Method of manufacturing aerosol-generating device

Abstract

An aerosol-generating device and a method of manufacturing an aerosol-generating device are provided. According to an aspect of an example embodiment, there is provided a method of manufacturing an aerosol-generating device that includes a heater inserted into an elongate heater pin. The method includes: injecting a liquid bonding material into a cavity of the heater pin; inserting the heater into the cavity; reducing bubbles in the bonding material when the bonding material is still in a liquid state; and curing the bonding material into a solid state to secure the heater in the heater pin.

Description

Technical Field

[0001] The present disclosure relates to an aerosol generating device and a method of manufacturing an aerosol generating device. Background Art

[0002] An aerosol generating device is a device that extracts a specific component from a medium or a substance by forming an aerosol. The medium may contain a multi-component substance. The substance contained in the medium may be a multi-component flavoring substance. For example, the substance contained in the medium may include a nicotine component, a herbal component, and / or a coffee component. Recently, various studies have been conducted on aerosol generating devices. Summary of the invention

[0003] Technical issues The present disclosure is directed to solving the above-mentioned and other problems.

[0004] Another object of the present disclosure is to reduce the formation of voids in heater pins.

[0005] Yet another object of the present disclosure is to improve the heat transfer efficiency of the heater.

[0006] Yet another object of the present disclosure is to prevent water or moisture from entering the interior of the heater pin.

[0007] Yet another object of the present disclosure is to improve the structural stability of the heater assembly.

[0008] Solutions to the problem According to one aspect of the subject matter described in this application, there is provided a method of manufacturing an aerosol generating device, the aerosol generating device comprising a heater inserted into an elongated heater pin. The method comprises: injecting a liquid bonding material into a cavity of the heater pin; inserting the heater into the cavity; reducing bubbles in the bonding material while the bonding material is still in a liquid state; and curing the bonding material into a solid state to fix the heater in the heater pin.

[0009] Advantageous Effects of the Invention According to at least one embodiment of the present disclosure, the formation of voids in heater pins may be reduced.

[0010] According to at least one embodiment of the present disclosure, the heat conduction efficiency of the heater may be improved.

[0011] According to at least one exemplary embodiment of the present disclosure, water or moisture may be prevented from entering the interior of the heater pin.

[0012] According to at least one embodiment of the present disclosure, the structural stability of the heater assembly may be improved.

[0013] Through the following detailed description, the further applicable scope of the present disclosure will become easy to understand. However, it should be understood that since those skilled in the art can clearly understand various changes and modifications within the concept and scope of the present disclosure, the detailed description of the present disclosure and specific embodiments such as preferred embodiments are only given by way of example. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figures 1 to 20 An example of an aerosol generating device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0015] Now, a description of exemplary embodiments disclosed herein will be given in detail with reference to the accompanying drawings. For the sake of brief description with reference to the accompanying drawings, the same or equivalent components have the same or similar reference numerals, and their description will not be repeated.

[0016] In the following description, suffixes such as "module" and "unit" may be used to refer to elements or components. Such suffixes are used herein only to facilitate the description of the specification, and the suffixes themselves are not intended to give any special meaning or function.

[0017] In the present disclosure, for the sake of brevity, the contents known to ordinary technicians in the relevant fields are generally omitted. The accompanying drawings are used to help easily understand the technical concept of the present disclosure, and it should be understood that the concept of the present disclosure is not limited by the accompanying drawings. The concept of the present disclosure should be interpreted as extending to any variants, equivalents and alternatives other than the accompanying drawings.

[0018] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element.

[0019] It should be understood that when a component is referred to as being "connected to" or "coupled to" another component, the component may be directly connected to or coupled to the other component, or intervening components may exist. On the other hand, when a component is referred to as being "directly connected to" or "directly coupled to" another component, there are no intervening components.

[0020] As used herein, a singular expression is intended to include the plural expression unless the context clearly indicates otherwise.

[0021] Reference Figures 1 to 3 The aerosol generating device 100 may include at least one of a battery 11, a controller 12, and a sensor 13. At least one of the battery 11, the controller 12, and the sensor 13 may be disposed in the body 10 of the aerosol generating device 100.

[0022] The duct 20 may be coupled to the upper side of the body 10 . The duct 20 may have an insertion space 24 therein. The insertion space 24 may be open at the top. The insertion space 24 may have a cylindrical shape. A stick 400 may be detachably inserted into the insertion space 24 .

[0023] The heater 33 may be disposed in the heater pin 30 that protrudes upward from the cover 25 defining the bottom of the pipe 20 toward the insertion space 24. The heater 33 may be a resistance heater. The heater 33 may heat the rod 400 inserted into the insertion space 24.

[0024] When the stick 400 is inserted into the insertion space 24, one end of the stick 400 may be exposed to the outside from the insertion space 24 and the body 10. When the stick 400 is inserted into the insertion space 24, the heater 33 may pass through the end of the stick 400 to be inserted into the stick 400. The stick 400 may be heated by the heater 33. The user may inhale air while holding the end of the stick 400 exposed to the outside in his or her mouth.

[0025] The battery 11 may supply power to operate the components of the aerosol generating device 100. The battery 11 may supply power to at least one of the controller 12, the sensor 13, the induction coil 14, and the heater 33. The battery 11 may supply power required for the operation of a display, a motor, etc. installed at the aerosol generating device 100.

[0026] The controller 12 may control the overall operation of the aerosol generating device 100. The controller 12 may control the operation of at least one of the battery 11, the induction coil 14, and the sensor 13. The controller 12 may control the operation of a display, a motor, etc. installed at the aerosol generating device 100. The controller 12 may check the state of each of the components of the aerosol generating device 100 to determine whether the aerosol generating device 100 is in an operable state.

[0027] The sensor 13 may sense the temperature of the heater 33. The controller 12 may control the temperature of the heater 33 based on the temperature of the heater 33 sensed by the sensor 13. The controller 12 may transmit information about the temperature of the heater 33 sensed by the sensor 13 to the user through the user interface.

[0028] Reference Figure 1 , the heater 33 may be electrically connected to the battery 11. The heater 33 may directly generate heat by using the current supplied from the battery 11 without the need for the induction coil 14 (see Figure 2 ).

[0029] Reference Figure 2, the aerosol generating device 100 may include an induction coil 14. The induction coil 14 may surround the insertion space 24 and the heater 33. The induction coil 14 may cause the heater 33 to generate heat. The heater 33 may be a susceptor that may generate heat by a magnetic field generated by an AC current flowing through the induction coil 14. The magnetic field may pass through the heater 33, thereby generating an eddy current in the heater 33. The current may cause the heater 33 to generate heat.

[0030] Reference Figures 3 to 5 , the duct 20 may include a cover 25. The cover 25 may define a bottom of the duct 20 and may cover a lower portion of the insertion space 24. The cover 25 may include a first cover portion 251 and a second cover portion 252.

[0031] The first cover portion 251 may be connected to the lower end of the pipe 20. The first cover portion 251 may cover the bottom of the insertion space 24. The second cover portion 252 may be connected to the first cover portion 251. The second cover portion 252 may be formed below the first cover portion 251. The inner surface of the second cover portion 252 may be recessed outward relative to the inner surface of the first cover portion 251. The cover through hole 254 may be formed in the lower portion 2522 of the second cover portion 252. The cover through hole 254 may be communicated with the cavity (or hollow portion) 34 of the heater pin 30.

[0032] The heater pin 30 may be elongated up and down or vertically. The heater pin 30 may protrude upwardly from the cover 25 toward the insertion space 24 for a long time. The heater pin 30 may include a cylindrical shape. The heater pin 30 may have a sharp or pointed upper end. The heater pin 30 may be provided with a space for inserting the heater 33 therein.

[0033] The heater pin 30 may be formed using a ceramic material. Since the heater pin 30 repeatedly contacts the rod 400, stretches, and accommodates the heater 33 therein, the material of the heater pin 30 may be selected by considering mechanical strength, wear resistance, heat resistance, and moisture resistance. For example, the heater pin 30 may be formed using zirconium oxide. Zirconium oxide has the best mechanical strength at room temperature among ceramics, a melting point of 2000° C. or higher, and good hardness and wear resistance. Due to the excellent durability of the heater pin 30, the heater pin 30 may maintain a stable shape even when the heater 33 repeatedly generates heat and repeatedly contacts the rod 400.

[0034] The heater pin 30 may include a pin body 31. The pin body 31 may be vertically elongated. The pin body 31 may have a cylindrical shape. The interior of the pin body 31 may define a cavity 34 (i.e., a hollow portion). The heater pin 30 may be open at the bottom to communicate with the cavity 34. The cavity 34 may be vertically elongated. The cavity 34 may have a cylindrical shape.

[0035] The heater pin 30 may include a pin tip 32. The pin tip 32 may define the upper end of the heater pin 30. The pin tip 32 may be integrally formed on the pin body 31. The pin tip 32 may have an upwardly tapered shape. The pin tip 32 may have a sharp or pointed upper end. Therefore, the heater pin 30 may pass through the rod S, thereby fixing the rod S.

[0036] The flange 35 may protrude outward from the heater pin 30. The flange 35 may protrude in a lateral direction from a lower end of the heater pin 30. The flange 35 may protrude in a radially outward direction from the heater pin 30. The flange 35 may be integrally formed with the heater pin 30.

[0037] The flange 35 may be formed using a plurality of layers. For example, the flange 35 may be formed using two layers. For example, the flange 35 may include a first flange 351 and a second flange 352. The first flange 351 may be disposed at an upper portion (or top) of the flange 35. The second flange 352 may be disposed at a lower portion (or bottom) of the flange 35. Hereinafter, it will be described that the flange 35 includes the first flange 351 and the second flange 352. However, the present disclosure is not limited thereto, and the flange 35 may include a greater number of flanges. For example, the flange 35 may be formed using three or more layers.

[0038] The first flange 351 may be disposed on the second flange 352. The first flange 351 may be formed integrally with the second flange 352. The first flange 351 may be disposed at a lower portion of the pin body 31. The first flange 351 may protrude in a transversely outward direction or a radially outward direction from an outer circumferential surface of the pin body 31. The first flange 351 may extend in a circumferential direction.

[0039] The second flange 352 may be disposed below the first flange 351. The second flange 352 may be disposed at the lower end of the heater pin 30. The second flange 352 may protrude in a lateral outward direction or a radial outward direction from the outer circumferential surface of the pin body 31. The second flange 352 may protrude further than the first flange 351 in a lateral outward direction or a radial outward direction.

[0040] Therefore, a step (or a step portion) may exist between the first flange 351 and the second flange 352 .

[0041] At least one of the first flange 351 and the second flange 352 may have a non-circular cross-section. For example, the first flange 351 may extend in the circumferential direction to have a circular cross-sectional shape, and the second flange 352 may have a non-circular cross-sectional shape.

[0042] The first cover portion 251 may surround and be in close contact with a side surface of the first flange 351. The first cover portion 251 may cover or be in close contact with an upper surface of the second flange 352. The upper surface of the first flange 351 together with the first cover portion 251 may face the bottom of the insertion space 24.

[0043] The second cover part 252 may surround and closely contact the side surface and the lower portion of the outer side of the second flange 352. The second flange 352 may be disposed between the first cover part 251 and the second cover part 252 so as to be supported in the up-down direction or the vertical direction.

[0044] Therefore, the cover 25 and the flange 35 may be combined with each other to be engaged in the vertical direction so as to be supported in the vertical direction. Therefore, the heater pin 30 may be prevented from being separated from the pipe 20, and structural stability may be achieved.

[0045] In addition, the cover 25 and the flange 35 may be coupled to each other to engage in the circumferential direction. Therefore, the heater pin 30 coupled to the pipe 20 may be prevented from rotating (see Figure 3 ).

[0046] The pipe 20 may be formed by insert injection molding. The pipe 20 combined with the heater pin 30 may be manufactured by inserting the heater pin 30 together with the heater 33, the support bar 332 and the bonding material 361 into a mold for injecting the pipe 20, then removing the lead 331 from the mold, and then injecting and curing the injection material into the mold.

[0047] Reference Figure 3 and Figure 6 The heater 33 may have a coil shape. The heater 33 may be wound around an elongated support bar 332. The heater 33 may be wound in a spiral shape around the support bar 332. The support bar 332 may support the heater 33, thereby allowing the heater 33 to maintain a shape.

[0048] The lead wire 331 may be extended longer from each of both ends of the heater 33. The heater 33 may be supplied with power from a power source through the lead wire 331. The heater 33 may be a resistance heater that may generate heat using power supplied thereto.

[0049] The heater 33 and the support bar 332 may be fixed in the heater pin 30 by the bonding material 361. The bonding material 361 may cover the opening at the bottom of the heater pin 30. The lead wire 331 may pass through the bonding material 361 and the cover through hole 254 to be exposed downward, and may be connected to a power source.

[0050] Reference Figure 7The syringe 51 may store the liquid bonding material 361 therein. The nozzle 511 of the syringe 51 may have an elongated shape. The syringe 51 may spray the liquid bonding material 361 through the nozzle 511.

[0051] The bonding material 361 can be made of a non-conductive material having excellent heat resistance and chemical resistance. For example, the bonding material 361 can be a ceramic binder (ceramic adhesive). The ceramic binder can include raw materials such as polyurethane, amine, styrene copolymer, resin, etc., but the present disclosure is not limited to this. The liquid bonding material 361 can be cured after a predetermined time at room temperature, but this can vary according to the type of raw materials constituting the bonding material 361 or the composition ratio of the raw materials. The bonding material 361 can be a ceramic binder, and the ceramic binder has good compatibility with the heater pin 30 formed using ceramics, so that the bonding material 361 is suitable for bonding with the heater pin 30. In addition, due to the excellent durability of the bonding material 361, the external shape can be stably maintained even when the heater 33 repeatedly generates heat and repeatedly contacts with the rod 400.

[0052] The bonding material 361 may include alumina ceramics, which may be a ceramic material containing alumina (Al2O3) as a main component. For example, the content of alumina in the bonding material 361 may be 80% or more. Therefore, the bonding material 361 may have high electrical insulation, high thermal shock resistance, high thermal conductivity, and excellent mechanical bonding strength and corrosion resistance. In addition, the bonding material 361 may be suitable for bonding and sealing with the inside of the heater pin 30.

[0053] The heater pin 30 may be opened at the bottom. In a state where the heater pin 30 is turned upside down and the opening at the bottom of the heater pin 30 faces upward, the liquid bonding material 361 may be injected into the cavity 34 of the heater pin 30 by the syringe 51. While the nozzle 511 is inserted into the cavity 34, the nozzle 511 may spray the bonding material 361 into the cavity 34. The bonding material 361 may be injected up to a height adjacent to the opening of the heater pin 30. For example, based on the heater pin 30 being turned upside down, the bonding material 361 may be injected up to the lower side of the flange 35.

[0054] Reference Figure 8 and Fig. 9, in a state where the heater pin 30 is turned upside down, the heater 33 and the support bar 332 may be inserted into the cavity 34 through the opening at the bottom of the heater pin 30. The heater 33 and the support bar 332 may be inserted into the liquid bonding material 361 injected into the cavity 34. The support bar 332 and the heater 33 may be completely immersed in the bonding material 361. Since the heater 33 is wound around the support bar 332 and supported by the support bar 332, the shape of the heater 33 may be maintained when the heater 33 is inserted into the bonding material 361. Here, the lead wire 331 may extend from the heater 33 to the outside of the cavity 34 through the opening of the heater pin 30 so as to be exposed under the heater pin 30.

[0055] The support bar 332 may be disposed in the cavity 34 in parallel with the pin body 31. The heater 33 may be disposed between the pin body 31 and the support bar 332 in the cavity 34. The bonding material 361 may fill the gaps between the pin body 31, the support bar 332, and the heater 33 in the cavity 34. After the heater 33 and the support bar 332 are inserted into the cavity 34, the bonding material 361 may be dried for a predetermined time and cured into a solid state. The bonding material 361 may be bonded and fixed to the inner surface of the pin body 31. The bonding material 361 may be bonded and fixed to the heater 33 and the support bar 332. The bonding material 361 may fix or fasten the heater 33 and the support bar 332 to the heater pin 30.

[0056] The support bar 332 may include alumina (Al2O3). Alumina, which is one of the ceramic raw materials, has good rigidity, high electrical insulation, high chemical stability, good corrosion resistance and heat resistance, and low price. Due to the electrical insulation property of the support bar 332, the support bar 332 can be prevented from short-circuiting with the heater 33, and the heater 33 can be allowed to be firmly fixed with little shape deformation when the heater 33 generates heat. In addition, since the support bar 332 has good compatibility with the bonding material 361, the support bar 332 can be easily bonded with the bonding material 361.

[0057] Reference Fig.10 According to an exemplary embodiment, a method of manufacturing an aerosol generating device may include injecting a bonding material 361 into a heater pin 30 (S1). In a state where the cavity 34 and the opening of the heater pin 30 are turned upside down to face upward, a nozzle 511 of a syringe 51 may be inserted into the cavity 34 to inject the bonding material 361 (see Figure 7 ). Here, the bonding material 361 may be in a liquid state.

[0058] The method of manufacturing an aerosol generating device may include inserting a heater 33 into a cavity 34 of a heater pin 30 (S2). At step S2, when the bonding material 361 is in a liquid state, the heater 33 may be inserted into the cavity 34 and the bonding material 361 to be immersed in the bonding material 361 (see Figures 7 to 9 ). Alternatively, the liquid bonding material 361 may be injected into the cavity 34 while the heater 33 is inserted into the cavity 34. Here, the heater 33 may be inserted into the cavity 34 together with the support bar 332. When the heater 33 is wound around the support bar 332, the heater 33 may stably maintain a shape and be accurately positioned when inserted into the liquid bonding material 361.

[0059] The method of manufacturing an aerosol generating device may include drying the liquid bonding material 361 ( S3 ). Here, the liquid bonding material 361 may be dried into a solid state to be fixed to the heater pin 30 , allowing the internal heater 33 and the support bar 332 to be fixed to the heater pin 30 .

[0060] The method of manufacturing an aerosol generating device may include combining the heater pin 30 and the pipe 20 together (S4). Here, the pipe 20 may be formed by insert injection molding. The pipe 20 combined with the heater pin 20 may be manufactured by inserting the heater pin 30 together with the heater 33, the support bar 332 and the bonding material 361 into a mold for injecting the pipe 20, then removing the lead 331 from the mold, and then injecting and curing the injection material into the mold.

[0061] Reference Figures 11 to 20 In the case where the aerosol generating device includes a heater pin 30 having a cavity 34 therein and open on one side and a heater 33 inserted into the cavity 34, the method of manufacturing the aerosol generating device may further include a step of reducing bubbles 363 in the liquid binding material 361. The step of reducing bubbles 363 in the liquid binding material 361 may be performed after injecting the liquid binding material 361 into the heater pin 30 and before curing the binding material 361 into a solid state.

[0062] Reference Fig.11 and Fig.12 , the step of reducing bubbles 363 in the liquid bonding material 361 may include exhausting the bonding material 361 through a decompressor (S310). The method of manufacturing the aerosol generating device may include: injecting the bonding material 361 into the heater pin 30 (S11); inserting the heater 33 into the heater pin 30 (S21); exhausting the bonding material 361 through the decompressor 61 (S310); drying the bonding material 361 (S31); and combining the heater pin 30 and the pipe 20 together (S41).

[0063] In one example, exhausting the bonding material 361 through the decompressor 61 (S310) may be performed after injecting the liquid bonding material 361 into the heater pin 30 (S11). In another example, exhausting the bonding material 361 through the decompressor 61 (S310) may be performed after injecting the liquid bonding material 361 into the heater pin 30 (S11) and inserting the heater 33 into the heater pin 30 (S21).

[0064] Specifically, exhausting the bonding material 361 by the decompressor 61 (S310) may be performed by placing the heater pin 30 in the interior 614 of the decompressor 61, then providing communication between the opening of the heater pin 30 and the interior 614 of the decompressor 61, and then reducing the pressure of the interior 614 of the decompressor 61, thereby removing the bubbles 363 from the bonding material 363. Here, the opening of the heater pin 30 may be set to face upward. The decompressor 613 may be a decompression valve or a decompression pump.

[0065] The decompressor 61 may be a decompression dryer. Therefore, the decompressor 61 may perform both the step of reducing the bubbles 363 and the step of solidifying the bonding material 361 into a solid state. When the decompressor 61 is a decompression dryer, after injecting the liquid bonding material 361 into the heater pin 30 (S11) and inserting the heater 33 into the heater pin 300 (S21), exhausting the bonding material 361 by the decompressor 61 (S310) may be performed.

[0066] Therefore, the formation of voids that may occur when the bubbles 363 of the bonding material 361 are not removed and hardened inside the heater pin 30 can be reduced, and the conduction efficiency of the heat generated from the heater 33 can be improved. In addition, water can be prevented from entering the inside of the heater pin 30 due to the voids. In addition, the structural stability of the heater assembly can be improved.

[0067] Reference Fig.13 and Fig.14 , the step of reducing bubbles 363 in the liquid bonding material 361 may include exhausting the bonding material 361 through the ultrasonic vibration generator 62, 62' (S120). The method of manufacturing the aerosol generating device may include: injecting the bonding material 361 into the heater pin 30 (S12); exhausting the bonding material 361 through the ultrasonic vibration generator 62, 62' (S120); inserting the heater 33 into the heater pin 30 (S22); drying the bonding material 361 (S32); and combining the heater pin 30 and the pipe 20 together (S42).

[0068] In one example, exhausting the bonding material 361 by the ultrasonic vibration generator 62, 62' (S120) may be performed after injecting the liquid bonding material 361 into the heater pin 30 (S12). In another example, exhausting the bonding material 361 by the ultrasonic vibration generator 62, 62' (S120) may be performed after injecting the liquid bonding material 361 into the heater pin 30 (S12) and inserting the heater 33 into the heater pin 30 (S22).

[0069] In one embodiment, the first ultrasonic vibration generator 62 may be configured to ultrasonically vibrate the bonding material 361 by inserting a vibrating rod 622 in the shape of a thin and long strip into the liquid bonding material 361. Fig.13 Here, exhausting the bonding material 361 by the ultrasonic vibration generator 62 ( S120 ) may be performed before inserting the heater 33 into the heater pin 30 ( S22 ).

[0070] In another embodiment, the second ultrasonic vibration generator 62' may be configured to receive the heater pin 30 therein so as to ultrasonically vibrate the heater pin 30 ( Fig.13 (b)). This is merely an example, and the form or type of the ultrasonic vibration generator 62, 62' is not limited thereto, and other forms may be used as long as the bonding material 361 is ultrasonically vibrated.

[0071] Therefore, the formation of voids that may occur when the bubbles 363 of the bonding material 361 are not removed and hardened inside the heater pin 30 can be reduced, and the conduction efficiency of the heat generated from the heater 33 can be improved. In addition, water can be prevented from entering the inside of the heater pin 30 due to the voids. In addition, the structural stability of the heater assembly can be improved.

[0072] Alternatively, the second ultrasonic vibration generator 62' and the reduced pressure dryer 61 may be included in a single device, which may be referred to as an ultrasonic reduced pressure dryer. The ultrasonic reduced pressure dryer may be configured to accommodate the heater pin 30 therein. By using the ultrasonic reduced pressure dryer, the following steps may be performed simultaneously: ultrasonically vibrating the bonding material 361 in the heater pin 30; exhausting bubbles in the bonding material 361 by reducing the internal pressure; and drying the bonding material 361. Therefore, the manufacturing process may be shorter and more efficient.

[0073] Reference Fig.15 and Fig.16 , the step of reducing the air bubbles 363 in the liquid bonding material 361 may be performed in the step of injecting the bonding material 361. The air bubbles 363 in the bonding material 361 may be reduced depending on how the bonding material 361 is injected.

[0074] In the step of reducing the bubbles 363 in the liquid bonding material 361, the bonding material 361 may be injected by inserting the nozzle 511 into the cavity 34 in the heater pin 30 in such a manner as to discharge the bonding material 361 (S13). Here, the nozzle 511 may be raised while discharging the bonding material 361 in accordance with the height of the bonding material 361 increased by the injection of the bonding material 361 (S13) (see Fig.15 (a), (b) and (c)).

[0075] The method of manufacturing an aerosol generating device may include injecting a bonding material 361 into a heater pin 30 while raising a nozzle 511 (S13); inserting a heater 33 into the heater pin 30 (S23); drying the bonding material 361 (S33); and bonding the heater pin 30 and the pipe 20 together (S43).

[0076] In the process (S13) of raising the nozzle 511 while injecting the bonding material 361 into the heater pin 30, the nozzle 511 may be raised corresponding to the height of the bonding material 361 while discharging the bonding material 361. Here, the height of the bonding material 361 and the height of the end of the nozzle 511 may correspond to each other.

[0077] Therefore, when the bonding material 361 is ejected from the nozzle 511, the amount of bubbles 363 formed in the bonding material 361 can be reduced. Therefore, the formation of voids that may occur when the bubbles 363 of the bonding material 361 are not removed and hardened inside the heater pin 30 can be reduced, and the conduction efficiency of heat generated from the heater 33 can be improved. In addition, water can be prevented from entering the inside of the heater pin 30 due to the void. In addition, the structural stability of the heater assembly can be improved.

[0078] Reference Fig.17 and Fig.18 , the step of reducing the bubbles 363 in the bonding material 361 in a liquid state may be performed in the step of inserting the heater 33. The bubbles 363 in the bonding material 361 may be reduced depending on how the heater 33 is inserted into the bonding material 361.

[0079] The method of manufacturing an aerosol generating device may include: injecting a bonding material 361 into a heater pin 30 (S14); inserting a heater 33 into the heater pin 30 by slowly rotating the heater 33 (S24); drying the bonding material 361 (S34); and bonding the heater pin 30 and the pipe 20 together (S44).

[0080] Inserting the heater 33 into the heater pin 30 by rotating the heater 33 (S24) may be performed by inserting while rotating the heater 33 and the support bar 332 in the direction in which the heater 33 is wound. When the heater 33 and the support bar 332 are inserted into the bonding material 361 without being rotated, an air layer may be formed between the bonding material 361 in the cavity 33 and the heater 33 and the support bar 332 at the time of insertion, resulting in the formation of bubbles 363 in the bonding material 361.

[0081] Since the heater 33 is wound in a spiral shape, when the heater 33 is inserted into the bonding material 361 while rotating in the direction in which the heater 33 is wound, the liquid bonding material 361 can flow upward in a spiral along the coil-shaped heater 33, thereby reducing the formation of an air layer. In addition, the formation of bubbles between the coils can be reduced. For the rotatable insertion of the heater 33, the heater 33 and the support bar 332 can be held and rotated by the rotating mechanism 64 to insert the heater 33 and the support bar 332 into the bonding material 261.

[0082] In addition, when the heater 33 is inserted at a high speed, bubbles 363 may be generated due to collision between the bonding material 361 and the heater 33 or between the bonding material 361 and the support bar 332. Therefore, the heater 33 may be slowly inserted at a speed that does not cause bubbles 363 to be formed in the bonding material 361. The speed that does not cause the formation of bubbles 363 may vary according to the size or shape of the support bar 332 and the heater 33 and the property or amount of the bonding material 361. An appropriate speed may be measured by experiment. For example, the speed that does not cause the formation of bubbles 363 may be a speed at which the generated bubbles 363 are less than 2% of the volume of the bonding material 361.

[0083] Therefore, the formation of bubbles between the coils caused when the liquid bonding material 361 flows upward along the coil-shaped heater 33 can be reduced. Therefore, the formation of voids that may occur when the bubbles 363 of the bonding material 361 are not removed and hardened inside the heater pin 30 can be reduced, and the conduction efficiency of the heat generated from the heater 33 can be improved. In addition, water can be prevented from entering the inside of the heater pin 30 due to the void. In addition, the structural stability of the heater assembly can be improved.

[0084] Reference Fig.19 and Fig. 20 , the surface tension of a liquid can change with temperature, and the surface tension of a liquid can decrease as the temperature of the liquid increases. The surface tension can determine the size of the bubbles. The relationship between the size of the bubbles in the liquid and the surface tension can be expressed by the following formula: P i -P O =4σ / r(P i : Pressure inside the bubble, PO : pressure outside the bubble, σ: surface tension, and r: radius of the bubble) That is, the surface tension of a liquid decreases as the temperature of the liquid increases, and the size of bubbles in the liquid may decrease as the surface tension decreases.

[0085] In order to reduce the bubbles 363 in the bonding material 361, the method of manufacturing the aerosol generating device may directly or indirectly increase the temperature of the bonding material 361. The method of manufacturing the aerosol generating device may include heating the bonding material 361 and / or the heater pin 30 to a predetermined temperature (S150). The method of manufacturing the aerosol generating device may include: injecting the bonding material 361 into the heater pin 30 (S15); inserting the heater 33 into the heater pin 30 (S25); drying the bonding material 361 (S35); and bonding the heater pin 30 and the pipe 20 together (S45).

[0086] Heating the bonding material 361 and / or the heater pin 30 to a predetermined temperature (S150) may be performed before drying the bonding material 361 (S35). In one example, heating the bonding material 361 and / or the heater pin 30 to a predetermined temperature (S150) may be performed before or after injecting the bonding material 361 into the heater pin 30 (S15). In another example, heating the bonding material 361 and / or the heater pin 30 to a predetermined temperature (S150) may be performed after inserting the heater 33 into the heater pin 30 (S25). For example, heating the bonding material 361 and / or the heater pin 30 to a predetermined temperature (S150) may be performed by placing the heater pin 30 into which the bonding material 361 is injected in a temperature chamber and heating it. However, the present disclosure is not limited thereto.

[0087] Therefore, the formation of voids that may occur when the bubbles 363 of the bonding material 361 are not removed and hardened within the heater pin 30 can be reduced, and the conduction efficiency of the heat generated from the heater 33 can be improved. In addition, water can be prevented from entering the inside of the heater pin 30 due to the voids. In addition, the structural stability of the heater assembly can be improved.

[0088] Reference Figures 1 to 20 According to one aspect of the present disclosure, there is provided a method of manufacturing an aerosol generating device, the aerosol generating device comprising a heater inserted into an elongated heater pin. The method comprises: injecting a liquid bonding material into a cavity of the heater pin; inserting the heater into the cavity; reducing bubbles in the bonding material while the bonding material is still in a liquid state; and curing the bonding material into a solid state to fix the heater in the heater pin.

[0089] The step of reducing bubbles may include degassing the bonding material using a pressure reducer.

[0090] The method also includes reducing the pressure above the bonding material using a pressure reducer to allow air bubbles to escape from the interior of the bonding material.

[0091] The decompressor may be a decompressor dryer configured to both reduce bubbles and cure the bonding material into a solid state.

[0092] The step of reducing bubbles may include degassing the bonding material using an ultrasonic vibration generator.

[0093] The ultrasonic vibration generator may be configured to induce ultrasonic vibration in the bonding material via an elongated vibration rod inserted into the bonding material.

[0094] The ultrasonic vibration generator may be configured to receive the heater pin therein to ultrasonically vibrate the heater pin.

[0095] The step of reducing bubbles may include degassing the bonding material using an ultrasonic reduced-pressure dryer including an ultrasonic vibration generator and a reduced-pressure dryer.

[0096] The step of injecting the bonding material includes injecting the bonding material by inserting a nozzle of an elongated syringe into the cavity of the heater pin to reduce air bubbles.

[0097] The bonding material is injected into the cavity while the nozzle is raised corresponding to the height of the bonding material which is raised along with the injection of the bonding material.

[0098] The nozzle may be gradually raised so that when the bonding material is injected, the end of the nozzle matches the height of the bonding material.

[0099] The heater may be wrapped around an elongated support strip inserted into the cavity.

[0100] The inserting of the heater may include reducing bubbles by inserting the heater into the bonding material while rotating the heater in a direction in which the heater is wound around the support bar.

[0101] The heater may be inserted into the bonding material at a rate that does not cause bubbles to form in the bonding material.

[0102] The method may further include heating at least one of the heater pin and the bonding material to a predetermined temperature.

[0103] The above-mentioned certain embodiments or other embodiments of the present disclosure are not mutually exclusive or different from each other.Any or all elements of the above-mentioned embodiments of the present disclosure can be combined with each other or can be combined with each other in structure or function.

[0104] For example, the configuration "A" described in one embodiment and the drawings of the present disclosure and the configuration "B" described in another embodiment and the drawings of the present disclosure may be combined with each other. That is, although the combination between the configurations is not directly described, the combination is possible except for the case where the impossible combination is described.

[0105] Although the embodiments have been described with reference to a number of illustrative embodiments thereof, it will be appreciated that numerous other variations and embodiments may be devised by those skilled in the art which will fall within the scope of the principles of the present disclosure. More specifically, various changes and modifications may be made to the component parts and / or arrangements of the subject combination arrangement within the scope of the present disclosure, the drawings, and the appended claims. In addition to changes and modifications to the component parts and / or arrangements, alternative uses will also be readily apparent to those skilled in the art.

Claims

1. A method of manufacturing an aerosol generating device, the aerosol generating device comprising a heater inserted into an elongated heater pin, the method comprising: injecting a liquid bonding material into the cavity of the heater pin; inserting the heater into the cavity; reducing air bubbles in the bonding material while the bonding material is still in a liquid state; as well as The bonding material is cured into a solid state to secure the heater in the heater pin.

2. The method according to claim 1, wherein: The step of reducing bubbles includes: exhausting the bonding material using a pressure reducer.

3. The method according to claim 2, further comprising: The pressure above the bonding material is reduced using the pressure reducer to allow air bubbles to escape from the interior of the bonding material.

4. The method according to claim 3, wherein: The decompressor is a decompression dryer configured to both reduce the bubbles and cure the bonding material into a solid state.

5. The method according to claim 1, wherein: The step of reducing bubbles includes: exhausting the bonding material using an ultrasonic vibration generator.

6. The method according to claim 5, wherein: The ultrasonic vibration generator is configured to induce ultrasonic vibration in the bonding material via an elongated vibration rod inserted into the bonding material.

7. The method according to claim 5, wherein: The ultrasonic vibration generator is configured to receive the heater pin therein to ultrasonically vibrate the heater pin.

8. The method according to claim 1, wherein: Steps to reduce bubbles include: The bonding material is degassed using an ultrasonic reduced-pressure dryer including an ultrasonic vibration generator and a reduced-pressure dryer.

9. The method according to claim 1, wherein: The step of injecting the bonding material includes injecting the bonding material to reduce air bubbles by inserting a nozzle of an elongated syringe into the cavity of the heater pin.

10. The method according to claim 9, wherein: The bonding material is injected into the cavity while the nozzle is raised corresponding to the height of the bonding material which is raised along with the injection of the bonding material.

11. The method according to claim 10, wherein: The nozzle is gradually raised so that the end of the nozzle matches the height of the bonding material when the bonding material is injected.

12. The method according to claim 1, wherein: The heater is wrapped around an elongated support strip inserted into the cavity.

13. The method according to claim 12, wherein: The step of inserting the heater includes reducing bubbles by inserting the heater into the bonding material while rotating the heater in a direction in which the heater is wound around the support bar.

14. The method according to claim 12, wherein: The heater is inserted into the bonding material at a speed that does not cause bubbles to form in the bonding material.

15. The method according to claim 1, further comprising: At least one of the heater pin and the bonding material is heated to a predetermined temperature.

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