Ultra-wideband antenna and electronic equipment

Abstract

The invention discloses an ultra wide band antenna and electronic equipment. The ultra wide band antenna includes: a substrate; the patch antennas are formed on the first surface of the substrate; wherein two slits are formed in the patch antenna, the two slits respectively extend from two opposite side edges of the patch antenna to the geometric center of the patch antenna, and the extension length of each slit is smaller than the distance between the corresponding side edge and the geometric center.

Description

Technical Field

[0001] The present application relates to the field of antenna technology, and in particular to ultra-wideband antennas and electronic devices. Background Art

[0002] UWB (Ultra Wideband), also known as ultra-wideband, is a carrier-free communication technology that uses non-sinusoidal narrow pulses in the nanosecond to microsecond range to transmit data. In recent years, UWB has been widely used in various electronic devices to achieve close-range and precise indoor positioning. Taking XR glasses as an example, XR glasses usually use FPC antennas to receive UWB signals, but FPC antennas cannot meet the ultra-high frequency requirements of UWB, which affects the quality of the UWB signals received by the communication circuit connected to the XR glasses through the FPC antenna, thereby affecting the positioning accuracy.

[0003] Currently, how to improve the performance of antennas is one of the technical problems that technical personnel in this field need to solve urgently. Summary of the invention

[0004] The ultra-wideband antenna and electronic device provided in the embodiments of the present application can solve or partially solve the above-mentioned deficiencies in the prior art or other deficiencies in the prior art.

[0005] The ultra-wideband antenna provided according to the first aspect of the present application includes:

[0006] substrate; and

[0007] A plurality of patch antennas formed on the first surface of the substrate;

[0008] There are two slits formed in the patch antenna, and the two slits extend from two oppositely disposed side edges of the patch antenna to the geometric center of the patch antenna respectively, and the extension length of the slit is less than the distance between the corresponding side edge and the geometric center.

[0009] According to one embodiment of the present application, the two slits are symmetrically arranged relative to a center line of the patch antenna perpendicular to a first direction, and the first direction is an extension direction of the slits.

[0010] According to one embodiment of the present application, the substrate further includes a second surface disposed opposite to the first surface;

[0011] Wherein, the ultra-wideband antenna further includes:

[0012] A connector fixed to the second surface of the substrate;

[0013] A transmission line corresponds to the patch antennas one by one, one end of the transmission line is electrically connected to the substrate and the corresponding patch antenna, and the other end is electrically connected to the connector.

[0014] According to one embodiment of the present application, the substrate includes a rigid board and a flexible board connected to the rigid board, the patch antenna is formed on the rigid board, and the connector is fixed to the flexible board.

[0015] According to one embodiment of the present application, the first end of the flexible board is connected to the rigid board, the second end of the flexible board extends along a second direction away from the rigid board, the connector is fixed to the second end of the flexible board, and the second direction intersects with the extension direction of the slit.

[0016] According to one embodiment of the present application, the material of the flexible board includes modified polyimide and / or liquid crystal polymer.

[0017] According to one embodiment of the present application, the rigid board includes conductive layers and insulating layers alternately stacked along a third direction, the patch antenna is located in the conductive layer farthest from the second surface, and a wire hole for fixing the transmission line is formed on the side of the patch antenna farthest from the second surface, and the wire hole extends along the third direction to the conductive layer located in the middle of the rigid board, and the third direction is parallel to the thickness direction of the substrate.

[0018] According to one embodiment of the present application, the material of at least one insulating layer includes modified polyimide and / or liquid crystal polymer.

[0019] According to one embodiment of the present application, the flexible board and one of the insulating layers are made of the same material and are integrally formed, and the material includes modified polyimide and / or liquid crystal polymer.

[0020] According to one embodiment of the present application, the number of the conductive layers is not less than four.

[0021] According to one embodiment of the present application, the wire hole is arranged adjacent to one of the slits.

[0022] According to one embodiment of the present application, the number of the patch antennas is three, the three patch antennas are distributed in an equilateral triangle, and the distance between the centers of two adjacent patch antennas is equal to half the wavelength of the UWB signal.

[0023] According to one embodiment of the present application, the substrate is formed with a plurality of through holes penetrating the substrate along a third direction, and the third direction is parallel to the thickness direction of the substrate.

[0024] According to one embodiment of the present application, the distance between two adjacent through holes is less than 1 / 10 of the wavelength of the UWB signal.

[0025] The electronic device provided according to the second aspect of the present application includes:

[0026] A processor, receiving a baseband signal;

[0027] The ultra-wideband antenna according to the first aspect of the present application receives an RF signal;

[0028] The communication circuit converts the baseband signal received by the processor into the RF signal and transmits it to the ultra-wideband antenna, and converts the RF signal received by the ultra-wideband antenna into the baseband signal and transmits it to the processor.

[0029] The ultra-wideband antenna and electronic device provided in the embodiments of the present application can make the patch antenna as a whole H-shaped by forming two oppositely arranged slits on the patch antenna, thereby not only realizing the circular polarization of the patch antenna, increasing the gain and bandwidth of the antenna, and reducing the axial ratio AR, thereby significantly improving the consistency of the radiation pattern and phase of each patch antenna, but also improving the isolation between different patch antennas.

[0030] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Other features, purposes and advantages of the present application will become more apparent by reading the detailed description of the non-limiting embodiments made with reference to the following drawings. The drawings are used to better understand the present solution and do not constitute a limitation of the present application.

[0032] In the attached picture:

[0033] Figure 1 is a schematic top view of an ultra-wideband antenna according to an embodiment of the present application;

[0034] Figure 2 is an axonometric perspective schematic diagram of an ultra-wideband antenna according to an embodiment of the present application;

[0035] Figure 3 is a front view schematic diagram of an ultra-wideband antenna according to an embodiment of the present application;

[0036] Figure 4 is a simulated return loss curve diagram of an ultra-wideband antenna according to an embodiment of the present application;

[0037] Figure 5 is a simulated gain curve diagram of an ultra-wideband antenna according to an embodiment of the present application;

[0038] Figure 6 It is a simulated radiation pattern of the ultra-wideband antenna when the magnetic plane E1, i.e., Phi=90°, according to the implementation mode of the present application;

[0039] Figure 7 is a simulated radiation pattern of an ultra-wideband antenna when the electrical plane E1, ie, Phi=0°, according to an embodiment of the present application; and

[0040] Figure 8 It is a schematic diagram of the structure of XR glasses according to an embodiment of the present application.

[0041] Reference numerals:

[0042] 100, patch antenna; 101, slit; 102, wire hole; 110, first patch antenna;

[0043] 120, second patch antenna; 130, third patch antenna; 200, substrate;

[0044] 201, first surface; 202, second surface; 203, through hole; 204, positioning hole;

[0045] 205, side edge; 210, rigid board; 220, flexible board; 300, connector;

[0046] 401, a first pad; 402, a second pad; 403, a third pad;

[0047] 501, a first transmission line; 502, a second transmission line; 503, a third transmission line;

[0048] 600, ultra-wideband antenna; 700, lens; 710, frame; 800, fisheye camera;

[0049] 900. Sensor. DETAILED DESCRIPTION

[0050] In the description of the embodiments of the present application, it should be noted that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc., indicating the position or state relationship, are based on the position or state relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0051] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0052] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0053] The following is a description of exemplary embodiments of the present application in conjunction with the accompanying drawings, including various details of the embodiments of the present application to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. Similarly, for the sake of clarity and conciseness, the description of well-known functions and structures is omitted in the following description.

[0054] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0055] Combination Figures 1 to 3 As shown, an embodiment of the present application provides an ultra-wideband antenna 600, which includes a substrate 200 and a plurality of patch antennas 100, wherein the plurality of patch antennas 100 are formed on a first surface 201 of the substrate 200, and two slits 101 are formed in the patch antenna 100, wherein the two slits 101 extend from two oppositely disposed side edges 205 of the patch antenna 100 toward a geometric center of the patch antenna 100, respectively, and an extension length of the slit 101 is less than a distance between the corresponding side edge 205 and the geometric center of the patch antenna 100, in other words, the slit 101 does not extend to the geometric center of the patch antenna 100, and the two slits 101 are not connected.

[0056] As can be seen from the above, the present application can make the patch antenna 100 as a whole H-shaped by forming two oppositely arranged slits 101 on the patch antenna 100, thereby not only realizing the circular polarization of the patch antenna 100, increasing the gain and bandwidth of the antenna, reducing the axial ratio AR, and thus significantly improving the consistency of the radiation pattern and phase of each patch antenna 100, but also improving the isolation between different patch antennas 100.

[0057] It should be noted that the two slits 101 can be symmetrically arranged about the center line of the patch antenna 100 perpendicular to the first direction (y direction), that is, the two slits 101 can be symmetrical about the second direction (x direction), the first direction is the extension direction of the slit 101, and the two slits 101 can also be slightly offset along the second direction (x direction) perpendicular to the first direction while ensuring the performance of the ultra-wideband antenna 600.

[0058] In some embodiments, the ultra-wideband antenna 600 may include three patch antennas 100, which are distributed in an equilateral triangle, and the spacing between the centers of two adjacent patch antennas 100 is equal to the half wavelength of the UWB signal. As an example, the spacing between the centers of two adjacent patch antennas 100 is 15cm to 18cm. For ease of description, the three patch antennas 100 are now referred to as the first patch antenna 110, the second patch antenna 120, and the third patch antenna 130 in sequence. The first patch antenna 110 to the third patch antenna 130 can all be used as receiving antennas to receive signals. In addition to receiving signals, one of the patch antennas 100, such as the second patch antenna 120, can also transmit signals. Assuming that the first patch antenna 110 receives the first signal, the second patch antenna 120 receives the second signal, and the third patch antenna 130 receives the third signal, when calculating the AOA (Angle of Arrival), the phase difference between the first signal and the second signal can be calculated based on the difference between the reception time when the first patch antenna 110 receives the first signal and the reception time when the second patch antenna 120 receives the second signal, and then the elevation angle is calculated using the phase difference and the spacing between the first patch antenna 110 and the second patch antenna 120. In addition, the phase difference between the first signal and the third signal can also be calculated based on the difference between the reception time when the first patch antenna 110 receives the first signal and the reception time when the third patch antenna 130 receives the third signal, and then the azimuth angle is calculated using the phase difference and the spacing between the first patch antenna 110 and the third patch antenna 130. As can be seen from the above, the embodiment of the present application can calculate the AOA arrival angle using the PDOA (Phase Difference Of Arrival) between the three patch antennas 100 by making the three patch antennas 100 distributed in a regular triangle, with higher accuracy. When the three patch antennas 100 are distributed in a right-angled triangle, the AOA arrival angle can only be calculated using the PDOA between two patch antennas 100. Compared with the case where the three patch antennas 100 are distributed in a right-angled triangle, the accuracy of the AOA arrival angle obtained by the embodiment of the present application is improved by more than 50%.

[0059] In some embodiments, the substrate 200 includes a second surface 202 disposed opposite to the first surface 201, and the ultra-wideband antenna 600 may further include a connector 300 and a transmission line corresponding to the patch antenna 100, the connector 300 is fixed to the second surface 202 of the substrate 200, one end of the transmission line is electrically connected to the substrate 200 and the corresponding patch antenna 100, and the other end is electrically connected to the connector 300. As an example, the ultra-wideband antenna 600 includes three patch antennas 100 and three transmission lines, and the first surface 201 of the substrate 200 is formed with a first pad 401, a second pad 402, and a third pad 403 electrically connected to the connector 300. For the convenience of description, the three patch antennas 100 can be referred to as the first patch antenna 110, the second patch antenna 120 and the third patch antenna 130, and the three transmission lines can be referred to as the first transmission line 501, the second transmission line 502 and the third transmission line 503, one end of the first transmission line 501 is electrically connected to the substrate 200 and the first patch antenna 110, the other end of the first transmission line 501 is electrically connected to the first soldering pad 401, one end of the second transmission line 502 is electrically connected to the substrate 200 and the second patch antenna 120, the other end of the second transmission line 502 is electrically connected to the second soldering pad 402, one end of the third transmission line 503 is electrically connected to the substrate 200 and the third patch antenna 130, and the other end of the third transmission line 503 is electrically connected to the third soldering pad 403. The connector 300 may be, but is not limited to, a BTB (Board to Board) connector, which not only has the strongest transmission capability, but also has the characteristics of miniaturization, lightness, high-frequency transmission stability, no welding, vibration resistance, noise reduction, etc. In addition, the BTB connector also has super corrosion resistance and super environmental resistance.

[0060] In some embodiments, the three transmission lines, i.e., the first transmission line 501 to the third transmission line 503, may be, but are not limited to, microstrip lines, and the microstrip lines extend along the first surface 201 of the substrate 200. As an example, the transmission lines may include an impedance matching transmission line and a coplanar waveguide transmission line, one end of the impedance matching transmission line is connected to the substrate 200 and the corresponding patch antenna 100, and the other end is connected to the coplanar waveguide transmission line, and one end of the coplanar waveguide transmission line away from the impedance matching transmission line is electrically connected to the connector 300. The coplanar waveguide transmission line may include a signal line and at least one ground line arranged in parallel with the signal line.

[0061] like Figure 1 and Figure 2As shown, the substrate 200 may include a rigid board 210 and a flexible board 220, the rigid board 210 and the flexible board 220 are connected to each other, a plurality of patch antennas 100 are formed on the rigid board 210, and the connector 300 is fixed to the flexible board 220. Since the substrate 200 in the embodiment of the present application includes a rigid board 210 and a flexible board 220, and the connector 300 is fixed to the flexible board 220, when the ultra-wideband antenna 600 is installed inside the electronic device, the ultra-wideband antenna 600 can be electrically connected to the motherboard of the electronic device by simply pressing the connector 300, and the operation is very convenient. In addition, the presence of the flexible board 220 can also make the layout of the ultra-wideband antenna 600 inside the electronic device more free. During the installation of the ultra-wideband antenna 600, the flexible board 220 can be bent according to the internal space of the electronic device, so that the patch antenna 100 can not only be kept away from the metal parts inside the electronic device, thereby ensuring that the patch antenna 100 has a better clearance space, but also reduce the footprint of the entire ultra-wideband antenna 600.

[0062] As an example, the first end of the flexible board 220 is connected to the rigid board 210, the second end of the flexible board 220 extends along the second direction (x direction) in a direction away from the rigid board 210, the connector 300 is fixed to the second end of the flexible board 220, and the first direction intersects the second direction. In order to further improve the bending freedom of the flexible board 220 and reduce the constraint of the rigid board 210 on the flexible board 220, the flexible board 220 can be connected to the rigid board 210 at only the first end, and the remaining part is not connected to the rigid board 210. For example, Figure 1 As shown, the rigid board 210 includes a first area and a second area extending from the edge of the first area along the first direction (y direction), the size of the first area along the second direction (x direction) is greater than the size of the second area along the second direction (x direction), a plurality of patch antennas 100 are fixed to the first area of ​​the rigid board 210, the first end of the flexible board 220 is connected to the second area of ​​the rigid board 210 and extends along the second direction (x direction), and there is a gap between the flexible board 220 and the first area of ​​the rigid board 210, in other words, the flexible board 220 does not contact the first area of ​​the rigid board 210. The material of the flexible board 220 may include, but is not limited to, modified polyimide (MPI) and / or liquid crystal polymer (LCP).

[0063] In some embodiments, Figure 3As shown, the rigid board 210 may include conductive layers and insulating layers alternately stacked along a third direction (z direction), the patch antenna 100 is located in the conductive layer of the second surface 202 farthest from the substrate 200, and a wire hole 102 for fixing the transmission line is formed on the side of the patch antenna 100 farthest from the second surface 202, and the wire hole 102 extends along the third direction (z direction) to the conductive layer located in the middle of the rigid board 210, and the third direction intersects with the first direction and is parallel to the thickness direction of the substrate 200. As an example, the rigid board 210 may include at least four conductive layers. For example, the rigid board 210 includes four conductive layers and three insulating layers, and the materials of the four conductive layers may be the same or different, and similarly, the materials of the three insulating layers may be the same or different. The patch antenna 100 is located in the outermost conductive layer, and the wire hole 102 is arranged adjacent to one of the slits 101 of the patch antenna 100. The material of the conductive layer may include, but is not limited to, conductive metal materials such as copper, silver, and gold, and the material of at least one insulating layer includes modified polyimide (MPI) and / or liquid crystal polymer (LCP).

[0064] In some embodiments, the substrate 200 can be prepared by an HTCP process, i.e., a multi-layer interlayer structure interconnection process. In other words, the flexible board 220 and the rigid board 210 can be formed simultaneously by means of the HTCP process. Taking the rigid board 210 as an example, which includes conductive layers and insulating layers alternately stacked along a third direction (z direction), the flexible board 220 and one of the insulating layers are made of the same material and are integrally formed. In other words, the flexible board 220 and the insulating layer are the same layer of insulating material. For example, when preparing the substrate 200, a first insulating layer with a thickness of 100um can be formed on one side of a first conductive layer with a thickness of 12um, a second conductive layer with a thickness of 12um can be formed on the side of the first insulating layer away from the first conductive layer, a second insulating layer with a thickness of 75um can be formed on the side of the second conductive layer away from the first insulating layer, a third conductive layer with a thickness of 18um can be formed on the side of the second insulating layer away from the second conductive layer, a third insulating layer with a thickness of 300um can be formed on the side of the third conductive layer away from the second insulating layer, and a fourth conductive layer with a thickness of 18um can be formed on the side of the third insulating layer away from the third conductive layer. The area of ​​the second insulating layer is greater than the area of ​​the other layers. In other words, the second insulating layer includes a first part and a second part. On a plane perpendicular to the third direction (z direction), the projection of the first part of the second insulating layer overlaps with the projection of the other layers, and the projection of the second part of the second insulating layer does not overlap with the projection of the other layers. Thus, the first conductive layer, the first insulating layer, the second conductive layer, the first part of the second insulating layer, the third conductive layer, the third insulating layer and the fourth conductive layer constitute a rigid board 210, and the second part of the second insulating layer constitutes a flexible board 220. The patch antenna 100 is embedded in the first conductive layer, that is, the patch antenna 100 is located in the first conductive layer and penetrates the first conductive layer. The materials of the patch antenna 100 and the first conductive layer can be the same. A wire hole 102 is formed on the side of the patch antenna 100 away from the first insulating layer, and the wire hole 102 penetrates the second conductive layer along the third direction (z direction). Among them, the materials of the first conductive layer to the fourth conductive layer may include but are not limited to conductive metal materials such as copper, silver, and gold, and the material of at least one insulating layer includes modified polyimide, namely MPI, and / or liquid crystal polymer, namely LCP. For example, the materials of the first insulating layer and the second insulating layer may include but are not limited to modified polyimide, namely MPI, and / or liquid crystal polymer, namely LCP, and the material of the third insulating layer may include but is not limited to flame-retardant materials of FR-4 grade. It should be noted that a protective layer may be formed on the side of the first conductive layer away from the first insulating layer and / or the side of the fourth conductive layer away from the third insulating layer. Among them, the material of the protective layer may include but is not limited to CVL (crystal violet lactone). In addition, in order to facilitate installation and positioning, the substrate 200 is also provided with at least one positioning hole 204. In order to prevent the positioning hole 204 from affecting the layout of the transmission line and the patch antenna 100, the positioning hole 204 can be opened at the corner of the substrate 200.

[0065] The embodiment of the present application uses the HTCP process to prepare the substrate 200, which can reduce the number of stacked layers of the substrate 200, increase the depth of the wire hole 102, and increase the thickness between the patch antenna 100 and the second conductive layer. The greater the height from the ground, the greater the radiation gain, thereby improving the performance of the patch antenna 100. In addition, since MPI and LCP have high DK in addition to bendability, and have the characteristics of high stability and low loss, and under the premise of achieving the same performance, the smaller the DK of the material, the smaller the size of the antenna can be made, so when the materials of the flexible board 220 and the rigid board 210 both include modified polyimide, namely MPI and / or liquid crystal polymer, namely LCP, the area and thickness of the entire ultra-wideband antenna 600 can be further reduced. In addition, since the BTB connector has the characteristics of miniaturization and lightness, it is found through research that when the ultra-wideband antenna 600 adopts the BTB connector and the materials of the flexible board 220 and the rigid board 210 both include MPI and / or LCP, the area of ​​the ultra-wideband antenna 600 of the present application can be only 27.5mm*25mm*0.88mm, while the area of ​​the ultra-wideband antenna 600 of the prior art is as high as 35mm*35mm*2mm. It can be seen that compared with the prior art, the area of ​​the ultra-wideband antenna 600 of the present application is reduced by 43.9% and the thickness is reduced by 56%.

[0066] In some embodiments, the substrate 200 is formed with a plurality of through holes 203 that penetrate the substrate 200 along a third direction (z direction), and the third direction (z direction) intersects with the first direction and is parallel to the thickness direction of the substrate 200. As an example, the spacing between two adjacent through holes 203 is less than 1 / 10 of the wavelength of the UWB signal. Since electromagnetic waves have spatial radiation, the embodiment of the present application can use the through holes 203 to quickly conduct microcurrent to the ground by opening a plurality of through holes 203 on the substrate 200, thereby increasing the isolation of the ultra-wideband antenna 600.

[0067] Figure 4 : shows a simulated return loss curve of the ultra-wideband antenna 600 in an embodiment of the present application, Figure 4 ANT0 refers to the first patch antenna 110, ANT1 refers to the second patch antenna 120, and ANT2 refers to the third patch antenna 130. Figure 4 It can be seen from the figure that the central frequency of the ultra-wideband antenna 600 of the embodiment of the present application is basically around 8 GHZ, and the resonant frequency and bandwidth are well consistent.

[0068] Figure 5 : shows a simulated gain curve diagram of the ultra-wideband antenna 600 in an embodiment of the present application, Figure 5ANT0 refers to the first patch antenna 110, ANT1 refers to the second patch antenna 120, and ANT2 refers to the third patch antenna 130. Figure 5 It can be seen that within the frequency range of 7800 MHz to 8050 MHz, the gain difference between the first patch antenna 110 , the second patch antenna 120 and the third patch antenna 130 is less than 1 db.

[0069] Figure 6 FIG. 4 shows the simulated radiation pattern of the ultra-wideband antenna 600 in the embodiment of the present application when the magnetic plane E1, ie, Phi=90°. Figure 6 ANT0 refers to the first patch antenna 110, ANT1 refers to the second patch antenna 120, and ANT2 refers to the third patch antenna 130. Figure 6 It can be seen from the figure that within the range of ±60° on the magnetic plane E1, the gain difference between the first patch antenna 110, the second patch antenna 120 and the third patch antenna 130 is relatively small.

[0070] Figure 7 FIG. 4 shows the simulated radiation pattern of the ultra-wideband antenna 600 in the embodiment of the present application when the electric plane E1, ie, Phi=0°, Figure 7 ANT0 refers to the first patch antenna 110, ANT1 refers to the second patch antenna 120, and ANT2 refers to the third patch antenna 130. Figure 7 It can be seen from the figure that within the range of ±60° on the electrical plane E2, the gain difference between the first patch antenna 110, the second patch antenna 120 and the third patch antenna 130 is relatively small.

[0071] In addition, if Figure 8 As shown, the embodiment of the present application also provides an electronic device, which includes a processor, a communication circuit and the above-mentioned ultra-wideband antenna 600, the processor can receive a baseband signal, the ultra-wideband antenna 600 can receive an RF signal, the communication circuit converts the baseband signal received by the processor into an RF signal and transmits it to the ultra-wideband antenna 600, and converts the RF signal received by the ultra-wideband antenna 600 into a baseband signal and transmits it to the processor

[0072] As an example, the electronic device may be an XR glasses, which may include a processor, a communication circuit, and an ultra-wideband antenna 600, as well as a lens 700 and a frame 710 disposed on both sides of the lens 700. The lens 700 is provided with at least one image acquisition device such as a fisheye camera 800 and at least one sensor 900.

[0073] The above specific implementations do not constitute a limitation on the protection scope of the present disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. An ultra-wideband antenna, characterized in that: include: substrate; as well as A plurality of patch antennas formed on the first surface of the substrate; There are two slits formed in the patch antenna, and the two slits extend from two oppositely disposed side edges of the patch antenna to the geometric center of the patch antenna respectively, and the extension length of the slit is less than the distance between the corresponding side edge and the geometric center.

2. The ultra-wideband antenna according to claim 1, wherein: The two slits are symmetrically arranged relative to a center line of the patch antenna perpendicular to a first direction, and the first direction is an extending direction of the slits.

3. The ultra-wideband antenna according to claim 1, wherein: The substrate further includes a second surface disposed opposite to the first surface; Wherein, the ultra-wideband antenna further includes: A connector fixed to the second surface; A transmission line corresponds to the patch antennas one by one, one end of the transmission line is electrically connected to the substrate and the corresponding patch antenna, and the other end is electrically connected to the connector.

4. The ultra-wideband antenna according to claim 3, wherein: The substrate includes a rigid board and a flexible board connected to the rigid board, the patch antenna is formed on the rigid board, and the connector is fixed to the flexible board.

5. The ultra-wideband antenna according to claim 4, wherein: The first end of the flexible board is connected to the rigid board, the second end of the flexible board extends away from the rigid board along a second direction, the connector is fixed to the second end of the flexible board, and the second direction intersects with the extension direction of the slit.

6. The ultra-wideband antenna according to claim 4, wherein: The material of the flexible board includes modified polyimide and / or liquid crystal polymer.

7. The ultra-wideband antenna according to claim 4, wherein: The rigid board includes conductive layers and insulating layers alternately stacked along a third direction, the patch antenna is located in the conductive layer farthest from the second surface, a wire hole for fixing a transmission line is formed on a side of the patch antenna farthest from the second surface, the wire hole extends along the third direction to the conductive layer located in the middle of the rigid board, and the third direction is parallel to the thickness direction of the substrate.

8. The ultra-wideband antenna according to claim 7, wherein: The material of at least one of the insulating layers includes modified polyimide and / or liquid crystal polymer.

9. The ultra-wideband antenna according to claim 7, wherein: The flexible board and one of the insulating layers are made of the same material and are integrally formed, and the material includes modified polyimide and / or liquid crystal polymer.

10. The ultra-wideband antenna according to claim 7, wherein: The number of the conductive layers is not less than four.

Images