Electronic device including a covering component

Abstract

An electronic device including a cover member is provided. A housing for an electronic device includes: an outer titanium portion; an inner aluminum connected to the outer titanium portion; and an intermetallic interface disposed between the outer titanium portion and the inner aluminum, the intermetallic interface having a thickness disposed between the inner aluminum and the outer titanium portion.

Description

[0001] This patent application is a divisional application of the Chinese patent application with application number 202410550501.0, application date May 6, 2024, and invention name “Electronic device including a covering component”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims priority to U.S. Provisional Patent Application No. 63 / 500,512, filed on May 5, 2023, and entitled “Electronic Device Including Clad Components,” the entire disclosure of which is hereby incorporated by reference. Technical Field

[0004] The described embodiments generally relate to materials for housings, structures and / or electronic devices. More specifically, embodiments of the present invention relate to cladding components for housings, structures and / or electronic devices having improved decorative finishes, reduced mass, improved machinability and reduced environmental impact. Background Art

[0005] Electronic devices are ubiquitous in society and can take many forms, from watches to computers. Electronic devices, including portable electronic devices such as handheld phones, tablet computers, and watches, can come into contact with a variety of surfaces during use. Additionally, the use, transportation, and storage of such devices can impose mechanical and thermal stresses on the devices.

[0006] Components for these devices, such as housings or casings, may benefit from exhibiting different combinations of properties relevant to the use of the device. Housings for portable electronic devices may have a combination of properties, such as strength, appearance, toughness, wear resistance, weight, corrosion resistance, thermal conductivity, electromagnetic shielding, and cost, so that the device works as required. Certain materials may provide desired performance levels with respect to some properties, but may not provide the best performance levels with respect to other properties. In addition, the combination of multiple materials in complex design configurations may introduce complexity into traditional manufacturing processes, typically increasing costs and processing time. Therefore, it may be desirable to provide a device housing comprising multiple materials to achieve a desired combination of properties that are different to a certain extent, as well as an efficient process for forming these materials. Summary of the invention

[0007] According to some aspects of the present disclosure, a housing for an electronic device includes an outer titanium portion, an inner metal connected to the outer titanium portion, and an intermetallic compound disposed between the inner metal and the outer titanium portion. The inner metal may be a different metal from the outer titanium portion. The intermetallic compound may have a thickness of less than 1 μm.

[0008] In some examples, the intermetallic compound may have a thickness of less than 200 nm. In some examples, the inner metal may include aluminum. In some examples, the intermetallic compound may include Al3Ti. In some examples, the intermetallic compound may be free of discrete oxide particles.

[0009] In some examples, the intermetallic compound can include a continuous layer between the inner metal and the outer titanium portion. In some examples, the intermetallic compound can separate the inner metal from the outer titanium portion. In some examples, the intermetallic compound can include a discontinuous layer between the inner metal and the outer titanium portion. In some examples, the inner metal can contact the outer titanium portion.

[0010] According to some examples, a housing for an electronic device includes an outer titanium portion that at least partially defines a first engagement feature and an inner aluminum portion connected to the outer titanium portion, the inner aluminum portion at least partially defining the first engagement feature. A first surface of the outer titanium portion defining the first engagement feature may include a first plurality of holes, the first plurality of holes having a first hole density and a first average hole depth. A second surface of the inner aluminum portion defining the first engagement feature may include a second plurality of holes, the second plurality of holes having a second hole density and a second average hole depth. The second hole density may be greater than the first hole density, and the first average hole depth may be greater than the second average hole depth.

[0011] In some examples, the first pore density is about 8% to 45%; and the first surface has a first pore depth of 50 μm to 110 μm and a first pore diameter of 50 μm to 110 μm. In some examples, the second pore density is about 30% to 65%; and the second surface has a second pore depth of 25 μm to 50 μm.

[0012] In some examples, the shell may further include an intermetallic compound disposed between the outer titanium portion and the inner aluminum portion, the intermetallic compound comprising Al3Ti. In some examples, the intermetallic compound may include a first layer and a second layer different from the first layer; and the intermetallic compound may have a thickness of less than 500 nm. In some examples, the intermetallic compound may include a continuous layer having a thickness of less than 200 nm. In some examples, the intermetallic compound may include a discontinuous layer having a thickness of less than 150 nm. In some examples, the intermetallic compound may be free of discrete oxide particles.

[0013] According to some examples, a housing for a portable electronic device includes a first titanium-clad sidewall portion that at least partially defines an interior volume and an exterior surface of the portable electronic device. The first titanium-clad sidewall portion may include a metal outer portion and an inner portion bonded to the metal outer portion. The metal outer portion may include a first material having a first set of material properties, and the metal outer portion may at least partially define a first joining feature. The inner portion may include a second material having a second set of material properties independent of the first set of material properties, and the inner portion may at least partially define the first joining feature. The surface of the metal outer portion defining the first joining feature may have a pore density of approximately 8% to 45%, a pore depth of 50μm to 110μm, and a pore diameter of 50μm to 110μm.

[0014] In some examples, the housing may also include a moldable material that mechanically engages the first engagement feature. In some examples, the moldable material may be at least partially disposed in the holes in the surface of the metallic outer portion.

[0015] In some examples, the metal outer portion may include titanium, and the inner portion may include aluminum. In some examples, the first titanium clad sidewall portion may also include an intermetallic compound disposed between the metal outer portion and the inner portion, and the intermetallic compound may include a continuous layer having a thickness of less than 200 nm. In some examples, the first titanium clad sidewall portion may also include an intermetallic compound disposed between the metal outer portion and the inner portion, and the intermetallic compound may include a discontinuous layer having a thickness of less than 150 nm.

[0016] In some examples, the surface defining the inner portion of the first engagement feature can have a pore density of approximately 30% to 65% and a pore depth of 25 μm to 50 μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals represent like structural elements, and in which:

[0018] Figure 1 Electronic devices are shown that include housings and cases formed with the cover materials described herein.

[0019] Figure 2 A perspective view of an electronic device is shown.

[0020] Figure 3 An exploded view of the electronic device is shown.

[0021] Figure 4 An exploded view of a housing for an electronic device is shown.

[0022] Figure 5A perspective view of a portion of a housing for an electronic device is shown.

[0023] Figure 6 A perspective view of a portion of a housing for an electronic device is shown.

[0024] Figure 7 A close-up perspective view of a portion of a housing for an electronic device is shown.

[0025] Figure 8 An outline view of a housing for an electronic device is shown.

[0026] Fig. 9 A flow chart showing a method of forming a cladding material using roll bonding is shown.

[0027] Fig. 10A and Fig. 10B A microscopic cross-sectional view of the cladding material is shown.

[0028] Fig.11 A flow chart of a method for forming a cladding material using direct metal deposition is shown.

[0029] Fig.12 A flow chart of a method for forming a cladding material using nano-pulse laser welding is shown.

[0030] Fig.13A , Fig. 13B , Fig. 13C , Fig.13D and Fig.13E A cross-sectional view illustrating a method of etching a cladding material.

[0031] Fig.13F , Figure 13G and Fig.13H Shown by FIG. 13A to FIG. 13E Microscopic cross-sectional view of a portion of the cladding material etched by the method.

[0032] Fig.13I A cross-sectional view of the etched cladding material is shown.

[0033] Fig.14 A flow chart of a method of forming a cover component for an electronic device is shown. DETAILED DESCRIPTION

[0034] Reference will now be made in detail to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, it is intended to cover substitutions, modifications and equivalents that may be included in the essence and scope of the described embodiments defined by the appended claims.

[0035] The following disclosure relates to composite (e.g., cladding) housings or shells for electronic devices, and methods for forming them. A composite housing or component of a housing may include: an exterior or outer portion having a first set of material properties, also referred to as a shell; and an interior or inner portion having a second set of different material properties independent of the first set of material properties, also referred to as a core. The exterior portion may include a metal material, such as titanium. The interior portion may include a metal material, such as aluminum. The exterior portion and the interior portion may be welded, bonded, adhered, or otherwise connected together so that they form a portion of the housing or shell and act as a composite body. In some examples, the composite body may be treated as a monolithic body with respect to machining, manufacturing, assembly, or other processes. The exterior portion and the interior portion may together define a joining feature that may be mechanically joined to a moldable material positioned at a surface of the composite component, including the exterior portion and the interior portion. The moldable material may mechanically engage the joining feature and connect or join the composite housing to one or more components, mountings, or housings.

[0036] In some examples, the outer portion may include a metal that is more corrosion-resistant and stronger than the metal of the inner portion. The metal of the outer portion may also have a desired decorative appearance and thermal characteristics. In some examples, the inner portion may include a different metal that is more environmentally friendly, has a larger supply, has a smaller density, is easier to machine and / or is easier to weld than the metal of the outer portion. For example, the material and / or geometry of the inner portion may be selected to achieve the desired level of strength, weight, rigidity, cost, thermal conductivity, electromagnetic transparency, machinability, carbon emissions, recyclability, other characteristics, or a combination thereof. At the same time, the material and / or geometry of the outer portion may be independently selected to achieve any of the above characteristics or the desired level of hardness, corrosion resistance, scratch resistance, decorative finish, other characteristics, or a combination thereof. Forming the housing of an electronic device from a composite material allows the housing to achieve the desired characteristics of a variety of materials included in the composite material.

[0037] In some examples, the composite material can be formed using a process that minimizes the thickness of the intermetallic compound formed between the outer portion and the inner portion, thereby improving the adhesion between the outer portion and the inner portion. The selected process can further maximize the respective hardness of the outer portion and the inner portion. In some examples, the selected process may include a roll-bonding process performed at a reduced temperature, which reduces the thickness of the intermetallic compound. In some examples, the roll-bonding process may include a heat treatment step that increases the hardness of the outer portion and the inner portion without excessively increasing the thickness of the intermetallic compound. In some examples, the selected process may include a pulsed laser welding process or a direct metal deposition process.

[0038] The following will refer to Figures 1 to 14to discuss these examples and other examples. However, those skilled in the art will readily appreciate that the detailed description of these figures given herein is for illustrative purposes only and should not be construed as limiting. In addition, as used herein, a system, method, article, component, feature, or sub-feature comprising at least one of a first option, a second option, or a third option should be understood to refer to a system, method, article, component, feature, or sub-feature that may include one of each listed option (e.g., only one first option, only one second option, only one third option), multiple of a single listed option (e.g., two or more first options), two options at the same time (e.g., one first option and one second option), or a combination thereof (e.g., two first options and one second option).

[0039] The methods described herein can be used to form composite materials (also referred to as overlay materials) that have improved adhesion and hardness and have aesthetic appeal to the surface of a housing and / or casing of a consumer device. Figure 1 An example consumer product that can be manufactured using the methods described herein is shown. Figure 1 Included are portable phones 102, tablet computers 104, watches 106, and portable computers 108, each of which may include a housing and / or casing. Devices 102, 104, 106, and 108 may be subjected to impact forces such as scratches, drops, scrapes, chips, and gouging during normal use, and may be subjected to conditions known to cause corrosion to aluminum, aluminum alloys, and titanium-aluminum composite parts. Providing a composite material formed by the methods detailed herein can improve the bonding strength, hardness, appearance, thermal properties, weight, corrosion resistance, processability, etc. of the components of devices 102, 104, 106, and 108.

[0040] Figure 2 A perspective view of electronic device 200 is shown. Figure 2 The illustrated electronic device 200 is a mobile wireless communications device (eg, a smart phone). Figure 2 The smartphone of is only one representative example of a device that can be used in conjunction with the systems and methods disclosed herein. The electronic device 200 can correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, global positioning system (GPS) unit, remote control device, or any other electronic device. The electronic device 200 can be referred to as an electronic device or a consumer device.

[0041] The electronic device 200 may have a housing including a border strip or frame 202 that defines an outer perimeter of the electronic device 200. As described herein, the border strip 202 or a portion thereof may be or may include a composite component. In some examples, the border strip 202 may include several sidewall components, such as a first sidewall component 204, a second sidewall component 206, a third sidewall component 208 (opposite to the first sidewall component 204), and a fourth sidewall component ( Figure 2 As described herein, the aforementioned sidewall component may be or may include a composite component.

[0042] In some examples, some of the sidewall members may form antenna assemblies ( Figure 2 202). Thus, one or more non-metallic materials can separate the sidewall components of the border strip 202 from each other so as to electrically isolate the corresponding sidewall components. For example, the first separation material 212 separates the first sidewall component 204 from the second sidewall component 206, and the second separation material 214 separates the second sidewall component 206 from the third sidewall component 208. As a non-limiting example, the aforementioned materials may include one or more electrically inert materials or electrically insulating materials, such as plastics and / or resins.

[0043] Electronic device 200 may also include a display assembly 216 (shown in dotted lines) covered by a protective cover 218. Display assembly 216 may include multiple layers, each of which provides unique functionality. Display assembly 216 may be partially covered by a frame 220 or a framework that extends along the outer edge of protective cover 218 and partially covers the outer edge of display assembly 216. Frame 220 may be positioned to hide or shield any electrical and mechanical connections between the layers of display assembly 216 and the flexible circuit connector. In addition, frame 220 may exhibit uniform thickness. For example, frame 220 may include a thickness that is not typically changed in X and Y dimensions.

[0044] In addition, if Figure 2 As shown, the example display assembly 216 may include a notch 222, which indicates the absence of the display assembly 216. The notch 222 may allow a visual system that provides information for object recognition, such as facial recognition, to the electronic device 200. In this regard, the electronic device 200 may include a masking layer having an opening (as shown in dashed lines) designed to hide or obscure the visual system, while the opening allows the visual system to provide object recognition information. The protective cover 218 may be formed of a transparent material such as glass, plastic, sapphire, or a similar transparent material. In this regard, the protective cover 218 may be referred to as a transparent cover, a transparent protective cover, or (when the protective cover 218 includes glass) a protective glass. As shown in FIG. Figure 2As shown, the protective cover 218 includes an opening 224, which may represent a single opening of the protective cover 218. The opening 224 may allow acoustic energy (in the form of audible sound) to be transmitted to the electronic device 200, which may be detected by a microphone ( Figure 2 In addition, the opening 224 can allow the acoustic energy (in the form of audible sound) to be transmitted to the outside of the electronic device 200, which can be received by the audio module (not shown) of the electronic device 200. Figure 2 According to some examples, the electronic device 200 may not include buttons commonly found in electronic devices, such as a "home button".

[0045] The electronic device 200 may also include a port 226 designed to receive a connector of a cable assembly. The port 226 allows the electronic device 200 to transmit (send and receive) data information and allows the electronic device 200 to receive power to charge the battery assembly. Therefore, the port 226 may include a terminal electrically coupled to the connector.

[0046] The electronic device 200 may include a number of openings. For example, the electronic device 200 may include an opening 228 that allows an additional audio module ( Figure 2 The electronic device 200 may include an opening 232 that allows a microphone of the electronic device to receive the acoustic energy. The electronic device 200 may include a first fastener 234 and a second fastener 236 that are designed to be fastened to a guide rail coupled to the protective cover 218. In this way, the first fastener 234 and the second fastener 236 are designed to couple the protective cover 218 to the border strip 202.

[0047] The electronic device 200 may include several control inputs designed to provide commands to the electronic device 200. For example, the electronic device 200 may include a first control input 242 and a second control input 244. As a non-limiting example, the aforementioned control inputs may be used to adjust the visual information presented on the display assembly 216 or the amount of acoustic energy output by the audio module. The control may include one of a switch, a sensor, or a button designed to generate a command to the processor circuit. The control input may extend at least partially through an opening in the side wall member. For example, the second side wall member 206 may include an opening 246 that receives the first control input 242. Figure 3 Further details of exemplary electronic devices are provided.

[0048] Figure 3 An exploded view of electronic device 300 is shown. Figure 3The electronic device 300 shown is a smart phone, but is merely a representative example of a device that can be used with or includes the systems and methods described herein. As described with respect to the electronic device 200, the electronic device 300 may also correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, and other electronic devices. In some examples, the electronic device 300 may include some or all of the features described herein with respect to the electronic device 200.

[0049] The electronic device 300 may have a housing including a bezel band 302 that at least partially defines an exterior portion (such as an outer perimeter) of the electronic device 300. Figure 2 202, the border strip 302 may include several side wall components, such as a first side wall component 304, a second side wall component 306, a third side wall component 308 (opposite to the first side wall component 304) and a fourth side wall component 310 (opposite to the second side wall component 306). As described herein, the aforementioned side wall components may be composite components or may include composite components. As described herein, the border strip 302 may also include one or more non-metallic materials that separate and / or connect the side wall components of the border strip 302 from each other. For example, the separation material 314 may separate and / or connect the second side wall component 306 from the third side wall component 308.

[0050] The housing including the border band 302 may include one or more features, such as feature 322, that receive or couple to other components of the device 300. For example, the border band 302 may include any number of features, such as holes, cavities, recesses, and other mating features, that are configured to receive and / or attach to one or more components of the device 300. The electronic device 300 may include internal components such as processors, memory, circuit boards, batteries, and sensors. Such components may be disposed within an internal volume at least partially defined by the border band 302, and may be attached to the border band 302 via an inner surface formed into, defined by, or otherwise part of the border band, an attachment feature such as feature 322, a threaded connector, a stud, a column, and / or other fixing features.

[0051] The device 300 may include internal components, such as a system-in-package (SiP) 326, which includes one or more integrated circuits, such as a processor, a sensor, and a memory. The device 300 may also include a battery 324 housed in the internal volume of the device 300. The device 300 may also include one or more sensors, such as an optical sensor or other sensor, which may sense or otherwise detect information about the environment outside the internal volume of the device 300. Additional components, such as a haptic engine, may also be included in the device 300. The electronic device 300 may also include a display assembly 316 similar to the display assembly 216 described herein. In some examples, the display assembly 316 may be received by the bezel strip 302 and / or attached to the bezel strip via one or more attachment features.

[0052] The electronic device 300 may also include a motherboard 320 that can provide structural support. As described herein, the chassis 320 may include a rigid material such as a metal, or may include a composite construction. The motherboard 320 may also be coupled to the border strip 302. In this way, the motherboard 320 can provide an electrical ground path for electrically coupling components to the motherboard. The electronic device 300 may alternatively or additionally include a backplane 330 having a cladding layer and / or other attachment features, so that one or more components of the electronic device 300 can be attached to the backplane 330, for example, via welding. The backplane 330 can form a conductive path for connecting components of the electronic device 300. In some examples, the backplane 330 can be attached to the border strip 302 of the device 300 via one or more attachment features such as feature 322.

[0053] The outer surface of the electronic device 300 may also be defined by a back cover 340 that may be coupled to the bezel strip 302. In this regard, the back cover 340 may be combined with the bezel strip 302 to form a housing or casing of the electronic device 300, wherein the housing or casing (including the bezel strip 302 and the back cover 340) at least partially defines an interior volume. The back cover 340 may include a transparent material such as glass, plastic, sapphire, or another transparent material.

[0054] The shell including the frame band 302 with one or more composite parts can meet the internal dimension requirements as defined by the internal parts. For example, the structure of the shell including the composite frame band 302 can be limited or restricted by the internal parts that the shell is designed to accommodate, uniquely or mainly. That is, because the shell including the composite frame band 302 can be extremely light and strong, the shell can be shaped to accommodate the internal parts in an efficient manner in size, without being constrained by factors other than the size of the parts, such as the need for additional structural elements. As described herein, the composite parts 304, 306, 308, 310 of the frame band 302 can be formed by a variety of processes. In some examples, these forming processes can allow the shell and / or the frame band 302 to have a specially customized detailed shape or design to meet one or more requirements (such as internal dimension requirements) without the need for additional features to strengthen the structure of the shell. In addition, the artificial traces of the shell manufacturing process can be eliminated. In addition, other components of the electronic device 300 (such as a single internal structural component or external input component of the chassis 320) can be formed by composite components or can include composite components, as described herein.

[0055] Although any number of components or various components of an electronic device (e.g., electronic device 300) may be formed of or may include composite components, the structure of these composite components may be, for example, a composite component including an external portion connected to an internal portion, as described herein. The structure and materials of the external and internal portions, as well as the composite components themselves, may be applied not only to the specific examples discussed herein, but also to any number or type of examples in any combination. Figure 4 Various examples of composite parts are described.

[0056] Figure 4 An electronic device (eg, with respect to Figures 1 to 3 104, 106, 108, 200, or 300). As described herein, the border strip 402 may include one or more portions that are or include a composite component, such as an outer portion connected to an inner portion. For example, the border strip 402 may include a first composite sidewall component 406, a second composite sidewall component 408, a third composite sidewall component 410 (opposite the first composite sidewall component 406), and a fourth composite sidewall component 412 (opposite the second composite sidewall component 408). In some examples, and as described herein, as a non-limiting example, the composite components 406, 408, 410, 412 may be separated and / or connected together by a material 414 that may include one or more electrically inert materials or electrically insulating materials (such as plastics and / or resins).

[0057] although Figure 4The illustrated embodiment includes a border strip 402 having a plurality of composite sidewall components 406, 408, 410, 412 connected together, but in some examples, as described herein, a housing or case for an electronic device may include or may be formed of a single composite component having an inner portion and an outer portion. Additionally, in some examples, the composite component may form a portion of the housing or case other than the sidewalls, such as a top portion, a bottom portion, or any portion of the housing or case. Further details of the composite sidewall components 406, 408, 410, 412 are provided below.

[0058] Figure 5 A perspective view of a composite component 510 is shown, which may be similar to that of FIG. Figure 4 The composite sidewall components 404, 406, 408, 410 described above may include features of these composite sidewall components. Composite component 510 may include an outer or exterior portion 522 connected to an inner or interior portion 524. In this example, exterior portion 522 may at least partially define an exterior surface of a housing or case for an electronic device. Interior portion 524 may at least partially define a surface of an interior volume of the electronic device. Figure 5 As shown, composite component 510 may include a plurality of features 532 , 534 , 536 , which may, for example, serve as attachment features for other components of the electronic device.

[0059] In some examples, the feature may be formed in one or both of the outer portion 522 and the inner portion 524 of the composite component 510. For example, the inner portion 524 of the composite component 510 may include a feature such as a hole 532. In some examples, the feature 532 may be a hole, a recess, a blind hole, or other feature formed in the inner portion 524 by a subtractive process (such as a machining or etching process). In some examples, the feature 532 may serve as an attachment feature for other components of the electronic device. The feature 532 may be configured to receive a component of the electronic device, such as a button or input component. Although depicted as a hole 532, the feature 532 may take any desired form or shape. In some examples, the feature 532 may extend at least partially to a desired depth in the inner portion 524. However, alternatively, the feature 532 may extend substantially completely through the entire thickness of the inner portion 524.

[0060] In some examples, features may be formed in both the outer portion 522 and the inner portion 524 of the composite component 510. For example, feature 534 may be formed in both the outer portion 522 and the inner portion 524 of the component 510, or may be defined by both the outer portion and the inner portion of the component. Feature 534 may be a hole or through hole that at least partially passes through the outer portion 522 and the inner portion 524. In addition, although portions 522, 524 are shown as having a relatively uniform thickness, in some examples, the thickness of the outer portion 522 and / or the inner portion 524 may vary at the location where a feature such as feature 534 is formed. Protruding features (such as feature 536) may be formed in the inner portion 524, for example, by a machining process or an additive manufacturing process, and may serve as attachment features for other components of the electronic device. Although depicted as a protrusion defining a hole therethrough, feature 536 may include any shape or design desired.

[0061] As described herein, the inner portion 524 of the composite component 510 can be selected so that the composite component has a set of material properties required to form features such as features 532, 534, 536. For example, the material of the inner portion 524 can be selected to have a material property or a set of material properties that allow the inner portion 524 to be machinable without causing high levels of wear on machining tools, and / or have machinability, such as easy welding. In addition, the material of the inner portion 524 can be relatively inexpensive, so that the material waste generated by forming the features does not substantially increase the production cost. The material of the inner portion 524 can be selected to be an environmentally friendly material, such as a recycled material. In addition, as described herein, the material of the outer portion can be selected to have a material property or a set of material properties that are independent of the material properties of the inner portion 524, and this material property or this set of material properties allows the outer portion 522 to have, for example, a high level of hardness and corrosion resistance. The material of the outer portion 522 can be selected to have a desired decorative appearance, thermal properties, etc.

[0062] In some examples, features formed in one or both of outer portion 522 and inner portion 524, such as features 532, 534, 536, can have a major dimension ranging from about micrometers to up to about millimeters or several millimeters or more. In some cases, features such as feature 536 can have a major dimension ranging from about 100 micrometers to about 1 millimeter. In addition, in some cases, features such as feature 536 can have a minor dimension ranging from about 100 micrometers to about 1 millimeter.

[0063] In addition, if Figure 5As shown, the outer portion 522 can have a substantially curved shape or profile that can correspond to the outer profile of the electronic device. The outer portion 522 can have any desired shape or profile. In some examples where the outer portion has a substantially curved shape or profile, the inner portion 524 can be positioned completely behind or within the curve that defines the curved profile of the outer portion 522. Figure 6 Additional details of outer portion 522 are provided.

[0064] Figure 6 Shows Figure 5 A perspective view of a composite component 510 of a housing. Figure 6 As shown, one or more regions of the outer portion 522, such as region 538, may be removed so that at least some of the inner portion 524 is exposed. The exposed surface of the inner portion 522 may be treated or otherwise processed, for example, to protect the exposed surface of the inner portion 522. In some examples, the outer portion 522 may include titanium or a titanium alloy, and the inner portion 524 may include aluminum. At region 538, the aluminum of the inner portion 524 is exposed to the outside, and the interface between the titanium of the outer portion 522 and the aluminum of the inner portion 524 may also be exposed.

[0065] In such examples, the interface between the materials of the two portions may form an electrical contact, and one of the materials of portions 522, 524 may be subject to or susceptible to electrical corrosion. Therefore, areas such as area 538 where the interface between the materials of portions 522, 524 is exposed may be processed or treated to prevent or inhibit electrical corrosion. One or more materials may be deposited over the interface between portions 522, 524 at area 538 to prevent or inhibit electrical corrosion. Example materials may include, but are in no way limited to, polymeric materials, metallic materials, ceramic materials, or combinations thereof.

[0066] Alternatively, the geometry of outer portion 522 and / or inner portion 524 may be designed such that the interface between these portions is not exposed even when features such as feature 538 are formed in outer portion 522. For example, outer portion 522 may be thicker at region 538 where feature 538 is formed so that inner portion 524 is not exposed even when material is removed from outer portion 524. Inner portion 524 may be correspondingly thinner at regions where outer portion 522 has an increased thickness so that composite component 510 maintains a relatively uniform thickness.

[0067] Figure 7A perspective view of a portion of a composite component 710 is shown, which may include a preformed outer portion 722 connected to an inner portion 724. The composite component 710 may include a surface 726 defined by both the outer portion 722 and the inner portion 724. Although the surface 726 is depicted as including approximately equal areas defined by each portion, in some examples, one of the inner portion 722 or the outer portion 724 may define substantially more of the surface 726 than the other portion.

[0068] Surface 726 may include one or more engagement features formed thereon. For example, surface 726 may include a plurality of engagement features 732 formed on a portion of the surface defined by outer portion 722, and a plurality of engagement features 734 formed on a portion of the surface defined by inner portion 724 (e.g., surface 726 may include an area of ​​engagement features 732 and an area of ​​engagement features 734). As described herein, engagement features 732, 734 may have a range from nanoscale or micron-scale features to macroscale features with millimeter-scale dimensions. In some examples, as described herein, engagement features 732, 734 may have any desired shape to engage moldable materials. For example, engagement features may include recesses, protrusions, or combinations thereof. In some examples, surface 726 may be subjected to various treatments, such as machining, etching, deposition, etc., so as to form engagement features 732, 734 across the region of surface 726.

[0069] In some examples, the engagement features 732, 734 can allow the composite component 710 to be connected to a second component by mechanical engagement with the moldable material. For example, the moldable material can mechanically engage the engagement features 732, 734 to connect the component 710 to a component (such as a moldable material). Figure 4 Component 408) shown and described is connected.

[0070] In some examples, engagement features 732, 734 may include shapes that allow moldable material to flow or be provided into or around engagement features 732, 734. In some examples, engagement features 732, 734 may allow the moldable material to mechanically engage engagement features 732, 734 to retain the moldable material on composite component 710 when cooled, cured, hardened, or otherwise solidified.

[0071] In some examples, the engagement features 732, 734 can be formed on or in the surface 726 of the composite component 710 defined by the inner portion 724 and the outer portion 722 by any number of additive or subtractive processes. The formation of the engagement features 732, 734 may include subtractive processes such as machining, etching, laser-based processes, cutting, grinding, and other subtractive processes. In some examples, the engagement features 732, 734 can be formed by additive processes, such as deposition processes, spray processes, 3D printing processes, and other similar additive processes. Alternatively, multiple processes can be used to form the engagement features 732, 734.

[0072] Figure 8 A border band 702 including a composite component 710 is shown, as described above. In some examples, the composite component 710 may include a plurality of surfaces defined by an outer portion 722 and an inner portion 724. For example, the composite component 710 may include a second surface (not shown) opposite to the surface 726, which is substantially similar and also includes a bonding feature formed thereon. In addition, one or more other components of the border band 702 (such as components 704 and 708) may similarly include a bonding feature formed on a surface defined by the outer portion and the inner portion. As shown, a moldable material 714 is disposed between the composite component 710 and the components 704, 708 connected thereto. The moldable material 714 may include a polymer material, such as an epoxy or resin, and may be an electrically insulating material. The moldable material 714 mechanically engages with the bonding feature 732, 734 of the composite component 704 and may similarly engage with the bonding feature of the components 710, 708. In this manner, moldable material 714 may be used to connect composite component 710 to additional components 704 , 708 and thereby form border strip 702 .

[0073] In some examples, the composite component 710 including the engagement features 732, 734 can be connected to the additional components 704, 708 including the engagement features by a moldable material 714 that engages with the engagement features of both the composite component 710 and the additional components 704, 708. In some examples, as described herein, multiple composite components can be connected to form a housing, case, or frame for an electronic device. The moldable material 714 can include any desired material, and in some examples, can include an electrically insulating material or an electromagnetically transparent material. In some examples, the moldable material 714 can be used to electrically isolate the composite component 710 from the additional components 704, 708.

[0074] Fig. 9 is a flow chart of a method 900 for forming a composite material that can be used in a composite part, as described herein. The composite material may also be referred to as a cladding material. Fig. 9In method 900, a composite material is formed by rolling. At step 902, various pretreatment steps are performed on the first raw material and the second raw material. The first material may include titanium, titanium alloy, stainless steel, etc. The second material may include aluminum, etc. Before the first material and the second material are connected to each other to form the composite material, the pretreatment step may be used to shape and / or purify the first raw material and the second raw material. Step 902 is optional and may be omitted depending on the shape and purity of the first material and the second material.

[0075] In some examples, step 902 may include one or more vacuum arc remelting (VAR) processes. For example, step 902 may include two VAR processes. The VAR process may be used for the first material and may be used to improve the quality and purity of the first material.

[0076] Various processes may be used to shape the first material. For example, before the first material and the second material are connected, the first material may be formed into a flat steel having a desired size. The first material may be formed into a billet by forging. Forging may be performed at a relatively high temperature. According to one example, the first material may then be formed into a wire by rolling. In this example, multiple rolling processes may be used to form the first material into a wire and reduce the diameter of the wire. The first material may also be formed into a flat steel by stretching. The rolling to form the first material into a wire and the stretching to form the first material into a flat steel may be performed at a relatively high temperature. In some examples, guide rollers may be incorporated into the forming process of the first material to improve dimensional symmetry. In some examples, the corner radius of the flat steel may be reduced by stretching and / or stripping to reduce edge breakage.

[0077] The surface of the first material may then be prepared based on the desired finish or decorative appearance of the composite part. For example, the surface preparation process may be used to produce different finishes in the composite material. The surface preparation process may include brushing, sandblasting, polishing, combinations thereof, or a plurality thereof, etc. Step 902 may include the same, similar, or equivalent process performed on the second material.

[0078] At step 904, the first material and the second material are preheated. In some examples, the preheating of step 904 may include high frequency (HF) induction heating, followed by heating in a furnace. After HF induction heating, the first material may be heated to a lower temperature relative to the temperature of the second material. Similarly, after heating in the furnace, the first material may be heated to a relatively lower temperature than the second material. The first material may be heated to a first temperature by HF induction heating, and the first material may be heated to a second higher temperature by heating in the furnace. The first temperature and the second temperature to which the first material is heated may be relatively lower than conventional processes. The second material may be heated to a first temperature by HF induction heating, and to a second lower temperature by heating in the furnace. Reducing the temperature to which the first material is heated after HF induction heating and after heating in the furnace may increase the bonding strength between the first material and the second material.

[0079] Step 904 may be performed in an inert environment that is isolated from air, contains an inert gas, and includes oxygen monitoring. This may prevent the formation of an alpha shell (a hard and brittle oxygen-rich surface phase that appears when titanium and its alloys are exposed to hot air or oxygen, which typically includes microcracks) in the first material. A pickling and / or stripping process may be used to remove the alpha shell from the first material. The annealing process of the first material may be minimized (e.g., by reducing the temperature or omitting the annealing process) to prevent the formation of an alpha shell. This may result in reduced delamination of the first material and the second material when the first material and the second material are joined to form a composite material, as well as reduced edge fractures between the first material and the second material in the composite material.

[0080] At step 906, the first material and the second material are connected together and combined to form a composite material. In method 900, the first material and the second material can be connected by a process such as roll bonding. For example, the first material and the second material can pass through a pair of flat rollers under high pressure to combine the first material and the second material to form a composite material. The roll bonding process can be followed by a subsequent forming process, such as a stretching or flattening process performed by passing the composite material through another roller or applying tension to the length of the composite material. The composite material may include an inner portion formed by a second material (e.g., aluminum, etc.), and an outer portion formed on opposite sides of the inner portion and formed by a first material (e.g., titanium, titanium alloy, stainless steel, etc.). In other words, the composite material may include a second material sandwiched between the first material. In some examples, the composite material may include a layer of the first material adjacent to a layer of the second material.

[0081] In step 908, the composite material is subjected to a heat treatment process. In some examples, the heat treatment process may include multiple heat treatment processes, such as a first heat treatment and a second heat treatment. The first heat treatment performed at different temperatures and for different durations may affect the formation of intermetallic compounds between the first material and the second material. For example, the first heat treatment performed at a high temperature for a long duration may result in the formation of two IMCs (e.g., two layers of IMC, such as a first IMC layer and a second IMC layer including a material different from the first IMC layer) with a thickness of about 300nm and 200nm between the first material and the second material. In some examples, the first IMC layer and the second IMC layer may have different titanium and aluminum ratios. The first heat treatment performed at a medium temperature for a long duration may result in the formation of a single continuous IMC with a thickness of about 200nm between the first material and the second material. The first heat treatment performed at a low temperature for a long duration may result in the formation of a single discontinuous IMC with a thickness of about 100nm between the first material and the second material. The first heat treatment performed at a low temperature for a short duration may result in the formation of a single discontinuous IMC with a thickness of about 150nm between the first material and the second material. Higher temperatures and longer durations increase hardness and reduce bonding strength. Lower temperatures and shorter durations reduce hardness and increase bond strength.

[0082] In one example, the first thermal treatment may be a T4 temper and may be used to optimize the interface quality between the first material and the second material. The first thermal treatment may be followed by a second thermal treatment, which may be a T6 temper according to one embodiment. The second thermal treatment may increase the strength of the first material and / or the second material. Various leveling and / or forming processes may be performed before, between, and after the first thermal treatment and the second thermal treatment. For example, a roll leveling process may be performed on the composite material after the first thermal treatment, and a three-point leveling process may be performed on the composite material after the second thermal treatment. In some examples, the leveling process may be used to correct any warping or deformation that occurs in the composite material due to the thermal treatment process.

[0083] At step 910, the composite material is shaped. In some examples, the shaping may include a double disc grinding process, a U-bending process, a forging process, combinations thereof, and the like. The double disc grinding process may remove material of the composite material, such as removing an alpha shell formed in the composite material. In some examples, the double disc grinding process may be performed to remove about 10 μm to about 15 μm, about 5 μm to about 20 μm, about 0 μm to about 5 μm, and the like of material from the composite material. Removing the alpha shell may prevent edge fractures and delamination in the composite material. The U-bending and forging processes may be warm processes performed at an elevated but relatively low temperature. The U-bending process may be performed to form the composite material into a U-shape. The U-bending process may be performed after a heat treatment process, such as after a second heat treatment. The composite material may include a second material layer between the first material layers, and each material layer may have a continuous U-shape, including corners around the U-shape. The forging process may be used to produce various features in the composite material, such as those described above with respect to Figures 1 to 8 The features discussed.

[0084] Fig. 10A and Fig. 10B A microscopic cross-sectional view of a composite material 1000 is shown. Composite material 1000 includes a first material 1002, a second material 1004, and an intermetallic compound 1006 between the first material 1002 and the second material 1004. Intermetallic compound 1006 may be an alloy, etc., and may include metals from the first material 1002 and the second material 1004. In some examples, first material 1002 may include titanium, titanium alloy, stainless steel, etc. Second material 1004 may include aluminum, etc. In some examples, intermetallic compound 1006 may include Al3Ti, Ti3Al, etc. In some examples, intermetallic compound 1006 may have a gradient concentration of the first material and the second material, and the ratio of the first material to the second material may vary from particle to particle within intermetallic compound 1006. In some examples, intermetallic compound 1006 may include TiAl adjacent to first material 1002 and Al3Ti adjacent to second material 1004. A continuous magnesium oxide layer may be formed in intermetallic compound 1006 between first material 1002 and second material 1004. The silicon concentration in the first material 1002 may be increased near the intermetallic compound 1006 .

[0085] The intermetallic compound 1006 may be a continuous layer (eg, Fig. 10A or a discontinuous layer such that the first material 1002 and the second material 1004 are in contact with each other (as shown); Fig. 10B ). Fig. 10AIn the example of a continuous layer of the intermetallic compound 1006, the intermetallic compound 1006 may have a relatively small thickness T1, such as less than about 1 μm, less than about 500 nm, less than about 200 nm, less than about 150 nm, less than about 100 nm, in the range of about 0.01 nm to about 100 nm, about 50 nm to about 200 nm, etc. Fig. 10B In the example of a discontinuous layer of the intermetallic compound 1006, the intermetallic compound 1006 may have a relatively small thickness T2, such as less than about 1 μm, less than about 500 nm, less than about 200 nm, less than about 150 nm, less than about 100 nm, in a range of about 0.01 nm to about 100 nm, about 50 nm to about 200 nm, etc. Minimizing the thickness of the intermetallic compound 1006 may improve adhesion between the first material 1002 and the second material 1004. Forming the composite material 1000 by rolling or the like may reduce the thickness of the intermetallic compound 1006 and improve adhesion between the first material 1002 and the second material 1004. In addition, the intermetallic compound 1006 may not contain discrete oxide particles, which may further improve the bonding between the first material 1002 and the second material 1004.

[0086] Fig.11 1 is a flow chart of a method 1100 for forming a composite material that can be used in a composite part, as described herein. The composite material may also be referred to as a cladding material. Fig.11 In the method 1100, the composite material is formed by direct metal deposition. For example, the first material can be formed on the second material by melting the first material onto the second material. The first material may include titanium, titanium alloy, stainless steel, etc. The second material may include aluminum, etc.

[0087] At step 1102, the surface of the second material may be prepared. This may include various surface modifications, such as sandblasting, sandblasting combined with drilling holes in the surface, laser texturing (such as with a line pattern or a dot pattern, which may include 20 μm holes, 2.0 mm vertical holes, etc.), combinations thereof, etc. In examples where the surface modification includes sandblasting, the surface may have a surface roughness of about 0.96 Sa (or about 0.85 Sa to about 1.05 Sa) and a surface roughness of about 1.21 Sq. (or about 1.10 Sq. to about 1.30 Sq.). In examples where the surface modification includes laser texturing with a line pattern, the surface may have a surface roughness of about 2.67 Sa (or about 2.40 Sa to about 2.90 Sa) and a surface roughness of about 3.85 Sq. (or about 3.50 Sq. to about 4.20 Sq.). In examples where the surface modification includes laser texturing with a hole pattern, the surface can have a surface roughness of about 0.97 Sa (or about 0.90 Sa to about 1.10 Sa) and a surface roughness of about 2.26 Sq. (or about 2.00 Sq. to about 2.50 Sq.). Surface modification of the surface of the second material can improve adhesion between the first material and the second material and can be used to provide a desired surface texture and decorative finish.

[0088] At step 1104, a first material is deposited on a surface of a second material. In some examples, the first material may be deposited from titanium wire, titanium powder, etc., and may be deposited on a second material, which may include an aluminum substrate. Depositing the first material on the second material by direct metal deposition may result in improved material utilization, 5-axis capability (e.g., the ability to produce a desired shape / contour of the first material on the second material), may have multiple material capabilities (e.g., may be used to deposit a series of first materials on a series of similar or dissimilar second materials), may be used to produce additional features on the second material, and may be used to repair the second material. However, depositing the first material on the second material by direct metal deposition may have relatively poor adhesion of the first material to the second material, and may result in warping, cosmetic challenges, or other deformation of the second material.

[0089] In some examples, a relatively thick intermetallic compound may be formed between the first material and the second material. The intermetallic compound may include a composite metal oxide, and a heat-affected zone may be formed around the intermetallic compound (e.g., in a portion of the second material adjacent to the intermetallic compound and the first material). This may adversely affect the material properties of the composite material formed by method 1100.

[0090] In some examples, the second material may include 6000 series aluminum and the first material may include Ti64. The composite material may include a titanium molten pool and Al3Ti intermetallic grains grown into the aluminum substrate. The intermetallic compound may have a thickness in the range of about 1 μm to about 2 μm. Oxides may be present in the second material, which may reduce the tensile strength of the composite material.

[0091] In some examples, the second material may include 7000 series aluminum and the first material may include Ti64. The composite material may include a titanium molten pool, Al3Ti intermetallic grains grown into the aluminum substrate, and recrystallized grains of the aluminum substrate adjacent to the intermetallic compound. The intermetallic compound may have a thickness in the range of about 0.2 μm to about 0.3 μm. The composite material may be relatively free of oxides, which may increase the tensile strength of the composite material.

[0092] Fig.12 is a flow chart of a method 1200 for forming a composite material that can be used in a composite part, as described herein. The composite material may also be referred to as a cladding material. Fig.12 In method 1200, a composite material is formed by nano-pulse laser welding. At step 1202, a sheet of a first material may be positioned on or adjacent to a sheet of a second material. The first material may include titanium, a titanium alloy, stainless steel, etc. The first material may have a thickness of up to about 0.5 mm. The second material may include aluminum, etc.

[0093] At step 1204, a nanosecond pulsed laser welding process is performed on the first material to bond the first material to the second material. Nanosecond pulsed laser welding can produce a small rivet molten pool at each location caused by the laser pulse while producing minimal intermetallic compounds between the first material and the second material. In some examples, nanosecond pulsed laser welding can be used to harden the second material by joining the second material to a harder first material while maintaining a desired decorative finish. The distribution of weld locations on the first material and the second material and the weld density can be varied to minimize warping of the first material and the second material and maximize the bond strength between the first material and the second material.

[0094] FIG. 13A to FIG. 13E A cross-sectional view of a method of etching a composite material 1300 including a first material 1302 and a second material 1304 is shown. Fig.13A Composite material 1300 is shown including first material 1302 bonded to second material 1304. First material 1302 may include titanium, titanium alloy, stainless steel, etc. Second material 1304 may include aluminum, etc. Second material 1304 may include a metal material that is relatively easier to etch than the metal material of first material 1302.

[0095] exist Fig. 13B, a protective layer 1306 is formed on the second material 1302. In some examples, the protective layer 1306 may include an anodized layer. The protective layer 1306 may be formed by anodizing the second material 1302, such as by anodizing the second material 1302 with sulfuric acid. The protective layer 1306 may have a thickness in a range of about 12 μm to about 15 μm.

[0096] exist Fig. 13C In some examples, the first material 1302 may be etched in a solution including ferric chloride (e.g., FeCl3), propylene glycol, and gluconate. The first material 1302 may be etched so that the pores 1308 have a pore density of about 8% to about 45% of the area of ​​the first material 1302, a pore depth in the range of about 50 μm to about 110 μm, and a pore diameter in the range of about 90 μm to about 130 μm. The second material 1304 is protected by the protection layer 1306 so that the second material 1304 is not etched by the etching process used to etch the first material 1302 .

[0097] exist Fig.13D In the embodiment, the protective layer 1306 is removed. After the protective layer 1306 is removed, the top surface of the second material 1304 is exposed. Fig.13E , the second material 1304 is etched to form holes or openings 1310. The second material 1304 can be etched in a solution including ferric chloride (e.g., FeCl3), sulfuric acid (H2SO4), and tartaric acid (C4H6O6). The second material 1304 can be etched so that the holes 1310 have a hole density of about 20% to about 70% of the area of ​​the second material 1304 or about 30% to about 65% of the area of ​​the second material 1304, a hole depth in the range of about 25 μm to about 50 μm, and a hole diameter in the range of about 90 μm to about 130 μm. Therefore, the holes 1310 in the second material 1304 can have a greater hole density than the holes 1308 of the first material 1302. The holes 1308 in the first material 1302 can have a greater hole depth (e.g., a greater average hole depth) than the holes 1310 of the second material 1304. A moldable material, such as moldable material 714 described above, may flow into holes 1308 , 1310 to mechanically engage holes 1308 , 1310 and couple the moldable material to a composite component including composite material 1300 .

[0098] according to FIG. 13A to FIG. 13D In the example shown, forming a protective layer on the second material 1304 can allow the first material 1302 to be etched by a more extreme process that would quickly deplete the second material without the protective layer. According to this example, a hole 1308 formed in the first material 1302 is formed, the protective layer 1306 is removed, and the second material 1304 is exposed to a process that does not significantly affect the hole 1308 formed in the first material 1302, while the hole 1310 is formed in the second material. In this way, the holes 1308, 1310 can have substantially similar geometries and properties, but are different materials.

[0099] Fig.13F and Figure 13G Shown by FIG. 13A to FIG. 13E Microscopic cross-sectional view of a portion of the cladding material etched by the method. Fig.13F is through relative to Fig. 13C A microscopic cross-sectional view of the first material 1302 including the holes 1308 after etching the first material 1302 by the etching process discussed. Figure 13G is through relative to Fig.13E A microscopic cross-sectional view of the second material 1304 including holes 1310 after the etching process discussed etches the second material 1304. Holes 1308 and holes 1310 may have similar characteristics, such as hole density, hole depth, and hole diameter. Holes 1308 formed in the first material may have more uniform characteristics, such as more uniform hole density, hole depth, and hole diameter, compared to holes 1310.

[0100] Fig.13H Shown by FIG. 13A to FIG. 13E Scanning electron microscope view of a portion of a cladding material, such as a titanium portion, etched by the method. Fig.13I Shows Fig.13H A cross-sectional view of the etched cladding material is shown. Fig.13IAs shown, the first material 1302 may be etched to include coarse pores and fine pores. In other words, the etching process may form holes or openings 1308 so that the coarse pore diameter is in the range of about 1 μm to about 1000 μm, about 5 μm to about 800 μm, or about 20 μm to about 500 μm. The coarse pores may include a pore depth in the range of about 1 μm to about 100 μm, about 5 μm to about 80 μm, or about 10 μm to about 60 μm. In the coarse etching, the pores 1308 may also include or define micropores within the larger coarse pores on the surface. In other words, the larger coarse pores 1308 may include fine pores with pore sizes in the range of about 1 nm to about 3000 nm, about 25 nm to about 2500 nm, or about 50 nm to about 2000 nm on the inner surface of the coarse pores. In some examples, the first material 1302 is etched to include fine etching. In fine etching, the etching process may form or define holes or openings 1308 such that the hole diameter is in the range of about 25 nm to about 250 nm or about 50 nm to about 100 nm. Fig.13H As shown, the etched titanium surface may include a combination of both coarse and fine pores.

[0101] Fig.14 14 is a flow chart of a method 1400 for forming a composite component for an electronic device having a bonding feature on a surface, as described herein. At step 1402, the method 1400 for forming a composite component may include connecting a first portion (such as an outer portion) including a first material having a first material property or a first set of material properties with a second portion (such as an inner portion) including a second material having a second material property or a second set of material properties. The method 1400 may also include forming one or more features in at least the second portion at step 1404, and processing a surface defined by the first portion and the second portion to form a bonding feature thereon at step 1406.

[0102] At step 1402, a first portion (such as an outer portion) of a composite component may be connected to a second portion (such as an inner portion) as described herein. The first portion may include a first material, and the second portion may include an independently selected second material. The materials of the first portion and the second portion may include any of the materials described herein with respect to the inner portion and / or the outer portion of the composite component.

[0103] In some examples, the first portion may be described by referring to Fig. 9 The roll bonding process is connected to the second part to form a composite material. In some examples, the first part can be connected to the second part by the roll bonding process described above. Fig.11 The direct metal deposition process described above is connected to the second part to form a composite material. In some examples, the first part can be formed by Fig.12The nano pulse welding process is connected to the second part to form a composite material. The first part and the second part can be connected by chemical bonding, metallurgical bonding, mechanical bonding and other connection methods.

[0104] At step 1404, one or more features are formed in at least the second portion of the composite component. The one or more features may be formed according to any process or method described herein, such as an additive or subtractive manufacturing process. For example, the one or more features may be formed in at least the second portion by machining, etching, deposition, molding, or other processes. In some examples, as described herein, the one or more features may be formed in both the first portion and the second portion. In some examples, the forming of the one or more features in at least the second portion at step 1404 may occur substantially simultaneously with the connecting step at step 1402.

[0105] At step 1406, the surface defined by the first portion and the second portion may be processed to form a bonding feature on or in the surface, as described herein. FIG. 13A to FIG. 13E The process can be used to form holes 1308, 1310 in the first part and the second part, which can form a bonding feature in the surface of the first part and the second part. In some examples, the bonding feature may have a range in size from nanoscale or micron-scale features to macroscale features with millimeter-scale dimensions. In addition, in some examples, the treatment at step 1406 may form more than one bonding feature on the surface. The treatment process may include any number of additive processes or subtractive processes. In some examples, the bonding feature forming process may form a bonding feature on a portion of the surface defined by the inner portion, but may not form a bonding feature on the portion of the surface defined by the outer portion or otherwise substantially damage or degrade the portion of the surface defined by the outer portion. In some examples, the treatment process may additionally form a bonding feature on a portion of the surface defined by the outer portion, but may not form a bonding feature on the portion of the surface defined by the inner portion or otherwise substantially damage or degrade the portion of the surface defined by the inner portion. That is, in some examples, the processing at step 1406 may form a joining feature on only a portion of a surface defined by one of the inner portion or the outer portion during one stage, and may form a joining feature on a portion of a surface defined by the other portion of the inner portion or the outer portion during a second stage.

[0106] In some examples, the processing stage at step 1406 may affect only or substantially affect the material of one of the inner portion or the outer portion. However, in some examples, the portion of the surface defined by one of the inner portion or the outer portion may be masked or otherwise processed (e.g., using a protective layer 1306) so that the processing stage only affects or forms features on an unmasked portion or an unprocessed portion (e.g., the first portion 1302). In some examples, the processing may form one or more engagement features on a portion of the surface defined by both the inner portion and the outer portion. The processing at step 1406 may include one or more subtractive processing processes, such as machining, etching, laser-based processes, cutting, grinding, and similar subtractive processes. In some examples, the processing at step 1406 may include additive processes, such as deposition processes, thermal spray processes, 3D printing processes, and other similar additive processes. In some examples, the processing at step 1406 may include multiple processes to form one or more engagement features.

[0107] In some examples, method 1400 may also include providing a moldable material, such as moldable material 714 described herein, to a surface including an engagement feature. The moldable material may be provided in a moldable or flowable form. Method 1400 may also include hardening, curing, cooling, or otherwise solidifying the moldable material so that the moldable material mechanically engages with the formed engagement feature. For example, as described herein, the moldable material may also mechanically engage with one or more other components and may be used to connect these components together.

[0108] To the extent applicable to the present technology, the collection and use of data obtained from various sources may be used to improve the delivery of inspirational content or any other content that may be of interest to users. The present disclosure contemplates that in some instances, such collected data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, ID, home address, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0109] The present disclosure recognizes that the use of such personal information data in the present invention technology can be used to benefit users. For example, the personal information data can be used to deliver targeted content that users are more interested in. Therefore, the use of such personal information data enables users to have planned control over the content delivered. In addition, the present disclosure also anticipates other uses of personal information data that benefit users. For example, health and fitness data can be used to provide insights into the user's overall health status, or can be used as positive feedback for individuals who use technology to pursue health goals.

[0110] This disclosure envisions that entities responsible for collecting, analyzing, disclosing, transmitting, storing or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as the collection and / or use of data changes. Personal information from users should be collected for legitimate and reasonable purposes of the entity and not shared or sold outside of these legitimate uses. In addition, such collection / sharing should be performed after receiving informed consent from the user. In addition, such entities should consider taking any necessary steps to safeguard and protect access to such personal information data and ensure that others who have access to personal information data comply with their privacy policies and processes. In addition, such entities may subject themselves to third-party assessments to demonstrate their compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to specific types of personal information data collected and / or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA), while health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained in each country for different types of personal data.

[0111] Regardless of the foregoing, the present disclosure also contemplates implementation schemes in which users selectively block the use or access of personal information data. That is, the present disclosure contemplates that hardware elements and / or software elements may be provided to prevent or block access to such personal information data. For example, with respect to an advertising delivery service, the technology of the present invention may be configured to allow a user to choose to "opt in" or "opt out" at any time during or after registration for the service to participate in the collection of personal information data. In another example, a user may choose not to provide emotion-related data for a target content delivery service. In another example, a user may choose to limit the length of time that emotion-related data is retained, or completely prohibit the development of basic emotional conditions. In addition to providing "opt-in" and "opt-out" options, the present disclosure also contemplates providing notifications related to access or use of personal information. For example, a user may be notified that their personal information data will be accessed when downloading an application, and then the user may be reminded again just before the personal information data is accessed by the application.

[0112] Furthermore, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risks can be minimized by limiting data collection and deleting data once it is no longer needed. Additionally, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. De-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at a city level rather than at an address level), controlling how data is stored (e.g., aggregating data across users), and / or other methods, where appropriate.

[0113] Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the present disclosure also contemplates that various embodiments may also be implemented without access to such personal information data. That is, various embodiments of the present technology will not fail to function properly due to the lack of all or a portion of such personal information data. For example, content may be selected and delivered to a user by inferring preferences based on non-personal information data or an absolute minimum amount of personal information, such as content requested by a device associated with the user, other non-personal information available to a content delivery service, or publicly available information.

[0114] For the purpose of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that specific details are not required in order to practice the embodiments. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. They are not intended to be exhaustive or to limit the embodiments to the disclosed precise forms. It will be apparent to those of ordinary skill in the art that, in view of the above teachings, many modifications and variations are feasible.

Claims

1. A housing for an electronic device, the housing comprising: External titanium section; an inner aluminum portion connected to the outer titanium portion; and An intermetallic interface is disposed between the outer titanium portion and the inner aluminum, the intermetallic interface having a thickness disposed between the inner aluminum and the outer titanium portion. 2 . The housing of claim 1 , wherein the metal-to-metal interface has a thickness of less than 1 μm.

3. The housing of claim 1, wherein the metal-to-metal interface has a thickness of less than 200 nm. The enclosure of claim 1 , wherein the intermetallic interface comprises a high magnesium phase.

5. The enclosure of claim 1 wherein the metal-to-metal interface is free of discrete oxide particles.

6. The housing according to claim 1, wherein: The intermetallic interface comprises a continuous layer between the inner aluminum and the outer titanium portion; and The intermetallic interface separates the inner aluminum from the outer titanium portion.

7. The housing according to claim 1, wherein: The intermetallic interface comprises a discontinuous layer between the inner aluminum and the outer titanium portion; and The inner aluminum is in contact with the outer titanium portion.

8. A housing for an electronic device, the housing comprising: an outer titanium portion at least partially defining a first engagement feature; and an inner aluminum portion connected to the outer titanium portion, the inner aluminum portion at least partially defining an engagement surface having an engagement feature; and A non-metallic portion engages with the engagement feature to connect the non-metallic portion to the inner aluminum portion.

9. The housing according to claim 8, wherein: The non-metallic portion comprises plastic.

10. The housing according to claim 8, wherein The bonding feature includes a plurality of holes in the oxide layer.

11. The housing according to claim 10, wherein: The plurality of apertures has a density between about 30% and 65%; and The plurality of pores has an average pore depth of between 25 μm and 50 μm.

12. The housing of claim 8, further comprising an intermetallic compound disposed between the outer titanium portion and the inner aluminum portion, the intermetallic compound comprising Al3Ti.

13. The housing according to claim 8, wherein: The engagement features include etched features on a engagement surface of the inner aluminum portion.

14. The housing of claim 8, further comprising an intermetallic compound between the outer titanium portion and the inner aluminum portion, the intermetallic compound comprising a mechanical surface interlocking structure between the outer titanium portion and the inner aluminum portion.

15. The housing according to claim 14, wherein The intermetallic compound includes a high magnesium phase.

16. A housing for a portable electronic device, the housing comprising: A wraparound sidewall portion at least partially defines an interior volume and an exterior surface of the portable electronic device and includes: a titanium outer portion at least partially defining an engagement surface; an aluminum inner portion bonded to the titanium outer portion, the aluminum inner portion at least partially defining the joining surface; wherein the engagement surface comprises at least one of a plurality of etched engagement features or a plurality of holes; and A non-metallic portion engages at least one of the plurality of etched engagement features or the plurality of holes to couple the non-metallic portion to the clad sidewall portion.

17. The housing of claim 16, the non-metallic portion comprising a moldable material at least partially disposed in at least one of the plurality of etched engagement features or the plurality of holes.

18. The housing according to claim 16, wherein The non-metallic portion includes a polymer.

19. The housing according to claim 18, wherein The polymer includes a resin.

20. The housing of claim 16, wherein: The non-metallic portion is coupled to the engagement surface via a mechanical surface interlocking structure.

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