Apparatus and method for manufacturing display device

Abstract

According to one embodiment of the present disclosure, there is provided a manufacturing apparatus and a manufacturing method of a display device, the manufacturing apparatus including: a stage configured to load a processing object and load a mask on the processing object; and a scanning section that measures a thickness of a shadow of the mask formed on the processing object.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a manufacturing apparatus and a manufacturing method of a display device, and more particularly, to a manufacturing apparatus and a manufacturing method of a display device including a tool for measuring a distance between a mask and a substrate. Background Art

[0002] A display device is a device that visually displays data. A display device may provide an image using a light emitting diode. A display device may include a plurality of pixels in a pattern to realize an image. In this case, a plurality of layers including a light emitting layer may be arranged on a substrate of the display device. These layers may be arranged on the substrate in different patterns according to their types, or may be arranged to cover the substrate as a whole. Summary of the invention

[0003] Technical issues to be solved

[0004] The layers arranged on the substrate can be arranged by spraying the deposition material onto the upper surface of the substrate. Multiple display devices can be manufactured simultaneously by arranging the deposition material on one mother substrate. The mask (e.g., an opening mask) that divides the mother substrate into several areas needs to maintain a predetermined distance from the upper surface of the substrate. This is because if the mask is too far away from the mother substrate, the deposition material may be deposited to an unwanted area, and if the mask is too close to the mother substrate, the substrate may be poked by the mask. Therefore, a tool that can measure the spacing between the mask and the substrate is required.

[0005] Workaround

[0006] According to an embodiment of the present disclosure, there is provided a manufacturing apparatus for a display device, comprising: a stage configured to load a processing object and load a mask on the processing object; and a scanning unit to measure a thickness of a shadow of the mask formed on the processing object.

[0007] In one embodiment, the manufacturing apparatus of the display device may further include: a sensor unit for measuring a distance between the mask and the processing object.

[0008] In one embodiment, the relationship between the thickness of the shadow and the interval may be determined using a plurality of thicknesses of the shadow obtained by the scanning unit and a plurality of intervals obtained by the sensor unit.

[0009] In one embodiment, the manufacturing apparatus of the display device may further include: a deposition unit configured to spray a deposition material toward the mask and the processing object.

[0010] In one embodiment, the manufacturing apparatus of the display device may further include: a moving unit to translate the scanning unit.

[0011] In one embodiment, the distance between the mask and the processing object can be adjusted by moving the mask.

[0012] In an embodiment, the mask may be spaced apart from the upper surface of the processing object in some regions.

[0013] In one embodiment, the scanning unit may be configured to photograph the mask and the processing object as a whole.

[0014] Another embodiment of the present disclosure provides a method for manufacturing a display device, comprising: loading a processing object on a stage and loading a mask on the processing object; and measuring a thickness of a shadow formed by the mask on the processing object using a scanning unit.

[0015] In one embodiment, the method for manufacturing the display device may further include: measuring a distance between the mask and the processing object by using a sensor unit.

[0016] In one embodiment, the manufacturing method of the display device may further include: determining a relationship between the thickness of the shadow and the spacing using the plurality of thicknesses of the shadows obtained by the scanning unit and the plurality of spacings obtained by the sensor unit.

[0017] In one embodiment, the method for manufacturing a display device may further include: determining a reference range of the thickness of the shadow so that the distance between the mask and the processing object is within a predetermined range.

[0018] In one embodiment, the method for manufacturing the display device may further include: a step of confirming whether the thickness of the shadow is within the reference range.

[0019] In one embodiment, the method for manufacturing the display device may further include: a step of issuing an alarm when the thickness of the shadow is outside the reference range.

[0020] In one embodiment, the method for manufacturing the display device may further include: a step of depositing a deposition material toward the mask and the processing object.

[0021] In one embodiment, the step of measuring the thickness of the shadow of the mask may include the step of photographing the mask and the processing object using a camera provided in the scanning unit.

[0022] In one embodiment, the manufacturing method of the display device may further include: a step of raising the mask and replacing a processing object; and a step of lowering the mask to approach the replaced processing object.

[0023] In one embodiment, the thicknesses of a plurality of shadows of the mask formed on the processing object may be measured in a plurality of different regions.

[0024] In one embodiment, the step of measuring the thickness of the shadow of the mask and the step of measuring the distance between the mask and the processing object may be repeated multiple times.

[0025] In one embodiment, the method for manufacturing the display device may further include: a step of adjusting the position of the mask.

[0026] Beneficial Effects

[0027] According to an embodiment of the present disclosure constructed as described above, a manufacturing device and a manufacturing method of a display device capable of measuring and managing the spacing with the mask in multiple regions of a large-area mother substrate can be realized. In addition, according to an embodiment of the present disclosure, it is not necessary to directly measure the spacing between the mask and the substrate in the process, but an image of the mask shadow can be obtained by a scanning camera that shoots the entire substrate, and the spacing between the mask and the substrate can be predicted and managed based on this. Of course, the present disclosure is not limited to these effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a cross-sectional view showing a manufacturing apparatus of a display device according to an embodiment of the present disclosure.

[0029] Figure 2 FIG. 1 is a perspective view showing a portion of a manufacturing device of a display device according to an embodiment of the present disclosure.

[0030] Figure 3 is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.

[0031] Figure 4a is a perspective view showing a first step S1 of a method for manufacturing a display device according to an embodiment of the present disclosure.

[0032] Figure 4b It is enlarged to show Figure 4a Cross-sectional view of the IVb region.

[0033] Figure 5a is a perspective view showing a second step S2 of the method for manufacturing a display device according to an embodiment of the present disclosure.

[0034] Figure 5b It is enlarged to show Figure 5a A plan view of region Vb.

[0035] Figure 6 1 is a diagram illustrating a third step S3 and a fourth step S4 of a method for manufacturing a display device according to an embodiment of the present disclosure.

[0036] Figure 7 is a perspective view showing a sixth step S6 of the method for manufacturing a display device according to an embodiment of the present disclosure.

[0037] Figure 8 is a perspective view showing a seventh step S7 of the method for manufacturing a display device according to an embodiment of the present disclosure.

[0038] Figures 9a to 9c is a perspective view showing a fifth step S5 of the method for manufacturing a display device according to an embodiment of the present disclosure.

[0039] Fig.10 is a plan view showing a portion of a method for manufacturing a display device according to another embodiment of the present disclosure.

[0040] Fig.11 is a flowchart illustrating a method for manufacturing a display device according to yet another embodiment of the present disclosure.

[0041] Fig.12 1 is a plan view showing a display device manufactured using the manufacturing apparatus of the display device according to an embodiment of the present disclosure.

[0042] Fig.13 is along Fig.12 A cross-sectional view of the display device taken along line XIII-XIII'.

[0043] Description of Reference Numerals

[0044] 100: Display device manufacturing device

[0045] 110: Chamber

[0046] 120: Taiwan

[0047] 130: Mask

[0048] SHW: Masked Shadows

[0049] TH: thickness of the mask's shadow

[0050] TH1, TH2, TH3, TH4, TH5, TH6, TH7, TH8, TH9, TH10: first thickness, second thickness, third thickness, fourth thickness, fifth thickness, sixth thickness, seventh thickness, eighth thickness, ninth thickness, tenth thickness

[0051] 140: Mobile Department

[0052] 150: Sedimentation

[0053] 150-1: Sedimentary Material

[0054] 150-2: Sedimentary Layer

[0055] 160: Sensor unit

[0056] 170: Scanning Department

[0057] 180: Pressure regulation unit

[0058] D: (display) substrate

[0059] SP: Spacing between mask and substrate

[0060] SP1, SP2, SP3, SP4, SP5, SP6, SP7, SP8, SP9, SP10: first spacing, second spacing, third spacing, fourth spacing, fifth spacing, sixth spacing, seventh spacing, eighth spacing, ninth spacing, tenth spacing

[0061] S0, S1, S2, S3, S4, S5, S6, S7, S8, S9, S10: Step 0, Step 1, Step 2, Step 3, Step 4, Step 5, Step 6, Step 7, Step 8, Step 9, Step 10

[0062] S2-1, S2-2: Step 2-1, Step 2-2

[0063] S5-1, S5-2, S5-3: Step 5-1, Step 5-2, Step 5-3 DETAILED DESCRIPTION

[0064] The present disclosure can be variously transformed and can have various embodiments, and specific embodiments will be illustrated in the drawings and described in detail. The effects and features of the present disclosure and methods for achieving the effects and features will be described in detail with reference to the following and the attached drawings. Figure 1 However, the present disclosure is not limited to the embodiments disclosed below, but can be implemented in various forms.

[0065] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and when describing with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and repeated description thereof will be omitted.

[0066] In the following embodiments, the terms "first", "second" and the like are not used in a limiting sense but are used for the purpose of distinguishing one constituent element from another constituent element.

[0067] In the following embodiments, unless clearly indicated otherwise in the context, an expression in the singular includes an expression in the plural.

[0068] In the following embodiments, terms such as “including” or “having” mean that the features or constituent elements described in the specification are present, and do not exclude the possibility of adding one or more other features or constituent elements in advance.

[0069] In the following embodiments, when a portion of a film, a region, a constituent element, etc. is referred to as being on or over another portion, it includes not only the case of being directly on the other portion but also the case of having other films, regions, constituent elements, etc. interposed therebetween.

[0070] In the drawings, the size of the components may be exaggerated or reduced for the convenience of explanation. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, and therefore the present disclosure is not necessarily limited to what is shown in the drawings.

[0071] In the following embodiments, X, Y and Z are not limited to the three directions of the orthogonal coordinate system, but can be interpreted as including a wide range of meanings thereof. For example, X, Y and Z can be orthogonal to each other, but can also refer to different directions that are not orthogonal to each other.

[0072] When a certain embodiment can be implemented differently, a specific process sequence can also be performed in a sequence different from the described sequence. For example, two processes described successively can be performed substantially simultaneously, or in a sequence opposite to the described sequence.

[0073] Figure 1 is a cross-sectional view showing a manufacturing apparatus of a display device according to an embodiment of the present disclosure.

[0074] Reference Figure 1 The manufacturing apparatus 100 of the display device may include a chamber 110 , a stage 120 , a mask 130 , a moving part 140 , a deposition part 150 , a sensor part 160 , a scanning part 170 , and a pressure adjustment part 180 .

[0075] A space may be formed inside the chamber 110, and a portion of the chamber 110 may be opened. At this time, a gate valve 110-1 may be provided in the opened portion of the chamber 110. In this case, the opened portion of the chamber 110 may be opened or closed according to the operation of the gate valve 110-1.

[0076] The stage 120 may be a place for a processing object to be placed thereon and support the processing object. The processing object may be, for example, a display substrate D. In one embodiment, the stage 120 may be in the form of a plate fixed inside the chamber 110. In another embodiment, the stage 120 may be in the form of a shuttle on which the display substrate D is placed and which can perform linear motion inside the chamber 110. In yet another embodiment, the stage 120 may also include an electrostatic chuck or an adhesive chuck fixed to the chamber 110 or arranged in the chamber 110 in a manner that can rise and fall inside the chamber 110. In the following, for the sake of convenience of description, a detailed description will be given with the case where the stage 120 is in the form of a plate fixed inside the chamber 110 as the center.

[0077] A mask 130 may be arranged on the display substrate D. In one embodiment, the mask 130 may be an open mask. The mask 130 may include an opening 130-1 overlapping a portion of the display substrate D. Figure 1 Although not shown in the figure, a separate moving unit (not shown) capable of moving the mask 130 may be provided. For example, the moving unit (not shown) may be a shuttle capable of translation and / or lifting, or may include a robot arm, and may also include a separate driving portion and alignment unit.

[0078] The moving part 140 may be arranged on the stage 120, the display substrate D, and the mask 130. The deposition part 150, the sensor part 160, and the scanning part 170 may be provided to be connected to the moving part 140 so as to move together with the moving part 140. The moving part 140 may be configured to be movable in the X direction and / or the Y direction and / or the Z direction. In some embodiments, the moving part 140 may be a gantry provided in the chamber 110. Figure 1 , the deposition part 150, the sensor part 160, and the scanning part 170 are shown to be fixed to the moving part 140, but the present disclosure is not limited thereto. In one embodiment, the moving part 140 can move in the Y direction and the Z direction, and each of the deposition part 150, the sensor part 160, and / or the scanning part 170 can move independently along the X direction on the moving part 140. In another embodiment, the manufacturing apparatus of the display device may include a plurality of moving parts, and the deposition part, the sensor part, and the scanning part may be respectively fixed to the corresponding moving parts so as to move independently.

[0079] The deposition part 150 may be arranged opposite to the mask 130 and the display substrate D. The deposition part 150 may be connected to the moving part 140 and may move together with the moving part 140. The deposition part 150 may be arranged toward the mask 130. In one embodiment, the deposition part 150 may be arranged at the lower end of the moving part 140 (or arranged in the -Z direction). In one embodiment, the deposition part 150 may contain a deposition material, and the deposition material may be evaporated or sublimated by applying heat to the deposition material. In another embodiment, the deposition part 150 may receive the deposition material from a separate source. The deposition part 150 may spray the above-mentioned deposition material toward the mask 130 and the display substrate D. In one embodiment, the deposition part 150 may be a nozzle dispenser (Jet Dispenser).

[0080] The sensor part 160 may be arranged opposite to the mask 130 and the display substrate D. The sensor part 160 may be connected to the moving part 140 and may move together with the moving part 140. The sensor part 160 may be arranged toward the mask 130. In one embodiment, the sensor part 160 may be arranged at the lower end of the moving part 140 (or arranged in the -Z direction). The sensor part 160 may include a tool capable of sensing an object and measuring a distance. In one embodiment, the sensor part 160 may include a displacement sensor. Therefore, the sensor part 160 may measure the distance from the sensor part 160 to the upper surface of the mask 130 and / or the distance from the sensor part 160 to the upper surface of the display substrate D.

[0081] The scanning section 170 may be connected to the moving section 140 and may move together with the moving section 140. The scanning section 170 may be arranged on a surface (e.g., a surface in the +Z direction) opposite to a surface (e.g., a surface in the -Z direction) of the moving section 140 on which the deposition section 150 and the sensor section 160 are arranged. For example, the scanning section 170 may be arranged at the upper end of the moving section 140 (or arranged in the +Z direction). However, the present disclosure is not necessarily limited thereto, and the scanning section 170 may also be arranged at the lower end of the moving section 140 (or arranged in the -Z direction). The scanning section 170 may be configured to be able to capture or scan the mask 130, the display substrate D, and the stage 120 as a whole. In one embodiment, the scanning section 170 may include an illumination device and a camera. Therefore, the scanning section 170 may acquire an overall image of the display substrate D and the mask 130 arranged on the stage 120.

[0082] The pressure regulating part 180 may be connected to the chamber 110 and regulate the pressure inside the chamber 110. For example, the pressure regulating part 180 may regulate the pressure inside the chamber 110 to be the same as or similar to the atmospheric pressure. In addition, the pressure regulating part 180 may regulate the pressure inside the chamber 110 to be the same as or similar to a vacuum state.

[0083] The pressure regulating part 180 may include a connection pipe 181 connected to the chamber 110 and a pump 182 provided in the connection pipe 181. At this time, according to the operation of the pump 182, external air may be introduced through the connection pipe 181, or the gas inside the chamber 110 may be guided to the outside through the connection pipe 181.

[0084] Figure 2 FIG. 1 is a perspective view showing a portion of a manufacturing device of a display device according to an embodiment of the present disclosure.

[0085] Reference Figure 2 , a processing object (eg, a display substrate D) and a mask 130 may be disposed on the stage 120 , and a moving part 140 , a deposition part 150 , a sensor part 160 , and a scanning part 170 may be disposed on the mask 130 .

[0086] The mask 130 may include an opening 130-1 exposing a portion of the upper surface of the display substrate D. The mask 130 may include a plurality of openings 130-1. The plurality of openings 130-1 of the mask 130 may divide the display substrate D into a plurality of regions. Figure 2 1 shows a total of six openings 130-1 that divide the display substrate D into six regions, but the present disclosure is not necessarily limited to these values. The edge of the mask 130 may be as follows: Figure 2 As shown in FIG. , the edge of the display substrate D is aligned, or it can be aligned with Figure 2 The edges of the display substrate D are covered differently as shown in FIG.

[0087] The moving part 140 may be disposed on the mask 130 . Figure 2 The legs connecting the moving part 140 to the ground or the side wall of the chamber are omitted. The moving part 140 can move in the Y direction and / or the Z direction. However, the following description will focus on the case where the position of the moving part 140 in the Z direction is fixed and the moving part 140 moves in the Y direction. The deposition part 150, the sensor part 160, and the scanning part 170 can be connected to the moving part 140.

[0088] The deposition part 150 and the sensor part 160 may be connected to the moving part 140 in a manner that they can move in the X direction. The deposition part 150 and the sensor part 160 may be independently movable in the X direction. In one embodiment, the deposition part 150 and / or the sensor part 160 may be translatably connected to a track or the like provided on the moving part 140. Therefore, the deposition part 150 and the sensor part 160 may be movable in the Y direction and / or the Z direction by the movement of the moving part 140, and may be movable in the X direction by the respective movements on the moving part 140. Therefore, the deposition part 150 and the sensor part 160 may be movable in the X direction and / or the Y direction and / or the Z direction.

[0089] The scanning unit 170 may be fixed to the moving unit 140. Therefore, the scanning unit 170 may move in the Y direction and / or the Z direction due to the movement of the moving unit 140. The scanning unit 170 may be configured to be able to photograph the table 120 as a whole. In one embodiment, the scanning unit 170 may be arranged at the center of the length of the moving unit 140 in the X direction. In one embodiment, when the scanning unit 170 is started, the moving unit 140 may be located at the center of the length of the table 120 in the Y direction. In one embodiment, in order to adjust the scanning range of the scanning unit 170, the position of the moving unit 140 in the Z direction may be adjusted, and the position of the scanning unit 170 in the Z direction may be adjusted accordingly.

[0090] Figure 3 is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.

[0091] Reference Figure 3 According to an embodiment of the present disclosure, the method for manufacturing a display device may include a 0th step S0 to a ninth step S9. Figure 3 In the present invention, the term "substrate" means a processing object or a display substrate D (see Figure 2 ).

[0092] In the 0th step S0, the mask 130 and the substrate D may be loaded. The mask 130 and the substrate D may be loaded onto the stage 120, and may be loaded at the same time, or may be loaded individually. In one embodiment, the loading direction of the mask 130 and the loading direction of the substrate D may be different. In one embodiment, the mask 130 may be loaded by ascending and descending motion (e.g., motion in the Z direction), and the substrate D may be loaded by translating in a direction perpendicular to the ascending and descending directions of the mask 130 (e.g., the Y direction).

[0093] In the first step S1, the spacing SP between the mask 130 and the substrate D may be measured using the sensor part 160. The spacing SP between the mask 130 and the substrate D may be measured multiple times and at multiple points. Therefore, multiple spacings SP between the mask 130 and the substrate D may be obtained.

[0094] The second step S2 may include a 2-1 step S2-1 and a 2-2 step S2-2.

[0095] In step 2-1 S2-1, the mask 130 and the substrate D arranged on the stage 120 may be photographed by the scanning unit 170. For example, the mask 130 and the substrate D may be photographed by a camera provided in the scanning unit 170. In one embodiment, the scanning unit 170 may include an illumination device, and may irradiate light toward the mask 130 and the substrate D. Therefore, a shadow SHW of the mask 130 may be formed on the substrate D by the light irradiated by the illumination device, and the shadow SHW of the mask 130 may be photographed by the camera.

[0096] In step 2-2 S2-2, the thickness TH of the shadow SHW of the mask 130 formed on the substrate D may be measured based on the image obtained in step 2-1 S2-1. The thickness TH of the shadow SHW may be measured multiple times and may be measured at multiple points. Therefore, multiple thicknesses TH of the shadow SHW may be obtained. In one embodiment, the thickness TH of the shadow SHW may be measured at the same point as the point at which the spacing SP between the mask 130 and the substrate D is measured in step 1 S1.

[0097] Through the first step S1 and the second step S2, a plurality of spacings SP between the mask 130 and the substrate D and a plurality of corresponding thicknesses TH of the shadows SHW can be obtained. In the third step S3, the relationship between the spacings SP and the thickness TH obtained in the first step S1 and the second step S2 can be determined. In one embodiment, the spacings SP between the mask 130 and the substrate D and the thickness TH of the shadows SHW can form a linear trend line. A trend formula of the corresponding trend line can be obtained, thereby expressing the spacings SP between the mask 130 and the substrate D as a function of the thickness TH of the shadows SHW.

[0098] Since the spacing SP between the mask 130 and the substrate D is a function of the thickness TH of the shadow SHW, if the range of the thickness TH of the shadow SHW is maintained within a predetermined range, the spacing SP between the mask 130 and the substrate D can be maintained within a predetermined range. In the fourth step S4, a reference range of the thickness TH of the shadow SHW for maintaining the spacing SP between the mask 130 and the substrate D within a predetermined range can be set.

[0099] In the fifth step S5, continuous operation may be started based on the thickness TH of the shadow SHW set in the fourth step S4. The fifth step S5 may include a 5-1st step S5-1, a 5-2nd step S5-2, and a 5-3rd step S5-3. In the 5-1st step S5-1, the mask 130 may be raised to be spaced apart from the substrate D. In the 5-2nd step S5-2, a new substrate may be loaded. In the 5-3rd step S5-3, the mask 130 may be lowered to approach the newly loaded substrate.

[0100] In the sixth step S6, a deposition process may be performed on the substrate D. The deposition process may be performed by the deposition unit 150 (see Figure 2 )implement.

[0101] In the seventh step S7, the mask 130 and the substrate D may be re-imaged by the scanner 170. Thus, a new image of the shadow SHW of the mask 130 formed on the substrate D may be obtained.

[0102] In the eighth step S8, it can be confirmed whether the thickness TH of the shadow SHW of the mask 130 newly obtained is within the reference range of the thickness TH of the shadow SHW set in the fourth step S4. If the thickness TH of the shadow SHW of the mask 130 newly obtained is within the reference range of the fourth step S4, it can be interpreted that the spacing SP between the mask 130 and the substrate D is within the desired range. If the thickness TH of the shadow SHW of the mask 130 newly obtained is outside the reference range of the fourth step S4, it can be interpreted that the spacing SP between the mask 130 and the substrate D exceeds the desired range. In this case, it can be interpreted that the mask 130 is too close or too far from the substrate D.

[0103] If the thickness TH of the shadow SHW of the newly obtained mask 130 is within the reference range of the fourth step S4, the production of the next substrate can be restarted. For example, the process can return to the fifth step S5 to load a new substrate.

[0104] If the thickness TH of the shadow SHW of the newly obtained mask 130 is outside the reference range of the fourth step S4, the ninth step S9 may be performed. In the ninth step S9, an alarm may be issued and the process may be interrupted, and an equipment inspection may be required.

[0105] According to an embodiment of the present disclosure, Figure 3 As shown in FIG. 1 , the process may be performed in the order of a fifth step S5 , a sixth step S6 , a seventh step S7 , and an eighth step S8 . That is, photographing the mask 130 and the substrate D may be performed after the deposition material is deposited on the substrate D in the sixth step S6 .

[0106] According to another embodiment of the present disclosure, the process may be performed in the order of the fifth step S5, the seventh step S7, the eighth step S8 and the sixth step S6. That is, the mask 130 and the substrate D may be photographed first (the seventh step S7), and it may be determined whether the thickness TH of the shadow SHW is within the range set in the fourth step S4 (the eighth step S8). If it is within the range, the deposition process may be performed in the sixth step S6.

[0107] According to another embodiment of the present disclosure, the process can be performed in the order of the sixth step S6, the seventh step S7, the eighth step S8 and the fifth step S5. That is, the deposition process (sixth step S6) can also be performed while the mask 130 and the substrate D are loaded, the mask 130 and the substrate D are re-photographed (seventh step S7), and it is determined whether the thickness TH of the shadow SHW is within the range set in the fourth step S4 (eighth step S8), and if it is within the range, the substrate D is replaced in the fifth step S5.

[0108] As described above, as long as the spacing SP between the mask 130 and the display substrate D and the thickness TH of the shadow SHW of the mask 130 are obtained and related to each other, it should be understood that it is included in the scope of the present disclosure regardless of the specific order of the method. In addition, it is obvious that at least one of the 0th step S0, the first step S1, the second step S2, the third step S3, the fourth step S4, the fifth step S5, the sixth step S6, the seventh step S7, the eighth step S8, and the ninth step S9 can be repeatedly performed in the manufacturing process of the display device.

[0109] Below, we will refer to Figure 4a , Figure 4b , Figure 5a , Figure 5b , Figure 6 , Figure 7 , Figure 8 , Figure 9a , Figure 9b and Fig.9c To explain in more detail Figure 3 Each step shown in .

[0110] Figure 4a is a perspective view showing a first step S1 of a method for manufacturing a display device according to an embodiment of the present disclosure. Figure 4b It is enlarged to show Figure 4a Cross-sectional view of the IVb region.

[0111] Reference Figure 4a , showing step 0 S0 (refer to Figure 3 ) has been performed so that the substrate D and the mask 130 are loaded on the stage 120. In the first step S1, the interval SP between the mask 130 and the display substrate D may be photographed by the sensor part 160.

[0112] The position of the sensor portion 160 can be adjusted by the movement of the moving portion 140 in the Y direction and the movement of the sensor portion 160 in the X direction on the moving portion 140. The sensor portion 160 can be positioned to overlap with the area of ​​the mask 130 covering the display substrate D. For example, the sensor portion 160 can be positioned such as Figure 4aThe distance between the sensor part 160 and the upper surface of the mask 130 and / or the distance between the sensor part 160 and the upper surface of the display substrate D may be measured by the sensor part 160 in the region as described above.

[0113] Reference Figure 4b , the upper surface of the mask 130 may be uneven. For example, the upper surface of the mask 130 (or the surface in the +Z direction) may include concavities and / or curvatures. The lower surface of the mask 130 (or the surface in the -Z direction) may also similarly include concavities and / or curvatures. Therefore, there may be a gap SPC between the lower surface of the mask 130 and the display substrate D.

[0114] Refer to Figure 4a and Figure 4b By subtracting the distance between the sensor portion 160 and the upper surface of the mask 130 from the distance between the sensor portion 160 and the upper surface of the display substrate D, the distance between the upper surface of the mask 130 and the upper surface of the display substrate D can be obtained. The distance between the upper surface of the mask 130 and the upper surface of the display substrate D can also be understood as the height of the upper surface of the mask 130 with respect to the upper surface of the display substrate D.

[0115] The distances between the upper surface of the display substrate D and the upper surface of the mask 130, i.e., the first height H1, the second height H2, the third height H3, the fourth height H4, the fifth height H5, the sixth height H6, the seventh height H7, the eighth height H8, the ninth height H9, and the tenth height H10 obtained by measuring the height of the upper surface of the mask 130, may be obtained at a plurality of points. At this time, the thickness 130T of the mask 130 may be constant, and the spacing SP between the lower surface of the mask 130 and the upper surface of the display substrate D may be obtained by subtracting the thickness 130T of the mask 130 from the height of the upper surface of the mask 130. For example, the first spacing SP1, the second spacing SP2, the third spacing SP3, the fourth spacing SP4, the fifth spacing SP5, the sixth spacing SP6, the seventh spacing SP7, the eighth spacing SP8, the ninth spacing SP9 and the tenth spacing SP10 can be obtained by subtracting the thickness 130T of the mask from the first height H1, the second height H2, the third height H3, the fourth height H4, the fifth height H5, the sixth height H6, the seventh height H7, the eighth height H8, the ninth height H9 and the tenth height H10. The first spacing SP1 to the tenth spacing SP10 can be understood as the spacing SP between the mask 130 and the display substrate D at various points, or can be understood as the thickness of the gap SPC at various points. The first height H1 to the tenth height H10 and the first spacing SP1 to the tenth spacing SP10 can be different according to the position. For example, as Figure 4bAs shown in FIG. 1 , the first to tenth heights H1 to H10 and the first to tenth intervals SP1 to SP10 may vary along the X direction.

[0116] Figure 4b , the upper surface of the display substrate D is shown to be flat, but the present disclosure is not limited thereto. The upper surface of the display substrate D may include concavo-convex and / or curvature. In this case, the first height H1 to the tenth height H10 and the first spacing SP1 to the tenth spacing SP10 may also be obtained in the same manner as described above.

[0117] By moving the position of the sensor part 160 and operating the sensor part 160, the spacings SP between the mask 130 and the display substrate D (eg, the first spacing SP1 to the tenth spacing SP10) can be obtained at a plurality of points. Of course, the present disclosure is not limited to the case where only ten of the above spacings SP are obtained.

[0118] Figure 5a is a perspective view showing a second step S2 of the method for manufacturing a display device according to an embodiment of the present disclosure. Figure 5b It is enlarged to show Figure 5a A plan view of region Vb.

[0119] Reference Figure 5a The scanning unit 170 may be configured as the entirety of the photographing stage 120 or the entirety of the mask 130 and the display substrate D. Figure 5a In FIG. 1 , an example in which the scanning unit 170 captures the entirety of the mask 130 and the display substrate D is shown by a dotted line. At this time, the scanning unit 170 may be fixed at the center of the moving unit 140 in the X direction. In addition, when the scanning unit 170 captures the mask 130 and the display substrate D, the moving unit 140 may be located at the center of the mask 130 and the display substrate D in the Y direction.

[0120] In one embodiment, the scanning unit 170 may include an illumination device and a camera. When the mask 130 and the display substrate D are photographed by the scanning unit 170 in step 2-1 S2-1, the illumination device may irradiate light toward the mask 130. Figure 4a and Figure 4b As described above, a partial region of the mask 130 may be spaced apart from the display substrate D, and therefore, when light is irradiated to the mask 130, a shadow SHW of the mask 130 may be formed on the display substrate D. The camera of the scanning unit 170 may capture an entire image of the mask 130 and the display substrate D including the shadow SHW of the mask 130 at one time. Hereinafter, a detailed description will be given based on a partial region (e.g., region Vb), but this is only for the convenience of description, and it should be understood that the scanning unit 170 does not only capture the corresponding region (e.g., region Vb).

[0121] Reference Figure 5b, Vb region can be Figure 4a and Figure 4b The shadow SHW of the mask 130 may be formed on the display substrate D by illumination irradiated toward the upper surface of the mask 130. Since the mask 130 may be spaced apart from the display substrate D in a predetermined area, in the shadow SHW of the mask 130, in addition to the portion blocked by the mask 130 due to overlap with the mask 130, there may also be a portion protruding beyond the edge of the mask 130. In step 2-2 S2-2, the thickness TH of the shadow SHW protruding beyond the edge of the mask 130 may be measured.

[0122] Since the thickness TH of the shadow SHW may vary according to the distance (e.g., the pitch SP) between the mask 130 and the display substrate D in the Z direction, the thickness TH of the shadow SHW may vary according to the point on the mask 130. For example, the thickness TH of the shadow SHW may be different according to the position and may include a first thickness TH1, a second thickness TH2, a third thickness TH3, a fourth thickness TH4, a fifth thickness TH5, a sixth thickness TH6, a seventh thickness TH7, an eighth thickness TH8, a ninth thickness TH9, and a tenth thickness TH10. In one embodiment, the first thickness TH1 to the tenth thickness TH10 may be Figure 4b The first pitch SP1 to the tenth pitch SP10 (refer to Figure 4b ) is the thickness TH of the shadow SHW measured at each located point in ).

[0123] Figure 6 1 is a diagram illustrating a third step S3 and a fourth step S4 of a method for manufacturing a display device according to an embodiment of the present disclosure.

[0124] Reference Figure 6 The x-axis in the figure represents the thickness TH of the shadow SHW, and the unit is μm. The y-axis in the figure represents the spacing SP between the mask 130 and the display substrate D, and the unit is mm.

[0125] In the third step S3, the Figure 3 ) and the second step S2 (refer to Figure 3 ) are plotted and curve fitted to determine the relationship therebetween. The thickness TH of the shadow SHW and the spacing SP between the mask 130 and the display substrate D may follow a linear relationship. Figure 6 FIG. 4 shows the relationship between the thickness TH of the shadow SHW and the spacing SP between the mask 130 and the display substrate D according to an embodiment. The trend equation of the corresponding trend line can be expressed by a function, which is also Figure 6 Shown in.

[0126] In the manufacturing process of the display device, it is necessary to keep the spacing SP between the mask 130 and the display substrate D within a predetermined range. In the fourth step S4, the thickness TH of the shadow SHW for keeping the spacing SP between the mask 130 and the display substrate D within a predetermined range can be set by a trend equation representing the relationship between the thickness TH of the shadow SHW and the spacing SP between the mask 130 and the display substrate D. In one embodiment, the maximum spacing SP-max of the spacing SP between the mask 130 and the display substrate D is set to 1.1 mm and the minimum spacing SP-min is set to 1.0 mm. At this time, according to Figure 6 According to the trend equation (y=0.0027x+0.4701) marked in FIG. 1 , the maximum thickness TH-max corresponding to the maximum spacing SP-max may be about 233.30 μm, and the minimum thickness TH-min corresponding to the minimum spacing SP-min may be about 196.25 μm. Therefore, in the fourth step S4, the reference range of the thickness TH of the shadow SHW of the mask 130 in the manufacturing process of the display device may be set to the minimum thickness TH-min to the maximum thickness TH-max (e.g., about 196.25 μm to about 233.30 μm). Of course, the present disclosure is not limited to such a trend equation or numerical value.

[0127] Figure 7 is a perspective view showing a sixth step S6 of the method for manufacturing a display device according to an embodiment of the present disclosure.

[0128] Reference Figure 7 In the sixth step S6, a deposition material 150-1 may be deposited on the display substrate D using the deposition part 150. The deposition part 150 may be positioned to overlap the opening 130-1 of the mask 130, and the deposition material 150-1 may be sprayed toward the opening 130-1 of the mask 130. A portion of the deposition material 150-1 may fill a portion of the opening 130-1 of the mask 130. In another embodiment, a portion of the deposition material 150-1 may also be disposed on an edge portion of the mask 130 adjacent to the opening 130-1.

[0129] After spraying the deposition material 150-1 toward one opening 130-1, the deposition unit 150 may move toward another opening to which the deposition material 150-1 is not sprayed. At this time, the deposition unit 150 may move by the movement of the moving unit 140 in the Y direction and the movement of the deposition unit 150 on the moving unit 140 along the X direction. The deposition unit 150 may move multiple times so that the deposition material 150-1 can be sprayed toward each of the multiple openings 130-1. Similarly, the spraying by the deposition unit 150 may also be performed multiple times. Through the structure of the mask 130 and the opening 130-1, the deposition material 150-1 may be arranged on the display substrate D in a predetermined pattern.

[0130] Figure 8 is a perspective view showing a seventh step S7 of the method for manufacturing a display device according to an embodiment of the present disclosure.

[0131] Reference Figure 8 , a deposition layer 150-2 may be disposed in each opening 130-1 of the mask 130. The deposition layer 150-2 may be Figure 7 The deposition material 150-1 described (refer to Figure 7 ) is formed by being located in the opening 130 - 1.

[0132] In the seventh step S7, Figure 5a Similarly, the scanning unit 170 can capture the mask 130 and the display substrate D as a whole to obtain an image. The above image may include a shadow SHW of the mask 130 formed on the display substrate D. This image can be provided to the eighth step S8 (refer to Figure 3 ), which is used to determine the thickness TH of the shadow SHW (refer to Figure 3 ) whether it is previously referenced Figure 6 In the determination of the thickness TH of the shadow SHW (refer to Figure 3 ) is within the benchmark range. Figure 3 described.

[0133] Figures 9a to 9c is a perspective view showing a fifth step S5 of the method for manufacturing a display device according to an embodiment of the present disclosure.

[0134] Figure 9a is a perspective view showing step S5 - 1 of the method for manufacturing a display device according to an embodiment of the present disclosure.

[0135] Reference Figure 9a, the mask 130 may be raised to space the mask 130 from the display substrate D. At this time, the deposition layer 150-2 located in the opening 130-1 of the mask 130 may remain on the display substrate D. Therefore, the deposition layer 150-2 may be formed on the display substrate D in a predetermined pattern (e.g., a pattern corresponding to the opening 130-1 of the mask 130). Figure 9a Although not shown in the figure, a tool (e.g., a shuttle or a robot arm) may be provided to raise the mask 130. In one embodiment, the tool may approach the mask 130 along the X direction and / or the Y direction, and then may grab the mask 130 and move the mask 130 in the +Z direction.

[0136] Reference Figure 9b , a new display substrate D' may be loaded. The existing display substrate D formed with the deposition layer 150-2 may be moved in a direction to be separated from the stage 120, and may be transferred toward the next process. At the same time, the new display substrate D' may be moved in a direction and loaded onto the stage 120. In one embodiment, the existing display substrate D and the new display substrate D' may be moved in a direction (e.g., an X direction and / or a Y direction) different from the moving direction (e.g., a Z direction) of the mask 130. Figure 9b The figure shows a situation where the existing display substrate D and the new display substrate D' are moved in the -Y direction.

[0137] Reference Fig.9c , the mask 130 can be lowered so that the mask 130 is close to the new display substrate D'. The distance that the mask 130 is lowered can be equal to the reference Figure 9a The distance that the mask 130 is raised in the illustrated embodiment. Fig.9c 130, but may be provided with a tool (e.g., a shuttle or a robotic arm) to lower the mask 130. Figure 9a The tool that grabs the mask 130 and moves the mask 130 in the +Z direction may move the mask 130 in the −Z direction so that the mask 130 approaches a new display substrate D′, and then releases the mask 130 .

[0138] Fig.10 is a plan view showing a portion of a method for manufacturing a display device according to another embodiment of the present disclosure.

[0139] Reference Fig.10, the mask 130 may be arranged on the display substrate D. The mask 130 may include a plurality of openings 130-1. The display substrate D may be divided into a plurality of regions by the plurality of openings 130-1. In one embodiment, the display substrate D1 may be divided into a first zone Z1, a second zone Z2, a third zone Z3, a fourth zone Z4, a fifth zone Z5, and a sixth zone Z6 by the plurality of openings 130-1 of the mask 130. The first zone Z1 and the second zone Z2 may be arranged adjacent to each other along the X direction. The third zone Z3 may be arranged in the -Y direction of the first zone Z1. The fourth zone Z4 may be arranged in the -Y direction of the second zone Z2. The third zone Z3 and the fourth zone Z4 may be arranged adjacent to each other along the X direction. The fifth zone Z5 may be arranged in the -Y direction of the third zone Z3. The sixth zone Z6 may be arranged in the -Y direction of the fourth zone Z4. The fifth zone Z5 and the sixth zone Z6 may be arranged adjacent to each other along the X direction.

[0140] Reference Figure 3 and Fig.10 , the first step S1 , the second step S2 , the third step S3 and the fourth step S4 may be performed individually in a plurality of regions.

[0141] In the first step S1, the measurement of the spacing SP between the mask 130 and the substrate D may be performed in the first zone Z1 to the sixth zone Z6, respectively. In one embodiment, when the sensor part 160 is overlapped with the first area A1, the spacing SP between the mask 130 and the substrate D may be measured in the first zone Z1 and the second zone Z2. Similarly, when the sensor part 160 is overlapped with the second area A2, the spacing SP between the mask 130 and the substrate D may be measured in the third zone Z3 and the fourth zone Z4. Similarly, when the sensor part 160 is overlapped with the third area A3, the spacing SP between the mask 130 and the substrate D may be measured in the fifth zone Z5 and the sixth zone Z6.

[0142] In step 2-1 S2-1, the scanning unit 170 may shoot the mask 130 and the substrate D as a whole. However, in step 2-2 S2-2, the measurement of the thickness TH of the shadow SHW may be performed separately in the first zone Z1 to the sixth zone Z6. For example, in the first area A1, the thickness TH of the shadow SHW may be measured at the same point as the point at which the spacing SP between the mask 130 and the substrate D of the first zone Z1 and the second zone Z2 is measured. Similarly, in the second area A2, the thickness TH of the shadow SHW may be measured at the same point as the point at which the spacing SP between the mask 130 and the substrate D of the third zone Z3 and the fourth zone Z4 is measured. Similarly, in the third area A3, the thickness TH of the shadow SHW may be measured at the same point as the point at which the spacing SP between the mask 130 and the substrate D of the fifth zone Z5 and the sixth zone Z6 is measured.

[0143] After the above process, in the third step S3, the relationship (or trend formula) between the spacing SP between the mask 130 and the substrate D and the thickness TH of the shadow SHW can be obtained in each of the first zone Z1 to the sixth zone Z6. Therefore, in the fourth step S4, the reference range of the thickness TH of the shadow SHW can also be set for each of the first zone Z1 to the sixth zone Z6.

[0144] Thereafter, in the eighth step S8, it may be determined whether the thickness TH of the shadow SHW is within the reference range for each of the first to sixth zones Z1 to Z6. In one embodiment, when the thickness TH of the shadow SHW is not within the reference range in any one of the first to sixth zones Z1 to Z6, the ninth step S9 may be performed. In another embodiment, when the thickness TH of the shadow SHW is not within the reference range in more than half of the zones (e.g., three zones) in the first to sixth zones Z1 to Z6, the ninth step S9 may be performed.

[0145] As mentioned above, according to Fig.10 In the embodiment shown in FIG. 1 , the spacing SP between the mask 130 and the display substrate D may be respectively monitored in individual regions formed by the openings 130 - 1 of the mask 130 .

[0146] Fig.11 is a flowchart illustrating a method for manufacturing a display device according to yet another embodiment of the present disclosure.

[0147] Reference Fig.11 , the first step S1 and the second step S2 can be repeatedly performed.

[0148] The desired number of repetitions N may be set after executing the 0th step S0 and before executing the first step S1, and the current number M may be set to 0. Then, the first step S1 and the second step S2 may be executed, and the current number M may be increased by 1. If the current number M is greater than the number of repetitions N, the third step S3 may be executed. If the current number M is less than the number of repetitions N, the tenth step S10 may be executed.

[0149] In the tenth step S10, the position of the mask 130 may be adjusted. For example, the position of the mask 130 in the Z direction may be adjusted. Therefore, the spacing SP between the mask 130 and the substrate D and the thickness TH of the shadow SHW of the mask 130 may be changed. Then, the changed spacing SP between the mask 130 and the substrate D and the changed thickness TH of the shadow SHW of the mask 130 may be re-measured by performing the first step S1 and the second step S2 again. Then, the current number M may be increased by 1.

[0150] If the current number M becomes the same as the set number of repetitions N by repeating the above process, the third step S3 can be performed. When performing the third step S3, all the spacings SP between the mask 130 and the substrate D and the thickness TH of the shadow SHW of the mask 130 obtained by repeatedly performing the first step S1 and the second step S2 can be used. Therefore, compared with when the first step S1 and the second step S2 are performed once respectively, the trend consistency between the spacing SP between the mask 130 and the substrate D and the thickness TH of the shadow SHW of the mask 130 can be improved.

[0151] Fig.12 1 is a plan view showing a display device manufactured using the manufacturing apparatus of the display device according to an embodiment of the present disclosure. Fig.13 is along Fig.12 A cross-sectional view of the display device taken along line XIII-XIII'.

[0152] Reference Fig.12 and Fig.13 A display area DA and a non-display area NDA outside the display area DA may be defined on the base substrate 21 of the display device 20. A light emitting element 28 may be arranged in the display area DA, and a power supply wiring (not shown) may be arranged in the non-display area NDA. In addition, a pad portion C may be arranged in the non-display area NDA.

[0153] A plurality of deposition material patterns may be arranged in the display area DA. At this time, the display area DA may be in an amorphous form.

[0154] The display device 20 may include a display substrate D, an intermediate layer 28 - 2 disposed on the display substrate D, and an opposite electrode 28 - 3 disposed on the intermediate layer 28 - 2. In addition, the display device 20 may include a thin film encapsulation layer E disposed over the opposite electrode 28 - 3.

[0155] The display substrate D may include a base substrate 21 , a thin film transistor TFT, a through hole layer 27 , and a pixel electrode 28 - 1 .

[0156] The base substrate 21 may be made of plastic or metal such as SUS or Ti. In addition, the base substrate 21 may be made of polyimide (PI).

[0157] The thin film transistor TFT may be disposed on the base substrate 21 , the through hole layer 27 may be disposed to cover the thin film transistor TFT, and the light emitting element 28 may be disposed on the through hole layer 27 .

[0158] A buffer layer 22 formed of an organic compound and / or an inorganic compound may also be disposed on the upper surface of the base substrate 21, and the buffer layer 22 may include SiOx (x≥1) and / or SiN x (x≥1).

[0159] After the active layer 23 arranged in a predetermined pattern is disposed on the buffer layer 22, the active layer 23 may be buried by the gate insulating layer 24. The active layer 23 may have a source region 23-1 and a drain region 23-3, and may further include a channel region 23-2 therebetween.

[0160] Such active layer 23 may be formed to contain various substances. In one embodiment, the active layer 23 may contain an inorganic semiconductor substance such as amorphous silicon or crystalline silicon. In another embodiment, the active layer 23 may contain an oxide semiconductor. In yet another embodiment, the active layer 23 may contain an organic semiconductor substance. Hereinafter, for the sake of convenience of description, a detailed description will be given centering on the case where the active layer 23 is formed of amorphous silicon.

[0161] The active layer 23 may be formed by forming an amorphous silicon film on the buffer layer 22, crystallizing the amorphous silicon film to form a polycrystalline silicon film, and patterning the polycrystalline silicon film. According to the type of thin film transistors such as a driving thin film transistor (not shown) and a switching thin film transistor (not shown), the source region 23-1 and the drain region 23-3 of the active layer 23 may be doped with impurities.

[0162] A gate electrode 25 corresponding to the active layer 23 and an interlayer insulating layer 26 burying the gate electrode 25 may be arranged on the upper surface of the gate insulating layer 24. After forming a contact hole CNT1 in the interlayer insulating layer 26 and the gate insulating layer 24, a source electrode 27-1 and a drain electrode 27-2 may be arranged on the interlayer insulating layer 26 to contact the source region 23-1 and the drain region 23-3, respectively.

[0163] A through hole layer 27 may be arranged above the thin film transistor TFT, and a pixel electrode 28-1 of the light emitting element 28 may be arranged above the through hole layer 27. The pixel electrode 28-1 contacts the drain electrode 27-2 of the thin film transistor TFT through the through hole CNT2 formed in the through hole layer 27. The through hole layer 27 may be formed of an inorganic and / or organic substance, a single layer or two or more layers, and may be formed to be flat so that the upper surface of the through hole layer 27 may become flat regardless of the curvature of the film below, and conversely, the through hole layer 27 may also be formed to be curved according to the curvature of the film located below.

[0164] After the pixel electrode 28 - 1 is disposed on the via layer 27 , a pixel defining film 29 may be formed of an organic and / or inorganic material to cover the pixel electrode 28 - 1 and the via layer 27 , and the pixel defining film 29 may be opened to expose the pixel electrode 28 - 1 .

[0165] An intermediate layer 28-2 and an opposing electrode 28-3 may be arranged on the pixel electrode 28-1. In one embodiment, the opposing electrode 28-3 may be arranged on the entire surface of the display substrate D. In this case, the opposing electrode 28-3 may be arranged on the intermediate layer 28-2 and the pixel defining film 29. Hereinafter, for the sake of convenience, a detailed description will be given focusing on the case where the opposing electrode 28-3 is arranged on the intermediate layer 28-2 and the pixel defining film 29.

[0166] The pixel electrode 28 - 1 may be used as an anode electrode, and the counter electrode 28 - 3 may be used as a cathode electrode. Of course, the polarities of the pixel electrode 28 - 1 and the counter electrode 28 - 3 may be reversed.

[0167] The pixel electrode 28 - 1 and the opposite electrode 28 - 3 are insulated from each other by the intermediate layer 28 - 2 described above, and light emission is achieved in the organic light emitting layer by applying voltages of different polarities to the intermediate layer 28 - 2 .

[0168] The intermediate layer 28-2 may include an organic light emitting layer. As another optional example, the intermediate layer 28-2 may include an organic light emitting layer, and in addition, may include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. The present embodiment is not limited thereto, and the intermediate layer 28-2 may include an organic light emitting layer, and may also include various other functional layers (not shown).

[0169] The intermediate layer 28 - 2 may be provided in plurality, and the plurality of intermediate layers 28 - 2 may form the display area DA. At this time, the plurality of intermediate layers 28 - 2 may be arranged to be spaced apart from each other inside the display area DA.

[0170] On the other hand, a unit pixel is composed of a plurality of sub-pixels, and the plurality of sub-pixels can emit light of various colors. For example, the plurality of sub-pixels can include sub-pixels emitting red light, green light, and blue light, respectively, and can include sub-pixels emitting red light, green light, blue light, and white light (not marked). The sub-pixels as described above can include an intermediate layer 28-2.

[0171] The thin film encapsulation layer E may include a plurality of inorganic layers, or may include an inorganic layer and an organic layer. The above-mentioned organic layer of the thin film encapsulation layer E may be formed of a polymer, and preferably may be a single film or a stacked film formed of any one of polyethylene terephthalate, polyimide, polycarbonate, epoxy resin, polyethylene, and polyacrylate. The above-mentioned inorganic layer of the thin film encapsulation layer E may be a single film or a stacked film including a metal oxide or a metal nitride. Specifically, the above-mentioned inorganic layer may include SiN x 、Al 2 O 3 、SiO 2 and TiO 2 The uppermost layer exposed to the outside among the thin film encapsulation layer E may be formed of an inorganic layer to prevent moisture from penetrating into the light emitting element.

[0172] The thin film encapsulation layer E may include at least one sandwich structure in which at least one organic layer is inserted between at least two inorganic layers. As another example, the thin film encapsulation layer E may include at least one sandwich structure in which at least one inorganic layer is inserted between at least two organic layers. As yet another example, the thin film encapsulation layer E may also include a sandwich structure in which at least one organic layer is inserted between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is inserted between at least two organic layers.

[0173] As described above, the present disclosure is described with reference to an embodiment shown in the accompanying drawings, but this is only exemplary, and those skilled in the art will understand that various modifications and variations of the embodiments can be made therefrom. Therefore, the true technical protection scope of the present disclosure should be determined by the technical ideas of the attached claims.

Claims

1. A manufacturing device for a display device, characterized in that: include: a stage configured to load a treatment object and to load a mask on the treatment object; as well as The scanning unit measures the thickness of the shadow of the mask formed on the processing object.

2. The manufacturing device of the display device according to claim 1, characterized in that: Also includes: The sensor unit measures a distance between the mask and the processing object.

3. The manufacturing device of the display device according to claim 2, characterized in that: The relationship between the thickness and the pitch of the shadow is determined using the thickness of the plurality of shadows obtained by the scanning section and the pitch of the plurality of shadows obtained by the sensor section.

4. The manufacturing device of a display device according to claim 1, characterized in that: The distance between the mask and the processing object is adjusted by moving the mask.

5. A method for manufacturing a display device, characterized in that: include: The steps of loading a treatment object on a stage and loading a mask on the treatment object; as well as The step of measuring the thickness of the shadow of the mask formed on the processing object by using a scanning unit.

6. The method for manufacturing a display device according to claim 5, characterized in that: Also includes: A step of measuring a distance between the mask and the processing object using a sensor unit.

7. The method for manufacturing a display device according to claim 6, wherein: Also includes: A step of determining a relationship between the thickness of the shadow and the pitch using the plurality of thicknesses of the shadow obtained by the scanning unit and the plurality of pitches obtained by the sensor unit.

8. The method for manufacturing a display device according to claim 7, wherein: Also includes: The step of determining a reference range of the thickness of the shadow so that the distance between the mask and the processing object is within a predetermined range.

9. The method for manufacturing a display device according to claim 5, characterized in that: The thicknesses of a plurality of shadows of the mask formed on the processing object are measured in a plurality of mutually different regions, respectively.

10. The method for manufacturing a display device according to claim 6, wherein: The step of measuring the thickness of the shadow of the mask and the step of measuring the distance between the mask and the processing object are repeated multiple times.

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