Film layer structure and preparation method thereof, shell and processing method thereof, and electronic equipment

Abstract

The invention relates to a film layer structure and a preparation method thereof, a shell and a processing method thereof, and electronic equipment. The film layer structure comprises a base material layer, a first ink layer and a second ink layer which are arranged in a stacked mode. The surface of the side, away from the base material layer, of the first ink layer comprises a first area and a second area, and the first area is located in the second area; the edge of the second area and the edge of the first area are spaced by a first preset distance which is greater than a preset threshold; the second ink layer is arranged in the first area. By adjusting the relative position of the second ink layer in the film layer structure, black lines can be reduced, and the delicate degree of a product can be improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic equipment, and in particular to a film structure and a preparation method thereof, a housing and a processing method thereof, and an electronic device. Background Art

[0002] As the market demand for electronic equipment continues to grow and the frequency of replacements gradually increases, consumers are increasingly pursuing decorative effects on the appearance of electronic equipment; the housing of an electronic device, as the main appearance part of the electronic device, has a direct impact on the aesthetics of the electronic device.

[0003] At present, the shells of electronic devices mostly use a transparent substrate combined with a decorative film to provide a variety of visual effects. In order to increase the strength of the shell, the edge of the substrate is usually designed as a chamfered structure, but this also makes it difficult for the decorative film to fit completely with the substrate, resulting in the problem of easy dust hiding at the edge of the shell. Based on this, in the related art, the problem of easy dust hiding at the edge of the shell is solved by spraying the edge with the same color as the decorative film. However, this will produce a black line problem at the junction of the edge of the decorative film and the edge ink, affecting the refinement of the product. Summary of the invention

[0004] In order to overcome the problems existing in the related art, the present disclosure provides a film layer structure and a preparation method thereof, a housing and a processing method thereof, and an electronic device.

[0005] According to a first aspect of an embodiment of the present disclosure, a film layer structure is provided, the film layer structure comprising a substrate layer, a first ink layer and a second ink layer which are stacked;

[0006] The surface of the first ink layer on the side away from the substrate layer includes a first area and a second area, and the first area is located in the second area;

[0007] An edge of the second area is spaced from an edge of the first area by a first preset distance, and the first preset distance is greater than a preset threshold;

[0008] The second ink layer is disposed in the first region.

[0009] In some embodiments of the present disclosure, the thickness ratio of the first ink layer to the second ink layer is (0.8-2):1.

[0010] In some embodiments of the present disclosure, the thickness of the first ink layer is 0.003 mm to 0.1 mm;

[0011] The thickness of the second ink layer is 0.003 mm to 0.05 mm.

[0012] In some embodiments of the present disclosure, the first preset distance is 0.1 mm to 3 mm.

[0013] In some embodiments of the present disclosure, the substrate layer includes a transparent or translucent substrate.

[0014] In some embodiments of the present disclosure, the transparent or translucent substrate includes one of polyethylene terephthalate, polycarbonate, and thermoplastic polyurethane elastomer.

[0015] In some embodiments of the present disclosure, the film layer structure further includes:

[0016] A first coating layer stacked on a first surface of the substrate layer, and / or a second coating layer stacked on a second surface of the substrate layer, wherein the first surface and the second surface are arranged opposite to each other;

[0017] The first ink layer is stacked and arranged on a side of the first coating layer away from the substrate layer.

[0018] In some embodiments of the present disclosure, the first coating layer and / or the second coating layer is formed by stacking two or more of silicon oxide, niobium oxide, titanium oxide, and indium.

[0019] In some embodiments of the present disclosure, the thickness of the first coating layer and / or the second coating layer is 40 nm to 300 nm.

[0020] In some embodiments of the present disclosure, the film layer structure further includes:

[0021] A first texture layer is stacked between the substrate layer and the first coating layer, and / or a second texture layer is stacked between the substrate layer and the second coating layer.

[0022] In some embodiments of the present disclosure, the thickness of the first texture layer and / or the second texture layer is 0.008 mm to 0.05 mm.

[0023] In some embodiments of the present disclosure, the film layer structure further includes:

[0024] A glue layer is laminated on a side of the substrate layer away from the first ink layer.

[0025] In some embodiments of the present disclosure, the thickness of the adhesive layer is 10 μm to 50 μm.

[0026] According to a second aspect of an embodiment of the present disclosure, a method for preparing a film layer structure is provided, wherein the method is used to prepare any of the above-mentioned film layer structures, and the method comprises:

[0027] A first ink layer and a second ink layer are sequentially stacked on the substrate layer to obtain the film layer structure;

[0028] Wherein, the surface of the first ink layer away from the substrate layer includes a first area and a second area, and the first area is located in the second area;

[0029] An edge of the second area is spaced from an edge of the first area by a first preset distance, and the first preset distance is greater than a preset threshold;

[0030] The second ink layer is disposed in the first region.

[0031] In some embodiments of the present disclosure, before the first ink layer and the second ink layer are sequentially stacked on the substrate layer, the method for preparing the film layer structure further includes:

[0032] A first coating layer is stacked on the first surface of the substrate layer, and / or a second coating layer is stacked on the second surface of the substrate layer, wherein the first surface and the second surface are arranged opposite to each other;

[0033] The first ink layer is stacked and arranged on a side of the first coating layer away from the substrate layer.

[0034] In some embodiments of the present disclosure, before a first coating layer is stacked on the first surface of the substrate layer, and / or before a second coating layer is stacked on the second surface of the substrate layer, the method for preparing the film layer structure further includes:

[0035] A first texture layer is laminated on the first surface of the substrate layer, and / or a second texture layer is laminated on the second surface of the substrate layer.

[0036] In some embodiments of the present disclosure, the method for preparing the film structure further includes:

[0037] A glue layer is laminated on a side of the substrate layer away from the first ink layer.

[0038] According to a third aspect of an embodiment of the present disclosure, a shell is provided, the shell comprising a main body and any one of the above-mentioned film layer structures, wherein a side of the film layer structure away from the first ink layer is arranged on the main body.

[0039] In some embodiments of the present disclosure, the surface of the body on which the film layer structure is disposed includes a third region and a fourth region, and the third region is located within the fourth region;

[0040] The edge of the fourth area is spaced from the edge of the third area by a second preset distance;

[0041] The film layer structure is arranged in the third area.

[0042] In some embodiments of the present disclosure, the shell further includes a third ink layer, and the third ink layer is disposed on a surface of the second ink layer away from the first ink layer, a side of the film structure, the second region, and the fourth region.

[0043] In some embodiments of the present disclosure, the third ink layer covers or partially covers the second ink layer.

[0044] In some embodiments of the present disclosure, the thickness of the third ink layer is 0.003 mm to 0.1 mm.

[0045] In some embodiments of the present disclosure, the housing further comprises:

[0046] An anti-fingerprint layer is stacked on a side of the body away from the film structure.

[0047] According to a fourth aspect of an embodiment of the present disclosure, there is provided a method for processing a housing, comprising:

[0048] The above-mentioned film layer structure is arranged on the main body, wherein a side of the film layer structure away from the first ink layer is arranged on the main body.

[0049] In some embodiments of the present disclosure, the surface of the body on which the membrane structure is disposed includes a third region and a fourth region, and the third region is located within the fourth region;

[0050] The edge of the fourth area is spaced from the edge of the third area by a second preset distance;

[0051] The processing method of the shell also includes:

[0052] Disposing the film layer structure in the third area;

[0053] A third ink layer is disposed on a surface of the second ink layer away from the first ink layer, a side surface of the film structure, the second region, and the fourth region.

[0054] In some embodiments of the present disclosure, the third ink layer covers or partially covers the second ink layer.

[0055] In some embodiments of the present disclosure, the processing method of the shell further includes:

[0056] An anti-fingerprint layer is stacked on a side of the body away from the film layer structure.

[0057] According to a fifth aspect of an embodiment of the present disclosure, there is provided an electronic device, comprising any one of the above-mentioned housings.

[0058] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0059] The present invention provides a second ink layer in a film structure in a first area, and makes the first area located within the second area. By controlling a first preset distance between an edge of the second area and an edge of the first area, the second ink layer is retracted relative to the first ink layer to reduce the generation of black lines, thereby facilitating improving the refinement and yield of the product.

[0060] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0062] Figure 1 is a schematic diagram of a layer structure of a film layer structure according to an exemplary embodiment;

[0063] Figure 2 is a schematic structural diagram of a first ink layer in a film layer structure according to an exemplary embodiment;

[0064] Figure 3 is a schematic diagram of a layer structure of a film layer structure according to an exemplary embodiment;

[0065] Figure 4 is a schematic diagram of a layer structure of a film layer structure according to an exemplary embodiment;

[0066] Figure 5 is a schematic diagram of a layer structure of a film layer structure according to an exemplary embodiment;

[0067] Figure 6 is a schematic flow chart of a method for preparing a film layer structure according to an exemplary embodiment;

[0068] Figure 7 is a schematic flow chart of a method for preparing a film layer structure according to an exemplary embodiment;

[0069] Figure 8 is a schematic flow chart of a method for preparing a film layer structure according to an exemplary embodiment;

[0070] Fig. 9 is a schematic flow chart of a method for preparing a film layer structure according to an exemplary embodiment;

[0071] Fig.10is a schematic diagram of a layer structure of a housing according to an exemplary embodiment;

[0072] Fig.11 is a schematic diagram of a layer structure of a housing according to an exemplary embodiment;

[0073] Fig.12 is a schematic flow chart of a method for processing a shell according to an exemplary embodiment;

[0074] Fig.13 is a schematic flow chart of a method for processing a shell according to an exemplary embodiment;

[0075] Fig.14 It is a schematic flow chart of a method for processing a shell according to an exemplary embodiment.

[0076] The symbols in the figure mean the following:

[0077] 1. substrate layer; 11. first surface; 12. second surface; 2. first ink layer; 21. first region; 22. second region; 3. second ink layer; 4. first coating layer; 5. second coating layer; 6. first texture layer; 7. second texture layer; 8. adhesive layer;

[0078] 10. Film structure; 20. Main body; 201. Third region; 202. Fourth region; 30. Third ink layer; 40. Anti-fingerprint layer;

[0079] L1, first preset distance; L2, second preset distance. DETAILED DESCRIPTION

[0080] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0081] In the related art, in order to solve the problem of dust easily hiding at the edge of the shell, a filler ink of the same color as the decorative film is sprayed at the edge to fill the gap between the decorative film and the substrate, thereby solving the problem of dust easily hiding at the edge of the shell. However, it is found in the application that after spraying the filler ink, black edges or black lines are prone to appear at the intersection of the decorative film and the filler ink, especially when the color difference between the bottom shielding ink of the decorative film and the filler ink is greater, the black line problem is more obvious, and the black line problem will lead to a decrease in the refinement of the product, affecting the product's appearance quality and production cost.

[0082] Based on this, the present disclosure provides a film layer structure, in which the second ink layer in the film layer structure is arranged in the first area, and the first area is located in the second area. By controlling the first preset distance between the edge of the second area and the edge of the first area, the second ink layer is retracted relative to the first ink layer to reduce the generation of black lines, which is beneficial to improving the refinement and yield of the product.

[0083] In an exemplary embodiment of the present disclosure, a film structure is provided, such as Figure 1 As shown, the film layer structure 10 includes a stacked substrate layer 1, a first ink layer 2 and a second ink layer 3; the surface of the first ink layer 2 away from the substrate layer 1 includes a first area 21 and a second area 22, and the first area 21 is located in the second area 22; the edge of the second area 22 is spaced from the edge of the first area 21 by a first preset distance L1, and the first preset distance L1 is greater than a preset threshold; the second ink layer 3 is arranged in the first area 21.

[0084] The film layer structure 10 in this embodiment is suitable for the housing of an electronic device and can be used to decorate the appearance of the housing. The second ink layer 3 is the inner side of the film layer structure 10, that is, the side close to the main body of the electronic device; the substrate layer 1 is the outer side of the film layer structure 10, that is, the side away from the main body of the electronic device.

[0085] The second ink layer 3 is a shielding color layer of the film structure 10, and its main function is to shield the electronic device body and prevent external light sources from entering the electronic device body. Therefore, the color of the second ink layer 3 is usually dark (i.e., black or dark gray, etc.). The first ink layer 2 is a decorative color layer of the film structure 10, which can present the overall color of the film structure 10 to decorate the electronic device housing. In order to make the appearance visual effect presented by the film structure 10 richer, the color of the first ink layer 2 is usually light (i.e., dark colors such as non-black / non-dark gray). Therefore, based on the above reasons, the first ink layer 2 and the second ink layer 3 usually present a relatively large color difference. When the shell is edged with a light-colored ink of the same color system as the first ink layer 2, a black edge or black line problem will appear at the intersection of the second ink layer 3 and the edge-filling ink due to the overlap of light and dark colors, affecting the refinement of the product.

[0086] In this embodiment, by disposing the second ink layer 3 in the first area 21 and making the first area 21 in the second area 22, and by controlling the first preset distance L1 between the edge of the second area 22 and the edge of the first area 21, the second ink layer 3 is retracted relative to the first ink layer 2, which can avoid the second ink layer 3 from being exposed, thereby reducing the generation of black lines, which is beneficial to improving the refinement and yield of the product.

[0087] It should be noted that the present disclosure does not limit the colors of the first ink layer 2 and the second ink layer 3 in the film layer structure 10. For example, the color of the second ink layer 3 may also be a light color with a shielding effect, or the color of the first ink layer 2 may also be a dark color. When there is no obvious color difference between the first ink layer 2 and the second ink layer 3, the film layer structure 10 of the present disclosure may also be used.

[0088] In an exemplary embodiment of the present disclosure, the thickness ratio of the first ink layer 2 to the second ink layer 3 is (0.8-2):1.

[0089] In this embodiment, the thickness ratio of the first ink layer 2 and the second ink layer 3 is controlled at (0.8-2):1, so that the film layer structure 10 can better play the role of decorating the shell and shielding the main body of the electronic device.

[0090] Exemplarily, the thickness ratio of the first ink layer 2 to the second ink layer 3 is 0.8:1.

[0091] It is understandable that the thickness ratio of the first ink layer 2 to the second ink layer 3 may also be other ratios within the above range. For example, the thickness ratio of the first ink layer 2 to the second ink layer 3 is 1:1 or 1.5:1 or 2:1.

[0092] In an exemplary embodiment of the present disclosure, the thickness of the first ink layer 2 is 0.003-0.1 mm; the thickness of the second ink layer 3 is 0.003-0.05 mm.

[0093] In this embodiment, the thickness of the first ink layer 2 and the second ink layer 3 is within the above range, which can make the film structure 10 thinner while satisfying the visual effect of the appearance of the film structure 10 to improve the aesthetics of the film structure 10.

[0094] Exemplarily, the thickness of the first ink layer 2 is 0.003 mm, and the thickness of the second ink layer 3 is 0.003 mm.

[0095] It is understandable that the thickness of the first ink layer 2 and the second ink layer 3 may also be other values ​​within the above range. For example, the thickness of the first ink layer 2 is 0.05 mm, and the thickness of the second ink layer 3 is 0.01 mm. Alternatively, the thickness of the first ink layer 2 is 0.1 mm, and the thickness of the second ink layer 3 is 0.05 mm.

[0096] In an exemplary embodiment of the present disclosure, the first preset distance L1 is 0.1 mm to 3 mm.

[0097] When the first preset distance L1 is less than 0.1 mm, the second ink layer 3 is easily exposed, and it is difficult to achieve a good effect of reducing black lines; when the first preset distance L1 is greater than 3 mm, it is difficult for the second ink layer 3 to provide a good shielding effect on the electronic device body. Therefore, in this embodiment, when the first preset distance L1 is 0.1 mm to 3 mm, it can effectively reduce the generation of black lines and provide a good shielding effect on the electronic device body.

[0098] Exemplarily, the first preset distance L1 is 0.1 mm. It is understandable that the first preset distance L1 may also be other values ​​within the above range. For example, the first preset distance L1 is 1 mm, 2 mm or 3 mm.

[0099] It should be understood that in the present disclosure, the first area 21 is located within the second area 22, which means that the first area 21 can be located at the center of the second area 22, or Figure 2 As shown, the first area 21 may also be located at a non-central position of the second area 22, as long as the shortest distance between the edge of the second area 22 and the edge of the first area 21 at any location is greater than a preset threshold, the shortest distance is the first preset distance L1.

[0100] In an exemplary embodiment of the present disclosure, the substrate layer 1 includes a transparent or translucent substrate.

[0101] In this embodiment, when the substrate layer 1 is a transparent or semi-transparent substrate, it is easier to show the decorative effect of the first ink layer 2. The thickness of the substrate layer 1 can be selected according to actual needs, generally 10-150 μm. For example, the thickness of the substrate layer 1 can be 10 μm, 80 μm or 150 μm.

[0102] Exemplarily, the transparent or translucent substrate includes one of polyethylene terephthalate (PET), polycarbonate (PC), and thermoplastic polyurethane (TPU).

[0103] In an exemplary embodiment of the present disclosure, Figure 3As shown, the film structure 10 includes a substrate layer 1, a first ink layer 2 and a second ink layer 3 which are stacked; it also includes a first coating layer 4 stacked on the first surface 11 of the substrate layer 1, and / or a second coating layer 5 stacked on the second surface 12 of the substrate layer 1, and the first ink layer 2 is stacked on the side of the first coating layer 4 away from the substrate layer 1; wherein the first surface 11 and the second surface 12 are arranged opposite to each other, that is, the substrate layer 1 can have two surfaces which are basically parallel to each other, one of which is the first surface 11 and the other is the second surface 12; the first surface 11 is the inner side of the substrate layer 1, that is, the side close to the electronic device body; the second surface 12 is the outer side of the substrate layer 1, that is, the side away from the electronic device body.

[0104] In this embodiment, the arrangement and structure of the substrate layer 1 , the first ink layer 2 and the second ink layer 3 are the same as those in the above embodiment, and will not be described in detail herein.

[0105] Exemplarily, the film structure 10 includes a substrate layer 1, a first coating layer 4, a first ink layer 2 and a second ink layer 3 which are stacked in sequence.

[0106] Alternatively, the film structure 10 includes a second coating layer 5 , a substrate layer 1 , a first ink layer 2 and a second ink layer 3 which are stacked in sequence.

[0107] Alternatively, the film structure 10 includes a second coating layer 5 , a substrate layer 1 , a first coating layer 4 , a first ink layer 2 and a second ink layer 3 which are stacked in sequence.

[0108] In this embodiment, a coating may be provided on one surface of the substrate layer 1 , or on both surfaces of the substrate layer 1 , so that the obtained film layer structure 10 has a better appearance and texture.

[0109] The first coating layer 4 and / or the second coating layer 5 may be formed by magnetron sputtering or evaporation coating, and the coating materials may be silicon oxide, niobium oxide, titanium oxide, indium, etc.

[0110] In an exemplary embodiment of the present disclosure, the first coating layer 4 and / or the second coating layer 5 is formed by stacking two or more of silicon oxide, niobium oxide, titanium oxide, and indium.

[0111] In this embodiment, the first coating layer 4 or the second coating layer 5 formed by two or more oxides or indium can brighten the film structure 10 to improve the aesthetics of the film structure 10 .

[0112] Exemplarily, the first coating layer 4 and / or the second coating layer 5 can be formed by stacking silicon oxide, niobium oxide, and indium in sequence. It can be understood that the stacking structure of the first coating layer 4 and / or the second coating layer 5 can also be formed by stacking any combination of the above oxides or metals. For example, the first coating layer 4 and / or the second coating layer 5 are formed by stacking silicon oxide and indium in sequence. Alternatively, the first coating layer 4 and / or the second coating layer 5 are formed by stacking silicon oxide, titanium oxide, and niobium oxide in sequence.

[0113] In an exemplary embodiment of the present disclosure, the thickness of the first coating layer 4 and / or the second coating layer 5 is 40 nm to 300 nm.

[0114] In this embodiment, the thickness of the first coating layer 4 and / or the second coating layer 5 needs to be controlled within 40nm to 300nm; when the thickness is too low, it is difficult to achieve the desired appearance effect; when the thickness is too high, it will affect the mechanical properties of the film structure 10.

[0115] Exemplarily, the thickness of the first coating layer 4 and / or the second coating layer 5 is 40 nm. It is understandable that the thickness of the first coating layer 4 and / or the second coating layer 5 may also be other values ​​within the above range. For example, the thickness of the first coating layer 4 and / or the second coating layer 5 is 100 nm, 200 nm or 300 nm.

[0116] In an exemplary embodiment of the present disclosure, Figure 4 As shown, the film structure 10 includes a substrate layer 1, a first ink layer 2 and a second ink layer 3 which are stacked; it also includes a first texture layer 6 and a first coating layer 4 which are stacked on the first surface 11 of the substrate layer 1, and / or a second texture layer 7 and a second coating layer 5 which are stacked on the second surface 12 of the substrate layer 1; the first ink layer 2 is stacked on the side of the first coating layer 4 away from the substrate layer 1.

[0117] In this embodiment, the arrangement and structure of the substrate layer 1 , the first ink layer 2 , the second ink layer 3 , the first coating layer 4 and the second coating layer 5 are the same as those in the above embodiment and will not be described in detail herein.

[0118] Exemplarily, the film structure 10 includes a substrate layer 1, a first texture layer 6, a first coating layer 4, a first ink layer 2 and a second ink layer 3 which are stacked in sequence.

[0119] Alternatively, the film structure 10 includes a second coating layer 5 , a second texture layer 7 , a substrate layer 1 , a first ink layer 2 and a second ink layer 3 which are stacked in sequence.

[0120] Alternatively, the film structure 10 includes a second coating layer 5, a second texture layer 7, a substrate layer 1, a first texture layer 6, a first coating layer 4, a first ink layer 2 and a second ink layer 3 which are stacked in sequence.

[0121] In this embodiment, a coating and a texture may be provided on one surface of the substrate layer 1 , or a coating may be provided on both surfaces of the substrate layer 1 , so that the obtained film layer structure 10 has a better appearance and texture.

[0122] The textures of the first texture layer 6 and the second texture layer 7 may be the same or different. The first texture layer 6 and the second texture layer 7 may be formed by light curing (UV), that is, the pattern on the mold is transferred by a UV texture mold and UV glue, wherein the UV texture mold may be realized by laser engraving, machining, bionic transfer, etc. The light transmittance of the first texture layer 6 thus formed may reach more than 80%, so that the decorative effects of the first ink layer 2 and the first coating layer 4 can be presented on the appearance of the film structure 10 through the first texture layer 6.

[0123] It should be noted that the first ink layer 2 of the film layer structure 10 may also be directly laminated on the first texture layer 6 , that is, the film layer structure 10 does not include the first coating layer 4 and the second coating layer 5 .

[0124] For example, the film structure 10 includes a substrate layer 1 , a first texture layer 6 , a first ink layer 2 , and a second ink layer 3 which are stacked in sequence.

[0125] Alternatively, the film structure 10 includes a second texture layer 7, a substrate layer 1, a first ink layer 2 and a second ink layer 3 which are stacked in sequence.

[0126] Alternatively, the film structure 10 includes a second texture layer 7, a substrate layer 1, a first texture layer 6, a first ink layer 2 and a second ink layer 3 which are stacked in sequence.

[0127] In an exemplary embodiment of the present disclosure, the thickness of the first texture layer 6 and / or the second texture layer 7 is 0.008 mm to 0.05 mm. When the thickness is too low, it is difficult to achieve the desired appearance effect; when the thickness is too high, the mechanical properties of the film structure 10 will be affected.

[0128] Exemplarily, the thickness of the first texture layer 6 and / or the second texture layer 7 is 0.008 mm. It is understandable that the thickness of the first texture layer 6 and / or the second texture layer 7 may also be other values ​​within the above range. For example, the thickness of the first texture layer 6 and / or the second texture layer 7 is 0.01 mm, 0.02 mm or 0.05 mm.

[0129] In an exemplary embodiment of the present disclosure, Figure 5 As shown, the film structure 10 includes a substrate layer 1 , a first ink layer 2 , and a second ink layer 3 which are stacked, and also includes a glue layer 8 which is stacked on a side of the substrate layer 1 away from the first ink layer 2 .

[0130] The arrangement and structure of the substrate layer 1 , the first ink layer 2 and the second ink layer 3 are the same as those in the above embodiment, and will not be described in detail herein.

[0131] In this embodiment, the provision of the adhesive layer 8 can facilitate the film structure 10 to be attached to other materials to form a composite material. For example, the film structure 10 provided with the adhesive layer 8 is attached to the body 20 to form a shell.

[0132] The adhesive layer 8 may be an optically clear adhesive (OCA) adhesive layer, which has a light transmittance of more than 95%, and has the advantages of being colorless and transparent, having good adhesion, being curable at room temperature, and having little shrinkage after curing.

[0133] In an exemplary embodiment of the present disclosure, the thickness of the adhesive layer 8 is 10 μm to 50 μm.

[0134] In this embodiment, the thickness of the adhesive layer 8 needs to be between 10 μm and 50 μm. If the thickness is too low, it is difficult to achieve the required bonding strength; if the thickness is too high, it is easy to cause adhesive overflow, affecting the aesthetics of the product.

[0135] Exemplarily, the thickness of the adhesive layer 8 is 10 μm. It is understandable that the thickness of the adhesive layer 8 may also be other values ​​within the above range, for example, the thickness of the adhesive layer 8 is 20 μm, 50 μm, etc.

[0136] In an exemplary embodiment of the present disclosure, Figure 6 As shown, a method for preparing a film layer structure is provided, comprising:

[0137] S110, sequentially stacking a first ink layer 2 and a second ink layer 3 on a substrate layer 1 to obtain a film layer structure 10;

[0138] Among them, the surface of the first ink layer 2 on the side away from the substrate layer 1 includes a first area 21 and a second area 22, the first area 21 is located in the second area 22; the edge of the second area 22 is separated from the edge of the first area 21 by a first preset distance L1, and the first preset distance L1 is greater than a preset threshold; the second ink layer 3 is arranged in the first area 21.

[0139] In this embodiment, by disposing the second ink layer 3 in the first area 21 and making the first area 21 in the second area 22, and by controlling the first preset distance L1 between the edge of the second area 22 and the edge of the first area 21, the second ink layer 3 is retracted relative to the first ink layer 2, which can avoid the second ink layer 3 from being exposed, thereby reducing the generation of black lines, which is beneficial to improving the refinement and yield of the product.

[0140] In this embodiment, the first ink layer 2 can be formed by spraying and drying ink with decorative effects. The second ink layer 3 can be formed by spraying and drying ink with shielding effects; for example, ink with a high value of Gouda can be used as the raw material of the second ink layer 3 to improve the bonding strength between the film structure 10 and other structures or materials.

[0141] The first ink layer 2 and the second ink layer 3 can be a single layer or multiple layers. For example, after spraying and drying the ink with decorative effect, the ink is sprayed again and dried to form the first ink layer 2 with a two-layer structure.

[0142] In an exemplary embodiment of the present disclosure, Figure 7 As shown, a method for preparing a film layer structure is provided, comprising:

[0143] S210, a first coating layer 4 is stacked on the first surface 11 of the substrate layer 1, and / or a second coating layer 5 is stacked on the second surface 12 of the substrate layer 1; wherein the first surface 11 and the second surface 12 are arranged opposite to each other.

[0144] In this step, a coating may be provided on one surface of the substrate layer 1 , or on both surfaces of the substrate layer 1 , so that the obtained film layer structure 10 has a better appearance and texture.

[0145] S220, sequentially stacking a first ink layer 2 and a second ink layer 3 on the first surface 11 of the substrate layer 1 or the first coating layer 4 to obtain a film layer structure 10;

[0146] Among them, the surface of the first ink layer 2 on the side away from the substrate layer 1 includes a first area 21 and a second area 22, the first area 21 is located in the second area 22; the edge of the second area 22 is separated from the edge of the first area 21 by a first preset distance L1, and the first preset distance L1 is greater than a preset threshold; the second ink layer 3 is arranged in the first area 21.

[0147] This step is the same as the implementation of step S110 in the above embodiment, and will not be described again here.

[0148] Illustratively, in one embodiment, a method for preparing a film structure includes:

[0149] A first coating layer 4 , a first ink layer 2 , and a second ink layer 3 are sequentially stacked on the first surface 11 of the substrate layer 1 to obtain a film layer structure 10 .

[0150] In another embodiment, a method for preparing a film structure includes:

[0151] A second coating layer 5 is stacked on the second surface 12 of the substrate layer 1;

[0152] A first ink layer 2 and a second ink layer 3 are sequentially stacked on the first surface 11 of the base layer 1 .

[0153] In another embodiment, a method for preparing a film structure includes:

[0154] A second coating layer 5 is stacked on the second surface 12 of the substrate layer 1;

[0155] A first plated film layer 4 , a first ink layer 2 , and a second ink layer 3 are sequentially stacked on the first surface 11 of the base material layer 1 .

[0156] In an exemplary embodiment of the present disclosure, Figure 8 As shown, a method for preparing a film layer structure is provided, comprising:

[0157] S310, a first texture layer 6 is stacked on the first surface 11 of the substrate layer 1, and / or a second texture layer 7 is stacked on the second surface 12 of the substrate layer 1; wherein the first surface 11 and the second surface 12 are arranged opposite to each other.

[0158] In this step, a texture may be provided on one surface of the substrate layer 1 , or a coating may be provided on both surfaces of the substrate layer 1 , so that the obtained film layer structure 10 has a better appearance texture.

[0159] S320 , stacking a first coating layer 4 on the first texture layer 6 , and / or stacking a second coating layer 5 on the second texture layer 7 .

[0160] S330, sequentially stacking a first ink layer 2 and a second ink layer 3 on the first surface 11 of the substrate layer 1 or the first coating layer 4 to obtain a film layer structure 10;

[0161] Among them, the surface of the first ink layer 2 on the side away from the substrate layer 1 includes a first area 21 and a second area 22, the first area 21 is located in the second area 22; the edge of the second area 22 is separated from the edge of the first area 21 by a first preset distance L1, and the first preset distance L1 is greater than a preset threshold; the second ink layer 3 is arranged in the first area 21.

[0162] The implementation of steps S320 to S330 of this embodiment is the same as that of steps S210 to S220 in the above embodiment, and will not be repeated here.

[0163] Illustratively, in one embodiment, a method for preparing a film structure includes:

[0164] A first texture layer 6 , a first coating layer 4 , a first ink layer 2 , and a second ink layer 3 are sequentially stacked on the first surface 11 of the substrate layer 1 to obtain a film layer structure 10 .

[0165] In another embodiment, a method for preparing a film structure includes:

[0166] A second texture layer 7 and a second coating layer 5 are sequentially stacked on the second surface 12 of the substrate layer 1;

[0167] A first ink layer 2 and a second ink layer 3 are sequentially stacked on the first surface 11 of the base layer 1 .

[0168] In another embodiment, a method for preparing a film structure includes:

[0169] A second texture layer 7 and a second coating layer 5 are sequentially stacked on the second surface 12 of the substrate layer 1;

[0170] A first texture layer 6 , a first plating layer 4 , a first ink layer 2 and a second ink layer 3 are sequentially stacked on the first surface 11 of the substrate layer 1 .

[0171] In an exemplary embodiment of the present disclosure, Fig. 9 As shown, a method for preparing a film layer structure is provided, comprising:

[0172] S410, sequentially stacking a first ink layer 2 and a second ink layer 3 on a substrate layer 1 to obtain a film layer structure 10;

[0173] Among them, the surface of the first ink layer 2 on the side away from the substrate layer 1 includes a first area 21 and a second area 22, the first area 21 is located in the second area 22; the edge of the second area 22 is separated from the edge of the first area 21 by a first preset distance L1, and the first preset distance L1 is greater than a preset threshold; the second ink layer 3 is arranged in the first area 21.

[0174] This step is the same as the implementation of step S110 in the above embodiment, and will not be described again here.

[0175] S420 , a glue layer 8 is laminated on a side of the substrate layer 1 away from the first ink layer 2 .

[0176] It should be noted that, in this embodiment, there is no order restriction for step S410 and step S420. The adhesive layer 8 may be first provided on the second surface 12 of the substrate layer 1, and then the first ink layer 2 and the second ink layer 3 may be provided on the first surface 11 of the substrate layer 1. The first ink and the second ink may also be first provided on the first surface 11 of the substrate layer 1, and then the adhesive layer 8 may be provided on the second surface 12 of the substrate layer 1. When the film structure 10 includes the second texture layer 7 and / or the second coating layer 5, it is necessary to provide the adhesive layer 8 on the side of the second texture layer 7 and / or the second coating layer 5 away from the substrate layer 1 after the second texture layer 7 and / or the second coating layer 5 are provided on the substrate layer 1.

[0177] During the study, it was found that the black line problem on the shell is caused not only by the overlap of light and dark colors at the intersection of the masking ink (second ink layer) and the filling ink, but also by the fact that when the film structure is bonded to the body, the glue layer on the film structure is squeezed to the edge and overflows, and then the overflow is contaminated by ink particles to form black lines.

[0178] Based on this, the present disclosure performs laser cutting on the outer shape of the film structure 10, and cleans the edge of the film structure 10 after the laser cutting to reduce the contamination of the adhesive layer 8 by ink particles after the laser cutting, thereby reducing the generation of black lines. In order to ensure that the first ink layer 2 of the film structure 10 after the laser cutting is flush with the outer shape edge of the film structure 10, the area of ​​the first ink layer 2 before the laser cutting can be slightly larger than or equal to the body 20.

[0179] In an exemplary embodiment of the present disclosure, a housing is provided, such as Fig.10 As shown, it includes a main body 20 and the film layer structure 10 in the above embodiment, and a side of the film layer structure 10 away from the first ink layer 2 is arranged on the main body 20 .

[0180] The film structure 10 can be attached to the body 20 via the adhesive layer 8 .

[0181] In this embodiment, the body 20 includes a transparent or translucent body 20. The body 20 of this material has good optical properties, so as to obtain a richer visual effect. For example, the body 20 can be ordinary glass, microcrystalline glass, sapphire glass, transparent polymer material, transparent composite material, etc. Among them, the transparent polymer material includes a combination of one or more of polyethylene terephthalate (PET), polycarbonate (PC), and polymethyl methacrylate (PMMA).

[0182] For example, a glass body may be selected, and its surface may be a glossy or non-glossy structure, wherein the non-glossy groove structure may be formed by etching or physical sandblasting.

[0183] The body 20 can be a 2D, 2.5D or 3D structure. The sapphire body can be formed into a 3D structure by heat bending. The transparent polymer body 20 or the transparent composite body 20 can be formed into a 3D structure by high pressure molding.

[0184] In this embodiment, the thickness of the body 20 is 0.1 mm to 5 mm. For example, the thickness of the body 20 is 0.1 mm, 1 mm, 3 mm or 5 mm.

[0185] In an exemplary embodiment of the present disclosure, a housing is provided, such as Fig.10As shown, it includes a main body 20 and the film layer structure 10 in the above embodiment, and a side of the film layer structure 10 away from the first ink layer 2 is arranged on the main body 20 .

[0186] Among them, the surface of one side of the main body 20 on which the membrane layer structure 10 is set includes a third area 201 and a fourth area 202, the third area 201 is located in the fourth area 202; the edge of the fourth area 202 is separated from the edge of the third area 201 by a second preset distance L2; the membrane layer structure 10 is set in the third area 201.

[0187] In order to improve the refinement of the shell and to facilitate the film structure 10 to be attached to the body 20, in this embodiment, the size of the body 20 is slightly larger than the film structure 10, that is, the film structure 10 is arranged in the third area 201, and the edge of the fourth area 202 is separated from the edge of the third area 201 by a second preset distance L2. Such an arrangement has a certain error tolerance when processing the shell, and when the film structure 10 is attached to the body 20, the problem of reduced product refinement caused by the offset between the film structure 10 and the body 20 can be reduced.

[0188] As for the fourth area 202, the shell may be filled with the fourth area 202 by performing edge filling processing, thereby improving the refinement and aesthetics of the appearance of the shell.

[0189] In an exemplary embodiment of the present disclosure, a housing is provided, such as Fig.10 As shown, it includes a body 20 , a film structure 10 and a third ink layer 30 , and a side of the film structure 10 away from the first ink layer 2 is arranged on the body 20 .

[0190] Among them, the surface of one side of the main body 20 on which the membrane layer structure 10 is set includes a third area 201 and a fourth area 202, the third area 201 is located in the fourth area 202; the edge of the fourth area 202 is separated from the edge of the third area 201 by a second preset distance L2; the membrane layer structure 10 is set in the third area 201.

[0191] The third ink layer 30 is disposed on the surface of the second ink layer 3 away from the first ink layer 2 , the side surface of the film structure 10 , the second region 22 , and the fourth region 202 .

[0192] In this embodiment, the third ink layer 30 is a filler color layer of the shell, and its main function is to fill the gap between the body 20 and the membrane structure 10 to solve the problem that the edge of the shell is easy to hide dust. Therefore, the color of the third ink layer 30 is usually the same color as the first ink layer 2. That is, when the color of the first ink layer 2 is light, the third ink layer 30 is also light. The third ink layer 30 is arranged on the surface of the second ink layer 3 away from the first ink layer 2, the side of the membrane structure 10, the second area 22 and the fourth area 202, which can fully fill the gap between the shell and the membrane structure 10. In addition, since the second ink layer 3 of the membrane structure 10 is arranged in the first area 21, and the edge of the second area 22 is separated from the edge of the first area 21 by a first preset distance L1, the second ink layer 3 is retracted relative to the first ink layer 2, which can avoid the second ink layer 3 from being exposed, so as to reduce the generation of black lines, thereby facilitating the improvement of the product's refinement and yield.

[0193] It should be noted that the method for judging the black line defect rate of the shell can be that the shell is judged as a defective product when black lines appear, or it can be judged as a defective product when the black lines appear on the shell reach a preset length, width or number. In this disclosure, for the convenience of statistics, the former judgment method is adopted, that is, the shell is judged as a defective product when black lines appear.

[0194] The black line defect rate of the shell obtained by the above embodiment of the present disclosure is reduced to less than 0.5%. Compared with the previous black line defect rate of 5-50%, the yield rate of the shell of the present disclosure is significantly improved.

[0195] In an exemplary embodiment of the present disclosure, the third ink layer 30 covers or partially covers the second ink layer 3 .

[0196] Since the third ink layer 30 is used to fill the gap between the shell and the membrane structure 10, and in order to avoid the problem of black lines caused by the overlap of the dark and light colors of the second ink layer 3 and the third ink layer 30, after the second ink layer 3 shrinks compared to the first ink layer 2, the third ink layer 30 fills the shrinking area (i.e., the fourth area 202), and the third ink layer 30 can completely cover the second ink layer 3 (e.g., Fig.10 As shown), the second ink layer 3 may also be partially covered (as shown Fig.11 As shown), both can reduce the black line problem.

[0197] In an exemplary embodiment of the present disclosure, the thickness of the third ink layer 30 is 0.003 mm to 0.1 mm.

[0198] In this embodiment, the thickness of the third ink layer 30 can be adjusted according to the gap between the film structure 10 and the body 20. By providing the third ink layer 30, the edge flatness of the housing can be improved.

[0199] In an exemplary embodiment of the present disclosure, Fig.10 As shown, the housing includes a body 20 , a film structure 10 , and an anti-fingerprint layer 40 stacked on a side of the body 20 away from the film structure 10 , and a side of the film structure 10 away from the first ink layer 2 is arranged on the body 20 .

[0200] In this embodiment, the provision of an anti-fingerprint (AF) layer can reduce the adhesion of fingerprints, which is beneficial to improving the surface smoothness of the housing. The thickness of the anti-fingerprint layer 40 is 5nm to 20nm. For example, the thickness of the anti-fingerprint layer 40 is 5nm, 10nm or 20nm.

[0201] In an exemplary embodiment of the present disclosure, Fig.12 As shown, a method for processing a shell is provided, comprising:

[0202] S510 , disposing a film layer structure 10 on the main body 20 , wherein a side of the film layer structure 10 away from the first ink layer 2 is disposed on the main body 20 .

[0203] In this embodiment, the film structure 10 adopts the film structure 10 in the above embodiment. The film structure 10 can be attached to the body 20 through the adhesive layer 8 on the film structure 10, or the adhesive layer 8 can be provided on the body 20 to attach the film structure 10 to the body 20.

[0204] In an exemplary embodiment of the present disclosure, Fig.13 As shown, a method for processing a shell is provided, comprising:

[0205] S610, the surface of one side of the main body 20 includes a third area 201 and a fourth area 202, the third area 201 is located in the fourth area 202; the edge of the fourth area 202 is separated from the edge of the third area 201 by a second preset distance L2; the side of the film structure 10 away from the first ink layer 2 is set in the third area 201.

[0206] In this step, since the edge of the fourth region 202 is spaced from the edge of the third region 201 by a second preset distance L2, the problem of reduced product refinement due to the offset between the film structure 10 and the body 20 is reduced, thereby reducing the difficulty of processing the shell.

[0207] S620 , a third ink layer 30 is disposed on the surface of the second ink layer 3 of the film layer structure 10 away from the first ink layer 2 , the side surface of the film layer structure 10 , the second region 22 , and the fourth region 202 .

[0208] In this embodiment, the third ink layer 30 can be formed by spraying the third ink (edge ​​filling ink) and then drying it. The third ink layer 30 is arranged on the surface of the second ink layer 3 away from the first ink layer 2, the side of the film layer structure 10, the second area 22 and the fourth area 202, which can fully fill the gap between the shell and the film layer structure 10 to improve the edge flatness of the shell.

[0209] In an exemplary embodiment of the present disclosure, step S620 in the above embodiment is further defined as follows:

[0210] The third ink layer 30 covers or partially covers the second ink layer 3 .

[0211] In this embodiment, the third ink can be sprayed on the second ink layer 3 so that the third ink layer 30 completely covers the second ink layer 3; the third ink can also be sprayed on the edge of the second ink so that the third ink layer 30 partially covers the second ink layer 3.

[0212] In an exemplary embodiment of the present disclosure, Fig.14 As shown, a method for processing a shell is provided, comprising:

[0213] S710 , disposing a film layer structure 10 on the main body 20 , wherein a side of the film layer structure 10 away from the first ink layer 2 is disposed on the main body 20 .

[0214] This step is the same as the implementation of step S510 in the above embodiment, and will not be described again here.

[0215] S720 , an anti-fingerprint layer 40 is stacked on a side of the body 20 away from the film structure 10 .

[0216] In this embodiment, an anti-fingerprint coating can be sprayed on the side of the body 20 away from the film structure 10, and then dried to form an anti-fingerprint layer 40. The anti-fingerprint layer 40 can reduce the adhesion of fingerprints and help improve the surface finish of the housing.

[0217] In an exemplary embodiment of the present disclosure, an electronic device is provided, and the electronic device is, for example, a mobile phone, a laptop computer, a tablet computer, and a wearable device.

[0218] The electronic device comprises the housing, and the housing can reduce the black line problem, thereby improving the aesthetics of the electronic device.

[0219] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the claims.

[0220] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A film structure, characterized in that: The film layer structure comprises a substrate layer, a first ink layer and a second ink layer which are stacked; The surface of the first ink layer on the side away from the substrate layer includes a first area and a second area, and the first area is located in the second area; An edge of the second area is spaced from an edge of the first area by a first preset distance, and the first preset distance is greater than a preset threshold; The second ink layer is disposed in the first region.

2. The film structure according to claim 1, characterized in that: The thickness ratio of the first ink layer to the second ink layer is (0.8-2):

1.

3. The film structure according to claim 1, characterized in that: The thickness of the first ink layer is 0.003 mm to 0.1 mm; The thickness of the second ink layer is 0.003 mm to 0.05 mm.

4. The film structure according to claim 1, characterized in that: The first preset distance is 0.1 mm to 3 mm.

5. The film structure according to claim 1, characterized in that: The substrate layer includes a transparent or translucent substrate.

6. The film structure according to claim 5, characterized in that: The transparent or semi-transparent substrate includes one of polyethylene terephthalate, polycarbonate, and thermoplastic polyurethane elastomer.

7. The film structure according to claim 1, characterized in that: The film layer structure also includes: A first coating layer stacked on a first surface of the substrate layer, and / or a second coating layer stacked on a second surface of the substrate layer, wherein the first surface and the second surface are arranged opposite to each other; The first ink layer is stacked and arranged on a side of the first coating layer away from the substrate layer.

8. The film structure according to claim 7, characterized in that: The first coating layer and / or the second coating layer is formed by stacking two or more of silicon oxide, niobium oxide, titanium oxide and indium.

9. The film structure according to claim 7, characterized in that: The thickness of the first coating layer and / or the second coating layer is 40 nm to 300 nm.

10. The film structure according to claim 7, characterized in that: The film layer structure also includes: A first texture layer is stacked between the substrate layer and the first coating layer, and / or a second texture layer is stacked between the substrate layer and the second coating layer.

11. The film structure according to claim 10, characterized in that: The thickness of the first texture layer and / or the second texture layer is 0.008 mm to 0.05 mm.

12. The film structure according to claim 1, characterized in that: The film layer structure also includes: A glue layer is laminated on a side of the substrate layer away from the first ink layer.

13. The film structure according to claim 12, characterized in that: The thickness of the adhesive layer is 10 μm to 50 μm.

14. A method for preparing a film structure, characterized in that: The preparation method is used to prepare the film layer structure according to any one of claims 1 to 13, and the preparation method comprises: A first ink layer and a second ink layer are sequentially stacked on the substrate layer to obtain the film layer structure; Wherein, the surface of the first ink layer away from the substrate layer includes a first area and a second area, and the first area is located in the second area; An edge of the second area is spaced from an edge of the first area by a first preset distance, and the first preset distance is greater than a preset threshold; The second ink layer is disposed in the first region.

15. The method for preparing a film structure according to claim 14, characterized in that: Before sequentially laminating the first ink layer and the second ink layer on the substrate layer, the method for preparing the film layer structure further includes: A first coating layer is stacked on the first surface of the substrate layer, and / or a second coating layer is stacked on the second surface of the substrate layer, wherein the first surface and the second surface are arranged opposite to each other; The first ink layer is stacked and arranged on a side of the first coating layer away from the substrate layer.

16. The method for preparing a film structure according to claim 15, characterized in that: Before a first coating layer is stacked on the first surface of the substrate layer, and / or before a second coating layer is stacked on the second surface of the substrate layer, the method for preparing the film structure further includes: A first texture layer is laminated on the first surface of the substrate layer, and / or a second texture layer is laminated on the second surface of the substrate layer.

17. The method for preparing a film structure according to claim 14, characterized in that: The method for preparing the film structure further comprises: A glue layer is laminated on a side of the substrate layer away from the first ink layer.

18. A housing, characterized in that: The shell includes a main body and a film layer structure as described in any one of claims 1 to 13, wherein a side of the film layer structure away from the first ink layer is arranged on the main body.

19. The housing according to claim 18, characterized in that The surface of the body on which the membrane structure is disposed comprises a third region and a fourth region, and the third region is located within the fourth region; The edge of the fourth area is spaced from the edge of the third area by a second preset distance; The film layer structure is arranged in the third area.

20. The housing according to claim 19, characterized in that The housing further includes a third ink layer, which is disposed on a surface of the second ink layer away from the first ink layer, a side surface of the film structure, the second region, and the fourth region.

21. The housing according to claim 20, characterized in that The third ink layer covers or partially covers the second ink layer.

22. The housing according to claim 20, characterized in that The thickness of the third ink layer is 0.003 mm to 0.1 mm.

23. The housing according to claim 18, characterized in that The housing further comprises: An anti-fingerprint layer is stacked on a side of the body away from the film structure.

24. A method for processing a shell, characterized in that: include: A film layer structure as described in any one of claims 1 to 13 is arranged on the main body, wherein a side of the film layer structure away from the first ink layer is arranged on the main body.

25. The method for processing a housing according to claim 24, characterized in that: The surface of the body on which the membrane structure is disposed comprises a third region and a fourth region, and the third region is located within the fourth region; The edge of the fourth area is spaced from the edge of the third area by a second preset distance; The processing method of the shell also includes: Disposing the film layer structure in the third area; A third ink layer is disposed on a surface of the second ink layer away from the first ink layer, a side surface of the film structure, the second region, and the fourth region.

26. The method for processing a housing according to claim 25, characterized in that: The third ink layer covers or partially covers the second ink layer.

27. The method for processing a housing according to claim 24, characterized in that: The processing method of the shell also includes: An anti-fingerprint layer is stacked on a side of the body away from the film layer structure.

28. An electronic device, characterized in that: The electronic device comprises a housing as described in any one of claims 18-23.

Images