Epoxy resin multi-factor comprehensive aging simulation and test design method

Abstract

The present application relates to a kind of epoxy resin multi-factor comprehensive aging simulation and test design method, comprising: selecting the electrical equipment component of different operating life, establish orthogonal experiment table of physicochemical property test, carry out physicochemical property test, obtain the macro aging characteristic quantity of each test content;Crosslinking epoxy resin molecular dynamics model is constructed, and macro aging characteristic quantity is introduced to simulate the microstructure change of epoxy resin in aging process, and establish multi-factor coupling aging model under the action of electricity-wet-heat;In multi-factor coupling aging model, the aging behavior of epoxy resin under different aging conditions is simulated using molecular dynamics simulation software, and micro aging characteristic quantity is obtained;Based on macro aging characteristic quantity and micro aging characteristic quantity, design multi-factor coupling epoxy resin aging test.The present application can quickly and effectively design more close to actual natural aging accelerated aging test, help to improve the aging prediction accuracy of epoxy resin.

Description

Technical Field

[0001] This invention relates to the field of aging test technology for insulating materials, specifically to a multi-factor comprehensive aging simulation and test design method for epoxy resin. Background Technology

[0002] Epoxy resin, as an important insulating material, is widely used in electronic packaging, coatings, composite materials, and electrical insulation. However, in practical applications, epoxy resin is often affected by various environmental factors, such as humidity, temperature, and electric fields. These factors cause the material to gradually age, affecting its mechanical, electrical, and chemical properties, and ultimately leading to insulation failure. The aging performance of epoxy resin is directly related to the safe and reliable operation of electrical equipment. Therefore, accurately assessing the aging behavior of epoxy resin is of great significance for predicting its lifespan and improving the reliable operation of electrical equipment.

[0003] Currently, traditional methods for evaluating the aging performance of insulating materials mainly rely on single-factor or multi-factor accelerated aging tests, such as damp heat aging, electrical aging, and thermal oxidative aging. These tests typically involve exposing the material to specific environmental conditions to accelerate its aging behavior and observe changes in its physical and electrical properties. Commonly used evaluation indicators include breakdown voltage, dielectric strength, volume resistivity, mechanical strength, and water absorption. While these testing methods can reflect the aging trend of materials to some extent, they also have some significant limitations. For example, they have long testing cycles and high costs, limiting the material development process; they cannot monitor early changes in the material's microstructure, making it difficult to capture early-stage degradation phenomena; and the matching between accelerated aging tests and actual natural aging is generally poor. Summary of the Invention

[0004] The technical problem to be solved by this invention is to provide a multi-factor comprehensive aging simulation and experimental design method for epoxy resin, which effectively combines molecular dynamics simulation and experiment for aging testing, so as to improve the accuracy of epoxy resin aging test, shorten the test time, and better predict the aging behavior of the material.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0006] A multi-factor comprehensive aging simulation and experimental design method for epoxy resin includes the following steps:

[0007] S1. Select electrical equipment components with different service years, establish an orthogonal experimental table for physical and chemical property testing, conduct physical and chemical property testing, and obtain the macroscopic aging characteristic quantities of each test item.

[0008] S2. Construct a molecular dynamics model of cross-linked epoxy resin, and introduce the macroscopic aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, and establish a multi-factor coupled aging model under the combined effects of electricity, humidity and heat.

[0009] S3. In the multi-factor coupled aging model, molecular dynamics simulation software is used to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities.

[0010] S4. Design a multi-factor coupled epoxy resin aging test based on the macroscopic aging characteristics and the microscopic aging characteristics.

[0011] The beneficial effects of this invention are as follows: It provides a multi-factor comprehensive aging simulation and experimental design method for epoxy resin. Through physicochemical property testing, it obtains aging characteristic quantities of different electrical equipment components with different service lives; it constructs a molecular dynamics model of cross-linked epoxy resin to introduce aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, thereby establishing a multi-factor coupled aging model under the combined effects of electricity, humidity, and heat; it uses molecular dynamics simulation software to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities; finally, through the analysis of physicochemical property testing and molecular dynamics microscopic aging results, it achieves the combination of macroscopic testing and microscopic simulation, jointly designing a multi-factor comprehensive epoxy resin aging test scheme. This facilitates the rapid and effective design of accelerated aging tests that more closely resemble actual natural aging, thereby improving the accuracy of epoxy resin aging tests, shortening test time, and better predicting the aging behavior of materials. Attached Figure Description

[0012] Figure 1 This is an overall flowchart of a multi-factor comprehensive aging simulation and experimental design method for epoxy resin according to an embodiment of the present invention;

[0013] Figure 2 This is a flowchart illustrating a multi-factor comprehensive aging simulation and experimental design method for epoxy resin according to an embodiment of the present invention.

[0014] Figure 3 This is a schematic diagram of the crosslinking script principle of a multi-factor comprehensive aging simulation and experimental design method for epoxy resin according to an embodiment of the present invention;

[0015] Figure 4 This is a schematic diagram of the simulation calculation results of a multi-factor comprehensive aging simulation and experimental design method for epoxy resin according to an embodiment of the present invention;

[0016] Figure 5 This is a schematic diagram of a multi-factor coupled aging test platform for an epoxy resin multi-factor comprehensive aging simulation and test design method according to an embodiment of the present invention;

[0017] Figure 6 This is a schematic diagram of the multi-factor cyclic aging test process of an epoxy resin multi-factor comprehensive aging simulation and test design method according to an embodiment of the present invention. Detailed Implementation

[0018] To explain in detail the technical content, objectives, and effects of the present invention, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0019] Please refer to Figures 1 to 6 A method for multi-factor comprehensive aging simulation and experimental design of epoxy resin, comprising the following steps:

[0020] S1. Select electrical equipment components with different service years, establish an orthogonal experimental table for physical and chemical property testing, conduct physical and chemical property testing, and obtain the macroscopic aging characteristic quantities of each test item.

[0021] S2. Construct a molecular dynamics model of cross-linked epoxy resin, and introduce the macroscopic aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, and establish a multi-factor coupled aging model under the combined effects of electricity, humidity and heat.

[0022] S3. In the multi-factor coupled aging model, molecular dynamics simulation software is used to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities.

[0023] S4. Design a multi-factor coupled epoxy resin aging test based on the macroscopic aging characteristics and the microscopic aging characteristics.

[0024] As can be seen from the above description, the beneficial effects of the present invention are as follows: It provides a multi-factor comprehensive aging simulation and experimental design method for epoxy resin. Through physicochemical property testing, it obtains aging characteristic quantities of different electrical equipment components with different service lives; it constructs a molecular dynamics model of cross-linked epoxy resin to introduce aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, thereby establishing a multi-factor coupled aging model under the combined effects of electricity, humidity, and heat; it uses molecular dynamics simulation software to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities; finally, through the analysis of physicochemical property testing and molecular dynamics microscopic aging results, it achieves the combination of macroscopic testing and microscopic simulation, jointly designing a multi-factor comprehensive epoxy resin aging test scheme. This facilitates the rapid and effective design of accelerated aging tests that more closely resemble actual natural aging, thereby improving the accuracy of epoxy resin aging tests, shortening test time, and better predicting the aging behavior of materials.

[0025] Furthermore, in step S1, electrical equipment components with different service lives are selected, specifically as follows:

[0026] Select AC transformers, contact boxes, busbars, and supporting insulators with service lives of 5, 10, 15, and 20 years.

[0027] Furthermore, before establishing the orthogonal experimental table for testing physicochemical properties in step S1, the following steps are also included:

[0028] Identify the main factors affecting aging characteristics, including the type of electrical equipment, years of operation, ambient temperature, and degree of contamination.

[0029] As described above, selecting different electrical equipment components of varying ages effectively determines the main factors affecting aging characteristics and ensures the reliability of aging test simulation data.

[0030] Furthermore, the test contents include crosslinking degree, glass transition temperature, water absorption rate, and dielectric constant;

[0031] The degree of crosslinking, the glass transition temperature, and the water absorption rate were all obtained by differential scanning calorimetry, and the dielectric constant was obtained by high and low temperature dielectric property tester.

[0032] The orthogonal experimental table is a four-factor, four-level orthogonal table L. 16 (4 4 ).

[0033] As described above, differential scanning calorimetry and high and low temperature dielectric properties testers are used to accurately and efficiently obtain the degree of crosslinking, glass transition temperature, water absorption rate and dielectric constant, thereby realizing the physicochemical property testing as different test contents.

[0034] Furthermore, the molecular dynamics simulation software is Materials Studio or Lammps.

[0035] As described above, molecular dynamics simulation technology is widely used in the field of materials science. It can simulate the behavior of materials in complex environments at the molecular level, providing new ideas for studying the aging mechanism of epoxy resin under the combined effects of moisture, heat, and electricity. Materials Studio and Lammps are both open-source software widely used in molecular dynamics simulation. They have multi-scale simulation capabilities, high performance, and parallel computing capabilities, effectively realizing the simulation of epoxy resin aging, thereby improving the accuracy of aging tests, shortening test time, and better predicting the aging behavior of materials.

[0036] Furthermore, the construction of the cross-linked epoxy resin molecular dynamics model in step S2 is specifically as follows:

[0037] The reaction site of bisphenol A epoxy resin was set as R1, and the reaction site of triethylenetetramine curing agent was set as R2. After the bisphenol A epoxy resin and triethylenetetramine curing agent were subjected to a cyclic crosslinking reaction using a Perl crosslinking script to achieve the ideal degree of crosslinking, the molecular dynamics model of the crosslinked epoxy resin was obtained.

[0038] As described above, the ideal degree of crosslinking can be achieved by using a Perl crosslinking script to perform a cyclic crosslinking reaction.

[0039] Furthermore, the microscopic aging characteristics include the free volume fraction of the epoxy resin model, the mean square displacement of the doped water molecules and cross-linked polymers, the interaction energy of the doped water molecules and cross-linked polymers, the cohesive energy density, and the system energy.

[0040] Furthermore, the epoxy resin aging behavior in step S3 includes:

[0041] The diffusion behavior of water molecules in cross-linked polymers and the combined electro-humid-thermal aging behavior of epoxy resin polymers.

[0042] Furthermore, step S4 also includes:

[0043] Accelerated aging test schemes are set up to simulate the aging environment in actual use under different conditions of electric field, humidity and temperature. The temperature range is -10℃ to 180℃, the humidity range is 20% to 98%, and the voltage range of the electric field is 0 to 40.5kV.

[0044] As described above, limiting the temperature range, humidity range, and voltage range further effectively simulates the real aging environment.

[0045] Furthermore, step S4 is followed by the following step:

[0046] S5. Based on the results of the accelerated aging test, verify the simulation accuracy of the multi-factor coupled aging model.

[0047] As described above, based on the results of accelerated aging tests, the accuracy of the simulation model can be verified, and the test conditions can be further optimized. Subsequently, the accelerated aging test scheme can be improved by adjusting the simulation parameters and experimental conditions, ultimately achieving rapid and effective aging prediction and testing.

[0048] This invention provides a multi-factor comprehensive aging simulation and experimental design method for epoxy resin, mainly applied to the evaluation of the aging performance of insulating materials. The following specific embodiments provide further details:

[0049] Please refer to Figure 1 Embodiment 1 of the present invention is as follows:

[0050] A multi-factor comprehensive aging simulation and experimental design method for epoxy resin, such as Figure 1 As shown, the steps include:

[0051] S1. Select electrical equipment components with different service lifespans, which can be 5, 10, 15 and 20 years. The electrical equipment components include AC transformers, contact boxes, busbars and supporting insulators, etc. Then, establish an orthogonal experimental table for physical and chemical property testing, conduct physical and chemical property tests, and obtain the macroscopic aging characteristic quantities of each test item.

[0052] That is, by selecting different electrical equipment components of different ages, the main factors affecting aging characteristics can be effectively determined, ensuring the reliability of the source of aging test simulation data.

[0053] S2. Construct a molecular dynamics model of cross-linked epoxy resin and introduce macroscopic aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, and establish a multi-factor coupled aging model under the combined effects of electricity, humidity and heat.

[0054] S3. In the multi-factor coupled aging model, molecular dynamics simulation software is used to simulate the aging behavior of epoxy resin under different aging conditions and obtain microscopic aging characteristic quantities.

[0055] S4. Design a multi-factor coupled epoxy resin aging test based on macroscopic and microscopic aging characteristics.

[0056] In this embodiment, aging characteristics of different electrical equipment components with varying service lives are obtained through physicochemical property testing. A molecular dynamics model of cross-linked epoxy resin is constructed to introduce these aging characteristics and simulate the microstructural changes of epoxy resin during the aging process, thereby establishing a multi-factor coupled aging model under the combined effects of electricity, humidity, and heat. Molecular dynamics simulation software is then used to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristics. Finally, by analyzing the results of physicochemical property testing and molecular dynamics microscopic aging, a combination of macroscopic testing and microscopic simulation is achieved, enabling the design of a multi-factor comprehensive epoxy resin aging test scheme. This facilitates the rapid and effective design of accelerated aging tests that more closely resemble actual natural aging, thereby improving the accuracy of epoxy resin aging tests, shortening test time, and better predicting the aging behavior of materials.

[0057] Please refer to Figures 2 to 6 Embodiment two of the present invention is as follows:

[0058] A multi-factor comprehensive aging simulation and experimental design method for epoxy resin, based on the above-described Example 1, in this example, as follows: Figure 2 As shown, the test items in step S1 include crosslinking degree, glass transition temperature, water absorption rate and dielectric constant.

[0059] In this embodiment, the degree of crosslinking, glass transition temperature, and water absorption rate are all obtained by differential scanning calorimetry, while the dielectric constant is obtained by high and low temperature dielectric property testing. That is, differential scanning calorimetry and high and low temperature dielectric property testing are used to accurately and efficiently obtain the degree of crosslinking, glass transition temperature, water absorption rate, and dielectric constant, thereby enabling the testing of physicochemical properties as different test parameters.

[0060] Before establishing the orthogonal experimental table for physicochemical property testing, it is necessary to determine the main factors affecting aging characteristics, including electrical equipment type, service life, ambient temperature, and degree of contamination. Each influencing factor has four levels. The table header design is shown in Table 1. Based on this, a four-factor, four-level orthogonal experimental table L is established. 16 (4 4 Establish an aging physicochemical property test dataset.

[0061] Table 1 Header Design

[0062] level Type A Operating years T Ambient temperature W Level of filth Z 1 <![CDATA[A1]]> <![CDATA[T1]]> <![CDATA[W1]]> <![CDATA[Z1]]> 2 <![CDATA[A2]]> <![CDATA[T2]]> <![CDATA[W2]]> <![CDATA[Z2]]> 3 <![CDATA[A3]]> <![CDATA[T3]]> <![CDATA[W3]]> <![CDATA[Z3]]> 4 <![CDATA[A4]]> <![CDATA[T4]]> <![CDATA[W4]]> <![CDATA[Z4]]>

[0063] Table 2 Orthogonal Experiment Table

[0064]

[0065]

[0066] The degree of crosslinking and glass transition temperature were tested using a differential scanning calorimeter, the water absorption rate was tested using an electronic balance, and the dielectric constant was tested using a high and low temperature dielectric property tester. These results are listed in columns 5, 6, 7, and 8 of Table 2, respectively.

[0067] Meanwhile, in this embodiment, molecular dynamics simulation technology is widely used in the field of materials science. It can simulate the behavior of materials in complex environments at the molecular level, providing new ideas for studying the aging mechanism of epoxy resin under the combined effects of moisture, heat and electricity. The molecular dynamics simulation software used in this embodiment is Materials Studio or Lammps, both of which are open-source software widely used in molecular dynamics simulation. They have multi-scale simulation capabilities, high performance and parallel computing capabilities, and can effectively realize the simulation of epoxy resin aging, so as to improve the accuracy of aging test, shorten the test time, and better predict the aging behavior of materials.

[0068] Because molecular dynamics simulations have very small timescales, typically femtoseconds or picoseconds, and very small spatial scales, usually at the nanometer level, the average crosslinking degree in Table 2 above is used as the ideal crosslinking degree to accelerate the aging process of the simulation model and improve its accuracy. This is based on the minimum water content W... min As the lower bound, the maximum value W maxAs the upper limit, six groups were evenly divided to construct six cross-linked epoxy resin models with different water contents.

[0069] In this embodiment, step S2 involves constructing a molecular dynamics model of the crosslinked epoxy resin, such as... Figure 3 As shown, specifically:

[0070] The reaction site of bisphenol A epoxy resin was set as R1, and the reaction site of triethylenetetramine curing agent was set as R2. After the bisphenol A epoxy resin and triethylenetetramine curing agent were subjected to a cyclic crosslinking reaction using a Perl crosslinking script to achieve the ideal degree of crosslinking, a molecular dynamics model of crosslinked epoxy resin was obtained.

[0071] That is, by using Perl crosslinking scripts to carry out cyclic crosslinking reactions, the ideal degree of crosslinking can be achieved.

[0072] Meanwhile, the microscopic aging characteristics in this embodiment include the free volume fraction (FFV) of the epoxy resin model, the mean square displacement (MSD) of the doped water molecules and cross-linked polymers, the interaction energy (E-ec) of the doped water molecules and cross-linked polymers, the cohesive energy density, and the system energy. Based on these microscopic aging characteristics, the motion behavior of water molecules and epoxy resin cross-linked products under multi-factor aging is analyzed, and the order of importance of electrical, moisture, and thermal factors on the degree of aging is analyzed. Simultaneously, the accuracy of the simulation is verified by combining microscopic and macroscopic aging characteristics. In this embodiment, as... Figure 3 The diagram shown is a simulation calculation result of this embodiment.

[0073] The epoxy resin aging behavior in step S3 includes the diffusion behavior of water molecules in the cross-linked polymer and the combined electro-humid-thermal aging behavior of the epoxy resin polymer.

[0074] Step S4 also includes:

[0075] Accelerated aging test schemes were set up to simulate the aging environment in actual use under different conditions of electric field, humidity and temperature. The temperature range was -10℃ to 180℃, the humidity range was 20% to 98%, and the voltage range of the electric field was 0 to 40.5kV.

[0076] This involves defining the temperature, humidity, and voltage ranges to more effectively simulate real aging environments.

[0077] The specific test plan is as follows Figure 6 As shown, the following can be used: Figure 5 The multi-factor coupled aging test platform shown in the figure is executed in the following specific steps:

[0078] (1) The temperature in the climate test chamber rises from 15℃ to 85℃ within 2 hours, is maintained at 85℃ for 1 hour, and then drops from 85℃ to 15℃ within 2 hours, and is maintained at 15℃ for another 1 hour. During this period, factors such as electricity (40.5kV), humidity (relative humidity greater than 95%), pollution (salt spray), and mechanical stress (busbars) are applied simultaneously. One temperature alternation cycle is 6 hours, and 20 cycles are carried out continuously, for a total of 120 hours (5 days), which is called Cycle A.

[0079] (2) After cycle A ends, stop the temperature alternation and allow the temperature in the climate chamber to gradually return to room temperature from 15℃, maintaining this temperature for 48 hours (2 days). During this period, apply factors such as electricity (40.5kV), humidity (relative humidity greater than 95%), pollution (salt spray), and mechanical stress (busbars). This is cycle B.

[0080] (3) After cycle B ends, within 24 hours (1 day), the sample is tested for partial discharge, withstand voltage, etc. at room temperature. This is test C.

[0081] The above A cycle + B cycle + C test constitutes one experimental cycle, which takes a total of 8 days.

[0082] (4) Repeat the aging test for 5 test cycles in the above manner, for a total of 40 days.

[0083] (5) After the fifth aging test cycle is completed, the sample shall be subjected to partial discharge and power frequency withstand voltage tests in accordance with the requirements of 2.4 and 2.5.

[0084] In addition, in this embodiment, step S4 is followed by the following step:

[0085] S5. Based on the results of accelerated aging tests, verify the simulation accuracy of the multi-factor coupled aging model.

[0086] Based on the results of accelerated aging tests, the accuracy of the simulation model is verified, and the test conditions are further optimized. Subsequently, the accelerated aging test scheme can be improved by adjusting the simulation parameters and experimental conditions, ultimately achieving rapid and effective aging prediction and testing.

[0087] In summary, this invention provides a multi-factor comprehensive aging simulation and experimental design method for epoxy resin. Through physicochemical property testing, it obtains aging characteristic quantities of different electrical equipment components with varying service lives. A molecular dynamics model of cross-linked epoxy resin is constructed to introduce these aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, thereby establishing a multi-factor coupled aging model under the combined effects of electricity, humidity, and heat. Molecular dynamics simulation software is used to simulate the aging behavior of epoxy resin under different aging conditions, obtaining microscopic aging characteristic quantities. Finally, by analyzing the results of physicochemical property testing and molecular dynamics microscopic aging, a combination of macroscopic testing and microscopic simulation is achieved, jointly designing a multi-factor comprehensive epoxy resin aging test scheme. This facilitates the rapid and effective design of accelerated aging tests that more closely resemble actual natural aging, thereby improving the accuracy of epoxy resin aging tests, shortening test time, and better predicting the aging behavior of materials.

[0088] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. An epoxy resin multi-factor comprehensive aging simulation and test design method, characterized in that, The method comprises the steps of: S1, selecting electrical equipment components with different service life, establishing an orthogonal experiment table for physicochemical property testing, performing physicochemical property testing, and obtaining macro aging characteristic quantities of each test content; the test content includes crosslinking degree, glass transition temperature, water absorption rate and dielectric constant; S2, constructing a crosslinked epoxy resin molecular dynamics model, introducing the macro aging characteristic quantities to simulate the microstructure changes of the epoxy resin in the aging process, and establishing a multi-factor coupling aging model under the combined action of electricity, moisture and heat; S3, simulating the aging behavior of the epoxy resin under different aging conditions in the multi-factor coupling aging model by using a molecular dynamics simulation software to obtain micro aging characteristic quantities; S4, designing a multi-factor coupling epoxy resin aging test based on the macro aging characteristic quantities and the micro aging characteristic quantities; In the step S2 of constructing the crosslinked epoxy resin molecular dynamics model, specifically: The reaction sites of bisphenol A epoxy resin are R1, and the reaction sites of triethylenetetramine curing agent are R2. After the cyclic crosslinking reaction of bisphenol A epoxy resin and triethylenetetramine curing agent is performed to achieve an ideal crosslinking degree by using a Perl crosslinking script, the crosslinked epoxy resin molecular dynamics model is obtained; The average crosslinking degree of the orthogonal experiment table is used as the ideal crosslinking degree, the minimum value Wmin of the water content is used as the lower limit, and the maximum value Wmax of the water content is used as the upper limit to construct the crosslinked epoxy resin molecular dynamics model with different water contents.

2. The method according to claim 1, wherein, In the step S1 of selecting electrical equipment components with different service life, specifically: The AC mutual inductor, contact box, busbar and support insulator with service life of 5 years, 10 years, 15 years and 20 years are selected.

3. The method of claim 1, wherein the method is characterized by: Before the step S1 of establishing the orthogonal experiment table for physicochemical property testing, further comprising: Determining the main factors affecting the aging characteristic quantities, including the type of electrical equipment, service life, environmental temperature and contamination degree.

4. The method of claim 1, wherein the method is characterized by: The crosslinking degree, the glass transition temperature and the water absorption rate are obtained by differential scanning calorimetry, and the dielectric constant is obtained by high-low temperature dielectric property tester; The orthogonal experiment table is a four-factor four-level orthogonal table L 16 (4 4 ).

5. The method of claim 1, wherein the method is characterized by: The molecular dynamics simulation software is Materials Studio software or Lammps software.

6. The method of claim 1, wherein the method is characterized by: The micro aging characteristic quantities include the free volume fraction of the epoxy resin model, the mean square displacement of the doped water molecules and the crosslinked polymer, the interaction energy of the doped water molecules and the crosslinked polymer, the cohesive energy density and the energy of the system.

7. The method of claim 1, wherein the method is characterized by: The epoxy resin aging behavior in the step S3 includes: The diffusion behavior of water molecules in the crosslinked polymer and the electricity-moisture-heat comprehensive aging behavior of the epoxy resin polymer.

8. The method of claim 1, wherein the method is characterized by: In the step S4, further comprising: According to different conditions of electric field, humidity and temperature, the aging environment in actual use is simulated, and an accelerated aging test scheme is set, the temperature range is -10℃-180℃, the humidity range is 20%-98%, and the voltage range of the electric field is 0-40.5kV.

9. The method of claim 8, wherein the method is characterized by, After the step S4, further comprising the step of: S5, verifying the simulation accuracy of the multi-factor coupling aging model according to the accelerated aging test results.

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