Method, device and equipment for tinning screw posts on printed circuit boards

Abstract

The present invention provides a method, device, and equipment for tinning screw posts on a printed circuit board, which belongs to the technical field of circuit board production and solves the problems of low tinning efficiency, uneven tin liquid coating, and easy pollution of screw posts on a printed circuit board. The method includes: providing a printed circuit board; obtaining solder paste data of the printed circuit board; obtaining coordinate data and contour data of multiple screw posts; obtaining solder paste supply data based on the contour data and solder paste data; controlling the heating device of the tinning equipment to heat the solder paste and detect the temperature of the solder paste to obtain temperature data based on the solder paste data; controlling the translation of the workbench of the tinning equipment based on the temperature data and coordinate data, and controlling the coating device of the tinning equipment to tin multiple screw posts of the printed circuit board fixed on the workbench based on the solder paste supply data. This solution achieves rapid and uniform tinning of the screw posts, improves production efficiency, and reduces pollution.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board manufacturing, in particular to a method, device and equipment for tinning screw posts on a printed circuit board. Background Art

[0002] In the assembly process of electronic products, PCBA (Printed Circuit Board Assembly) is a core component, and its manufacturing quality and efficiency directly impact the performance and reliability of the final product. Tinning of screw posts, key structures on PCBAs that secure other components or the housing, is a crucial step. Tinning, or applying solder, strengthens the connection between the screw posts and the screws or other metal parts, ensuring they resist loosening over time while also providing good electrical conductivity.

[0003] Traditional manual tinning relies on the operator's technical proficiency and physical condition, making it difficult to achieve fast and continuous operations. In the environment of large-scale production of electronic products, manual operation will significantly slow down the speed of the entire production line and increase production costs. At the same time, manual operation cannot ensure that the amount of solder applied each time is completely consistent. This may result in excessive solder in certain parts of the screw column, causing waste and possibly affecting the subsequent assembly accuracy; while other parts may not have enough solder, affecting the firmness of the connection and the conductivity. During manual operation, the operator's hands, tools or surrounding environment may become a source of contamination, introducing dust, grease or other impurities. These pollutants may produce poor solder joints during the soldering process and reduce product reliability. In addition, solder fumes are also harmful to human health. Manual operation increases the risk of operators being exposed to these harmful substances. Summary of the Invention

[0004] The invention provides a method, device and equipment for tinning screw posts of a printed circuit board, which solve the problems of low tinning efficiency, uneven coating of tin liquid and easy pollution of screw posts of a printed circuit board.

[0005] In order to solve the above technical problems, the technical solutions of the present invention are as follows:

[0006] An embodiment of the present invention provides a method for tinning screw posts on a printed circuit board, comprising:

[0007] A printed circuit board is provided, wherein a plurality of screw columns are provided on the printed circuit board;

[0008] Obtaining solder paste data of the printed circuit board;

[0009] Acquiring coordinate data and contour data of the plurality of screw columns;

[0010] Obtaining solder paste supply data according to the profile data and the solder paste data;

[0011] According to the solder paste data, controlling a heating device of a tinning device to heat the solder paste and detecting a temperature of the solder paste to obtain temperature data;

[0012] The workbench of the tinning equipment is controlled to translate according to the temperature data and the coordinate data, and the coating device of the tinning equipment is controlled to tin the multiple screw columns of the printed circuit board fixed on the workbench according to the solder paste supply data.

[0013] Optionally, obtaining solder paste data of the printed circuit board includes:

[0014] According to the design model of the printed circuit board, solder paste data of the printed circuit board is obtained, where the solder paste data includes at least one of composition data, melting point data, and viscosity data of the solder paste.

[0015] Optionally, obtaining coordinate data and contour data of the plurality of screw columns includes:

[0016] The printed circuit board is scanned and identified by a scanning device of the tinning equipment to obtain coordinate data and contour data of a plurality of screw columns.

[0017] Optionally, obtaining solder paste supply data according to the profile data and the solder paste data includes:

[0018] Obtaining solder paste supply volume data according to the profile data;

[0019] Solder paste supply pressure data is obtained based on the viscosity data.

[0020] Optionally, controlling the translation of a workbench of the tinning equipment according to the temperature data and the coordinate data, and controlling a coating device of the tinning equipment to tin the plurality of screw columns of the printed circuit board fixed on the workbench according to the solder paste supply data, includes:

[0021] When the temperature data is greater than the melting point data, controlling the translation of the workbench of the tinning equipment according to the coordinate data to obtain workbench translation data;

[0022] When the workbench translation data reaches a preset value, the coating device is controlled to apply pressure to the tin liquid to tin the multiple screw columns of the printed circuit board fixed on the workbench, wherein the pressure value applied to the tin liquid is determined by the solder paste supply pressure data, and the tin liquid flow rate for tinning the screw columns is determined by the solder paste supply volume data.

[0023] An embodiment of the present invention further provides a tinning device for screw posts on a printed circuit board, comprising:

[0024] base;

[0025] A workbench motor is provided on the first surface of the base;

[0026] a workbench movably connected to the workbench motor, wherein the workbench is driven by the workbench motor to translate along the first surface of the base;

[0027] a bracket fixedly connected to the base;

[0028] The top of the bracket is provided with a scanning device and a coating device on a surface close to the base;

[0029] A heating device connected to the coating device via a tin feeding tube;

[0030] Among them, the tinning device for the screw columns of the printed circuit board obtains the solder paste data of the printed circuit board, and scans and identifies the printed circuit board through a scanning device to obtain coordinate data and contour data of multiple screw columns; obtains solder paste supply data based on the contour data and the solder paste data; controls the heating device to heat the solder paste and detects the temperature of the solder paste based on the solder paste data to obtain temperature data; controls the translation of the workbench based on the temperature data and the coordinate data, and controls the coating device to tin the multiple screw columns of the printed circuit board fixed on the workbench based on the solder paste supply data.

[0031] Optionally, the coating device includes:

[0032] An upper tin rod, wherein a rack is provided on the outside of the upper tin rod, a pipe for passing tin liquid is provided on the inside of the upper tin rod, a first port of the pipe is connected to a tin coating port provided at the bottom of the upper tin rod, the tin coating port is provided with a valve, and a second port of the pipe is connected to the tin feeding pipe;

[0033] A coating motor is fixedly connected to the top surface of the bracket close to the base, and a gear is provided at the output end of the coating motor, and the gear is meshed with the upper tin rod rack;

[0034] A driving pump is provided between the second port of the pipeline and the tin feeding tube.

[0035] An embodiment of the present invention further provides a computing device, comprising: a processor and a memory storing a computer program, wherein the computer program executes the above method when executed by the processor.

[0036] An embodiment of the present invention further provides a computer-readable storage medium storing instructions, which, when executed on a computer, enable the computer to execute the above method.

[0037] An embodiment of the present invention further provides a printed circuit board with screw columns, wherein the printed circuit board is manufactured by the above method.

[0038] The technical solution of the present invention includes at least the following effects:

[0039] The above-mentioned scheme of the present invention provides a printed circuit board, which is provided with multiple screw columns; obtains solder paste data of the printed circuit board; obtains coordinate data and contour data of the multiple screw columns; obtains solder paste supply data based on the contour data and solder paste data; controls the heating device of the tinning equipment to heat the solder paste and detect the temperature of the solder paste according to the solder paste data to obtain temperature data; controls the translation of the workbench of the tinning equipment according to the temperature data and coordinate data, and controls the coating device of the tinning equipment to tin the multiple screw columns of the printed circuit board fixed on the workbench according to the solder paste supply data, thereby solving the problems of low tinning efficiency, uneven coating of tin liquid, and easy pollution of the screw columns of the printed circuit board, realizing rapid and uniform tinning of the screw columns, improving production efficiency, and reducing pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a flow chart of a method for tinning screw posts on a printed circuit board provided by an embodiment of the present invention;

[0041] Figure 2 This is a structural diagram of a tinning device for printed circuit board screw posts provided by an embodiment of the present invention;

[0042] Figure 3 is a schematic diagram of the structure of a computing device provided by an embodiment of the present invention;

[0043] Among them, 1. Base; 2. Workbench motor; 3. Workbench; 4. Bracket; 5. Scanning device; 6. Tin feeding tube; 7. Heating device; 8. Printed circuit board; 9. Tin rod; 10. Tin coating port; 11. Valve; 12. Coating motor; 13. Drive pump. DETAILED DESCRIPTION

[0044] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0045] like Figure 1 As shown, an embodiment of the present invention provides a method for tinning screw posts on a printed circuit board, comprising:

[0046] Step 11, providing a printed circuit board, wherein a plurality of screw columns are provided on the printed circuit board;

[0047] Step 12, obtaining solder paste data of the printed circuit board;

[0048] Step 13, obtaining coordinate data and contour data of the plurality of screw columns;

[0049] Step 14, obtaining solder paste supply data according to the contour data and the solder paste data;

[0050] Step 15: Controlling a heating device of a tinning device to heat the solder paste and detecting the temperature of the solder paste according to the solder paste data to obtain temperature data;

[0051] Step 16: Control the translation of the workbench of the tinning equipment according to the temperature data and the coordinate data, and control the coating device of the tinning equipment to tin the multiple screw columns of the printed circuit board fixed on the workbench according to the solder paste supply data.

[0052] In this embodiment, a printed circuit board that needs to be tinned with screw columns is first prepared. The printed circuit board is a component of an electronic product and is pre-designed and installed with multiple screw columns. The screw columns are used for the subsequent installation of other electronic components or mechanical fixation to ensure the stability and reliability of the entire electronic system; through professional testing equipment or software tools, relevant information about the solder paste used for the printed circuit board is obtained; the solder paste data includes physical and chemical properties such as the composition of the solder paste (such as the ratio of metals such as tin, lead, and silver), viscosity, and melting point; different solder paste properties will affect the quality and effect of tinning, for example, viscosity will affect the fluidity and coating uniformity of the solder paste, and the melting point will determine the control range of the heating temperature; using high The high-precision scanning measurement equipment measures multiple screw columns on the printed circuit board; the coordinate data is used to determine the exact position of each screw column on the printed circuit board, expressed in the form of two-dimensional coordinates; the contour data describes the shape, size and surface characteristics of the screw column; the coordinate data and contour data provide precise positioning information for the operation of the tinning equipment, ensuring that the solder paste can be accurately coated on each screw column to avoid problems such as tin leakage and tin bias; the obtained screw column contour data and solder paste data are comprehensively analyzed, and the parameters such as the amount of solder paste, coating speed, coating pressure, etc. required for each screw column are calculated based on the shape, size and surface characteristics of the screw column, combined with the viscosity, particle size and other characteristics of the solder paste. These parameters Together they constitute the solder paste supply data; through calculation and analysis, the supply parameters that are most suitable for the current screw column and solder paste combination are determined to ensure that the solder paste can be evenly and appropriately coated on the screw column, thereby improving the quality and consistency of tinning; the tinning equipment is equipped with a special heating device, which accurately controls the temperature of the heating device according to the previously acquired solder paste data, so that the solder paste reaches the appropriate heating state; at the same time, the temperature of the solder paste is monitored in real time using a temperature sensor, and the temperature data is fed back to the control system; the appropriate heating temperature can ensure that the solder paste has good fluidity and coating performance. Through precise temperature control and real-time monitoring, the solder paste can be kept in the best state during the coating process to avoid deterioration of the solder paste due to excessively high temperature or excessively low temperature. Leading to problems such as insufficient fluidity; the workbench of the tinning equipment can be accurately translated according to the acquired temperature data and coordinate data; the temperature data ensures that the coating operation is performed under appropriate temperature conditions, while the coordinate data guides the workbench to move each screw column on the printed circuit board in turn to directly under the coating device; the coating device accurately controls the solder paste supply amount, coating speed, coating pressure and other parameters based on the solder paste supply data calculated previously, and evenly coats the solder paste on each screw column; through precise workbench translation and coating device control, efficient and precise tinning of multiple screw columns on the printed circuit board is achieved, ensuring that each screw column can obtain a good tinning effect to meet the quality and performance requirements of electronic products.

[0053] The above-mentioned embodiment proposed by the present invention solves the problems of low tinning efficiency, uneven tin liquid coating, and easy pollution of printed circuit board screw columns, realizes rapid and uniform tinning of the screw columns, improves production efficiency, and reduces pollution.

[0054] In an optional embodiment of the present invention, step 12 may include:

[0055] Step 121 : Acquire solder paste data of the printed circuit board according to the design model of the printed circuit board, wherein the solder paste data includes at least one of composition data, melting point data, and viscosity data of the solder paste.

[0056] In this embodiment, the PCB design model is a digital file generated during the electronics design process, containing information such as the detailed structure, layout, and electrical connections of the PCB. Common design model file formats include Gerber files and ODB++ files, and these files are typically generated by professional electronic design automation (EDA) software. The design model is the foundation of PCB manufacturing and assembly, accurately describing various parameters of the PCB. In this process, the design model is the source for obtaining solder paste data, as different PCB designs have different requirements for solder paste properties. Specific methods for obtaining solder paste data include extracting it from the design model or obtaining it from reference design documents and specifications. For areas with specific process requirements, the design model will indicate the use of solder paste with a specific composition, melting point, or viscosity. In addition to the design model itself, related design documents also contain solder paste requirements. For example, the design specification will clearly state that a solder paste with a specific composition or melting point is required to ensure the performance and reliability of the PCB. Standards and specifications will provide recommendations for solder paste selection based on different application scenarios and PCB types. For example, for high-density interconnect (HDI) PCBs, a low-viscosity solder paste is required to ensure uniform coating.

[0057] Solder paste typically consists of metallic elements such as tin, lead, silver, and copper, as well as additives such as flux. For example, a common solder paste composition is a eutectic alloy of 63% tin and 37% lead, while lead-free solder paste contains 96.5% tin, 3% silver, and 0.5% copper. Different compositions affect the electrical and mechanical properties of the solder paste, as well as the soldering quality. For example, silver-containing solder paste offers improved conductivity and oxidation resistance, but is relatively expensive. Lead-free solder paste meets environmental requirements, but the soldering process requires corresponding adjustments. The melting point refers to the temperature at which the solder paste transitions from solid to liquid, and different types of solder paste have different melting points. For example, the melting point of lead solder paste is generally around 183°C, while the melting point of lead-free solder paste is typically between 217 and 221°C. The melting point is a key parameter to consider when selecting solder paste, as it determines the heating temperature during the soldering process. If the melting point is too high, the soldering time will be too long, increasing the risk of component damage. If the melting point is too low, the solder joints may become loose during subsequent use. Viscosity reflects the flow properties of solder paste, generally expressed in Pa·s. Different types of solder paste have different viscosity ranges. Viscosity directly affects the solder paste's coating quality. Proper viscosity ensures uniform coating of the solder paste on the PCB pads during printing, preventing issues like missing prints and fins. If the viscosity is too high, the solder paste will flow poorly, making it difficult to apply evenly. If the viscosity is too low, the solder paste will flow during printing, resulting in irregular solder joint shapes. The collected solder paste data is used to guide the actual PCB production process; for example, the solder paste's melting point and composition can be used to determine the soldering equipment's heating temperature profile and soldering time.

[0058] In an optional embodiment proposed by the present invention, step 13 may include:

[0059] Step 131 , scanning and identifying the printed circuit board by a scanning device of the tinning equipment to obtain coordinate data and contour data of a plurality of screw columns.

[0060] In this embodiment, the printed circuit board is divided into several scanning areas according to the size of the printed circuit board and the distribution of the screw columns; the scanning device scans each area in turn according to a predetermined scanning strategy, such as line-by-line scanning or spiral scanning; during the scanning process, the optical sensor collects image data of each area in real time; in order to improve scanning efficiency and accuracy, multi-frame image acquisition and stitching technology can be used to stitch images of multiple small areas into a complete circuit board image; the collected original image is preprocessed, including denoising, contrast enhancement and other operations; denoising can eliminate interference signals in the image, and contrast enhancement can make features such as screw columns more obvious, facilitating subsequent feature extraction; image processing algorithms, such as edge detection and contour tracking, are used to extract the contour information of the screw columns from the preprocessed image; at the same time, the coordinate position of each screw column on the circuit board is determined through the reference points and coordinate system in the image. Coordinate data is used to describe the precise location of each screw stud on the printed circuit board (PCB) and is represented using a two-dimensional coordinate system. For example, on a two-dimensional plane, the center position of the screw stud is represented by (x, y) coordinates. Accurate coordinate data provides precise positioning information for the coating device of the tinning equipment, ensuring that solder paste is accurately coated on each screw stud. Contour data describes the shape, size, and surface features of the screw stud. The contour boundary of the screw stud can be represented by a series of point coordinates, or the shape of the screw stud can be described by geometric parameters (such as diameter and radius). Contour data helps the tinning equipment adjust the operating parameters of the coating device, such as the coating range and coating pressure, according to the actual shape and size of the screw stud to ensure that the solder paste can evenly cover the surface of the screw stud, thereby improving the quality and consistency of the tinning. After scanning, the acquired coordinate and contour data must be verified by comparing with a pre-designed circuit board model or using sampling inspection to ensure data accuracy and reliability.

[0061] In an optional embodiment of the present invention, step 14 may include:

[0062] Step 141, obtaining solder paste supply volume data according to the profile data;

[0063] Step 142: Obtain solder paste supply pressure data based on the viscosity data.

[0064] In this embodiment, the theoretical supply volume of solder paste is calculated based on the shape and size of the screw post. At the same time, in order to ensure that the solder paste can fully cover the surface of the screw post and form a good solder joint, it is usually necessary to add a certain coating margin on top of the theoretical volume. The size of the coating margin depends on factors such as the fluidity of the solder paste and the accuracy of the printing process. Specifically, according to:

[0065] , get solder paste supply volume data;

[0066] Where V is the solder paste supply volume data, D is the screw column diameter, H is the solder joint target height, K is the reflow shrinkage compensation coefficient, and:

[0067]

[0068] Wherein, α is the thermal expansion coefficient, ΔT is the difference between the peak temperature and room temperature, β is the volatility correction factor, which is generally 0.85-0.95, and is taken as 0.9 in this example, and ζ is the process correction factor, which is generally 1.05-1.1, and is taken as 1.05 in this example;

[0069] The viscosity of solder paste reflects its flow properties. The higher the viscosity, the worse the solder paste's fluidity, requiring greater pressure to pass smoothly through the nozzle of the coating device and evenly coat the screw stud. Conversely, the lower the viscosity, the better the solder paste's fluidity, requiring a relatively smaller supply pressure. At the same time, appropriate supply pressure ensures the stability and consistency of the solder paste during the coating process. If the pressure is too low, the solder paste may not fully fill the surface of the screw stud, resulting in insufficient soldering. If the pressure is too high, the solder paste may splash or be unevenly coated, affecting the quality of soldering. Specifically, according to:

[0070] , get the dynamic flow of solder paste;

[0071] Among them, Q is the dynamic flow rate of solder paste after liquefaction, ρ is the density of solder paste after liquefaction, η is the viscosity of solder paste after liquefaction, and t is the tinning time; according to:

[0072] , get solder paste supply pressure data;

[0073] Where P is the solder paste supply pressure data, a is the tin liquid characteristic coefficient, a=ρ / 2, k is the friction loss coefficient, k=f·L / D1, f is the roughness of the tin feed pipe, L is the tin feed pipe length, D1 is the tin feed pipe diameter, v is the tin liquid flow rate, v=Q / S, S is the cross-sectional area of ​​the tin feed pipe, S=π(D1 / 2) 2 .

[0074] In an optional embodiment of the present invention, step 16 may include:

[0075] Step 161, when the temperature data is greater than the melting point data, controlling the workbench translation of the tinning equipment according to the coordinate data to obtain workbench translation data;

[0076] Step 162, when the workbench translation data reaches a preset value, control the coating device to apply pressure to the tin liquid to tin the multiple screw columns of the printed circuit board fixed on the workbench, wherein the pressure value applied to the tin liquid is determined by the solder paste supply pressure data, and the tin liquid flow rate for tinning the screw columns is determined by the solder paste supply volume data.

[0077] In this embodiment, the solder paste has a specific melting point. Only when the temperature reaches or exceeds the melting point will the solder paste change from solid to liquid, and have good fluidity and coating performance; therefore, the conditions for tinning the screw column are met only when the temperature data is greater than the melting point data; at this time, the workbench translation of the tinning equipment is controlled according to the coordinate data, which can ensure that the screw column on the printed circuit board is accurately moved to the working area of ​​the coating device; the workbench translation control system generates workbench translation data based on the coordinate data and the current workbench position information; these data include the translation vector, that is, the distance and direction of movement, which are used to drive the workbench motor to move the workbench along a predetermined trajectory; the preset value of the workbench translation is set according to the requirements of the tinning process and the performance parameters of the equipment, and represents the standard for the workbench to translate to the appropriate position. When the workbench translation data reaches the preset value, it means that the screw column has accurately reached the working area of ​​the coating device, and the tinning process can be performed at this time;

[0078] Appropriate pressure ensures that the tin liquid flows out of the nozzle of the coating device at a stable flow rate and in a uniform shape, ensuring that the solder paste can fully fill the surface of the screw column and form a good solder joint. If the pressure is too low, the tin liquid may not flow out smoothly or the coating may be uneven; if the pressure is too high, it may cause the tin liquid to splash or damage the surface of the screw column. In actual operation, the pressure control system of the coating device accurately controls the pressure applied to the tin liquid based on this pressure value.

[0079] The tin flow rate for tinning screw studs is determined by the solder paste supply volume data. This data is calculated based on the screw stud profile and process requirements, reflecting the amount of solder paste required for each stud. The coating device's flow control system uses this volume data to precisely control the tin flow rate, ensuring the appropriate amount of solder paste is delivered to each stud. Accurate flow control ensures that the solder paste dosage meets process requirements and avoids quality issues caused by too much or too little solder paste. Too much solder paste can cause short circuits or bridging during soldering, while too little solder paste may prevent a good solder connection.

[0080] like Figure 2 As shown, an embodiment of the present invention provides a tinning device for a screw column of a printed circuit board, comprising:

[0081] Base 1;

[0082] A workbench motor 2 is provided on the first surface of the base 1;

[0083] a workbench 3 movably connected to the workbench motor 2 , wherein the workbench 3 is driven by the workbench motor 2 to translate along the first surface of the base 1 ;

[0084] A bracket 4 fixedly connected to the base 1;

[0085] The top of the bracket 4 is provided with a scanning device 5 and a coating device on the surface close to the base 1;

[0086] A heating device 7 connected to the coating device via a tin feeding tube 6;

[0087] Among them, the printed circuit board screw column tinning device obtains the solder paste data of the printed circuit board 8, and scans and identifies the printed circuit board 8 through the scanning device 5 to obtain the coordinate data and contour data of multiple screw columns; based on the contour data and the solder paste data, the solder paste supply data is obtained; based on the solder paste data, the heating device 7 is controlled to heat the solder paste and detect the temperature of the solder paste to obtain temperature data; based on the temperature data and the coordinate data, the workbench 3 is controlled to translate, and based on the solder paste supply data, the coating device is controlled to tin the multiple screw columns of the printed circuit board 8 fixed on the workbench 3.

[0088] In this embodiment, the tinning device for the screw posts of the printed circuit board is mainly composed of a base 1, a workbench motor 2, a workbench 3, a bracket 4, a scanning device 5, a coating device and a heating device 7. Each part works together to achieve accurate tinning of the screw posts of the printed circuit board. The base 1 is the supporting foundation of the entire device, providing a mounting and fixing position for other components, and has sufficient strength and stability to ensure that the device does not shake or shift during operation, thereby ensuring the accuracy of the tinning operation; the workbench motor 2 is arranged on the first surface of the base 1, and is the power source for driving the workbench 3 to move horizontally; the workbench motor 2 adopts a high-precision linear servo motor, which can accurately control the moving distance and speed of the workbench 3; the workbench 3 is movably connected to the workbench motor 2, and under the drive of the workbench motor 2, the workbench 3 can move horizontally along the first surface of the base 1. This translation movement enables the printed circuit board 8 to be accurately moved to the working area of ​​the scanning device 5 and the coating device for scanning, identification and tinning; the bracket 4 is fixedly connected to the base 1 to provide support for the scanning device 5 and the coating device; the design of the bracket 4 needs to ensure the stability of the position of the scanning device 5 and the coating device, ensuring that they can accurately The printed circuit board 8 is operated; the scanning device 5 is arranged on the top of the bracket 4 close to the surface of the base 1, and the scanning device 5 is used to scan and identify the printed circuit board 8. It adopts a high-precision optical sensor and image processing system, which can capture the image information of the surface of the printed circuit board 8, and extract the coordinate data and contour data of multiple screw columns through the image processing algorithm; the coating device is also arranged on the top of the bracket 4 close to the surface of the base 1, adjacent to the scanning device 5; the coating device is used to coat solder paste on the screw columns of the printed circuit board 8, and includes a tin coating port 10 and a control system, which can accurately control the flow rate and coating position of the solder paste according to the solder paste supply data; the heating device 7 is connected to the coating device through the tin feeding tube 6, and the heating device 7 is used to heat the solder paste to make it reach a suitable temperature; at the same time, the heating device 7 is also equipped with a temperature detection device, which can monitor the temperature of the solder paste in real time and feed back the temperature data to the control system.

[0089] The device's workflow is as follows: first, the solder paste data of the printed circuit board (PCB) 8 is acquired. This data includes information such as the composition, melting point, and viscosity of the solder paste. The solder paste data can be pre-entered into the device's control system or acquired through a connection to an external database. The PCB 8 is scanned and identified by a scanning device 5, which emits light onto the PCB 8. Surface features such as screw posts reflect the light, which is captured by the optical sensor of the scanning device and converted into electrical signals. The reflected light is then processed to obtain coordinate data and contour data for multiple screw posts. Based on the scanned contour data and the acquired solder paste data, the device's control system calculates solder paste supply data. Specifically, the volume of solder paste required for each screw post is determined based on the contour data, and the pressure and other parameters during application are determined based on the viscosity of the solder paste. Based on the solder paste data, the control system controls the heating device to heat the solder paste. The heating device 7 heats the solder paste to a temperature close to its melting point, and the temperature of the solder paste is monitored in real time by a temperature detection device to obtain temperature data. Only when the temperature data reaches or exceeds the melting point of the solder paste, the conditions for tinning are met; according to the temperature data and coordinate data, the control system controls the workbench motor 2 to drive the workbench 3 to translate, so that the screw column on the printed circuit board 8 is accurately moved to the working area of ​​the coating device; when the workbench 3 reaches the preset position, the control system controls the coating device to perform tinning according to the solder paste supply data; the coating device will apply the solder paste on the screw column according to the predetermined pressure and flow rate to complete the tinning operation.

[0090] The above-mentioned device proposed in the present invention can achieve precise positioning and tinning of screw columns and improve the quality of tinning through precise workbench translation control and scanning recognition technology; the workflow of the entire device is automatically completed by the control system, reducing manual intervention and improving production efficiency and consistency; it can flexibly adjust parameters such as solder paste supply data and heating temperature according to different printed circuit boards and solder paste types to adapt to various production needs.

[0091] In an optional embodiment proposed by the present invention, the coating device includes:

[0092] An upper tin rod 9, the outer portion of which is provided with a rack, the inner portion of which is provided with a pipe for passing molten tin, the first end of which is communicated with a tinning port 10 provided at the bottom of the upper tin rod 9, the tinning port 10 being provided with a valve 11, and the second end of which is communicated with the tin feeding tube 6;

[0093] A coating motor 12 is fixedly connected to the top of the bracket 4 near the surface of the base 1, and a gear is provided at the output end of the coating motor 12, and the gear is engaged with the upper tin rod rack;

[0094] A driving pump 13 is provided between the second port of the pipeline and the tin feeding tube 6 .

[0095] In this embodiment, the coating device primarily comprises an upper tin rod 9, a coating motor 12, and a drive pump 13. These components work in concert to precisely coat the molten tin onto the screw posts of the printed circuit board. A rack is provided on the exterior of the upper tin rod 9, enabling it to mesh with the gear at the output of the coating motor 12, thereby achieving linear reciprocating motion. A conduit for the molten tin is located within the upper tin rod 9. This conduit serves as a channel for transporting the molten tin from the tin delivery tube to the tin coating port 10. The conduit is constructed from high-temperature and corrosion-resistant materials to ensure that the molten tin does not chemically react or become clogged during transport. The first port of the pipeline is connected to the tin coating port 10 provided at the bottom of the upper tin rod 9. The tin coating port 10 is the part where the tin liquid flows out and is coated on the screw column. The tin coating port 10 is provided with a valve 11. The function of the valve 11 is to control the outflow and stop of the tin liquid to ensure that the coating operation is carried out at the right time. The opening and closing of the valve 11 can be precisely controlled by the control system. The second port of the pipeline is connected to the tin feeding pipe 6. The tin feeding pipe 6 transports the tin liquid heated by the heating device 7 to the pipeline of the coating device. When the tinning operation is required, the valve 1 is opened, and the tin liquid flows from the tin feeding pipe 6 through the pipeline to the tin coating port 10, and then with the movement of the upper tin rod 9, the tin liquid is evenly coated on the screw column. On top; the coating motor 12 is fixedly connected to the top surface of the bracket 4 close to the base 1 to ensure that the motor is in a stable position during operation; the output end of the coating motor 12 is provided with a gear, which is engaged with the rack on the outside of the upper tin rod 9; the coating motor 12 converts the rotational motion of the motor into a linear reciprocating motion of the upper tin rod 9 through the engagement transmission of the gear and the rack; the speed and direction of the motor can be precisely adjusted by the control system, thereby controlling the movement speed and direction of the upper tin rod 9, and realizing precise control of the tin liquid coating position and coating amount; for example, by adjusting the speed of the motor, the moving speed of the upper tin rod 9 can be controlled, thereby affecting the coating thickness of the tin liquid on the screw column. The driving pump 13 is arranged between the second port of the pipeline and the tin delivery tube 6. Its main function is to transport the tin liquid heated by the heating device 7 from the tin delivery tube 6 to the pipeline of the upper tin rod 9; the driving pump 13 can accurately control the flow and pressure of the tin liquid according to the instructions of the control system; for example, during the coating process, the flow of the driving pump 13 is adjusted according to the size of the screw column and the required amount of tin liquid to ensure that each screw column can obtain the appropriate amount of tin liquid; at the same time, the pressure generated by the driving pump 13 can ensure that the tin liquid passes through the pipeline and the tin coating port 10 smoothly, thereby achieving a stable coating effect.

[0096] The working process of the coating device includes: the heating device 7 heats the solder paste to a suitable temperature, the driving pump 13 is in standby state, the gear of the coating motor is well engaged with the rack of the upper tin rod 9, and the valve 11 is closed; when the tinning operation is required, the control system opens the valve 11, the driving pump 13 starts, and the heated tin liquid is transported from the tin delivery tube 6 to the pipeline of the upper tin rod 9; the coating motor 12 is started according to the preset parameters, and drives the upper tin rod 9 to perform linear reciprocating motion through the transmission of the gear and rack; the tin coating port 10 at the bottom of the upper tin rod 9 moves with the upper tin rod 9, and the tin liquid is evenly coated on the screw column of the printed circuit board 8; after the coating is completed, the control system closes the valve 11, the driving pump 13 stops working, the coating motor 12 stops rotating, and the coating device is cleaned to prepare for the next tinning operation.

[0097] like Figure 3 As shown, an embodiment of the present invention further provides a computing device 30, comprising a processor 31, a memory 32, and a program or instruction stored in the memory 32 and executable by the processor 31. When executed by the processor 31, the program or instruction implements the various processes of the aforementioned embodiment of the method for tinning screw posts on a printed circuit board, and can achieve the same technical effects. To avoid repetition, the details are not described here. It should be noted that the computing device in the embodiment of the present invention includes the aforementioned mobile electronic devices and non-mobile electronic devices.

[0098] An embodiment of the present invention further provides a printed circuit board with screw columns, wherein the printed circuit board is manufactured by the above method.

[0099] In this embodiment, the printed circuit board is made by the above method, which solves the problems of low tinning efficiency, uneven tin liquid coating, and easy pollution of the printed circuit board screw columns, realizes rapid and uniform tinning of the screw columns, improves production efficiency, and reduces pollution.

[0100] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0101] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0102] In the embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed can be through some interface, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0103] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0104] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0105] If the functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the portion that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product, stored in a storage medium, includes instructions for causing a computer device (such as a personal computer, server, or network device) to execute all or part of the steps of the various embodiments of the method of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, mobile hard drives, ROM, RAM, magnetic disks, or optical disks.

[0106] In addition, it should be pointed out that in the apparatus and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present invention. Moreover, the steps of performing the above-mentioned series of processing can naturally be performed in chronological order according to the order of description, but they do not necessarily need to be performed in chronological order, and some steps can be performed in parallel or independently of each other. For those of ordinary skill in the art, it can be understood that all or any steps or components of the method and apparatus of the present invention can be implemented in hardware, firmware, software or a combination thereof in any computing device (including a processor, storage medium, etc.) or a network of computing devices. This can be achieved by those of ordinary skill in the art using their basic programming skills after reading the description of the present invention.

[0107] Therefore, the purpose of the present invention can also be achieved by running a program or a group of programs on any computing device. The computing device can be a well-known general-purpose device. Therefore, the purpose of the present invention can also be achieved simply by providing a program product containing program code for implementing the method or device. That is to say, such a program product also constitutes the present invention, and the storage medium storing such a program product also constitutes the present invention. Obviously, the storage medium can be any well-known storage medium or any storage medium developed in the future. It should also be pointed out that in the device and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent schemes of the present invention. In addition, the steps of performing the above-mentioned series of processing can naturally be performed in chronological order according to the order of description, but do not necessarily need to be performed in chronological order. Certain steps can be performed in parallel or independently of each other.

[0108] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for tinning screw posts on a printed circuit board, characterized in that: include: A printed circuit board is provided, wherein a plurality of screw columns are provided on the printed circuit board; Obtaining solder paste data of the printed circuit board; Acquiring coordinate data and contour data of the plurality of screw columns; Obtaining solder paste supply data according to the profile data and the solder paste data; According to the solder paste data, controlling a heating device of a tinning device to heat the solder paste and detecting a temperature of the solder paste to obtain temperature data; Controlling the translation of the workbench of the tinning equipment according to the temperature data and the coordinate data, and controlling the coating device of the tinning equipment to tin the plurality of screw columns of the printed circuit board fixed on the workbench according to the solder paste supply data; Wherein, obtaining solder paste data of the printed circuit board includes: Acquire solder paste data of the printed circuit board according to the design model of the printed circuit board, wherein the solder paste data includes at least one of composition data, melting point data, and viscosity data of the solder paste; The step of obtaining solder paste supply data according to the profile data and the solder paste data includes: According to the profile data, the solder paste supply volume data is obtained; the specific formula is: ； in, V Provide volume data for solder paste, D is the screw column diameter, H is the target height of the welding point, K is the reflow shrinkage compensation coefficient, and: ； in, α is the thermal expansion coefficient, Δ T is the difference between the peak temperature and room temperature, β is the volatility correction factor, ζ is the process correction factor; According to the viscosity data, the solder paste supply pressure data is obtained; the specific formula is: ； in, Q is the dynamic flow rate of solder paste after liquefaction, ρ is the density of solder paste after liquefaction, η is the viscosity of the solder paste after liquefaction, t Tinning time; according to: , get solder paste supply pressure data; in, P Provide pressure data for solder paste, a is the characteristic coefficient of tin liquid, a = ρ / 2, k is the friction loss coefficient, k=f·L / D 1, f For the roughness of the tin delivery pipeline, L is the length of the tin delivery pipeline, D 1 is the diameter of the tin delivery pipe, v is the tin liquid flow rate, v=Q / S , S is the cross-sectional area of ​​the tin delivery pipeline, S= π( D 1 / 2) 2 .

2. The method for tinning screw posts on a printed circuit board according to claim 1, characterized in that: Acquiring coordinate data and contour data of the plurality of screw columns, including: The printed circuit board is scanned and identified by a scanning device of the tinning equipment to obtain coordinate data and contour data of a plurality of screw columns.

3. The method for tinning screw posts on a printed circuit board according to claim 2, characterized in that: The method comprises: controlling the translation of a workbench of the tinning equipment according to the temperature data and the coordinate data, and controlling the coating device of the tinning equipment to tin the plurality of screw columns of the printed circuit board fixed on the workbench according to the solder paste supply data, comprising: When the temperature data is greater than the melting point data, controlling the translation of the workbench of the tinning equipment according to the coordinate data to obtain workbench translation data; When the workbench translation data reaches a preset value, the coating device is controlled to apply pressure to the tin liquid to tin the multiple screw columns of the printed circuit board fixed on the workbench, wherein the pressure value applied to the tin liquid is determined by the solder paste supply pressure data, and the tin liquid flow rate for tinning the screw columns is determined by the solder paste supply volume data.

4. A tinning device for printed circuit board screw posts, characterized in that: include: Base (1); A workbench motor (2) is provided on the first surface of the base (1); a workbench (3) movably connected to the workbench motor (2), wherein the workbench (3) moves in translation along the first surface of the base (1) under the drive of the workbench motor (2); A bracket (4) fixedly connected to the base (1); A scanning device (5) and a coating device are provided on the top of the bracket (4) close to the surface of the base (1); a heating device (7) connected to the coating device via a tin feeding tube (6); The tinning device for the screw posts of the printed circuit board obtains solder paste data of the printed circuit board (8), and scans and identifies the printed circuit board (8) through the scanning device (5), thereby obtaining coordinate data and contour data of a plurality of screw posts; based on the contour data and the solder paste data, solder paste supply data is obtained; based on the solder paste data, the heating device (7) is controlled to heat the solder paste and detect the temperature of the solder paste to obtain temperature data; based on the temperature data and the coordinate data, the workbench (3) is controlled to move horizontally, and based on the solder paste supply data, the coating device is controlled to perform tinning on a plurality of screw posts of the printed circuit board (8) fixed on the workbench (3); Wherein, obtaining solder paste data of the printed circuit board includes: Acquire solder paste data of the printed circuit board according to the design model of the printed circuit board, wherein the solder paste data includes at least one of composition data, melting point data, and viscosity data of the solder paste; The step of obtaining solder paste supply data according to the profile data and the solder paste data includes: According to the profile data, the solder paste supply volume data is obtained; the specific formula is: ； in, V Provide volume data for solder paste, D is the screw column diameter, H is the target height of the welding point, K is the reflow shrinkage compensation coefficient, and: ； in, α is the thermal expansion coefficient, Δ T is the difference between the peak temperature and room temperature, β is the volatility correction factor, ζ is the process correction factor; According to the viscosity data, the solder paste supply pressure data is obtained; the specific formula is: ； in, Q is the dynamic flow rate of solder paste after liquefaction, ρ is the density of solder paste after liquefaction, η is the viscosity of the solder paste after liquefaction, t Tinning time; according to: , get solder paste supply pressure data; in, P Provide pressure data for solder paste, a is the characteristic coefficient of tin liquid, a = ρ / 2, k is the friction loss coefficient, k=f·L / D 1, f For the roughness of the tin delivery pipeline, L is the length of the tin delivery pipeline, D 1 is the diameter of the tin delivery pipe, v is the tin liquid flow rate, v=Q / S , S is the cross-sectional area of ​​the tin delivery pipeline, S= π( D 1 / 2) 2 .

5. The tinning device for printed circuit board screw posts according to claim 4, characterized in that: The coating device comprises: An upper tin rod (9), wherein a rack is provided on the outside of the upper tin rod (9), and a pipe for passing tin liquid is provided on the inside of the upper tin rod (9), wherein a first port of the pipe is communicated with a tin coating port (10) provided at the bottom of the upper tin rod (9), wherein the tin coating port (10) is provided with a valve (11), and a second port of the pipe is communicated with the tin delivery tube (6); a coating motor (12) fixedly connected to the top of the bracket (4) near the surface of the base (1), wherein the output end of the coating motor (12) is provided with a gear, and the gear is meshed with the upper tin rod rack; A driving pump (13) is provided between the second port of the pipeline and the tin delivery tube (6).

6. A computing device, characterized in that include: A processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method according to any one of claims 1 to 3 is performed.

7. A computer-readable storage medium, characterized in that The device stores instructions, which, when executed on a computer, enable the computer to execute the method according to any one of claims 1 to 3.

8. A printed circuit board with screw columns, characterized in that: The printed circuit board is manufactured by the method according to any one of claims 1 to 3.

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