Composite hardware mold box for hardware machining

Abstract

The invention discloses a composite hardware mold box for hardware machining. The composite hardware mold box comprises a bottom plate, and a bottom mold is fixed to the bottom plate; the top plate is arranged above the bottom plate, and a top die is fixed on the bottom surface of the top plate; the two side plates are respectively fixed on two sides of the bottom plate; the air injection structure is arranged on the top mold; the two shielding structures are arranged on the top mold; the air supply structure is arranged between the bottom plate and the top plate; and the cooling structure is arranged on the top plate. According to the invention, through periodic lifting of the top plate and the top die and ingenious utilization of a gas compression and release mechanism, gas cooling of the bottom die and hardware is realized, too high temperature generated by high-frequency stamping is effectively avoided, and the machining quality of the hardware and long-term use of the die are ensured.

Description

Technical Field

[0001] The invention relates to the technical field of hardware moulds, in particular to a composite hardware mould box for hardware processing. Background Art

[0002] A composite metal mold refers to a mold that completes several stamping processes at the same part of the mold during one working stroke of the press. These processes may include different types of operations such as punching, blanking, drawing, and shaping.

[0003] During the stamping process of the punching machine on the hardware, heat will be generated between the hardware and the mold, and the high-frequency impact will gradually accumulate heat. First, the plastic deformation of the hardware material will cause the temperature to rise. When the convex and concave molds work continuously at high temperature, the softened processed material will adhere to the side of the convex mold and continue to increase. It will only fall off when it reaches a certain limit. This repeated cycle will cause the mold to bite and accelerate the wear of the mold. At the same time, side pressure and high-temperature expansion will be generated, causing the mold gap between the convex and concave molds to change, resulting in a sudden change in the shape of the incision or a large triangular burr, or a die-biting phenomenon, which will reduce the processing accuracy and surface quality of the product. Secondly, excessive temperature will cause the hardware material to soften excessively, resulting in processing errors. Especially for high-hardness materials, excessively high temperature will cause welding, cracking and other undesirable phenomena, seriously affecting the quality and performance of the product. Moreover, the mold will also undergo thermal expansion and softening when working for a long time at high temperature, resulting in unstable mold size, further affecting the processing accuracy of the product and the service life of the mold. At the same time, high temperature will accelerate the fatigue and wear of the mold material, shorten the mold replacement cycle, and increase production costs. Summary of the invention

[0004] In order to overcome the above technical problems, the object of the present invention is to provide a composite hardware mold box for hardware processing.

[0005] The purpose of the present invention can be achieved by the following technical solutions: A composite hardware mold box for hardware processing, comprising: A bottom plate, on which a bottom mold is fixed; A top plate is placed above the bottom plate, and a top mold is fixed on the bottom surface of the top plate; Two side panels are respectively fixed on both sides of the bottom plate; An air injection structure is arranged on the top mold; Two shielding structures are both arranged on the top mold; An air supply structure is arranged between the bottom plate and the top plate; The cooling structure is arranged on the top plate.

[0006] As a further solution of the present invention: the jet structure comprises: Two cavities are both opened on the top mold; A connecting cavity is provided on the top mold, and the two cavities are connected through the connecting cavity; Two sinks are both provided on the bottom surface of the top mold; A plurality of air-jet holes are respectively arranged in the two sinks, and the plurality of air-jet holes in the same sink are all communicated with the corresponding cavities.

[0007] As a further solution of the present invention: the shielding structure includes: A first groove is formed on the groove wall of the sink; A second slot is provided on the side of the top mold, and the second slot is connected to the first slot; A baffle plate, slidably disposed in the first slot; A connecting plate is slidably disposed in the second slot, one end of the connecting plate is fixedly connected to the baffle, and the other end of the connecting plate extends to the outside of the second slot; A magnetic block is fixed to an end of the connecting plate away from the baffle; A tension spring, one end of which is connected to the top mold, and the other end of which is connected to the connecting plate; The magnetic block is fixed on the side plate.

[0008] As a further solution of the present invention: the air supply structure comprises: A sealing cylinder is fixed on the top surface of the bottom plate, and the top end of the sealing cylinder is an open structure; A pressure rod is sealingly and slidably connected in the sealing cylinder, and the top end of the pressure rod extends to the outside of the sealing cylinder and is fixedly connected to the top plate; Two connecting pipes, one end of each of which is connected to the sealing cylinder; Two one-way valves are respectively installed on the two connecting pipes.

[0009] As a further solution of the present invention: the cooling structure comprises: A cooling box is fixed on the side of the top plate, and an assembly opening is provided on the side of the cooling box; A semiconductor cooling sheet is installed in the assembly opening, and the heat-conducting surface of the semiconductor cooling sheet faces the outside of the cooling box; A cooling tube is fixed inside the cooling box, both ends of the cooling tube extend to the outside of the cooling box, one end of the cooling tube is connected to an end of one of the connecting tubes away from the sealing cylinder, and the other end of the cooling tube is connected to one of the cavities.

[0010] As a further solution of the present invention: a suction structure and a driving structure are provided on the top plate, and the suction structure includes: A mounting box fixed to the side of the top plate; A reciprocating screw rod is rotatably mounted inside the mounting box; A movable plate, threadedly sleeved on the reciprocating screw rod; An annular capsule, one end of which is connected to the inner surface of the mounting box, and the other end of which is connected to the movable plate, the reciprocating screw rod passes through the middle of the annular capsule, and the reciprocating screw rod and the annular capsule do not contact each other; Two mounting tubes are both connected to the annular capsule, wherein one end of one mounting tube away from the annular capsule is connected to one side of the cooling box, and the other end of the other mounting tube away from the annular capsule is connected to the other side of the cooling box; Two one-way valves 2 are respectively installed on the two installation pipes.

[0011] As a further solution of the present invention: the driving structure includes: A shaft rod is rotatably mounted on the side of the mounting box, and one end of the shaft rod is fixedly connected to the reciprocating screw rod; A gear, fixedly sleeved on the shaft; two fixing rods, both fixed on one of the side panels; The rack is fixed to one end of the two fixing rods away from the side plates and is arranged opposite to the gear.

[0012] Beneficial effects of the present invention: 1. During the stamping and shaping process of hardware, the top plate and the top mold are raised and lowered periodically, and the gas compression and release mechanism is cleverly used to achieve air cooling of the bottom mold and hardware. When the top plate descends, the gas in the sealing cylinder is pressed into the cooling pipe and the cavity. After cooling by the coolant and further cooling by the semiconductor refrigeration sheet, the temperature of the gas accumulated in the two cavities is reduced. When the top plate rises, the interaction between the magnetic block and the magnetic block causes the baffle to move away, and the low-temperature gas is ejected through the jet hole to directly cool the bottom mold and the hardware, effectively avoiding the excessive temperature caused by high-frequency stamping, and ensuring the processing quality of the hardware and the long-term use of the mold; 2. The movable plate in the present invention moves back and forth under the drive of the gear and the rack, thereby continuously squeezing and stretching the annular capsule, realizing the circulation of the coolant. The orderly flow of the coolant in the cooling box is ensured by the flow limiting effect of the two one-way valves, that is, one one-way valve allows the coolant to enter the annular capsule, and the other one-way valve allows the coolant to flow out of the annular capsule. This design not only improves the utilization rate of the coolant, but also enables the semiconductor refrigeration plate to contact and cool the coolant more evenly and comprehensively, further improving the cooling efficiency; 3. The design of the composite hardware mold box fully considers the compactness of the structure and the integration of functions. Through the clever mechanical structure design, the functions of gas compression, cooling, release and circulation of coolant are integrated into one box, which not only saves space but also improves work efficiency. At the same time, the various components cooperate closely and the movements are coordinated, ensuring the stability and reliability of the entire stamping shaping and cooling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described below in conjunction with the accompanying drawings.

[0014] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a structural schematic diagram of another perspective of the present invention; Figure 3 It is a structural schematic diagram of the top plate and the top mold; Figure 4 It is a schematic diagram of the structure of the top mold, two cavities and the connecting cavity; Figure 5 It is a schematic diagram of the structure of the top mold and two shielding structures; Figure 6 yes Figure 1 A magnified view of the structure at A; Figure 7 yes Figure 1 A magnified view of the structure at B; Figure 8 yes Figure 2 A magnified view of the structure at C; Fig. 9 yes Figure 5 A magnified view of the structure at D; Fig.10 is a schematic diagram of the cooling structure; Fig.11 It is a structural schematic diagram of the suction structure.

[0015] In the figure: 1, bottom plate; 2, bottom mold; 3, top plate; 4, top mold; 5, side plate; 61, cavity; 62, connecting cavity; 63, sink groove; 64, jet hole; 71, slot one; 72, slot two; 73, baffle; 74, connecting plate; 75, magnetic block; 76, tension spring; 77, magnetic block; 81, sealing cylinder; 82, pressure rod; 83, connecting pipe; 84, one-way valve one; 91, cooling box; 92, semiconductor refrigeration plate; 93, cooling pipe; 101, mounting box; 102, reciprocating screw; 103, moving plate; 104, annular capsule; 105, mounting pipe; 106, one-way valve two; 111, shaft; 112, gear; 113, fixing rod; 114, rack. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] like Figure 1-11 As shown, a composite hardware mold box for hardware processing includes a bottom plate 1, on which a bottom mold 2 is fixed; a top plate 3 is placed above the bottom plate 1, and a top mold 4 is fixed on the bottom surface of the top plate 3; two side plates 5 are respectively fixed on both sides of the bottom plate 1; The jet structure is arranged on the top mold 4, and the jet structure includes: two cavities 61, both of which are opened on the top mold 4; a connecting cavity 62, which is opened on the top mold 4, and the two cavities 61 are connected through the connecting cavity 62; two sink grooves 63, both of which are opened on the bottom surface of the top mold 4; a plurality of jet holes 64, which are respectively opened in the two sink grooves 63, and the plurality of jet holes 64 located in the same sink groove 63 are connected with the corresponding cavity 61; Two shielding structures are arranged on the top mold 4, and the shielding structures include: a slot 71, which is arranged on the slot wall of the sink 63; a slot 72, which is arranged on the side of the top mold 4, and the slot 72 is connected with the slot 71; a baffle 73 is slidably arranged in the slot 71; a connecting plate 74 is slidably arranged in the slot 72, one end of the connecting plate 74 is fixedly connected to the baffle 73, and the other end extends to the outside of the slot 72; a magnetic block 75 is fixed to the end of the connecting plate 74 away from the baffle 73; a tension spring 76, one end of which is connected to the top mold 4, and the other end is connected to the connecting plate 74; a magnetic block 77 is fixed on the side plate 5; The air supply structure is arranged between the bottom plate 1 and the top plate 3, and the air supply structure includes: a sealing cylinder 81, which is fixed on the top surface of the bottom plate 1, and the top of the sealing cylinder 81 is an open structure; a pressure rod 82, which is sealingly slidably connected in the sealing cylinder 81, and the top of the pressure rod 82 extends to the outside of the sealing cylinder 81 and is fixedly connected to the top plate 3; two connecting pipes 83, one end of which is connected to the sealing cylinder 81; two one-way valves 84, which are respectively installed on the two connecting pipes 83, and the flow limiting directions of the two one-way valves 84 are opposite. Specifically, one of the one-way valves 84 limits the gas to only enter the sealing cylinder 81, and the other one-way valve 84 limits the gas to only flow out of the sealing cylinder 81. When the pressure rod 82 moves down, the sealing cylinder 81 performs an exhaust action, and when the pressure rod 82 moves up, the sealing cylinder 81 can perform a suction action; The cooling structure is arranged on the top plate 3, and the cooling structure includes: a cooling box 91, which is fixed on the side of the top plate 3, and an assembly port is opened on the side of the cooling box 91; a semiconductor refrigeration sheet 92, which is installed in the assembly port, and the heat conduction surface of the semiconductor refrigeration sheet 92 faces the outside of the cooling box 91; a cooling pipe 93, which is fixed inside the cooling box 91, and both ends of the cooling pipe 93 extend to the outside of the cooling box 91, one end of the cooling pipe 93 is connected to one end of one of the connecting pipes 83 away from the sealing tube 81, and the other end of the cooling pipe 93 is connected to one of the cavities 61. In the process of a single lifting of the top plate 3 and the top mold 4, the top plate 3 first descends and drives the pressure rod 82 to descend. When the pressure rod 82 moves downward, it can press out the gas in the sealing tube 81, so that the gas passes through the corresponding connecting pipe 8 3 enters the cooling tube 93. Further, the gas will flow in the cooling tube 93 and finally enter the cavity 61 connected to the cooling tube 93. The two cavities 61 are connected through the connecting cavity 62, so the gas will be filled in the two cavities 61. During the gas flowing in the cooling tube 93, the coolant in the cooling box 91 can cool the gas flowing in the cooling tube 93, so that the gas accumulated in the two cavities 61 has a lower temperature. In addition, a semiconductor cooling sheet 92 is installed on the cooling box 91. When the semiconductor cooling sheet 92 is powered on, it can cool the coolant, thereby ensuring the cooling effect of the coolant on the gas. The heat conducting surface of the semiconductor cooling sheet 92 faces the outside of the cooling box 91, so that the semiconductor cooling sheet 92 can dissipate heat; A suction structure and a driving structure are provided on the top plate 3, and the suction structure includes: a mounting box 101, fixed to the side of the top plate 3; a reciprocating screw rod 102, rotatably mounted inside the mounting box 101; a movable plate 103, threadedly sleeved on the reciprocating screw rod 102; an annular capsule 104, one end of which is connected to the inner surface of the mounting box 101, and the other end is connected to the movable plate 103, the reciprocating screw rod 102 passes through the middle of the annular capsule 104, and the reciprocating screw rod 102 and the annular capsule 104 do not contact each other; two mounting tubes 105, both of which are connected to the annular capsule 104, one end of which is away from the annular capsule 104 and is connected to one side of the cooling box 91, and the other end of which is away from the annular capsule 104 and is connected to the other side of the cooling box 91; two one-way valves 106, respectively mounted on the two mounting tubes 105, and the driving structure includes: a shaft 111, a rotating mounting Mounted on the side of the installation box 101, one end of the shaft rod 111 is fixedly connected to the reciprocating screw rod 102; the gear 112 is fixedly sleeved on the shaft rod 111; the two fixed rods 113 are fixed on one of the side plates 5; the rack 114 is fixed to one end of the two fixed rods 113 away from the side plate 5, and is arranged opposite to the gear 112. During the lifting process of the top plate 3, the gear 112 will mesh with the rack 114 and rotate under the action of the rack 114. When the gear 112 rotates, it can drive the shaft rod 111 to rotate, and the reciprocating screw rod 102 will also rotate accordingly. Since the cross-sections of the installation box 101 and the moving plate 103 are both rectangular structures, and the inner surface of the installation box 101 and the side surface of the moving plate 103 are in contact with each other, the reciprocating screw rod 102 can drive the moving plate 103 to reciprocate when it rotates, which makes the moving plate 103 continuously squeeze and stretch the annular bag 104.

[0018] Working principle of the present invention: When the composite hardware mold box for hardware processing proposed by the present invention is used, during the stamping process, the top plate 3 drives the top mold 4 to impact downward periodically, and cooperates with the shaping function of the bottom mold 2 to achieve the stamping shaping of the hardware. During the single lifting and lowering process of the top plate 3 and the top mold 4, the top plate 3 first descends and drives the pressure rod 82 to descend. When the pressure rod 82 moves downward, the gas in the sealing tube 81 can be pressed out, so that the gas enters the cooling tube 93 through the corresponding connecting pipe 83. Further, the gas will flow in the cooling tube 93 and finally enter the cavity 61 connected to the cooling tube 93. The space between the two cavities 61 The two cavities 61 are connected through the connecting cavity 62, so the gas will be filled into the two cavities 61. When the gas flows in the cooling tube 93, the coolant in the cooling box 91 can cool the gas flowing in the cooling tube 93, so that the gas accumulated in the two cavities 61 has a lower temperature. In addition, a semiconductor cooling sheet 92 is installed on the cooling box 91. When the semiconductor cooling sheet 92 is powered on, it can cool the coolant, thereby ensuring the cooling effect of the coolant on the gas. The heat conductive surface of the semiconductor cooling sheet 92 faces the outside of the cooling box 91, so that the semiconductor cooling sheet 92 can dissipate heat; During the process of the top plate 3 descending, under the action of the tension spring 76, the baffle 73 is located inside the sink 63. At this time, the baffle 73 can block the plurality of jet holes 64. At this time, the gas in the two cavities 61 cannot be ejected through the plurality of jet holes 64, which makes the gas pressure in the two cavities 61 gradually increase. After the stamping action is completed, the top plate 3 drives the top mold 4 to move upward. When the top plate 3 moves upward to the upper limit position, the magnetic block 75 just moves to the position facing the magnetic block 77. At this time, under the attraction of the magnetic block 77, the magnetic block 75 can move toward the direction of the magnetic block 77 and be adsorbed on the magnetic block 77. When the magnetic block 75 moves, it can drive the connecting plate 7 4 moves, so that the connecting plate 74 drives the baffle 73 to move, and the baffle 73 can be retracted into the slot 1 71 when moving, so that the baffle 73 no longer blocks the plurality of jet holes 64. In this case, the low-temperature gas in the two cavities 61 can be ejected through the plurality of jet holes 64 and sprayed toward the bottom mold 2 and the hardware after stamping and shaping on the bottom mold 2. The low-temperature gas can cool the bottom mold 2 and the hardware. Based on the above process, during the high-frequency stamping process of the top mold 4, the plurality of jet holes 64 can intermittently perform jetting action, thereby air-cooling the bottom mold 2 and the hardware to prevent the temperature of the bottom mold 2 and the hardware from being too high. When the top plate 3 is lifted or lowered, the gear 112 will mesh with the rack 114 and rotate under the action of the rack 114. When the gear 112 rotates, it can drive the shaft 111 to rotate, and the reciprocating screw 102 will also rotate accordingly. Since the cross-sections of the installation box 101 and the movable plate 103 are both rectangular structures, and the inner surface of the installation box 101 and the side surface of the movable plate 103 fit each other, the reciprocating screw 102 can drive the movable plate 103 to reciprocate when it rotates, which makes the movable plate 103 continuously squeeze and stretch the annular bag 104. Furthermore, the limiting directions of the two one-way valves 106 are opposite. Specifically, one of the one-way valves 106 limits the liquid to only enter the annular bag The annular capsule 104 and the one-way valve 106 restrict the liquid from flowing out only from the annular capsule 104. Therefore, when the annular capsule 104 is squeezed, the annular capsule 104 can discharge. When the annular capsule 104 is stretched, the annular capsule 104 can extract. Therefore, along with the reciprocating movement of the movable plate 103, the annular capsule 104 can continuously extract the coolant from one end of the cooling box 91, and discharge the coolant back into the cooling box 91 through the other end of the cooling box 91, so that the coolant flows inside the cooling box 91. When the coolant flows, the semiconductor refrigeration sheet 92 can evenly and comprehensively cool the coolant, thereby ensuring the cooling effect of the semiconductor refrigeration sheet 92 on the coolant.

[0019] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A composite hardware mold box for hardware processing, characterized in that: include: A bottom plate (1), a bottom mold (2) being fixed on the bottom plate (1); A top plate (3) is placed above the bottom plate (1), and a top mold (4) is fixed to the bottom surface of the top plate (3); Two side panels (5) are respectively fixed on two sides of the bottom panel (1); An air jet structure, arranged on the top mold (4); Two shielding structures, both arranged on the top mold (4); An air supply structure, arranged between the bottom plate (1) and the top plate (3); A cooling structure is arranged on the top plate (3).

2. A composite metal mold box for metal processing according to claim 1, characterized in that: The jet structure comprises: Two cavities (61) are both opened on the top mold (4); A connecting cavity (62) is provided on the top mold (4), and the two cavities (61) are connected via the connecting cavity (62); Two sink grooves (63) are both provided on the bottom surface of the top mold (4); A plurality of air-jet holes (64) are respectively provided in the two sink grooves (63); the plurality of air-jet holes (64) located in the same sink groove (63) are all connected to the corresponding cavity (61).

3. A composite hardware mold box for hardware processing according to claim 2, characterized in that: The shielding structure comprises: A first groove (71) is formed on the groove wall of the sink groove (63); A second groove (72) is formed on the side of the top mold (4), and the second groove (72) is connected to the first groove (71); A baffle (73) slidably disposed in the first slot (71); A connecting plate (74) is slidably disposed in the second slot (72), one end of the connecting plate (74) is fixedly connected to the baffle (73), and the other end extends to the outside of the second slot (72); A magnetic attraction block (75) fixed to an end of the connecting plate (74) away from the baffle (73); A tension spring (76), one end of which is connected to the top mold (4) and the other end of which is connected to the connecting plate (74); The magnetic block (77) is fixed on the side plate (5).

4. The composite metal mold box for metal processing according to claim 3, characterized in that: The air supply structure comprises: A sealing cylinder (81) is fixed on the top surface of the bottom plate (1), and the top end of the sealing cylinder (81) is an open structure; A pressure rod (82) is sealingly and slidably connected in the sealing cylinder (81), and the top end of the pressure rod (82) extends to the outside of the sealing cylinder (81) and is fixedly connected to the top plate (3); Two connecting pipes (83), one end of each of which is connected to the sealing cylinder (81); Two one-way valves (84) are respectively installed on the two connecting pipes (83).

5. The composite metal mold box for metal processing according to claim 4, characterized in that: The cooling structure comprises: A cooling box (91) is fixed to a side surface of the top plate (3), and an assembly opening is provided on the side surface of the cooling box (91); A semiconductor cooling sheet (92) is installed in the assembly opening, with a heat-conducting surface of the semiconductor cooling sheet (92) facing the outside of the cooling box (91); A cooling tube (93) is fixed inside the cooling box (91), both ends of the cooling tube (93) extend to the outside of the cooling box (91), one end of the cooling tube (93) is connected to an end of one of the connecting tubes (83) away from the sealing cylinder (81), and the other end of the cooling tube (93) is connected to one of the cavities (61).

6. The composite metal mold box for metal processing according to claim 5, characterized in that: A suction structure and a driving structure are provided on the top plate (3), and the suction structure comprises: A mounting box (101) fixed on a side surface of the top plate (3); A reciprocating screw rod (102) rotatably mounted inside the mounting box (101); A movable plate (103) threadably sleeved on the reciprocating screw rod (102); An annular capsule (104) has one end connected to the inner surface of the installation box (101) and the other end connected to the movable plate (103); the reciprocating screw rod (102) passes through the middle of the annular capsule (104), and the reciprocating screw rod (102) and the annular capsule (104) do not contact each other; Two mounting tubes (105), both of which are connected to the annular capsule (104), wherein one end of one of the mounting tubes (105) away from the annular capsule (104) is connected to one side of the cooling box (91), and the other end of the other mounting tube (105) away from the annular capsule (104) is connected to the other side of the cooling box (91); Two one-way valves (106) are respectively installed on the two installation pipes (105).

7. A composite metal mold box for metal processing according to claim 6, characterized in that: The driving structure comprises: A shaft rod (111) is rotatably mounted on a side surface of the mounting box (101), and one end of the shaft rod (111) is fixedly connected to the reciprocating screw rod (102); A gear (112) fixedly sleeved on the shaft (111); Two fixing rods (113), both fixed on one of the side panels (5); The rack (114) is fixed to one end of the two fixing rods (113) away from the side plate (5) and is arranged opposite to the gear (112).

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