Detection method for light-emitting diode packaging element

Abstract

The invention relates to a method for detecting a light-emitting diode packaging element, which comprises the following steps of: providing the light-emitting diode packaging element which comprises a light-emitting diode crystal grain, a bracket and a coating carrier; the light-emitting diode crystal grain is arranged on the support, the height of the support is larger than that of the light-emitting diode crystal grain, and the wrapping carrier wraps the light-emitting diode crystal grain and part of the support. Then, a part of the coating carrier is removed to expose the upper surface of the light emitting diode crystal grain.

Description

Technical Field

[0001] The present invention relates to a method for detecting a light emitting diode package component, and in particular to a method for detecting a cross section of a light emitting diode package component. Background Art

[0002] Light-emitting diodes are widely used in lighting, display and other fields due to their small size, long life, energy saving and high efficiency. Light-emitting diodes have a variety of packaging structures, among which the common plug-in light-emitting diodes (Lamp LED) have a variety of types such as 3 mm, 5 mm, round, concave, oval and square, which can be widely used in consumer products, home appliances, traffic signs, outdoor display screens and industrial equipment.

[0003] See also Figure 1 , which shows a common plug-in type LED package component. The basic components of such a plug-in type LED package component 1 include a LED die 10, a bracket 20 and a package carrier 30. The LED die 10 is fixed on the bracket 20, and the bracket 20 has two independent electrode terminals electrically connected to the anode and cathode of the LED die 10, respectively. The package carrier 30 covers the LED die 10 and a part of the bracket 20.

[0004] In order to effectively control the production quality of the above-mentioned light-emitting diode package components, it is necessary to perform failure analysis on the package components. One common analysis method is to perform cross-section cutting on the light-emitting diode package components by grinding and ion beam cutting, and cut to the light-emitting diode grains to form cross-sections between the components in the light-emitting diode package components. Through cross-section analysis, the undesirable conditions between the components in the above-mentioned package components and their possible causes are found, and then product improvement plans are proposed.

[0005] However, after the above-mentioned grinding and cutting of the LED packaging components, the components in the packaging components often separate from each other. Figure 2 As shown in the figure, cracks are clearly shown between the package carrier 30 and the bracket 20, between the silver glue 40 and the bracket 20, and between the silver glue 40 and the LED die 10. However, whether these cracks are caused by abnormalities in the manufacturing process of the LED package components or the above-mentioned grinding and cutting section detection process, the current detection method cannot clarify the cause of the cracks, which in turn affects the subsequent judgment of quality abnormalities.

[0006] To overcome the above problems, the industry urgently needs an innovative detection method to reduce unexpected cracks in packaging components caused by improper grinding and cutting, so as to truly determine the abnormal causes of the packaging component production process and reduce the impact of cracks caused by improper grinding and cutting during the detection process on abnormal judgment. Summary of the invention

[0007] The main purpose of the present invention is to provide an innovative method for detecting light-emitting diode packaging components, reduce unexpected cracks in the packaging components caused by improper grinding and cutting, reduce the impact of cracks caused by improper grinding and cutting during the detection process on abnormal judgment, and correctly determine the causes of abnormalities in the packaging component production process.

[0008] To achieve the above-mentioned purpose, the present invention provides a method for detecting a light-emitting diode package component, comprising: providing a light-emitting diode package component, wherein the light-emitting diode package component comprises a light-emitting diode die, a bracket and a coating carrier. The light-emitting diode die is arranged on the bracket, the height of the bracket is higher than the height of the light-emitting diode die, and the coating carrier covers the light-emitting diode die and a part of the bracket. Then, a part of the coating carrier is removed to expose the upper surface of the light-emitting diode die.

[0009] In one embodiment, the light emitting diode package component inspection method provided by the present invention further comprises removing a portion of the coating carrier on a side surface of the light emitting diode die.

[0010] In one embodiment, the method for inspecting a light emitting diode package component provided by the present invention further comprises polishing a light emitting diode die with an ion beam to form a cross section of the light emitting diode package component.

[0011] In one embodiment, the present invention provides a method for inspecting LED package components, wherein the step of removing a portion of the coating carrier to expose the upper surface of the LED die is to remove a portion of the coating carrier on the upper surface of the LED die by grinding with a grinding wheel.

[0012] In one embodiment, the present invention provides a method for inspecting a light emitting diode package, wherein the step of removing a portion of the coating carrier on one side of the light emitting diode die is to remove a portion of the coating carrier on one side of the light emitting diode die by grinding with a grinding wheel.

[0013] In one embodiment, the present invention provides a method for detecting a light emitting diode package component, wherein the light emitting diode package component further comprises a conductive adhesive for fixing the light emitting diode die on the bracket.

[0014] In one embodiment, the present invention provides a method for detecting a light emitting diode package component, wherein the light emitting diode die can be either a horizontal light emitting diode die or a vertical light emitting diode die.

[0015] After referring to the accompanying drawings and the embodiments described below, a person skilled in the art will be able to understand other objects, technical means and implementation schemes of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1The figure is a schematic diagram of the structure of an existing plug-in type light emitting diode packaging component.

[0017] Figure 2 This is a SEM photo of the actual cross section of an existing plug-in light-emitting diode package component after grinding and cutting.

[0018] Figure 3 It is a partial structural schematic diagram of a plug-in type light emitting diode package component to be detected in an embodiment of a detection method of the present invention.

[0019] Figure 4 It is a partial top perspective view of detecting a plug-in type light emitting diode package component in an embodiment of a detection method of the present invention.

[0020] Figure 5 This is a SEM photograph of the actual cross section of the packaged component after cutting in an embodiment of a detection method of the present invention.

[0021] Description of Reference Numerals

[0022] 1. Light-emitting diode package components

[0023] 10 LED Dies

[0024] 20 Bracket

[0025] 30 Packaging carrier

[0026] 40 Conductive adhesive

[0027] 100 LED package components

[0028] 110 LED Die

[0029] 120 Bracket

[0030] 122 Anode terminal

[0031] 124 cathode terminal

[0032] 130 Coating carrier

[0033] 140 Conductive adhesive. DETAILED DESCRIPTION

[0034] The present invention will be explained below by way of examples, and the examples of the present invention are not intended to limit the present invention to any specific environment, application or special method as described in the examples. Therefore, the description of the examples is only for the purpose of explaining the present invention, and is not intended to limit the present invention. It should be noted that in the following examples and drawings, elements that are not directly related to the present invention have been omitted and are not shown, and the dimensional relationship between the elements in the drawings is only for easy understanding, and is not intended to limit the actual proportion.

[0035] See also Figure 3 As shown in FIG. 1 , it is a partial structural schematic diagram of a plug-in type light-emitting diode package component to be detected in an embodiment of a detection method of the present invention. The plug-in type light-emitting diode package component 100 shown in the figure is the same as the existing common light-emitting diode package structure, and its basic composition includes a light-emitting diode chip 110, a bracket 120, a coating carrier 130 and a conductive adhesive 140. Among them, the light-emitting diode chip 110 can be one of the common horizontal light-emitting diode chips or vertical light-emitting diode chips. In the embodiment shown in the present invention, the light-emitting diode chip 110 uses a vertical structure. In addition, the bracket 120 has two independent electrode ends, namely, the anode end 122 and the cathode end 124. Among them, the upper half of the cathode end 124 has a concave cup structure that is wide at the top and narrow at the bottom, and the heights of the anode end 122 and the cathode end 124 of the bracket 120 are both higher than the height of the light-emitting diode chip 110, so as to accommodate the light-emitting diode chip 110. The LED die 110 is fixed to one end surface of the cathode terminal 124 by a conductive adhesive 140, such as silver adhesive, and is electrically connected thereto. Specifically, the anode terminal 122 of the support 120 is electrically connected to the upper electrode of the LED die 110, and the cathode terminal 124 of the support 120 is electrically connected to the lower electrode on the back of the LED die 110. The encapsulating carrier 130 encapsulates the entire LED die 110, the conductive adhesive 140 and a portion of the support 120, and the encapsulating carrier may be epoxy resin.

[0036] The present invention uses the finite element method to analyze and explore the stress distribution between the LED crystal, conductive glue, bracket and coating carrier in the existing LED packaging structure. It can be found that the bottom of the LED crystal will be the place with the greatest stress. If the existing detection method is used to grind and cut directly with a cross-section polisher, the improper stress transmission to the packaging structure will cause the coating carrier to expand, squeeze the LED crystal and lift it up, thereby causing unexpected separation between the coating carrier and the bracket, between the conductive glue and the bracket, and between the conductive glue and the chip. In view of this, the present invention proposes an innovative detection method to reduce unexpected cracks caused by improper stress transmission during grinding and cutting.

[0037] Please continue reading Figure 3 In order to reduce the stress that is improperly transmitted to the inside of the packaging structure during grinding and cutting, the detection method of the present invention performs grinding and cutting in a segmented manner. Specifically, first, a portion of the coating carrier 130 of the upper half of the packaging component 100 is removed by grinding with a grinding wheel from the top of the light-emitting diode packaging component 100, for example, a portion of the coating carrier 130 on the upper surface of the light-emitting diode die 110 is removed until the upper surface of the light-emitting diode die 110 is exposed. Figure 3As shown, the line segment A-A' of the cross section is used as the top grinding cut-off line of the first stage of grinding, so that no coating carrier remains on the upper surface of the LED die 110. In a preferred embodiment, the first stage of grinding can be further divided into two stages. First, a coarse grinding wheel is used to grind and remove the portion of the coating carrier 130 from the top of the LED package element 100 to the outside of the bracket 120. Then, a fine grinding wheel is used to grind and remove the portion of the coating carrier 130 between the bracket 120 and the LED die 110 until the upper surface of the LED die 110 is exposed.

[0038] Secondly, please refer to Figure 4 , the figure shows a partial top perspective view of the light emitting diode die 110, the bracket 120 and the coating carrier 130 in the light emitting diode package component 100. It should be noted that, Figure 4 The outlines and size ratios of the components shown are for illustrative purposes only and are not the actual outlines or sizes of the package components. In a preferred embodiment, after removing a portion of the coating carrier 130 on the top of the LED package component 100, a grinder is used to grind the side of the LED package component 100 to remove a portion of the coating carrier 130 on one side of the LED die 110. Figure 4 As shown, the line segment BB′ of the cross section is used as the side grinding cutoff line of the second grinding stage. It should be noted that this grinding stage only needs to grind to the side of the LED die 110 and does not need to expose the side of the LED die 110 .

[0039] Next, the third stage of grinding and cutting is performed. In this stage, a profile grinder can be used to grind and cut the light emitting diode package component 100 with an ion beam. Figure 4 As shown, the package component 100 is continuously polished by the ion beam from the cross-sectional line segment BB' until the cross-sectional line segment CC' is formed to form the cross section of the light-emitting diode package component. Figure 5 , which shows an actual cross-sectional SEM (scanning electron microscope) photograph of a light emitting diode package component after using the light emitting diode package component detection method of the present invention.

[0040] like Figure 5As shown, since the entire profile grinding process has been divided into several different grinding and cutting stages, the stress generated during the grinding and cutting process can be effectively released in stages without being transmitted to the components in the packaging structure, and the impact on the LED grain and other components can be substantially reduced. In particular, in the first stage, the coating carrier between the top of the packaging component and the surface of the grain has been largely removed. In the subsequent grinding and cutting process, the stress caused by the grinding and cutting will no longer substantially affect the strength of the components in the packaging component at this stage. Therefore, the LED grain 110, the bracket 120, the coating carrier 130 and the conductive adhesive 140 in the LED packaging component 100 can still maintain the integrity of the original good structure, and the separation phenomenon of the unexpected cracks between the above components will not occur, so that the subsequent product abnormality analysis and judgment can find the correct cause of the process abnormality, and the detection method can be more accurate.

[0041] The above embodiments are only used to illustrate the embodiments of the present invention and to explain the technical features of the present invention, and are not used to limit the protection scope of the present invention. Any changes or equivalent arrangements that can be easily completed by a person skilled in the art belong to the scope claimed by the present invention, and the scope of protection of the present invention shall be subject to the attached claims.

Claims

1. A method for detecting a light emitting diode package component, comprising: A light-emitting diode package component is provided, wherein the light-emitting diode package component comprises a light-emitting diode die, a bracket and a coating carrier, the light-emitting diode die is arranged on the bracket and the height of the bracket is higher than the height of the light-emitting diode die, and the coating carrier covers the light-emitting diode die and a part of the bracket; and A portion of the encapsulating carrier is removed to expose the upper surface of the light emitting diode die. 2 . The method for inspecting a light emitting diode package component as claimed in claim 1 , further comprising removing a portion of the coating carrier from a side surface of the light emitting diode die. 3 . The method for inspecting a light emitting diode package component as claimed in claim 2 , further comprising polishing the light emitting diode die by ion beam to form a cross section of the light emitting diode package component. 4 . The method for inspecting a light emitting diode package component as claimed in claim 1 , wherein the step of removing a portion of the coating carrier to expose the upper surface of the light emitting diode die is to remove a portion of the coating carrier on the upper surface of the light emitting diode die by grinding with a grinding wheel. 5 . The method for inspecting a light emitting diode package component as claimed in claim 2 , wherein the step of removing a portion of the coating carrier on a side surface of the light emitting diode die is to remove a portion of the coating carrier on a side surface of the light emitting diode die by grinding with a grinding wheel. 6 . The method for inspecting a light emitting diode package component as claimed in claim 1 , wherein the light emitting diode package component further comprises a conductive adhesive for fixing the light emitting diode die on the bracket. 7 . The method for inspecting a light emitting diode package component as claimed in claim 1 , wherein the light emitting diode die can be one of a horizontal light emitting diode die and a vertical light emitting diode die.

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