Heat dissipation device for vehicle-mounted domain controller wire chip

Abstract

According to the heat dissipation device for the vehicle-mounted domain controller wire chip, an upper metal film is arranged above a lower metal film in parallel, an upper piezoelectric ceramic piece is arranged on the upper side of the upper metal film, and the lower surface of the upper piezoelectric ceramic piece is connected with the upper surface of the upper metal film; the upper surface and the lower surface of the upper piezoelectric ceramic piece are connected with the two ends of a first positive and negative electrode convertible power source through wires respectively. An inverse piezoelectric effect principle is adopted, the bending vibration direction of the metal films is controlled, an air suction and compression area is formed by the upper metal film and the lower metal film, the vibration direction, magnitude and frequency are controlled by controlling the magnitude, direction and frequency of voltage, air ejected at a high speed forms strong convection to dissipate heat of a chip, and the heat dissipation efficiency of the chip is improved. Under the condition of same power consumption, the radiating effect is higher than that of a fan by more than 30%, the radiating reliability of the chip is improved, the service life of the chip is prolonged, and noise is reduced.

Description

Technical Field

[0001] The present invention relates to the field of physics, and in particular to chip heat dissipation technology, in particular to a heat dissipation device for a vehicle-mounted domain controller line chip. Background Art

[0002] The functions of the vehicle-mounted domain controller are increasing, and the power consumption and heat generated by its chips are constantly increasing. In the existing technology, the natural heat dissipation method can no longer meet the requirements of chip heat dissipation. Therefore, medium-power chips currently use fans for heat dissipation, and high-power chips use multiple fans for heat dissipation at the same time or water cooling. However, the heat dissipation effect of the fan is not good enough, and there are also problems such as high noise and short life. It is easy to cause dust accumulation, which reduces chip performance. In addition, there is a hysteresis effect of air when the fan blows air to the fins. The flow rate in the boundary layer is relatively low, which affects the heat exchange coefficient and requires relatively high power consumption. Although the effect of water cooling is better than that of air cooling, it requires the introduction of coolant, and there is a risk of leakage and corrosion during long-term use. Summary of the invention

[0003] The object of the present invention is to provide a heat dissipation device for a vehicle-mounted domain controller line chip, and the heat dissipation device for a vehicle-mounted domain controller line chip is to solve the technical problem in the prior art that the domain controller uses a fan for heat dissipation that is not effective enough.

[0004] A heat dissipation device for a vehicle-mounted domain controller line chip of the present invention comprises a shell, at least two air outlets are arranged at intervals at the bottom of the shell, an upper cover is arranged on the shell, at least two air inlet holes are arranged at intervals in the middle of the upper cover, at least one piezoelectric sheet fixing seat is arranged in the shell, any piezoelectric sheet fixing seat each comprises two support seats, an upper metal film and a lower metal film are arranged between the two support seats, the upper metal film is arranged in parallel above the lower metal film, the upper metal film is located below the air inlet hole, the lower metal film is located on the upper side of the air outlet hole and closes the air outlet hole, an upper piezoelectric ceramic sheet is arranged on the upper side of the upper metal film, the lower surface of the upper piezoelectric ceramic sheet is connected to the upper surface of the upper metal film, the upper surface and the lower surface of the upper piezoelectric ceramic sheet are respectively connected to the two ends of a first positive-negative convertible power supply through wires, a lower piezoelectric ceramic sheet is arranged on the upper side of the lower metal film, the lower surface of the lower piezoelectric ceramic sheet is connected to the upper surface of the lower metal film, the upper surface and the lower surface of the upper piezoelectric ceramic sheet are respectively connected to the two ends of a second positive-negative convertible power supply through wires.

[0005] Furthermore, the number of the piezoelectric piece fixing seats is two.

[0006] Furthermore, the lower side of the air inlet is covered with a dustproof cloth.

[0007] Compared with the prior art, the present invention has a positive and obvious effect. The present invention adopts the principle of the reverse piezoelectric effect to control the bending vibration direction of the metal film, uses the upper metal film and the lower metal film to form the air suction and compression area, controls the direction, magnitude and frequency of the vibration by controlling the magnitude, direction and frequency of the voltage, and the high-speed air ejected forms a strong convection to dissipate heat for the chip. Under the same power consumption, the heat dissipation effect is more than 30% higher than that of the fan, improves the reliability of chip heat dissipation, increases the service life of the chip, and reduces noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 The present invention is a three-dimensional schematic diagram of a heat dissipation device for a vehicle-mounted domain controller line chip.

[0009] Figure 2 The present invention is a cross-sectional schematic diagram of a heat dissipation device for a vehicle-mounted domain controller line chip in a first usage state.

[0010] Figure 3 The present invention is a cross-sectional schematic diagram of a heat dissipation device for a vehicle-mounted domain controller line chip in a second usage state.

[0011] Figure 4 The present invention is a cross-sectional schematic diagram of a heat dissipation device for a vehicle-mounted domain controller line chip in a third usage state. DETAILED DESCRIPTION

[0012] The present invention is further described below in conjunction with an embodiment, but the present invention is not limited to the embodiment, and any similar structure and similar changes of the present invention should be included in the protection scope of the present invention. The use of directions such as up, down, front, back, left, and right in the present invention is only for the convenience of description and is not a limitation of the technical solution of the present invention.

[0013] like Figure 1-Figure 4As shown, a heat dissipation device for a vehicle-mounted domain controller line chip of the present invention comprises a shell 1, at least two air outlet holes 2 are arranged at intervals at the bottom of the shell 1, an upper cover 3 is arranged on the shell 1, at least two air inlet holes 4 are arranged at intervals in the upper cover 3, at least one piezoelectric sheet fixing seat is arranged in the shell 1, any piezoelectric sheet fixing seat each comprises two support seats 5, an upper metal film 6 and a lower metal film 7 are arranged between the two support seats 5, the upper metal film 6 is arranged in parallel above the lower metal film 7, the upper metal film 6 is located below the air inlet hole 4, and the lower metal film 7 is located above the outlet. The upper side of the air hole 2 closes the air outlet 2, an upper piezoelectric ceramic sheet 8 is arranged on the upper side of the upper metal film 6, the lower surface of the upper piezoelectric ceramic sheet 8 is connected to the upper surface of the upper metal film 6, the upper surface and the lower surface of the upper piezoelectric ceramic sheet 8 are respectively connected to the two ends of a first positive-negative switchable power supply (not shown in the figure) through wires, and a lower piezoelectric ceramic sheet 9 is arranged on the upper side of the lower metal film 7, the lower surface of the lower piezoelectric ceramic sheet 9 is connected to the upper surface of the lower metal film 7, and the upper surface and the lower surface of the upper piezoelectric ceramic sheet 8 are respectively connected to the two ends of a second positive-negative switchable power supply (not shown in the figure) through wires.

[0014] Furthermore, the number of the piezoelectric piece fixing seats is two.

[0015] Furthermore, the lower side of the air inlet 4 is covered with a dustproof cloth 11 .

[0016] Specifically, the metal film, piezoelectric ceramic sheet, positive-negative switchable power supply, dustproof cloth 11, etc. in this embodiment all adopt well-known solutions in the prior art, which are well known to those skilled in the art and will not be described in detail here.

[0017] The working principle of this embodiment: The air outlet 2 of the present invention is installed above the chip 10. When working, Figure 2 As shown in FIG. 1 , when the upper piezoelectric ceramic sheet 8 and the lower piezoelectric ceramic sheet 9 are not powered, no airflow is generated. Figure 3 As shown, the first positive-negative convertible power source applies a negative voltage on the upper piezoelectric ceramic sheet 8, and according to the principle of the inverse piezoelectric effect, the upper piezoelectric ceramic sheet 8 is deformed to drive the upper metal film 6 to bend downward, and the lower piezoelectric ceramic sheet 9 is applied with a positive voltage on the upper side and a negative voltage on the lower side, and the lower piezoelectric ceramic sheet 9 is deformed to drive the lower metal film 7 to bend upward, thereby forming a high-pressure area in region A 12 (the area between the upper metal film 6 and the lower metal film 7), and a low-pressure area in region B 13 (the area above the upper metal film 6) and region C 14 (the area below the lower metal film 7). Region A 12 inhales fresh air from the outside through the air inlet 4, and the air in the high-pressure area drives the air in the low-pressure area to be ejected from the air outlet 2 at high speed, hitting the chip 10 to form a strong convection, thereby cooling the chip 10. Then, as Figure 4As shown, the second positive-negative convertible power supply is stopped, the voltage of the lower piezoelectric ceramic sheet 9 is cut off, the lower piezoelectric ceramic sheet 9 recovers its deformation, and the air outlet 2 is closed. Then, the first positive-negative convertible power supply loads the upper piezoelectric ceramic sheet 8 with a positive voltage on the top and a negative voltage on the bottom. The upper piezoelectric ceramic sheet 8 drives the upper metal film 6 to bend upward, and the A area 12 forms a high-pressure area, and the B area 13 forms a low-pressure area. The high-pressure A area 12 drives the air to fill the low-pressure B area 13, preparing for the next air injection. In this way, the bending vibration of the upper metal film 6 and the lower metal film 7 is controlled repeatedly to realize the continuous injection of high-speed air to form a strong convection to cool the chip 10.

[0018] The present invention adopts the principle of the inverse piezoelectric effect to control the bending vibration direction of the metal film, uses the upper metal film 6 and the lower metal film 7 to form an air intake and compression area, and controls the direction, magnitude and frequency of the vibration by controlling the magnitude, direction and frequency of the voltage. The high-speed ejected air forms a strong convection to dissipate the heat of the chip 10. Under the same power consumption, the heat dissipation effect is more than 30% higher than that of the fan, thereby improving the reliability of the heat dissipation of the chip 10, increasing the service life of the chip 10, and reducing noise.

Claims

1. A heat dissipation device for a vehicle-mounted domain controller line chip, characterized in that: It includes a shell, at least two air outlets are arranged at intervals at the bottom of the shell, an upper cover is arranged on the shell, at least two air inlet holes are arranged at intervals in the middle of the upper cover, at least one piezoelectric sheet fixing seat is arranged in the shell, any piezoelectric sheet fixing seat each includes two support seats, an upper metal film and a lower metal film are arranged between the two support seats, the upper metal film is arranged in parallel above the lower metal film, the upper metal film is located below the air inlet hole, the lower metal film is located on the upper side of the air outlet and closes the air outlet hole, an upper piezoelectric ceramic sheet is arranged on the upper side of the upper metal film, the lower surface of the upper piezoelectric ceramic sheet is connected to the upper surface of the upper metal film, the upper surface and the lower surface of the upper piezoelectric ceramic sheet are respectively connected to the two ends of a first positive-negative convertible power supply through wires, a lower piezoelectric ceramic sheet is arranged on the upper side of the lower metal film, the lower surface of the lower piezoelectric ceramic sheet is connected to the upper surface of the lower metal film, the upper surface and the lower surface of the upper piezoelectric ceramic sheet are respectively connected to the two ends of a second positive-negative convertible power supply through wires.

2. The heat dissipation device for a vehicle-mounted domain controller line chip according to claim 1, characterized in that: The number of the piezoelectric sheet fixing seats is two.

3. The heat dissipation device for a vehicle-mounted domain controller line chip according to claim 1, characterized in that: The lower side of the air inlet is covered with a dustproof cloth.

Images