Semiconductor element lead bonding apparatus and bonding method

Abstract

The application discloses a kind of semiconductor element lead welding device and welding method, belong to semiconductor element processing technical field, including installation box, the drive electric jar is equipped in the installation box, welding rotary mechanism is equipped at the connecting disc, it is rotatably connected between the welding rotary mechanism and connecting disc, welding sliding mechanism is equipped on the welding rotary mechanism, welding wire feeding mechanism is equipped on the welding sliding mechanism, the welding wire feeding mechanism extends to the position below automatic welding head position.This application adjusts welding point according to the need of semiconductor element welding according to welding when, sliding motor works and drives sliding gear to rotate on sliding rack, so as to drive wire feeding frame to move on rotating gear through two sliding blocks, so as to change the position distance between welding wire and automatic welding head;It can be suitable for the welding of different size elements, complex welding path, accurate control of welding drop point and evenly distribute solder.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor element processing, and particularly relates to a semiconductor element lead welding device and a welding method. BACKGROUND

[0002] Lead welding is a process of connecting each electrode on a transistor chip with a lead-out line (i.e., a pin) of a tube base by using a metal lead. There are many methods and ways of lead welding, and currently, hot pressure welding, ultrasonic welding, and reverse welding (i.e., knock welding or flip welding) are commonly used. There are various methods of lead welding, such as ultrasonic bonding and ball welding. In the manufacturing of SAW devices, ultrasonic bonding (or ultrasonic spot welding) is generally used at present because it has the advantages of high connection reliability, simple operation, high welding efficiency, and no need to heat the substrate.

[0003] The existing Chinese patent with the publication number CN115194388B discloses a semiconductor lead welding device and its use method, which relates to the technical field of lead welding. The present application comprises a connecting pipe, a threaded connecting pipe at the bottom of the inner side wall of the connecting pipe, an operating groove in the inner side wall of the connecting pipe, and a driving mechanism rotatingly connected to the inner side wall of the operating groove. The device further comprises a clamping mechanism and a pushing mechanism installed at the bottom of the connecting pipe. When the device is used, the outer side wall of the lead is in contact with the driving mechanism, and the downward movement of the lead will drive the driving mechanism to work under the action of friction, so that the driving mechanism drives the clamping mechanism to work until the lead extends to the specified position beyond the bottom of the pushing mechanism. The clamping mechanism will clamp the lead, effectively limiting the extension length of the lead, preventing the molten ball from being too large during the extension process, affecting the welding quality, saving resources, and improving resource utilization.

[0004] However, the above-mentioned patent cannot adjust the welding position and the size of the welding spot according to the welding needs of the semiconductor element during the welding process of the semiconductor element, which easily leads to false welding or miswelding of the semiconductor element, affecting the welding quality. SUMMARY

[0005] The present application provides a semiconductor element lead welding device and a welding method to solve the problems in the prior art.

[0006] The embodiment of the present application adopts the technical scheme as follows: a semiconductor element lead welding device, comprising a mounting box, a driving electric cylinder is arranged in the mounting box, an automatic welding head is arranged on the telescopic end of the driving electric cylinder, a connecting disc is arranged between the automatic welding head and the telescopic end of the driving electric cylinder, a welding rotating mechanism is arranged at the connecting disc, the welding rotating mechanism is rotatably connected with the connecting disc, a welding sliding mechanism is arranged on the welding rotating mechanism, the welding sliding mechanism is slidably connected with the welding rotating mechanism, a welding wire feeding mechanism is arranged on the welding sliding mechanism, and the welding wire feeding mechanism extends to a position below the automatic welding head.

[0007] Further, an external placement disc is arranged at the connecting disc, the external placement disc is concentrically arranged with the connecting disc, a connecting rod is arranged on the telescopic end of the driving electric cylinder, a threaded head is arranged at the bottom of the connecting rod, the threaded head is threadedly connected at the center position of the connecting disc, and a wire roller is arranged at the connecting rod.

[0008] Further, the welding rotating mechanism comprises a rotating motor, a rotating gear, a rotating disc and a rotating gear ring arranged on the rotating disc, the rotating disc is rotatably connected on the external placement disc, the rotating motor is located at the top position of the automatic welding head, the rotating gear is connected with the main shaft of the rotating motor, and the rotating gear and the rotating gear ring are meshed with each other.

[0009] Further, a wire feeding frame is arranged on the rotating disc, the wire feeding frame extends to the outside of the external placement disc and extends to the position below the automatic welding head.

[0010] Further, the welding sliding mechanism comprises a sliding motor, a sliding gear, a sliding rack and two sliding blocks, the two sliding blocks are symmetrically arranged at the position below the wire feeding frame, the wire feeding frame is slidably connected on the rotating disc through the two sliding blocks, the sliding motor is located in the rotating disc, the sliding gear is connected with the main shaft of the sliding motor, the sliding rack is located at the position below the wire feeding frame, and the sliding rack and the sliding gear are meshed with each other.

[0011] Further, the welding wire feeding mechanism comprises a mounting frame, a top conveying wheel, a bottom conveying wheel and a conveying motor, the mounting frame is located at the top of the wire feeding frame, the top conveying wheel and the bottom conveying wheel are distributed in an up-down manner, the top conveying wheel and the bottom conveying wheel are rotatably connected on the mounting frame, the conveying motor is located on the side wall of the mounting frame and is drivingly connected with the bottom conveying wheel, and a wire passing groove for the welding wire to move is arranged on the bottom conveying wheel.

[0012] Further, a top wire feeding roller and a bottom wire feeding roller are arranged on the wire feeding frame, an inclined wire guide plate is arranged at the bottom of the wire feeding frame, and a guide ring is arranged on the wire guide plate.

[0013] A welding method of a semiconductor element lead welding device, the welding method comprising the following steps:

[0014] In the first step, when welding the semiconductor element lead, the welding wire feeding mechanism is used to feed the welding wire to the position of the automatic welding head, and the feeding distance is fixed each time to ensure the accuracy of subsequent welding.

[0015] In the second step, during the welding process, the welding rotating mechanism is used to rotate the welding wire to the position below the automatic welding head to ensure the comprehensiveness of the welding.

[0016] In the third step, during the welding process, the welding sliding mechanism is used to slide on the welding rotating mechanism, and different radii of welding points can be welded according to the welding needs of the semiconductor element to ensure the firmness of the semiconductor element welding.

[0017] In the fourth step, the semiconductor element is welded by the automatic welding head under the cooperation of the welding rotating mechanism, the welding sliding mechanism and the welding wire feeding mechanism.

[0018] The above-mentioned at least one technical solution adopted by the embodiment of the present application can achieve the following beneficial effects:

[0019] Firstly, when welding, the rotating motor drives the rotating gear to rotate, so that the rotating gear rotates on the rotating gear ring, thereby driving the rotating disc to rotate on the external placement disc, and driving the wire feeding frame to rotate. When welding the semiconductor element, the welding wire can be uniformly fed, and uniform feeding can ensure the stability of the supply amount of solder (welding wire) during the welding process. If the wire feeding is not uniform, there may be too much solder in some areas, which may cause a short circuit bridge, resulting in short-circuiting of adjacent welding points or element leads, thereby damaging the semiconductor element. Rotating the wire feeding helps to make the solder more evenly distributed around the welding points, and when welding multiple welding points, the shape, size and solder coverage of each welding point can be basically the same. It helps to make the solder more evenly distributed around the welding points. It can reduce the number of interruptions in the welding process caused by wire feeding problems.

[0020] Secondly, when adjusting the welding points according to the welding needs of the semiconductor element, the sliding motor drives the sliding gear to rotate on the sliding rack, thereby driving the wire feeding frame to move on the rotating disc through the two sliding blocks, so as to change the position distance between the welding wire and the automatic welding head. It can be used for welding elements of different sizes, cope with complex welding paths, accurately control the welding landing point and uniformly distribute the solder. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

[0022] Figure 1 is a schematic view of the three-dimensional structure of the present application;

[0023] Figure 2 is a schematic view of the three-dimensional structure of the present application;

[0024] Figure 3 is a schematic view of the three-dimensional structure of the present application;

[0025] Figure 4 is a schematic view of the three-dimensional structure of the present application; Figure 3 is an enlarged view of A in FIG. 4;

[0026] Figure 5 is a schematic view of the three-dimensional structure of the present application;

[0027] Figure 6 is a schematic view of the three-dimensional structure of the present application;

[0028] Reference Signs:

[0029] mounting box 1, driving electric cylinder 10, automatic welding head 11, connecting disc 12, connecting rod 13, threaded head 14, wire feeding roller 15, externally connected placement disc 16, welding rotating mechanism 2, rotating motor 21, rotating gear 22, rotating disc 23, rotating gear ring 24, welding sliding mechanism 3, sliding motor 31, sliding gear 32, sliding rack 33, sliding block 34, welding wire feeding mechanism 4, mounting frame 41, top conveying wheel 42, bottom conveying wheel 43, conveying motor 44, threading groove 45, wire feeding rack 5, top wire feeding roller 51, bottom wire feeding roller 52, guide ring 53. DETAILED DESCRIPTION

[0030] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described below in detail with reference to the embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0031] The technical solutions of the semiconductor element lead welding device and the welding method provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0032] Reference Figures 1 to 6As shown, the semiconductor element lead welding device provided by the embodiment of the application comprises a mounting box 1, a driving electric cylinder 10 is arranged in the mounting box 1, an automatic welding head 11 is arranged on the telescopic end of the driving electric cylinder 10, a connecting disc 12 is arranged between the automatic welding head 11 and the telescopic end of the driving electric cylinder 10, a welding rotating mechanism 2 is arranged at the connecting disc 12, the welding rotating mechanism 2 is rotatably connected with the connecting disc 12, a welding sliding mechanism 3 is arranged on the welding rotating mechanism 2, the welding sliding mechanism 3 is slidably connected with the welding rotating mechanism 2, a welding wire feeding mechanism 4 is arranged on the welding sliding mechanism 3, and the welding wire feeding mechanism 4 extends to a position below the automatic welding head 11.

[0033] Specifically, an external placement disc 16 is arranged at the connecting disc 12, the external placement disc 16 is concentrically arranged with the connecting disc 12, a connecting rod 13 is arranged on the telescopic end of the driving electric cylinder 10, a threaded head 14 is arranged at the bottom of the connecting rod 13, the threaded head 14 is threadedly connected at the center of the connecting disc 12, and a wire roller 15 is arranged at the connecting rod 13.

[0034] When the semiconductor element is welded, the driving electric cylinder 10 works to drive the automatic welding head 11 to move downward through the connecting rod 13, so as to weld the semiconductor element, the wire roller 15 can rotate on the connecting rod 13 to feed the wire in subsequent welding, when the wire on the wire roller 15 is replaced, the connecting head is rotated to drive the threaded head 14 to rotate on the connecting disc 12, the connecting head is detached from the connecting disc 12, the wire roller 15 is replaced, and the wire roller 15 is provided with a welding wire.

[0035] Specifically, the welding rotating mechanism 2 comprises a rotating motor 21, a rotating gear 22, a rotating disc 23 and a rotating gear ring 24 arranged on the rotating disc 23, the rotating disc 23 is rotatably connected with the external placement disc 16, the rotating motor 21 is arranged at the top of the automatic welding head 11, the rotating gear 22 is connected with the main shaft of the rotating motor 21, and the rotating gear 22 and the rotating gear ring 24 are engaged with each other.

[0036] When welding, the rotating motor 21 works to drive the rotating gear 22 to rotate, so that the rotating gear 22 rotates on the rotating gear ring 24, thereby driving the rotating disc 23 to rotate on the outer placed disc 16, thereby driving the wire feeding frame 5 to rotate, so that the solder wire can be uniformly fed during welding of the semiconductor element, and uniform feeding can ensure that the amount of solder wire supplied during welding is stable. If the wire feeding is not uniform, it may cause excessive solder in some areas, resulting in solder accumulation. Excessive solder may form a short circuit bridge, causing adjacent solder joints or element pins to be short-circuited, thereby damaging the semiconductor element. Rotating the wire feeding helps to make the solder more evenly distributed around the solder joint. When welding multiple solder joints, the shape, size and solder coverage of each solder joint can be basically the same. It helps to make the solder more evenly distributed around the solder joint. It can reduce the number of interruptions caused by wire feeding problems during welding.

[0037] Specifically, the rotating disc 23 is provided with a wire feeding frame 5, and the wire feeding frame 5 extends to the outside of the outer placed disc 16 and extends to the position below the automatic welding head 11.

[0038] Specifically, the welding sliding mechanism 3 includes a sliding motor 31, a sliding gear 32, a sliding rack 33 and two sliding blocks 34. The two sliding blocks 34 are symmetrically arranged at the position below the wire feeding frame 5, the wire feeding frame 5 is slidably connected to the rotating disc 23 through the two sliding blocks 34, the sliding motor 31 is located in the rotating disc 23, the sliding gear 32 is connected to the main shaft of the sliding motor 31, the sliding rack 33 is located at the position below the wire feeding frame 5, and the sliding rack 33 is engaged with the sliding gear 32.

[0039] When adjusting the welding point according to the needs of the semiconductor element welding, the sliding motor 31 works to drive the sliding gear 32 to rotate on the sliding rack 33, thereby driving the wire feeding frame 5 to move on the rotating disc 23 through the two sliding blocks 34, thereby changing the position distance between the solder wire and the automatic welding head 11;

[0040] First, different component sizes should be adapted: semiconductor components have various sizes and shapes, and when the solder wire can rotate and change the distance between the position and the automatic soldering head 11, it can better adapt to different sizes of components; second, complex soldering paths should be adapted: the pin layout or internal connection structure of some semiconductor components is complex, and the soldering path may be curved or have multiple levels, and the rotatable and position-adjustable characteristics of the solder wire make it easier to solder along these complex paths, third, precise control of the solder drop point: by changing the distance between the solder wire and the automatic soldering head 11, the drop point of the solder can be accurately controlled. In the soldering of high-precision semiconductor components, the appropriate position distance can make the solder accurately fall on the connection between the pin and the pad, avoid the solder deviating from the target position and causing short circuit or virtual welding, and the rotation of the solder wire can make the solder contact the soldering site at the best angle and pose, further improving the accuracy of the soldering; fourth, uniform distribution of solder: for some cases where solder needs to be uniformly distributed between a larger area or multiple solder points, the rotatable and position-adjustable solder wire is very helpful, by adjusting the position and rotation angle of the solder wire, the solder can be evenly spread on the contact surface, improving the heat conduction efficiency, thereby ensuring the performance and reliability of the semiconductor component.

[0041] Specifically, the solder wire feeding mechanism 4 comprises a mounting frame 41, a top conveying wheel 42, a bottom conveying wheel 43 and a conveying motor 44, the mounting frame 41 is located at the top of the wire feeding frame 5, the top conveying wheel 42 and the bottom conveying wheel 43 are distributed up and down, the top conveying wheel 42 and the bottom conveying wheel 43 are rotationally connected to the mounting frame 41, the conveying motor 44 is located on the side wall of the mounting frame 41 and is in transmission connection with the bottom conveying wheel 43, and the bottom conveying wheel 43 is provided with a wire passing groove 45 for the movement of the solder wire.

[0042] When the solder wire is fed, the solder wire is located in the top conveying wheel 42 and the wire passing groove 45 of the bottom conveying wheel 45, and then the conveying motor 44 works to drive the bottom conveying wheel 43 to rotate on the mounting frame 41, thereby continuously feeding the solder wire forward to feed the solder wire to the position below the automatic soldering head 11, thereby realizing the soldering work of the semiconductor component.

[0043] Specifically, the wire feeding frame 5 is provided with a top wire feeding roller 51 and a bottom wire feeding roller 52, the bottom of the wire feeding frame 5 is provided with an inclined wire guide plate, and the wire guide plate is provided with a guide ring 53. The solder wire passes through the top wire feeding roller 51 to the bottom wire feeding roller 52, and then passes through the guide ring 53 to move below the automatic soldering head 11 to perform the soldering work of the semiconductor component.

[0044] A soldering method of a semiconductor component lead soldering device, the soldering method comprising the following steps:

[0045] First, the wire feeding mechanism 4 can be used to feed the welding wire to the position of the automatic welding head 11, and the distance of each feeding is fixed, ensuring the accuracy of subsequent welding.

[0046] Second, during the welding process, the welding rotating mechanism 2 can be used to feed the welding wire circumferentially to the position below the automatic welding head 11, ensuring the comprehensiveness of the welding.

[0047] Third, during the welding process, the welding sliding mechanism 3 can be used to slide on the welding rotating mechanism 2, and different radii of welding points can be welded according to the needs of semiconductor element welding, ensuring the firmness of semiconductor element welding.

[0048] Fourth, under the cooperation of the welding rotating mechanism 2, the welding sliding mechanism 3 and the welding wire feeding mechanism 4, the automatic welding head 11 can be used to weld the semiconductor element.

[0049] The above only describes the embodiments of the present application and is not used to limit the present application. The present application can have various changes and variations for those skilled in the art. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the scope of claims of the present application.

Claims

1. A semiconductor element lead bonding apparatus, characterized in that, The system includes an installation box (1), which contains a drive cylinder (10). An automatic welding head (11) is provided on the telescopic end of the drive cylinder (10). A connecting disc (12) is provided between the automatic welding head (11) and the telescopic end of the drive cylinder (10). A welding rotation mechanism (2) is provided at the connecting disc (12). The welding rotation mechanism (2) is rotatably connected to the connecting disc (12). A welding sliding mechanism (3) is provided on the welding rotation mechanism (2). The welding sliding mechanism (3) is slidably engaged with the welding rotation mechanism (2). A welding wire feeding mechanism (4) is provided on the welding sliding mechanism (3). The welding wire feeding mechanism (4) extends to a position below the automatic welding head (11). An external placement disc (16) is provided at the connecting disc (12). The welding rotation mechanism (2) includes a rotation motor (21), a rotation gear (22), a rotation disk (23), and a rotation gear ring (24) disposed on the rotation disk (23). The rotation disk (23) is rotatably connected to an external placement disk (16). The rotation motor (21) is located at the top of the automatic welding head (11). The rotation gear (22) is connected to the main shaft of the rotation motor (21). The rotation gear (22) and the rotation gear ring (24) mesh with each other. The rotating disk (23) is provided with a wire feeder (5), which extends to the outside of the outer placement disk (16) and extends to the position below the automatic welding head (11); The welding sliding mechanism (3) includes a sliding motor (31), a sliding gear (32), a sliding rack (33), and two sliders (34). The two sliders (34) are symmetrically arranged below the wire feeder (5). The wire feeder (5) is slidably connected to the rotating disk (23) through the two sliders (34). The sliding motor (31) is located inside the rotating disk (23). The sliding gear (32) is connected to the main shaft of the sliding motor (31). The sliding rack (33) is located below the wire feeder (5). The sliding rack (33) meshes with the sliding gear (32).

2. The semiconductor element lead bonding apparatus according to claim 1, characterized in that: The external placement disk (16) and the connecting disk (12) are concentrically arranged. The extension end of the drive cylinder (10) is provided with a connecting rod (13). The bottom of the connecting rod (13) is provided with a threaded head (14). The threaded head (14) is threadedly connected to the center position of the connecting disk (12). The connecting rod (13) is provided with a wire feeding roller (15).

3. The semiconductor element wire bonding apparatus according to claim 1, characterized in that: The wire feeder (5) is provided with a top wire feeder (51) and a bottom wire feeder (52). The bottom of the wire feeder (5) is provided with an inclined wire guide plate, and the wire guide plate is provided with a guide ring (53).

4. The semiconductor element wire bonding apparatus according to claim 1, characterized in that: The welding wire feeding mechanism (4) includes a mounting frame (41), a top conveyor wheel (42), a bottom conveyor wheel (43), and a conveyor motor (44). The mounting frame (41) is located on top of the wire feeding frame (5). The top conveyor wheel (42) and the bottom conveyor wheel (43) are distributed vertically and are rotatably connected to the mounting frame (41). The conveyor motor (44) is located on the side wall of the mounting frame (41) and is connected to the bottom conveyor wheel (43) in a transmission manner. The bottom conveyor wheel (43) is provided with a wire-passing groove (45) for the welding wire to move.

5. The welding method of the semiconductor element lead bonding apparatus according to any one of claims 1-4, characterized in that: The welding method includes the following steps: First, when welding semiconductor element leads, the welding wire can be fed to the position of the automatic welding head (11) by the welding wire feeding mechanism (4), and the distance of each feeding is fixed to ensure the accuracy of subsequent welding; Second, during the welding process, the welding rotation mechanism (2) can deliver the welding wire circumferentially to the position below the automatic welding head (11) to ensure the comprehensiveness of the welding; Third, during the welding process, the welding sliding mechanism (3) slides in the welding rotation mechanism (2) to weld welding points of different radii according to the needs of semiconductor element welding, ensuring the firmness of semiconductor element welding; Fourth, with the cooperation of the welding rotation mechanism (2), the welding sliding mechanism (3) and the welding wire feeding mechanism (4), the automatic welding head (11) is used to weld the semiconductor element.

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