Ultrasonic probe, ultrasonic imaging system and preparation method

Abstract

The invention discloses an ultrasonic probe, an ultrasonic imaging system and a preparation method, the ultrasonic probe comprises a transducer assembly, and the transducer assembly comprises a matching layer; the piezoelectric layer is provided with a first surface and a second surface which are opposite to each other, the second surface of the piezoelectric layer is connected to the matching layer, and the piezoelectric layer comprises a plurality of array elements arranged in an array; the flexible circuit board comprises an insulating substrate and a plurality of conductive parts, the insulating substrate is connected to the first face of the piezoelectric layer, and the conductive parts are arranged on the side, facing the piezoelectric layer, of the insulating substrate; the backing is connected to one side, back to the piezoelectric layer, of the insulating substrate; the conductive adhesive is used for bonding the insulating substrate and the piezoelectric layer, the conductive adhesive comprises a plurality of conductive particles, and the conductive particles are used for conducting the array elements and the conductive parts; and the accommodating structure is used for accommodating the conductive particles and limiting the movement of the conductive particles, and the first surface of each array element is provided with the accommodating structure, so that the first surface of each array element is correspondingly conducted with one conductive part, and the conduction rate of the array element is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of medical equipment, and in particular to an ultrasonic probe, an ultrasonic imaging system and a preparation method thereof. Background Art

[0002] In medical ultrasound imaging systems, ultrasound probes are used to transmit ultrasound waves and receive echoes containing information about human tissue. When an array element fails to connect, the quality of the scanned image will deteriorate.

[0003] However, the area array probe has thousands of array elements and a very small area. Therefore, it is extremely difficult to make electrical connections between the array elements of the transducer of the area array probe and the flexible printed circuit board, and it is difficult to achieve a high conductivity. Summary of the invention

[0004] In view of this, the present invention proposes an ultrasonic probe, an ultrasonic imaging system and a preparation method thereof.

[0005] A first aspect of the present invention provides an ultrasound probe, comprising a transducer assembly, wherein the transducer assembly comprises:

[0006] Matching layer;

[0007] A piezoelectric layer having a first surface and a second surface opposite to each other, wherein the second surface of the piezoelectric layer is connected to the matching layer, and the piezoelectric layer comprises a plurality of array elements arranged in an array;

[0008] A flexible circuit board, comprising an insulating substrate and a plurality of conductive parts, wherein the insulating substrate is connected to a first surface of the piezoelectric layer, and the plurality of conductive parts are arranged on a side of the insulating substrate facing the piezoelectric layer;

[0009] A backing connected to a side of the insulating substrate facing away from the piezoelectric layer;

[0010] Conductive adhesive, used for bonding the insulating substrate and the piezoelectric layer, the conductive adhesive comprising a plurality of conductive particles, the conductive particles being used for conducting the array element and the conductive part;

[0011] The accommodating structure is used to accommodate the conductive particles and limit the movement of the conductive particles. The first surface of each array element is provided with the accommodating structure so that the first surface of each array element is connected to a corresponding conductive part.

[0012] A second aspect of the present invention provides an ultrasound probe, comprising a transducer assembly, wherein the transducer assembly comprises:

[0013] Matching layer;

[0014] A piezoelectric layer having a first surface and a second surface opposite to each other, wherein the second surface of the piezoelectric layer is connected to the matching layer, and the piezoelectric layer comprises a plurality of array elements arranged in an array;

[0015] At least one conductive material layer connected to the first surface of the piezoelectric layer and conductively connected to the plurality of array elements;

[0016] A flexible circuit board, comprising an insulating substrate and a plurality of conductive parts, wherein the insulating substrate is connected to a side of the conductive material layer facing away from the piezoelectric layer, the plurality of conductive parts are arranged on a side of the insulating substrate facing the piezoelectric layer, the conductive material layer has a plurality of conductive areas, each of the conductive areas corresponds to one of the array elements and one of the conductive parts;

[0017] A backing connected to a side of the insulating substrate facing away from the piezoelectric layer;

[0018] Conductive adhesive, used for bonding the insulating substrate and the piezoelectric layer, the conductive adhesive comprising a plurality of conductive particles, the conductive particles being used for conducting the array element and the conductive part;

[0019] The accommodating structure is used to accommodate the conductive particles and limit the movement of the conductive particles. Each conductive area of ​​the conductive material layer is provided with the accommodating structure so that the first surface of each array element is connected to a corresponding conductive part.

[0020] A third aspect of the present invention provides an ultrasound probe, comprising a transducer assembly, wherein the transducer assembly comprises:

[0021] Matching layer;

[0022] A piezoelectric layer having a first surface and a second surface opposite to each other, wherein the second surface of the piezoelectric layer is connected to the matching layer, and the piezoelectric layer comprises a plurality of array elements arranged in an array;

[0023] A flexible circuit board, comprising an insulating substrate and a plurality of conductive parts, wherein the insulating substrate is connected to a first surface of the piezoelectric layer, and the plurality of conductive parts are arranged on a side of the insulating substrate facing the piezoelectric layer;

[0024] A backing connected to a side of the insulating substrate facing away from the piezoelectric layer;

[0025] Conductive adhesive, used for bonding the insulating substrate and the piezoelectric layer, the conductive adhesive comprising a plurality of conductive particles, the conductive particles being used for conducting the array element and the conductive part;

[0026] The accommodating structure is used to accommodate the conductive particles and limit the movement of the conductive particles. Each conductive part is provided with the accommodating structure so that the first surface of each array element is connected to a corresponding conductive part.

[0027] A fourth aspect of the present invention provides a method for processing an ultrasonic probe, comprising:

[0028] Cutting the first surface of each of the array elements to form the accommodating structure;

[0029] Repeatedly coating the conductive glue containing the conductive particles, and performing scraping to make the conductive particles sink into the accommodating structure, until the conductive particles are distributed on the first surface of all the array elements;

[0030] The flexible circuit board is pressed and aligned through the position identification points, and the pressed piezoelectric layer and the flexible circuit board are transferred to a preset temperature position for curing to complete the bonding.

[0031] The fifth aspect of the present invention proposes an ultrasonic imaging system, comprising a host, a display and the above-mentioned ultrasonic probe, wherein the display and the ultrasonic probe are electrically connected to the host, the ultrasonic probe is used to send ultrasonic waves to the operating object and receive ultrasonic echoes, the host is used to process the ultrasonic echoes and generate ultrasonic images, and the display is used to display the ultrasonic images.

[0032] It can be seen from the above technical solutions that the ultrasonic probe proposed in the present invention utilizes the characteristic that conductive particles can process electrical connections with narrower spacing in batches, which can effectively improve the conduction effect, so as to achieve conduction between the first surfaces of multiple array elements and multiple conductive parts respectively. By setting the accommodating structure, the conductive particles can be stabilized on the first surface of the array element, so that the conductive particles are evenly distributed, so that the first surface of each of the array elements is connected to one of the conductive parts, thereby improving the conductivity of the array element. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained like these accompanying drawings without paying any creative work.

[0034] Figure 1 This is an exploded schematic diagram of the ultrasonic probe proposed in an embodiment of the present application.

[0035] Figure 2 This is a schematic diagram of the transducer assembly of an embodiment of the present application using conductive adhesive to bond a flexible circuit board and a piezoelectric layer.

[0036] Figure 3 This is a schematic diagram of the conductive particles being confined in the accommodating structure after the piezoelectric layer is repeatedly coated with conductive glue according to an embodiment of the present application.

[0037] Figure 4 This is a schematic diagram of a structure in which the flexible circuit board and the piezoelectric layer are connected to each other through conductive particles according to an embodiment of the present application. In the figure, the accommodating structure is arranged on the first surface of the array element of the piezoelectric layer.

[0038] Figure 5 This is a schematic structural diagram of a conductive material layer provided between the flexible circuit board and the piezoelectric layer of an embodiment of the present application, in which the accommodation structure is provided on the conductive material layer.

[0039] Figure 6 This is a schematic diagram of a structure in which the flexible circuit board and the piezoelectric layer are connected to each other through conductive particles in an embodiment of the present application. In the figure, the accommodation structure is arranged on the conductive part of the flexible circuit board.

[0040] Figure 7 This is a schematic diagram of the first surface of an array element provided with a groove proposed in an embodiment of the present application.

[0041] Figure 8 This is a schematic diagram of the first surface of an array element provided with a blind hole proposed in an embodiment of the present application.

[0042] Fig. 9 This is a structural block diagram of the ultrasound imaging system proposed in an embodiment of the present application.

[0043] Description of reference numerals:

[0044] 100, ultrasonic probe; 10, transducer assembly; 11, matching layer; 12, piezoelectric layer; 12a, array element; 121, first surface; 1211, bonding area; 122, second surface; 13, flexible circuit board; 131, insulating substrate; 132, conductive part; 14, backing; 15, conductive adhesive; 151, conductive particles; 16, accommodating structure; 161, groove; 1611, first side wall; 1612, second side wall; 162, blind hole; 17, conductive material layer; 171, conductive area; 20, housing; 30, lens; 1000, ultrasonic imaging system; 200, host; 300, display. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0047] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0048] See also Figure 1-Figure 3 As shown, the embodiment of the present application proposes an ultrasonic probe 100, including a transducer assembly 10, the transducer assembly 10 includes a matching layer 11, a piezoelectric layer 12, a flexible circuit board 13, a backing 14, a conductive adhesive 15 and a containing structure 16. The piezoelectric layer 12 has a first surface 121 and a second surface 122 opposite to each other, the second surface 122 of the piezoelectric layer 12 is connected to the matching layer 11, and the piezoelectric layer 12 includes a plurality of array elements 12a arranged in an array; the flexible circuit board 13 includes an insulating substrate 131 and a plurality of conductive parts 132, the conductive parts 132 may be pads provided on the insulating substrate 131, the insulating substrate 131 is connected to the first surface 121 of the piezoelectric layer 12, and the plurality of conductive parts 132 are provided on the side of the insulating substrate 131 facing the piezoelectric layer 12; the backing 14 connected to the side of the insulating substrate 131 facing away from the piezoelectric layer 12; the conductive glue 15 is used to bond the insulating substrate 131 and the piezoelectric layer 12, and the conductive glue 15 includes a plurality of conductive particles 151, and the conductive particles 151 are used to provide electrical connection between the array element 12a and the conductive portion 132; the accommodating structure 16 is used to accommodate the conductive particles 151 and limit the movement of the conductive particles 151, and the first surface 121 of each array element 12a is provided with the accommodating structure 16 so that the first surface 121 of each array element 12a is correspondingly connected to a conductive portion 132.

[0049] The ultrasonic probe 100 of the embodiment of the present application utilizes the characteristic that the conductive particles 151 can process the electrical connection with narrower spacing in batches, and can effectively improve the conduction effect, so as to realize the conduction between the first surfaces 121 of multiple array elements 12a and the multiple conductive parts 132. Since the distribution of the conductive particles 151 cannot be uniformly controlled during the electrical connection process, the situation of non-conduction or parallel connection is accommodated, and the flatness of the bonding surface is extremely high. Therefore, the embodiment of the present application can stabilize the conductive particles 151 on the first surface 121 of the array element 12a through the arrangement of the accommodation structure 16, realize the position limitation of the conductive particles 151, make the conductive particles 151 evenly distributed, reduce the requirements for the flatness of the array element 12a, and enhance the bonding strength, so that the first surface 121 of each array element 12a is connected to a conductive part 132, improve the conductivity of the array element 12a, and thus improve the conductivity between the array element 12a and the flexible circuit board 13.

[0050] In specific applications, the piezoelectric layer 12 may include thousands of array elements 12a arranged in an array to form a planar array probe. The planar array probe can provide 4D imaging and has significant application advantages in ultrasonic imaging. However, the number of array elements in a planar array probe is dozens of times that of a conventional probe, and the size of the array elements is also very small, only a few tens of times that of a conventional probe (linear array probe). Therefore, extremely high requirements are placed on the interconnection technology of the array elements, which is also one of the current problems in the industry. The embodiment of the present application can achieve the limitation of the conductive particles 151 by setting the accommodating structure 16, so that the conductive particles 151 are evenly distributed, the conductivity of the array elements 12a is improved, and the conductivity between the array elements 12a and the flexible circuit board 13 is improved.

[0051] As an embodiment, the first surface 121 can be the positive surface of the piezoelectric layer 12, and the second surface 122 can be the negative surface of the piezoelectric layer 12, that is, the negative surface of the piezoelectric layer 12 is connected to the matching layer 11, and the positive surface of the piezoelectric layer 12 is connected to the insulating substrate 131.

[0052] As another embodiment, the first surface 121 can also be the negative electrode surface of the piezoelectric layer 12, and the second surface 122 can be the positive electrode surface of the piezoelectric layer 12, that is, the positive electrode surface of the piezoelectric layer 12 is connected to the matching layer 11, and the negative electrode surface of the piezoelectric layer 12 is connected to the insulating substrate 131.

[0053] In some embodiments, Figure 1 As shown, the ultrasound probe 100 further includes a housing 20, the housing 20 encloses a receiving space, the transducer assembly 10 is connected to the housing 20, and at least a portion of the transducer assembly 10 is received in the receiving space. Exemplarily, the matching layer 11, the piezoelectric layer 12, the flexible circuit board 13 and the backing 14 are all received in the receiving space.

[0054] In some embodiments, Figure 1 As shown, the ultrasound probe 100 also includes a lens 30, which is connected to the housing 20 or the transducer assembly 10. The lens 30 is arranged on the side of the transducer assembly 10 facing the object to be scanned. In the working state, the lens 30 is located between the transducer assembly 10 and the object to be scanned.

[0055] When the ultrasonic probe 100 is in use, the ultrasonic waves emitted by the transducer assembly 10 pass through the lens 30 to reach the object to be scanned. Due to the effect of the lens 30, the distance between the transducer assembly 10 and the object to be scanned is raised, so that the ultrasonic waves can be focused on the superficial surface of the object to be scanned, thereby achieving the requirement of superficial tissue imaging.

[0056] In some embodiments, Figure 2 and Figure 3As shown, the first surface 121 of each array element 12a has a bonding area 1211 opposite to the conductive portion 132, and each array element 12a is provided with a receiving structure 16 at least in the bonding area 1211. In this embodiment, in order to ensure that the first surface 121 of the array element 12a can be electrically connected to the conductive portion 132, the receiving structure 16 is provided at least in the bonding area 1211 opposite to the conductive portion 132. Optionally, the bonding area 1211 can be the central area of ​​the first surface 121 of the array element 12a, so that at least the central area of ​​the array element 12a can be electrically connected to the conductive portion 132.

[0057] Of course, the area where the accommodation structure 16 is disposed may also cover the entire area or other partial area of ​​the first surface 121 of the array element 12 a , as long as the conductive particles 151 are stabilized so that the array element 12 a and the conductive portion 132 are electrically connected.

[0058] In some embodiments, the conductive particles 151 are spherical. In this embodiment, the conductive particles 151 can be anisotropic conductive particles, that is, resin microspheres with gold-plated surfaces, which can effectively improve the conduction effect. Among them, anisotropic conductive particles are a composite material composed of polymer particles as a core and a metal coating as a shell, and have the function of unidirectional conductivity, that is, they are conductive only in the Z-axis direction, that is, in the direction perpendicular to the first surface 121 of the array element 12a; the X-axis and Y-axis directions, that is, the two directions parallel to the first surface 121 of the array element 12a and perpendicular to each other, are not conductive. Compared with traditional lead-tin soldering, anisotropic conductive particles can batch process narrower spacing electrical connections.

[0059] In an optional embodiment, the conductive adhesive 15 can be prepared by mixing a suitable base adhesive with the conductive particles 151, which has wide applicability, high bonding strength, and good reliability. Since the particle distribution cannot be uniformly controlled, it is easy to have non-conduction or parallel connection, and the flatness of the bonding surface is required to be high. Therefore, the embodiment of the present application uses a receiving structure 16 to limit the conductive particles 151 to ensure the conduction between the array element 12a and the conductive part 132.

[0060] Of course, in other embodiments, the conductive adhesive 15 may also be an anisotropic conductive adhesive film, and the conductivity and binding strength may also be further enhanced through the limiting effect of the accommodating structure 16 .

[0061] As an implementation method, Figure 2-Figure 4As shown, the accommodating structure 16 includes a groove 161 formed on the first surface 121 of the array element 12a. The arrangement of the groove 161 not only accommodates the conductive particles 151 to limit the conductive particles 151 from being separated from the first surface 121 of the array element 12a, thereby facilitating the conduction between the array element 12a and the conductive portion 132 through the conductive particles 151, but also has simple manufacturing, precise positioning, good consistency, and greatly reduces the difficulty of the process operation of bonding the conductive particles 151. In addition, the arrangement of the groove 161 also increases the bonding surface area, thereby increasing the pull-out force of the binding structure, that is, enhancing the binding strength.

[0062] In an optional embodiment, the number of grooves 161 on the first surface 121 of each array element 12a can be multiple, and the multiple grooves 161 can be arranged in an array to increase the layout area of ​​the grooves 161, so as to accommodate more conductive particles 151 and improve the conductive effect of the array element 12a and the conductive part 132.

[0063] In an alternative embodiment, if Figure 7 As shown, there are two grooves 161 on the first surface 121 of each array element 12a, and the two grooves 161 are arranged crosswise. In this embodiment, the arrangement structure of the two grooves 161 is simple and convenient for processing, and can cover the first surface 121 of the array element 12a from two directions to improve the conductive effect between the array element 12a and the conductive part 132.

[0064] In an optional embodiment, the two grooves 161 are arranged orthogonally to form a cross-shaped structure, which has a simple structure, is easy to process, and reduces processing costs. Of course, the angle between the two grooves 161 can also be less than or greater than 90°.

[0065] It is understandable that in other embodiments, the number of the grooves 161 is not limited to two, but may be one, three or even more. The arrangement of the plurality of grooves 161 is not limited to a cross arrangement, but may be a plurality of grooves 161 arranged in a plurality of rows along the front-to-back direction of the array element 12a, a plurality of grooves 161 arranged in a plurality of columns along the left-to-right direction of the array element 12a, or a plurality of rows of grooves 161 and a plurality of columns of grooves 161 arranged crosswise.

[0066] Of course, the groove 161 can also be arranged to be inclined or curved, such as forming a regular or irregular shape such as an S-shape or a Z-shape, so as to limit the conductive particles 151 .

[0067] In some embodiments, the depth of the groove 161 in the first direction is smaller than the diameter of the conductive particle 151, and the first direction is perpendicular to the first surface 121 of the array element 12a. In this embodiment, the first direction is also the height direction of the array element 12a, and the depth of the groove 161 is set to be smaller than the diameter of the conductive particle 151, so that the conductive particle 151 can be exposed from the first surface 121 of the array element 12a, thereby facilitating contact and conduction with the conductive portion 132.

[0068] In some embodiments, the depth of the groove 161 in the first direction is 1 μm-20 μm. In this embodiment, if the depth of the groove 161 is less than 1 μm, the portion of the conductive particle 151 that is sunk into the groove 161 is too small, which will affect the limiting effect of the conductive particle 151, making it easy for the conductive particle 151 to slide out of the groove 161. If the depth of the groove 161 is greater than 20 μm, the portion of the conductive particle 151 that can be exposed from the first surface 121 of the array element 12a is too small, which will affect the contact and conduction with the conductive part 132. Therefore, limiting the depth of the groove 161 in the first direction to within the range of 1 μm-20 μm can ensure that the conductive particle 151 can be confined in the groove 161 to prevent movement, and can also avoid affecting the contact and conduction between the conductive particle 151 and the conductive part 132.

[0069] Exemplarily, the depth of groove 161 in the first direction may be 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10m, 11μm, 12μm, 13m, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm or 20μm, etc.

[0070] In some embodiments, the depth of the groove 161 in the first direction is 30%-80% of the diameter of the conductive particle 151. In this embodiment, if the depth of the groove 161 is less than 30% of the diameter of the conductive particle 151, the portion of the conductive particle 151 that is sunk into the groove 161 is too small, which will affect the limiting effect of the conductive particle 151, making it easy for the conductive particle 151 to slide out of the groove 161. If the depth of the groove 161 is greater than 80% of the diameter of the conductive particle 151, the portion of the conductive particle 151 that can be exposed from the first surface 121 of the array element 12a is too small, which will affect the contact and conduction with the conductive part 132. Therefore, limiting the depth of the groove 161 in the first direction to within the range of 30%-80% of the diameter of the conductive particle 151 can ensure that the conductive particle 151 can be confined in the groove 161 to prevent movement, and can also avoid affecting the contact and conduction between the conductive particle 151 and the conductive part 132.

[0071] Exemplarily, the depth of the groove 161 in the first direction may be 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75% or 80% of the diameter of the conductive particle 151 .

[0072] In some embodiments, the groove 161 has a second direction and a third direction parallel to the first surface 121 of the array element 12a, the groove 161 extends along the second direction, the width of the groove 161 in the third direction is 2 μm-30 μm, and the second direction and the third direction are perpendicular to each other. Figure 7 As shown, the groove 161 includes a first side wall 1611 and a second side wall 1612 that are arranged opposite to each other in the third direction, and the width of the groove 161 in the third direction, that is, the distance between the first side wall 1611 and the second side wall 1612 is 2μm-30μm. In this embodiment, if the width of the groove 161 is less than 2μm, it is difficult for the conductive particles 151 to enter the groove 161, and if the width of the groove 161 is greater than 30μm, a large gap will be left between the conductive particles 151 and the inner wall of the groove 161, thereby affecting the limiting effect of the conductive particles 151. Therefore, the width of the groove 161 is limited to the range of 2μm-30μm, ensuring that the conductive particles 151 can be confined in the groove 161, thereby ensuring the conduction between the array element 12a and the conductive part 132.

[0073] Exemplarily, the width of the groove 161 in the third direction can be 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10m, 11μm, 12μm, 13m, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, 21μm, 22μm, 23m, 24μm, 25μm, 26μm, 27μm, 28μm, 29μm or 30μm, etc.

[0074] Among them, Figure 7 As shown, the second direction is the extension direction of the groove 161, and the third direction is the width direction of the groove 161. When the groove 161 extends along the front-to-back direction of the array element 12a, the second direction is the front-to-back direction, and the third direction is the left-to-right direction. When the groove 161 extends along the left-to-right direction of the array element 12a, the second direction is the left-to-right direction, and the third direction is the front-to-back direction.

[0075] Exemplarily, when there are two grooves 161 and the two grooves 161 are arranged orthogonally, one groove 161 extends in the front-to-back direction and its width in the left-to-right direction is 2μm-30μm, and the other groove 161 extends in the left-to-right direction and its width in the front-to-back direction is 2μm-30μm.

[0076] In some embodiments, the groove 161 has a second direction and a third direction parallel to the first surface 121 of the array element 12a, the groove 161 extends along the second direction, the width of the groove 161 in the third direction is 50%-150% of the diameter of the conductive particle 151, and the second direction and the third direction are perpendicular to each other. Specifically, Figure 7 As shown, the groove 161 includes a first side wall 1611 and a second side wall 1612 which are arranged opposite to each other in the third direction, and the width of the groove 161 in the third direction, that is, the distance between the first side wall 1611 and the second side wall 1612 is 50%-150% of the diameter of the conductive particle 151. In this embodiment, if the width of the groove 161 is less than 50% of the diameter of the conductive particle 151, it is difficult for the conductive particle 151 to enter the groove 161, and if the width of the groove 161 is greater than 150% of the diameter of the conductive particle 151, a large gap will be left between the conductive particle 151 and the inner wall of the groove 161, thereby affecting the limiting effect of the conductive particle 151. Therefore, the width of the groove 161 is limited to the range of 50%-150% of the diameter of the conductive particle 151, so as to ensure that the conductive particle 151 can be confined in the groove 161, thereby ensuring the conduction between the array element 12a and the conductive part 132.

[0077] Exemplarily, the width of the groove 161 in the third direction can be adjusted based on the diameter of the conductive particle 151, and can be 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 100%, 110%, 120%, 130%, 140% or 150% of the diameter of the conductive particle 151, etc.

[0078] Exemplarily, when there are two grooves 161 and the two grooves 161 are arranged orthogonally, one of the grooves 161 extends in the front-to-back direction, and its width in the left-to-right direction is 50%-150% of the diameter of the conductive particle 151, and the other groove 161 extends in the left-to-right direction, and its width in the front-to-back direction is 50%-150% of the diameter of the conductive particle 151.

[0079] Of course, the accommodating structure 16 is not limited to the form of the groove 161, and may also be other structures capable of limiting the conductive particles 151. For example, as another implementation, Figure 8 As shown, the accommodating structure 16 includes a blind hole 162 formed on the first surface 121 of the array element 12a. The blind hole 162 can also accommodate the conductive particles 151 to limit the conductive particles 151 from leaving the first surface 121 of the array element 12a, thereby facilitating the conduction between the array element 12a and the conductive portion 132 through the conductive particles 151.

[0080] In an optional embodiment, the number of blind holes 162 on the first surface 121 of each array element 12a can be multiple, and the multiple blind holes 162 can be arranged in an array to increase the layout area of ​​the blind holes 162, so as to accommodate more conductive particles 151 and improve the conductive effect between the array element 12a and the conductive part 132.

[0081] In some embodiments, the depth of the blind hole 162 in the first direction is smaller than the diameter of the conductive particle 151 .

[0082] In some embodiments, the depth of the blind hole 162 in the first direction is 1 μm-20 μm.

[0083] In some embodiments, the depth of the blind hole 162 in the first direction is 30%-80% of the diameter of the conductive particle 151 .

[0084] It can be understood that the depth setting of the blind hole 162 in the first direction is the same as the depth setting of the groove 161 in the first direction. For details, please refer to the depth setting of the groove 161 in the above embodiment, which will not be repeated here.

[0085] It should be noted that the accommodating structure 16 can be a groove 161 or a blind hole 162 directly opened on the array element 12a, or it can be indirectly connected to the array element 12a through a fixed structure, for example, a base made of a conductive material is fixed on the first surface 121 of the array element 12a, and a groove or a blind hole is opened on the base to accommodate the conductive particles 151.

[0086] See also Figure 5 As shown, the embodiment of the present application also proposes an ultrasonic probe 100, including a transducer assembly 10, the transducer assembly 10 includes a matching layer 11, a piezoelectric layer 12, at least one conductive material layer 17, a flexible circuit board 13, a backing 14, a conductive adhesive 15 and a containing structure 16. The piezoelectric layer 12 has a first surface 121 and a second surface 122 opposite to each other, the second surface 122 of the piezoelectric layer 12 is connected to the matching layer 11, and the piezoelectric layer 12 includes a plurality of array elements 12a arranged in an array; at least one conductive material layer 17 is connected to the first surface 121 of the piezoelectric layer 12 and is conductive with the plurality of array elements 12a; the flexible circuit board 13 includes an insulating substrate 131 and a plurality of conductive portions 132, the insulating substrate 131 is connected to a side of the conductive material layer 17 facing away from the piezoelectric layer 12, the plurality of conductive portions 132 are arranged on a side of the insulating substrate 131 facing the piezoelectric layer 12, and the conductive material layer 17 has a plurality of conductive regions 171, Each conductive area 171 corresponds to an array element 12a and a conductive part 132; the backing 14 is connected to the side of the insulating substrate 131 facing away from the piezoelectric layer 12; the conductive adhesive 15 is used to bond the insulating substrate 131 and the piezoelectric layer 12, and the conductive adhesive 15 includes a plurality of conductive particles 151, and the conductive particles 151 are used to provide electrical connection between the array element 12a and the conductive part 132; the accommodating structure 16 is used to accommodate the conductive particles 151 and limit the movement of the conductive particles 151, and each conductive area 171 of the conductive material layer 17 is provided with a accommodating structure 16 so that the first surface 121 of each array element 12a corresponds to electrical connection with a conductive part 132.

[0087] In this embodiment, the ultrasonic probe 100 utilizes the characteristic that the conductive particles 151 can process electrical connections with narrower spacing in batches, which can effectively improve the conduction effect, so as to achieve conduction between the first surfaces 121 of multiple array elements 12a and multiple conductive parts 132 respectively. By setting the accommodating structure 16, the conductive particles 151 can be firmly fixed in the conductive area 171 of the conductive material layer 17, so that the conductive particles 151 are evenly distributed, so that the first surface 121 of each array element 12a is connected to a corresponding conductive part 132 through the conductive material layer 17, thereby improving the conductivity of the array element 12a.

[0088] In some embodiments, the conductive material layer 17 may be made of copper foil or other materials with conductive functions. The conductive material layer 17 may be a conductive layer provided to improve the performance of the ultrasonic probe 100 or to increase other functions. The accommodation structure 16 is provided on the conductive material layer 17, which does not affect the performance of the ultrasonic probe 100 and can also limit the conductive particles 151, thereby improving the conductivity of the array element 12a.

[0089] It can be understood that the accommodating structure 16 in the ultrasonic probe of this embodiment is different from the accommodating structure 16 of the ultrasonic probe of the above embodiment only in the setting position, and the specific structure of the accommodating structure 16 is consistent with the setting of the accommodating structure 16 of the above embodiment. For details, please refer to the specific setting of the accommodating structure 16 in the above embodiment, which will not be repeated here.

[0090] See also Figure 6 As shown, the embodiment of the present application further proposes an ultrasound probe 100 , including a transducer assembly 10 , wherein the transducer assembly 10 includes a matching layer 11 , a piezoelectric layer 12 , a flexible circuit board 13 , a backing 14 , a conductive adhesive 15 and a containing structure 16 . The piezoelectric layer 12 has a first surface 121 and a second surface 122 opposite to each other. The second surface 122 of the piezoelectric layer 12 is connected to the matching layer 11. The piezoelectric layer 12 includes a plurality of array elements 12a arranged in an array. The flexible circuit board 13 includes an insulating substrate 131 and a plurality of conductive parts 132. The insulating substrate 131 is connected to the first surface 121 of the piezoelectric layer 12. The plurality of conductive parts 132 are arranged on a side of the insulating substrate 131 facing the piezoelectric layer 12. The backing 14 is connected to a side of the insulating substrate 131 facing away from the piezoelectric layer 12. The conductive adhesive 15 is used to bond the insulating substrate 131 and the piezoelectric layer 12. The conductive adhesive 15 includes a plurality of conductive particles 151. The conductive particles 151 are used to provide electrical connection between the array element 12a and the conductive part 132. The accommodating structure 16 is used to accommodate the conductive particles 151 and limit the movement of the conductive particles 151. Each conductive part 132 is provided with an accommodating structure 16 so that the first surface 121 of each array element 12a is electrically connected to a corresponding conductive part 132.

[0091] The ultrasound probe 100 of the embodiment of the present application utilizes the characteristic that the conductive particles 151 can process electrical connections with narrower spacing in batches, which can effectively improve the conduction effect, so as to achieve conduction between the first surfaces 121 of multiple array elements 12a and the multiple conductive parts 132 respectively. The conductive particles 151 can be stabilized on the conductive parts 132 by the arrangement of the accommodating structure 16, so that the conductive particles 151 are evenly distributed, so that the first surface 121 of each array element 12a is correspondingly connected to a conductive part 132, thereby improving the conductivity of the array element 12a.

[0092] It can be understood that the accommodating structure 16 in the ultrasonic probe of this embodiment is different from the accommodating structure 16 of the ultrasonic probe of the above embodiment only in the setting position, and the specific structure of the accommodating structure 16 is consistent with the setting of the accommodating structure 16 of the above embodiment. For details, please refer to the specific setting of the accommodating structure 16 in the above embodiment, which will not be repeated here.

[0093] The present application also provides a method for preparing an ultrasonic probe 100, comprising:

[0094] The first surface 121 of each array element 12a is cut to form a housing structure 16, wherein the housing structure 16 may be a groove 161. The cutting position may be the central area of ​​the first surface 121 of the array element 12a. Grooves are cut along the front-to-back direction and the left-to-right direction. The width of the groove 161 may be controlled by the thickness of the blade and may be greater than or equal to the diameter of the conductive particle 151. The depth of the groove 161 is controlled by the cutting depth and may be less than the diameter of the conductive particle 151.

[0095] The conductive glue 15 containing the conductive particles 151 is repeatedly coated and can be scraped flat by a scraper to make the conductive particles 151 sink into the accommodating structure 16 until the first surface 121 of all the array elements 12a has the conductive particles 151 distributed thereon; by repeated coating, the randomly distributed conductive particles 151 will gradually get stuck in the accommodating structure 16, thereby ensuring that there are enough evenly distributed conductive particles 151 directly below the conductive portion 132 of the flexible circuit board 13.

[0096] The flexible circuit board 13 is pressed together by aligning the position identification points, and the pressed piezoelectric layer 12 and the flexible circuit board 13 are transferred to the preset temperature position for curing to complete the bonding. By pressing the flexible circuit board 13, the conductive part 132 of the flexible circuit board 13 first contacts the conductive particles 151 limited in the accommodating structure 16, thereby achieving conductivity. At the same time, since the conductive particles 151 are limited in the accommodating structure 16 and are less distributed laterally, conduction in the X-axis and Y-axis directions will not be caused, and only conduction in the Z-axis direction will be achieved. A very small number of conductive particles 151 distributed between the array elements 12a are not conductive because the insulating substrate 131 of the flexible circuit board 13 is directly above them, so they will not have a negative impact.

[0097] The preparation method proposed in the embodiment of the present application has a simple process, is convenient for processing, and reduces production costs. The ultrasonic probe 100 is configured with a receiving structure 16 to accommodate the conductive particles 151 and limit the movement of the conductive particles 151, so that the conductive particles 151 are evenly distributed, so that the first surface 121 of each array element 12a is connected to a conductive portion 132 corresponding to each array element 12a, thereby improving the conductivity of the array element 12a.

[0098] See also Fig. 9 As shown, the embodiment of the present application also proposes an ultrasound imaging system 1000, including a host 200, a display 300 and an ultrasound probe 100 of any of the above embodiments, the display 300 and the ultrasound probe 100 are both electrically connected to the host 200, the ultrasound probe 100 is used to send ultrasound to the operation object and receive ultrasound echoes, the ultrasound probe 100 is connected to the host 200 through a wire, the host 200 is used to process ultrasound echoes and generate ultrasound images, and the display 300 is used to display ultrasound images.

[0099] The structure and function of the ultrasound probe 100 in the ultrasound imaging system 1000 proposed in the embodiment of the present application are the same as those in the above embodiment. For details, please refer to the description of the above embodiment, and this embodiment will not be repeated.

[0100] Those skilled in the art may combine and associate different embodiments or examples and features of different embodiments or examples described in this specification without mutual contradiction.

[0101] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. An ultrasonic probe, comprising a transducer assembly, characterized in that: The transducer assembly comprises: Matching layer; A piezoelectric layer having a first surface and a second surface opposite to each other, wherein the second surface of the piezoelectric layer is connected to the matching layer, and the piezoelectric layer comprises a plurality of array elements arranged in an array; A flexible circuit board, comprising an insulating substrate and a plurality of conductive parts, wherein the insulating substrate is connected to a first surface of the piezoelectric layer, and the plurality of conductive parts are arranged on a side of the insulating substrate facing the piezoelectric layer; A backing connected to a side of the insulating substrate facing away from the piezoelectric layer; Conductive adhesive, used for bonding the insulating substrate and the piezoelectric layer, the conductive adhesive comprising a plurality of conductive particles, the conductive particles being used for conducting the array element and the conductive part; The accommodating structure is used to accommodate the conductive particles and limit the movement of the conductive particles. The first surface of each array element is provided with the accommodating structure so that the first surface of each array element is connected to a corresponding conductive part.

2. The ultrasonic probe according to claim 1, characterized in that: The first surface of each of the array elements has a bonding area opposite to the conductive portion, and each of the array elements is provided with the accommodating structure at least in the bonding area.

3. The ultrasonic probe according to claim 1, characterized in that: The conductive particles are spherical, and the accommodating structure includes a groove or a blind hole formed on the first surface of the array element.

4. The ultrasonic probe according to claim 3, characterized in that: The number of the grooves or the blind holes on the first surface of each array element is multiple, and the multiple grooves or the multiple blind holes are arranged in an array.

5. The ultrasonic probe according to claim 3, characterized in that: The number of the grooves on the first surface of each array element is two, and the two grooves are arranged crosswise.

6. The ultrasonic probe according to claim 5, characterized in that: The two grooves are arranged orthogonally.

7. The ultrasonic probe according to claim 3, characterized in that: The depth of the groove or the blind hole in a first direction is smaller than the diameter of the conductive particle, and the first direction is perpendicular to the first surface of the array element.

8. The ultrasonic probe according to claim 7, characterized in that: The depth of the groove or the blind hole in the first direction is 1 μm-20 μm.

9. The ultrasonic probe according to claim 7, characterized in that: The depth of the groove or the blind hole in the first direction is 30%-80% of the diameter of the conductive particle.

10. The ultrasonic probe according to claim 3, characterized in that: The groove has a second direction and a third direction parallel to the first surface of the array element. The groove extends along the second direction. The width of the groove in the third direction is 2 μm-30 μm. The second direction and the third direction are perpendicular to each other.

11. The ultrasonic probe according to claim 3, characterized in that: The groove has a second direction and a third direction parallel to the first surface of the array element. The groove extends along the second direction. The width of the groove in the third direction is 50%-150% of the diameter of the conductive particles. The second direction and the third direction are perpendicular to each other.

12. An ultrasonic probe, comprising a transducer assembly, characterized in that: The transducer assembly comprises: Matching layer; A piezoelectric layer having a first surface and a second surface opposite to each other, wherein the second surface of the piezoelectric layer is connected to the matching layer, and the piezoelectric layer comprises a plurality of array elements arranged in an array; At least one conductive material layer connected to the first surface of the piezoelectric layer and conductively connected to the plurality of array elements; A flexible circuit board, comprising an insulating substrate and a plurality of conductive parts, wherein the insulating substrate is connected to a side of the conductive material layer facing away from the piezoelectric layer, the plurality of conductive parts are arranged on a side of the insulating substrate facing the piezoelectric layer, the conductive material layer has a plurality of conductive areas, each of the conductive areas corresponds to one of the array elements and one of the conductive parts; A backing connected to a side of the insulating substrate facing away from the piezoelectric layer; Conductive adhesive, used for bonding the insulating substrate and the piezoelectric layer, the conductive adhesive comprising a plurality of conductive particles, the conductive particles being used for conducting the array element and the conductive part; The accommodating structure is used to accommodate the conductive particles and limit the movement of the conductive particles. Each conductive area of ​​the conductive material layer is provided with the accommodating structure so that the first surface of each array element is connected to a corresponding conductive part.

13. An ultrasonic probe, comprising a transducer assembly, characterized in that: The transducer assembly comprises: Matching layer; A piezoelectric layer having a first surface and a second surface opposite to each other, wherein the second surface of the piezoelectric layer is connected to the matching layer, and the piezoelectric layer comprises a plurality of array elements arranged in an array; A flexible circuit board, comprising an insulating substrate and a plurality of conductive parts, wherein the insulating substrate is connected to a first surface of the piezoelectric layer, and the plurality of conductive parts are arranged on a side of the insulating substrate facing the piezoelectric layer; A backing connected to a side of the insulating substrate facing away from the piezoelectric layer; Conductive adhesive, used for bonding the insulating substrate and the piezoelectric layer, the conductive adhesive comprising a plurality of conductive particles, the conductive particles being used for conducting the array element and the conductive part; The accommodating structure is used to accommodate the conductive particles and limit the movement of the conductive particles. Each conductive part is provided with the accommodating structure so that the first surface of each array element is connected to a corresponding conductive part.

14. A method for preparing an ultrasonic probe according to any one of claims 1 to 11, characterized in that: include: Cutting the first surface of each of the array elements to form the accommodating structure; Repeatedly coating the conductive glue containing the conductive particles, and performing scraping to make the conductive particles sink into the accommodating structure, until the conductive particles are distributed on the first surface of all the array elements; The flexible circuit board is pressed and aligned through the position identification points, and the pressed piezoelectric layer and the flexible circuit board are transferred to a preset temperature position for curing to complete the bonding.

15. An ultrasonic imaging system, characterized in that: It includes a host, a display, and an ultrasound probe as described in any one of claims 1 to 13, wherein the display and the ultrasound probe are electrically connected to the host, the ultrasound probe is used to send ultrasound to the operation object and receive ultrasound echoes, the host is used to process the ultrasound echoes and generate ultrasound images, and the display is used to display the ultrasound images.

Images