Luminescent lamp strip structure and manufacturing method thereof

Abstract

The invention provides a light-emitting lamp strip structure and a manufacturing method thereof, and belongs to the technical field of lamp strip machining. The light-emitting lamp strip structure is composed of a wire, a conductor, a lamp bead chip, a lamp bead wrapping part used for transmitting or shading lamplight and a pasting part; according to the lamp strip, machining of exposed parts of the wires, machining of welded lamp bead chips after tin dispensing, machining of lamp bead wrapping parts, machining of pasting parts and final cutting and packaging can be conducted in sequence, mechanization can be adopted in all the machining processes, rapid batch production of the lamp strip is achieved, the production process of a traditional LED lamp strip is really changed through the lamp strip manufacturing method, the production cost is reduced, and the production efficiency is improved. The LED lamp strip is novel, reasonable in structure, simple in manufacturing method and capable of being self-defined according to user requirements, and has high practical value and wide market prospects.

Description

Technical Field

[0001] The present invention relates to the technical field of light strip processing, and in particular to a light strip structure and a manufacturing method thereof. Background Art

[0002] LED light strips, as decorative lighting and atmosphere-creating LED light source products widely used in lighting in various industries, have functions and effects everywhere, whether it is lighting effect decoration or actual lighting. However, traditional LED light strips have some limitations and inconveniences, which are mainly reflected in their structural form. Generally speaking, there are two ways of traditional LED light strips. One is to assemble the LED on the PCB hard board, and then fix the PCB hard board in the light-transmitting shell; the other is to encapsulate the LED on the FPC flexible board, and then form a coating structure that wraps the FPC flexible board at one time by injection molding or extrusion on the outside of the FPC flexible board. In actual production, this structure often needs to be customized according to customer needs, such as choosing single-sided or double-sided light emission, or needing to be re-molded, etc. The versatility of the corresponding coating structure and production process is relatively poor.

[0003] In addition, overall, it is difficult for the LED light strip products currently on the market to meet the diversified and personalized needs, such as the number and spacing of user-defined light-emitting parts, etc. The traditional light strip structure adopts the method of embedding the finished light strip in the shell or inlaying it in the injection molded part, and its scalability is relatively limited. Therefore, it is of great market prospect to improve the existing LED light strip design from the perspective of structure, functionality and production process to improve its applicability in different environments and meet the personalized and diversified needs of modern users for lighting products. Summary of the invention

[0004] The embodiments of the present invention provide a light strip structure and a manufacturing method thereof, aiming to solve the problems that the existing intercom has certain deficiencies in structure and specific use.

[0005] The embodiment of the present invention provides a light strip structure, characterized in that: it comprises a wire, and a surface of the wire is formed with a plurality of exposed portions by peeling;

[0006] At least two conductors, the conductors are built inside the wire, and the surfaces of the conductors are spot-welded with tin plates at the exposed parts;

[0007] A lamp bead chip, which is soldered to the surface of the tin plate and is connected to the conductor, and is a SMD lamp bead;

[0008] A lamp bead covering part used for transmitting or shielding light, the lamp bead covering part covers the outer wall of the lamp bead chip and fills the exposed part, and the light passes through the lamp bead covering part to produce single-sided, double-sided, multi-sided and back-emitting light effects of different colors;

[0009] The adhesive portion is fixedly connected to the flat mounting and fixing surface of the wire.

[0010] In one embodiment of the present invention, tension wire ropes and optical fiber wires are also placed inside the conductive wire.

[0011] In one embodiment of the present invention, the adhesive portion is a double-sided adhesive fixed to the flat mounting and fixing surface of the conductor.

[0012] A method for manufacturing a light strip, comprising the steps of:

[0013] S1, wire processing;

[0014] S2, solder the lamp chip after tinning;

[0015] S3, processing the lamp bead covering part;

[0016] S4, processing the pasting part and obtaining the luminous light strip;

[0017] S5, quality inspection, cutting, winding and packaging of the light strips.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1) The light-emitting components of this type of light strip are selected from SMD lamp bead chips, and the SMD lamp bead chips can be quickly mounted on the tin plate of the light strip by SMD method, so that the light strip can meet the needs of mass production, and through the processing and control of the number, spacing, and size of the exposed parts, the number, spacing, and specifications of the lamp bead chips can be freely DIY according to actual needs. The insulator of the lamp bead covering part can be coated on the outside of the lamp bead chip by dispensing, injection molding, hot melting, ultrasound, bonding or assembly according to processing needs. While protecting the lamp bead chip, the single-sided, double-sided, multi-sided and back-side light emission of the light strip can be controlled by selecting transparent materials or opaque materials. It can provide users with diversified lighting effects and experiences according to actual application needs and scenarios, greatly increasing the application scope of this type of light strip and the scope of application of different groups of people, and having better product competitiveness in the market;

[0020] 2) This type of light strip can be processed in sequence for the exposed part of the wire, the processing of the lamp bead chip after tinning, the processing of the lamp bead covering part, the processing of the pasting part and finally cutting and packaging, and each processing process can be mechanized to achieve rapid mass production of the light strip. Moreover, the light strip manufacturing method of the present invention has indeed changed the production process of traditional LED light strips, and provides a new type of LED light strip with reasonable structure, simple manufacturing method, and can be customized according to user needs, which has high practical value and broad market prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic structural diagram of a light strip structure provided in an embodiment of the present invention;

[0023] Figure 2 A schematic diagram of the back structure of a light strip structure provided in an embodiment of the present invention;

[0024] Figure 3 A schematic diagram of the structure of the exposed portion provided in an embodiment of the present invention;

[0025] Figure 4 A schematic diagram of the structure of the lamp bead covering portion provided in an embodiment of the present invention;

[0026] Figure 5 A schematic diagram of the structure of the lamp bead covering portion provided in an embodiment of the present invention;

[0027] Figure 6 A schematic cross-sectional view of a lamp bead covering portion provided in an embodiment of the present invention;

[0028] Figure 7 This is one of the cross-sectional schematic diagrams of the lamp bead covering portion provided in an embodiment of the present invention;

[0029] Figure 8 The second cross-sectional schematic diagram of the lamp bead covering portion provided in the embodiment of the present invention;

[0030] Fig. 9 The third cross-sectional schematic diagram of the lamp bead covering portion provided in the embodiment of the present invention;

[0031] Fig.10 The fourth cross-sectional schematic diagram of the lamp bead covering portion provided in the embodiment of the present invention.

[0032] Icons: 1. Wire; 11. Exposed part; 12. Tin plate; 13. Optical fiber; 14. Wire sheath; 15. Tension wire rope; 2. Conductor; 3. Lamp bead chip; 4. Lamp bead covering; 41. Insulator; 5. Adhesive part; 51. Release paper. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0038] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0040] Example

[0041] See also Figure 1 A light-emitting lamp strip structure is composed of a wire 1, a conductor 2, a lamp bead chip 3, a lamp bead covering part 4 for transmitting or shielding light, and an adhesive part 5.

[0042] For details, please refer to Figure 1-2 The lamp strip structure is composed of a wire 1, a conductor 2, a lamp bead chip 3, a lamp bead covering portion 4 and an adhesive portion 5. The conductor 2 is used to power the lamp bead chip 3. Of course, the conductor 2 is not limited to the power supply line, and can also include a control line for controlling the lamp bead chip 3. The lamp bead chip 3 can be controlled by the control line; the lamp bead covering portion 4 can protect the lamp bead chip 3 and the conductor 2, increase the structural strength of the wire 1, and at the same time, the shading of the lamp bead covering portion 4 can also control the light emission direction of the lamp bead chip 3, so that the lamp strip can provide users with diversified lighting effects and experiences according to actual application needs and scenarios; the adhesive portion 5 can enable the lamp strip to be quickly bonded and fixed to the installation object, so as to realize flexible and convenient installation of the lamp strip.

[0043] See also Figure 3 , wherein the surface of the wire 1 is formed with a plurality of exposed portions 11 arranged at equal or unequal intervals by peeling, and the sizes of the plurality of exposed portions 11 are the same or different;

[0044] Specifically, after the wire 1 is stripped by an automatic wire stripping machine, an exposed portion 11 is formed on the surface of the wire 1. By controlling the stripping position, shape, and size, the distance and shape between the multiple exposed portions 11 can be controlled, so that the exposed portion 11 can adapt to the processing of lamp bead chips 3 and lamp bead coverings 4 of different specifications, thereby realizing the DIY and customization needs of the light strip.

[0045] See also Figure 3 , the conductor 2 is built inside the wire 1, and a tin plate 12 is spot-welded on the surface of the conductor 2 at the exposed portion 11;

[0046] Specifically, the surface of the conductor 2 at the exposed portion 11 can be tinned by an automatic tinning machine, and after tinning, a tin plate 12 can be formed on the surface of the conductor 2 to provide a welding point for the lamp bead chip 3 .

[0047] Please also refer to Figure 3 The lamp bead chip 3 is soldered to the surface of the tin plate 12 and is connected to the conductor 2. The lamp bead chip 3 is a SMD lamp bead;

[0048] Specifically, an automatic chip mounter can be used to mount the chip-type lamp bead chip 3 and the tin plate 12. While ensuring processing efficiency, the chip-type lamp bead chip 3 also has a variety of luminous colors and a better service life, thereby ensuring the service life of the light strip.

[0049] See also Figure 1 The lamp bead covering portion 4 covers the outer wall of the lamp bead chip 3 and fills the exposed portion 11;

[0050] Specifically, by controlling the shape of the lamp bead covering portion 4 and the processing of the shading surface, the lamp bead covering portion 4 can fill the exposed portion 11 and control the light emitting direction of the lamp bead chip 3 at the same time.

[0051] See also Figure 2 , the adhesive portion 5 is fixedly connected to the flat mounting and fixing surface of the conductor 1;

[0052] Specifically, the provided adhesive portion 5 can enable the light strip to be quickly adhered and fixed to the installation object, and the adhesive portion 5 can be processed according to the light-emitting direction of the lamp bead chip 3 to prevent the installation object from blocking the light emission of the lamp bead chip 3.

[0053] In this embodiment: the lamp bead covering part 4 is an insulator 41 that is covered on the lamp bead chip 3 by dispensing, injection molding, hot melting, ultrasound, bonding or assembly. The insulator 41 is made of transparent material or opaque material. After the lamp bead covering part 4 is covered on the lamp bead chip 3, the edge and the surface of the wire 1 remain flat. When the lamp bead chip 3 is illuminated, the light passes through the insulator 41 to produce different color light effects of single-sided, double-sided, multi-sided and back-emitting.

[0054] For details, please refer to Figure 4 The lamp bead covering portion 4 can be processed by injection molding using insulating materials, so that the lamp bead covering portion 4 formed by the insulator 41 can be fitted and covered on the outside of the lamp bead chip 3 and kept flush with the edge of the exposed portion 11; the insulator 41 can also be processed by dispensing (see Figure 5 ), after the insulating colloid material is solidified, the lamp bead covering portion 4 can also be formed; the insulator 41 can also be processed by assembly (see Figure 6 ), firstly, two insulating sheets of mortise and tenon structure are processed, and then the two insulating sheets are covered on the outside of the lamp bead chip 3 and then buckled, which can also form the lamp bead covering part 4; of course, the insulator 41 can also be processed by hot melting, ultrasound, bonding and other methods to cover the insulating material on the outside of the lamp bead chip 3, which can also form the lamp bead covering part 4, further increasing the flexibility of light strip processing.

[0055] However, it should be noted that: in order to increase the flexibility of customers in choosing light strips, after the lamp bead covering part 4 is covered on the lamp bead chip 3, the edge and the surface of the wire 1 may also be convex or concave; after the lamp bead covering part 4 is fitted and covered on the outside of the lamp bead chip 3, it and the edge of the exposed part 11 may also be convex or concave, thereby increasing the diversity of the appearance of the light strip.

[0056] In order to use the lamp bead covering part 4 to control the light emitting surface of the lamp bead chip 3, the details are as follows:

[0057] When the lamp bead covering portion 4 is single-sided luminous (see Figure 7 ), wherein the three sides of the insulator 41 are provided with opaque shading surfaces, and the three shading surfaces are used to shield light, so that the light emitted by the lamp bead chip 3 can only be emitted through one light-transmitting surface;

[0058] When the lamp bead covering portion 4 is double-sided luminous (see Figure 8 ), wherein both sides of the insulator 41 are provided with opaque shading surfaces, and the two shading surfaces are used to shield light, so that the light emitted by the lamp bead chip 3 can only be emitted through the two light-transmitting surfaces;

[0059] When the lamp bead covering portion 4 is multi-faceted (see Fig. 9 ), wherein the insulator 41 is made of a fully transparent insulating material or a frosted insulating material, and the light transmittance of the insulator 41 is utilized so that the light emitted by the lamp bead chip 3 can be emitted through multiple light-transmitting surfaces;

[0060] When the lamp bead covering portion 4 is back-emitting (see Fig.10 ), wherein the three sides of the insulator 41 are provided with opaque shading surfaces, and the three shading surfaces are used to shield light, so that the light emitted by the lamp bead chip 3 can only be emitted through the back light-transmitting surface;

[0061] Of course, the lamp bead covering portion 4 is not limited to the above-mentioned tetrahedron. When it is a polyhedron or a cylinder, the light-emitting effect and direction of the lamp bead chip 3 can also be controlled by processing and controlling the shading surface.

[0062] In this embodiment: the conductor 2 is at least two wires, and the two wires are connected to the power supply to supply power to the lamp bead chip 3, and a tension wire rope 15 and an optical fiber wire 13 are also placed inside the wire 1, and the wire 1 is a flat wire, a square wire, a round wire, a flat wire or a special-shaped wire.

[0063] Specifically, the conductor 2 is used in conjunction with the tin plate 12 to power the lamp bead chip 3, so that the lamp bead chip 3 can emit light normally, and the tension wire rope 15 can increase the tensile strength and structural strength of the light strip, and the optical fiber line 13 can guide light, so that the light strip has a more colorful lighting effect, and the use of flat wires, square wires, round wires, flat wires or special-shaped wires can be used as the conductors 1, so that the light strip can present different appearances, which is just suitable for different application scenarios and different people to choose.

[0064] In this embodiment, the adhesive portion 5 is a double-sided adhesive or glue fixed to the flat mounting and fixing surface of the conductor 1 , and a release paper 51 is bonded to the bottom of the double-sided adhesive or glue.

[0065] Specifically, the bonding structure of the adhesive portion 5 is formed by the double-sided tape or adhesive, so that the light strip can be quickly bonded to the installation object, and the release paper 51 can protect the double-sided tape or adhesive to prevent the double-sided tape or adhesive from adhering to foreign objects and affecting the installation when the light strip is not in use. At the same time, the lamp bead chip 3 of this type of light strip adopts a surface-mount lamp bead chip 3. After the light strip is cut horizontally and the conductor 2 is connected to the power supply, a single-segment light strip can also be used, further increasing the flexibility of use of this type of light strip.

[0066] A method for manufacturing a light strip, comprising the steps of:

[0067] S1, wire 1 processing, wherein the wire 1 can be selected as a finished wire according to processing needs, wherein the finished wire can be selected to have a tension wire rope 15 or an optical fiber line 13 inside according to usage requirements, and then the wire 1 is stripped on the surface of the finished wire by an automatic wire stripping machine to form an exposed portion 11. Of course, the wire 1 can also be directly processed into interval-arranged wire skins 14 on the outside of the conductor 2, the tension wire rope 15 and the optical fiber line 13 by an extruder or an injection molding machine as needed, and the exposed portion 11 is also formed at the intervals between adjacent wire skins 14; and the wire skin 14 can be an insulating sleeve that is hot-melted, ultrasonically, bonded or assembled on the outside of the conductor 2, the tension wire rope 15 and the optical fiber line 13, and the insulating sleeves are arranged at intervals, and the interval between two adjacent insulating sleeves also forms an exposed portion 11, so that the exposed portion 11 of the wire 1 can be flexibly processed.

[0068] S2, soldering the lamp bead chip 3 after tinning, wherein the tinning can be performed by an automatic tinning machine on the surface of the conductor 2 and processed into a tin plate 12, and then the lamp bead chip 3 is soldered on the tin plate 12 by an automatic placement machine to complete the installation of the lamp bead chip 3.

[0069] S3, processing the lamp bead covering part 4, wherein the lamp bead covering part 4 can also be processed in a similar way to the wire skin 14, and the insulator 41 is covered on the outside of the lamp bead chip 3 by dispensing, injection molding, hot melting, ultrasound, bonding or assembly, and then fixed with the conductor 2, tension wire rope 15, optical fiber line 13 and other wires, wherein the insulator 41 can be made of fully transparent, translucent and partially opaque insulating materials according to the needs of light emission, and the processed lamp bead covering part 4 is used to transmit light or block light from the lamp bead chip 3.

[0070] S4, process the adhesive part 5 and obtain the luminous light strip, wherein the adhesive part 5 can be made of adhesive coated on the flat mounting and fixing surface of the conductor 1 by a coating machine, or double-sided adhesive pasted on the flat mounting and fixing surface of the conductor 1 by a gluing machine, and then a release paper 51 is pasted on the bottom of the adhesive or double-sided adhesive by a pasting machine to complete the processing of the luminous light strip.

[0071] S5, quality inspection, cutting, winding and packaging of the light strips are carried out to facilitate the sale and transportation of the finished light strips.

[0072] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A light strip structure, characterized in that: It comprises a wire (1), the surface of which is formed with a plurality of exposed portions (11) by peeling; At least two conductors (2), the conductors (2) being built inside the wire (1), and a tin plate (12) being spot-welded at an exposed portion (11) on the surface of the conductor (2); A lamp bead chip (3), wherein the lamp bead chip (3) is soldered to the surface of the tin plate (12) and is in electrical conduction with the conductor (2), and the lamp bead chip (3) is a surface-mount lamp bead; A lamp bead covering portion (4) for transmitting or shielding light, wherein the lamp bead covering portion (4) covers the outer wall of the lamp bead chip (3) and fills the exposed portion (11), and light passes through the lamp bead covering portion (4) to produce single-sided, double-sided, multi-sided and back-side luminous effects of different colors; An adhesive portion (5), the adhesive portion (5) is fixedly connected to the planar mounting fixing surface of the conductor (1), and the adhesive portion (5) is a double-sided adhesive fixed to the planar mounting fixing surface of the conductor (1).

2. The light strip structure according to claim 1, characterized in that: A tension wire rope (15) and an optical fiber line (13) are also placed inside the conductor (1).

3. A method for manufacturing a light strip, comprising manufacturing the light strip according to any one of claims 1 to 2, characterized in that: The following steps are also included: S1, wire (1) processing; S2, soldering the lamp bead chip after tinning (3); S3, processing the lamp bead covering portion (4); S4, processing the pasting portion (5) and obtaining a light strip; S5, quality inspection, cutting, winding and packaging of the light strips.

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