Ultrasonic vibration helical grinding method

Abstract

The application relates to an ultrasonic vibration spiral grinding method, which comprises the following steps: installing an ultrasonic vibration structure on a machining machine tool, installing a grinding tool on the ultrasonic vibration structure; installing a workpiece to be machined on the machining machine tool, moving the grinding tool, and making the grinding tool contact with a hole wall to be machined of a hole to be machined on the workpiece to be machined; setting a separation condition of the grinding tool and the hole wall to be machined; starting the machining machine tool and the ultrasonic vibration structure to control high-speed spiral grinding of the grinding tool on the hole wall to be machined. Before the hole wall to be machined is ground, the separation condition between the grinding tool and the hole wall to be machined is set, so that the grinding speed of the grinding tool is improved, high precision and high efficiency of spiral grinding are realized, the grinding precision of the hole to be machined is ensured, the temperature of the grinding tool is reduced, and the service life of the grinding tool is prolonged.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of precision high-speed machining, and particularly relates to an ultrasonic vibration spiral grinding method. BACKGROUND

[0002] High-speed grinding technology is mainly applied to the fields of aviation, aerospace and automobiles, and can be used for manufacturing parts made of difficult-to-machine materials such as titanium alloy and nickel-based high-temperature alloy, and can realize high material removal rate and improve the surface quality of the parts.

[0003] During high-speed grinding, the cutting speed is high, the friction between the grinding head and the workpiece is large, and the heat accumulation is large, which can easily cause the surface temperature of the workpiece to rise and cause defects such as burning, and can also cause the grinding head to wear out, thereby affecting the machining quality and precision. Therefore, improving the cooling effect and reducing the grinding force on the basis of high-speed grinding is the key to ensuring precision machining.

[0004] At present, the main research ideas for breaking through the speed limit of grinding technology include trace gas cooling and intelligent temperature monitoring, but there are still limitations in production cost and efficiency, and it is difficult to be arranged in the machining of the inner hole structure.

[0005] Ultrasonic vibration cutting has the advantages of reducing cutting force, reducing cutting temperature, improving the limit cutting capacity and machining quality, but for traditional ultrasonic vibration cutting, the cutting speed needs to be limited to ensure the effect of intermittent separation, and once the cutting speed exceeds the limit value, the advantages brought by ultrasonic vibration will be lost, which greatly limits the application of ultrasonic vibration cutting.

[0006] That is, when machining the parts with the inner hole structure, the ultrasonic vibration cutting method is usually used to reduce the cutting temperature and improve the limit cutting capacity and machining quality, but the current ultrasonic vibration cutting limits the cutting speed, reduces the cutting precision and limits the application of ultrasonic vibration cutting. SUMMARY

[0007] Therefore, it is necessary to provide an ultrasonic vibration spiral grinding method for the problem that the cutting speed is reduced for improving the machining quality in the current ultrasonic vibration cutting, the grinding speed can be improved by indirectly contacting the grinding with the wall of the hole to be machined on the workpiece to be machined, the high-precision and high-efficiency machining of the hole to be machined can be realized, the temperature of the grinding tool can be reduced, and the service life of the grinding tool can be prolonged.

[0008] An ultrasonic vibration spiral grinding method comprises the following steps:

[0009] An ultrasonic vibration structure is installed on a machining machine tool, and a grinding tool is installed on the ultrasonic vibration structure.

[0010] installing a workpiece to be processed on the machining tool, moving the grinding tool to make the grinding tool contact with a hole wall of a hole to be processed on the workpiece to be processed;

[0011] setting a separation condition of the grinding tool and the hole wall to be processed;

[0012] starting the machining tool and the ultrasonic vibration structure to control the grinding tool to perform high-speed spiral grinding on the hole wall to be processed.

[0013] In an embodiment of the present application, the grinding tool comprises a grinding head and abrasive grains, and the abrasive grains are protrudingly arranged on the outer circumferential surface of the grinding head.

[0014] The number of the abrasive grains is one, or the number of the abrasive grains is at least two, and the at least two abrasive grains are arranged at intervals along the axial direction of the grinding head.

[0015] In an embodiment of the present application, when the number of the abrasive grains is at least two, the at least two abrasive grains are at least one of different materials, different bonding modes and different particle sizes.

[0016] In an embodiment of the present application, when the grinding tool is moved to make the grinding tool contact with the hole wall to be processed, the end of the abrasive grain contacts with the hole wall to be processed.

[0017] In an embodiment of the present application, the setting of the separation condition of the grinding tool and the hole wall to be processed comprises:

[0018] setting high-speed spiral grinding parameters of the grinding tool and / or vibration parameters of the ultrasonic vibration structure;

[0019] judging whether the grinding tool and the hole wall to be processed meet the separation condition in the high-speed spiral grinding process according to the high-speed spiral grinding parameters and / or the vibration parameters;

[0020] if yes, controlling the grinding tool to perform high-speed spiral grinding on the hole to be processed;

[0021] if no, adjusting the high-speed spiral grinding parameters and / or the vibration parameters until the grinding tool meets the separation condition with the hole wall to be processed in the grinding process.

[0022] In an embodiment of the present application, the setting of the separation condition of the grinding tool and the hole wall to be processed further comprises:

[0023] when the grinding tool meets the separation condition with the hole wall to be processed in the grinding process, the grinding tool repeatedly grinds at least twice along the high-speed grinding track.

[0024] In an embodiment of the present application, the high-speed spiral grinding parameters include one or more combinations of the rotational speed of the grinding tool, the feed speed of the grinding tool, the pitch of the grinding tool during high-speed spiral grinding, and the grinding depth of the grinding tool.

[0025] And / or, the vibration parameters include the amplitude of the ultrasonic vibration structure and / or the frequency of the ultrasonic vibration structure.

[0026] In an embodiment of the present application, when the grinding tool meets the separation condition of the hole wall to be machined, the high-speed spiral grinding parameters and / or the vibration parameters should meet the following formula:

[0027]

[0028] Wherein, M is the number of abrasive grains intersected by the front and rear grinding tracks of the grinding tool, Δl is the distance between adjacent two abrasive grains, n is the rotational speed of the grinding tool, r is the radius of the grinding tool, f is the pitch of the grinding tool during high-speed spiral grinding, R is the radius of the hole to be machined, v is the feed speed of the grinding tool, A is the amplitude of the ultrasonic vibration structure, and a is the angle turned by a single abrasive grain when the contact between the single abrasive grain and the hole wall to be machined changes from cutting in to cutting out during one revolution.

[0029] In an embodiment of the present application, after the grinding tool is installed on the ultrasonic vibration structure, the grinding tool can generate axial vibration or axial vibration component.

[0030] In an embodiment of the present application, the ultrasonic vibration structure includes an ultrasonic transducer and a horn, the ultrasonic transducer is connected with an alternating current power supply, and the horn is installed on the output end of the ultrasonic transducer.

[0031] The grinding tool is arranged on the output end of the horn.

[0032] After adopting the above technical solution, the present application has at least the following technical effects:

[0033] The ultrasonic vibration spiral grinding method of the present application can grind the hole wall to be machined of the workpiece to be machined. The ultrasonic vibration structure is installed on the machining machine tool, the grinding tool is installed on the ultrasonic vibration structure, and the workpiece to be machined is installed on the machining machine tool. The grinding tool is moved to extend into the hole to be machined of the workpiece to be machined and contact the hole wall to be machined. After setting the separation condition of the grinding tool and the hole wall to be machined, the machining machine tool and the ultrasonic transducer are started to control the grinding tool to perform high-speed spiral grinding on the hole wall to be machined.

[0034] The ultrasonic vibration spiral grinding method sets the separation condition between the grinding tool and the hole wall to be processed before grinding the hole wall to be processed. In the high-speed spiral grinding process, the ultrasonic vibration structure enables intermittent contact between the grinding tool and the hole wall to be processed. In this way, when the grinding tool contacts the hole wall to be processed, the hole wall to be processed can be ground, and when the grinding tool is separated from the hole wall to be processed, the grinding tool does not contact the hole wall to be processed. Therefore, the grinding speed of the grinding tool can be improved, the high precision and high efficiency of spiral grinding can be realized, the grinding precision of the hole to be processed can be ensured, the temperature of the grinding tool can be reduced, and the service life of the grinding tool can be prolonged. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 A flowchart of the ultrasonic vibration spiral grinding method of an embodiment of the present application.

[0036] Figure 2 A schematic diagram of the ultrasonic vibration structure driving the grinding tool to grind the workpiece to be processed.

[0037] Figure 3 A schematic diagram of the ultrasonic vibration structure driving the grinding tool to grind the workpiece to be processed. Figure 2 A schematic diagram of the ultrasonic vibration structure driving the grinding tool to grind the workpiece to be processed.

[0038] Figure 4 A schematic diagram of the ultrasonic vibration structure driving the grinding tool to grind the workpiece to be processed. Figure 2 A schematic diagram of the ultrasonic vibration structure driving the grinding tool to grind the workpiece to be processed.

[0039] Figure 5 A schematic diagram of the ultrasonic vibration structure driving the grinding tool to grind the workpiece to be processed. Figure 1 A flowchart of the ultrasonic vibration spiral grinding method of an embodiment of the present application.

[0040] Figure 6 A schematic diagram of the ultrasonic vibration spiral grinding method of an embodiment of the present application.

[0041] Figure 7 A schematic diagram of the ultrasonic vibration spiral grinding method of an embodiment of the present application.

[0042] Figure 8 A schematic diagram of the ultrasonic vibration spiral grinding method of an embodiment of the present application. Figure 2 A schematic diagram of the ultrasonic vibration spiral grinding method of an embodiment of the present application.

[0043] Figure 9 A schematic diagram of the ultrasonic vibration spiral grinding method of an embodiment of the present application. Figure 2 A schematic diagram of the ultrasonic vibration spiral grinding method of an embodiment of the present application.

[0044] Figure 10 A comparison diagram of the grinding amount and roughness of the ultrasonic vibration spiral grinding and ordinary grinding of the present application under a process parameter.

[0045] Figure 11 Fig. 6 is a comparison chart of the grinding amount and roughness of the ultrasonic vibration spiral grinding and the ordinary grinding under another process parameter of the present application.

[0046] Figure 12 Fig. 7 is a comparison chart of the grinding force of the grinding amount and roughness of the ultrasonic vibration spiral grinding and the ordinary grinding under different process parameters of the present application.

[0047] Wherein: 100, ultrasonic vibration structure; 200, grinding tool; 210, grinding head; 220, abrasive grains; 300, workpiece; 310, hole to be processed; 311, hole wall to be processed. DETAILED DESCRIPTION

[0048] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, a large number of specific details are set forth in order to facilitate a full understanding of the present application. However, the present application can be implemented in many different ways other than those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0049] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0050] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features referred to. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0051] In the present application, unless specifically defined otherwise, if there are terms such as "mount", "connect", "connect", "fix" and the like, these terms should be interpreted in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0052] In the present application, unless specifically defined otherwise, if there are terms such as "mount", "connect", "connect", "fix" and the like, these terms should be interpreted in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0053] It should be noted that if an element is referred to as "fixed to" or "provided on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.

[0054] High-speed grinding technology is mainly applied in the fields of aerospace, automobile, etc. It can realize the manufacturing of parts made of difficult-to-machine materials such as titanium alloy and nickel-based high-temperature alloy, and can realize high material removal rate and improve the surface quality of parts.

[0055] Ultrasonic vibration cutting has the advantages of reducing cutting force, reducing cutting temperature, improving limiting cutting capacity and machining quality, etc. At present, when machining parts with inner hole structure, ultrasonic vibration cutting is usually used to reduce cutting temperature, improve limiting cutting capacity and machining quality, but the current ultrasonic vibration cutting limits the cutting speed, reduces the cutting precision, and limits the application of ultrasonic cutting vibration.

[0056] Therefore, referring to Figure 1 and Figure 2The application provides an ultrasonic vibration spiral grinding method which can grind a workpiece 300. Figure 1 FIG. 1 is a flowchart of an ultrasonic vibration spiral grinding method according to an embodiment of the application. Figure 2 FIG. 2 is a schematic diagram of an ultrasonic vibration structure 100 driving a grinding tool 200 to grind a workpiece 300 according to the application.

[0057] It can be understood that grinding is a material removal machining method. When the grinding tool 200 rotates at high speed, it can remove the excess material on the workpiece 300 to precisely machine the workpiece 300, improve the machining accuracy of the workpiece 300, and ensure the quality of the workpiece 300.

[0058] In this embodiment, the workpiece 300 has a workpiece hole 310, as shown in FIG. 3. Figure 2 The workpiece hole 310 is located in the middle region of the workpiece 300 and extends in the axial direction (height direction, up-down direction). The grinding tool 200 can extend into the workpiece hole 310 to grind the workpiece hole wall 311 of the workpiece hole 310.

[0059] In addition, the application is described with the axial direction of the workpiece hole 310 as the azimuth reference. It can be understood that the workpiece 300 is a part of difficult-to-machine material such as titanium alloy or nickel-based superalloy, which can be applied to the fields of aerospace and automobile. Of course, in other embodiments of the application, the workpiece 300 can also be other parts that need to be ground on the inner hole.

[0060] In addition, the shape of the workpiece 300 is not limited in principle, Figure 2 The workpiece 300 shown in FIG. 3 is a schematic diagram of a part. The workpiece 300 can also have other shapes, and the shape of the workpiece 300 will not be described when the ultrasonic vibration spiral grinding method is described later.

[0061] The ultrasonic vibration spiral grinding method of the application adopts the grinding tool 200 to perform high-speed spiral grinding on the workpiece hole wall 311 when grinding the workpiece 300. The grinding tool 200 here is a grinding head 210 with abrasive particles 220, and its specific structure will be described later.

[0062] The ultrasonic vibration spiral grinding method of the application can indirectly contact and grind the workpiece hole wall 311 of the workpiece hole 310 on the workpiece 300 to improve the grinding speed, realize high-precision and high-efficiency machining of the workpiece hole 310, and reduce the temperature of the grinding tool 200, prolonging the service life of the grinding tool 200. The ultrasonic vibration spiral grinding method of the application is introduced below.

[0063] See Figure 1 and Figure 2 In one embodiment, the ultrasonic vibration helical grinding method includes the following steps:

[0064] S1, the ultrasonic vibration structure 100 is installed on the machine tool, and the grinding tool 200 is installed on the ultrasonic vibration structure 100.

[0065] The ultrasonic vibration structure 100 can receive the ultrasonic frequency of an external AC power source, and can output vibration motion at the ultrasonic frequency. The top of the ultrasonic vibration structure 100 is mounted on a machine tool, that is, the fixed end of the ultrasonic vibration structure 100 is mounted on the machine tool.

[0066] A grinding tool 200 is mounted on the output end of the ultrasonic vibration structure 100. When the ultrasonic vibration structure 100 outputs vibration, it can drive the grinding tool 200 to vibrate synchronously. At the same time, the machine tool can also drive the ultrasonic vibration structure 100 to rotate, thereby enabling the ultrasonic vibration structure 100 to drive the grinding tool 200 to rotate for high-speed spiral grinding operation.

[0067] It is understood that the machine tool used in this application can be a vertical grinder or a vertical milling machine. The machine tool has a spindle and a chuck, with the chuck located at the end of the spindle. The chuck can clamp the fixed end of the ultrasonic vibration structure 100, thereby fixing the ultrasonic vibration structure 100.

[0068] The machine tool drives the spindle to rotate, and the spindle, in turn, drives the ultrasonic vibration structure 100 and the grinding tool 200 to rotate around the axis of the spindle via a three-jaw chuck. In this application, the rotational speed of the grinding tool 200 is the same as the rotational speed of the spindle, i.e., ... Figure 2 The rotational speed n is shown.

[0069] Meanwhile, the spindle can also drive the ultrasonic vibration structure 100 and the grinding tool 200 to move along the spindle axis through the three-jaw chuck, so as to perform feed operation while rotating. In addition, the ultrasonic vibration structure 100 drives the grinding tool 200 to vibrate, which enables the grinding tool 200 to perform high-speed spiral grinding operation.

[0070] like Figure 2 As shown, when the grinding tool 200 is performing high-speed spiral grinding, the grinding tool 200 moves axially at a feed speed v and makes spiral motion with a pitch f. In addition, the ultrasonic vibration structure 100 drives the grinding tool 200 to vibrate with an amplitude A.

[0071] It is worth noting that the focus of this application is to use the ultrasonic vibration spiral grinding method of this application to perform high-speed spiral grinding on the wall 311 of the hole to be machined. The type, structure and working principle of the machine tool are not the focus of this application and will not be elaborated on later.

[0072] S2, mounting the workpiece 300 to be processed on the machining tool, moving the grinding tool 200 so that the grinding tool 200 is in contact with the hole wall 311 of the hole 310 to be processed on the workpiece 300 to be processed.

[0073] After the grinding tool 200 and the ultrasonic vibration structure 100 are mounted to the machining tool, the workpiece 300 to be processed is fixed to the machining tool, and the hole 310 to be processed of the workpiece 300 to be processed is exposed. Then, the position of the grinding tool 200 is adjusted by the machining tool, so that the grinding tool 200 can be moved into the hole 310 to be processed.

[0074] It can be understood that the hole 310 to be processed can be arranged corresponding to the grinding tool 200 after the workpiece 300 to be processed is mounted to the machining tool. In this way, the machining tool controls the spindle to drive the ultrasonic vibration structure 100 and the grinding tool 200 to perform a moving operation, that is, the grinding tool 200 can be moved into the hole 310 to be processed.

[0075] After the grinding tool 200 is moved into the hole 310 to be processed, the outer wall of the grinding tool 200 is in contact with the hole wall 311 of the hole 310 to be processed. When the spindle drives the grinding tool 200 to rotate at high speed through the ultrasonic vibration structure 100, the grinding tool 200 can perform high-speed spiral grinding on the hole wall 311 to be processed.

[0076] S3, setting a separation condition of the grinding tool 200 and the hole wall 311 to be processed.

[0077] After the grinding tool 200 is moved into the hole 310 to be processed and is in contact with the hole wall 311 to be processed, the separation condition of the grinding tool 200 and the hole wall 311 to be processed needs to be set. The separation condition here refers to the separation of the grinding tool 200 and the hole wall 311 to be processed.

[0078] That is, the grinding tool 200 is in indirect contact with the hole wall 311 to be processed, and the grinding tool 200 performs grinding on the hole wall 311 to be processed in an intermittent grinding manner. In the process of high-speed spiral grinding, the grinding tool 200 is in contact with the hole wall 311 to be processed for a period of time to perform high-speed spiral grinding.

[0079] In the next period of time, the grinding tool 200 is separated from the hole wall of the hole 310 to be processed, and at this time, the grinding tool 200 no longer performs high-speed spiral grinding on the hole wall of the hole 310 to be processed, but the spindle still drives the grinding tool 200 to rotate. In the next period of time, the grinding tool 200 is in contact with the hole wall 311 to be processed.

[0080] Thus, in the high-speed spiral grinding process, the relationship between the grinding tool 200 and the hole wall 311 to be processed is: the grinding tool 200 is in contact with the hole wall 311 to be processed-the grinding tool 200 is not in contact with the hole wall 311 to be processed-the grinding tool 200 is in contact with the hole wall 311 to be processed-the grinding tool 200 is not in contact with the hole wall 311 to be processed-the grinding tool 200 is in contact with the hole wall 311 to be processed-...

[0081] In this way, when the grinding tool 200 is driven by the ultrasonic vibration structure 100 to perform ultrasonic vibration spiral grinding, the cutting force and the cutting temperature are reduced, the limit cutting capacity and the machining quality are improved, and the like. At the same time, by setting the separation condition of the grinding tool 200 and the hole wall 311 to be processed, the grinding speed can be improved, and high precision and high efficiency of spiral grinding can be realized.

[0082] Moreover, in the high-speed spiral grinding process, the separation of the grinding tool 200 and the hole wall 311 to be processed can also prolong the service life of the grinding tool 200. It can be understood that the separation in the high-speed spiral grinding process can improve the cooling effect, reduce the grinding force, slow down the wear of the grinding tool 200, and thus prolong the service life of the grinding tool 200.

[0083] Among them, the wear of the grinding tool 200 is divided into three stages of initial wear, stable wear and severe wear, and correspondingly, the roughness will first decrease and tend to be stable, and then sharply increase with the wear of the grinding tool 200. Therefore, when the roughness sharply increases, it is considered that the grinding tool 200 fails, the experiment is stopped, and the cumulative grinding removal amount at this time is the service life of the grinding tool 200.

[0084] S4, turn on the machining tool and the ultrasonic vibration structure 100 to control the grinding tool 200 to perform high-speed spiral grinding on the hole wall 311 to be processed.

[0085] After the separation condition of the grinding tool 200 and the hole wall 311 to be processed is set, the grinding tool 200 can perform grinding operation. At this time, the machining tool and the ultrasonic vibration structure 100 are turned on, the machining tool can drive the grinding tool 200 to rotate and move (feed) through the ultrasonic vibration structure 100, and at the same time, the ultrasonic vibration structure 100 can drive the grinding tool 200 to vibrate. In this way, the grinding tool 200 can perform high-speed spiral grinding operation on the hole wall 311 to be processed.

[0086] The ultrasonic vibration spiral grinding method of the above embodiment sets the separation condition between the grinding tool 200 and the hole wall 311 to be processed before the hole wall 311 to be processed is subjected to grinding processing. In the high-speed spiral grinding process, the ultrasonic vibration structure 100 can make the grinding tool 200 and the hole wall 311 to be processed contact intermittently. In this way, when the grinding tool 200 contacts the hole wall 311 to be processed, the hole wall 311 to be processed can be ground, and when the grinding tool 200 is separated from the hole wall 311 to be processed, the grinding tool 200 does not contact the hole wall 311 to be processed. Therefore, the grinding speed of the grinding tool 200 can be improved, the high precision and high efficiency of spiral grinding can be realized, the grinding precision of the hole 310 to be processed can be ensured, the temperature of the grinding tool 200 can be reduced, and the service life of the grinding tool 200 can be prolonged.

[0087] Referring to Figure 1 , Figure 3 and Figure 4 , in an embodiment, the grinding tool 200 comprises a grinding head 210 and abrasive grains 220, and the abrasive grains 220 are protrudingly arranged on the outer circumferential surface of the grinding head 210. The number of the abrasive grains 220 is one, or the number of the abrasive grains 220 is at least two, and the at least two abrasive grains 220 are arranged at intervals along the axial direction and / or the circumferential direction of the grinding head 210. Figure 3 For Figure 2 the schematic diagram of the ultrasonic vibration structure 100 installing the grinding tool 200, Figure 4 for Figure 2 the schematic diagram of the motion track of the abrasive grains 220 of the grinding tool 200 grinding the hole wall 311 to be processed.

[0088] The grinding head 210 is the main body of the grinding tool 200, and the grinding head 210 is arranged in a cylindrical shape. The central axis of the grinding head 210 is installed to the output end of the ultrasonic vibration structure 100. The abrasive grains 220 are components for grinding operation of the grinding tool 200, and the abrasive grains 220 are arranged on the outer circumferential surface of the grinding head 210, and the abrasive grains 220 are protrudingly arranged on the outer circumferential surface of the grinding head 210.

[0089] When the grinding tool 200 performs high-speed spiral grinding operation on the hole wall 311 to be processed, the abrasive grains 220 can contact the surface of the hole wall to be processed and perform grinding operation on the hole wall 311 to be processed to remove excess material of the hole wall 311 to be processed and reduce the surface roughness of the hole wall 311 to be processed.

[0090] In this embodiment, the grinding tool 200 comprises at least two abrasive grains 220, and the at least two abrasive grains 220 are arranged at intervals on the outer circumferential surface of the grinding head 210. In this way, the plurality of abrasive grains 220 can contact the hole wall 311 to be processed respectively, increase the contact area between the grinding tool 200 and the hole wall 311 to be processed, and improve the grinding efficiency.

[0091] Meanwhile, after the previous abrasive particle 220 contacts the hole wall 311 to be processed, the subsequent abrasive particle 220 can contact the hole wall 311 to be processed in the area where the previous abrasive particle 220 does not contact, so as to reduce the height of the unprocessed area, reduce the area of the unprocessed area, improve the grinding quality, and reduce the surface roughness of the hole wall 311 to be processed.

[0092] Of course, in other embodiments of the present application, the grinding head 210 can also be provided with one abrasive particle 220, and the hole wall 311 to be processed is ground by one abrasive particle 220.

[0093] It is worth noting that the grinding tool 200 has one abrasive particle 220 and the grinding tool 200 has at least two abrasive particles 220, and the grinding principle is substantially the same. When the previous and subsequent two abrasive particles 220 grind the hole wall 311 to be processed, it can correspond to the processing of one abrasive particle 220 twice.

[0094] Hereinafter, only the grinding tool 200 with at least two abrasive particles 220 will be described, and the grinding tool 200 with one abrasive particle 220 will not be described.

[0095] Figure 4 It is shown that the motion trajectory diagram of the single abrasive particle 220 in the grinding tool 200, the spindle drives the grinding tool 200 to rotate at high speed and axially feed through the ultrasonic vibration structure 100, and at the same time, the ultrasonic vibration structure 100 drives the grinding tool 200 to vibrate along the axial direction. In this way, the grinding tool 200 can make high-speed spiral motion, and the abrasive particle 220 on the grinding tool 200 can perform high-speed spiral grinding.

[0096] Figure 4 In the figure, the left side is a schematic diagram of the overall motion trajectory of the single abrasive particle 220, and the right side is a local enlarged view of the motion trajectory. As can be seen from the figure, the grinding tool 200 can make spiral motion as a whole when it rotates itself, so as to perform high-speed spiral grinding operation on the hole wall 311 to be processed.

[0097] In an embodiment, when the number of abrasive particles 220 is at least two, the at least two abrasive particles 220 are at least one of different materials, different bonding methods, and different particle sizes.

[0098] The materials of the at least two abrasive particles 220 in the grinding tool 200 are different, such as the materials of the abrasive particles 220 are boron carbide, chromium corundum, silicon carbide, etc. In this way, the processing effects of the at least two abrasive particles 220 on the hole wall 311 to be processed are different, so as to achieve the required surface roughness after processing the hole wall 311 to be processed.

[0099] At least two abrasive grains 220 in the grinding tool 200 are joined in different ways. For example, the abrasive grains 220 are set on the grinding head 210 by electroplating, or they can be set on the grinding head 210 by bonding, etc. In this way, the different joining methods result in different processing effects of the abrasive grains 220 on the hole wall 311 to be processed, so that the hole wall 311 to be processed achieves the required surface roughness after processing.

[0100] At least two abrasive grains 220 in the grinding tool 200 have different grit sizes. Grit size refers to the size of the abrasive grain 220, which is measured by the diameter of the abrasive grain 220 (usually the major or minor diameter). Thus, different grit sizes result in different machining effects on the hole wall 311 to be machined, so that the hole wall 311 to be machined achieves the required surface roughness after machining.

[0101] In the ultrasonic vibration spiral grinding method of this application, at least two abrasive grains 220 may have at least one of the following characteristics: different materials, different bonding methods, and different grain sizes, so that the abrasive grains 220 have different processing effects on the hole wall 311 to be processed, so that the hole wall 311 to be processed achieves the required surface roughness after processing.

[0102] like Figure 2 As shown, in one embodiment, after the grinding tool 200 is mounted on the machine tool via the ultrasonic vibration structure 100, the grinding tool 200 can vibrate axially or with a component of axial vibration. In this way, the ultrasonic vibration structure 100 can drive the grinding tool 200 to vibrate axially, thereby reducing the grinding force during high-speed helical grinding, reducing the grinding temperature, and improving the ultimate grinding capability and machining quality.

[0103] like Figure 2 As shown, in one embodiment, after the grinding tool 200 is mounted on the machine tool via the ultrasonic vibration structure 100, the grinding tool 200 can vibrate axially. In this way, the ultrasonic vibration structure 100 can drive the grinding tool 200 to vibrate axially, thereby reducing the grinding force during high-speed helical grinding, reducing the grinding temperature, and improving the ultimate grinding capability and machining quality.

[0104] like Figure 2 As shown, in one embodiment, the vibration direction of the ultrasonic vibration structure 100 coincides with the central axis of the grinding tool 200. In this way, the ultrasonic vibration structure 100 can vibrate accurately along the axial direction.

[0105] like Figure 2As shown, in one embodiment, when the grinding tool 200 is moved to contact the wall 311 of the hole to be processed, the tip of the abrasive grain 220 contacts the wall 311 of the hole to be processed. That is, after the grinding tool 200 moves to the hole 310 to be processed, the tip of the abrasive grain 220, that is, the end of the abrasive grain 220 away from the grinding head 210, can contact the wall 311 of the hole to be processed.

[0106] That is, when the grinding tool 200 has no feed, has not yet started grinding, and the grinding depth is zero, the tip of the abrasive grain 220 can contact the wall 311 of the hole to be processed. In this way, when the spindle drives the grinding head to rotate through the ultrasonic vibration structure 100, the grinding head can perform grinding operations on the wall 311 of the hole to be processed.

[0107] See Figure 1 , Figure 2 and Figure 5 , Figure 5 for Figure 1 The flowchart illustrates a method for separating the grinding tool 200 from the hole wall 311 during ultrasonic vibration helical grinding. In one embodiment, the separation conditions for the grinding tool 200 from the hole wall 311 include:

[0108] Set the high-speed spiral grinding parameters of the grinding tool 200 and / or the vibration parameters of the ultrasonic vibration structure 100;

[0109] Based on the high-speed spiral grinding parameters and / or the vibration parameters, determine whether the grinding tool 200 and the hole wall 311 to be processed meet the separation conditions during the high-speed spiral grinding process;

[0110] If so, control the grinding tool 200 to perform high-speed spiral grinding on the hole 310 to be processed;

[0111] If not, adjust the high-speed spiral grinding parameters and / or the vibration parameters until the grinding tool 200 meets the separation condition from the hole wall 311 to be processed during the grinding process.

[0112] In the ultrasonic vibration spiral grinding method of this application, by setting the high-speed spiral grinding parameters of the grinding tool 200 and the vibration parameters of the ultrasonic vibration structure 100, the abrasive grains 220 of the grinding head 210 meet the separation conditions from the hole wall 311 to be processed during the high-speed spiral grinding process.

[0113] Before starting the machining tool and the ultrasonic vibration structure 100, the high-speed spiral grinding parameters of the grinding tool 200 and the vibration parameters of the ultrasonic vibration structure 100 are set. Based on the high-speed spiral parameters and vibration parameters, it is determined whether the grinding tool 200 and the hole wall 311 to be processed meet the separation conditions during the high-speed spiral grinding process.

[0114] If the separation condition is met between the grinding tool 200 and the hole wall 311 to be machined during high-speed spiral grinding, the machining tool and the ultrasonic vibration structure 100 are started, at this time, the machining tool can drive the grinding tool 200 to rotate at high speed through the ultrasonic vibration structure 100, and at the same time, the ultrasonic vibration structure 100 can drive the grinding tool 200 to vibrate, so that the grinding tool 200 performs high-speed spiral grinding operation on the hole wall 311 to be machined.

[0115] If the separation condition is not met between the grinding tool 200 and the hole wall 311 to be machined during high-speed spiral grinding, the high-speed spiral grinding parameters of the grinding tool 200 are adjusted, and / or the vibration parameters of the ultrasonic vibration structure 100 are adjusted, and then whether the separation condition is met between the grinding tool 200 and the hole wall 311 to be machined during high-speed spiral grinding is judged according to the adjusted high-speed spiral grinding parameters and / or vibration parameters.

[0116] If the separation condition is still not met between the grinding tool 200 and the hole wall 311 to be machined during high-speed spiral grinding, the high-speed spiral grinding parameters of the grinding tool 200 are continuously adjusted, and / or the vibration parameters of the ultrasonic vibration structure 100 are adjusted, until the separation condition is met between the grinding tool 200 and the hole wall 311 to be machined during high-speed spiral grinding, and then the grinding tool 200 can be controlled to perform high-speed spiral grinding operation.

[0117] Referring to Figure 1 , Figure 2 , Figure 5 and Figure 6 , Figure 6 is a schematic diagram of high-speed grinding of the ultrasonic vibration spiral grinding method of the present application. In an embodiment, the separation condition of the grinding tool 200 and the hole wall 311 to be machined is also provided, which includes:

[0118] When the separation condition of the grinding tool 200 and the hole wall 311 to be machined is met during grinding, the grinding tool 200 performs multiple repeated grinding in the overlapping track of high-speed grinding.

[0119] It can be understood that when the machining tool drives the grinding tool 200 to rotate, the rotating speed of the grinding tool 200 is generally greater than or equal to 3000 revolutions per minute. The rotating speed of the grinding tool 200 is high, and when the grinding tool 200 grinds a circle, the grinding tool 200 has not yet fed downward, at this time, the grinding tool 200 can perform multiple repeated grinding on the same position through the abrasive grains 220, so that the grinding track at high speed is overlapped.

[0120] Thus, the grinding tool 200 can repeatedly grind the to-be-processed hole wall 311 at the same position by the abrasive particles 220, so as to obtain a surface morphology with smaller residual height and regular arrangement, and reduce the surface roughness of the to-be-processed hole wall 311. Figure 4

[0121] As shown in Figure 2 , Figure 6 and Figure 7 , the ultrasonic vibration spiral method of the present application is compared with the current ultrasonic vibration grinding for the to-be-processed hole wall 311. Figure 7 FIG. 4 is a schematic view of the current ultrasonic vibration grinding for the to-be-processed hole wall 311 at a low speed.

[0122] In Figure 6 and Figure 7 , n is the rotational speed of the grinding tool 200, v is the feed speed of the grinding tool 200, the spiral line is the cutting track of the abrasive particles 220, and the thickness of the removed material is the grinding depth.

[0123] As can be seen in Figure 7 , the grinding tool 200 rotates at a low speed to perform low-speed spiral grinding on the to-be-processed hole wall 311, the abrasive particles 220 perform one grinding at the same position, the to-be-processed hole wall 311 removes less material, there is more material left on the to-be-processed hole wall 311, and the surface roughness of the to-be-processed hole wall 311 is higher.

[0124] As can be seen in Figure 6 , when the to-be-processed hole wall 311 is subjected to high-speed spiral grinding, the abrasive particles 220 repeatedly grind at the same position, the grinding tool 200 can remove the excess material of the to-be-processed hole wall 311, and obtain a surface morphology with smaller residual height and regular arrangement, thereby reducing the surface roughness of the to-be-processed hole wall 311.

[0125] Moreover, in Figure 6 , compared with Figure 7 , the ultrasonic vibration spiral grinding method of the present application can grind the to-be-processed hole wall 311 at a deeper grinding depth when the to-be-processed hole wall 311 is subjected to high-speed spiral grinding, so as to remove the material of the to-be-processed hole wall 311 as much as possible and reduce the surface roughness of the to-be-processed hole wall 311.

[0126] Referring to Figure 1 , Figure 2 and Figure 4 , in an embodiment, the high-speed spiral grinding parameters include one or more combinations of the rotational speed of the grinding tool 200, the feed speed of the grinding tool 200, the pitch of the grinding tool 200 during high-speed spiral grinding, and the grinding depth of the grinding tool 200. ​

[0127] It can be understood that the high-speed helical grinding parameters of the grinding tool 200 are related to the rotational speed of the grinding tool 200, the feed speed, the pitch during the high-speed helical grinding, and the grinding depth. The rotational speed of the grinding tool 200 herein is higher than the general grinding rotational speed.

[0128] If the separation condition is not met between the grinding tool 200 and the hole wall 311 to be machined during the high-speed helical grinding, one or more of the rotational speed of the grinding tool 200, the feed speed, the pitch during the high-speed helical grinding, and the grinding depth in the high-speed helical grinding parameters of the grinding tool 200 can be adjusted to meet the separation condition between the grinding tool 200 and the hole wall 311 to be machined during the high-speed helical grinding.

[0129] Referring to Figure 1 , Figure 2 and Figure 4 , in an embodiment, the vibration parameters include the amplitude of the ultrasonic vibration structure 100 and / or the frequency of the ultrasonic vibration structure 100. It can be understood that the vibration parameters of the ultrasonic vibration structure 100 are related to the amplitude and the frequency of the ultrasonic vibration structure 100.

[0130] If the separation condition is not met between the grinding tool 200 and the hole wall 311 to be machined during the high-speed helical grinding, the amplitude and / or the frequency of the ultrasonic vibration structure 100 in the ultrasonic vibration structure 100 can be adjusted to meet the separation condition between the grinding tool 200 and the hole wall 311 to be machined during the high-speed helical grinding.

[0131] Referring to Figures 1 to 5 , Figure 8 and Figure 9 , Figure 8 , the axial separation diagram of the adjacent abrasive grains 220 of the grinding tool 200 is shown in Figure 2 , the axial and axial separation diagram of the adjacent abrasive grains 220 of the grinding tool 200 is shown in. In an embodiment, when the grinding tool 200 meets the separation condition of the hole wall 311 to be machined, the high-speed helical grinding parameters and / or the vibration parameters should meet the following formula: Figure 9 Figure 2

[0132]

[0133] ​​Wherein, M is the number of the abrasive grains 220 intersected by the front and rear grinding tracks of the grinding tool 200, Δ1 is the distance between two adjacent abrasive grains 220, n is the rotating speed of the grinding tool 200, r is the radius of the grinding tool 200, f is the pitch of the grinding tool 200 in the high-speed spiral grinding process, R is the radius of the hole 310 to be processed, v is the feed speed of the grinding tool 200, A is the amplitude of the ultrasonic vibration structure 100, and a is the angle turned by a single abrasive grain 220 from cutting in to cutting out in the contact with the hole wall 311 in one revolution.

[0134] It can be understood that, in a certain processing area of the hole wall 311, the motion track of the abrasive grains 220 in the grinding tool 200 is a sinusoidal curve. When the grinding tool 200 rotates at high speed, the rear abrasive grain 220 in the grinding tool 200 will overlap the area processed by the front abrasive grain 220, causing the rear abrasive grain 220 to separate from the hole wall 311 in the area, as shown in Figure 8 .

[0135] In Figure 8 , G N-1 indicates the motion track of the front abrasive grain 220, and G N indicates the motion track of the rear abrasive grain 220. A is the amplitude of the ultrasonic vibration structure 100, and in Figure 8 , the axial distance between the motion track of the front abrasive grain 220 G N-1 and the motion track of the rear abrasive grain 220 G N is less than 2A.

[0136] As can be seen from Figure 8 , after the front abrasive grain 220 G N-1 grinds the hole wall 311, a wavy structure is formed on the surface of the hole wall 311. After the rear abrasive grain 220 G N grinds the hole wall 311 at the same position, there will be an overlapping area with the motion track of the front abrasive grain 220 G N-1 , affecting the separation effect.

[0137] G N’ indicates the motion track of the third abrasive grain 220. In Figure 8 , the motion track of the rear abrasive grain 220 G N is approximately the same as that of the third abrasive grain 220 G N’ , the axial distance between the motion track of the front abrasive grain 220 G N-1 and that of the third abrasive grain 220 G N’ is equal to 2A, and the motion track of the third abrasive grain 220 G N’ is approximately the same as that of the front abrasive grain 220 G N-1The motion trajectories do not overlap, so they do not affect the separation effect.

[0138] G N” This illustrates the movement trajectory of the fourth abrasive grain 220. Figure 8 In the middle, the last abrasive grain is 220G. N And the fourth abrasive grain 220G N” The motion trajectories are roughly the same, the previous abrasive grain 220G N-1 The motion trajectory and the fourth abrasive grain 220G N” When the axial distance between the motion trajectories is greater than 2A, the fourth abrasive grain is 220G. N” The motion trajectory is far away from the previous abrasive grain 220G N-1 The movement trajectories of the two objects are identical, and there is no overlapping area between them, so the separation effect will not be affected.

[0139] It can be seen that the separation conditions between the grinding tool 200 and the hole wall 311 to be machined are related to the high-speed spiral grinding parameters and the amplitude of ultrasonic vibration. Depending on the relationship between the motion parameters and the amplitude of ultrasonic vibration, the separation process also varies. Only when the axial spacing of the grinding marks is less than 2A can the separation effect be achieved, and the larger A is, the larger the separation area, ensuring the separation effect between the grinding tool 200 and the hole wall 311 to be machined.

[0140] Meanwhile, since the circumferential cutting arc length of a single abrasive grain 220 on the hole wall 311 to be machined is limited, when grinding with multiple abrasive grains 220, the circumferential and axial trajectories of the preceding and following abrasive grains 220 on the hole wall must simultaneously intersect, that is, the preceding abrasive grain 220G N With the next abrasive grain 220G N+1 Another abrasive grain 220G N+2 To achieve optimal separation, the intersecting regions must be defined to form a separation area. Figure 9 As shown.

[0141] Therefore, when setting the separation conditions between the grinding tool 200 and the hole wall 311 to be processed, the high-speed spiral grinding parameters, the relevant parameters of the abrasive grains 220, and the vibration parameters are substituted into the above formula to determine whether the above formula is valid, thereby determining whether the grinding tool 200 and the hole wall 311 to be processed meet the separation conditions.

[0142] In one embodiment, the ultrasonic vibration structure 100 includes an ultrasonic transducer and an amplitude transformer. The ultrasonic transducer is connected to an external AC power supply, and the amplitude transformer is mounted on the output end of the ultrasonic transducer. The grinding tool 200 is disposed on the output end of the amplitude transformer.

[0143] Thus, the ultrasonic transducer is driven to vibrate by the ultrasonic power supply outputting alternating current of ultrasonic frequency, and the amplitude of the ultrasonic transducer is amplified through the amplitude transformer, so that the tool is finally driven to realize axial stable ultrasonic frequency vibration.

[0144] The ultrasonic vibration spiral grinding method of the application breaks through the cutting speed limit of traditional ultrasonic vibration cutting, improves the machining difficulty of the surface roughness, precision and efficiency of the to-be-machined hole 310 due to the small hole diameter and large depth, and realizes high-precision and high-efficiency machining of the to-be-machined hole 310.

[0145] Meanwhile, the ultrasonic vibration spiral grinding method can effectively reduce the surface roughness of the to-be-machined hole wall 311, break through the machining parameter limit, and the like as shown in Figure 10 and Figure 11 , and Figure 10 is a comparison chart of the grinding amount and roughness of the ultrasonic vibration spiral grinding and ordinary grinding of the application under another process parameter. Figure 11 is a comparison chart of the grinding amount and roughness of the ultrasonic vibration spiral grinding and ordinary grinding of the application under another process parameter.

[0146] Figure 10 In the table, the rotation speed n is 5000 r / min, the feed speed v is 600 mm / min, and the pitch is 0.1 mm. Figure 11 In the table, the rotation speed n is 7000 r / min, the feed speed v is 600 mm / min, and the pitch is 0.1 mm.

[0147] Taking the roughness of 1.6 μm as a standard, compared with ordinary grinding, when the rotation speed n is 5000 r / min, the roughness of ordinary machining is basically above 1.6 μm, which is considered to be unprocessable under the condition, while the ultrasonic spiral grinding can stably process and reduce the roughness of the to-be-machined hole wall 311. The roughness can be reduced by about 63.7% at most. When the rotation speed n is 7000 r / min, the roughness of ordinary machining is mostly above 1.6 μm, while the ultrasonic spiral grinding can stably process and reduce the roughness of the to-be-machined hole wall 311.

[0148] Meanwhile, the ultrasonic vibration spiral grinding method can effectively prolong the service life of the grinding tool 200 and improve the wear of the grinding tool 200, and the like as shown in Figure 10 and Figure 11 , the maximum cumulative grinding amount of the grinding tool 200 can be increased by 97% under normal grinding, and the roughness can be reduced under the same cumulative grinding amount.

[0149] As shown in Figure 12 , and Figure 12The comparative chart of the grinding force of the grinding allowance and roughness of the ultrasonic vibration spiral grinding and the ordinary grinding under different process parameters. Using the ultrasonic vibration spiral grinding method of the application, the grinding force can be effectively reduced under different processing parameters, and the effect of reducing the grinding force is better with the increase of the amplitude of the ultrasonic vibration. When the amplitude of the ultrasonic vibration is 12 μm, the grinding force can be reduced by about 52.9%.

[0150] The high-speed ultrasonic spiral grinding method of the application can achieve the separation condition of high-speed spiral grinding by adjusting the processing parameters, improve the grinding speed, realize the high precision and high efficiency of spiral grinding, and at the same time, reduce the temperature of the grinding tool 200 and prolong the service life of the grinding tool 200.

[0151] The technical features of the above-described embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0152] The above-described embodiments only express several implementation manners of the application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the application, a number of modifications and improvements can be made, which all belong to the protection scope of the application. Therefore, the protection scope of the patent of the application should be subject to the appended claims.

Claims

1. An ultrasonic vibration spiral grinding method characterized by, The method comprises the following steps: installing an ultrasonic vibration structure on a machining tool, and installing a grinding tool on the ultrasonic vibration structure; installing a workpiece to be machined on the machining tool, and moving the grinding tool to make the grinding tool contact with a hole wall of a hole to be machined on the workpiece to be machined; setting a separation condition of the grinding tool and the hole wall; starting the machining tool and the ultrasonic vibration structure to control the grinding tool to perform high-speed spiral grinding on the hole wall; wherein the ultrasonic vibration structure applies vibration to the grinding tool in a direction parallel to an axis of the hole to be machined, so that the grinding tool performs ultrasonic axial vibration while performing spiral grinding, thereby realizing ultrasonic spiral grinding.

2. The ultrasonic vibration assisted grinding method according to claim 1, wherein, The grinding tool comprises a grinding head and abrasive grains, and the abrasive grains are protrusively arranged on an outer circumferential surface of the grinding head. The number of the abrasive grains is one, or the number of the abrasive grains is at least two, and the at least two abrasive grains are arranged in an axial direction and / or a circumferential direction of the grinding head.

3. The ultrasonic vibration assisted helical grinding method according to claim 2, characterized by, When the number of the abrasive grains is at least two, the at least two abrasive grains are at least one of different materials, different bonding modes, and different particle sizes.

4. The ultrasonic vibration assisted helical grinding method according to claim 2, characterized by, When the grinding tool is moved to contact with the hole wall, an end of the abrasive grain contacts with the hole wall.

5. The ultrasonic vibration assisted helical grinding method according to any one of claims 1 to 4, characterized in that, The setting of the separation condition of the grinding tool and the hole wall comprises: setting high-speed spiral grinding parameters of the grinding tool and / or vibration parameters of the ultrasonic vibration structure; judging whether the separation condition is met between the grinding tool and the hole wall during high-speed spiral grinding according to the high-speed spiral grinding parameters and / or the vibration parameters; if yes, controlling the grinding tool to perform high-speed spiral grinding on the hole; if no, adjusting the high-speed spiral grinding parameters and / or the vibration parameters until the separation condition is met between the grinding tool and the hole wall during grinding.

6. The ultrasonic vibration assisted helical grinding method according to claim 5, characterized by The setting of the separation condition of the grinding tool and the hole wall further comprises: when the separation condition is met between the grinding tool and the hole wall during grinding, the grinding tool performs multiple repeated grinding in a track overlap of high-speed grinding.

7. The ultrasonic vibration assisted helical grinding method according to claim 5, wherein, The high-speed spiral grinding parameters comprise one or more combinations of a rotating speed of the grinding tool, a feed speed of the grinding tool, a pitch of the grinding tool during high-speed spiral grinding, and a grinding depth of the grinding tool. And / or, the vibration parameters comprise an amplitude of the ultrasonic vibration structure and / or a frequency of the ultrasonic vibration structure.

8. The ultrasonic vibration assisted helical grinding method according to claim 5, characterized by, When the grinding tool meets the separation condition of the hole wall, the high-speed spiral grinding parameters and / or the vibration parameters should meet the following formula: Wherein, M is the number of the intersection of the grinding tool front and rear grinding track abrasive particles, Δl is the distance between the two adjacent abrasive particles, n is the speed of the grinding tool, r is the radius of the grinding tool, f is the pitch of the grinding tool in the process of high-speed spiral grinding, R is the radius of the hole to be processed, v is the feed speed of the grinding tool, A is the amplitude of the ultrasonic vibration structure, and α is the angle of a single abrasive particle in a rotation and the contact of the hole wall from cutting in to cutting out.

9. The ultrasonic vibration assisted helical grinding method according to any one of claims 1 to 4, characterized in that, After the grinding tool is installed on the ultrasonic vibration structure, the grinding tool can produce axial vibration or axial vibration components.

10. The ultrasonic vibration assisted helical grinding method according to any one of claims 1 to 4, characterized in that, The ultrasonic vibration structure comprises an ultrasonic transducer and a horn, the ultrasonic transducer is circumscribed by an alternating current power supply, and the horn is installed on the output end of the ultrasonic transducer. The grinding tool is arranged on the output end of the horn.

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