Display panel, manufacturing method of display panel and electronic equipment

Abstract

The invention provides a display panel, a manufacturing method of the display panel and electronic equipment, the display panel comprises a driving backboard and at least one light emitting device, and the driving backboard comprises a bonding surface; the light-emitting device is arranged on the bonding surface of the driving back plate; the light-emitting device comprises a first surface facing the driving backboard, a second surface opposite to the first surface and a side face located between the first surface and the second surface. At least part of the side face of the light-emitting device is covered with a reflection layer, and the reflection layer comprises a metal layer and a first protection layer which are sequentially stacked in the direction from the side face to the side face. According to the structure, the metal layer and the first protective layer are sequentially arranged on the side face of the light-emitting device to serve as the reflecting layer, the light emitted by the side face of the light-emitting device is reflected through the reflecting layer, the light emitted by the light-emitting device can be prevented from being excessively dispersed, and therefore the light emitting efficiency of the display panel under the specific visual angle is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] With the development of display device manufacturing technology, mini light-emitting diodes (Mini LED) and micro light-emitting diodes (Micro-LED) are widely used because of their greater advantages in terms of excellent brightness, resolution, contrast, energy consumption, service life, response speed and thermal stability. At present, there are still some problems with LED chips during long-term use, such as insufficient reliability. In order to improve the reliability of LED chips, packaging processing is usually performed. However, packaging processing may cause loss of light efficiency. Due to the presence of packaging film, part of the light may be absorbed, reflected or scattered, resulting in reduced light transmission efficiency. Summary of the invention

[0003] In order to overcome the above-mentioned deficiencies in the prior art, the object of the present application is to provide a display panel, the display panel comprising:

[0004] A drive backplane, the drive backplane comprising a bonding surface;

[0005] At least one light emitting device disposed on the bonding surface of the driving backplane;

[0006] The light emitting device comprises a first surface facing the driving backplane, a second surface arranged opposite to the first surface, and a side surface located between the first surface and the second surface;

[0007] At least part of the side surface of the light emitting device is covered with a reflective layer, and the reflective layer includes a metal layer and a first protective layer which are sequentially stacked in a direction from close to the side surface to far away from the side surface.

[0008] In a possible implementation, the material of the metal layer includes silver;

[0009] Preferably, the material of the first protective layer includes metal oxide;

[0010] Preferably, the material of the first protective layer includes indium tin oxide. In a possible implementation, the reflective layer further includes a light-transmitting second protective layer, and the second protective layer is located on a side of the metal layer close to the side surface;

[0011] Preferably, the material of the second protective layer includes metal oxide;

[0012] Preferably, the material of the second protective layer includes indium tin oxide.

[0013] In a possible implementation, the reflective layer includes a second protective layer, the metal layer, and the first protective layer stacked in sequence from close to the side surface to away from the side surface; the material of the second protective layer is indium tin oxide, the material of the first protective layer is silver, and the material of the first protective layer is indium tin oxide.

[0014] In a possible implementation manner, the thickness of the metal layer is greater than the thickness of the first protective layer and the second protective layer.

[0015] In a possible implementation, the display panel further includes a light shielding layer located on the bonding surface of the driving backplane, and the light shielding layer exposes the second surface and at least a portion of the side surface of the light emitting device.

[0016] In a possible implementation, the light emitting device includes four side surfaces, and the four side surfaces are opposite to each other in pairs; the reflective layer covers two of the side surfaces that are opposite to each other;

[0017] Alternatively, the reflective layer covers each of the side surfaces of the light emitting device.

[0018] Another object of the present application is to provide a method for manufacturing a display panel, the method for manufacturing a display panel comprising:

[0019] Providing a drive backplane, the drive backplane comprising a bonding surface;

[0020] At least one light emitting device is arranged on the bonding surface of the driving backplane, and the light emitting device includes a first surface facing the driving backplane, a second surface arranged opposite to the first surface, and a side surface located between the first surface and the second surface;

[0021] Sequentially forming a metal layer and a first protective layer covering the driving backplane and the light-emitting device as an encapsulation layer;

[0022] The encapsulation layer is subjected to patterned etching, so as to retain at least a portion of the reflective layer disposed on the side surface and remove the encapsulation layer at other positions.

[0023] In a possible implementation, the step of sequentially forming a metal layer and a first protective layer covering the driving backplane and the light-emitting device as an encapsulation layer includes:

[0024] A second protective layer, a metal layer and a first protective layer covering the driving backplane and the light-emitting device are sequentially formed as a packaging layer.

[0025] Another object of the present application is to provide an electronic device, which includes the display panel provided in the present application.

[0026] Compared with the prior art, this application has the following beneficial effects:

[0027] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and an electronic device. By sequentially arranging a metal layer and a first protective layer as a reflective layer on the side of a light-emitting device, the reflective layer reflects the light emitted from the side of the light-emitting device, thereby preventing the light emitted by the light-emitting device from being excessively dispersed, thereby improving the light output efficiency of the display panel at a specific viewing angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 This is one of the top view schematic diagrams of the display panel provided in the embodiment of the present application;

[0030] Figure 2 One of the cross-sectional schematic diagrams of the display panel provided in the embodiment of the present application;

[0031] Figure 3 A second cross-sectional schematic diagram of a display panel provided in an embodiment of the present application;

[0032] Figure 4 A third cross-sectional schematic diagram of a display panel provided in an embodiment of the present application;

[0033] Figure 5 A second schematic top view of a display panel provided in an embodiment of the present application;

[0034] Figure 6 A third schematic top view of a display panel provided in an embodiment of the present application;

[0035] Figure 7 A schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0036] Figure 8 A schematic diagram of the structure of a method for manufacturing a display panel provided in an embodiment of the present application;

[0037] Fig. 9 This is a fourth cross-sectional schematic diagram of the display panel provided in the embodiment of the present application.

[0038] Icon: 100 - driving backplane; 200 - light-emitting device; 300 - packaging layer; 400 - light-shielding layer; 310 - reflective layer; 311 - metal layer; 312 - first protective layer; 313 - second protective layer. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0041] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0042] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0043] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0044] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings.

[0045] Please refer to Figure 1 , Figure 1 A schematic structural diagram of a display panel provided in this embodiment is illustrated. In this embodiment, the display panel includes a driving backplane 100 and at least one light-emitting device 200. The light-emitting device 200 may be a Micro LED or Mini LED chip. In this embodiment, the size of the light-emitting device 200 is not specifically limited.

[0046] The driving backplane 100 may include multiple film layer structures, such as a substrate, a buffer layer, an active layer, multiple metal layers, multiple insulating layers, and a planarization layer. The multiple film layer structures may form multiple thin film transistors (TFTs) at different positions of the driving backplane 100, and the thin film transistors may cooperate with each other to form multiple driving units, and the driving units are used to drive the light emitting device 200 to emit light. At least one or a pair of bonding electrodes may be provided on one side of the driving backplane 100, and the bonding electrodes are used to be electrically connected to the light emitting device 200.

[0047] Please refer to Figure 2 The driving backplane 100 includes a bonding surface, on which bonding electrodes for bonding the light emitting device 200 may be provided, and the driving unit in the driving backplane 100 may transfer electric energy to the light emitting device 200 through the bonding electrodes. Optionally, in this embodiment, the display panel may further include an anisotropic conductive film (ACF) provided on the bonding surface, and the light emitting device 200 may be electrically connected to the bonding electrodes on the bonding surface through the anisotropic conductive film.

[0048] The light emitting device 200 includes a first surface facing the driving backplane 100, a second surface opposite to the first surface, and a side surface between the first surface and the second surface. When the light emitting device 200 emits light, the second surface and at least part of the side surface can emit light.

[0049] In this embodiment, at least part of the side surface of the light emitting device 200 is covered with a reflective layer 310 , and the reflective layer 310 includes a metal layer 311 and a first protective layer 312 stacked in sequence from close to the side surface to away from the side surface.

[0050] The reflective layer 310 is used to reflect the light emitted from the side of the light emitting device 200, so that the light emitted from the side of the light emitting device 200 is as inclined as possible to be emitted from a direction perpendicular to the second surface after reflection. In this way, it is possible to avoid excessive dispersion of the light emitted by the light emitting device 200 and improve the light extraction efficiency of the display panel at a specific viewing angle.

[0051] Specifically, in the reflective layer 310, the metal layer 311 with good reflective effect mainly realizes the reflective function, which can improve and enhance the light extraction efficiency of the light emitting device 200 at a specific viewing angle. In addition, the first protective layer 312 is arranged on the side of the metal layer 311 away from the side surface to protect the metal layer 311, which can be used to prevent moisture and oxygen from entering the metal layer 311, reduce the possibility of oxidation and corrosion of the metal layer 311, and ensure the reflective effect of the metal layer 311.

[0052] Based on the above design, in the display panel provided in this embodiment, by sequentially arranging the metal layer 311 and the first protective layer 312 as the reflective layer 310 on the side of the light-emitting device 200, the reflective layer 310 reflects the light emitted from the side of the light-emitting device 200, so that the light emitted by the light-emitting device 200 can be prevented from being too dispersed, thereby improving the light extraction efficiency of the display panel at a specific viewing angle. In addition, the metal layer 311 is easier to prepare, which can reduce the difficulty of manufacturing the reflective layer 310, improve manufacturing efficiency, and save manufacturing costs.

[0053] Optionally, in this embodiment, the number of the light emitting device 200 may be one or more. Figure 1 When the number of the light-emitting devices 200 is multiple, the multiple light-emitting devices 200 are distributed in an array on the bonding surface. The multiple light-emitting devices 200 include light-emitting devices 200 of multiple colors, and the number of the light-emitting devices 200 of each color is several to ensure that the displayed image will not be color-shifted. The light-emitting devices 200 of multiple colors may include red light-emitting devices 200, green light-emitting devices 200, and blue light-emitting devices 200, that is, the multiple light-emitting devices 200 may include at least one red light-emitting device 200, at least one green light-emitting device 200, and at least one blue light-emitting device 200. Among them, the red light-emitting device 200 refers to a light-emitting device 200 that can emit red light, the green light-emitting device 200 refers to a light-emitting device 200 that can emit green light, and the blue light-emitting device 200 refers to a light-emitting device 200 that can emit blue light.

[0054] In a possible implementation manner, the material of the metal layer 311 may include silver (Ag).

[0055] Specifically, metallic silver has good electronic conductivity and light reflection performance. In this embodiment, the main function of the silver film is to prevent the light emitted by the light emitting device 200 from being too dispersed, thereby improving the light extraction efficiency of the display panel at a specific viewing angle. It can reflect light so that the light emitted from the side of the light emitting device 200 is reflected as much as possible to be emitted from a direction perpendicular to the second surface.

[0056] On this basis, the material of the first protective layer 312 includes metal oxide. The metal oxide and the silver metal layer 311 can be better attached to each other to avoid separation between the film layers, and the metal oxide has good oxidation resistance and can protect the silver metal layer 311 from oxidation. In addition, the metal oxide can be more conveniently patterned and etched, which can effectively reduce the manufacturing difficulty of the reflective layer 310 and improve the manufacturing efficiency. Preferably, the material of the first protective layer 312 includes indium tin oxide (ITO).

[0057] Specifically, the indium tin oxide film plays a protective role in this embodiment. It can prevent moisture and oxygen from entering the metal layer 311, thereby reducing the possibility of oxidation of the metal silver and affecting the reflectivity. In addition, the indium tin oxide film can also provide certain mechanical protection to reduce the impact of physical collision on the metal layer 311.

[0058] In one possible implementation, see Figure 3 The reflective layer 310 further includes a light-transmissive second protective layer 313 , and the second protective layer 313 is located on a side of the metal layer 311 close to the side surface.

[0059] In this embodiment, the second protective layer 313 is used to isolate the metal layer 311 from the light-emitting device 200. The metal layer 311 is located between the first protective layer 312 and the second protective layer 313. The second protective layer 313 is directly in contact with the side of the light-emitting device 200. The second protective layer 313 is light-transmissive. In this way, it can be ensured that the light emitted by the light-emitting device 200 can pass through the second protective layer 313 and then be reflected by the metal layer 311.

[0060] On this basis, the material of the second protective layer 313 includes metal oxide. The metal oxide and the silver metal layer 311 can be better adhered to each other to prevent the film layers from being separated from each other. At the same time, the metal oxide and the side of the light-emitting device 200 also have strong adhesion to prevent the second protective layer 313 from being separated from the light-emitting device. Preferably, the material of the second protective layer 313 includes indium tin oxide.

[0061] Specifically, the reflective layer 310 can be a sandwich structure of indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO), wherein the indium tin oxide layer close to the side of the light-emitting device 200 is the second protective layer 313, the indium tin oxide layer away from the side of the light-emitting device 200 is the first protective layer 312, and the silver layer located between the two indium tin oxide layers is the metal layer 311.

[0062] Among them, the silver in the metal layer 311 has a high reflectivity, which can better reflect the light from the side of the light-emitting device 200, thereby preventing the light emitted by the light-emitting device 200 from being too dispersed, thereby improving the light extraction efficiency of the display panel at a specific viewing angle.

[0063] The indium tin oxide film is a transparent conductive oxide film with excellent transparency. In the indium tin oxide-silver-indium tin oxide structure, the indium tin oxide (ITO) film as the second protective layer 313 has good light transmittance, which can enable the light emitted by the light-emitting device 200 to be transmitted to the silver film through the indium tin oxide film in contact with the side, thereby completing the reflection. The indium tin oxide (ITO) film as the first protective layer 312 can prevent moisture and oxygen from entering the metal layer 311, thereby reducing the possibility of Ag in the metal layer 311 being oxidized and affecting the reflectivity, and can also dissipate heat well, reduce the temperature rise and thermal stress of the light-emitting device 200, and improve the reliability of the light-emitting device 200. In addition, indium tin oxide can also have a strong adhesion with the side of the light-emitting device 200 and the side of the light-emitting device 200, which can prevent the second protective layer 313 from detaching from the light-emitting device.

[0064] In one possible implementation, please refer again to Figure 3 , the thickness L1 of the metal layer 311 may be greater than the thickness L2 of the first protective layer 312 and the thickness L3 of the second protective layer 313 .

[0065] In this embodiment, the thickness L2 of the first protective layer 312 and the thickness L3 of the second protective layer 313 may be equal, the thickness L2 of the first protective layer 312 and the thickness L3 of the second protective layer 313 may be 50 nm, and the thickness L1 of the metal layer 311 may be 100 nm.

[0066] Since Ag has high light transmittance, especially low absorption rate in the visible light range, if the thickness of the Ag film is too thin, the reflective ability of the Ag film will be weakened, thereby increasing the light loss. Therefore, in this embodiment, the thickness of the Ag film can be increased to ensure that the Ag film has a high reflectivity, avoid excessive dispersion of the light emitted by the light emitting device 200, and thus improve the light extraction efficiency of the display panel at a specific viewing angle.

[0067] In one possible implementation, see Figure 4 The display panel may further include a light shielding layer 400 located on the bonding surface of the driving backplane 100 , wherein the light shielding layer 400 exposes the second surface and at least a portion of the side surface of the light emitting device 200 .

[0068] The light shielding layer 400 is located on the side of the bonding surface away from the driving backplane 100. The light shielding layer 400 can be made of a material that is opaque or has poor light transmittance. For example, the light shielding layer 400 can be formed by printing black ink. In the thickness direction of the display panel, the height of the light shielding layer 400 is lower than the height of the light emitting device 200. In this way, the light shielding layer 400 can be prevented from affecting the setting of the reflective layer 310.

[0069] In this embodiment, after the bonding of the light emitting device 200 is completed, the light shielding layer 400 is provided first, and then the reflective layer 310 is formed.

[0070] In one possible implementation, see Figure 5 The light emitting device 200 may include four side surfaces, and the four side surfaces are opposite to each other. The reflective layer 310 covers two side surfaces that are opposite to each other.

[0071] For example, please refer again to Figure 5 , the orthographic projection of the light emitting device 200 on the bonding surface is a rectangle. The reflective layer 310 can be disposed on the two opposite side surfaces of the light emitting device 200 in the first direction D1. In this way, the reflective layer 310 can reflect the light emitted from the two opposite side surfaces of the light emitting device 200 in the first direction D1, thereby improving the light extraction efficiency of the light emitting device 200 at a specific viewing angle by sacrificing the light extraction angle in the first direction D1.

[0072] Taking the display panel provided in this embodiment as an example, which is used for a TV or monitor that is usually placed vertically, the first direction D1 can be a vertical direction, and the second direction D2 can be a horizontal direction. Usually, when watching a TV or monitor and other devices, a large visual viewing angle is not required in the vertical direction (i.e., the first direction D1), but a larger visual viewing angle may be required in the horizontal direction (i.e., the second direction D2). Therefore, the reflective layer 310 can be set on the two opposite side surfaces in the vertical direction, so as to improve the light output efficiency of the light-emitting device 200 at a specific viewing angle by sacrificing the light output angle in the vertical direction.

[0073] In another possible implementation, see Figure 6 The reflective layer 310 covers each of the side surfaces of the light emitting device 200. In this way, light from the side surfaces of the light emitting device 200 in various directions can be reflected, thereby improving the light extraction efficiency of the light emitting device 200 at a specific viewing angle.

[0074] In one possible implementation, the light-emitting device 200 may be a multi-color light-emitting device 200, which may include a first color light-emitting device 200, a second color light-emitting device 200, and a third color light-emitting device 200, wherein the first color light-emitting device 200, the second color light-emitting device 200, and the third color light-emitting device 200 may be a red light-emitting device 200, a green light-emitting device 200, and a blue light-emitting device 200, respectively.

[0075] The reflective layer 310 on the light emitting device 200 can completely cover the side of the light emitting device 200, that is, the reflective layer 310 on the red light emitting device 200 completely covers the side of the red light emitting device 200, the reflective layer 310 on the green light emitting device 200 completely covers the side of the green light emitting device 200, and the reflective layer 310 on the blue light emitting device 200 completely covers the side of the blue light emitting device 200. In this case, for each of the light emitting devices 200, the reflective layer 310 on the light emitting device 200 can reflect the light emitted by the light emitting device 200 back, so that the light of the light emitting device 200 can be concentrated on the second surface to avoid excessive dispersion of the light emitted by the light emitting device 200, thereby improving the light extraction efficiency of the light emitting device 200 at a specific viewing angle.

[0076] The present application also provides a method for manufacturing a display panel. Figure 7 , the method may include the following steps.

[0077] Step S100, providing a driving backplane 100, wherein the driving backplane 100 includes a bonding surface.

[0078] Step S200 , disposing at least one light emitting device 200 on the bonding surface of the driving backplane 100 .

[0079] Optionally, in this embodiment, a plurality of the light emitting devices 200 may be disposed on the bonding surface of the driving backplane 100 by mass transfer, and then the light emitting devices 200 may be electrically connected to the driving backplane 100 by pressure bonding.

[0080] The light emitting device 200 includes a first surface facing the driving backplane 100 , a second surface opposite to the first surface, and a side surface between the first surface and the second surface.

[0081] Step S300 , sequentially forming a metal layer 311 and a first protective layer 312 covering the driving backplane 100 and the light emitting device 200 as a packaging layer 300 .

[0082] In this embodiment, after step S200, please refer to Figure 8 A metal layer 311 covering the driving backplane 100 and the light-emitting device 200 can be formed on the driving backplane 100 and the light-emitting device 200 by deposition, and after the metal layer 311 is formed, a first protective layer 312 can be formed on the metal layer 311 by deposition, and the first protective layer 312 is used to protect the metal layer 311 and prevent the metal layer 311 from corrosion.

[0083] In the thickness direction of the display panel, the thickness of the encapsulation layer 300 is smaller than the height of the light emitting device 200 .

[0084] Step S400 , performing patterned etching on the encapsulation layer 300 , retaining at least a portion of the reflective layer 310 disposed on the side surface, and removing the encapsulation layer 300 at other locations.

[0085] In this embodiment, when the encapsulation layer 300 is subjected to patterned etching, part of the reflective layer 310 arranged on the side surface of the light-emitting device 200 can be retained. For example, when the light-emitting device 200 may include four side surfaces, and the four side surfaces are opposite to each other, the reflective layer 310 on two oppositely arranged side surfaces can be retained; the reflective layer 310 arranged on the side surface of the light-emitting device 200 can also be completely retained. In this way, it is possible to avoid excessive dispersion of light emitted by the light-emitting device 200.

[0086] After step S400 , the method may further include removing the photoresist on the reflective layer 310 .

[0087] In one possible implementation, see Fig. 9 When a metal layer 311 and a first protective layer 312 covering the driving backplane 100 and the light-emitting device 200 are formed in sequence as the encapsulation layer 300, a second protective layer 313, a metal layer 311 and a first protective layer 312 covering the driving backplane 100 and the light-emitting device 200 can be formed in sequence as the encapsulation layer 300.

[0088] In this embodiment, in step S300, a second protective layer 313, a metal layer 311 and a first protective layer 312 may be sequentially formed on the driving backplane 100 and the light-emitting device 200 by deposition as the encapsulation layer 300, and the encapsulation layer 300 completely covers the driving backplane 100 and the light-emitting device 200. The first protective layer 312 is used to prevent corrosion and oxidation of the metal layer 311, and the second protective layer 313 is used to isolate the metal layer 311 from the light-emitting device 200. The metal layer 311 is located between the first protective layer 312 and the second protective layer 313, and the second protective layer 313 is directly in contact with the side of the light-emitting device 200. The second protective layer 313 has light transmittance, so that it can be ensured that the light emitted by the light-emitting device 200 can be reflected by the metal layer 311.

[0089] This embodiment also provides an electronic device, which may include the display panel provided in this embodiment or the display panel manufactured by the method. The electronic device may include a display, a spliced ​​display screen, a mobile phone, a tablet computer, a laptop computer, a television, or other device with a display function.

[0090] In summary, the present embodiment provides a display panel, a method for manufacturing a display panel, and an electronic device. By sequentially arranging a metal layer and a first protective layer as a reflective layer on the side of the light-emitting device, the reflective layer reflects the light emitted from the side of the light-emitting device, thereby preventing the light emitted by the light-emitting device from being excessively dispersed, thereby improving the light output efficiency of the display panel at a specific viewing angle, and the reflective layer is manufactured through simple steps, thereby simplifying the manufacturing process.

[0091] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: A drive backplane, the drive backplane comprising a bonding surface; At least one light emitting device disposed on the bonding surface of the driving backplane; The light emitting device comprises a first surface facing the driving backplane, a second surface arranged opposite to the first surface, and a side surface located between the first surface and the second surface; At least part of the side surface of the light emitting device is covered with a reflective layer, and the reflective layer includes a metal layer and a first protective layer which are sequentially stacked in a direction from close to the side surface to far away from the side surface.

2. The display panel according to claim 1, characterized in that: The material of the metal layer includes silver; Preferably, the material of the first protective layer includes metal oxide; Preferably, the material of the first protective layer includes indium tin oxide.

3. The display panel according to claim 1, characterized in that: The reflective layer further comprises a light-transmissive second protective layer, wherein the second protective layer is located on a side of the metal layer close to the side surface; Preferably, the material of the second protective layer includes metal oxide; Preferably, the material of the second protective layer includes indium tin oxide.

4. The display panel according to claim 1, characterized in that: The reflective layer includes a second protective layer, the metal layer and the first protective layer which are stacked in sequence from close to the side surface to far away from the side surface; the material of the second protective layer is indium tin oxide, the material of the first protective layer is silver, and the material of the first protective layer is indium tin oxide.

5. The display panel according to claim 3 or 4, characterized in that: The thickness of the metal layer is greater than that of the first protection layer and the second protection layer.

6. The display panel according to claim 1, characterized in that: The display panel further includes a light shielding layer located on the bonding surface of the driving backplane, wherein the light shielding layer exposes the second surface and at least a portion of the side surface of the light emitting device.

7. The display panel according to claim 1, characterized in that: The light emitting device comprises four side surfaces, and the four side surfaces are opposite to each other in pairs; the reflective layer covers two of the side surfaces that are opposite to each other; Alternatively, the reflective layer covers each of the side surfaces of the light emitting device.

8. A method for manufacturing a display panel, characterized in that: The method comprises: Providing a drive backplane, the drive backplane comprising a bonding surface; At least one light emitting device is arranged on the bonding surface of the driving backplane, and the light emitting device includes a first surface facing the driving backplane, a second surface arranged opposite to the first surface, and a side surface located between the first surface and the second surface; Sequentially forming a metal layer and a first protective layer covering the driving backplane and the light-emitting device as an encapsulation layer; The encapsulation layer is subjected to patterned etching, so as to retain at least a portion of the reflective layer disposed on the side surface and remove the encapsulation layer at other positions.

9. The display panel according to claim 8, characterized in that: The step of sequentially forming a metal layer and a first protective layer covering the driving backplane and the light-emitting device as an encapsulation layer comprises: A second protective layer, a metal layer and a first protective layer covering the driving backplane and the light-emitting device are sequentially formed as a packaging layer.

10. An electronic device, characterized in that: A display panel comprising any one of claims 1 to 7.

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