VSP reflected wave coverage frequency calculation method and device, storage medium and equipment

Abstract

The invention provides a VSP reflected wave coverage frequency calculation method and device, a storage medium and equipment, and belongs to the field of in-well seismic exploration. The method comprises the following steps: creating a surface element grid according to input parameters, calculating a reflection point position of each shot point at each horizon, and mapping the reflection point position to the surface element grid to obtain the number of coverage times. Practical tests show that the method provided by the invention not only has fast calculation efficiency, but also has calculation precision equivalent to that of a ray tracing method.

Description

Technical Field

[0001] The present invention belongs to the field of borehole seismic exploration, and in particular relates to a method, a device, a storage medium and equipment for calculating the number of times of VSP reflection wave coverage. Background Art

[0002] Vertical seismic profile (VSP) in wells has the characteristics of high signal-to-noise ratio, high resolution and well-ground bridge due to its reception in the well, and has important applications in the field of seismic exploration.

[0003] VSP acquisition design is the premise to ensure the exploration effect, and the calculation of coverage times is a key step in acquisition design. Existing technologies mainly calculate the reflection point position through ray tracing or uniform medium model calculation formula, and then calculate the coverage times. Among them, ray tracing is a high-precision calculation method that fully considers the velocity change of the medium. However, this method uses a certain strategy or rule to continuously adjust the ray path and gradually approach the real ray path, so the calculation efficiency is low, especially in large models or with many shot check points.

[0004] Therefore, the problem that needs to be solved urgently is to find a method for calculating the reflection wave coverage times with high precision and computational efficiency. Summary of the invention

[0005] The purpose of the present invention is to solve the above-mentioned difficulties existing in the prior art and to provide a method, device, storage medium and equipment for calculating the coverage times of VSP reflection waves, which solve the problems of low ray tracing efficiency and large uniform medium error when calculating the coverage times in the existing VSP acquisition and observation system.

[0006] One of the objectives of the present invention is to provide a method for calculating the number of VSP reflection wave coverage times.

[0007] A second object of the present invention is to provide a VSP reflection wave coverage times calculation device.

[0008] A third object of the present invention is to provide a computer-readable storage medium.

[0009] A fourth object of the present invention is to provide a computer device.

[0010] The present invention is achieved through the following technical solutions:

[0011] The first aspect of the present invention provides a method for calculating the coverage times of VSP reflection waves, which creates a bin grid according to input parameters, calculates the reflection point position of each shot check point in each layer and maps it to the bin grid to obtain the coverage times.

[0012] A further improvement of the present invention is:

[0013] The method comprises the following steps:

[0014] Step 1: Input parameters;

[0015] Step 2: Create a facet mesh;

[0016] The third step is to calculate the reflection point position of each shot check point in each layer and map it to the surface element grid to obtain the coverage number of the reflection wave.

[0017] A further improvement of the present invention is:

[0018] The input parameters in the first step specifically include:

[0019] Input model parameters (h i ,v i ), i = 1, 2...I, I is the number of model layers, h i represents the layer depth of the reflected wave in layer i, v i represents the layer velocity of the reflected wave in layer i;

[0020] Enter the positions of all excitation points involved in the calculation (x sm ,h sm ), where m = 1, 2...M; receiving point position (x gn ,h gn ), where n = 1, 2...N; M and N are the number of excitation points and receiving points respectively; x represents the coordinate in the horizontal direction, and h represents the coordinate in the depth direction;

[0021] Enter the horizontal size of the bin grid d x and d h ; where d x d h Represent the horizontal width and vertical height of the panel grid respectively.

[0022] A further improvement of the present invention is:

[0023] In the second step, a facet mesh is created, and the specific operations include:

[0024] Calculate the horizontal extent x of the bin grid max =x sM -x g1 , vertical range h max =h I -h1; where x g1 Indicates the x-coordinate of the first detection point, x sM represents the x-coordinate of the last excitation point, where h I is the depth of the last layer of the model, and h1 is the depth of the first layer of the model;

[0025] Calculate the number of horizontal surface element grids K = x max / d x , and the number of vertical surface elements L = h max / d h ;

[0026] Set the horizontal extent of the bin grid to x max Divide into K equal facets and number them b xk , k = 1, 2 ... K; the vertical range of the surface element grid h max Divide into L equal facets and number them b hl , l=1,2……L;

[0027] Each surface element grid (b xk ,b hl )’s initial value of coverage times is set to 0.

[0028] A further improvement of the present invention is:

[0029] In the third step, the reflection point position of each shot check point in each layer is calculated and mapped to the bin grid to obtain the coverage times of the reflection wave. The specific operations include:

[0030] Step 1, take the first excitation point (x s1 ,h s1 ), from the excitation point depth h s1 From the layer to the depth h of the first vertical face element r1 The layer where the transmission wave is located is calculated, and the vertical propagation distance s of each layer is calculated. si , where i = 1, 2...N, N is the number of layers that the reflected wave passes through;

[0031] Step 2: Calculate the vertical travel time t of each layer layer by layer si =s si / v i , where i = 1, 2...N, N is the number of layers the reflected wave passes through, v i represents the layer velocity of the reflected wave in layer i;

[0032] Step 3: Calculate the vertical incidence time t from the first excitation point to the first vertical plane depth 0sr :

[0033]

[0034] Step 4: Calculate the RMS velocity v from the first excitation point to the first vertical plane depth sr :

[0035]

[0036] Step 5, take the first receiving point (x g1 ,h g1 ), from the receiving point depth hg1 From the layer to the depth h of the first vertical face element r1 The layer where the reflected wave is located is calculated by calculating the vertical propagation distance S of each layer. gi , where i = 1, 2...N, N is the number of layers that the reflected wave passes through;

[0037] Step 6: Calculate the vertical travel time of each layer layer by layer Where i = 1, 2...N, N is the number of layers the reflected wave passes through, v i represents the layer velocity of the reflected wave in layer i;

[0038] Step 7, calculate the vertical incidence time t from the first receiving point to the first vertical bin depth 0gr :

[0039]

[0040] Step 8: The root mean square velocity v from the first receiving point to the first vertical bin depth gr :

[0041]

[0042] Step 9, calculate the first excitation point (x s1 ,h s1 ) to the first receiving point (x gn ,h gn ) is the reflection point position at the first vertical bin depth where x s and x g denote the x-coordinates of the excitation point and the receiving point respectively;

[0043] Step 10: Set the reflection point position x r Mapping to the panel grid (b xk ,b h1 ), and add 1 to the number of covers, where k = x r / d x .

[0044] A further improvement of the present invention is:

[0045] The third step also includes step 11:

[0046] According to steps 1 to 10, traverse the depth of all vertical surface element grids and calculate the first excitation point (x s1 ,h s1 ) to the first receiving point (x gn ,h gn ) maps the locations at all vertical bin grid depths and updates the corresponding coverage counts.

[0047] A further improvement of the present invention is:

[0048] The third step further comprises step 12:

[0049] According to steps 1 to 11, traverse all the excitation points and receiving points, calculate the bin mapping positions from all excitation points to all receiving points at all bin depths, and update the number of coverages.

[0050] The final coverage times are the calculated coverage times of the reflected waves.

[0051] A second aspect of the present invention provides a VSP reflection wave coverage number calculation device, comprising:

[0052] Input unit, used to input parameters;

[0053] A panel mesh creation unit, used for creating a panel mesh;

[0054] The acquisition unit is used to calculate the reflection point position of each shot check point in each layer, and map it to the surface element grid to obtain the coverage number of the reflection wave.

[0055] According to a third aspect of the present invention, a computer-readable medium is provided, wherein the computer-readable storage medium stores at least one computer-executable program, and when the at least one program is executed by the computer, the computer executes the steps in the method for calculating the number of VSP reflection wave coverage as described above.

[0056] A fourth aspect of the present invention provides a computer device, comprising a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the method for calculating the number of VSP reflection wave coverage as described above.

[0057] Compared with the prior art, the present invention has the following beneficial effects:

[0058] Practical tests have shown that the method of the present invention has both fast calculation efficiency and calculation accuracy comparable to that of the ray tracing method. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 is a flow chart of a method for calculating the number of VSP reflection wave coverages in an embodiment of the present invention;

[0060] Figure 2 It is a schematic diagram of the method of the present invention;

[0061] Figure 3 is a distribution diagram of reflection point positions calculated using the method of the present invention in an embodiment;

[0062] Figure 4It is the distribution map of reflection point positions calculated by ray tracing method. DETAILED DESCRIPTION

[0063] The present invention is further described in detail below in conjunction with the accompanying drawings:

[0064] In the vertical seismic profile (VSP) exploration in a well, when designing a reflection wave observation system, the coverage number is a key parameter for evaluating the observation system. Generally, the positions of shot points and receiving points are designed, the reflection point positions of underground media are simulated and calculated, and then the coverage times of different strata are counted. In practical applications, the ray tracing method is used to calculate the reflection point positions and count the coverage times, but the calculation efficiency is low. The present invention proposes a VSP reflection wave coverage number calculation method, which has both fast calculation efficiency and high calculation accuracy.

[0065] The present invention provides a method for calculating the coverage times of VSP reflection waves, which creates a bin grid according to input parameters, calculates the reflection point position of each shot check point in each layer and maps it to the bin grid, thereby obtaining the coverage times.

[0066] The embodiments of the method of the present invention are as follows:

[0067] [Example 1]

[0068] like Figure 1 and Figure 2 As shown, the method comprises the following steps:

[0069] Step 1: Input parameters;

[0070] The input parameters specifically include:

[0071] Input model parameters (h i ,v i ), i = 1, 2...I, I is the number of model layers, h i represents the layer depth of the reflected wave in layer i, v i represents the layer velocity of the reflected wave in layer i;

[0072] Enter the positions of all excitation points involved in the calculation (x sm ,h sm ), where m = 1, 2...M; receiving point position (x gn ,h gn ), where n = 1, 2...N; M and N are the number of excitation points and receiving points respectively; x represents the coordinate in the horizontal direction, and h represents the coordinate in the depth direction;

[0073] Enter the horizontal size of the bin grid d x and d h ; where d x d hRepresent the horizontal width and vertical height of the panel grid respectively.

[0074] Step 2: Create a facet mesh;

[0075] The specific operation of creating the facet grid includes:

[0076] Calculate the horizontal extent x of the bin grid max =x sM -x g1 , vertical range h max =h I -h1; where x g1 Indicates the x-coordinate of the first detection point, x sM represents the x-coordinate of the Mth (last) excitation point, where h I is the depth of the last layer of the model, and h1 is the depth of the first layer of the model;

[0077] Calculate the number of horizontal surface element grids K = x max / d x , and the number of vertical surface elements L = h max / d h ;

[0078] Set the horizontal extent of the bin grid to x max Divide into K equal facets and number them b xk ,k=1,2,…K;the vertical range of the facet grid h max Divide into L equal facets and number them b hl , l=1,2……L;

[0079] Each surface element grid (b xk ,b hl )’s initial value of coverage times is set to 0.

[0080] Step 3: Calculate the reflection point position of each shot check point in each layer and map it to the bin grid to obtain the coverage number of the reflection wave;

[0081] Specific operations include:

[0082] (1) Take the first excitation point (x s1 ,h s1 ), from the excitation point depth h s1 From the layer to the depth h of the first vertical face element r1 The layer where the transmission wave is located is calculated, and the vertical propagation distance s of each layer is calculated. si , where i = 1, 2...N, N is the number of layers that the reflected wave passes through;

[0083] (2) Calculate the vertical travel time t of each layer layer by layer si =s si / vi , where i = 1, 2...N, N is the number of layers the reflected wave passes through, v i represents the layer velocity of the reflected wave in layer i;

[0084] (3) Calculate the vertical incidence time t from the first excitation point to the first vertical plane depth 0sr :

[0085]

[0086] (4) Calculate the root mean square velocity v from the first excitation point to the first vertical surface element depth sr :

[0087]

[0088] (5) Take the first receiving point (x g1 ,h g1 ), from the receiving point depth h g1 From the layer to the depth h of the first vertical face element r1 The layer where the reflected wave is located is calculated by calculating the vertical propagation distance S of each layer. gi , where i = 1, 2...N, N is the number of layers that the reflected wave passes through;

[0089] (6) Calculate the vertical travel time of each layer layer by layer Where i = 1, 2...N, N is the number of layers the reflected wave passes through, v i represents the layer velocity of the reflected wave in layer i;

[0090] (7) Calculate the vertical incidence time t from the first receiving point to the first vertical bin depth 0gr :

[0091]

[0092] (8) Calculate the root mean square velocity v from the first receiving point to the first vertical surface element depth gr :

[0093]

[0094] (9) Calculate the first excitation point (x s1 ,h s1 ) to the first receiving point (x gn ,h gn ) is the reflection point position at the first vertical bin depth

[0095] x s and x g denote the x-coordinates of the excitation point and the receiving point respectively;

[0096] (10) The reflection point position x r Mapping to the panel grid (b xk ,b h1 ), and add 1 to the number of covers, where k = x r / d x ;

[0097] (11) According to steps (1) to (10), traverse the depth of all vertical surface element grids and calculate the first excitation point (x s1 ,h s1 ) to the first receiving point (x gn ,h gn ) The mapping position at all vertical bin grid depths and the corresponding coverage number are updated; the coverage number is increased by 1 for each mapping;

[0098] (12) According to steps (1) to (11), traverse all the excitation points and receiving points, calculate the bin mapping positions from all the excitation points to all the receiving points at all bin depths, and update the coverage times.

[0099] The final coverage times are the calculated coverage times of the reflected waves.

[0100] Step 4: Output the coverage frequency profile;

[0101] Specifically, the calculation results of the third step are plotted into a graph, specifically the surface element grid mapped in the third step (b xk ,b hl ), with b xk The horizontal coordinate x value is the horizontal coordinate, b hl The vertical coordinate h value is the ordinate and is plotted in a graph. The depth of the color represents the number of times the position is covered.

[0102] Table 1 shows the model parameters of the embodiment, including layer depth and layer velocity.

[0103] Table 1

[0104] Serial number 1 2 3 4 5 6 7 8 9 10 11 Layer depth (m) 0 1982 3260 3845 4445 6225 7420 8110 9210 10127 10950 P-wave velocity (m / s) 1953 1953 2819 3803 4203 4604 4806 5770 6453 6714 5789

[0105] In the embodiment model, the surface element grid d x and d h are all 10 meters, the excitation point depth is fixed at 0 meters, and the position x s From 0 to 4000 meters (increments of 10 meters), the receiving point position x g Fixed at 0 m, depth h g The coverage profile of the change from 6000 to 7500 meters (increments of 10 meters) is shown in Figure 1. Figure 3 and Figure 4It can be seen that the distribution of coverage times calculated by the method of the present invention and the ray tracing method is highly consistent, indicating that the method of the present invention is comparable to the ray tracing method in terms of accuracy. Since the method uses an analytical formula to directly calculate the reflection point position instead of continuously trying to approximate the reflection point position through the ray method, the calculation efficiency of the method is more than 10 times faster than that of the ray tracing method, indicating that the calculation efficiency of the method of the present invention is higher.

[0106] [Example 2]

[0107] A second aspect of the present invention provides a VSP reflection wave coverage number calculation device, comprising:

[0108] Input unit, used to input parameters, including:

[0109] Input model parameters (h i ,v i ), i = 1, 2...I, I is the number of model layers, h i represents the layer depth of the reflected wave in layer i, v i represents the layer velocity of the reflected wave in layer i;

[0110] Enter the positions of all excitation points involved in the calculation (x sm ,h sm ), where m = 1, 2...M; receiving point position (x gn ,h gn ), where n = 1, 2...N; M and N are the number of excitation points and receiving points respectively; x represents the coordinate in the horizontal direction, and h represents the coordinate in the depth direction;

[0111] Enter the horizontal size of the bin grid d x and d h ; where d x d h Represent the horizontal width and vertical height of the panel grid respectively.

[0112] The surface element mesh creation unit is used to create the surface element mesh. The specific operations include:

[0113] Calculate the horizontal extent x of the bin grid max =x sM -x g1 , vertical range h max =h I -h1; where x g1 Indicates the x-coordinate of the first detection point, x sM represents the x-coordinate of the Mth (last) excitation point, where h I is the depth of the last layer of the model, and h1 is the depth of the first layer of the model;

[0114] Calculate the number of horizontal surface element grids K = xmax / d x , and the number of vertical surface elements L = h max / d h ;

[0115] Set the horizontal extent of the bin grid to x max Divide into K equal facets and number them b xk , k = 1, 2 ... K; the vertical range of the surface element grid h max Divide into L equal facets and number them b hl , l=1,2……L;

[0116] Each surface element grid (b xk ,b hl )’s initial value of coverage times is set to 0.

[0117] The acquisition unit is used to calculate the reflection point position of each shot check point in each layer, and map it to the bin grid to obtain the coverage number of the reflection wave; the specific operations include:

[0118] (1) Take the first excitation point (x s1 ,h s1 ), from the excitation point depth h s1 From the layer to the depth h of the first vertical face element r1 The layer where the transmission wave is located is calculated, and the vertical propagation distance s of each layer is calculated. si , where i = 1, 2...N, N is the number of layers that the reflected wave passes through;

[0119] (2) Calculate the vertical travel time t of each layer layer by layer si =s si / v i , where i = 1, 2...N, N is the number of layers the reflected wave passes through, v i represents the layer velocity of the reflected wave in layer i;

[0120] (3) Calculate the vertical incidence time t from the first excitation point to the first vertical plane depth 0sr :

[0121]

[0122] (4) Calculate the root mean square velocity v from the first excitation point to the first vertical surface element depth sr :

[0123]

[0124] (5) Take the first receiving point (x g1 ,h g1 ), from the receiving point depth h g1From the layer to the depth h of the first vertical face element r1 The layer where the reflected wave is located is calculated by calculating the vertical propagation distance S of each layer. gi , where i = 1, 2...N, N is the number of layers that the reflected wave passes through;

[0125] (6) Calculate the vertical travel time of each layer layer by layer Where i = 1, 2...N, N is the number of layers the reflected wave passes through, v i represents the layer velocity of the reflected wave in layer i;

[0126] (7) Calculate the vertical incidence time t from the first receiving point to the first vertical bin depth 0gr :

[0127]

[0128] (8) Calculate the root mean square velocity v from the first receiving point to the first vertical surface element depth gr :

[0129]

[0130] (9) Calculate the first excitation point (x s1 ,h s1 ) to the first receiving point (x gn ,h gn ) is the reflection point position at the first vertical bin depth

[0131] x s and x g denote the x-coordinates of the excitation point and the receiving point respectively;

[0132] (10) The reflection point position x r Mapping to the panel grid (b xk ,b h1 ), and add 1 to the number of covers, where k = x r / d x ;

[0133] (11) According to steps (1) to (10), traverse the depth of all vertical surface element grids and calculate the first excitation point (x s1 ,h s1 ) to the first receiving point (x gn ,h gn ) The mapping position at all vertical bin grid depths and the corresponding coverage number are updated; the coverage number is increased by 1 for each mapping;

[0134] (12) According to steps (1) to (11), traverse all the excitation points and receiving points, calculate the bin mapping positions from all the excitation points to all the receiving points at all bin depths, and update the coverage times.

[0135] The final coverage times are the calculated coverage times of the reflected waves.

[0136] The device also includes an output unit for outputting a coverage frequency profile, specifically:

[0137] The calculation results of the acquisition unit are plotted as a graph, specifically on the surface element grid (b xk ,b hl ), with b xk The horizontal coordinate x value is the horizontal coordinate, b hl The vertical coordinate h value is the ordinate and is plotted in a graph. The depth of the color represents the number of times the position is covered.

[0138] [Example 3]

[0139] An embodiment of the present invention provides a computer-readable medium, wherein the computer-readable storage medium stores at least one program executable by a computer, and when the at least one program is executed by the computer, the computer executes the steps in the method for calculating the number of VSP reflected wave coverage as described above.

[0140] [Example 4]

[0141] An embodiment of the present invention provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the method for calculating the number of VSP reflected wave coverage as described above.

[0142] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0143] The above technical solution is only one implementation mode of the present invention. For those skilled in the art, it is easy to make various types of improvements or modifications based on the principles disclosed in the present invention, and it is not limited to the technical solution described in the above specific embodiments of the present invention. Therefore, the above description is only preferred and does not have a restrictive meaning.

Claims

1. A method for calculating the number of VSP reflection wave coverages, characterized in that: A bin grid is created according to the input parameters, and the reflection point position of each shot check point in each layer is calculated and mapped to the bin grid, so as to obtain the coverage number.

2. The method for calculating the number of VSP reflected wave coverage times according to claim 1, characterized in that: The method comprises the following steps: Step 1: Input parameters; Step 2: Create a facet mesh; The third step is to calculate the reflection point position of each shot check point in each layer and map it to the surface element grid to obtain the coverage number of the reflection wave.

3. The method for calculating the number of VSP reflected wave coverage times according to claim 2, characterized in that: The input parameters in the first step specifically include: Input model parameters (h i ,v i ), i = 1, 2...I, I is the number of model layers, h i represents the layer depth of the reflected wave in layer i, v i represents the layer velocity of the reflected wave in layer i; Enter the positions of all excitation points involved in the calculation (x sm ,h sm ), where m = 1, 2...M; receiving point position (x gn ,h gn ), where n = 1, 2...N; M and N are the number of excitation points and receiving points respectively; x represents the coordinate in the horizontal direction, and h represents the coordinate in the depth direction; Enter the horizontal size of the bin grid d x and d h ; where d x d h Represent the horizontal width and vertical height of the panel grid respectively.

4. The method for calculating the number of VSP reflected wave coverage times according to claim 3, characterized in that: In the second step, a facet mesh is created, and the specific operations include: Calculate the horizontal extent x of the bin grid max =x sM -x g1 , vertical range h max =h I -h1; where x g1 Indicates the x-coordinate of the first detection point, x sM represents the x-coordinate of the last excitation point, where h I is the depth of the last layer of the model, and h1 is the depth of the first layer of the model; Calculate the number of horizontal surface element grids K = x max / d x , and the number of vertical surface elements L = h max / d h ; Set the horizontal extent of the bin grid to x max Divide into K equal facets and number them b xk , k = 1, 2 ... K; the vertical range of the surface element grid h max Divide into L equal facets and number them b hl , l=1,2……L; Each surface element grid (b xk ,b hl )’s initial value of coverage times is set to 0.

5. The method for calculating the number of VSP reflected wave coverages according to claim 4, characterized in that: In the third step, the reflection point position of each shot check point in each layer is calculated and mapped to the bin grid to obtain the coverage times of the reflection wave. The specific operations include: Step 1, take the first excitation point (x s1 ,h s1 ), from the excitation point depth h s1 From the layer to the depth h of the first vertical face element r1 The layer where the transmission wave is located is calculated, and the vertical propagation distance s of the transmission wave through each layer is calculated. si , where i = 1, 2...N, N is the number of layers that the reflected wave passes through; Step 2: Calculate the vertical travel time t of each layer layer by layer si =s si / v i , where i = 1, 2...N, N is the number of layers the reflected wave passes through, v i represents the layer velocity of the reflected wave in layer i; Step 3: Calculate the vertical incidence time t from the first excitation point to the first vertical plane depth 0sr : Step 4: Calculate the RMS velocity v from the first excitation point to the first vertical plane depth sr : Step 5, take the first receiving point (x g1 ,h g1 ), from the receiving point depth h g1 From the layer to the depth h of the first vertical face element r1 The layer where the reflected wave is located is calculated by calculating the vertical propagation distance S of each layer. gi , where i = 1, 2...N, N is the number of layers that the reflected wave passes through; Step 6: Calculate the vertical travel time t of each layer layer by layer gi =s gi / v i , where i = 1, 2...N, N is the number of layers the reflected wave passes through, v i represents the layer velocity of the reflected wave in layer i; Step 7, calculate the vertical incidence time t from the first receiving point to the first vertical bin depth 0gr : Step 8: The root mean square velocity v from the first receiving point to the first vertical bin depth gr : Step 9, calculate the first excitation point (x s1 ,h s1 ) to the first receiving point (x gn ,h gn ) is the reflection point position at the first vertical bin depth where x s and x g denote the x-coordinates of the excitation point and the receiving point respectively; Step 10: Set the reflection point position x r Mapping to the panel grid (b xk ,b h1 ), and add 1 to the number of covers, where k = x r / d x .

6. The method for calculating the number of VSP reflected wave coverages according to claim 5, characterized in that: The third step also includes step 11: According to steps 1 to 10, traverse the depth of all vertical surface element grids and calculate the first excitation point (x s1 ,h s1 ) to the first receiving point (x gn ,h gn ) maps the locations at all vertical bin grid depths and updates the corresponding coverage counts.

7. The method for calculating the number of VSP reflected wave coverage times according to claim 6, characterized in that: The third step further comprises step 12: According to steps 1 to 11, traverse all the excitation points and receiving points, calculate the bin mapping positions from all excitation points to all receiving points at all bin depths, and update the number of coverages. The final coverage times are the calculated coverage times of the reflected waves.

8. A VSP reflection wave coverage number calculation device, characterized in that: include: Input unit, used to input parameters; A facet mesh creation unit, used for creating a facet mesh; The acquisition unit is used to calculate the reflection point position of each shot check point in each layer, and map it to the surface element grid to obtain the coverage number of the reflection wave.

9. A computer-readable medium, characterized in that The computer-readable storage medium stores at least one computer-executable program, and when the at least one program is executed by the computer, the computer executes the steps in the method for calculating the number of VSP reflected wave coverages according to any one of claims 1 to 7.

10. A computer device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the method for calculating the number of VSP reflected wave coverage times according to any one of claims 1 to 7.

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