Display apparatus and method of manufacturing same

Abstract

Provided are a display device and a method of manufacturing the same, the display device including a sub-pixel formed on a base layer, and the sub-pixel including: a color conversion layer in a first sub-pixel area and including quantum dots; a first scattering layer in the second sub-pixel region and including a first scattering body; and a second scattering layer in the third sub-pixel region and including a second scatterer; a first color filter in the first sub-pixel region; a second color filter in the second sub-pixel region; and a third color filter in the third sub-pixel region, in which light emitted from the light emitting element includes light of the second color and light of the third color, and in which a color of light passing through the first scattering layer and the second scattering layer is substantially not changed by the first scattering layer and the second scattering layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0140731 filed in the Korean Intellectual Property Office on October 19, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Aspects of some embodiments of the present disclosure relate to a display device and a method of manufacturing the display device. Background Art

[0004] As interest in information display increases, research and development of display devices continues.

[0005] The above information disclosed in this Background section is for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute prior art. Summary of the invention

[0006] Aspects of the present disclosure relate to a display device having improved light output efficiency and a method of manufacturing the display device.

[0007] Aspects of the present disclosure relate to a display device capable of achieving sufficient brightness and a method of manufacturing the display device.

[0008] Aspects of the present disclosure relate to a display device having improved process efficiency and a method of manufacturing the display device.

[0009] Aspects of the present disclosure relate to a display device capable of reducing production costs and a method of manufacturing the display device.

[0010] Aspects of the present disclosure relate to a display device having good optical characteristics and a method of manufacturing the display device.

[0011] According to some embodiments of the present disclosure, a display device is provided, the display device including sub-pixels, the sub-pixels being formed on a base layer and including a first sub-pixel forming a first sub-pixel region and configured to provide light of a first color, a second sub-pixel forming a second sub-pixel region and configured to provide light of a second color, and a third sub-pixel forming a third sub-pixel region and configured to provide light of a third color, the sub-pixels including: a display layer including a light-emitting element on the base layer; a light-control layer on the display layer and including a color conversion layer including quantum dots in the first sub-pixel region, a first scattering layer including a first scatterer in the second sub-pixel region, and a second scattering layer including a second scatterer in the third sub-pixel region; and a color filter layer on the light-control layer and including a first color filter in the first sub-pixel region, a second color filter in the second sub-pixel region, and a third color filter in the third sub-pixel region, wherein light emitted from the light-emitting element includes light of the second color and light of the third color, and at least a portion of the emitted light is emitted through the light-control layer and the color filter layer, and wherein the color of light passing through the first scattering layer and the second scattering layer is substantially not changed by the first scattering layer and the second scattering layer.

[0012] The light control layer may further include a covering layer, at least a portion of which may be configured to passivate the color conversion layer, wherein a first portion of the covering layer is on the color conversion layer in the first sub-pixel region, and a second portion of the covering layer is below the first scattering layer in the second sub-pixel region and the second scattering layer in the third sub-pixel region.

[0013] The display device may further include an upper layer on the color filter layer and may include an upper substrate, wherein the color filter layer and the light control layer are sequentially stacked below the upper substrate, and wherein the filling layer is between the display layer and the color conversion layer, the first scattering layer, and the second scattering layer.

[0014] The display device may further include an upper layer on the color filter layer and may include an upper substrate, wherein the filling layer is between the color filter layer and the color conversion layer, the first scattering layer, and the second scattering layer.

[0015] The display device may further include an upper layer on the color filter layer and may include an upper film layer, wherein the light control layer and the color filter layer are sequentially stacked on the display layer.

[0016] The color conversion layer may have a first thickness, wherein the first scattering layer has a second thickness, wherein the second scattering layer has a third thickness, wherein the first thickness is greater than each of the second thickness and the third thickness, and wherein the second thickness is substantially equal to the third thickness.

[0017] The first scatterer and the second scatterer may be included in a range of about 1.5 wt % to about 8.5 wt % with respect to the first scattering layer and the second scattering layer, respectively.

[0018] The size of the first scatterer may be greater than the size of the second scatterer.

[0019] The first scatterer may be included at a first weight ratio relative to the first scattering layer, wherein the second scatterer is included at a second weight ratio relative to the second scattering layer, and wherein the first weight ratio is greater than the second weight ratio.

[0020] The first scattering layer may include one or more scatterers having the same composition ratio as the first scatterer and a different size from the first scatterer, and the second scattering layer may include one or more scatterers having the same composition ratio as the second scatterer and a different size from the second scatterer.

[0021] The color filter layer may also include an optical layer having a refractive index smaller than that of the color conversion layer, and the optical layer may be arranged between the light control layer and the first color filter, the second color filter and the third color filter, and among the first sub-pixel area, the second sub-pixel area and the third sub-pixel area, only the first sub-pixel area may include the optical layer.

[0022] The light-controlling layer may further include a filling scattering layer in the second sub-pixel region and the third sub-pixel region, the filling scattering layer overlapping the first scattering layer and the second scattering layer in a thickness direction and including a filling material and a scattering material.

[0023] The light-controlling layer may further include a bank, wherein at least a portion of the bank surrounds the first sub-pixel region and extends in a thickness direction.

[0024] The embankment may not be between the second sub-pixel region and the third sub-pixel region, and the light control layer may further include a black matrix layer, at least a portion of which is between the second sub-pixel region and the third sub-pixel region, and the black matrix layer penetrates between the first scattering layer and the second scattering layer.

[0025] In a plan view, the bank may be formed around all sides of the first sub-pixel region, and the bank may not be formed around at least a portion of each of the second sub-pixel region and the third sub-pixel region.

[0026] At least one side of the second sub-pixel region may include an open edge on which the bank is not formed, and wherein the open edge is formed to be oriented in a direction away from the third sub-pixel region.

[0027] In a plan view, the bank may be formed around all sides of both the first sub-pixel region and the second sub-pixel region, and may not be formed around at least a portion of the third sub-pixel region.

[0028] The light management layer may further include a cover layer, at least a portion of the cover layer configured to passivate the color conversion layer and the first scattering layer, wherein a portion of the cover layer is between the second scattering layer and the third color filter in the third sub-pixel region.

[0029] The thickness of the first scattering layer is greater than the thickness of the second scattering layer.

[0030] The bank may include an isolated bank part, wherein the isolated bank part is between the second sub-pixel region and the third sub-pixel region.

[0031] The light management layer may further include a spacer on the bank and over the color conversion layer, the first scattering layer, and the second scattering layer.

[0032] The spacer may be between the first sub-pixel region and the second sub-pixel region, between the second sub-pixel region and the third sub-pixel region, and between the first sub-pixel region and the third sub-pixel region.

[0033] The first subpixel, the second subpixel, and the third subpixel may be adjacent to each other in a first direction and may form a first pixel, wherein the first pixel is adjacent to the second pixel in a second direction different from the first direction, and wherein a spacer is between a first subpixel region of the first pixel and a first subpixel region of the second pixel, between the second subpixel region of the first pixel and the second subpixel region of the second pixel, and between a third subpixel region of the first pixel and a third subpixel region of the second pixel.

[0034] The first and third sub-pixel regions may be adjacent to each other in a first direction, and the second sub-pixel region may be adjacent to the first and third sub-pixel regions in a second direction different from the first direction, wherein the spacer overlaps the second sub-pixel region in the first direction.

[0035] The light management layer may further include a cover layer, at least a portion of which is configured to passivate the color conversion layer, the dam, the first scattering layer, the second scattering layer, and the spacer.

[0036] The light management layer may further include a cover layer, wherein at least a portion of the cover layer is configured to passivate the color conversion layer, the bank, the first scattering layer, and the second scattering layer, and wherein the spacer is disposed on the cover layer.

[0037] The bank may include: a first bank portion and a second bank portion spaced apart from each other by a first distance, the second sub-pixel region being between the first bank portion and the second bank portion; a third bank portion spaced apart from the second bank portion by a second distance, the third sub-pixel region being between the third bank portion and the second bank portion, and wherein a thickness of the first scattering layer is greater than a thickness of the second scattering layer.

[0038] The light emitting element may include one or more of an organic light emitting diode including an organic material and an inorganic light emitting diode including an inorganic material.

[0039] According to other embodiments of the present disclosure, a method for manufacturing a display device is provided, the method comprising: manufacturing a first panel; manufacturing a second panel; and connecting the first panel and the second panel to each other, wherein manufacturing the first panel comprises providing a light-emitting element on a lower substrate, wherein manufacturing the second panel comprises providing a color filter layer on an upper substrate and providing a light control layer on the color filter layer, wherein providing the light control layer comprises: patterning a dam on the color filter layer; placing (or setting or providing) a color conversion layer including quantum dots in a first sub-pixel region; placing (or setting or providing) a first scattering layer including a first scatterer in a second sub-pixel region; and placing (or setting or providing) a second scattering layer including a second scatterer in a third sub-pixel region, and wherein the first scattering layer and the second scattering layer are configured to allow incident light to pass through the first scattering layer and the second scattering layer without changing the color of the incident light.

[0040] Providing the light control layer may further include forming a covering layer on the color conversion layer, the covering layer being configured to passivate the color conversion layer, wherein providing the color conversion layer includes patterning the color conversion layer by an inkjet process, and wherein providing the first scattering layer and providing the second scattering layer are performed after forming the covering layer and are performed based on a photolithography process.

[0041] The color conversion layer, the first scattering layer, and the second scattering layer may be patterned based on a photolithography process, and providing the light control layer may further include forming a cover layer on the color conversion layer, the color conversion layer being configured to passivate the color conversion layer, the first scattering layer, and the second scattering layer.

[0042] The color conversion layer, the first scattering layer, and the second scattering layer may be formed based on an inkjet process.

[0043] Coupling the first panel and the second panel may include providing a filler layer between the first panel and the second panel.

[0044] According to other embodiments of the present disclosure, a method for manufacturing a display device is provided, the method comprising: manufacturing a first panel; manufacturing a second panel; and connecting the first panel and the second panel to each other, wherein manufacturing the first panel comprises providing a display layer and providing a light control layer on the display layer, the display layer comprising a light emitting element on a lower substrate, wherein manufacturing the second panel comprises providing a color filter layer on an upper substrate, wherein providing the light control layer comprises: patterning a dam on the display layer; providing a color conversion layer comprising quantum dots in a first sub-pixel region; providing a first scattering layer comprising a first scatterer in a second sub-pixel region; and providing a second scattering layer comprising a second scatterer in a third sub-pixel region, and wherein the first scattering layer and the second scattering layer are configured to allow incident light to pass through the first scattering layer and the second scattering layer without changing the color of the incident light.

[0045] Providing the light control layer may further include forming a covering layer on the color conversion layer, the covering layer being configured to passivate the color conversion layer, wherein providing the color conversion layer includes patterning the color conversion layer by an inkjet process, and wherein providing the first scattering layer and providing the second scattering layer are performed after forming the covering layer and are performed based on a photolithography process.

[0046] The color conversion layer, the first scattering layer, and the second scattering layer may be patterned based on a photolithography process, and providing the light control layer may further include forming a cover layer on the color conversion layer, the cover layer being configured to passivate the color conversion layer, the first scattering layer, and the second scattering layer.

[0047] The color conversion layer, the first scattering layer, and the second scattering layer may be formed based on an inkjet process. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The above and other aspects and features of the present disclosure will be more clearly understood from the following detailed description of illustrative, non-limiting embodiments with reference to the accompanying drawings.

[0049] Figure 1 is a schematic plan view showing a display device according to some embodiments of the present disclosure.

[0050] Figure 2 is a schematic cross-sectional view illustrating a display device according to some embodiments of the present disclosure.

[0051] Figure 3 is a schematic diagram showing display layers according to some embodiments of the present disclosure.

[0052] Figure 4 is a schematic diagram for describing the optical path of a sub-pixel according to some embodiments of the present disclosure.

[0053] Figures 5 to 7 are schematic cross-sectional views each illustrating a display device according to some embodiments of the present disclosure.

[0054] Figure 8 is a schematic cross-sectional view depicting the thickness relationship between the first scattering layer, the second scattering layer, and the color conversion layer according to some embodiments of the present disclosure.

[0055] Figures 9 to 11 is a schematic cross-sectional view depicting a relationship between scatterers included in each of a first scattering layer and a second scattering layer according to some embodiments of the present disclosure.

[0056] Figures 12 to 15 is a cross-sectional view depicting properties of a light management layer according to some embodiments of the present disclosure.

[0057] Figures 16 to 21 are plan views each depicting an arrangement relationship between a bank and a sub-pixel region according to some embodiments of the present disclosure.

[0058] Figure 22 to Figure 26 are plan views each depicting an arrangement relationship between a spacer and a sub-pixel region according to some embodiments of the present disclosure.

[0059] Fig. 27 is a schematic plan view showing a display area of ​​a display device according to some embodiments of the present disclosure.

[0060] Fig.28 It is along Fig. 27 8 is a schematic cross-sectional view taken along line AA' of , which shows a schematic cross-sectional view of a second panel according to some embodiments of the present disclosure.

[0061] Figure 29 to Figure 31 are schematic cross-sectional views each illustrating a display device according to some embodiments of the present disclosure.

[0062] Figure 32 to Figure 34 are schematic cross-sectional views each illustrating a display device according to some embodiments of the present disclosure.

[0063] Fig.35 is a schematic cross-sectional view depicting the relationship between a first scattering layer and a second scattering layer according to some embodiments of the present disclosure.

[0064] Fig.36 is a flowchart illustrating a method of manufacturing a display device according to some embodiments of the present disclosure.

[0065] Fig.37 is a flow chart illustrating sub-operations of an operation of manufacturing a second panel according to some embodiments of the present disclosure.

[0066] Figures 38 to 43is a schematic cross-sectional view illustrating a method of manufacturing a display device according to some embodiments of the present disclosure through process operations.

[0067] Fig.44 is a flow chart illustrating sub-operations of an operation of manufacturing a second panel according to some embodiments of the present disclosure.

[0068] Figures 45 to 48 is a schematic cross-sectional view illustrating a method of manufacturing a display device according to some embodiments of the present disclosure through process operations.

[0069] Fig.49 is a flowchart illustrating a method of manufacturing a display device according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0070] Hereinafter, some embodiments will be described in more detail with reference to the accompanying drawings. It should be noted that only the parts suitable for understanding the operation according to the present disclosure will be described below, and in order not to obscure the main points of the present disclosure, descriptions of other parts will not be provided. In some embodiments, the present disclosure is not limited to the embodiments described herein, and can be implemented in other forms. Hereinafter, the embodiments will be described in more detail so that a person of ordinary skill in the art can easily implement the technical ideas of the present disclosure.

[0071] Since the present disclosure allows various changes and many embodiments, the specific embodiments will be shown in the drawings and described in more detail in the written description. However, this is not intended to limit the present disclosure to a specific practice, and it should be understood that all changes, equivalents and substitutions that do not depart from the spirit and technical scope of the present disclosure are included in the present disclosure.

[0072] It will be understood that when a part is referred to as being "connected to" another part, it may be "directly connected to" another part or "indirectly connected to" another part, and the intervening part is between the part and the other part. The terms used herein are intended to describe specific embodiments and are not intended to limit the present disclosure. It will be understood that, as used herein, the terms "comprising", "including" or "having" specify the presence of the elements stated, but do not exclude the presence or addition of one or more other elements. The expressions "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as any combination of one X, one Y, one Z, or two or more of X, Y, and Z (e.g., XYZ, XYY, YZ, ZZ, etc.). As used herein, the terms "or" and "and / or" include any combination of one or more of the elements.

[0073] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element. Similarly, the second element may also be referred to as the first element. In the present disclosure, the singular form is intended to also include the plural form, unless the context clearly indicates otherwise.

[0074] It will also be understood that the terms "comprise", "include", "have", etc., when used in the present disclosure, specify the presence of stated features, wholes, steps, operations, elements, parts and / or combinations thereof, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts and / or combinations thereof. In addition, in the case where a first part such as a layer, film, region or plate is disposed on (e.g., located on or provided on) a second part, not only may the first part be directly on the second part, but also a third part may be between them. In addition, when it is indicated that a first part such as a layer, film, region or plate is formed on a second part, the surface of the second part on which the first part is formed is not limited to the upper surface of the second part, but may include other surfaces such as the side surface or lower surface of the second part. Conversely, in the case where a first part such as a layer, film, region or plate is below a second part, not only may the first part be directly below the second part, but also a third part may be between them.

[0075] Spatially relative terms such as "below", "above", etc. can be used for descriptive purposes to describe the relationship between an element or feature and another (some) element or feature as shown in the drawings. In addition to the directions depicted in the drawings, spatially relative terms are intended to also include different directions in use, operation and / or manufacture. For example, when the device shown in the drawings is turned over, the element described as being "below" other elements or features is located "above" other elements or features. Therefore, in some embodiments, the term "below" may include both the upper direction and the lower direction. In some embodiments, the device may be oriented in other directions (e.g., rotated 90 degrees or oriented in other directions), and therefore, spatially relative terms as used herein should be interpreted accordingly.

[0076] Some embodiments related to functional blocks, units and / or modules are described with reference to the accompanying drawings. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by logic circuits, discrete components, microprocessors, hard-wired circuits, storage elements, wiring connections and other electronic circuits. This can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Blocks, units and / or modules implemented by microprocessors or other similar hardware can be programmed and controlled using software to perform various functions discussed herein, and can be optionally driven by firmware and / or software. In some embodiments, the corresponding blocks, units and / or modules can be implemented by dedicated hardware, or can be implemented as a combination of dedicated hardware that performs some functions and processors (e.g., one or more programmed microprocessors and associated circuits) that perform other functions. In some embodiments, blocks, units and / or modules can be physically divided into two or more separate blocks, units and / or modules that interact within the scope of the present disclosure. In some embodiments, without departing from the scope of the present disclosure, blocks, units and / or modules can be physically combined into more complex blocks, units and / or modules.

[0077] Various embodiments are described with reference to the accompanying drawings that schematically illustrate non-limiting embodiments. Therefore, it is expected that the shapes may vary depending on, for example, tolerances and / or manufacturing techniques. Therefore, the embodiments disclosed herein should not be construed as limited to the specific shapes shown, but should be understood to include shape changes that occur, for example, due to manufacturing. Therefore, the shapes shown in the drawings may not depict the actual shape of the device area, and the present embodiments are not limited thereto.

[0078] When a certain embodiment can be implemented differently, the specific process sequence can be different from the described sequence. For example, the two consecutive processes described can be performed simultaneously or substantially simultaneously, or can be performed in the reverse order of the described sequence.

[0079] As used herein, the terms "substantially," "about," and similar terms are used as approximate terms rather than as terms of degree, and are intended to account for the inherent variations in measured or calculated values ​​that one of ordinary skill in the art would recognize. In addition, when describing embodiments of the present disclosure, the use of "may" refers to "one or more embodiments of the present disclosure." As used herein, the terms "use," "using," and "used" may be considered synonymous with the terms "utilize," "utilizing," and "utilized," respectively.

[0080] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and / or this specification, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0081] Various embodiments of the present disclosure relate to a display device and a method of manufacturing the display device. Hereinafter, a display device DD and a method of manufacturing the display device DD in some embodiments will be described with reference to the accompanying drawings.

[0082] Figure 1 is a schematic plan view showing a display device DD according to some embodiments of the present disclosure.

[0083] refer to Figure 1 , the display device DD may include a base layer BSL and pixels PXL disposed on (eg, located or provided on) the base layer BSL. Although not shown in the drawings, the display device DD may further include driving circuit components (eg, a scan driver and a data driver), lines, and pads to drive the pixels PXL.

[0084] The display device DD (or the base layer BSL) may include a display area DA and a non-display area NDA. For example, the display area DA may be an area configured to display an image. The non-display area NDA may refer to an area other than the display area DA. The non-display area NDA may surround at least a portion of the display area DA.

[0085] The base layer BSL may form a base surface of the display device DD. The base layer BSL may be a rigid or appropriately flexible substrate or film. For example, the base layer BSL may include a glass material. The base layer BSL may include a silicon material. The base layer BSL may include polyimide. However, the present disclosure is not limited to the above examples.

[0086] In some embodiments, the base layer BSL may be a lower substrate BSUB. For example, the base layer BSL may be a first substrate. The base layer BSL may include a substrate configured to manufacture a first panel PNL1 (refer to Figure 5 )'s base substrate.

[0087] The display area DA may refer to an area in which the pixels PXL are disposed. The non-display area NDA may refer to an area in which the pixels PXL are not disposed. Driving circuit components, lines, and pads connected to the pixels PXL of the display area DA may be disposed in the non-display area NDA.

[0088] In some embodiments, the pixels PXL (or sub-pixels SPX) may be arranged in stripes or The present disclosure may be arranged in an arrangement structure, etc., but the present disclosure is not limited thereto. Various embodiments may be applied to the present disclosure.

[0089] In some embodiments, the pixel PXL (or sub-pixel SPX) may include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may be a sub-pixel. At least one first sub-pixel SPX1, at least one second sub-pixel SPX2, and at least one third sub-pixel SPX3 may form one pixel unit that may emit light of various colors.

[0090] Each of the first subpixel SPX1 , the second subpixel SPX2 , and the third subpixel SPX3 may emit light in a single color.

[0091] For example, the first sub-pixel SPX1 may be a red pixel configured to emit red (e.g., a first color) light, the second sub-pixel SPX2 may be a green pixel configured to emit green (e.g., a second color) light, and the third sub-pixel SPX3 may be a blue pixel configured to emit blue (e.g., a third color) light. The red pixel may provide light in a band of about 600nm to about 750nm. The green pixel may provide light in a band of about 480nm to about 560nm. The blue pixel may provide light in a band of about 370nm to about 460nm.

[0092] In some embodiments, the number of second subpixels SPX2 may be greater than the number of first subpixels SPX1 or the number of third subpixels SPX3. The colors, types and / or numbers of the first subpixels SPX1, second subpixels SPX2 and third subpixels SPX3 forming each pixel unit are not limited to specific examples.

[0093] In some embodiments, reference is made to Figures 2 to 4 The overall structure of the display device DD including its cross-sectional structure is described.

[0094] Figure 2 is a schematic cross-sectional view illustrating a display device DD according to some embodiments of the present disclosure. Figure 3 is a schematic diagram illustrating a display layer DL according to some embodiments of the present disclosure. Figure 4 is a schematic diagram for describing the optical path of a sub-pixel SPX according to some embodiments of the present disclosure.

[0095] refer to Figures 2 to 4 , the display device DD may include a display layer DL, a light control layer LCL, a color filter layer CFL, and an upper layer UPL.

[0096] The display layer DL may be configured to emit light.The display layer DL may form a substrate on which the light control layer LCL is disposed.

[0097] The display layer DL may include a base layer BSL, a pixel circuit layer PCL, and a light emitting element layer LEL, wherein the light emitting element layer LEL can form a pixel PXL including a light emitting element LD.

[0098] The base layer BSL may form a substrate on which the pixel circuit PXC is disposed. The pixel circuit PXC may be disposed on the base layer BSL and may be configured to drive the light emitting element LD. The pixel circuit layer PCL may include a conductive layer and an insulating layer. The conductive layer may form the pixel circuit PXC. The pixel circuit PXC may include a circuit element configured to drive the sub-pixel SPX (or the light emitting element LD). The circuit element may include a driving transistor, and may also include another transistor and a capacitor.

[0099] The light emitting element layer LEL may be disposed on the pixel circuit layer PCL. In some embodiments, the light emitting element layer LEL may include a light emitting element LD.

[0100] For example (reference Figure 3 ), the light emitting element LD may include an organic light emitting diode (OLED) including an organic material. Figure 3 An embodiment in which the light emitting element LD is formed of an OLED is schematically illustrated, which shows a schematic cross-sectional structure of a display layer DL including a base layer BSL, a pixel circuit layer PCL, and a light emitting element layer LEL as a cross-sectional structure of a display device DD in a display area DA.

[0101] In some embodiments, the light emitting element layer LEL may further include a pixel defining layer PDL, a cover layer CPL, and an encapsulation layer TFE.

[0102] In some embodiments, the light emitting element LD may be disposed on the pixel circuit layer PCL. The light emitting element LD may include a first light emitting element (e.g., a first portion of the light emitting element LD) included in the first sub-pixel SPX1, a second light emitting element (e.g., a second portion of the light emitting element LD) included in the second sub-pixel SPX2, and a third light emitting element (e.g., a third portion of the light emitting element LD) included in the third sub-pixel SPX3.

[0103] In some embodiments, the light emitting element LD may include a first electrode EL1, an emission part EL, and a second electrode EL2. In some embodiments, the emission part EL may be disposed in a region defined by a pixel defining layer PDL. One surface of the emission part EL may be electrically connected to the first electrode EL1. The other surface of the emission part EL may be electrically connected to the second electrode EL2.

[0104] The first electrode EL1 may be an anode electrode for the emission component EL. The second electrode EL2 may be a cathode electrode for the emission component EL. In some embodiments, the first electrode EL1 and the second electrode EL2 may include a conductive material. For example, the conductive material may include one or more selected from gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and platinum (Pt). In some examples, in some embodiments, the conductive material may include one or more selected from silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO 2 ), one or more of carbon nanotubes and graphene. However, the present disclosure is not limited to the above-mentioned embodiments.

[0105] The emission part EL may emit light based on an electrical signal provided from an anode electrode (eg, the first electrode EL1 ) and a cathode electrode (eg, the second electrode EL2 ).

[0106] The emission component EL may include a multilayer structure. For example, the emission component EL may include a plurality of emission structures, each of which includes a hole transport component, an emission layer (or a light generating layer), and an electron transport component. Each of the layers forming the emission structure may include an organic material, and in some embodiments, may also include an inorganic material such as a metal-containing compound or a quantum dot.

[0107] In some embodiments, the emission component EL may include a series structure. For example, the emission component EL may emit light of one color including a light component of a second color and a light component of a third color. For example, the emission structure may include a first emission structure and a second emission structure. The first emission structure may include a multilayer structure configured to emit light of the second color. The second emission structure may include a multilayer structure configured to emit light of the third color. Therefore, the light emitted from the emission component EL may have a mixed color of the second color and the third color.

[0108] The hole transport component may include a multilayer structure having a plurality of layers including different materials, respectively. For example, the hole transport component may include at least one of a hole injection layer and a hole transport layer, and in some embodiments, may further include an auxiliary emission layer, an electron blocking layer, etc. For example, the hole transport component may have a multilayer structure, the multilayer structure including a hole injection layer / hole transport layer, a hole injection layer / hole transport layer / auxiliary emission layer, a hole injection layer / auxiliary emission layer, a hole transport layer / auxiliary emission layer, an electron blocking layer / hole injection layer / hole transport layer, a hole transport layer sequentially arranged including different materials, or a hole injection layer / hole transport layer / electron blocking layer. However, the present disclosure is not limited to specific examples.

[0109] The emission layer may include a material capable of emitting light of one color. The emission layer may include a host and a dopant. The host of the emission layer may be an emitting material capable of capturing carriers (e.g., electrons and holes) to generate light, thereby inducing efficient exciton generation. The dopant may include a phosphorescent dopant or a fluorescent dopant. In some embodiments, examples of dopants are not particularly limited. In some embodiments, the dopant may include an organic material, and may include a metal complex, etc.

[0110] The electron transport component may include a multilayer structure having a plurality of layers including different materials, respectively. The electron transport component may include at least one of an electron injection layer and an electron transport layer, and in some embodiments, may further include an electron buffer layer, a hole blocking layer, and the like. For example, the electron transport component may have a multilayer structure, for example, including an electron transport layer / electron injection layer, a hole blocking layer / electron transport layer / electron injection layer, an electron control layer / electron transport layer / electron injection layer, or an electron buffer layer / electron transport layer / electron injection layer. However, the present disclosure is not limited to specific examples.

[0111] The pixel defining layer PDL may be disposed on the pixel circuit layer PCL, and may define the position where the emission component EL is to be disposed. The pixel defining layer PDL may include an organic material. For example, the pixel defining layer PDL may be formed of one or more selected from acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. However, the present disclosure is not limited thereto. In some embodiments, the pixel defining layer PDL may include an inorganic material. For example, the pixel defining layer PDL may include silicon oxide (SiO x ) and silicon nitride (SiN x In some embodiments, the pixel defining layer PDL may have a structure including a silicon oxide (SiO x ) layer and / or including silicon nitride (SiN x ) layers to form a multilayer structure.

[0112] The cover layer CPL may be disposed on the second electrode EL2. The cover layer CPL may cover the second electrode EL2. The cover layer CPL may include an inorganic material.

[0113] The encapsulation layer TFE may be disposed on the light emitting element LD (e.g., the second electrode EL2). The encapsulation layer TFE may offset the step difference formed by the light emitting element LD and the pixel defining layer PDL. The encapsulation layer TFE may include a plurality of insulating layers configured to cover the light emitting element LD. In some embodiments, the encapsulation layer TFE may have a structure formed by alternately stacking inorganic layers and organic layers. In some embodiments, the encapsulation layer TFE may be formed by a thin film encapsulation layer.

[0114] In some embodiments, the light emitting element LD may be an inorganic light emitting diode including an inorganic material. For example, the display device DD may include a structure in which the light emitting element LD including an inorganic material is aligned between a plurality of electrodes spaced apart from each other. In some examples, the display device DD may include a structure in which the light emitting element LD as a micro light emitting diode (micro LED) is transferred to the pixel circuit layer PCL in a transfer scheme. The transfer scheme may be one of a stamp-based transfer scheme, a laser-based transfer scheme, an electrostatic transfer scheme, a magnetic and electromagnetic transfer scheme, and an adhesive-based transfer scheme. However, the present disclosure is not limited to the above examples.

[0115] In the case where the light emitting element LD includes an inorganic material, in some embodiments, the light emitting element LD may be configured to emit light including a light component in the second color and a light component in the third color. For example, a portion of the light emitting element LD may be configured to emit light including a light component in the second color, and another portion of the light emitting element LD may be configured to emit light including a light component in the third color.

[0116] The light control layer LCL may be disposed on the display layer DL (eg, on the light emitting element layer LEL). For example, the light control layer LCL may be disposed on the upper side of the display layer DL relative to a display direction (eg, a third direction DR3), which is also referred to herein as a thickness direction.

[0117] In some embodiments, the light control layer LCL may be a layer capable of changing the color of applied light and scattering the applied light. For example, the light control layer LCL may include a color conversion layer CCL (refer to Figure 5 ) and the scattering layer SCT (reference Figure 5 ). For example, a portion of the light control layer LCL corresponding to the color conversion layer CCL may be configured to change the color of light applied thereto, and another portion of the light control layer LCL corresponding to the scattering layer SCT may be configured to scatter the scattered light applied thereto.

[0118] The color filter layer CFL may be disposed on the light control layer LCL. For example, the color filter layer CFL may be disposed on an upper side of the light control layer LCL with respect to a display direction (eg, a third direction DR3).

[0119] In some embodiments, the color filter layer CFL may include a color filter CF (refer to Figure 5 ), each of the color filters CF allows light of one color to selectively pass therethrough.

[0120] The upper layer UPL may be disposed on the color filter layer CFL. For example, the upper layer UPL may be disposed on an upper side of the color filter layer CFL with respect to a display direction (eg, a third direction DR3).

[0121] In some embodiments, the upper UPL may include an upper substrate USUB (refer to Figure 5 ). The upper UPL may include an upper film layer UFM (refer to Figure 7 ). In some embodiments, the upper substrate USUB may be a second substrate.

[0122] Reference Figure 4 Structural characteristics of achieving full-color display using a display device DD according to some embodiments are described. Descriptions overlapping with the descriptions of the above-mentioned embodiments will be simplified or may not be repeated.

[0123] Figure 4 is a schematic block diagram illustrating an optical path provided for each sub-pixel SPX in a display device DD according to some embodiments of the present disclosure.

[0124] refer to Figure 4 , the display device DD may include a sub-pixel area SPXA and a non-sub-pixel area NSPXA.

[0125] The sub-pixel region SPXA may be a region formed by the sub-pixel SPX to provide light of one color, and the non-sub-pixel region NSPXA may be a region formed between adjacent sub-pixel regions SPXA to provide light of no color.

[0126] The sub-pixel region SPXA may include a first sub-pixel region SPXA1 defined by the first sub-pixel SPX1 and formed to provide light of a first color, a second sub-pixel region SPXA2 defined by the second sub-pixel SPX2 and formed to provide light of a second color, and a third sub-pixel region SPXA3 defined by the third sub-pixel SPX3 and formed to provide light of a third color.

[0127] In some embodiments, the light control layer LCL and the color filter layer CFL may be sequentially disposed (eg, may be sequentially disposed one after another) on the display layer DL, thereby defining first to third subpixels SPX1 to SPX3.

[0128] In some embodiments, the light emitting elements LD may be disposed in the first to third sub-pixel regions SPXA1 to SPXA3, respectively. For example, a first portion of the light emitting element LD may be disposed in the first sub-pixel region SPXA1, a second portion of the light emitting element LD may be disposed in the second sub-pixel region SPXA2, and a third portion of the light emitting element LD may be disposed in the third sub-pixel region SPXA3. In some embodiments, each light emitting element LD may emit light of a certain color. For example, the light emitting elements LD disposed in the first to third sub-pixel regions SPXA1 to SPXA3, respectively, may emit light of the same color.

[0129] In some embodiments, the light emitted from the light emitting element LD disposed in the sub-pixel region SPXA may include a light component in the third color and a light component in the second color. For example, the light emitted from the light emitting element LD may be a mixture of light corresponding to the spectrum of the third color and light corresponding to the spectrum of the second color.

[0130] In some embodiments, the light control layer LCL may include a color conversion layer CCL disposed in the first sub-pixel region SPXA1, and may include a scattering layer SCT disposed in each of the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3. For example, the scattering layer SCT may include a first scattering layer SCT1 disposed in the second sub-pixel region SPXA2 and a second scattering layer SCT2 disposed in the third sub-pixel region SPXA3.

[0131] In some embodiments, the color filter layer CFL may include a color filter CF. The color filter CF may include a first color filter CF1 disposed in the first sub-pixel area SPXA1, a second color filter CF2 disposed in the second sub-pixel area SPXA2, and a third color filter CF3 disposed in the third sub-pixel area SPXA3.

[0132] In the first sub-pixel area SPXA1, light emitted from the light emitting element LD may pass through the color conversion layer CCL and thus be provided as light in the first color. For example, the color conversion layer CCL may convert light in the third color (or the second color) into light in the first color. Light provided in the first color by passing through the color conversion layer CCL may pass through the first color filter CF1 and finally be provided as light in the first color. Therefore, the first sub-pixel SPX1 may be configured to provide light in the first color.

[0133] In the second sub-pixel area SPXA2, light emitted from the light emitting element LD may pass through the first scattering layer SCT1, and thus be provided as light of the same color as the emitted light. Light provided in the same color as the light emitted by passing through the first scattering layer SCT1 may pass through the second color filter CF2, and thus be provided as light of the second color. For example, the second color filter CF2 allows light of the second color to selectively pass therethrough. Therefore, the second sub-pixel SPX2 may be configured to provide light of the second color.

[0134] In the third sub-pixel area SPXA3, light emitted from the light emitting element LD may pass through the second scattering layer SCT2, and thus be provided as light of the same color as the emitted light. Light provided in the same color as the light emitted by passing through the second scattering layer SCT2 may pass through the third color filter CF3, and thus be provided as light of a third color. For example, the third color filter CF3 allows light of the third color to selectively pass therethrough. Therefore, the third sub-pixel SPX3 may be configured to provide light of the third color.

[0135] In other words, in some embodiments, the color conversion layer CCL provided as a component in the light control layer LCL and configured to change the color of light of one color may be formed only in the first subpixel SPX1. In this case, technical effects including sufficient light output efficiency and brightness and simplified process operations may be provided.

[0136] In some embodiments, even when a color conversion layer CCL having quantum dots QD is formed only in the first sub-pixel SPX1 for displaying red light, and a color conversion structure including quantum dots is not formed in the second sub-pixel SPX2 and the third sub-pixel SPX3 for displaying green light and blue light, respectively, a full-color display structure of a display device DD including corresponding sub-pixels SPX of red / green / blue is used, the display device DD may have desired structural characteristics, thereby ensuring sufficient light efficiency. For example, while the display device DD is configured to have a simplified (e.g., cost-effective) design by using a color conversion layer CCL for only one type of sub-pixel (e.g., a red sub-pixel) out of three types of sub-pixels (e.g., red sub-pixels, green sub-pixels, and blue sub-pixels), the display device DD may still provide sufficient light efficiency.

[0137] First, the reason why it is suitable to form the first sub-pixel SPX1 using the color conversion layer CCL is as follows. Experimentally, in the case where the light emitting element LD emits light including a red light component, the red light component emitted from the light emitting element LD may have a relatively wide wavelength spectrum. In this case, even if the red light component emitted from the light emitting element LD passes through the first color filter CF1, it may be difficult to ensure sufficiently high light efficiency. For example, even if the red light component emitted from the light emitting element LD passes through the first color filter CF1, it may be difficult to ensure sufficiently high light purity (also referred to as "color purity"). Therefore, in order to form the first sub-pixel SPX1 with sufficiently high light efficiency (for example, sufficiently high light purity), the light emitting element LD may be suitable for being configured so that the light emitted from the light emitting element LD includes a blue light component, and a color conversion layer CCL is formed in the first sub-pixel SPX1 to convert the blue light into red light. Therefore, in some embodiments, the first subpixel SPX1 can be implemented using a color conversion layer CCL and a first color filter CF1, thereby (e.g., enabling) the first subpixel SPX1 to provide (e.g., ensure) sufficient light efficiency and / or color purity (e.g., sufficiently high light efficiency and / or color purity).

[0138] Next, the reason why the second sub-pixel SPX2 is formed without forming a color conversion structure including quantum dots is as follows. Experimentally, in the case where the light emitting element LD emits light including a green light component, the green light component emitted from the light emitting element LD may have a relatively narrow wavelength spectrum. In this case, even if the green light component emitted from the light emitting element LD passes through the second color filter CF2 without passing through the color conversion structure, sufficient light efficiency and / or color purity (e.g., sufficiently high light efficiency and / or sufficiently high color purity) may be provided (e.g., ensured) for the second sub-pixel area SPXA2 to emit green light. Based on the above principles, in some embodiments, the light emitting element LD is configured to emit light including a green light component, and the second sub-pixel SPX2 includes the second color filter CF2 without including a color conversion structure, whereby the second sub-pixel SPX2 may be able to emit green light. Therefore, in some embodiments, the second sub-pixel SPX2 may have sufficient light efficiency and / or color purity (e.g., may have sufficiently high light efficiency and / or may have high color purity characteristics).

[0139] Similarly, the light emitted from the light emitting element LD may include a blue light component. The blue light component emitted from the light emitting element LD may also have a relatively narrow wavelength spectrum. In this case, the third sub-pixel SPX3 may not include a color conversion structure having quantum dots. For example, even if the blue light component emitted from the light emitting element LD passes through the third color filter CF3 without passing through the color conversion structure, sufficient light efficiency and / or color purity (e.g., sufficiently high light efficiency and / or sufficiently high color purity) may be provided (e.g., ensured) for the third sub-pixel area SPXA3 to emit blue light.

[0140] In summary, based on the red / green / blue light spectrum characteristics, the color conversion structure can be applied to only some color sub-pixels SPX. Therefore, in some embodiments, a display device DD configured such that each of the first sub-pixel SPX1 to the third sub-pixel SPX3 includes a color conversion layer CCL, a first scattering layer SCT1, and a second scattering layer SCT2 can be provided. In some embodiments, the display device DD can be configured such that only the first sub-pixel SPX1 among the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 includes the color conversion layer CCL. Therefore, in some embodiments, the display device DD can have sufficiently high light efficiency. In some embodiments, the method of manufacturing the display device DD can simplify some process operations, thereby resulting in a reduction in processing costs (e.g., a reduction in manufacturing costs).

[0141] Reference below Figures 5 to 27 The display device DD according to some embodiments is discussed in further detail. Descriptions overlapping with those of the above contents will be simplified or may not be repeated.

[0142] In accordance with Figures 5 to 27 In the display device DD of the embodiment shown in , the color conversion layer CCL may be manufactured by an inkjet process, and one or more of the first scattering layer SCT1 and the second scattering layer SCT2 may be manufactured by a photolithography process using a mask. For example, the color conversion layer CCL may be manufactured by an inkjet process, and the first scattering layer SCT1 and / or the second scattering layer SCT2 may be manufactured by a photolithography process.

[0143] Figures 5 to 7 are schematic cross-sectional views each illustrating a display device DD according to some embodiments of the present disclosure.

[0144] In some embodiments, the layers of the display device DD can be fabricated on the same substrate, or can be fabricated on different substrates and then joined together.

[0145] For example (reference Figure 5), the first panel PNL1 may be manufactured by forming a display layer DL including a lower substrate BSUB. The second panel PNL2 may be manufactured by forming a color filter layer CFL and a light control layer LCL on an upper substrate USUB. The first panel PNL1 and the second panel PNL2 may be coupled to each other by a filling layer FIL interposed between the first panel PNL1 and the second panel PNL2. Thus, a display device DD may be provided. In some embodiments, the first panel PNL1 and / or the second panel PNL2 may further include a dam structure to reduce (e.g., prevent) risks such as diffusion of the filling layer FIL to the outside.

[0146] In some embodiments, the light control layer LCL may include a bank QBNK, a color conversion layer CCL, a first cover layer QCP1, a first scattering layer SCT1, a second scattering layer SCT2, a spacer CS, and a second cover layer QCP2 as components formed under the color filter layer CFL.

[0147] For example, the light control layer LCL may be formed on the upper substrate USUB and manufactured to include the second panel PNL2, and thus may be disposed under the color filter layer CFL.

[0148] In some embodiments, the bank QBNK may be disposed under the color filter layer CFL. For example, the bank QBNK may be disposed directly on the optical cover layer LCP. In some embodiments, without forming the optical cover layer LCP, the bank QBNK may be disposed directly on the optical layer LR.

[0149] In a plan view, the bank QBNK may be disposed between adjacent sub-pixel regions SPXA. For example, the bank QBNK may overlap the non-sub-pixel region NSPXA in the third direction DR3 (eg, see Fig.16 corresponding plan view).

[0150] The bank QBNK may surround at least a portion of a region. For example, the bank QBNK may surround at least a portion of a region for forming the sub-pixel region SPXA and protrude in a thickness direction (for example, in the third direction DR3) of the lower substrate BSUB (for example, the base layer BSL). Therefore, the bank QBNK may form a space in which the color conversion layer CCL and the scattering layer SCT may be disposed (for example, accommodated).

[0151] The plane defined in this specification may be in the first direction DR1 and the second direction DR2 (for example, see Figure 1 ) and may be defined based on a plane on which the base layer BSL is disposed. In some embodiments, the third direction DR3 may correspond to a thickness direction of the base layer BSL. The third direction DR3 may correspond to a light output direction of the display device DD.

[0152] In some embodiments, the bank QBNK may include a tapered side surface that is recessed on a side portion adjacent to a surface on which the bank QBNK is disposed. In this case, a surface area of ​​a portion surrounded by the bank QBNK may expand outward based on a light emission direction. For example, an area surrounded by a lower portion of the bank QBNK may be smaller than an area surrounded by an upper portion of the bank QBNK.

[0153] The bank QBNK may include various materials. For example, the bank QBNK may include an organic material. In some embodiments, the bank QBNK may be formed of one or more selected from acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. In some embodiments, the bank QBNK may also include a scattering material (e.g., titanium oxide (TiO x )). However, the present disclosure is not limited thereto.

[0154] The color conversion layer CCL may be disposed under the color filter layer CFL. For example, the color conversion layer CCL may be disposed directly on the optical cover layer LCP. In some embodiments, the color conversion layer CCL may be disposed directly on the optical layer LR without forming the optical cover layer LCP.

[0155] The color conversion layer CCL may be formed in the first sub-pixel region SPXA1 and may overlap the first sub-pixel region SPXA1 in a plan view (eg, the third direction DR3 ), but may not overlap the second sub-pixel region SPXA2 or the third sub-pixel region SPXA3 .

[0156] The color conversion layer CCL may be a component configured to form the first sub-pixel SPX1. For example, the color conversion layer CCL may include first color conversion particles to convert light provided from the light emitting element LD (e.g., light including a light component in the second color and a light component in the third color) into light in the first color. For example, the color conversion layer CCL may include a quantum dot QD configured to convert light in the third color into light in the first color. The quantum dot QD may absorb light in the third color, change its wavelength according to energy conversion, and thus emit light in the first color. The quantum dot QD may be dispersed in a matrix layer formed of an organic material or the like.

[0157] The first cover layer QCP1 may be disposed throughout the sub-pixel area SPXA and the non-sub-pixel area NSPXA. The first cover layer QCP1 may be disposed on at least a portion of the bank QBNK, the color conversion layer CCL, and the optical cover layer LCP.

[0158] The first cover layer QCP1 may be positioned above the color conversion layer CCL in the first sub-pixel area SPXA1 based on a substrate (e.g., a color filter CF, an optical layer LR, or an optical cover layer LCP) on which the light control layer LCL (e.g., the color conversion layer CCL) is disposed. The first cover layer QCP1 may be positioned on (e.g., below) the first scattering layer SCT1 and the second scattering layer SCT2 in the second sub-pixel area SPXA2 and the third sub-pixel area SPXA3 based on a substrate (e.g., a color filter CF, an optical layer LR, or an optical cover layer LCP) on which the light control layer LCL (e.g., the first scattering layer SCT1 and the second scattering layer SCT2) are disposed. For example, the first cover layer QCP1 may passivate the color conversion layer CCL. The first cover layer QCP1 may be disposed (e.g., directly disposed) on the optical cover layer LCP in the second sub-pixel area SPXA2 and the third sub-pixel area SPXA3. In some embodiments, without forming the optical cover layer LCP, the first cover layer QCP1 may be disposed (eg, directly disposed) on the optical layer LR in the second and third sub-pixel areas SPXA2 and SPXA3 .

[0159] Herein, the first cover layer QCP1 may be referred to as a “cover layer”.

[0160] The first cover layer QCP1 may be manufactured after the inkjet process of manufacturing the color conversion layer CCL, and may be manufactured before the photolithography process of manufacturing the first scattering layer SCT1 and the second scattering layer SCT2. Therefore, the first cover layer QCP1 may be positioned under the color conversion layer CCL, and may be positioned above the first scattering layer SCT1 and the second scattering layer SCT2.

[0161] The first capping layer QCP1 may be an inorganic layer and may be made of a material selected from silicon nitride (SiN x ), aluminum nitride (AlN x ), titanium nitride (TiN x ), silicon oxide (SiO x ), aluminum oxide (Al x O y ), titanium oxide (TiO x ), Silicon Oxycarbide (SiO x C y ) and silicon oxynitride (SiO x N y ) are formed by one or more of the above examples. However, the present disclosure is not limited to the above examples.

[0162] The first scattering layer SCT1 and the second scattering layer SCT2 may be positioned below the color filter layer CFL. For example, the first scattering layer SCT1 and the second scattering layer SCT2 may be disposed (e.g., directly disposed) on the first cover layer QCP1. For example, a process of forming the first scattering layer SCT1 and the second scattering layer SCT2 may be performed after manufacturing the first cover layer QCP1 (e.g., after the first cover layer QCP1 passivates the color conversion layer CCL). Therefore, the first scattering layer SCT1 and the second scattering layer SCT2 may be directly adjacent to the first cover layer QCP1.

[0163] The first scattering layer SCT1 may be formed in the second sub-pixel area SPXA2. The second scattering layer SCT2 may be formed in the third sub-pixel area SPXA3. The first scattering layer SCT1 may overlap the second sub-pixel area SPXA2 in a plan view (e.g., in a third direction DR3). The second scattering layer SCT2 may overlap the third sub-pixel area SPXA3 in a plan view (e.g., in a third direction DR3). The first scattering layer SCT1 and the second scattering layer SCT2 may not overlap the first sub-pixel area SPXA1.

[0164] The first scattering layer SCT1 and the second scattering layer SCT2 may be layers configured to enhance light output efficiency (e.g., brightness) and improve viewing angle characteristics. For example, each of the first scattering layer SCT1 and the second scattering layer SCT2 may include a scatterer SC. The scatterer SC may be dispersed in a matrix formed of an organic material (e.g., a transparent organic material) or the like. In some embodiments, the scatterer SC may include a first scatterer SC1 included in the first scattering layer SCT1 and a second scatterer SC2 included in the second scattering layer SCT2.

[0165] In some embodiments, the concentration of the first scatterer SC1 in the first scattering layer SCT1 and the concentration of the second scatterer SC2 in the second scattering layer SCT2 may be different from each other. Therefore, the light characteristic relationship between the second sub-pixel SPX2 and the third sub-pixel SPX3 may be adjusted based on the concentration of the first scatterer SC1 and the concentration of the second scatterer SC2.

[0166] In some embodiments, the scatterer SC may include various light scattering particles. For example, the scatterer SC may include a particle selected from titanium oxide (TiO x ), silicon oxide (SiO x ) (e.g., silica beads, hollow silica particles, etc.), zirconium oxide (ZrO x ), aluminum oxide (Al x O y ), indium oxide (In x O y ), zinc oxide (ZnO x), tin oxide (SnO x )) and antimony oxide (Sb x O y However, the present disclosure is not limited to the above-mentioned embodiments.

[0167] In some embodiments, the scatterer SC may be included in a range of about 0.1 wt% (weight percent) to about 8.5 wt% with respect to the scattering layer SCT. In some embodiments, the scatterer SC may be included in a range of about 1.5 wt% to about 8.5 wt% with respect to the scattering layer SCT. In some embodiments, the scatterer SC may be included in a range of about 4.0 wt% to about 7.5 wt% with respect to the scattering layer SCT. The above numerical ranges may be independently applied to each of the first scattering layer SCT1 and the second scattering layer SCT2. However, the present disclosure is not limited to the above examples.

[0168] Each of the first scattering layer SCT1 and the second scattering layer SCT2 may not include quantum dots as color conversion particles. For example, the first scattering layer SCT1 may not include quantum dots for providing green light. For example, the second scattering layer SCT2 may not include quantum dots for providing blue light. Therefore, the first scattering layer SCT1 and the second scattering layer SCT2 may transmit incident light without changing the color of the incident light.

[0169] In the present specification, the phrase “without changing the color of light applied to the first scattering layer SCT1 and the second scattering layer SCT2” may mean that the color of the light is substantially the same before and after passing through the first scattering layer SCT1 and the second scattering layer SCT2. For example, the light before passing through the first scattering layer SCT1 may be light including a mixture of green light and blue light (or may have a wavelength band including a green light component and a blue light component). The light after passing through the first scattering layer SCT1 may be light including a mixture of green light and blue light (or may have a wavelength band including a green light component and a blue light component). The light before passing through the second scattering layer SCT2 may be light including a mixture of green light and blue light (or may have a wavelength band including a green light component and a blue light component). The light after passing through the second scattering layer SCT2 may be light including a mixture of green light and blue light (or may have a wavelength band including a green light component and a blue light component).

[0170] In some embodiments, the color conversion layer CCL may further include a scatterer SC. In this case, in a region where the color conversion layer CCL is formed, light emitted from the light emitting element LD may be scattered, and a viewing angle characteristic in the first subpixel SPX1 may be improved.

[0171] In some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 may be manufactured by the same photolithography process. In this case, at least some of the process operations for manufacturing the second sub-pixel SPX2 and the third sub-pixel SPX3 may be simplified. However, the present disclosure is not limited to the above examples. After performing the first photolithography process for manufacturing the first scattering layer SCT1, the second photolithography process for manufacturing the second scattering layer SCT2 may be performed. In some examples, after performing the second photolithography process for manufacturing the second scattering layer SCT2, the first photolithography process for manufacturing the first scattering layer SCT1 may be performed.

[0172] In some embodiments, when the first and second scattering layers SCT1 and SCT2 are manufactured based on a photolithography process, the sub-pixels SPX may be manufactured finer, thereby enabling the production of a display device DD having high performance (eg, high resolution, etc.).

[0173] The spacer CS may be disposed in the non-sub-pixel area NSPXA. In some embodiments, the spacer CS may not overlap the sub-pixel area SPXA in a plan view (eg, in the third direction DR3).

[0174] The spacer CS may be disposed on the bank QBNK. For example, the spacer CS may be disposed between the bank QBNK and the display layer DL. The spacer CS may be disposed directly on the first cover layer QCP1.

[0175] The spacer CS may be disposed above the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 based on the substrate on which the light control layer LCL is disposed. For example, the spacer CS may protrude in the thickness direction (e.g., the third direction DR3) of the lower substrate BSUB (e.g., the base layer BSL). The spacer CS may form a spacing distance between the display layer DL and other components of the light control layer LCL during a process of coupling the first panel PNL1 and the second panel PNL2 to each other. To this end, the spacer CS may be closest to the display layer DL compared to the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2.

[0176] The spacer CS may be manufactured by the same photolithography process as at least any one of the first scattering layer SCT1 and the second scattering layer SCT2. Therefore, the process operation of forming the spacer CS may be simplified, resulting in a reduction in processing costs. For example, the spacer CS may be formed by the same process as the first scattering layer SCT1. In some examples, the spacer CS may be formed by the same process as the second scattering layer SCT2. As a further alternative, the spacer CS may be formed by the same process as the first scattering layer SCT1 and the second scattering layer SCT2.

[0177] The spacer CS may be manufactured by the same process as at least any one of the first scattering layer SCT1 and the second scattering layer SCT2 and have the same material as at least any one of them, and may have the scatterer SC.

[0178] The second cover layer QCP2 may be disposed throughout the sub-pixel area SPXA and the non-sub-pixel area NSPXA. The second cover layer QCP2 may be disposed on the first cover layer QCP1, the first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS. The second cover layer QCP2 may passivate the first scattering layer SCT1 and the second scattering layer SCT2.

[0179] The second cover layer QCP2 may be manufactured after a photolithography process for manufacturing the first and second scattering layers SCT1 and SCT2.

[0180] The second capping layer QCP2 may be an inorganic layer and may be made of a material selected from silicon nitride (SiN x ), aluminum nitride (AlN x ), titanium nitride (TiN x ), silicon oxide (SiO x ), aluminum oxide (Al x O y ), titanium oxide (TiO x ), Silicon Oxycarbide (SiO x C y ) and silicon oxynitride (SiO x N y ) are formed by one or more of the above. However, the present disclosure is not limited to the above-mentioned embodiments.

[0181] As described above, the filling layer FIL may be interposed between the first panel PNL1 and the second panel PNL2. The filling layer FIL may include various transparent organic materials, and examples thereof are not particularly limited.

[0182] In some embodiments, the color filter layer CFL may include a color filter CF, an optical layer LR, and an optical cover layer LCP as components formed under the upper layer UPL.

[0183] For example, the color filter layer CFL may be formed on the upper substrate USUB and manufactured to be included in the second panel PNL2, and thus may be disposed under the upper layer UPL.

[0184] In some embodiments, the color filter CF may include a first color filter CF1 disposed to form the first subpixel SPX1 , a second color filter CF2 disposed to form the second subpixel SPX2 , and a third color filter CF3 disposed to form the third subpixel SPX3 .

[0185] The color filter CF may be disposed under the upper substrate USUB. For example, the color filter CF may be disposed directly on the upper cover layer UCP.

[0186] The first color filter CF1 may be disposed in the first sub-pixel area SPXA1. The first color filter CF1 may include a color filter material (eg, pigment or dye) for allowing light of a first color (eg, red light) to pass therethrough (eg, selectively pass therethrough).

[0187] The second color filter CF2 may be disposed in the second sub-pixel area SPXA2. The second color filter CF2 may include a color filter material (eg, pigment or dye) for allowing the second color light (eg, green light) to pass therethrough (eg, selectively pass therethrough).

[0188] The third color filter CF3 may be disposed in the third sub-pixel area SPXA3. The third color filter CF3 may include a color filter material (eg, pigment or dye) for allowing light of a third color (eg, blue light) to pass therethrough (eg, selectively pass therethrough).

[0189] In some embodiments, light of one color may be formed between the sub-pixel regions SPXA, and a non-sub-pixel region NSPXA may be invisible. In some embodiments, the first color filter CF1, the second color filter CF2, and the third color filter CF3 may overlap each other in the non-sub-pixel region NSPXA in a plan view (e.g., in the third direction DR3).

[0190] The optical layer LR may be disposed on the color filter CF. The optical layer LR may be disposed throughout the sub-pixel area SPXA and the non-sub-pixel area NSPXA.

[0191] The optical layer LR may have a higher refractive index than a layer forming the color filter CF. The optical layer LR may have a lower refractive index than the color conversion layer CCL, and may form an optical recycling structure.

[0192] The optical layer LR may include various materials having a refractive index. For example, the optical layer LR may include various resins and hollow silica. In some examples, the optical layer LR may include zirconium oxide (ZrO x ). However, the present disclosure is not limited to the above examples.

[0193] Herein, the optical layer LR may be referred to as a low-refractive layer.

[0194] The optical cover layer LCP may be disposed on the optical layer LR. The optical cover layer LCP may be disposed throughout the sub-pixel area SPXA and the non-sub-pixel area NSPXA. The optical cover layer LCP may passivate the optical layer LR.

[0195] The optical cover layer LCP may include one or more of the examples described with reference to the first cover layer QCP1. In some embodiments, the optical cover layer LCP may be omitted (eg, the optical cover layer LCP may not be provided).

[0196] In some embodiments, the upper substrate USUB may be disposed on the color filter layer CFL as a base member for manufacturing the second panel PNL2. In some embodiments, the upper cover layer UCP may be disposed on the upper substrate USUB.

[0197] The upper substrate USUB may be a manufacturing substrate provided to manufacture the second panel PNL2 and may include one or more of the materials described above with reference to the lower substrate BSUB (eg, base layer BSL). For example, the upper substrate USUB may include an organic substrate.

[0198] The upper cover layer UCP may be disposed between the upper substrate USUB and the color filter CF, and may include one or more of the examples (eg, materials) described above with reference to the first cover layer QCP1.

[0199] In some embodiments (see Figure 6 ), the first panel PNL1 may be manufactured by forming a display layer DL including a lower substrate BSUB and a light control layer LCL on the display layer DL. The second panel PNL2 may be manufactured by forming a color filter layer CFL on an upper substrate USUB. The first panel PNL1 and the second panel PNL2 may be coupled to each other by a filling layer FIL interposed between the first panel PNL1 and the second panel PNL2. Thus, a display device DD may be provided.

[0200] For example, Figure 6 The display device DD shown in FIG. Figure 5 The display device DD shown in FIG. 1 is different in that components for forming a light control layer LCL (e.g., a dam QBNK, a color conversion layer CCL, a first cover layer QCP1, a first scattering layer SCT1, a second scattering layer SCT2, a spacer CS, and a second cover layer QCP2) are disposed on a lower substrate BSUB (e.g., even before the first panel PNL1 and the second panel PNL2 are coupled to each other).

[0201] Therefore, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 may be disposed adjacent to the display layer DL and included in the first panel PNL1. The filling layer FIL may be interposed between the color filter layer CFL and the layers forming the light control layer LCL.

[0202] In some embodiments (see Figure 7), the first panel PNL1 may be manufactured by forming a display layer DL including a lower substrate BSUB and a light control layer LCL, a color filter layer CFL, and an upper layer UPL on the display layer DL without separately forming an upper substrate USUB. The display device DD may be provided without performing a separate process of coupling panels to each other.

[0203] in this case, Figure 7 The display device DD shown in FIG. Figure 6 The display device DD shown in FIG. 1 is different in that a color filter layer CFL and an upper layer UPL are also provided on the lower substrate BSUB.

[0204] In this case, the optical layer LR and the color filter CF may be sequentially disposed on the light control layer LCL. In addition, in some embodiments, a planarization layer PLA including an organic material may also be disposed on the color filter CF. In some embodiments, an upper substrate USUB may not be formed, and an upper film layer UFM may be disposed on an upper cover layer UCP. In some embodiments, the upper film layer UFM may include one selected from a polyethylene terephthalate (PET) film, a low-reflection film, a polarizing film, and a transmittance controllable film. The present disclosure is not limited to the above examples.

[0205] Reference below Figures 8 to 27 Various technical features related to the light control layer LCL are discussed.

[0206] Figure 8 2 is a schematic cross-sectional view for describing a thickness relationship among the first scattering layer SCT1 , the second scattering layer SCT2 , and the color conversion layer CCL in some embodiments.

[0207] Figures 9 to 11 is a schematic cross-sectional view depicting a relationship between scatterers SC included in each of the first scattering layer SCT1 and the second scattering layer SCT2 according to some embodiments of the present disclosure.

[0208] Figure 8 The first sub-pixel region SPXA1, the second sub-pixel region SPXA2, the third sub-pixel region SPXA3 and the regions adjacent thereto according to some embodiments of the present disclosure are shown. Figure 8 The color conversion layer CCL disposed in the first sub-pixel region SPXA1, the first scattering layer SCT1 disposed in the second sub-pixel region SPXA2, and the second scattering layer SCT2 disposed in the third sub-pixel region SPXA3 are shown, and a bank QBNK surrounding the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 is shown. Figure 8, the color conversion layer CCL may have a thickness greater than each of the first scattering layer SCT1 and the second scattering layer SCT2. In the present specification, the term “thickness” may be defined based on a thickness direction (eg, third direction DR3) of the base layer BSL.

[0209] For example, the color conversion layer CCL may have a first thickness T1. The first scattering layer SCT1 may have a second thickness T2. The second scattering layer SCT2 may have a third thickness T3. The first thickness T1 may be greater than each of the second thickness T2 and the third thickness T3. In some embodiments, the second thickness T2 and the third thickness T3 may be substantially the same as each other.

[0210] In some embodiments, it may be desirable for the subpixels SPX to have substantially uniform light output efficiencies. For example, the first subpixel SPX1, the second subpixel SPX2, and the third subpixel SPX3 may be adapted to have light output efficiencies corresponding to each other (eg, substantially the same light output efficiencies).

[0211] The first subpixel SPX1 configured to emit light in the first color may be realized by the color conversion layer CCL and thus has a relatively low color realization efficiency (eg, current efficiency) compared to the second subpixel SPX2 and the third subpixel SPX3 .

[0212] In some embodiments, a first thickness T1 of the color conversion layer CCL included in the first subpixel SPX1 may be defined to be greater than each of a second thickness T2 of the first scattering layer SCT1 included in the second subpixel SPX2 and a third thickness T3 of the second scattering layer SCT2 included in the third subpixel SPX3. In this case, the color conversion layer CCL may be defined to be relatively thick so as to have a larger amount of scatterers SC than the first and second scattering layers SCT1 and SCT2, thereby compensating for a difference in color realization efficiency between the first to third subpixels SPX1 to SPX3.

[0213] Furthermore, the first and second scattering layers SCT1 and SCT2 , each of which does not include quantum dots, may have thicknesses corresponding to each other (eg, substantially the same thickness as each other), thereby resulting in enhanced process convenience.

[0214] Figures 9 to 11 The second sub-pixel region SPXA2, the third sub-pixel region SPXA3 and the region adjacent thereto according to some embodiments of the present disclosure are shown. Figures 9 to 11 The first and second scattering layers SCT1 and SCT2 disposed in the second and third sub-pixel areas SPXA2 and SPXA3 are illustrated, and a bank QBNK surrounding the first and second scattering layers SCT1 and SCT2 is illustrated.

[0215] In some embodiments, adjacent banks QBNK surrounding the first scattering layer SCT1 may be spaced apart from each other by a first distance L1. Adjacent banks QBNK surrounding the second scattering layer SCT2 may be spaced apart from each other by a second distance L2.

[0216] refer to Fig. 9 In some embodiments, each of the first scatterers SC1 may be larger than each of the second scatterers SC2. In this case, in some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 may be manufactured by separate processes.

[0217] In the present specification, the size of the scatterer SC may refer to a maximum diameter that may be defined as particles constituting the scatterer SC.

[0218] For example, in some embodiments, when the scatterer SC has an elliptical shape, the size of the scatterer SC may refer to the major radius of the ellipse. For example, in some embodiments, when the scatterer SC has a circular shape, the size of the scatterer SC may refer to the diameter of the circle. For example, in some embodiments, when the scatterer SC has a shape including an uneven protrusion structure, the size of the scatterer SC may refer to the distance between the ends spaced apart from each other at the maximum distance in the shape of the scatterer SC.

[0219] The scatterer SC may most efficiently scatter light of a wavelength band having a size twice that of the scatterer SC.

[0220] For example, in some embodiments, when the diameter of the scatterer SC is about 300 nm to about 375 nm, the scatterer SC can effectively scatter light in a wavelength band of about 600 nm to about 750 nm. In some embodiments, when the diameter of the scatterer SC is about 240 nm to about 280 nm, the scatterer SC can effectively scatter light in a wavelength band of about 480 nm to about 560 nm. In some embodiments, when the diameter of the scatterer SC is about 185 nm to about 230 nm, the scatterer SC can effectively scatter light in a wavelength band of about 370 nm to about 460 nm.

[0221] Therefore, in some embodiments, the size of the first scatterer SC1 may be set to correspond to the wavelength band of light provided from the second sub-pixel SPX2. The size of the second scatterer SC2 may be set to correspond to the wavelength band of light provided from the third sub-pixel SPX3.

[0222] For example, the first scatterer SC1 may have a size of about 240 nm to about 280 nm, and the second scatterer SC2 may have a size of about 185 nm to about 230 nm.

[0223] Therefore, in some embodiments, the scattering properties of the first scattering layer SCT1 and the second scattering layer SCT2 may be provided (eg, optimized) for the respective sub-pixels SPX of the first scattering layer SCT1 and the second scattering layer SCT2.

[0224] refer to Fig.10 In some embodiments, the first scatterer SC1 and the second scatterer SC2 may have the same size. The first scatterer SC1 may be included in the first scattering layer SCT1 at a first weight ratio. The second scatterer SC2 may be included in the second scattering layer SCT2 at a second weight ratio. The first weight ratio may be greater than the second weight ratio. For example, the number of the first scatterers SC1 in the first scattering layer SCT1 may be greater than the number of the second scatterers SC2 in the second scattering layer SCT2.

[0225] As described above, it is desirable that the sub-pixel SPX has a substantially uniform light output efficiency. The second sub-pixel SPX2 and the third sub-pixel SPX3 may be adapted to have light output efficiencies corresponding to each other (e.g., substantially the same light output efficiencies). For example, the light emitted from the light emitting element LD disposed in each of the sub-pixel regions SPXA may include a light component in a second color and a light component in a third color. The light component in the third color may be used to form a third sub-pixel SPX3 providing light in a third color and a first sub-pixel SPX1 providing light in a first color using a color conversion layer CCL. Therefore, when the second sub-pixel SPX2 and the third sub-pixel SPX3 are compared, the third sub-pixel SPX3 may have a higher light output efficiency than the second sub-pixel SPX2. Therefore, it is desirable to compensate for the light output efficiency of the second sub-pixel SPX2 so that the light output efficiency of the second sub-pixel SPX2 and the light output efficiency of the third sub-pixel SPX3 may correspond to each other (e.g., may be substantially the same).

[0226] The scatterer SC may scatter applied light and enhance light output efficiency. Therefore, as the ratio of the scatterer SC included in the scattering layer SCT increases, the light output efficiency of the corresponding sub-pixel SPX may also be enhanced.

[0227] In some embodiments, the weight ratio of the first scatterer SC1 in the first scattering layer SCT1 may be higher than the weight ratio of the second scatterer SC2 in the second scattering layer SCT2, thereby compensating for the difference in light output efficiency. Therefore, the second subpixel SPX2 and the third subpixel SPX3 may have substantially uniform light output efficiency.

[0228] refer to Fig.11In some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 may be formed by the same process and include materials of the same composition. In addition, each of the first scatterer SC1 and the second scatterer SC2 may include some scatterers SC having different sizes. For example, each of the first scatterer SC1 and the second scatterer SC2 may include scatterers SC having different sizes at the same composition ratio.

[0229] The scatterer SC may relatively effectively scatter light of a wavelength band having a size twice that of the scatterer SC.

[0230] In some embodiments, each of the first scatterer SC1 and the second scatterer SC2 may include both a scatterer SC having a relatively large size to effectively scatter light of the second color and a scatterer SC having a relatively small size to effectively scatter light of the third color. Therefore, the first scattering layer SCT1 and the second scattering layer SCT2 may be manufactured by the same process, thereby simplifying the process and improving the light output efficiency of each of the sub-pixels SPX.

[0231] Figures 12 to 15 is a cross-sectional view depicting characteristics of a light control layer LCL according to some embodiments of the present disclosure.

[0232] For ease of explanation, Figures 12 to 15 Based on the reference Figure 5 The cross-sectional structure of the light control layer LCL described above is shown in FIG. Figures 12 to 15 The color filter layer CFL and the light control layer LCL are shown disposed on the upper substrate USUB. Figures 12 to 15 The second panel PNL2 is shown. In order to describe the structure in which the second panel PNL2 is formed, a configuration is shown in which an upper substrate USUB is positioned below and a color filter layer CFL and a light control layer LCL are sequentially disposed on the upper substrate USUB.

[0233] refer to Fig.12 In some embodiments, the optical layer LR may be disposed (eg, selectively disposed) only in some of the sub-pixel areas SPXA.

[0234] For example, the optical layer LR may be disposed in the first sub-pixel region SPXA1. The optical layer LR may be disposed neither in the second sub-pixel region SPXA2 nor in the third sub-pixel region SPXA3. Therefore, in some embodiments, the first cover layer QCP1 may be directly adjacent to (e.g., directly contact) each of the second color filter CF2 in the second sub-pixel region SPXA2 and the third color filter CF3 in the third sub-pixel region SPXA3.

[0235] In some embodiments, the optical layer LR may be a low refractive layer having a lower refractive index than the color conversion layer CCL. Therefore, light provided from the color conversion layer CCL may be reflected by the optical layer LR and then provided back to the color conversion layer CCL, thereby forming a light recycling structure.

[0236] In some embodiments, quantum dots QD configured to change the color of light may be disposed in the first sub-pixel region SPXA1, but not in the second and third sub-pixel regions SPXA2 and SPXA3. Therefore, it may be particularly desirable to form a light recycling structure in the first sub-pixel region SPXA1.

[0237] Therefore, in some embodiments, the optical layer LR may be selectively disposed only in some regions, thereby resulting in a reduction in the processing cost of manufacturing the display device DD. In addition, in the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3 where the optical layer LR is not disposed, the scattering layer SCT may be disposed within the thickness range of the optical layer LR. Therefore, the scattering performance of the scattering layer SCT in the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3 may be further improved.

[0238] refer to Fig.13 In some embodiments, the display device DD may further include a black matrix layer BM. In the non-sub-pixel region NSPXA adjacent to the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3, the black matrix layer BM may be provided without the bank QBNK. For example, in some embodiments, the black matrix layer BM may be provided between the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3 instead of providing the bank QBNK between the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3. The black matrix layer BM may penetrate between the first scattering layer SCT1 and the second scattering layer SCT2.

[0239] In some embodiments, the bank QBNK may be patterned in a non-sub-pixel region NSPXA adjacent to the first sub-pixel region SPXA1. The black matrix layer BM may be disposed in a non-sub-pixel region NSPXA that is not directly adjacent to the first sub-pixel region SPXA1. In a plan view, the black matrix layer BM may be disposed in the non-sub-pixel region NSPXA and may not overlap the sub-pixel region SPXA. In some embodiments, the black matrix layer BM may be directly adjacent to (e.g., directly in contact with) the first cover layer QCP1. However, the present disclosure is not limited to the above examples.

[0240] In some embodiments, the first and second scattering layers SCT1 and SCT2 may be manufactured by a photolithography process instead of an inkjet process. Therefore, even in the absence of a bank QBNK adjacent to the first and second scattering layers SCT1 and SCT2, the first and second scattering layers SCT1 and SCT2 may be properly patterned.

[0241] For example, in some embodiments, in order to manufacture the first scattering layer SCT1 and the second scattering layer SCT2, a basic scattering layer including a scatterer SC may be disposed throughout the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3. A black matrix layer BM passing through the basic scattering layer may be patterned in regions adjacent to the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3.

[0242] In some embodiments, the black matrix layer BM may include a pigment or dye capable of blocking or absorbing light. For example, the black matrix layer BM may include carbon black, etc. However, the present disclosure is not limited to the above examples.

[0243] refer to Fig.14 and Fig.15 , the display device DD (e.g., the light control layer LCL) in some embodiments may further include a filling scattering layer FSCT including a filling scatterer FSC. The filling scatterer FSC may include a first filling scatterer FSC1 and a second filling scatterer FSC2. The filling scattering layer FSCT may include a first filling scattering layer FSCT1 in which the first filling scatterer FSC1 is disposed and a second filling scattering layer FSCT2 in which the second filling scatterer FSC2 is disposed. The filling scattering layer FSCT may refer to a material including the filling scatterer FSC formed by including a scattering material in a filling material.

[0244] In some embodiments, the first filling scattering layer FSCT1 may be disposed in the second sub-pixel area SPXA2. In a plan view (e.g., in the third direction DR3), the first filling scattering layer FSCT1 may overlap the first scattering layer SCT1. The second filling scattering layer FSCT2 may be disposed in the third sub-pixel area SPXA3. In a plan view (e.g., in the third direction DR3), the second filling scattering layer FSCT2 may overlap the second scattering layer SCT2.

[0245] For example (reference Fig.14), the first filling scattering layer FSCT1 may be disposed on the first scattering layer SCT1 and may be passivated (e.g., coated and / or protected) by the second cover layer QCP2. The second filling scattering layer FSCT2 may be disposed on the second scattering layer SCT2 and may be passivated by the second cover layer QCP2. In some embodiments, after patterning the first scattering layer SCT1 and the second scattering layer SCT2, the first filling scattering layer FSCT1 and the second filling scattering layer FSCT2 may be patterned.

[0246] In another example (ref. Fig.15 ), the first filling scattering layer FSCT1 may be disposed between the first scattering layer SCT1 and the second color filter CF2, and may be adjacent to (e.g., directly adjacent to) the first cover layer QCP1 according to an embodiment. The second filling scattering layer FSCT2 may be disposed between the second scattering layer SCT2 and the third color filter CF3, and may be adjacent to (e.g., directly adjacent to) the first cover layer QCP1 according to an embodiment. In some embodiments, after patterning the first filling scattering layer FSCT1 and the second filling scattering layer FSCT2, the first scattering layer SCT1 and the second scattering layer SCT2 may be patterned.

[0247] In some embodiments, a plurality of scattering structures having various scattering characteristics may be formed in the second and third sub-pixel regions SPXA2 and SPXA3, thereby resulting in enhanced scattering efficiency. Thus, the light output efficiency of the display device DD may be improved.

[0248] Figures 16 to 21 are plan views each depicting an arrangement relationship between a bank QBNK and a sub-pixel area SPXA according to some embodiments of the present disclosure.

[0249] For ease of explanation, Figures 16 to 21 Some regions of the display area DA are shown, and the sub-pixel area SPXA and the bank QBNK disposed adjacent thereto are shown. Figures 16 to 19 A structure in which the first sub-pixel region SPXA1 and the second sub-pixel region SPXA2 are adjacent to each other in the second direction DR2 and the third sub-pixel region SPXA3 and the first sub-pixel region SPXA1 are adjacent in the first direction DR1 according to some embodiments of the present disclosure is shown. Figures 17 to 19 Pixels PXL adjacent to each other in the display area DA according to some embodiments of the present disclosure are shown. For example, Figures 17 to 19 A first pixel PXL1 and a second pixel PXL2 adjacent to each other in the first direction DR1 among the pixels PXL are shown. Fig. 20 and Fig.21 A structure in which the sub-pixel areas SPXA are sequentially disposed in the first direction DR1 according to some embodiments of the present disclosure is shown.

[0250] refer to Fig.16 , the bank QBNK may surround at least a portion of each of the sub-pixel areas SPXA. Fig.16 Pixels PXL in a display area DA according to some embodiments of the present disclosure are shown.

[0251] In some embodiments, the bank QBNK may form a closed loop for each of the sub-pixel regions SPXA. For example, in a plan view, the bank QBNK may surround the entire first sub-pixel region SPXA1 (e.g., the color conversion layer CCL) (e.g., may surround all sides of the first sub-pixel region SPXA1). In a plan view, the bank QBNK may surround the entire second sub-pixel region SPXA2 (e.g., the first scattering layer SCT1). In a plan view, the bank QBNK may surround the entire third sub-pixel region SPXA3 (e.g., the second scattering layer SCT2).

[0252] refer to Fig.17 , in a plan view, the bank QBNK may surround only one of (eg, among three) sub-pixel regions SPXA.

[0253] In some embodiments, the bank QBNK may surround the entire first sub-pixel region SPXA1 (eg, the color conversion layer CCL). Thus, the bank QBNK may form a closed loop structure, and an inkjet process for manufacturing the color conversion layer CCL may be performed.

[0254] Furthermore, in some embodiments, the first and second scattering layers SCT1 and SCT2 may be manufactured by a photolithography process instead of an inkjet process. Therefore, even if the bank QBNK does not directly surround the second and third sub-pixel areas SPXA2 and SPXA3, the first and second scattering layers SCT1 and SCT2 may be appropriately manufactured.

[0255] In some embodiments, the second and third sub-pixel regions SPXA2 and SPXA3 , which are not directly surrounded by the bank QBNK, may be spaced apart from each other by a distance greater than a spacing distance from the first sub-pixel region SPXA1 .

[0256] For example, a spacing distance between the second subpixel region SPXA2 and the third subpixel region SPXA3 may be greater than a spacing distance between the first subpixel region SPXA1 and the third subpixel region SPXA3 or a spacing distance between the first subpixel region SPXA1 and the second subpixel region SPXA2.

[0257] Therefore, even if the bank QBNK is not directly adjacent to the second and third sub-pixel regions SPXA2 and SPXA3 , the risk of color mixing between the second and third sub-pixel regions SPX2 and SPX3 may be reduced.

[0258] refer to Fig.18 , in some embodiments, similar to Fig.17 , the bank QBNK may surround the entire first sub-pixel region SPXA1 (e.g., the color conversion layer CCL) and surround at least a portion of the second sub-pixel region SPXA2 (e.g., the first scattering layer SCT1), and allow at least another portion of the second sub-pixel region SPXA2 (e.g., the first scattering layer SCT1) to be open. Therefore, at least one side of the second sub-pixel region SPXA2 may include an open edge OEDG where the bank QBNK is not formed.

[0259] In some embodiments, the bank QBNK may be disposed in a region adjacent to the third sub-pixel region SPXA3 (eg, the second scattering layer SCT2), and may not directly surround the third sub-pixel region SPXA3 (eg, the second scattering layer SCT2). Therefore, the periphery of the third sub-pixel region SPXA3 may be open.

[0260] In some embodiments, the open edge OEDG may be formed based on the second sub-pixel region SPXA2 to face a direction different from the direction toward the third sub-pixel region SPXA3. For example, the open edge OEDG may be formed away from the third sub-pixel region SPXA3 so that the bank QBNK is formed around the second side of the second sub-pixel region SPXA2 closer to the third sub-pixel region SPXA3 than the open edge OEDG.

[0261] For example, the open edge OEDG may be disposed in an upper portion of the second sub-pixel region SPXA2 based on the second direction DR2. The third sub-pixel region SPXA3 may be positioned on a lower right portion of the second sub-pixel region SPXA2 based on the second direction DR2.

[0262] In this case, the risk of color mixing between the second sub-pixel SPX2 and the third sub-pixel SPX3 can be reduced.

[0263] In some embodiments, as described above, although the bank QBNK does not directly surround the third sub-pixel region SPXA3, the bank QBNK may be disposed adjacent to the first sub-pixel region SPXA1 and the second sub-pixel region SPXA2, and thus substantially adjacent to the third sub-pixel region SPXA3. For example, the third sub-pixel region SPXA3 of the first pixel PXL1 may be positioned between a portion of the bank QBNK of the first pixel PXL1 and a portion of the bank QBNK of the second pixel PXL2.

[0264] Therefore, the spacing distances between the bank QBNK and the second and third sub-pixel regions SPXA2 and SPXA3 may be defined. In some embodiments, the shortest distance between the bank QBNK and the second sub-pixel region SPXA2 may be smaller than the shortest distance between the bank QBNK and the third sub-pixel region SPXA3.

[0265] Furthermore, in some embodiments, the bank QBNK may surround the region in which the first scattering layer SCT1 and the second scattering layer SCT2 are positioned to different degrees, respectively. In this case, the respective thicknesses, etc., of the first scattering layer SCT1 and the second scattering layer SCT2 may be formed to be substantially uniform without a separate additional process. Furthermore, the first scattering layer SCT1 and the second scattering layer SCT2 may be patterned based on a photolithography process, etc., rather than an inkjet process. Therefore, the uniformity (e.g., thickness uniformity) of the first scattering layer SCT1 and the second scattering layer SCT2 may be enhanced. Furthermore, the process operation may be simplified, resulting in a sufficient processing margin and a reduction in processing costs.

[0266] refer to Fig.19 , in some embodiments, similar to Fig.18 The bank QBNK may be directly adjacent to the first sub-pixel region SPXA1 and the second sub-pixel region SPXA2 and relatively spaced apart from the third sub-pixel region SPXA3. In a plan view, the bank QBNK may surround the entire second sub-pixel region SPXA2.

[0267] For example, the bank QBNK may form a closed loop structure surrounding the second sub-pixel area SPXA2.

[0268] In this case, when the transparent organic material including the scatterer SC is patterned to form the first scattering layer SCT1 and the second scattering layer SCT2, the thickness of the second scattering layer SCT2 may be formed to be smaller than the thickness of the first scattering layer SCT1. For example, because the first scattering layer SCT1 and the second scattering layer SCT2 include organic materials, there may be a diffusion (e.g., expansion) phenomenon of the first scattering layer SCT1 and the second scattering layer SCT2. In some embodiments, the second sub-pixel area SPXA2 is completely surrounded by the bank QBNK. Therefore, a diffusion phenomenon of the first scattering layer SCT1 may not substantially occur, while some of the second scattering layer SCT2 may diffuse over a relatively large area. Therefore, compared with the first scattering layer SCT1, the second scattering layer SCT2 may be formed with a relatively small thickness.

[0269] In some embodiments, as described above, in order to allow the second sub-pixel SPX2 and the third sub-pixel SPX3 to have relatively corresponding light output efficiencies, the first scattering layer SCT1 may be adapted to include a larger amount of scatterers SC than the second scattering layer SCT2. In some embodiments, because the second scattering layer SCT2 may be formed with a relatively small thickness compared to the first scattering layer SCT1, the second scattering layer SCT2 may include a relatively large amount of scatterers SC compared to the first scattering layer SCT1. Therefore, in some embodiments, according to the structure of the bank QBNK, the second sub-pixel SPX2 and the third sub-pixel SPX3 may be configured to have relatively corresponding light output efficiencies (e.g., have substantially the same light output efficiencies).

[0270] refer to Fig. 20 and Fig.21 , the first sub-pixel region SPXA1, the second sub-pixel region SPXA2, and the third sub-pixel region SPXA3 may be sequentially arranged in the first direction DR1. The bank QBNK may surround at least some portions of the sub-pixel region SPXA.

[0271] For example (reference Fig. 20 ), the bank QBNK may form a closed loop structure surrounding each of the first sub-pixel region SPXA1, the second sub-pixel region SPXA2, and the third sub-pixel region SPXA3.

[0272] In another example (ref. Fig.21 ), the bank QBNK may surround the entire first sub-pixel region SPXA1, and may allow at least a portion of each of the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3 to be open. For example, the bank QBNK may not be disposed on at least one side of each of the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3.

[0273] In some embodiments, the bank QBNK may include an isolated bank part QBNK_I. The isolated bank part QBNK_I may be a portion of the bank QBNK and may be a portion separated from other portions of the bank QBNK. The isolated bank part QBNK_I may be positioned between the second sub-pixel area SPXA2 and the third sub-pixel area SPXA3.

[0274] In some embodiments, the isolated bank part QBNK_I may extend in a direction (eg, the second direction DR2 ) different from a direction in which the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3 are spaced apart from each other.

[0275] In some embodiments, the first and second scattering layers SCT1 and SCT2 may not be manufactured by an inkjet process. Therefore, the bank QBNK may allow one side of each of the second and third sub-pixel areas SPXA2 and SPXA3 to be open.

[0276] In some embodiments, the area where the bank QBNK is disposed can be minimized, resulting in a reduction in processing costs. In addition, the first scattering layer SCT1 and the second scattering layer SCT2 can be patterned based on a photolithography process, etc., rather than an inkjet process. Therefore, the uniformity (e.g., thickness uniformity) of the first scattering layer SCT1 and the second scattering layer SCT2 can be enhanced.

[0277] In some embodiments, an isolated bank part QBNK_I as a part of the bank QBNK may be disposed (eg, selectively disposed) between the second subpixel region SPXA2 and the third subpixel region SPXA3. Thus, the risk of color mixing between the second subpixel SPX2 and the third subpixel SPX3 may be reduced.

[0278] In some embodiments, the isolated bank part QBNK_I as a part of the bank QBNK may not be disposed between the first pixel PXL1 and the second pixel PXL2 spaced apart from each other by a relatively large distance (e.g., between the second sub-pixel region SPXA2 of the first pixel PXL1 and the second sub-pixel region SPXA2 of the second pixel PXL2 and between the third sub-pixel region SPXA3 of the first pixel PXL1 and the third sub-pixel region SPXA3 of the second pixel PXL2). In other words, the isolated bank part QBNK_I may not be disposed in a region having a relatively low risk of color mixing, thereby resulting in a reduction in the cost of processing materials.

[0279] Figure 22 to Figure 26 are plan views each depicting an arrangement relationship between a spacer CS and a sub-pixel area SPXA according to some embodiments of the present disclosure.

[0280] For ease of explanation, Figure 22 to Figure 26 Some regions of the display area DA are shown, and the sub-pixel area SPXA and the spacer CS disposed adjacent thereto are shown.

[0281] Figure 22 to Figure 24 1 shows a planar structure in which the sub-pixel areas SPXA are sequentially arranged in the first direction DR1. For ease of explanation, Figure 22 to Figure 24 A planar structure in which the first pixel PXL1 and the second pixel PXL2 are adjacent to each other in the second direction DR2 is shown. Fig.25 and Fig.261 shows a planar structure in which the first sub-pixel region SPXA1 and the third sub-pixel region SPXA3 are adjacent to each other in the first direction DR1 and the second sub-pixel region SPXA2 is spaced apart from the first sub-pixel region SPXA1 and the third sub-pixel region SPXA3 in the second direction DR2. Fig.25 and Fig.26 A planar structure in which a first pixel PXL1 and a second pixel PXL2 are adjacent to each other in a first direction DR1 according to some embodiments of the present disclosure is shown.

[0282] refer to Figure 22 to Figure 24 , the spacer CS may be disposed in a region where the sub-pixel region SPXA is not formed (eg, the non-sub-pixel region NSPXA). The spacer CS may be disposed to be adjacent between the sub-pixel regions SPXA.

[0283] In some embodiments (see Fig. 22 ), the spacer CS may be positioned between the sub-pixel regions SPXA based on the first direction DR1. For example, the spacer CS may be disposed between the first sub-pixel region SPXA1 and the second sub-pixel region SPXA2. The spacer CS may be positioned between the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3. The spacer CS may be positioned between the first sub-pixel region SPXA1 and the third sub-pixel region SPXA3. Therefore, the spacers CS may be sequentially arranged in the first direction DR1, and may be sequentially arranged in the second direction DR2.

[0284] In some embodiments (see Fig.23 ), the spacer CS may be positioned between the sub-pixel areas SPXA based on the second direction DR2. The spacer CS may be disposed between different pixels PXL adjacent to each other in the second direction DR2. For example, the spacer CS may be disposed between the first sub-pixel area SPXA1 of the first pixel PXL1 and the first sub-pixel area SPXA1 of the second pixel PXL2. The spacer CS may be disposed between the second sub-pixel area SPXA2 of the first pixel PXL1 and the second sub-pixel area SPXA2 of the second pixel PXL2. The spacer CS may be disposed between the third sub-pixel area SPXA3 of the first pixel PXL1 and the third sub-pixel area SPXA3 of the second pixel PXL2.

[0285] In some embodiments (see Fig.24 ), the spacer CS may not overlap the sub-pixel area SPXA in the first direction DR1 or the second direction DR2. For example, the spacer CS may be disposed between the first pixel PXL1 and the second pixel PXL2 in the second direction DR2 and may not overlap the sub-pixel area SPXA in the second direction DR2.

[0286] refer to Fig.25 and Fig.26 , the spacer CS may be disposed in a relatively large area among the areas where the sub-pixel area SPXA is not disposed. In some embodiments, the spacer CS may be disposed in a relatively large area where the sub-pixel area SPXA is not formed as a part of the area where the pixel PXL is formed. Therefore, the display area DA may be more effectively utilized.

[0287] In some embodiments (see Fig.25 ), the spacer CS may be disposed between different pixels PXL. For example, the spacer CS may be disposed between the second sub-pixel region SPXA2 of the first pixel PXL1 and the second sub-pixel region SPXA2 of the second pixel PXL2 with respect to the first direction DR1. The spacer CS may not overlap the sub-pixel region SPXA in a direction (e.g., the second direction DR2) different from the direction in which the first pixel PXL1 and the second pixel PXL2 are spaced apart from each other.

[0288] In some embodiments, the corresponding sub-pixel regions SPXA may be spaced apart from each other at a certain distance. Here, the spacer CS may be disposed between the sub-pixel regions SPXA spaced apart from each other at a relatively large distance. For example, in a single pixel PXL, the first sub-pixel region SPXA1 and the third sub-pixel region SPXA3 may be spaced apart from each other at a first spacing distance PL1. The second sub-pixel region SPXA2 of the first pixel PXL1 and the second sub-pixel region SPXA2 of the second pixel PXL2 may be spaced apart from each other at a second spacing distance PL2 that is greater than the first spacing distance PL1. In some embodiments, the second spacing distance PL2 may be the maximum spacing distance among the spacing distances between the sub-pixel regions SPXA defined in the display area DA. In some embodiments, the spacer CS may be disposed in a region defining the second spacing distance PL2.

[0289] In some embodiments (see Fig.26 ), the spacer CS may be positioned between the corresponding second sub-pixel regions SPXA2 of different pixels PXL in the first direction DR1. For example, the spacer CS may overlap the second sub-pixel region SPXA2 of the first pixel PXL1 and the second sub-pixel region SPXA2 of the second pixel PXL2 with respect to the first direction DR1. For example, the spacer CS and the second sub-pixel region SPXA2 may be alternately arranged in the first direction DR1.

[0290] In some embodiments, the spacer CS may overlap the third sub-pixel area SPXA3 in the second direction DR2. Therefore, the spacer CS may not overlap the first sub-pixel area SPXA1 in each of the first direction DR1 and the second direction DR2.

[0291] In some embodiments (see, e.g., Fig. 27 and Fig.28 ), the color conversion layer CCL and the first scattering layer SCT1 may be manufactured by an inkjet process, and the second scattering layer SCT2 may be manufactured by photolithography using a mask.

[0292] Fig. 27 is a schematic plan view showing a display area DA of a display device in some embodiments. Fig.28 It is along Fig. 27 A schematic cross-sectional view taken along line AA' of FIG. 1 shows a schematic cross-sectional view of a second panel PNL2 according to some embodiments of the present disclosure. For ease of explanation, Fig.28 An embodiment in which the light control layer LCL is included in the second panel PNL2 is shown, and a structure in which the color filter layer CFL and the light control layer LCL are disposed on an upper substrate USUB is shown.

[0293] refer to Fig. 27 and Fig.28 The bank QBNK may form a closed loop structure surrounding each of the first sub-pixel area SPXA1 and the second sub-pixel area SPXA2. Therefore, the color conversion layer CCL and the first scattering layer SCT1 may be manufactured by an inkjet process.

[0294] In some embodiments, after the color conversion layer CCL and the first scattering layer SCT1 are manufactured by an inkjet process, the first cover layer QCP1 may be manufactured. After the first cover layer QCP1 is disposed, the second scattering layer SCT2 may be patterned. Therefore, the first cover layer QCP1 may passivate the color conversion layer CCL and the first scattering layer SCT1. The second scattering layer SCT2 may be disposed on the first cover layer QCP1.

[0295] In some embodiments, as described above with reference to Fig.19 Similarly discussed, when viewed in a plan view, the bank QBNK allows at least some portions of the sides of the third sub-pixel region SPXA3 to be open. Therefore, the second scattering layer SCT2 patterned in the third sub-pixel region SPXA3 and the like may extend (e.g., expand) beyond the region defining the third sub-pixel region SPXA3. Therefore, the second scattering layer SCT2 may be designed to have a relatively small thickness compared to the first scattering layer SCT1.

[0296] Next, we will refer to Figure 29 to Figure 31 The display device DD in some embodiments is described. The description overlapping with the description of the above content will be simplified or may not be repeated. For example, unless it is inconsistent with the features discussed in the embodiments to be described below, reference is made to Figures 5 to 28 The technical features described can be applied to Figure 29 to Figure 31A display device DD of an embodiment is described.

[0297] according to Figure 29 to Figure 31 The display device DD of the embodiment shown in FIG. 1 is different from the display device DD according to the above-described embodiments in that the color conversion layer CCL, the first scattering layer SCT1 , and the second scattering layer SCT2 are manufactured through a photolithography process.

[0298] Figure 29 to Figure 31 are schematic cross-sectional views each illustrating a display device DD according to some embodiments of the present disclosure. In some embodiments, Fig.29 Shown above Figure 5 The display device DD of the embodiment is similar to the cross-sectional structure of the display device DD. Fig.30 Shown above Figure 6 The display device DD of the embodiment is similar to the cross-sectional structure of the display device DD. Fig.31 Shown above Figure 7 The display device DD of the embodiment is similar to the cross-sectional structure of the display device DD.

[0299] In some embodiments, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 may be manufactured without performing a separate inkjet process. Therefore, after manufacturing the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2, the first cover layer QCP1 may be disposed. The first cover layer QCP1 may passivate each of the bank QBNK, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2.

[0300] In some embodiments, after patterning the color conversion layer CCL, the first scattering layer SCT1 and the second scattering layer SCT2 may be patterned. In some embodiments, after patterning the first scattering layer SCT1 and the second scattering layer SCT2, the color conversion layer CCL may be patterned. In some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 may have similar thicknesses (e.g., substantially the same thicknesses).

[0301] In some embodiments (see Fig.29 ), the light control layer LCL may be provided to be included in the second panel PNL2. For example, the light control layer LCL may be provided on the color filter layer CFL provided on the upper substrate USUB.

[0302] In some embodiments (see Fig.30 ), the light control layer LCL may be disposed to be included in the first panel PNL1. For example, the light control layer LCL may be disposed on the display layer DL including the lower substrate BSUB.

[0303] In some embodiments (see Fig.29 and Fig.30 ), the spacer CS may be patterned by the same process as the first scattering layer SCT1 and the second scattering layer SCT2, and the spacer CS and the first scattering layer SCT1 and the second scattering layer SCT2 may include the same material. In some embodiments, the spacer CS may be passivated by the first cover layer QCP1.

[0304] In some embodiments (see Fig.31 ), the first panel PNL1 may be manufactured by forming a display layer DL including a lower substrate BSUB and sequentially placing a light control layer LCL, a color filter layer CFL (which may include an optical layer LR, a color filter CF, and a planarization layer PLA), and an upper layer UPL on the display layer DL without manufacturing a separate second panel PNL2. The display device DD may be manufactured without performing a separate process of coupling the panels to each other. In this case, when the first scattering layer SCT1 and the second scattering layer SCT2 may be patterned, the spacer CS may not be formed.

[0305] Next, we will refer to Figure 32 to Figure 35 A display device DD according to some embodiments is described. The description overlapping with the description of the above contents will be simplified or may not be repeated. For example, unless it is inconsistent with the features discussed in the embodiments to be described below, reference is made to Figures 5 to 31 The technical features described can be applied to Figure 32 to Figure 35 A display device DD of an embodiment is described.

[0306] according to Figure 32 to Figure 35 The display device DD of the embodiment shown in FIG. 1 is different from the display device DD according to the above-described embodiments in that the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 are manufactured by an inkjet process.

[0307] Figure 32 to Figure 34 are schematic cross-sectional views each illustrating a display device DD according to some embodiments of the present disclosure. Fig.35 is a schematic cross-sectional view depicting the relationship between the first scattering layer SCT1 and the second scattering layer SCT2 according to some embodiments of the present disclosure. In some embodiments, Fig.32 Shown above Figure 5 The display device DD of the embodiment is similar to the cross-sectional structure of the display device DD. Fig.33 Shown above Figure 6 The display device DD of the embodiment is similar to the cross-sectional structure of the display device DD. Fig.34 Shown above Figure 7 The display device DD of the embodiment is similar to the cross-sectional structure of the display device DD. Fig.35The second sub-pixel region SPXA2, the third sub-pixel region SPXA3, and the bank QBNK adjacent thereto are shown.

[0308] In some embodiments, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 may be manufactured without performing a separate photolithography process. Therefore, each of the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 may be manufactured by an inkjet process. In some embodiments, an inkjet process for forming each of the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 may be performed in an area surrounded by the bank QBNK. Thereafter, the first cover layer QCP1 may passivate the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2.

[0309] In some embodiments, after performing the inkjet process of forming the color conversion layer CCL, the inkjet process of forming the first scattering layer SCT1 and the second scattering layer SCT2 may be performed. In some embodiments, after performing the inkjet process of forming the first scattering layer SCT1 and the second scattering layer SCT2, the inkjet process of forming the color conversion layer CCL may be performed.

[0310] In some embodiments (see Fig.32 ), the light control layer LCL may be provided to be included in the second panel PNL2. For example, the light control layer LCL may be on the color filter layer CFL provided on the upper substrate USUB.

[0311] In some embodiments (see Fig.33 ), the light control layer LCL may be provided to be included in the first panel PNL1. For example, the light control layer LCL may be on the display layer DL including the lower substrate BSUB.

[0312] In some embodiments (see Fig.32 and Fig.33 ), after manufacturing the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 (for example, after manufacturing the first cover layer QCP1), the spacer CS may be patterned in the non-sub-pixel area NSPXA (for example, the spacer CS may be patterned by a photolithography process).

[0313] In some embodiments (see Fig.34), the first panel PNL1 may be manufactured by forming a display layer DL including a lower substrate BSUB and sequentially placing a light control layer LCL, a color filter layer CFL (which may include an optical layer LR, a color filter CF, and a planarization layer PLA), and an upper layer UPL on the display layer DL without manufacturing a separate second panel PNL2. The display device DD may be manufactured without performing a separate process of coupling the panels to each other. In this case, after performing an inkjet process for the first scattering layer SCT1 and the second scattering layer SCT2, a process of forming the spacer CS may not be performed.

[0314] In some embodiments (see Fig.35 ), the first distance L1 may be smaller than the second distance L2, the first distance L1 is the spacing distance between the banks QBNK (e.g., the first bank portion) defining the second sub-pixel region SPXA2, and the second distance L2 is the spacing distance between the banks QBNK (e.g., the second bank portion) defining the third sub-pixel region SPXA3. For example, the first distance L1 may correspond to the distance between the first bank portion and the second bank portion, and the second distance L2 may correspond to the distance between the third bank portion and the second bank portion.

[0315] For example, the first distance L1 may be the shortest distance between the banks QBNK adjacent to (e.g., directly adjacent to) the second sub-pixel region SPXA2 (or the first scattering layer SCT1). The second distance L2 may be the shortest distance between the banks QBNK adjacent to (e.g., directly adjacent to) the third sub-pixel region SPXA3 (or the second scattering layer SCT2).

[0316] In some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 may be formed by the same inkjet process and may include materials of the same composition. In addition, the bank QBNK may be patterned so that the first distance L1 is smaller than the second distance L2, thereby allowing the first scattering layer SCT1 to have a thickness greater than that of the second scattering layer SCT2.

[0317] Experimentally, the scattering efficiency in each of the first scattering layer SCT1 and the second scattering layer SCT2 may generally increase as the thickness of each of the first scattering layer SCT1 and the second scattering layer SCT2 increases.

[0318] As described above, the second sub-pixel SPX2 and the third sub-pixel SPX3 may be expected to have corresponding light output efficiencies. Therefore, the first scattering layer SCT1 may be manufactured to have a greater thickness than the second scattering layer SCT2. In this case, due to the relatively large thickness of the first scattering layer SCT1, even if the light efficiency of the second color is relatively low, the difference in light output efficiency between the second sub-pixel SPX2 and the third sub-pixel SPX3 may be compensated. Therefore, the second sub-pixel SPX2 and the third sub-pixel SPX3 may have relatively similar light output efficiencies.

[0319] In some embodiments, the corresponding processes of manufacturing the first scattering layer SCT1 and the second scattering layer SCT2 may not be performed separately. In other words, the first scattering layer SCT1 and the second scattering layer SCT2 may be manufactured by the same inkjet process. In some embodiments, because the first distance L1 is smaller than the second distance L2, the space where the first scattering layer SCT1 defined by the surrounding of the bank QBNK is placed may be smaller than the space where the second scattering layer SCT2 defined by the surrounding of the bank QBNK is placed. In this case, even if the volume of the ink droplet including the scatterer SC provided to each of the regions is not individually adjusted during the inkjet process, the thickness of the ink provided to the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3 may be defined to be different values.

[0320] Therefore, in some embodiments, process convenience may be improved, and a difference in light output efficiency between sub-pixels SPX may be compensated. Therefore, the display device DD may be manufactured to have uniform light output efficiency for each of the sub-pixels SPX.

[0321] Reference below Figure 36 to Figure 49 A method of manufacturing a display device DD according to some embodiments is discussed. Descriptions overlapping with those of the above contents will be simplified or may not be repeated.

[0322] Figure 36 to Figure 43 Operations of a method of manufacturing a display device DD according to some embodiments of the present disclosure are illustrated in such a manner that a first panel PNL1 and a second panel PNL2 are separately provided and then coupled to each other, wherein a light control layer LCL is included in the second panel PNL2 .

[0323] Fig.36 is a flowchart illustrating a method of manufacturing a display device according to some embodiments of the present disclosure. Fig.37 is a flow chart illustrating sub-operations of an operation of manufacturing a second panel according to some embodiments of the present disclosure. Figures 38 to 43 is a schematic cross-sectional view illustrating a method of manufacturing a display device according to some embodiments of the present disclosure through process operations.

[0324] The method of manufacturing a display device according to some embodiments may include an operation S100 of manufacturing a first panel, an operation S200 of manufacturing a second panel, and an operation S300 of coupling the first panel and the second panel to each other.

[0325] In some embodiments, after performing the operation S100 of manufacturing the first panel, the operation S200 of manufacturing the second panel may be performed. In some examples, after performing the operation S200 of manufacturing the second panel, the operation S100 of manufacturing the first panel may be performed. As a further alternative, the operation S100 of manufacturing the first panel and the operation S200 of manufacturing the second panel may be performed in substantially the same time period. For ease of explanation, the method of manufacturing the display device DD will be described based on an embodiment in which the operation S200 of manufacturing the second panel is performed after performing the operation S100 of manufacturing the first panel.

[0326] refer to Figure 36 to Figure 38 At operation S100 of manufacturing the first panel, a first panel PNL1 including a display layer DL may be provided.

[0327] At operation S100 , a layer forming the display layer DL may be disposed on the lower substrate BSUB forming the base layer BSL.

[0328] In some embodiments, the conductive layer or insulating layer on the lower substrate BSUB or the upper substrate USUB may be formed based on a process for manufacturing a semiconductor device. For example, the conductive layer or insulating layer on the base layer BSL may be formed by a photolithography process, may be etched by various methods (e.g., wet etching, dry etching, etc.), and may be deposited by various methods (e.g., sputtering, chemical vapor deposition, etc.). However, the present disclosure is not limited to specific examples.

[0329] At operation S100, a pixel circuit layer PCL may be formed by patterning a pixel circuit PXC on a lower substrate BSUB, and a light emitting element LD may be disposed on the pixel circuit layer PCL. In some embodiments, at operation S100, a light emitting element LD may be disposed on the lower substrate BSUB (eg, the pixel circuit layer PCL) by various methods.

[0330] For example, refer to Figure 3 Each light emitting element LD may include an organic light emitting diode. The light emitting element LD may be manufactured on the lower substrate BSUB by a deposition process.

[0331] In some embodiments, each light emitting element LD may include an inorganic light emitting diode. Ink including the light emitting element LD may be provided on the lower substrate BSUB. Alignment signals may be provided to the first alignment electrode and the second alignment electrode to form an electric field, respectively, whereby the light emitting element LD may be aligned between the first alignment electrode and the second alignment electrode based on the formed electric field.

[0332] In some embodiments, each light emitting element LD may include an inorganic light emitting diode. The light emitting element LD may be transferred to the pixel circuit layer PCL by various methods.

[0333] refer to Fig.36 , the operation S200 of manufacturing the second panel may be performed. In some embodiments, referring to Fig.37 , operation S200 of manufacturing the second panel may include operation S220 of placing (or arranging or providing) a color filter layer on the upper substrate and operation S240 of placing (or arranging or providing) a light control layer on the color filter layer.

[0334] refer to Fig.36 , Fig.37 and Fig.39 , at operation S220 of placing the color filter layer on the upper substrate, the color filter CF may be patterned (eg, continuously patterned) on the upper substrate USUB, and the optical layer LR and the optical cover layer LCP may be formed on the color filter CF.

[0335] At operation S220, a third color filter CF3, a second color filter CF2, and a first color filter CF1 may be disposed on the upper substrate USUB. The color filter CF may be formed by various processes such as a photolithography process. In some embodiments, the order of forming the color filter CF is not particularly limited.

[0336] At operation S220 , an optical layer LR may be formed (eg, deposited) to cover the color filter CF. In some embodiments, as described above, the optical layer LR may be selectively disposed in the first sub-pixel area SPXA1 .

[0337] At operation S220, the optical cover layer LCP may cover the optical layer LR to passivate the optical layer LR.

[0338] refer to Fig.36 , Fig.37 and Figure 39 to Figure 42 , at operation S240 of disposing the light control layer on the color filter layer, a component for forming the light control layer LCL may be disposed on the color filter layer CFL.

[0339] refer to Fig.39 , at operation S240, a bank QBNK may be patterned on the color filter layer CFL. The bank QBNK may be disposed to surround a portion of each of at least some of the regions.

[0340] At operation S240, after patterning the bank QBNK, a color conversion layer CCL including quantum dots QD may be disposed on the color filter layer CFL by an inkjet process. Thus, the color conversion layer CCL may be patterned in the first sub-pixel area SPXA1. For example, ink including a material for forming the color conversion layer CCL may be provided to an area surrounded by the bank QBNK. The present disclosure is not limited to the above-described embodiments. In some embodiments, the color conversion layer CCL may be patterned based on a photolithography process. Thus, a first covering layer QCP1 for passivating the color conversion layer CCL (e.g., covering the color conversion layer CCL) may be formed (e.g., deposited) on the entire area of ​​the upper substrate USUB.

[0341] refer to Figure 40 to Figure 42 , at operation S240 , a process of forming the first scattering layer SCT1 and the second scattering layer SCT2 may be performed.

[0342] For example, refer to Fig.40 , the first scattering layer SCT1 and the second scattering layer SCT2 may be patterned in the second sub-pixel area SPXA2 and the third sub-pixel area SPXA3, respectively. The spacer CS may be formed (eg, simultaneously formed) in the non-sub-pixel area NSPXA.

[0343] In some embodiments, the first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS may be patterned based on a photolithography process. Fig.40 Although not shown, the second cover layer QCP2 may be formed (eg, deposited) to passivate the first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS.

[0344] In some embodiments, the spacer CS may be adapted to be spaced apart from the upper substrate USUB compared to other components of the light control layer LCL, such as the first scattering layer SCT1 and the second scattering layer SCT2. Therefore, the spacer CS forming a relatively high base may be disposed on the bank QBNK, thereby forming a protruding structure. In some embodiments, if the height of the spacer CS is too large, a cell gap may be excessively formed between the first panel PNL1 and the second panel PNL2 during a subsequent process. Therefore, in some embodiments, an additional process of removing at least a portion of the spacer CS may be performed.

[0345] In another example, reference Fig.41, after the color conversion layer CCL is manufactured based on a photolithography process, the first scattering layer SCT1 and the second scattering layer SCT2 may be patterned before the first cover layer QCP1 is formed. For example, the first scattering layer SCT1 and the second scattering layer SCT2 may be patterned based on a photolithography process. The spacer CS may be patterned by the same process as the first scattering layer SCT1 and the second scattering layer SCT2. After the first scattering layer SCT1 and the second scattering layer SCT2 are formed, the first cover layer QCP1 may be manufactured.

[0346] In another example, reference Fig.42 , before forming the first cover layer QCP1, the first scattering layer SCT1 and the second scattering layer SCT2 may be manufactured by an inkjet process. Thereafter, the first cover layer QCP1 may be formed to cover the color conversion layer CCL, the first scattering layer SCT1 and the second scattering layer SCT2. The spacer CS may be patterned by a separate photolithography process. Thereafter, although Fig.42 Although not shown, the second cover layer QCP2 may be formed (eg, deposited) to passivate the first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS.

[0347] refer to Fig.36 and Fig.43 , at operation S300 of coupling the first and second panels to each other, a filling layer FIL may be interposed between the first and second panels PNL1 and PNL2 , and the first and second panels PNL1 and PNL2 may be adjacent to each other.

[0348] At operation S300, the first panel PNL1 including the display layer DL may be coupled to the second panel PNL2 including the upper layer UPL, the color filter layer CFL, and the light control layer LCL. In some embodiments, the spacer CS is formed so that the first and second panels PNL1 and PNL2 may be properly coupled to each other.

[0349] Fig.36 and Figures 44 to 48 A method of manufacturing the display device DD in a manner in which the first panel PNL1 and the second panel PNL2 are separately provided and then coupled to each other is shown, which shows an embodiment in which the light control layer LCL is included in the first panel PNL1.

[0350] Fig.44 is a flow chart illustrating sub-operations of the operation of manufacturing a first panel in some embodiments. Figures 45 to 48 is a schematic cross-sectional view illustrating a method of manufacturing a display device in some embodiments through process operations.

[0351] With the above reference Figure 36 to Figure 43 Compared with the manufacturing method described above, a method of manufacturing a display device DD in some embodiments will be described focusing on differences.

[0352] In some embodiments, the method of manufacturing the display device DD may include an operation S100 of manufacturing a first panel, an operation S200 of manufacturing a second panel, and an operation S300 of coupling the first panel and the second panel. Fig.44 , operation S100 of manufacturing the first panel may include operation S120 of disposing a pixel circuit layer and a light emitting element layer on a lower substrate and operation S140 of disposing a light control layer on the light emitting element layer.

[0353] In some embodiments, after operation S120 of disposing a pixel circuit layer and a light emitting element layer on a lower substrate is performed, a layer forming a light control layer LCL may be disposed on the manufactured display layer DL (eg, the light emitting element layer LEL).

[0354] For example, refer to Fig.45 and Fig.46 , at operation S140 , a color conversion layer CCL, a first scattering layer SCT1 , and a second scattering layer SCT2 may be disposed on the display layer DL to manufacture a first panel PNL1 .

[0355] In some embodiments (see Fig.45 ), at operation S140, the color conversion layer CCL may be manufactured on the display layer DL by an inkjet process. After forming a first cover layer QCP1 to passivate the color conversion layer CCL, the first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS may be manufactured by a photolithography process.

[0356] In some embodiments (see Fig.46 ), at operation S140, the color conversion layer CCL may be manufactured by an inkjet process. The first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS may be manufactured by a photolithography process. Thereafter, the first cover layer QCP1 may be formed.

[0357] In some embodiments (see Fig.47 ), at operation S140, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 may be manufactured by an inkjet process. After the first cover layer QCP1 is formed, the spacer CS may be manufactured by a photolithography process.

[0358] In some embodiments, operation S200 of manufacturing the second panel is performed so that the second panel PNL2 in which the color filter layer CFL is disposed on the upper substrate USUB can be provided.

[0359] refer to Fig.36 and Fig.48, at operation S300 of coupling the first and second panels to each other, a filling layer FIL may be interposed between the first and second panels PNL1 and PNL2 , and the first and second panels PNL1 and PNL2 may be adjacent to each other.

[0360] At operation S300 , the first panel PNL1 including the display layer DL and the light control layer LCL may be coupled to the second panel PNL2 including the upper layer UPL and the color filter layer CFL.

[0361] Fig.49 A method of manufacturing the display device DD in such a manner that the layers of the display device DD are continuously disposed on the lower substrate BSUB without manufacturing the second panel PNL2 is shown.

[0362] Fig.49 is a flow chart illustrating a method of manufacturing a display device in some embodiments.

[0363] With the above reference Figures 36 to 48 Compared with the manufacturing method described above, a method of manufacturing a display device DD in some embodiments will be described focusing on differences.

[0364] In some embodiments, the method of manufacturing a display device DD may include an operation S1000 of setting a pixel circuit layer on a lower substrate, an operation S2000 of setting a light emitting element layer on the pixel circuit layer, an operation S3000 of setting a light control layer on the light emitting element layer, an operation S4000 of setting a color filter layer on the light control layer, and an operation S5000 of setting an upper film layer on the color filter layer.

[0365] In other words, in some embodiments, without forming an upper substrate USUB, a display layer DL including a lower substrate BSUB provided as a base and a light control layer LCL, a color filter layer CFL, and an upper layer UPL on the display layer DL may be continuously formed. In some embodiments, a process for manufacturing each of these layers may be specified with reference to the above. For example, the light control layer LCL may be formed using (e.g., using) various processes such as an inkjet process and / or a photolithography process.

[0366] Aspects of some embodiments of the present disclosure may provide a display device having improved light output efficiency and a method of manufacturing the display device.

[0367] Aspects of some embodiments of the present disclosure may provide a display device capable of achieving sufficient brightness and a method of manufacturing the display device.

[0368] Aspects of some embodiments of the present disclosure may provide a display device having improved process efficiency and a method of manufacturing the display device.

[0369] Aspects of some embodiments of the present disclosure may provide a display device capable of reducing production costs and a method of manufacturing the display device.

[0370] Aspects of some embodiments of the present disclosure may provide a display device having good optical characteristics and a method of manufacturing the display device.

[0371] Although various embodiments have been described above, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the present disclosure.

[0372] Therefore, the embodiments disclosed in this specification are only for the purpose of illustration, rather than limiting the technical spirit of the present disclosure. The scope of the present disclosure will be defined by the appended claims.

Claims

1. Display equipment, including: A sub-pixel is formed on the base layer and includes: a first sub-pixel forming a first sub-pixel region and configured to provide light of a first color; a second sub-pixel forming a second sub-pixel region and configured to provide light of a second color; and a third sub-pixel forming a third sub-pixel region and configured to provide light of a third color, The sub-pixel comprises: a display layer including a light emitting element on the base layer; A light control layer is on the display layer and includes: a color conversion layer in the first sub-pixel region and comprising quantum dots; a first scattering layer in the second sub-pixel region and comprising a first scatterer; and a second scattering layer, in the third sub-pixel region and comprising a second scatterer; and a color filter layer on the light control layer and including a first color filter in the first sub-pixel region, a second color filter in the second sub-pixel region, and a third color filter in the third sub-pixel region, wherein the light emitted from the light emitting element includes the light of the second color and the light of the third color, and at least a portion of the emitted light is emitted through the light control layer and the color filter layer, and The color of light passing through the first scattering layer and the second scattering layer is not changed by the first scattering layer and the second scattering layer.

2. The display device according to claim 1, wherein: The light management layer further includes a cover layer, at least a portion of which is configured to passivate the color conversion layer, A first portion of the cover layer is on the color conversion layer in the first sub-pixel region, and a second portion of the cover layer is below the first scattering layer in the second sub-pixel region and the second scattering layer in the third sub-pixel region.

3. The display device according to claim 2, further comprising an upper layer on the color filter layer and comprising an upper substrate, in, The color filter layer and the light control layer are sequentially stacked below the upper substrate, and The filling layer is between the display layer and the color conversion layer, the first scattering layer and the second scattering layer.

4. The display device according to claim 2, further comprising an upper layer on the color filter layer and comprising an upper substrate, in, A filling layer is between the color filter layer and the color conversion layer, the first scattering layer, and the second scattering layer.

5. The display device according to claim 2, further comprising an upper layer on the color filter layer and comprising an upper film layer, in, The light control layer and the color filter layer are sequentially stacked on the display layer.

6. The display device according to claim 1, wherein: The color conversion layer has a first thickness, wherein the first scattering layer has a second thickness, wherein the second scattering layer has a third thickness, wherein the first thickness is greater than each of the second thickness and the third thickness, and Wherein, the second thickness is equal to the third thickness.

7. The display device according to claim 1, wherein: The first scatterer and the second scatterer are included in a range of 1.5 wt % to 8.5 wt % with respect to the first scattering layer and the second scattering layer, respectively.

8. The display device according to claim 1, wherein: The size of the first scatterer is greater than that of the second scatterer.

9. The display device according to claim 1, wherein: The first scatterer is included at a first weight ratio relative to the first scattering layer, wherein the second scatterer is included in a second weight ratio relative to the second scattering layer, and Wherein, the first weight ratio is greater than the second weight ratio.

10. The display device according to claim 1, wherein: The first scattering layer includes one or more scatterers having the same composition ratio as the first scatterer and a size different from that of the first scatterer, and The second scattering layer includes one or more scatterers having the same composition ratio as the second scatterer and a size different from that of the second scatterer.

11. The display device according to claim 1, wherein: The color filter layer further includes an optical layer having a refractive index smaller than that of the color conversion layer, the optical layer being disposed between the light control layer and the first, second, and third color filters, and Among the first sub-pixel region, the second sub-pixel region and the third sub-pixel region, only the first sub-pixel region includes the optical layer.

12. The display device according to claim 1, wherein: The light control layer further includes a filling scattering layer in the second sub-pixel region and the third sub-pixel region, the filling scattering layer overlaps the first scattering layer and the second scattering layer in a thickness direction and includes a filling material and a scattering material.

13. The display device according to claim 1, wherein: The light control layer further includes a bank, wherein at least a portion of the bank surrounds the first sub-pixel region and extends in a thickness direction.

14. The display device according to claim 13, wherein: The bank is not between the second sub-pixel region and the third sub-pixel region, and The light control layer further includes a black matrix layer, at least a portion of the black matrix layer is between the second sub-pixel region and the third sub-pixel region, and the black matrix layer penetrates between the first scattering layer and the second scattering layer.

15. The display device according to claim 13, wherein: The bank is formed around all sides of the first sub-pixel region in a plan view, and the bank is not formed around at least a portion of each of the second sub-pixel region and the third sub-pixel region, wherein at least one side of the second sub-pixel region includes an open edge on which the bank is not formed, and The open edge is formed to be oriented in a direction away from the third sub-pixel region.

16. The display device according to claim 13, wherein: The bank is formed around all sides of both the first sub-pixel region and the second sub-pixel region in a plan view, and is not formed around at least a portion of the third sub-pixel region, wherein the light control layer further comprises a covering layer, at least a portion of which is configured to passivate the color conversion layer and the first scattering layer, wherein a portion of the cover layer is between the second scattering layer and the third color filter in the third sub-pixel region, and Wherein, the thickness of the first scattering layer is greater than the thickness of the second scattering layer.

17. The display device according to claim 13, wherein: The levee includes isolated levee components, and Wherein, the isolated bank part is between the second sub-pixel region and the third sub-pixel region.

18. The display device according to claim 13, wherein: The light control layer further includes a spacer on the bank and above the color conversion layer, the first scattering layer, and the second scattering layer, The spacer is between the first sub-pixel region and the second sub-pixel region, between the second sub-pixel region and the third sub-pixel region, and between the first sub-pixel region and the third sub-pixel region.

19. The display device according to claim 13, wherein: The light control layer further includes a spacer on the bank and above the color conversion layer, the first scattering layer, and the second scattering layer, The first sub-pixel, the second sub-pixel and the third sub-pixel are adjacent to each other in a first direction and form a first pixel. wherein the first pixel is adjacent to the second pixel in a second direction different from the first direction, and Wherein, the spacer is between the first sub-pixel region of the first pixel and the first sub-pixel region of the second pixel, between the second sub-pixel region of the first pixel and the second sub-pixel region of the second pixel, and between the third sub-pixel region of the first pixel and the third sub-pixel region of the second pixel.

20. The display device according to claim 13, wherein: The light control layer further includes a spacer on the bank and above the color conversion layer, the first scattering layer, and the second scattering layer, wherein the first sub-pixel region and the third sub-pixel region are adjacent to each other in a first direction, and the second sub-pixel region is adjacent to the first sub-pixel region and the third sub-pixel region in a second direction different from the first direction, and Wherein, the spacer overlaps with the second sub-pixel region in the first direction.

21. The display device according to claim 18, wherein: The light management layer also includes a cover layer, at least a portion of which is configured to passivate the color conversion layer, the bank, the first scattering layer, the second scattering layer, and the spacer.

22. The display device according to claim 18, wherein: The light control layer further comprises a covering layer, wherein at least a portion of the cover layer is configured to passivate the color conversion layer, the bank, the first scattering layer, and the second scattering layer, Wherein, the spacer is arranged on the cover layer, Wherein, the dike comprises: a first bank portion and a second bank portion, the first bank portion and the second bank portion being spaced apart from each other by a first distance, the second sub-pixel region being between the first bank portion and the second bank portion; and A third bank portion is spaced apart from the second bank portion by a second distance, the third sub-pixel region is between the third bank portion and the second bank portion, and wherein a thickness of the first scattering layer is greater than a thickness of the second scattering layer.

23. The display device according to claim 1, wherein: The light emitting element includes one or more of an organic light emitting diode including an organic material and an inorganic light emitting diode including an inorganic material.

24. A method for manufacturing a display device, comprising: manufacturing a first panel; manufacturing a second panel; as well as coupling the first panel and the second panel to each other, Wherein, manufacturing the first panel includes providing a light emitting element on a lower substrate, Wherein, manufacturing the second panel includes providing a color filter layer on the upper substrate and providing a light control layer on the color filter layer, Wherein, providing the light control layer comprises: patterning banks on the color filter layer; providing a color conversion layer including quantum dots in the first sub-pixel region; providing a first scattering layer including a first scatterer in the second sub-pixel region; and providing a second scattering layer including a second scatterer in the third sub-pixel region, and The first scattering layer and the second scattering layer are configured to allow incident light to pass through the first scattering layer and the second scattering layer without changing the color of the incident light.

25. The method according to claim 24, wherein: Providing the light control layer further comprises forming a cover layer on the color conversion layer, the cover layer being configured to passivate the color conversion layer, Wherein, providing the color conversion layer comprises patterning the color conversion layer by an inkjet process, and Wherein, providing the first scattering layer and providing the second scattering layer are performed after forming the cover layer, and are performed based on a photolithography process.

26. The method according to claim 24, wherein: patterning the color conversion layer, the first scattering layer, and the second scattering layer based on a photolithography process, and Wherein, providing the light control layer further comprises forming a covering layer on the color conversion layer, wherein the covering layer is configured to passivate the color conversion layer, the first scattering layer and the second scattering layer.

27. The method according to claim 24, wherein: The color conversion layer, the first scattering layer, and the second scattering layer are formed based on an inkjet process.

28. The method of claim 24, wherein: Joining the first panel and the second panel includes providing a filler layer between the first panel and the second panel.

29. A method for manufacturing a display device, comprising: manufacturing a first panel; manufacturing a second panel; as well as coupling the first panel and the second panel to each other, The manufacturing of the first panel includes providing a display layer and providing a light control layer on the display layer, wherein the display layer includes a light emitting element on a lower substrate, Wherein, manufacturing the second panel includes providing a color filter layer on the upper substrate, Wherein, providing the light control layer comprises: patterning a bank on the display layer; providing a color conversion layer including quantum dots in the first sub-pixel region; providing a first scattering layer including a first scatterer in the second sub-pixel region; and providing a second scattering layer including a second scatterer in the third sub-pixel region, and The first scattering layer and the second scattering layer are configured to allow incident light to pass through the first scattering layer and the second scattering layer without changing the color of the incident light.

30. The method of claim 29, wherein: Providing the light control layer further comprises forming a cover layer on the color conversion layer, the cover layer being configured to passivate the color conversion layer, Wherein, providing the color conversion layer comprises patterning the color conversion layer by an inkjet process, and Wherein, providing the first scattering layer and providing the second scattering layer are performed after forming the cover layer, and are performed based on a photolithography process.

31. The method of claim 29, wherein: patterning the color conversion layer, the first scattering layer, and the second scattering layer based on a photolithography process, and Wherein, providing the light control layer further comprises forming a covering layer on the color conversion layer, wherein the covering layer is configured to passivate the color conversion layer, the first scattering layer and the second scattering layer.

32. The method of claim 29, wherein: The color conversion layer, the first scattering layer, and the second scattering layer are formed based on an inkjet process.

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