Photosensitive assembly and periscopic camera module

Abstract

The photosensitive assembly comprises a photosensitive chip, a connecting circuit board, a leading-out circuit board and a chip circuit board, the photosensitive chip is provided with a chip upper surface and a chip lower surface which are opposite to each other, the chip circuit board is provided with a board upper surface and a board lower surface which are opposite to each other, and a board through hole penetrating through the board upper surface and the board lower surface, and the connecting end of the lead-out circuit board is connected to one side of the chip circuit board; wherein a non-photosensitive area of the photosensitive chip is mounted on the lower surface of the plate of the chip circuit board, a photosensitive area of the photosensitive chip corresponds to the plate through hole of the chip circuit board, and the connecting circuit board is mounted on the lower surface of the plate of the chip circuit board. And the connecting circuit board is used for conducting a pair of circuits of the chip circuit board, which are positioned on the different sides of the board through hole.

Description

Technical Field

[0001] The present invention relates to the field of photography, and in particular to a photosensitive component and a periscope camera module. Background Art

[0002] In recent years, portable electronic devices have been increasingly moving towards intelligence and thinness. On this basis, in order to meet the requirements of portable electronic devices for the imaging capabilities of camera modules, periscope camera modules have been developed and equipped. Figure 1A and Figure 1B The invention is a photosensitive component of a periscope camera module of the prior art, which includes a chip circuit board 10P, a photosensitive chip 20P and a lead-out circuit board 30P, wherein the chip circuit board 10P has a plate front side 11P, a plate back side 12P corresponding to the plate front side 11P and a plate through hole 13P penetrating the plate front side 11P and the plate back side 12P, the photosensitive chip 20P has a chip front side 21P and a chip back side 22P corresponding to the chip front side 21P, based on the chip flip-chip process, the chip front side 21P of the photosensitive chip 20P and the plate front side 12P of the chip circuit board 10P are mounted, and the chip solder joint of the photosensitive chip 20P located in the non-photosensitive area The plate soldering pad 12P of the plate and the chip circuit board 10P located on the back side of the plate is connected, the photosensitive area of ​​the photosensitive chip 20P corresponds to the plate through-hole 13P of the chip circuit board 10P, one end of the export circuit board 30P is connected to one side of the chip circuit board 10P, and the other end can be connected to the portable electronic device, that is, the function of the export circuit board 30P is to connect the periscope camera module and the portable electronic device. Therefore, it can be understood that the circuit 14P derived from the photosensitive chip 20P by the chip circuit board 10P must be exported through the export circuit board 30P, and connected by the export circuit board 30P and the portable electronic device. Since the pads on at least two sides of the chip circuit board 10P and the photosensitive chip 20P are connected, and only one end of the export circuit board 30P is connected to a side of the chip circuit board 10P, the circuit 14P on the side of the chip circuit board 10P away from the connection position of the chip circuit board 10P and the export circuit board 30P needs to bypass the top or bottom of the plate through hole 13P of the chip circuit board 10P and extend to the side of the chip circuit board 10P used to connect to the export circuit board 30P, that is, the chip circuit board 10P needs to reserve sufficient width above and / or below the plate through hole 13P for laying out the circuit 14P, which results in the height of the periscope camera module cannot be lowered, and further causes the periscope camera module to be unable to adapt to the further lightweight development trend of portable electronic devices. Summary of the invention

[0003] An object of the present invention is to provide a photosensitive component and a periscope camera module, wherein the height dimension of the periscope camera module can be further reduced to meet the further lightweight development trend of portable electronic devices.

[0004] One object of the present invention is to provide a photosensitive component and a periscope camera module, wherein the connecting circuit board of the photosensitive component is connected to a pair of circuits of a chip circuit board located on opposite sides of a plate perforation, so that a smaller number of circuits can be arranged on at least one side of the chip circuit board, or even no circuits can be arranged, so as to help reduce the height dimension of the periscope camera module.

[0005] One object of the present invention is to provide a photosensitive component and a periscope camera module, wherein the height difference between the inner surface and the outer surface of the chip circuit board is greater than the thickness of the photosensitive chip to prevent the photosensitive chip from protruding from the lower surface of the chip circuit board. In this way, during the process of mounting the connecting circuit board on the chip circuit board, the photosensitive chip is prevented from being pressed to prevent the photosensitive chip from being deformed or compressed, thereby improving the yield of the periscope camera module.

[0006] One object of the present invention is to provide a photosensitive component and a periscope camera module, wherein the photosensitive component is provided with a heat-conducting portion between the lower surface of the photosensitive chip and the connecting circuit board for dissipating the heat generated by the photosensitive chip and reducing the temperature of the photosensitive chip during operation.

[0007] According to one aspect of the present invention, the present invention provides a photosensitive component, which includes:

[0008] Connect the circuit board;

[0009] A lead-out circuit board has an opposing connection end and an assembly end;

[0010] A photosensitive chip having an upper chip surface and a lower chip surface opposite to each other, wherein the upper chip surface has a photosensitive area and a non-photosensitive area surrounding the photosensitive area; and

[0011] A chip circuit board has an upper plate surface and a lower plate surface relative to each other, and a plate through-hole penetrating the upper plate surface and the lower plate surface, wherein the connection end of the lead-out circuit board is connected to one side of the chip circuit board, wherein the non-photosensitive area of ​​the photosensitive chip is mounted on the lower plate surface of the chip circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the plate through-hole of the chip circuit board, wherein the connecting circuit board is mounted on the lower plate surface of the chip circuit board, and the connecting circuit board conducts a pair of circuits of the chip circuit board located on opposite sides of the plate through-hole.

[0012] According to one embodiment of the present invention, the connecting circuit board conducts at least one circuit of the chip circuit board for connecting to one side of the export circuit board and at least one circuit of the chip circuit board away from the export circuit board.

[0013] According to one embodiment of the present invention, the connecting circuit board conducts at least one circuit of the chip circuit board for connecting one side of the export circuit board and at least one circuit of the chip circuit board on one side close to the export circuit board.

[0014] According to one embodiment of the present invention, the four sides of the chip circuit board used to define the plate through-holes are respectively defined as a first side of the plate, a second side of the plate, a third side of the plate and a fourth side of the plate in a clockwise direction, the first side of the plate and the third side of the plate correspond to each other in the width direction, the second side of the plate and the fourth side of the plate correspond to each other in the height direction, wherein the connecting end of the export circuit board is connected to the first side of the plate of the chip circuit board, wherein the connecting circuit board conducts at least one circuit located on the first side of the plate and at least one circuit located on the third side of the plate.

[0015] According to one embodiment of the present invention, the four sides of the chip circuit board used to define the plate through-holes are respectively defined as a first side of the plate, a second side of the plate, a third side of the plate and a fourth side of the plate in a clockwise direction, the first side of the plate and the third side of the plate correspond to each other in the width direction, the second side of the plate and the fourth side of the plate correspond to each other in the height direction, wherein the connecting end of the export circuit board is connected to the first side of the plate of the chip circuit board, wherein the connecting circuit board conducts at least one circuit located on the first side of the plate and at least one circuit located on the second side of the plate.

[0016] According to one embodiment of the present invention, the connecting circuit board is on the back of the photosensitive chip.

[0017] According to one embodiment of the present invention, the lower surface of the plate of the chip circuit board has an inner surface and an outer surface surrounding the inner surface, and the height difference between the inner surface and the outer surface is greater than the thickness of the photosensitive chip, wherein the photosensitive chip is mounted on the inner surface of the chip circuit board, and the connecting circuit board is mounted on the outer surface of the chip circuit board, and there is a gap between the lower surface of the photosensitive chip and the connecting circuit board.

[0018] According to one embodiment of the present invention, the photosensitive component includes a heat-conducting portion, and the heat-conducting portion is arranged in the gap between the chip lower surface of the photosensitive chip and the connecting circuit board.

[0019] According to one embodiment of the present invention, the photosensitive chip has a MIPI interface, the chip circuit board has a MIPI circuit, the MIPI circuit is completely arranged on the chip circuit board, and the MIPI circuit connects the MIPI interface of the photosensitive chip and the export circuit board.

[0020] According to one embodiment of the present invention, the chip circuit board is a rigid circuit board, and the connection circuit board is a flexible circuit board.

[0021] According to one embodiment of the present invention, the connection circuit board has two wiring layers, and the chip circuit board has four or six wiring layers, wherein the lines in the two wiring layers of the connection circuit board are parallel lines.

[0022] According to one embodiment of the present invention, the number of routing layers of the connecting circuit board is two, and the number of routing layers of the chip circuit board is four or six, wherein the lines of one of the two layers of routing of the connecting circuit board are parallel lines, and the lines of the other layer of routing are grid lines.

[0023] According to one embodiment of the present invention, the photosensitive component includes a reinforcement unit, and the reinforcement unit includes a front reinforcement part and a back reinforcement part, wherein the front reinforcement part has a light window, and the front reinforcement part is arranged on the upper surface of the plate material of the chip circuit board, and the light window of the front reinforcement part is communicated with the plate material through-hole of the chip circuit board, wherein the back reinforcement part has a mounting channel, and the back reinforcement part is arranged on the lower surface of the plate material of the chip circuit board, and the connecting circuit board is accommodated in the mounting channel of the back reinforcement part.

[0024] According to an embodiment of the present invention, the front reinforcing portion is integrally formed on the upper surface of the plate of the chip circuit board, and the back reinforcing portion is integrally formed on the lower surface of the plate of the chip circuit board.

[0025] According to another aspect of the present invention, the present invention further provides a periscope camera module, which includes:

[0026] Optical lens;

[0027] Light path reflection component; and

[0028] The photosensitive component further comprises:

[0029] Connect the circuit board;

[0030] A lead-out circuit board has an opposing connection end and an assembly end;

[0031] A photosensitive chip having an upper chip surface and a lower chip surface opposite to each other, wherein the upper chip surface has a photosensitive area and a non-photosensitive area surrounding the photosensitive area; and

[0032] A chip circuit board having an upper plate surface and a lower plate surface relative to each other, and a plate through-hole penetrating the upper plate surface and the lower plate surface, wherein the connection end of the derivation circuit board is connected to one side of the chip circuit board, wherein the non-photosensitive area of ​​the photosensitive chip is mounted on the lower plate surface of the chip circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the plate through-hole of the chip circuit board, wherein the connection circuit board is mounted on the lower plate surface of the chip circuit board, and the connection circuit board conducts at least one circuit located on the first side of the plate and at least one circuit located on the second side of the plate, wherein the optical lens and the light path reflection component are respectively arranged on the photosensitive path of the photosensitive chip of the photosensitive component.

[0033] According to another aspect of the present invention, the present invention further provides a method for manufacturing a photosensitive component, wherein the manufacturing method comprises the following steps:

[0034] (a) mounting a non-photosensitive area of ​​a photosensitive chip on the lower surface of a chip circuit board, wherein the photosensitive area of ​​the photosensitive chip corresponds to a through hole of the chip circuit board; and

[0035] (b) Mounting a connecting circuit board on the lower surface of the chip circuit board, wherein the connecting circuit board conducts a pair of circuits of the chip circuit board located on opposite sides of the plate through-hole to obtain the photosensitive component.

[0036] According to one embodiment of the present invention, the step (a) further comprises the steps of:

[0037] (a.1) providing a first solder on the inner pad of the chip circuit board;

[0038] (a.2) providing a second solder on the chip pad of the photosensitive chip; and

[0039] (a.3) After attaching the photosensitive chip to the chip circuit board, thermally press-bonding the first solder and the second solder to achieve mounting of the photosensitive chip and the chip circuit board.

[0040] According to one embodiment of the present invention, in step (b), the top side pads of the connecting circuit board and the outer side pads of the chip circuit board are connected by a hot pressing welding process or an anisotropic conductive adhesive film process to mount the connecting circuit board on the lower surface of the chip circuit board.

[0041] According to one embodiment of the present invention, in the step (a), the photosensitive chip is mounted on the inner surface of the chip circuit board to prevent the photosensitive chip from protruding from the lower surface of the plate of the chip circuit board, and in the step (b), a gap is formed between the lower surface of the photosensitive chip and the connecting circuit board to prevent the photosensitive chip from being pressed during the process of mounting the connecting circuit board on the lower surface of the plate of the chip circuit board through a hot pressing welding process or anisotropic conductive adhesive film process.

[0042] According to one embodiment of the present invention, before step (b), thermally conductive silicone is arranged on the chip lower surface of the photosensitive chip and the connecting circuit board, so that after step (b), the thermally conductive silicone forms a heat-conducting part between the chip lower surface of the photosensitive chip and the connecting circuit board.

[0043] According to one embodiment of the present invention, before the step (a), the manufacturing method further includes the step of: (c) providing a back reinforcement portion on the lower surface of the plate of the chip circuit board, and the mounting channel of the back reinforcement portion is connected to the plate through-hole of the chip circuit board, so that in the step (a), the non-photosensitive area of ​​the photosensitive chip is mounted on the plate surface of the chip circuit board through the mounting channel of the back reinforcement portion.

[0044] According to one embodiment of the present invention, before the step (b), the manufacturing method further comprises the step of: providing a side encapsulation on the side of the photosensitive chip.

[0045] According to one embodiment of the present invention, the side encapsulation fills the gap between the side of the photosensitive chip and the back reinforcement portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1A and Figure 1B It is a schematic diagram of different viewing angles of the photosensitive component of the prior art.

[0047] Figure 2 It is a cross-sectional schematic diagram of a periscope camera module according to a preferred embodiment of the present invention.

[0048] Figure 3 It is a schematic cross-sectional view in one direction of a photosensitive component of the periscope camera module according to the above preferred embodiment of the present invention.

[0049] Figure 4 yes Figure 3 A magnified view of a local location.

[0050] Figure 5It is a cross-sectional schematic diagram of the photosensitive component of the periscope camera module in another direction according to the above preferred embodiment of the present invention.

[0051] Figure 6 It is a schematic diagram of a partial structure of the photosensitive component of the periscope camera module according to the above-mentioned preferred embodiment of the present invention.

[0052] 7A to 7H It is a schematic diagram of the manufacturing process of the photosensitive component of the periscope camera module according to the present invention. DETAILED DESCRIPTION

[0053] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components described below or illustrated in the following figures. The present invention can have other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used here are for descriptive purposes and should not be considered restrictive. The use of "including", "comprising" or "having" and its variations herein is intended to cover the items and their equivalents and additional items displayed below. Unless otherwise specified or limited, the terms "install", "connect", "support" and "couple" and their variations are widely used and cover direct installation and indirect installation, connection, support and connection. In addition, "connect" and "couple" are not limited to physical or mechanical connections or connections.

[0054] Furthermore, on the first aspect, in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or positional relationship shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second aspect, the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" cannot be understood as a limitation on the quantity.

[0055] With reference to the accompanying drawings of the present invention Figures 2 to 6A periscope camera module according to a preferred embodiment of the present invention will be disclosed and explained in the following description, wherein the periscope camera module includes an optical path reflection component 10, a lens component 20 and a photosensitive component 30, wherein the optical path reflection component 10 is arranged on the light incident side of the lens component 20, and the photosensitive component 30 is arranged on the light exit side of the lens component 20, wherein the incident light is deflected 90° by the optical path reflection component 10 and reaches the photosensitive component 30 after passing through the lens component 20, and the photosensitive component 30 performs photoelectric conversion to form an image.

[0056] In another example of the periscope camera module of the present invention, the optical path reflection component 10 and the photosensitive component 30 are sequentially arranged on the light-emitting side of the lens component 20, that is, the optical path reflection component 10 is located between the lens component 20 and the photosensitive component 30, wherein the incident light reaches the photosensitive component 30 after passing through the lens component 20 and being turned 90° by the optical path reflection component 10, and the photosensitive component 30 performs photoelectric conversion into imaging.

[0057] In another example of the periscope camera module of the present invention, the periscope camera module includes a plurality of the lens assemblies 20, and the light path reflection assembly 10 is located between two adjacent lens assemblies 20, wherein the incident light is deflected 90° by the light path reflection assembly 10 after passing through at least one of the lens assemblies 20, and the deflected incident light reaches the photosensitive assembly 30 after further passing through at least one of the lens assemblies 20, and the photosensitive assembly 30 performs photoelectric conversion into imaging.

[0058] Reference Figure 2 The periscope camera module includes a shell 40, which has a receiving cavity 41 and a light inlet 42 and a light outlet 43 respectively connected to the receiving cavity 41, wherein the light path reflection component 10 is received in the receiving cavity 41 of the shell 40, and the incident surface 11 of the light path reflection component 10 corresponds to the light inlet 42 of the shell 40, so as to allow the incident light entering from the light inlet 42 of the shell 40 to be incident on the incident surface 11 of the light path reflection component 10, wherein the lens assembly 20 is received in the receiving cavity 41 of the shell 40, wherein the photosensitive component 30 is arranged at the light outlet 43 of the shell 40, so as to allow the light emitted from the light outlet 43 of the shell 40 to reach the photosensitive component 30, and the photosensitive component 30 performs photoelectric conversion to form an image.

[0059] Reference Figure 2In this specific example of the periscope camera module of the present invention, the lens assembly 20 is movable so that the periscope camera module has a focus and / or anti-shake function. For example, the lens assembly 20 is configured to be movable along the length direction so that the camera module has a focus function, and / or the lens assembly 20 is configured to be movable along the height direction and the width direction so that the camera module has an anti-shake function, wherein the direction in which the light enters the optical path reflection assembly 10 is the height direction, the direction in which the light exits the optical path reflection assembly 10 is the length direction, the height direction is perpendicular to the length direction, and the direction perpendicular to the height direction and the length direction is the width direction.

[0060] It is worth mentioning that the specific structure for driving the lens assembly 20 to move along the length direction and the specific structure for driving the lens assembly 20 to move along the height direction and the width direction are not limited in the periscope camera module of the present invention.

[0061] In one embodiment of the periscope camera module of the present invention, the optical path reflection component 10 is configured to be rotatable around the central axis of the incident surface 11 of the optical path reflection component 10 and is configured to be rotatable around the central axis of the exit surface 12 of the optical path reflection component 10, so that the periscope camera module has an optical image stabilization function. It is worth mentioning that the specific structure of driving the optical path reflection component 10 to rotate around the central axis of the incident surface 11 of the optical path reflection component 10 and around the central axis of the exit surface 12 is not limited in the periscope camera module of the present invention.

[0062] Continue to refer to the attached Figures 2 to 6The photosensitive component 30 includes a chip circuit board 31, a photosensitive chip 32 and a connecting circuit board 33. The chip circuit board 31 has a plate upper surface 311 and a plate lower surface 312 opposite to each other, and a plate through hole 313 that penetrates the plate upper surface 311 and the plate lower surface 312. The photosensitive chip 32 has a chip upper surface 321 and a chip lower surface 322 opposite to each other, the chip upper surface 321 has a photosensitive area 3211 and a non-photosensitive area 3212 surrounding the photosensitive area 3211, wherein the non-photosensitive area 3212 of the photosensitive chip 32 is mounted on the plate lower surface 312 of the chip circuit board 31, and the photosensitive area 3211 of the photosensitive chip 32 corresponds to the plate through hole 313 of the chip circuit board 31. The connecting circuit board 33 is mounted on the lower surface 312 of the chip circuit board 31, wherein the connecting circuit board 33 conducts a pair of circuits of the chip circuit board 31 located on one side of the plate through hole 313. For example, a pair of circuits of the chip circuit board 31 located on the opposite side of the plate through hole 313 and conducting the photosensitive chip 32 can be conducted by the connecting circuit board 33. In this way, in the height direction of the periscope camera module, the area above and / or below the plate through hole 313 of the chip circuit board 31 can be arranged with fewer circuits, or even the circuit arrangement can be cancelled, so as to reduce the width dimension of the area above and / or below the plate through hole 313 of the chip circuit board 31, thereby reducing the height dimension of the periscope camera module.

[0063] For example, in this specific example of the periscope camera module of the present invention, refer to the attached Figure 6The four sides of the chip circuit board 31 used to define the plate through hole 313 are respectively defined as a first side 314, a second side 315, a third side 316 and a fourth side 317 of the plate in a clockwise direction, wherein the first side 314 and the third side 316 of the plate correspond to each other in the width direction of the periscope camera module, and the second side 315 and the fourth side 317 of the plate correspond to each other in the height direction of the periscope camera module. At least one first circuit 3141 located on the first side 314 of the plate and at least one second circuit 3161 located on the third side 316 of the plate are connected through the connecting circuit board 33, so that the second side 315 of the plate does not need to be arranged with a circuit for connecting the first circuit 3141 and the second circuit 3161, so that the width dimension of the second side 315 of the plate can be reduced, which is beneficial to reducing the height dimension of the periscope camera module, and the fourth side 317 of the plate also does not need to be arranged with a circuit for connecting the first circuit 3141 and the second circuit 3161, so that the width dimension of the fourth side 317 of the plate can be reduced, which is beneficial to reducing the height dimension of the periscope camera module.

[0064] In the attached Figures 2 to 6 In this specific example of the periscope camera module of the present invention shown, at least one of the first circuits 3141 located on the first side 314 of the plate and at least one third circuit 3151 located on the second side 315 of the plate can also be conductively connected through the connecting circuit board 33. For example, the third circuit 3151 away from the first side 314 of the plate can be conductively connected to the first circuit 3141 through the connecting circuit board 33. In this way, the chip circuit board 31 can be arranged with a smaller number of the third circuits 3151 on the second side 315 of the plate to reduce the width dimension of the second side 315 of the plate, which is beneficial to reduce the height dimension of the periscope camera module.

[0065] Reference Figure 2 , Figure 3 and Figure 6, the photosensitive component 30 includes an export circuit board 34, the export circuit board 34 has a connecting end 341 and an assembly end 342 opposite to each other and a connector 343 located at the assembly end 342, wherein the connecting end 341 of the export circuit board 34 is connected to the first side 314 of the plate of the chip circuit board 31, and the connector 343 of the export circuit board 34 can be connected to a portable electronic device. In other words, the connection between the periscope camera module and the portable electronic device is realized by the export circuit board 34, so the third circuit 3151 located on the second side 315 of the plate and the second circuit 31612 located on the third side 316 of the plate need to bypass the plate through-hole 313 of the chip circuit board 31 and then extend to the first side 314 of the plate, and then further extend to the export circuit board 34 and connect to the portable electronic device through the export circuit board 34.

[0066] In the periscope camera module of the present invention, the connecting circuit board 33 is mounted on the lower surface 312 of the chip circuit board 31, and the connecting circuit board 33 conductively connects at least one first circuit 3141 and at least one second circuit 3161 and / or conductively connects at least one first circuit 3141 and at least one third circuit 3151, so that a smaller number of the third circuits 3151 can be arranged on the second side 315 of the plate, and the fourth side 317 of the plate can no longer be arranged with a circuit for conducting the first circuit 3141 and the second circuit 3161, so that the width dimension of the second side 315 of the plate and the width dimension of the fourth side 317 of the plate can be reduced, which is beneficial to reducing the height dimension of the periscope camera module.

[0067] Specifically, in the attached Figures 2 to 6In this specific example of the periscope camera module of the present invention shown, the chip circuit board 31 has three columns of inner pads 318 and three columns of outer pads 319, which are respectively located on the lower surface 312 of the plate, and the first side 314 of the plate, the second side 315 of the plate, and the third side 316 of the plate are respectively provided with a column of the inner pads 318 and a column of the outer pads 319. The photosensitive chip 32 has three columns of chip pads 323, and three of the four sides of the photosensitive area 3211 of the photosensitive chip 32 are respectively provided with a column of chip pads 323, wherein the photosensitive chip 32 is mounted on the lower surface 312 of the plate of the chip circuit board 31 in a manner that each column of the chip pads 323 and each column of the inner pads 318 are respectively welded. The connecting circuit board 33 has three columns of top side pads 331 , wherein the connecting circuit board 33 is mounted on the lower surface of the chip circuit board 31 in a manner that each column of the top side pads 331 and each column of the outer side pads 319 are respectively welded.

[0068] That is to say, in the periscope camera module of the present invention, first, the photosensitive chip 32 is flip-chip soldered to the chip circuit board 31, and secondly, the connecting circuit board 33 is soldered to the lower surface 312 of the plate of the chip circuit board 31, so that the connecting circuit board 33 can conduct the circuit of the chip circuit board 31 on the opposite side of the plate through-hole 313 and the photosensitive chip 32 on the back side of the photosensitive chip 32. For example, the connecting circuit board 33 can conduct the first circuit 3141 located on the first side 314 of the plate and the second circuit 3161 located on the third side 316 of the plate on the back side of the photosensitive chip 32, so that the first circuit 3141 and the second circuit 3161 form a complete circuit. The circuit board 33 can also connect the first circuit 3141 and the third circuit 3151 on the back side of the photosensitive chip 32 so that the first circuit 3141 and the third circuit 3151 form a complete circuit. In this way, it is possible to avoid the increase in the lateral (height and width) dimensions of the chip circuit board 31 or the increase in the thickness (length) dimension of the chip circuit board 31 caused by all the circuits leading out from the photosensitive chip 32 extending on the chip circuit board 31, thereby avoiding the problem of an increase in the height dimension of the periscope camera module due to the increase in the lateral dimension of the chip circuit board 31 and avoiding the risk of bending of the chip circuit board 31 after the plate perforation 313 is set due to the increase in the thickness of the circuit board 31.

[0069] It is worth mentioning that in a specific example of the periscope camera module of the present invention, the connecting circuit board 33 is only used to conduct the first circuit 3141 and the second circuit 3161 of the chip circuit board 31 located at the plate through hole 313, that is, the connecting circuit board 33 is only used to conduct the circuits of the chip circuit board 31 located on opposite sides of the plate through hole 313, therefore, the number of the top side pads 331 of the connecting circuit board 33 is less than the number of the chip pads 323 of the photosensitive chip 32, so that the number of the outer side pads 319 of the chip circuit board 31 is less than the number of the inner side pads 318. In a specific example of the periscope camera module of the present invention, the number of the top side pads 331 of the connecting circuit board 33 is less than half of the number of the chip pads 323 of the photosensitive chip 32. More specifically, when the model of the photosensitive chip 32 is different, the number of pads of the photosensitive chip 32 and the number of circuits that need to be derived from the photosensitive component 30 are also different. However, considering that the connecting circuit board 33 only needs to conduct the circuits of the chip circuit board 31 on the opposite sides of the plate through hole 313, and the size of the connecting circuit board 33 is also limited by the size of the photosensitive component 30, the number of the top side pads 331 of the connecting circuit board 33 is set between 28 and 60. Further, considering that the increase in the number of the top side pads 331 of the connecting circuit board 33 leads to an increase in the size of the connecting circuit board 33, the number of the top side pads 331 of the connecting circuit board 33 is set between 28 and 60.

[0070] In addition, in a specific example of the periscope camera module of the present invention, the main purpose of the periscope camera module to set the connecting circuit board 33 is to connect at least one circuit on one side of the chip circuit board 31 for connecting to the export circuit board 34 and at least one circuit on the side of the chip circuit board 31 away from the export circuit board 34, and then export it from the export circuit board 34. For example, the main purpose of the connecting circuit board 33 is to connect the first circuit 3141 of the chip circuit board 31 located on the first side 314 of the plate and the second circuit 3161 located on the third side 316 of the plate. Since one circuit in the connecting circuit board 33 needs to connect two top side pads 331, the number of circuits in the connecting circuit board 33 is greater than or equal to one-half of the number of circuits in the export circuit board 34. Each pin in the connector 343 of the export circuit board 34 is electrically connected to the circuit in the connecting circuit board 33. In a specific example, the number of the top side pads 331 of the connecting circuit board 33 is greater than the number of pins of the connector 343.

[0071] It is worth mentioning that as the pixel of the photosensitive chip 32 is increased, in order to meet the demand for data transmission speed, the photosensitive chip 32 has at least one MIPI interface (Mobile Industry Processor Interface). Accordingly, the chip circuit board 31 has at least one MIPI circuit for conducting the MIPI interface of the photosensitive chip 32, and the MIPI circuit of the chip circuit board 31 extends to the export circuit board 34. Since the MIPI circuit of the chip circuit board 31 is used to transmit high-speed signals, it is required that the MIPI circuit reduce layer changes in the process of extending from the MIPI interface of the photosensitive chip 32 to the export circuit board 34, so as to avoid impedance mutation caused by layer changes and affect high-speed signal transmission. Therefore, the MIPI circuit of the chip circuit board 31 is not connected to the outer pad 319, that is, the MIPI circuit of the chip circuit board 31 is not conducted through the connecting circuit board 33, but is all arranged on the chip circuit board 31 and directly exported from the chip circuit board 31 to the export circuit board 34, avoiding the problem of layer change of the MIPI circuit. In a specific example of the periscope camera module of the present invention, the MIPI circuit of the chip circuit board 31 is arranged on the first side 314 of the plate to avoid the complexity of the MIPI circuit routing path and layer change problems. In another specific example of the periscope camera module of the present invention, the MIPI circuit of the chip circuit board 31 can also be arranged on the second side 315 of the plate close to one end of the first side 314 of the plate.

[0072] More specifically, the MIPI interface of the photosensitive chip 32 includes a D-PHY interface and a C-PHY interface. The D-PHY interface requires the use of two parallel extended circuits, and the differential impedance value of the two circuits is 100Ω±10%. The C-PHY interface only requires the use of a single circuit, and its single-ended impedance value is 50Ω±10%. It should be understandable that the range of specific impedance values ​​is adjusted for different products, but multiple layer changes during the routing of the MIPI circuit of the chip circuit board 31 will cause impedance mutations, and there is a probability that the differential impedance values ​​of the two lines of the D-PHY interface will mutate, as well as the single-ended impedance value of the C-PHY interface will mutate, affecting the signal transmission of the photosensitive chip 32. Therefore, in the periscope camera module of the present invention, the MIPI circuit of the chip circuit board 31 is arranged on the side of the chip circuit board 31 used to connect the export circuit board 34, so that the complexity of the MIPI circuit routing path and the layer change problem can be avoided, so that the MIPI circuit of the chip circuit board 31 is not turned on through the connecting circuit board 33, but is all arranged on the chip circuit board 31 and directly exported from the chip circuit board 31 to the export circuit board 34.

[0073] In addition, since the photosensitive chip 32 is small in size and needs to be configured with more interfaces, the chip pads 323 of the photosensitive chip 32 are small in size and need to be densely arranged. Since the chip circuit board 31 is large in size and the number of the top side pads 331 of the connecting circuit board 33 is less than the number of the chip pads 323 of the photosensitive chip 32, the setting space of the outer pads 319 of the chip circuit board 31 and the setting space of the top side pads 331 of the connecting circuit board 33 are both larger than the setting space of the chip pads 323 of the photosensitive chip 32. In a specific example of the periscope camera module of the present invention, the size of the top side pad 331 of the connecting circuit board 33 is larger than the size of the chip pad 323 of the photosensitive chip 32, and the gap between adjacent top side pads 331 of the connecting circuit board 33 is larger than the gap between adjacent chip pads 323 of the photosensitive chip 32. Accordingly, relative to the process difficulty of welding the photosensitive chip 32 and the chip circuit board 31, the process difficulty of welding the connecting circuit board 33 and the chip circuit board 31 can be reduced. For example, the process of welding the connecting circuit board 33 and the chip circuit board 31 can be implemented by a hot pressing welding (HotBar) process or an anisotropic conductive film (ACF) process, wherein the principle of the hot pressing welding process is to print solder paste on the outer pad 319 of the chip circuit board 31, melt the solder paste after passing through a reflow furnace and pre-solder it on the chip circuit board 31, then place the object to be soldered (i.e., the connecting circuit board 33) on the chip circuit board 31 on which the solder paste has been printed, and finally use the heat of the hot pressing head to melt the solder and connect the chip circuit board 31 and the connecting circuit board 33.

[0074] In an example of the periscope camera module of the present invention, the chip circuit board 31 is a rigid circuit board, and the connecting circuit board 33 is a flexible circuit board, so that the size of the periscope camera module in the length direction can be reduced. For example, in a specific example of the periscope camera module of the present invention, in the length direction of the periscope camera module, the size of the connecting circuit board 33 (i.e., the thickness of the connecting circuit board 33) can be less than or equal to 0.1 mm.

[0075] In an example of the periscope camera module of the present invention, the number of wiring layers of the connecting circuit board 33 is less than the number of wiring layers of the chip circuit board 31, and it is sufficient as long as the connecting circuit board 33 satisfies the requirements of exporting at least one circuit of the chip circuit board 31 on one side for connecting to the export circuit board 34 and exporting at least one circuit of the chip circuit board 31 on the side away from the export circuit board 34. For example, in a specific example of the periscope camera module of the present invention, the number of wiring layers of the connecting circuit board 33 is two layers, and the number of wiring layers of the chip circuit board 31 is four or six layers. It is worth mentioning that the lines of the connecting circuit board 33 are mainly parallel lines, or one layer of lines of the connecting circuit board 33 is a grid line used as a ground line, and the remaining lines are parallel lines.

[0076] Accordingly, in the present invention, the number of wiring layers of the connecting circuit board 33 is less than that of the chip circuit board 31, thereby avoiding unnecessary increase in the thickness of the connecting circuit board 33, thereby avoiding a significant increase in the thickness of the photosensitive component 30.

[0077] Reference Figures 2 to 5 There is a gap 50 between the chip lower surface 322 of the photosensitive chip 32 and the connecting circuit board 33, and the thickness of the gap 50 is between 0.01mm-0.06mm, that is, the chip lower surface 323 of the photosensitive chip 32 and the connecting circuit board 33 are not in direct contact. In a specific example of the periscope camera module of the present invention, the thickness of the gap 100 between the chip lower surface 322 of the photosensitive chip 32 and the connecting circuit board 33 is less than 0.05mm, so that in the process of mounting the connecting circuit board 33 on the lower surface 312 of the plate of the chip circuit board 31, the photosensitive chip 32 is avoided from being affected.

[0078] In an example of the periscope camera module of the present invention, in order to reduce the thickness of the photosensitive component 30, the lower surface 312 of the plate of the chip circuit board 31 has an inner surface 3121 and an outer surface 3122 surrounding the inner surface 3121, and the inner surface 3121 and the outer surface 3122 have a height difference, so that the plate through hole 313 of the chip circuit board 31 forms a stepped plate opening 3111 on the lower surface 312 of the plate, and the photosensitive chip 32 is mounted on the inner surface 3121 of the chip circuit board 31 and the photosensitive area 3211 of the photosensitive chip 32 faces the plate through hole 313 of the chip circuit board 31 to allow incident light to reach the photosensitive area 3211 of the photosensitive chip 32 after passing through the plate through hole 313, and the connecting circuit board 33 is mounted on the outer surface 3122 of the chip circuit board 31. In order to form the stepped plate opening 3111, the chip circuit board 31 includes a frame-shaped circuit board body 3112 and a conductive portion 3113 extending inward from the circuit board body 3112. The photosensitive chip 32 is inverted and electrically connected to the conductive portion 3113 of the chip circuit board 31, and the connection end 341 of the lead-out circuit board 34 is connected to the circuit board body 3112.

[0079] In a specific example of the periscope camera module of the present invention, the height difference between the inner surface 3121 and the outer surface 3122 of the chip circuit board 31 is greater than the thickness of the photosensitive chip 32, thereby preventing the photosensitive chip 32 from protruding from the lower surface 312 of the chip circuit board 31, that is, the chip lower surface 322 of the photosensitive chip 32 is lower than the outer surface 3122 of the chip circuit board 31, so that the connecting circuit board 33 can be flatly mounted on the outer surface 3122 of the chip circuit board 31, and the gap 50 is formed between the chip lower surface 322 of the photosensitive chip 32 and the connecting circuit board 33, thereby reducing the risk of the photosensitive chip 32 being compressed or even crushed during the process of hot pressing the connecting circuit board 33 to the chip circuit board 31. In other words, the connecting circuit board 33 is located on the back of the photosensitive chip 32.

[0080] Reference Figures 2 to 5 The photosensitive component 30 includes a heat-conducting portion 35, which is located in the gap 50 to conduct heat generated by the photosensitive chip 32 to reduce the working temperature of the photosensitive chip 32. In a specific example of the periscope camera module of the present invention, the heat-conducting portion 35 is formed by thermally conductive silicone grease filled between the chip lower surface 322 of the photosensitive chip 32 and the connecting circuit board 33.

[0081] Reference Figures 2 to 5 The photosensitive component 30 includes a reinforcement unit 36, which includes a front reinforcement part 361, and the front reinforcement part 361 has a light window 3611, wherein the front reinforcement part 361 is arranged on the upper surface 311 of the plate of the chip circuit board 31, and the plate through hole 313 of the chip circuit board 31 is connected to the light window 3611 of the front reinforcement part 361, so as to allow the incident light to reach the photosensitive area 3211 of the photosensitive chip 32 after passing through the light window 3611 of the front reinforcement part 361 and the plate through hole 313 of the chip circuit board 31. The front reinforcement part 361 can reinforce the strength of the chip circuit board 31 to improve the flatness of the chip circuit board 31.

[0082] In a specific example of the periscope camera module of the present invention, the front reinforcement portion 361 is integrally formed on the upper surface 311 of the plate of the chip circuit board 31. For example, based on a molding process, the front reinforcement portion 361 can be integrally formed on the upper surface 311 of the plate of the chip circuit board 31. In this way, on the one hand, there is no need to apply glue between the front reinforcement portion 361 and the chip circuit board 31 to reduce the process steps and reduce the thickness of the photosensitive component 30. On the other hand, with the aid of the mold, the top surface of the front reinforcement portion 361 has a higher flatness.

[0083] The photosensitive component 30 further includes at least one electronic component 37, which can be a passive electronic component such as a capacitor, a resistor or an inductor, or an active electronic component such as a diode or a memory chip. The electronic component 37 is mounted on the upper surface 311 of the plate of the chip circuit board 31. In the process of integrally forming the front reinforcement portion 361 on the upper surface 311 of the plate of the chip circuit board 31, the front reinforcement portion 361 can embed the electronic component 37. In this way, on the one hand, there is no need to reserve a safety distance between the front reinforcement portion 361 and the electronic component 37, so as to help reduce the overall size of the photosensitive component 30. On the other hand, the front reinforcement portion 361 can isolate the electronic component 37 and the photosensitive chip 32 to prevent contaminants such as debris from falling off the electronic component 37 and contaminating the photosensitive chip 32.

[0084] Reference Figures 2 to 5The photosensitive component 30 includes a filter element 38, which is mounted on the top surface of the front reinforcement part 361, and the filter element 38 closes the light window 3611, so that the incident light needs to enter the light window 3611 of the front reinforcement part 361 after passing through the filter element 38, so that the filter element 38 filters a specific type of light in the incident light. For example, in a specific example of the periscope camera module of the present invention, the filter element 38 is an infrared cutoff filter, which is used to filter infrared light in the incident light.

[0085] The reinforcement unit 36 ​​also includes a back reinforcement portion 362, and the back reinforcement portion 362 has a mounting channel 3621, wherein the back reinforcement portion 362 is arranged on the lower surface 312 of the plate of the chip circuit board 31, and the outer pad 319 of the chip circuit board 31 is exposed to the mounting channel 3621 of the back reinforcement portion 362 for mounting the connecting circuit board 33, wherein the back reinforcement portion 362 can reinforce the strength of the chip circuit board 31 to improve the flatness of the chip circuit board 31. It can be understood that the connecting circuit board 33 is accommodated in the mounting channel 3621 of the back reinforcement portion 362. In a specific example of the periscope camera module of the present invention, the connecting circuit board 33 and the back reinforcement portion 362 have a minimum spacing of 0.15 mm.

[0086] In a specific example of the periscope camera module of the present invention, the back reinforcement portion 362 is integrally formed on the lower surface 312 of the plate of the chip circuit board 31. For example, based on a molding process, the back reinforcement portion 362 can be integrally formed on the lower surface 312 of the plate of the chip circuit board 31. In this way, there is no need to apply glue between the back reinforcement portion 362 and the chip circuit board 31, so as to reduce the process steps and reduce the thickness of the photosensitive component 30.

[0087] Reference Figures 2 to 5 The photosensitive component 30 includes a heat sink 39, which can be a highly oriented pyrolytic graphite sheet, wherein the heat sink 39 is mounted on the back reinforcement portion 362, and the heat sink 39 closes the mounting channel 3621 of the back reinforcement portion 362 to increase the heat dissipation capacity.

[0088] Reference 7A to 7H The present invention further provides a method for manufacturing the photosensitive component 30, wherein the manufacturing method comprises the following steps:

[0089] (a) The front reinforcing portion 361 is disposed on the upper surface 311 of the plate of the chip circuit board 31, wherein the plate through hole 313 of the chip circuit board 31 is connected to the light window 3611 of the front reinforcing portion 361. For example, in a specific example of the manufacturing method of the present invention, first, the electronic component 37 is mounted on the upper surface 311 of the plate of the chip circuit board 31, and the electronic component 37 is mounted on the upper surface 311 of the plate of the chip circuit board 31. Fig. 7A Secondly, based on the molding process, the front reinforcement portion 361 is integrally formed on the upper surface 311 of the chip circuit board 31, refer to the attached Figure 7B , wherein in the process of integrally forming the front reinforcement portion 361 on the upper surface 311 of the plate of the chip circuit board 31, on the one hand, the front reinforcement portion 361 embeds the electronic components 37, and on the other hand, the light window 3611 of the front reinforcement portion 361 is formed, and the light window 3611 is connected to the plate through hole 313 of the chip circuit board 31.

[0090] (b) Providing a first solder on the inner pad 318 of the chip circuit board 31. In a specific example of the manufacturing method of the present invention, a reflow device may be used to provide the first solder on the inner pad 318 of the chip circuit board 31.

[0091] (c) The back reinforcement portion 362 is disposed on the lower surface 312 of the chip circuit board 31, wherein the plate through hole 313 of the chip circuit board 31 is connected to the mounting channel 3621 of the back reinforcement portion 362, see the attached Figure 7C For example, in a specific example of the manufacturing method of the present invention, based on a molding process, the back reinforcement portion 362 is integrally formed on the lower surface 312 of the plate of the chip circuit board 31, wherein in the process of integrally forming the back reinforcement portion 362 on the lower surface 312 of the plate of the chip circuit board 31, the mounting channel 3621 of the back reinforcement portion 362 is formed, and the mounting channel 3621 is connected to the plate through hole 313 of the chip circuit board 31.

[0092] (d) The photosensitive chip 32 and the chip circuit board 31 are connected and conducted through the mounting channel 3621 of the back reinforcement portion 362 by means of thermal compression bonding, wherein the chip pad 323 of the photosensitive chip 32 is provided with a second solder, and the first solder and the second solder are bonded by thermal compression to achieve the connection and conduction between the photosensitive chip 32 and the chip circuit board 31, see Attachment 1. Fig.7D. In a specific example of the manufacturing method of the present invention, a non-conductive glue is further provided at the bonding position of the photosensitive chip 32 and the chip circuit board 31, so as to protect the solder and enhance the connection strength between the photosensitive chip 32 and the chip circuit board 31. In a specific example of the manufacturing method of the present invention, the photosensitive chip 32 is prevented from protruding from the lower surface 312 of the plate of the chip circuit board 31. The specific types of the first solder and the second solder are not limited in the manufacturing method of the present invention. For example, in a specific example, the first solder and the second solder can both be gold materials, so that the first solder and the second solder can be bonded by hot pressing to achieve the conduction between the photosensitive chip 32 and the chip circuit board 31. In another specific example, the first solder is tin solder and the second solder is gold solder. In this way, the first solder and the second solder can be bonded by hot pressing to achieve the conduction between the photosensitive chip 32 and the chip circuit board 31.

[0093] (e) The connecting circuit board 33 is mounted on the lower surface 312 of the chip circuit board 31 through the mounting channel 3621 of the back reinforcement portion 362, wherein the electrical connection between the top side pad 331 of the connecting circuit board 33 and the outer side pad 319 of the chip circuit board 31 can be achieved by a hot pressing (HotBar) process or an anisotropic conductive film (ACF) process, see Attachment 1. Figure 7F In a specific example of the manufacturing method of the present invention, before the connecting circuit board 33 is mounted on the lower surface 312 of the chip circuit board 31 through the mounting channel 3621 of the back reinforcement portion 362, thermal conductive silicone may be provided on the chip lower surface 322 of the photosensitive chip 32 or the connecting circuit board 33, so that after the connecting circuit board 33 is mounted on the plate lower surface 312 of the chip circuit board 31, the thermal conductive silicone forms the heat conducting portion 35 between the chip lower surface 322 of the photosensitive chip 32 and the connecting circuit board 33, see the attached Fig. 7E .

[0094] (f) The filter element 38 is mounted on the top surface of the front reinforcement portion 361, wherein the filter element 38 closes the light window 3611 of the front reinforcement portion 361. Figure 7H .

[0095] In a specific example of the manufacturing method of the present invention, before the front reinforcing portion 361 is disposed on the plate upper surface 311 of the chip circuit board 31, the chip circuit board 31 is preset with the plate through hole 313. In a specific example of the manufacturing method of the present invention, after the front reinforcing portion 361 is disposed on the plate upper surface 311 of the chip circuit board 31 and the back reinforcing portion 362 is disposed on the plate lower surface 312 of the chip circuit board 31, the chip circuit board 31 is cut so that the chip circuit board 31 has the plate through hole 313.

[0096] In an example of the manufacturing method of the present invention, the manufacturing method further includes a cleaning step, wherein the cleaning step can be performed before the front reinforcement portion 361 is set, that is, the chip circuit board 31 is cleaned first, and then the front reinforcement portion 361 is set on the upper surface 311 of the plate of the chip circuit board 31, wherein the cleaning step can also be performed before the back reinforcement portion 362 is set, that is, the chip circuit board 31 provided with the front reinforcement portion 361 is cleaned first, and then the back reinforcement portion 362 is set on the lower surface 312 of the plate of the chip circuit board 31. Through the cleaning step, the dirt on the upper surface 311 and the lower surface 312 of the plate of the chip circuit board 31 can be reduced, which is beneficial to improve the yield of the photosensitive component 30.

[0097] In an example of the manufacturing method of the present invention, the manufacturing method further includes a step of encapsulation, specifically, after the photosensitive chip 32 is mounted on the chip circuit board 31, encapsulation is provided on the side of the photosensitive chip 32 to protect the photosensitive chip 32. For example, in a specific example of the manufacturing method of the present invention, the side encapsulation can fill the gap between the side of the photosensitive chip 32 and the inner wall of the back reinforcement part 362.

[0098] In an example of the manufacturing method of the present invention, the manufacturing method further includes the step of mounting the heat sink 39 on the back reinforcement portion 362 , and the heat sink 39 closes the mounting channel 3621 of the back reinforcement portion 362 .

[0099] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A photosensitive component, characterized in that: include: Connect the circuit board; A lead-out circuit board has an opposing connection end and an assembly end; A photosensitive chip having an upper chip surface and a lower chip surface opposite to each other, wherein the upper chip surface has a photosensitive area and a non-photosensitive area surrounding the photosensitive area; as well as A chip circuit board has an upper plate surface and a lower plate surface relative to each other, and a plate through-hole penetrating the upper plate surface and the lower plate surface, wherein the connection end of the lead-out circuit board is connected to one side of the chip circuit board, wherein the non-photosensitive area of ​​the photosensitive chip is mounted on the lower plate surface of the chip circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the plate through-hole of the chip circuit board, wherein the connecting circuit board is mounted on the lower plate surface of the chip circuit board, and the connecting circuit board conducts a pair of circuits of the chip circuit board located on opposite sides of the plate through-hole.

2. The photosensitive component according to claim 1, wherein the connecting circuit board conducts at least one circuit of the chip circuit board for connecting to one side of the export circuit board and at least one circuit of the chip circuit board away from the export circuit board.

3. The photosensitive component according to claim 1, wherein the connecting circuit board conducts at least one circuit of the chip circuit board for connecting to one side of the export circuit board and at least one circuit of the chip circuit board on one side close to the export circuit board.

4. The photosensitive component according to claim 2, wherein the four sides of the chip circuit board used to define the plate through-hole are respectively defined as a first side of the plate, a second side of the plate, a third side of the plate and a fourth side of the plate in a clockwise direction, the first side of the plate and the third side of the plate correspond to each other in the width direction, the second side of the plate and the fourth side of the plate correspond to each other in the height direction, wherein the connecting end of the export circuit board is connected to the first side of the plate of the chip circuit board, wherein the connecting circuit board conducts at least one circuit located on the first side of the plate and at least one circuit located on the third side of the plate.

5. The photosensitive component according to claim 3, wherein the four sides of the chip circuit board used to define the plate perforation are respectively defined as a first side of the plate, a second side of the plate, a third side of the plate and a fourth side of the plate in a clockwise direction, the first side of the plate and the third side of the plate correspond to each other in the width direction, the second side of the plate and the fourth side of the plate correspond to each other in the height direction, wherein the connecting end of the export circuit board is connected to the first side of the plate of the chip circuit board, wherein the connecting circuit board conducts at least one circuit located on the first side of the plate and at least one circuit located on the second side of the plate.

6. The photosensitive component according to any one of claims 1 to 5, wherein the connecting circuit board is on the back of the photosensitive chip.

7. The photosensitive component according to any one of claims 1 to 5, wherein the lower surface of the plate of the chip circuit board has an inner surface and an outer surface surrounding the inner surface, the height difference between the inner surface and the outer surface is greater than the thickness of the photosensitive chip, wherein the photosensitive chip is mounted on the inner surface of the chip circuit board, the connecting circuit board is mounted on the outer surface of the chip circuit board, and there is a gap between the lower surface of the photosensitive chip and the connecting circuit board.

8. The photosensitive component according to claim 7, wherein the photosensitive component comprises a heat-conducting portion, and the heat-conducting portion is arranged in the gap between the chip lower surface of the photosensitive chip and the connecting circuit board.

9. A photosensitive component according to any one of claims 1 to 5, wherein the photosensitive chip has a MIPI interface, the chip circuit board has a MIPI circuit, the MIPI circuit is completely arranged on the chip circuit board, and the MIPI circuit connects the MIPI interface of the photosensitive chip and the export circuit board.

10. The photosensitive component according to any one of claims 1 to 5, wherein the chip circuit board is a rigid circuit board, and the connecting circuit board is a flexible circuit board.

11. The photosensitive component according to any one of claims 1 to 5, wherein the number of wiring layers of the connecting circuit board is two, the number of wiring layers of the chip circuit board is four or six, and the lines in the two layers of wiring of the connecting circuit board are parallel lines.

12. The photosensitive component according to any one of claims 1 to 5, wherein the number of wiring layers of the connecting circuit board is two, and the number of wiring layers of the chip circuit board is four or six, wherein the lines of one of the two layers of wiring of the connecting circuit board are parallel lines, and the lines of the other layer of wiring are grid lines.

13. A photosensitive component according to any one of claims 1 to 5, wherein the photosensitive component includes a reinforcement unit, the reinforcement unit includes a front reinforcement part and a back reinforcement part, wherein the front reinforcement part has a light window, the front reinforcement part is arranged on the upper surface of the plate of the chip circuit board, the light window of the front reinforcement part and the plate through-hole of the chip circuit board are communicated, wherein the back reinforcement part has a mounting channel, the back reinforcement part is arranged on the lower surface of the plate of the chip circuit board, and the connecting circuit board is accommodated in the mounting channel of the back reinforcement part.

14. The photosensitive component according to claim 13, wherein the front reinforcement portion is integrally formed on the upper surface of the plate of the chip circuit board, and the back reinforcement portion is integrally formed on the lower surface of the plate of the chip circuit board.

15. A periscope camera module, characterized in that: include: Optical lens; Optical path reflection component; as well as According to any one of claims 1 to 14, the optical lens and the light path reflection component are respectively arranged in the photosensitive path of the photosensitive chip of the photosensitive component.

Images