is larger than the orthographic projection of the first mark on the first piece to be aligned on the first surface; Fixing the second piece to be aligned to the second surface of the second workbench so that the orthographic projection of the second light-transmitting structure on the second workbench on the second surface covers and is larger than the orthographic projection of the second mark on the second piece to be aligned on the second surface; adjusting the gap between the first to-be-aligned member and the second to-be-aligned member along a first direction by a gap adjustment mechanism; Turning on the transmission light source, and the transmission light collector simultaneously captures the first mark and the second mark; Based on the relative positional relationship between the first mark and the second mark, the first to-be-aligned component and the second to-be-aligned component are bonded.

10. The bonding alignment method according to claim 9, characterized in that: Based on the relative positional relationship between the first mark and the second mark, the bonding of the first to-be-aligned part and the second to-be-aligned part is achieved, including: based on a transmission image acquired by a transmission light collector, obtaining an alignment position deviation value of the first mark and the second mark in the transmission image, and adjusting the position of the first to-be-aligned part on the first surface according to the deviation value, and / or adjusting the position of the second to-be-aligned part on the second surface.

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