Simulation model testing method and device and electronic equipment

Abstract

The invention provides a test method and device of a simulation model and electronic equipment, and can be applied to the technical field of machinery and the technical field of simulation test. The test method of the simulation model comprises the steps that a to-be-tested simulation model is obtained, the to-be-tested simulation model is used for simulating the state change generated by the package of a target object under the action of external force impact, and the to-be-tested simulation model comprises an impact simulation body and a package simulation body; performing first finite element calculation on the structure of the packaging simulation body according to the simulation parameter set to obtain a first stress-strain relation of the packaging simulation body in a static compression process; the first stress-strain relation is converted according to packaging simulation parameters of the packaging simulation body, a second stress-strain relation of the packaging simulation body in the dynamic compression process is obtained, and the simulation parameter set comprises the packaging simulation parameters; and performing second finite element calculation on the structure of the package simulation body by using the second stress-strain relationship to obtain a motion state test result of the package simulation body in the dynamic compression process.

Description

Technical Field

[0001] The present application relates to the fields of mechanical technology and simulation test technology, and more specifically to a testing method, device and electronic equipment for a simulation model. Background Art

[0002] In order to prevent objects from being accidentally impacted or dropped during transportation, which may damage their appearance or functions, they are protected by packaging with cushioning functions.

[0003] In order to reduce transportation loss costs, impact or drop tests are usually performed on the packaging of objects for reference by designers. However, the test cost of the experiment is high, the measured result data is small, and it is difficult to provide accurate test results to designers. Summary of the invention

[0004] In view of the above problems, the present application provides a testing method, device and electronic equipment for a simulation model.

[0005] According to the first aspect of the present application, a testing method for a simulation model is provided, comprising: obtaining a simulation model to be tested, the simulation model to be tested is used to simulate the state changes of the packaging of the target item under the action of an external force impact, the simulation model to be tested includes an impact simulation body and a packaging simulation body; performing a first finite element calculation on the structure of the packaging simulation body according to a simulation parameter set of the simulation model to be tested, and obtaining a first stress-strain relationship of the packaging simulation body during static compression, the first stress-strain relationship characterizing the relationship between the static stress suffered by the packaging simulation body and a first deformation of the packaging simulation body; converting the first stress-strain relationship according to packaging simulation parameters of the packaging simulation body, and obtaining a second stress-strain relationship of the packaging simulation body during dynamic compression, the simulation parameter set includes packaging simulation parameters, and the second stress-strain relationship characterizing the relationship between the dynamic stress suffered by the packaging simulation body and a second deformation of the packaging simulation body; performing a second finite element calculation on the structure of the packaging simulation body using the second stress-strain relationship, and obtaining a test result of the motion state of the packaging simulation body during dynamic compression.

[0006] The second aspect of the present application provides a testing device for a simulation model, comprising: an acquisition module, used to acquire a simulation model to be tested, the simulation model to be tested is used to simulate the state change of the packaging of the target article under the action of an external force impact, and the simulation model to be tested includes an impact simulation body and a packaging simulation body; a first finite element calculation module, used to perform a first finite element calculation on the structure of the packaging simulation body according to a simulation parameter set of the simulation model to be tested, and obtain a first stress-strain relationship of the packaging simulation body during a static compression process, the first stress-strain relationship characterizing the relationship between the static stress suffered by the packaging simulation body and a first deformation of the packaging simulation body; a conversion module, used to convert the first stress-strain relationship according to packaging simulation parameters of the packaging simulation body, and obtain a second stress-strain relationship of the packaging simulation body during a dynamic compression process, the simulation parameter set includes packaging simulation parameters, and the second stress-strain relationship characterizing the relationship between the dynamic stress suffered by the packaging simulation body and a second deformation of the packaging simulation body; a second finite element calculation module, used to perform a second finite element calculation on the structure of the packaging simulation body using the second stress-strain relationship, and obtain a test result of the motion state of the packaging simulation body during the dynamic compression process.

[0007] The third aspect of the present application provides an electronic device, comprising: one or more processors; a memory for storing one or more computer programs, wherein the one or more processors execute the one or more computer programs to implement the steps of the above method.

[0008] The fourth aspect of the present application also provides a computer-readable storage medium on which a computer program or instruction is stored, and the steps of the above method are implemented when the above computer program or instruction is executed by a processor.

[0009] The fifth aspect of the present application also provides a computer program product, including a computer program or instructions, which implement the steps of the above method when the above computer program or instructions are executed by a processor.

[0010] According to the embodiment of the present application, the first finite element calculation is performed on the structure of the packaging simulation body according to the simulation parameter set of the simulation model to be tested, and the first stress-strain relationship of the packaging simulation body in the static compression process is obtained; the first stress-strain relationship of the packaging simulation body in the static compression process is converted according to the simulation parameters of the packaging simulation body, and the second stress-strain relationship of the packaging simulation body in the dynamic compression process is obtained, so that the accurate stress-strain relationship in the dynamic compression process can be obtained to adapt to dynamic simulation. Then, based on the second stress-strain relationship, the second finite element calculation is performed on the structure of the packaging simulation body to obtain the motion state test result of the packaging simulation body in the dynamic compression process, so as to realize "simulation to be tested", reduce costs, provide designers with more test data of static compression process and dynamic compression process, and more accurate test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above contents and other purposes, features and advantages of the present application will become more apparent through the following description of the embodiments of the present application with reference to the accompanying drawings, in which:

[0012] Figure 1A A collision scene diagram of a test method of a simulation model according to an embodiment of the present application is schematically shown;

[0013] Figure 1B A diagram schematically shows a drop scenario of a test method of a simulation model according to an embodiment of the present application;

[0014] Figure 2 A flowchart of a method for testing a simulation model according to an embodiment of the present application is schematically shown;

[0015] Figure 3 A schematic diagram of a simulation model to be tested according to an embodiment of the present application is schematically shown;

[0016] Figure 4 A schematic diagram schematically shows a first measured stress-strain relationship according to an embodiment of the present application;

[0017] Figure 5A A static compression displacement cloud diagram of a package simulation according to an embodiment of the present application when the package is compressed to a limit state during static compression is schematically shown;

[0018] Figure 5B A static stress cloud diagram of a packaging simulation body compressed to a limit state during a static compression process according to an embodiment of the present application is schematically shown;

[0019] Fig. 6A A schematic diagram schematically shows the change of the initial static compression displacement with the simulation time during the static compression process according to an embodiment of the present application;

[0020] Figure 6B A schematic diagram schematically shows the change of the initial static compression rate with the simulation time during the static compression process according to an embodiment of the present application;

[0021] Figure 7 A schematic diagram schematically shows the change of static stress with simulation time during static compression according to an embodiment of the present application;

[0022] Figure 8 The following schematically shows a curve to be fitted formed by static stress and static compression rate under simulation time information according to an embodiment of the present application;

[0023] Fig. 9 The dynamic compression displacement curves under different simulated stresses according to the embodiment of the present application are schematically shown;

[0024] Fig.10 The maximum acceleration curves under different simulation stresses according to the embodiment of the present application are schematically shown;

[0025] Fig.11 Schematically showing a curve representing the relationship between acceleration and dynamic stress at different thicknesses of a packaging simulation body according to an embodiment of the present application;

[0026] Fig.12 A structural block diagram schematically shows a test device for a simulation model according to an embodiment of the present application; and

[0027] Fig.13 A block diagram of an electronic device suitable for implementing a testing method for a simulation model according to an embodiment of the present application is schematically shown. DETAILED DESCRIPTION

[0028] Below, embodiments of the present application will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present application. In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present application. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present application.

[0029] The terms used herein are only for describing specific embodiments and are not intended to limit the present application. The terms "include", "comprising", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0030] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0031] When using expressions such as "at least one of A, B, and C, etc.", they should generally be interpreted according to the meaning of the expression commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0032] An embodiment of the present application provides a testing method for a simulation model, comprising: obtaining a simulation model to be tested, the simulation model to be tested is used to simulate the state change of the packaging of a target item under the action of an external force impact, and the simulation model to be tested includes an impact simulation body and a packaging simulation body; performing a first finite element calculation on the structure of the packaging simulation body according to a simulation parameter set of the simulation model to be tested, and obtaining a first stress-strain relationship of the packaging simulation body during a static compression process, the first stress-strain relationship characterizing the relationship between the static stress suffered by the packaging simulation body and a first deformation of the packaging simulation body; converting the first stress-strain relationship according to packaging simulation parameters of the packaging simulation body, and obtaining a second stress-strain relationship of the packaging simulation body during a dynamic compression process, the simulation parameter set includes packaging simulation parameters, and the second stress-strain relationship characterizing the relationship between the dynamic stress suffered by the packaging simulation body and a second deformation of the packaging simulation body; performing a second finite element calculation on the structure of the packaging simulation body using the second stress-strain relationship, and obtaining a test result of the motion state of the packaging simulation body during the dynamic compression process.

[0033] Figure 1A A collision scenario diagram of a testing method of a simulation model according to an embodiment of the present application is schematically shown.

[0034] like Figure 1A As shown, the collision scene graph according to this embodiment may include a target object 101 , a package 102 , and an impact body 103 .

[0035] The target object 101 may be a mechanical instrument, precision equipment, fragile product, etc. For example, the target object is a compass, a server, a cup, etc. The shape and size of the target object 101 are not limited.

[0036] The packaging 102 may be cushioning. For example, the packaging may be made of foam, rubber, air cushion, gel, or the like.

[0037] The impact body 103 may be an object that has contact with the target object 101. For example, the impact body may be the earth, a floor, other products, and the like.

[0038] When the target object 101 wrapped by the package 102 is impacted by an external force brought by the impact object 103 , the appearance or function of the target object may be damaged.

[0039] The impact body 103 may be a product that is located adjacent to the target object 101 during transportation. When the impact body 103 is bumped during transportation, the impact object 103 tilts, thereby bringing external force impact to the package 102, causing the package 102 to deform, change its motion state, etc. Figure 1A The contact position between the impact body 103 and the package 102 (shown by the dotted curve line in the figure).

[0040] Figure 1B A drop scenario diagram of a testing method for a simulation model according to an embodiment of the present application is schematically shown.

[0041] like Figure 1B As shown, the collision scene graph according to this embodiment may include a target object 101 , a package 102 , and an impact body 103 .

[0042] The impact body 103 may also be the earth. In the process of transporting the target object 101, it may fall unexpectedly, causing the package 102 to be subjected to the downward impact of the target object 101 and the supporting force of the earth. The package 102 falls with the target object 101, and the package 102 may be deformed. Figure 1B The contact position between the impact body 103 and the packaging body 102 (shown by the straight dashed line in the figure).

[0043] It should be noted that the testing method of the simulation model of the embodiment of the present application is not limited to collision scenarios and falling scenarios, and can be a scenario in which the packaging body 102 is compressed under the action of any external force.

[0044] Figure 2 The flowchart of the testing method of the simulation model according to the embodiment of the present application is schematically shown.

[0045] like Figure 2 As shown, the testing method of the simulation model of this embodiment includes operations S210 to S240, and the testing method of the simulation model can be executed by a server.

[0046] In operation S210 , a simulation model to be tested is obtained.

[0047] According to an embodiment of the present application, the simulation model to be tested is used to simulate the state change of the packaging of the target article under the impact of external force, and the simulation model to be tested includes an impact simulation body and a packaging simulation body.

[0048] The simulation model to be tested can be constructed based on the information of the actual test scene of the target object. For example, the actual test scene can be a drop scene. Before constructing the simulation model to be tested, the drop height of the target object, the support force given by the ground, the geometric shape of the package, and the constitutive relationship of the material (such as plasticity, linear elasticity), etc. need to be set.

[0049] The target object may be a mechanical instrument, precision equipment, fragile product, etc. For example, the target object is a compass, a server, a cup, etc. The shape and size of the target object are not limited.

[0050] The impact simulation body is used to simulate the external force impact on the packaging of the target article. The packaging simulation body can be constructed according to the information of the packaging structure, material, etc. There is a contact position between the impact simulation body and the packaging simulation body.

[0051] The state change may include at least one of the following: motion change, structural change, elastic property change, etc. The motion change may be a decrease in speed, an increase in displacement, etc. The structural change may be a decrease in thickness, damage to the package, etc. The elastic change may be a decrease in elasticity, etc.

[0052] In operation S220, a first finite element calculation is performed on the structure of the packaging simulation body according to the simulation parameter set of the simulation model to be tested, so as to obtain a first stress-strain relationship of the packaging simulation body during a static compression process.

[0053] According to an embodiment of the present application, the static compression process may be such that the external load of the package is constant and does not change over time. For example, when the target object is placed on the ground, the external impact force may be the support force of the ground on the package, while the target object is a pressure on the package. Therefore, the external load of the package is constant and does not change over time.

[0054] In the finite element analysis, the simulation model to be tested is meshed, especially the contact positions on the packaging simulation body. The more detailed the meshing, the higher the accuracy of the finite element analysis.

[0055] According to an embodiment of the present application, the simulation parameter set may include simulation parameters of each of the impact simulation body and the packaging simulation body.

[0056] According to an embodiment of the present application, the first stress-strain relationship represents the relationship between the static stress on the packaging simulation body and the first deformation of the packaging simulation body. For example, the first deformation is the deformation amount of the packaging simulation body during the static compression process.

[0057] In operation S230, the first stress-strain relationship is converted according to packaging simulation parameters of the packaging simulation body to obtain a second stress-strain relationship of the packaging simulation body during a dynamic compression process, wherein the simulation parameter set includes the packaging simulation parameters.

[0058] According to an embodiment of the present application, the packaging simulation parameters may characterize the properties of the packaging in finite element analysis, for example, the properties may be structure, material characteristics, etc.

[0059] According to an embodiment of the present application, the second stress-strain relationship represents the relationship between the dynamic stress on the packaging simulation body and the second deformation of the packaging simulation body. For example, the second deformation is the deformation amount of the packaging simulation body during the dynamic compression process.

[0060] The first stress-strain relationship and the second stress-strain relationship can be represented by the first function and the second function respectively, the stress and strain can be the independent variable and the dependent variable respectively, and the packaging simulation parameter can be the independent variable coefficient of the function. Therefore, the first stress-strain relationship can be converted by the packaging simulation parameter to obtain the second stress-strain relationship of the packaging simulation body during the dynamic compression process.

[0061] For example, the packaging simulation parameters of the dynamic compression process are 1.4 times the packaging simulation parameters of the static compression process, and the first stress-strain relationship can be converted into the second stress-strain relationship.

[0062] For example, there are multiple packaging simulation parameters, and by analyzing the historical first stress-strain data and the historical second stress-strain data, the potential relationship between the multiple packaging simulation parameters in the static compression process and the dynamic compression process can be obtained.

[0063] In operation S240, a second finite element calculation is performed on the structure of the packaging simulation body using the second stress-strain relationship to obtain a motion state test result of the packaging simulation body during the dynamic compression process.

[0064] According to an embodiment of the present application, the dynamic compression process may be stress generated when the external load on the package changes over time, causing the package to deform or vibrate. For example, the falling process of the target object causes the package to vibrate, thereby generating dynamic stress.

[0065] According to an embodiment of the present application, the motion state test result may be a displacement change, a speed change, an acceleration change, etc. of the packaging body.

[0066] According to the embodiment of the present application, the first finite element calculation is performed on the structure of the packaging simulation body according to the simulation parameter set of the simulation model to be tested, and the first stress-strain relationship of the packaging simulation body in the static compression process is obtained; the first stress-strain relationship of the packaging simulation body in the static compression process is converted according to the simulation parameters of the packaging simulation body, and the second stress-strain relationship of the packaging simulation body in the dynamic compression process is obtained, so that the accurate stress-strain relationship in the dynamic compression process can be obtained to adapt to dynamic simulation. Then, the second finite element calculation is performed on the structure of the packaging simulation body according to the second stress-strain relationship, and the motion state test result of the packaging simulation body in the dynamic compression process is obtained, so as to realize "simulation to be tested", reduce costs, and provide designers with more test data of static compression process and dynamic compression process, and more accurate test results.

[0067] According to an embodiment of the present application, the packaging simulation parameters include at least one of the following: structural parameters, material parameters, contact parameters, and mechanical parameters.

[0068] According to an embodiment of the present application, structural parameters may include the size of the package; material parameters may include elastic model, Poisson's ratio, density; contact parameters may be contact mode; mechanical parameters may be the magnitude, direction, load distribution, etc. of the contact force.

[0069] For example, the target object may be a server. To simulate the state changes of the server during static compression and dynamic compression, the packaging may include a cushion made of EPE (Expanded Polyethylene Cushioning), a rigid floor as the impact body, and a steel pressure plate as the server.

[0070] Figure 3 The schematic diagram of a simulation model to be tested according to an embodiment of the present application is schematically shown.

[0071] like Figure 3 As shown, the simulation model to be tested includes an impact simulation body 301 , a packaging simulation body 302 and an article simulation body 303 .

[0072] The impact simulation body 301 may be a rigid floor, may be set as a rigid plane, and may not consider the surface microscopic features.

[0073] The packaging simulation body 302 may be a liner made of EPE material, the size of which may be set to 100 mm*100 mm*20 mm (length*width*height), and adopt equivalent material properties to simplify the complex internal structure.

[0074] The article simulation body 303 may be a steel pressure plate. The pressure plate may be in a rectangular shape, and a high elastic modulus and a low Poisson's ratio are set in the material properties so that the pressure plate has sufficient rigidity during the compression process and can evenly transfer the external pressure to the packaging simulation body 302.

[0075] Through this simplified approach, the amount of calculation and the calculation time can be significantly reduced while ensuring the simulation accuracy of key physical processes such as impact and buffering.

[0076] For example, when dividing the grid, both the packaging simulation body 302 and the article simulation body 303 are divided into hexahedral grids with a unit size of 10 mm (millimeter), and the corresponding material properties and cross-sectional properties are assigned. The EPE liner of the packaging simulation body 302 can be selected as the unit type of C3D8I. The unit type of C3D8I has low calculation cost and can accurately capture surface stress. The material type of the EPE liner is low-density foam, model Q35, and density 35kg / m 3 (kg / m3), which can accurately simulate the low density, high elasticity and buffering energy absorption characteristics of EPE cushioning pads, and is highly consistent with the actual mechanical behavior of EPE materials, thus ensuring the accuracy of the simulation results.

[0077] Figure 4 A schematic diagram of a first measured stress-strain relationship according to an embodiment of the present application is schematically shown.

[0078] like Figure 4 As shown, the first measured strain may be the compression rate of the package during the static compression process, and the first measured stress may be the static stress to which the package is subjected during the static compression process. The curve in the figure can characterize the relationship between the first measured strain and the first measured stress. The maximum measured strain involved in the first measured stress-strain relationship is 75%.

[0079] According to an embodiment of the present application, a first finite element calculation is performed on the structure of the packaging simulation body according to the simulation parameters of the simulation model to be tested to obtain a first stress-strain relationship of the packaging simulation body during static compression, including: performing a first finite element calculation on the structure of the packaging simulation body according to the simulation parameters of the simulation model to be tested to obtain static strain data; and performing curve fitting on the static strain data based on simulation time information to obtain a first stress-strain relationship.

[0080] According to an embodiment of the present application, the simulation model to be tested after meshing can be imported into finite element simulation software.

[0081] Set the analysis step, add contact and boundary conditions in the finite element simulation software. For example, the analysis step of the static mechanical analysis can be set to 1, which can simulate the mechanical response of the package during static compression.

[0082] Contacts are added between the lower surface of the object simulation body and the upper surface of the packaging simulation body, and between the lower surface of the packaging simulation body and the impact simulation body, so as to simulate the actual contact state of the packaging during the compression process.

[0083] The impact simulation body is fixed to simulate its role of providing stable support. A forced displacement of 19.8 mm (compression rate can reach 99%) and vertically downward is applied to the object simulation body. The forced displacement is set to simulate the pressure applied to the package during the actual compression process, so that the packaging simulation body produces a corresponding deformation.

[0084] The first finite element calculation is performed on the structure of the packaging simulation body using finite element simulation software to obtain static strain data. The static strain data is curve-fitted based on the simulation time information to obtain the first stress-strain relationship. The static stress corresponding to the maximum static strain in the first stress-strain relationship can obtain a complete static stress-strain curve, and the data is more comprehensive and accurate.

[0085] According to an embodiment of the present application, the static strain data includes: static stress between the impact simulation body and the packaging simulation body, and static compression rate of the packaging simulation body during static compression.

[0086] Figure 5A A static compression displacement cloud diagram of a packaging simulation according to an embodiment of the present application when the body is compressed to a limit state during a static compression process is schematically shown.

[0087] like Figure 5A As shown, the packaging simulation body uses EPE liner, model Q35. Strain can be static compression displacement, in millimeters. In the figure, "-19" means that the package is compressed downward by 19 mm, the grid color is blue, and the static compression displacement is large.

[0088] The initial static compression rate of the packaging simulation body can be calculated according to the thickness and the initial static compression displacement of the packaging simulation body.

[0089] Figure 5B The static stress cloud diagram of a packaging simulation body compressed to a limit state during a static compression process according to an embodiment of the present application is schematically shown.

[0090] like Figure 5B As shown in the figure, the static stress distribution of the packaging simulation body. The grid color is blue and the static stress is relatively small.

[0091] Through the compression displacement cloud map and stress cloud map, we can intuitively understand the static compression displacement and static stress distribution of the packaging simulation body when it is compressed to the limit state.

[0092] According to an embodiment of the present application, the method further includes: determining a plurality of target points from the outer surface of the packaging simulation body according to preset positions; and calculating the average of the initial static compression rates of the plurality of target points to obtain the static compression rate.

[0093] According to an embodiment of the present application, the preset position may be a position such as the center or edge of the upper surface of the packaging simulation body. Figure 5A Or the target points 1 to 9 marked as shown in 5B.

[0094] According to the embodiment of the present application, extract Figure 5A The simulation time information and initial static compression displacement of the preset position in the simulation are obtained. According to the thickness of the packaging simulation body and the initial static compression displacement, the initial static compression rate of the packaging simulation body can be calculated. The initial static compression rate is shown as follows:

[0095] (1)

[0096] ε is the initial static compression rate, ∆h is the initial static compression displacement, which refers to the distance that the packaging simulation body reduces in the thickness direction after being compressed, in mm; h0 is the thickness of the packaging simulation body when it is not compressed.

[0097] The initial static compression rates of multiple target points are averaged according to the simulation time information to obtain the static compression rate under the simulation time information. This can effectively reduce the error caused by data fluctuations at individual positions and more accurately reflect the overall compression displacement of the upper surface of the packaging simulation body.

[0098] According to the embodiment of the present application, extract Figure 5B The simulation time information and static stress of the preset position in the simulation time are calculated. The average value of the static stress of the nodes in 9 is calculated according to the simulation time information, and the curve of the static stress changing with the simulation time during the static compression process is obtained. This can avoid excessive deviation of the static compression rate due to the influence of special factors on individual position points and improve the accuracy of the analysis results.

[0099] Fig. 6A The schematic diagram schematically shows the change of the initial static compression displacement with the simulation time during the static compression process according to an embodiment of the present application.

[0100] like Fig. 6A As shown in FIG. 1 , during the static compression process, as the simulation time changes, the downward initial static compression displacement of the packaging simulation body becomes larger. The unit of the simulation time is seconds.

[0101] Figure 6B The schematic diagram schematically shows the change of the initial static compression rate with the simulation time during the static compression process according to an embodiment of the present application.

[0102] like Figure 6B As shown, during the static compression process, as the simulation time changes, the initial static compression rate of the packaging simulation body increases, but it has not yet reached the compression rate limit of 100%.

[0103] Figure 7 The schematic diagram schematically shows the change of static stress with simulation time during static compression according to an embodiment of the present application.

[0104] like Figure 7 As shown in the figure, during the static compression process, as the simulation time changes, the static stress on the packaging simulation body increases slowly at first and then rises linearly. The unit of static stress is megapascal (MPa).

[0105] According to an embodiment of the present application, a curve fitting is performed on the static strain data based on the simulation time information to obtain a first stress-strain relationship, including: curve synthesis of the static stress and the static compression rate based on the simulation time information to obtain a relationship to be fitted; and curve fitting is performed on the relationship to be fitted using a fitting model to obtain a first stress-strain relationship.

[0106] According to an embodiment of the present application, static stress and static compression rate with the same simulation time information are used as data pairs. Multiple groups of data pairs are sorted according to the simulation time information. The static compression rate is used as the data of the horizontal axis and the static stress is used as the data of the vertical axis, so as to synthesize the relationship to be fitted. The relationship to be fitted can be characterized by a curve formed by the static stress and the static compression rate under the simulation time information.

[0107] Therefore, the static stress and static compression rate are synthesized into curves based on the simulation time information, which can make the data match accurately.

[0108] Figure 8 The figure schematically shows a curve to be fitted formed by static stress and static compression rate under simulation time information according to an embodiment of the present application.

[0109] like Figure 8 As shown, the red solid line is the curve to be fitted, and the maximum compression rate can approach 95%. The first measured stress-strain curve can be obtained by actual measurement. Before the static compression rate is 75%, the simulated curve to be fitted and the first measured stress-strain curve are completely consistent, which fully verifies that the simulation method has high accuracy in the small deformation stage of the material. When the static compression rate exceeds 75%, since the material enters the complex nonlinear deformation area, the first measured stress-strain curve may be difficult to obtain complete data due to the limitations of the test conditions. The simulation curve can show the mechanical response trend of the material under large deformation conditions based on the established material model and simulation algorithm.

[0110] According to an embodiment of the present application, the fitting model may be a constitutive model, which may represent the behavior of a material through a mathematical equation to reflect the mechanical response of the material under an external load. For example, the fitting model may be a Prandtl-Reuss model.

[0111] By using the fitting model to perform curve fitting on the relationship to be fitted, the static stress corresponding to the static compression rate of 0%~100% can be obtained, that is, the complete first stress-strain curve. Therefore, it can be subsequently converted into a complete and accurate second stress-strain relationship, which can more accurately simulate the dynamic response of the packaging of the target object during the falling process, help optimize the packaging design, improve the safety of the target object during transportation and storage, and reduce the cost of damage caused by impact.

[0112] According to an embodiment of the present application, the above method also includes: establishing a measured fitting model based on the first measured stress-strain relationship and the static hardening coefficient to obtain a fitted stress-strain relationship; adjusting the static hardening coefficient of the measured fitting model until the error value between the fitted stress-strain relationship and the second measured stress-strain relationship meets the threshold condition; and determining the conversion parameters based on the adjusted static hardening coefficient and the static hardening coefficient.

[0113] According to an embodiment of the present application, the first measured stress-strain relationship is as follows: Figure 4 The second measured stress-strain relationship can be obtained by measuring the stress and strain of the package during dynamic compression.

[0114] According to an embodiment of the present application, the measured fitting model and the fitting model are constitutive models of the same type.

[0115] The first measured data satisfying the first measured stress-strain relationship is input into the constitutive model with a hardening coefficient to obtain an initial measured fitting model. The hardening coefficient of the initial measured fitting model is adjusted to a static hardening coefficient to obtain an intermediate measured fitting model. The intermediate measured fitting model corresponds to the intermediate model function relationship with the static hardening coefficient. According to the data error between the data to be determined satisfying the intermediate model function relationship and the data satisfying the first measured stress-strain relationship, the least square method is used to adjust the other coefficients in the intermediate measured model except the hardening coefficient until the data error reaches a minimum value to obtain the measured fitting model.

[0116] According to an embodiment of the present application, the hardening coefficient of the initial measured fitting model is first adjusted to a static hardening coefficient to obtain an intermediate measured fitting model. The intermediate model function relationship of the intermediate measured fitting model is used to obtain the data to be determined for parameter optimization, which can improve the construction efficiency of the measured fitting model.

[0117] The least squares method is used to adjust the coefficients except the hardening coefficient in the intermediate measured model until the data error reaches the minimum value, which can keep the static hardening coefficient unchanged, thereby obtaining a measured fitting model that conforms to the static mechanical response of the packaging material, improving the accuracy of the conversion parameters, and making the motion state test results obtained by the second finite element calculation based on the second stress-strain relationship more accurate.

[0118] According to the embodiments of the present application, the measured fitting model accurately reflects the static mechanical response of the packaging material, that is, the measured fitting model can predict the stress and strain of the packaging during the static compression process.

[0119] In order to obtain the stress and strain variation law of the package during dynamic compression based on the measured fitting model, the static hardening coefficient can be optimized so that the error value between the fitted stress-strain relationship and the second measured stress-strain relationship meets the threshold condition. That is, the error value between the fitting data that satisfies the fitted stress-strain relationship and the second measured data that satisfies the second measured stress-strain relationship meets the threshold condition.

[0120] According to the embodiments of the present application, the conversion parameters are determined based on the first measured stress-strain curve and the second measured stress-strain curve, so that the dynamic simulation can be more consistent with the measured results, thereby improving the accuracy of the dynamic simulation.

[0121] According to an embodiment of the present application, the material parameters include a static hardening coefficient; the first stress-strain relationship is converted according to the packaging simulation parameters of the packaging simulation body to obtain a second stress-strain relationship of the packaging simulation body during a dynamic compression process, including: converting the static hardening coefficient of the packaging simulation body based on the conversion parameters to obtain a dynamic hardening coefficient of the packaging simulation body, the conversion parameters being obtained based on a first measured stress-strain relationship during a static compression process and a second measured stress-strain relationship during a dynamic compression process; converting the first stress-strain relationship using the dynamic hardening coefficient to obtain a second stress-strain relationship.

[0122] According to an embodiment of the present application, the conversion parameter may be to associate the packaging in a static compression process with a dynamic compression process.

[0123] According to an embodiment of the present application, the first stress-strain relationship can be represented by a first function, and the first function is of the same type as the model function in the measured fitting model. That is, the first function has a hardening coefficient. Therefore, the first measured stress-strain relationship, the second measured stress-strain relationship, the first stress-strain relationship, and the second stress-strain relationship are associated through the model function in the measured fitting model to obtain a conversion parameter. Thus, the first stress-strain relationship is converted into the second stress-strain relationship through the conversion parameter, so that the motion state test result of the packaging simulation body obtained is more comprehensive and accurate.

[0124] The static hardening coefficient is converted based on the conversion parameter to obtain the dynamic hardening coefficient. The static hardening coefficient in the first function is adjusted to the dynamic hardening coefficient to obtain the second stress-strain relationship.

[0125] According to the embodiment of the present application, since the first stress-strain relationship has the static stress corresponding to the maximum static strain, a complete static stress-strain curve can be obtained, and the data is more comprehensive and accurate. Therefore, the complete static compression first stress-strain relationship is converted into a dynamic compression second stress-strain relationship through conversion parameters, so that the second stress-strain relationship is also more comprehensive and more accurate, and the dynamic simulation result is more accurate.

[0126] According to an embodiment of the present application, the model to be tested also includes an object simulation body; the material parameters also include density; a second finite element calculation is performed on the structure of the packaging simulation body using the second stress-strain relationship to obtain a motion state test result of the packaging simulation body during dynamic compression, including: adjusting the density of the object simulation body based on the second stress-strain relationship to obtain the simulated stress to which the packaging simulation body is subjected during dynamic compression; calculating the impact velocity of the packaging simulation body in contact with the impact simulation body based on the initial velocity of the packaging simulation body and the distance between the packaging simulation body and the impact simulation body; performing a second finite element calculation on the structure of the packaging simulation body based on the simulated stress and the impact velocity to obtain the relationship between the acceleration and dynamic stress of the packaging simulation body as the motion state test result.

[0127] According to an embodiment of the present application, CAE (Computer-Aided Engineering) simulation technology is used to change the dynamic stress per unit area of ​​the packaging simulation body when the thickness and drop height of the packaging simulation body are known. The acceleration of the packaging simulation body under different dynamic stresses can be simulated and calculated.

[0128] According to the embodiment of the present application, the thickness of the packaging simulation body is 100 mm, the drop height is 700 mm, the weight of the article simulation body is w, the volume is v, the density is ρ, and the simulated stress per unit area is δ. The contact area between the impact simulation body and the packaging simulation body is A.

[0129] δ=W÷A, W=ρv, so δ=ρv÷A. When the contact area between the object simulation body and the packaging simulation body remains unchanged, the simulated stress δ changes with the change of the density ρ of the object simulation body. During simulation, the static stress per unit area is changed by changing the density of the object simulation body.

[0130] It should be noted that the range of the simulated stress is the same as the range of the dynamic stress in the second stress-strain relationship, that is, the density of the object simulation body is adjusted, and the simulated stress obtained belongs to the range of the dynamic stress.

[0131] According to the embodiments of the present application, by adjusting the density of the object simulation body and changing the simulation stress, the simulation process can be simplified and the simulation efficiency can be improved.

[0132] Taking the falling scene as an example, the distance between the packaging simulation body and the impact simulation body can be the falling height, and the initial speed of the packaging simulation body is 0. According to the free fall speed calculation formula, the speed of the packaging simulation body and the object simulation body at the moment of landing is , where g = 9810 mm / s 2(mm / second squared), the drop height h=700mm (mm), and the impact velocity v=3706mm / s (mm / second) when the packaging simulation body contacts the impact simulation body is calculated.

[0133] The second stress-strain relationship is input into the material model of the object simulation body, and the tensile curve and the compression curve are defined. If the simulated stress δ=0.01, the density ρ of the object simulation body is calculated by the formula δ=ρv÷A.

[0134] A dynamic analysis step is established to simulate the free fall motion of the object simulation body. The boundary condition can be a fixed impact simulation body, and the impact velocity v of the object simulation body and the packaging simulation body is defined. The second finite element calculation is performed on the structure of the packaging simulation body based on the simulated stress δ and the impact velocity v.

[0135] After the second finite element calculation is completed, the dynamic compression displacement of the object simulation body during the dynamic compression process is extracted, the dynamic compression displacement of the object simulation body is secondarily derived to obtain the acceleration of the object simulation body, and the dynamic compression displacement and acceleration are stored.

[0136] The value of the simulated stress can be adjusted to obtain the density of the simulated body of the object, and the dynamic compression displacement and acceleration of the simulated body of the object under different simulated stresses can be obtained.

[0137] Fig. 9 The dynamic compression displacement curves under different simulated stresses according to the embodiments of the present application are schematically shown.

[0138] like Fig. 9 As shown in FIG. 1 , the dynamic compression displacement curves are obtained when the simulated stresses are δ1, δ2, ..., δ11. The greater the simulated stress, the greater the dynamic compression displacement, that is, the maximum compression of the package simulation body during the drop process.

[0139] Fig.10 The maximum acceleration curves under different simulation stresses according to the embodiments of the present application are schematically shown.

[0140] like Fig.10 As shown, the maximum acceleration curve of the object simulation body during the falling process of the object simulation body under different simulation stresses.

[0141] Fig. 9 The dynamic compression displacement curve and Fig.10 The maximum acceleration curve can be synthesized through the curve to obtain the relationship between the acceleration and dynamic stress of the packaging simulation body.

[0142] The thickness of the packaging simulation body is d=100 mm (millimeter), and the drop height is h=700 mm (millimeter). When the packaging simulation body is dropped at different simulated stresses δ, the compression amount, acceleration, and compression rate of the packaging simulation body are shown in Table 1.

[0143] The simulation calculation and data collation of the above 11 simulated stress δ values ​​are completed in a short time. The compression and acceleration of the packaging simulation body under different simulated stresses are obtained by the method of "simulation instead of measurement". The number of simulated stress δ values ​​is not limited. The more values ​​are taken, the more data are obtained, and the more accurate the relationship between the acceleration and dynamic stress of the packaging simulation body is.

[0144] Using CAE simulation technology, the thickness of the packaging simulation body is changed while the drop height remains unchanged. The acceleration of the object simulation body under different static pressures at different thicknesses is obtained by simulation calculation.

[0145] When the drop height h=700mm (millimeter) remains unchanged, the thickness of the packaging simulation body is modified, and the simulation model to be tested is tested using the test method for the simulation model. The acceleration of the packaging simulation body under different thicknesses and different simulation pressures δ is obtained, as shown in Table 2.

[0146] Table 1

[0147]

[0148] Table 2

[0149]

[0150] The data in Table 2 are stored in the database. The method of "simulation instead of measurement" is used. No samples and experimental equipment are required, which greatly reduces the economic and time costs. The operation is simple and fast. The number of values ​​of the simulation stress δ is not limited and can be any number. The thickness of the packaging simulation body can also be changed arbitrarily. A more accurate and complete database of information such as acceleration, static stress, dynamic stress, etc. of the packaging simulation body can be quickly established in a short period of time.

[0151] Fig.11 The graph schematically shows the relationship between acceleration and dynamic stress at different thicknesses of the packaging simulation body according to the embodiment of the present application.

[0152] like Fig.11 As shown in the figure, under the same dynamic stress, the greater the thickness of the packaging simulation body, the smaller the acceleration. The greater the thickness, the more obvious the buffering effect.

[0153] According to the embodiments of the present application, the drop height h can also be modified, and the simulation model to be tested is tested using the test method for the simulation model to obtain the simulated stress and acceleration when falling from different heights. A curve representing the relationship between dynamic stress and acceleration when falling from different heights is drawn based on the obtained data. Taking server products as an example, the drop height h is related to the weight of the product. After collecting the common drop heights of server products, a database including acceleration, static stress, dynamic stress and other data of the server product drop can be established.

[0154] After determining the drop height and fragility value of the product (target object), the thickness and static pressure of the package are selected according to the existing technology based on the relationship between acceleration and dynamic stress when falling from a height.

[0155] The database contains the compression of the packaging simulation body under different simulated stresses. When the product (target object) has a protruding part on its appearance, the compression corresponding to the simulated stress can be used as a reference for avoidance. For example, the target object is a server. The drop height of the server is 700mm (millimeter), the thickness of the packaging is 100mm (millimeter), and the dynamic stress is 0.06. It can be seen that the maximum compression of the packaging is 60.34mm (millimeter). In the packaging design, the packaging avoidance depth of the server box ear should be designed to be no less than 60.34mm (millimeter) to ensure that the box ear does not collide with the floor during the fall.

[0156] Fig.12 The structural block diagram of a testing device for a simulation model according to an embodiment of the present application is schematically shown.

[0157] like Fig.12 As shown, the test device 1200 of the simulation model of this embodiment includes an acquisition module 1210 , a first finite element calculation module 1220 , a conversion module 1230 and a second finite element calculation module 1240 .

[0158] The acquisition module 1210 is used to acquire a simulation model to be tested, which is used to simulate the state change of the packaging of the target item under the action of an external force impact, and the simulation model to be tested includes an impact simulation body and a packaging simulation body. In one embodiment, the acquisition module 1210 can be used to perform the operation S210 described above, which will not be repeated here.

[0159] The first finite element calculation module 1220 is used to perform a first finite element calculation on the structure of the packaging simulation body according to the simulation parameter set of the simulation model to be tested, and obtain a first stress-strain relationship of the packaging simulation body during the static compression process, wherein the first stress-strain relationship represents the relationship between the static stress received by the packaging simulation body and the first deformation of the packaging simulation body. In one embodiment, the first finite element calculation module 1220 can be used to perform the operation S220 described above, which will not be described in detail herein.

[0160] The conversion module 1230 is used to convert the first stress-strain relationship according to the packaging simulation parameters of the packaging simulation body to obtain a second stress-strain relationship of the packaging simulation body during the dynamic compression process, the simulation parameter set includes the packaging simulation parameters, and the second stress-strain relationship represents the relationship between the dynamic stress received by the packaging simulation body and the second deformation of the packaging simulation body. In one embodiment, the conversion module 1230 can be used to perform the operation S230 described above, which will not be repeated here.

[0161] The second finite element calculation module 1240 is used to perform a second finite element calculation on the structure of the packaging simulation body using the second stress-strain relationship to obtain a test result of the motion state of the packaging simulation body during dynamic compression. The second finite element calculation module 1240 can be used to perform the operation S240 described above, which will not be described in detail here.

[0162] According to an embodiment of the present application, the first finite element calculation module 1220 includes a first finite element calculation submodule and a curve fitting submodule. The first finite element calculation submodule is used to perform a first finite element calculation on the structure of the packaging simulation body according to the simulation parameters of the simulation model to be tested to obtain static strain data; the curve fitting submodule is used to perform curve fitting on the static strain data based on the simulation time information to obtain a first stress-strain relationship.

[0163] According to an embodiment of the present application, the static strain data includes: the static stress between the impact simulation body and the packaging simulation body, and the static compression rate of the packaging simulation body during the static compression process; the curve fitting submodule includes a curve synthesis unit and a curve fitting unit. The curve synthesis unit is used to perform curve synthesis on the static stress and the static compression rate based on the simulation time information to obtain the relationship to be fitted; the curve fitting unit is used to perform curve fitting on the relationship to be fitted using the fitting model to obtain the first stress-strain relationship.

[0164] According to an embodiment of the present application, the packaging simulation parameters include at least one of the following: structural parameters, material parameters, contact parameters, and mechanical parameters.

[0165] According to an embodiment of the present application, the material parameter includes a static hardening coefficient; the conversion module 1230 includes a first conversion submodule and a second conversion submodule. The first conversion submodule is used to convert the static hardening coefficient of the packaging simulation body based on the conversion parameter to obtain the dynamic hardening coefficient of the packaging simulation body, and the conversion parameter is obtained according to the first measured stress-strain relationship during the static compression process and the second measured stress-strain relationship during the dynamic compression process; the second conversion submodule is used to convert the first stress-strain relationship using the dynamic hardening coefficient to obtain the second stress-strain relationship.

[0166] According to an embodiment of the present application, the above-mentioned device further includes: an establishment module, an adjustment module and a first determination module. The establishment module is used to establish a measured fitting model according to the first measured stress-strain relationship and the static hardening coefficient to obtain a fitted stress-strain relationship; the adjustment module is used to adjust the static hardening coefficient of the measured fitting model until the error value between the fitted stress-strain relationship and the second measured stress-strain relationship meets the threshold condition; the first determination module is used to determine the conversion parameter based on the adjusted static hardening coefficient and the static hardening coefficient.

[0167] According to an embodiment of the present application, the model to be tested also includes an article simulation body; the material parameters also include density; the second finite element calculation module 1240 includes an adjustment submodule, a first calculation submodule and a second finite element calculation submodule. The adjustment submodule is used to adjust the density of the article simulation body based on the second stress-strain relationship to obtain the simulated stress to which the packaging simulation body is subjected during the dynamic compression process; the first calculation submodule is used to calculate the impact velocity of the packaging simulation body contacting the impact simulation body according to the initial velocity of the packaging simulation body and the distance between the packaging simulation body and the impact simulation body; the second finite element calculation submodule is used to perform a second finite element calculation on the structure of the packaging simulation body based on the simulated stress and the impact velocity to obtain the relationship between the acceleration and dynamic stress of the packaging simulation body as the motion state test result.

[0168] According to an embodiment of the present application, the device further comprises a second determination module and a mean calculation module. The second determination module is used to determine multiple target points from the outer surface of the packaging simulation body according to preset positions; the mean calculation module is used to calculate the mean of the initial static compression rates of the multiple target points to obtain the static compression rate.

[0169] According to an embodiment of the present application, any multiple modules of the acquisition module 1210, the first finite element calculation module 1220, the conversion module 1230, and the second finite element calculation module 1240 can be combined into one module for implementation, or any one of the modules can be split into multiple modules. Alternatively, at least part of the functions of one or more of these modules can be combined with at least part of the functions of other modules and implemented in one module. According to an embodiment of the present application, at least one of the acquisition module 1210, the first finite element calculation module 1220, the conversion module 1230, and the second finite element calculation module 1240 can be at least partially implemented as a hardware circuit, such as a field programmable gate array (FPGA), a programmable logic array (PLA), a system on a chip, a system on a substrate, a system on a package, an application specific integrated circuit (ASIC), or can be implemented by hardware or firmware such as any other reasonable way of integrating or packaging the circuit, or implemented in any one of the three implementation methods of software, hardware, and firmware, or in any appropriate combination of any of them. Alternatively, at least one of the acquisition module 1210, the first finite element calculation module 1220, the conversion module 1230 and the second finite element calculation module 1240 may be at least partially implemented as a computer program module, and when the computer program module is executed, a corresponding function may be performed.

[0170] Fig.13 A block diagram of an electronic device suitable for implementing a testing method for a simulation model according to an embodiment of the present application is schematically shown.

[0171] like Fig.13 As shown, the electronic device 1300 according to an embodiment of the present application includes a processor 1301, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1302 or a program loaded from a storage part 908 into a random access memory (RAM) 1303. The processor 901 may include, for example, a general-purpose microprocessor (e.g., a CPU), an instruction set processor and / or a related chipset and / or a dedicated microprocessor (e.g., an application-specific integrated circuit (ASIC)), etc. The processor 1301 may also include an onboard memory for caching purposes. The processor 901 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of the present application.

[0172] In RAM 1303, various programs and data required for the operation of electronic device 1300 are stored. Processor 1301, ROM 1302 and RAM 1303 are connected to each other via bus 1304. Processor 1301 performs various operations of the method flow according to the embodiment of the present application by executing the program in ROM 1302 and / or RAM 1303. It should be noted that the program can also be stored in one or more memories other than ROM 1302 and RAM 1303. Processor 1301 can also perform various operations of the method flow according to the embodiment of the present application by executing the program stored in the one or more memories.

[0173] According to an embodiment of the present application, the electronic device 1300 may further include an input / output (I / O) interface 1305, which is also connected to the bus 1304. The electronic device 1300 may further include one or more of the following components connected to the input / output (I / O) interface 1305: an input portion 1306 including a keyboard, a mouse, etc.; an output portion 1307 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage portion 1308 including a hard disk, etc.; and a communication portion 1309 including a network interface card such as a LAN card, a modem, etc. The communication portion 1309 performs communication processing via a network such as the Internet. A drive 1310 is also connected to the input / output (I / O) interface 1305 as needed. A removable medium 1311, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 1310 as needed, so that a computer program read therefrom is installed into the storage portion 1308 as needed.

[0174] The present application also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiments; or may exist independently without being assembled into the device / apparatus / system. The above computer-readable storage medium carries one or more programs, and when the above one or more programs are executed, the method according to the embodiment of the present application is implemented.

[0175] According to an embodiment of the present application, the computer-readable storage medium may be a non-volatile computer-readable storage medium, for example, it may include but is not limited to: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, the computer-readable storage medium may be any tangible medium containing or storing a program, which may be used by or in combination with an instruction execution system, an apparatus or a device. For example, according to an embodiment of the present application, the computer-readable storage medium may include the ROM 1302 and / or RAM 1303 described above and / or one or more memories other than ROM 1302 and RAM 1303.

[0176] The embodiment of the present application also includes a computer program product, which includes a computer program, and the computer program contains program code for executing the method shown in the flowchart. When the computer program product is run in a computer system, the program code is used to enable the computer system to implement the test method of the simulation model provided in the embodiment of the present application.

[0177] The computer program executes the above functions defined in the system / device of the embodiment of the present application when the processor 1301 executes the computer program. According to the embodiment of the present application, the system, device, module, unit, etc. described above can be implemented by a computer program module.

[0178] In one embodiment, the computer program may rely on tangible storage media such as optical storage devices, magnetic storage devices, etc. In another embodiment, the computer program may also be transmitted and distributed in the form of signals on a network medium, and downloaded and installed through the communication part 1309, and / or installed from the removable medium 1311. The program code contained in the computer program may be transmitted using any appropriate network medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0179] In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 1309, and / or installed from the removable medium 1311. When the computer program is executed by the processor 1301, the above functions defined in the system of the embodiment of the present application are performed. According to the embodiment of the present application, the system, device, means, module, unit, etc. described above can be implemented by a computer program module.

[0180] According to an embodiment of the present application, the program code for executing the computer program provided by the embodiment of the present application can be written in any combination of one or more programming languages, and specifically, these computing programs can be implemented using high-level process and / or object-oriented programming languages, and / or assembly / machine languages. Programming languages ​​include, but are not limited to, such as Java, C++, python, "C" language or similar programming languages. The program code can be executed entirely on the user computing device, partially on the user device, partially on the remote computing device, or completely on the remote computing device or server. In the case of a remote computing device, the remote computing device can be connected to the user computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computing device (e.g., using an Internet service provider to connect through the Internet).

[0181] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the above-mentioned module, program segment or a part of a code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flow chart, and the combination of the boxes in the block diagram or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0182] It will be appreciated by those skilled in the art that the features described in the various embodiments of the present application may be combined and / or combined in a variety of ways, even if such combinations or combinations are not explicitly described in the present application. In particular, without departing from the spirit and teachings of the present application, the features described in the various embodiments of the present application may be combined and / or combined in a variety of ways. All of these combinations and / or combinations fall within the scope of the present application.

[0183] The embodiments of the present application are described above. However, these embodiments are only for the purpose of illustration, and are not intended to limit the scope of the present application. Although each embodiment is described above, this does not mean that the measures in each embodiment cannot be used in combination advantageously. Without departing from the scope of the present application, those skilled in the art may make a variety of substitutions and modifications, which should all fall within the scope of the present application.

Claims

1. A method for testing a simulation model, characterized in that: The method comprises: Acquire a simulation model to be tested, wherein the simulation model to be tested is used to simulate the state change of the packaging of the target article under the action of external force impact, and the simulation model to be tested includes an impact simulation body and a packaging simulation body; Performing a first finite element calculation on the structure of the packaging simulation body according to the simulation parameter set of the simulation model to be tested, to obtain a first stress-strain relationship of the packaging simulation body during a static compression process, wherein the first stress-strain relationship represents a relationship between a static stress on the packaging simulation body and a first deformation of the packaging simulation body; The first stress-strain relationship is converted according to the packaging simulation parameters of the packaging simulation body to obtain a second stress-strain relationship of the packaging simulation body during the dynamic compression process, the simulation parameter set includes the packaging simulation parameters, and the second stress-strain relationship represents the relationship between the dynamic stress on the packaging simulation body and the second deformation of the packaging simulation body; A second finite element calculation is performed on the structure of the packaging simulation body using the second stress-strain relationship to obtain a test result of the motion state of the packaging simulation body during the dynamic compression process.

2. The method according to claim 1, characterized in that The step of performing a first finite element calculation on the structure of the packaging simulation body according to the simulation parameters of the simulation model to be tested to obtain a first stress-strain relationship of the packaging simulation body during a static compression process includes: Performing a first finite element calculation on the structure of the packaging simulation body according to the simulation parameters of the simulation model to be tested to obtain static strain data; Curve fitting is performed on the static strain data based on the simulation time information to obtain the first stress-strain relationship.

3. The method according to claim 2, characterized in that The static strain data includes: static stress between the impact simulation body and the packaging simulation body, and static compression rate of the packaging simulation body during static compression; The performing curve fitting on the static strain data based on the simulation time information to obtain the first stress-strain relationship includes: Performing curve synthesis on the static stress and the static compression rate based on the simulation time information to obtain a relationship to be fitted; The fitting model is used to perform curve fitting on the relationship to be fitted to obtain the first stress-strain relationship.

4. The method according to claim 1 or 2, characterized in that: The packaging simulation parameters include at least one of the following: structural parameters, material parameters, contact parameters, and mechanical parameters.

5. The method according to claim 4, characterized in that The material parameters include a static hardening coefficient; The converting the first stress-strain relationship according to the packaging simulation parameter of the packaging simulation body to obtain a second stress-strain relationship of the packaging simulation body during the dynamic compression process includes: Converting the static hardening coefficient of the packaging simulation body based on a conversion parameter to obtain a dynamic hardening coefficient of the packaging simulation body, wherein the conversion parameter is obtained according to a first measured stress-strain relationship during the static compression process and a second measured stress-strain relationship during the dynamic compression process; The first stress-strain relationship is converted using the dynamic hardening coefficient to obtain the second stress-strain relationship.

6. The method according to claim 5, characterized in that The method further comprises: Establishing a measured fitting model according to the first measured stress-strain relationship and the static hardening coefficient to obtain a fitted stress-strain relationship; adjusting the static hardening coefficient of the measured fitting model until an error value between the fitted stress-strain relationship and the second measured stress-strain relationship meets a threshold condition; The conversion parameter is determined based on the adjusted static hardening coefficient and the static hardening coefficient.

7. The method according to claim 4, characterized in that: The model to be tested also includes an object simulation body; the material parameters also include density; The step of performing a second finite element calculation on the structure of the packaging simulation body by using the second stress-strain relationship to obtain a test result of a motion state of the packaging simulation body during the dynamic compression process includes: adjusting the density of the article simulation body based on the second stress-strain relationship to obtain the simulated stress to which the packaging simulation body is subjected during the dynamic compression process; Calculating the impact velocity of the packaging simulation body when it contacts the impact simulation body according to the initial velocity of the packaging simulation body and the distance between the packaging simulation body and the impact simulation body; A second finite element calculation is performed on the structure of the packaging simulation body based on the simulated stress and the impact velocity to obtain a relationship between the acceleration of the packaging simulation body and the dynamic stress as the motion state test result.

8. The method according to claim 3, characterized in that The method further comprises: According to the preset positions, a plurality of target points are determined from the outer surface of the packaging simulation body; The initial static compression rates of the multiple target points are averaged to obtain the static compression rate.

9. A testing device for a simulation model, characterized in that: The device comprises: An acquisition module, used for acquiring a simulation model to be tested, wherein the simulation model to be tested is used for simulating the state change of the packaging of the target article under the impact of an external force, and the simulation model to be tested includes an impact simulation body and a packaging simulation body; a first finite element calculation module, configured to perform a first finite element calculation on the structure of the packaging simulation body according to the simulation parameter set of the simulation model to be tested, and obtain a first stress-strain relationship of the packaging simulation body during a static compression process, wherein the first stress-strain relationship represents a relationship between a static stress on the packaging simulation body and a first deformation of the packaging simulation body; a conversion module, configured to convert the first stress-strain relationship according to packaging simulation parameters of the packaging simulation body to obtain a second stress-strain relationship of the packaging simulation body during dynamic compression, wherein the simulation parameter set includes the packaging simulation parameters, and the second stress-strain relationship represents a relationship between a dynamic stress on the packaging simulation body and a second deformation of the packaging simulation body; The second finite element calculation module is used to perform a second finite element calculation on the structure of the packaging simulation body by using the second stress-strain relationship to obtain a motion state test result of the packaging simulation body during the dynamic compression process.

10. An electronic device comprising: one or more processors; a memory for storing one or more computer programs, It is characterized in that the one or more processors execute the one or more computer programs to implement the steps of the method according to any one of claims 1 to 8.

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