Nickel / copper dissimilar metal and red / blue double-laser deposition device and method of mortise and tenon imitating structure

Abstract

The invention provides a nickel / copper dissimilar metal and red / blue double-laser deposition device and method of a mortise and tenon imitating structure. The nickel / copper dissimilar metal and red / blue double-laser deposition device comprises an optical fiber laser, a semiconductor laser, a multi-light-path laser head, a powder feeding assembly and a controller. The fiber laser is used for emitting red laser, and the semiconductor laser is used for emitting blue laser. A laser focusing lens set and a lens height adjusting assembly are arranged in the multi-light-path laser head. The controller is used for controlling starting and stopping of the optical fiber laser and the semiconductor laser, powder feeding of the double-barrel powder feeder and work of the lens height adjusting assembly so as to meet the deposition requirement of the designed dissimilar material metal. According to the laser cladding equipment, alternate laser cladding of two different metals of nickel and copper is realized by utilizing the equipment and combining with the lens height adjusting assembly, so that the interface bonding strength of dissimilar metals is improved. Meanwhile, the invention further provides the nickel / copper dissimilar metal of the mortise and tenon imitating structure prepared through the device and method.

Description

Technical Field

[0001] The invention relates to the technical field of laser additive manufacturing, and in particular to a nickel / copper dissimilar metal and red / blue dual laser deposition device and method for imitating a mortise and tenon structure. Background Art

[0002] With the rapid development of high-tech fields such as aerospace, the demand for high-performance heterogeneous materials is growing. By combining the advantages of two or more materials, heterogeneous materials can significantly improve the comprehensive performance of aerospace vehicles and meet more stringent working environment requirements. As a cutting-edge manufacturing technology, Laser Additive Manufacturing (LAM) has shown great potential in the rapid prototyping of metal components with its unique advantages such as shallow heat-affected zone and high-precision molding. LAM technology does not require traditional casting molds, which not only reduces production costs, but also greatly improves the quality and efficiency of molded parts.

[0003] However, there are many challenges in using LAM technology to deposit heterogeneous materials such as nickel and copper. Due to the significant differences in the physical and chemical properties of these materials, interface cracks and stress concentration are easily generated during processing, which seriously weaken the bonding strength of the interface. In addition, there are large differences in the absorption rate of nickel and copper to lasers, which makes it difficult to ensure a good deposition effect when using the same type of infrared laser for deposition manufacturing, which in turn affects the formation quality and bonding strength of the interface. Summary of the invention

[0004] In view of the problems of low interface bonding strength and poor forming quality in the existing laser additive manufacturing of nickel / copper dissimilar metals, the present invention provides a nickel / copper dissimilar metal with imitation mortise and tenon structure, and a red / blue dual laser deposition device and method for preparing nickel / copper dissimilar metal with imitation mortise and tenon structure. The red / blue dual laser deposition device adopts a red laser and a blue laser emitting device, and is equipped with a lens height adjustment component to achieve alternating laser deposition of two different materials of nickel and copper, thereby improving the interface bonding strength of dissimilar metals. The nickel / copper dissimilar metal with imitation mortise and tenon structure prepared by the device has high interface bonding strength and good forming quality.

[0005] The present invention achieves the above technical objectives through the following technical means.

[0006] A red / blue dual laser deposition device, comprising a fiber laser, a semiconductor laser, a multi-optical path laser head, a powder feeding component and a controller;

[0007] The fiber laser is used to emit red laser light, and the semiconductor laser is used to emit blue laser light; the multi-path laser head is provided with a laser inlet connected to the fiber laser and the semiconductor laser in the vertical direction, and a laser outlet is provided in the vertical direction below the multi-path laser head; a laser focusing lens group and a lens height adjustment component for adjusting the distance between the laser focusing lens group and the laser outlet are provided in the multi-path laser head; the red laser light and the blue laser light are focused by the laser focusing lens group, emitted from the laser outlet, and focused on the processing plane to form a composite laser spot;

[0008] The powder feeding assembly includes a double-barrel powder feeder and two powder feeding heads connected to the outlet ends of the double-barrel powder feeder by separate pipelines; the powder feeding head is installed on the multi-light path laser head, and the extension line of the central axis of the powder feeding head intersects with the extension line of the central axis of the multi-light path laser head to ensure that the laser beam from the laser outlet converges with the powder from the outlet of the powder feeding head;

[0009] The controller is used to control the start and stop of the fiber laser and the semiconductor laser, the powder feeding of the double-barrel powder feeder, and the operation of the lens height adjustment component to meet the deposition requirements of the designed heterogeneous metals.

[0010] Furthermore, the laser focusing lens group includes at least one convex lens horizontally arranged along the axial direction of the multi-path laser head; the lens height adjustment assembly includes a set of screw adjustment mechanisms equipped for each convex lens, each set of screw adjustment mechanisms includes a screw slider, a screw and a drive motor, the drive motor is installed on the multi-path laser head, and its output end is connected to the screw, the screw slider is sleeved on the screw and threadedly connected to the screw, and the convex lens is fixed on the corresponding screw slider; the drive motors in the lens height adjustment assembly are all connected to the controller.

[0011] Furthermore, the controller controls the lens height adjustment assembly by: adjusting the distance between the laser focusing lens group and the laser outlet by synchronously controlling the drive motor in the lens height adjustment assembly to rotate the same number of circles in the same direction according to the required width of the deposited metal and the required spot diameter on the processing plane, combined with the transmission and focusing characteristics of the laser.

[0012] Furthermore, the wavelength of the red laser emitted by the fiber laser is 600-700 nm, and the wavelength of the blue laser emitted by the semiconductor laser is 400-600 nm.

[0013] Furthermore, after adjustment, the lead screw is located at the origin. Assuming that the distance between the optical center of the lower convex lens in the laser focusing lens group and the laser outlet is Y at this time, the distance between the optical center of the lower convex lens and the laser outlet after adjustment is h, the corresponding number of turns required by the lead screw is r, and the thread spacing on the lead screw is d, and h satisfies: h=Y+r*d; assuming that the required spot diameter is a, the focal length of the convex lens is f, and the diameter of the convex lens is D, it satisfies: a=(Y+r*df)*D / f.

[0014] The method for preparing nickel / copper dissimilar metals with imitation mortise and tenon structure using any of the above red / blue dual laser deposition devices comprises the following steps:

[0015] S1: The controller starts the fiber laser and controls the double-barrel powder feeder to deliver nickel alloy powder to the powder feeding head, and prepares the nickel alloy on the substrate by laser powder deposition as a nickel alloy matrix layer;

[0016] S2: On the surface of the formed nickel-based alloy substrate, continue to use red laser to deposit a single pass of nickel-based alloy with a spot diameter of a1 mm and an interval of b1 mm. The laser process parameters remain unchanged. At this time, the lead screws are all located at the origin, and the distance between the optical center of the lower convex lens in the laser focusing lens group and the laser outlet is Y;

[0017] S3: After completing the deposition of a single nickel-based alloy, the fiber laser is kept working, and the controller turns on the semiconductor laser to emit a blue laser coaxial with the red laser. The spots of the two lasers overlap, and at the same time, the controller controls the powder feeding head to stop conveying titanium alloy powder and instead convey copper alloy powder; the screws in the lens height adjustment assembly are driven by the corresponding drive motors to rotate clockwise by the same number of turns r1, adjust the spot diameter to b1 mm, and deposit a single copper alloy at the interval between adjacent single nickel-based alloys, and the duration of the blue laser is t; the working time t of the semiconductor laser in a single layer, the laser scanning speed v, the number of copper alloys in a single layer N, and the length w of a single layer satisfy a quantitative relationship: t = Nw / v; at this point, the deposition of the first layer of the interface imitation mortise and tenon structure is completed;

[0018] S4. After the deposition of the first layer is completed, the lead screw (8) in the lens height adjustment assembly is driven by the corresponding drive motor (7) to return to the origin, and then rotates clockwise by the same number of turns r2 to adjust the spot diameter to a2 mm. At the same time, the semiconductor laser stops working, and a single red laser is used to deposit a single nickel-based alloy track in the same manner as step S2, with a spacing of b2 mm between the single nickel-based alloy tracks; the spot diameter a, the number of turns r driven by the drive motor, the thread spacing d of the lead screw, the focal length f of the convex lens, the diameter D of the convex lens, and the spacing h between the optical center of the lower convex lens in the laser focusing lens group and the laser outlet satisfy a quantitative relationship: h = Y + r * d, a = (Y + r * df) * D / f; the spacing between the convex lens and the laser outlet increases, and the spot diameter increases;

[0019] S5. After the single-pass deposition of the nickel-based alloy is completed, the lead screws in the lens height adjustment assembly are driven by the corresponding drive motors to return to the origin, and then rotate clockwise by the same number of turns r3 to adjust the spot diameter to b2 mm; at the same time, the semiconductor laser starts to work, and deposits the copper alloy with a spot diameter of b2 at the interval of the second layer of nickel-based alloy, and the arrangement of the nickel-based alloy and the copper alloy is the same as that of the first layer. At this point, the second layer of the mortise and tenon structure is deposited;

[0020] S6. Repeat steps (4)-(5) n-2 times, depositing nickel-based alloy and copper alloy with spot diameters a3, a4... and b3, b4..., respectively, to complete the construction of the interface imitation mortise and tenon structure; the total number of layers of the mortise and tenon structure is n; the spot diameters a1, a2, a3, a4... increase in sequence along the deposition direction, and the spot diameters b1, b2, b3, b4... decrease in sequence along the deposition direction, and satisfy the relationship: a1+b1=a2+b2=....=a n +b n ;

[0021] S7. After the deposition of the simulated mortise and tenon structure on the interface is completed, the blue laser is kept coaxial and overlapping with the red laser to complete the deposition of the copper alloy matrix; at this point, the deposition of the nickel / copper dissimilar metals of the simulated mortise and tenon structure is completed.

[0022] Furthermore, the particle size of the nickel alloy powder is 50 to 150 μm; the particle size of the copper alloy powder is 50 to 150 μm.

[0023] Furthermore, when depositing nickel alloy, the laser power emitted by the fiber laser is 1800W, and the scanning speed is 10mm / s; when depositing copper alloy, the laser power emitted by the fiber laser is 800W, and the laser power emitted by the semiconductor laser is 1000W, and the scanning speed is 10mm / s.

[0024] The nickel / copper dissimilar metal with imitation mortise and tenon structure prepared by the above-mentioned preparation method includes a nickel alloy layer, a mortise and tenon inlay layer and a copper alloy layer stacked in sequence; in the mortise and tenon inlay layer, in the extension plane of the copper alloy layer and / or the nickel alloy layer, a single copper alloy and a single nickel alloy are alternately arranged, and from the nickel alloy layer to the copper alloy layer, the width of the single nickel alloy gradually decreases, and the width of the single copper alloy gradually increases, and the reduction and / or increase of the two are the same.

[0025] Furthermore, the width of a single nickel alloy and a single copper alloy in the mortise and tenon inlay layer is 1-4 mm; the thickness of the mortise and tenon structure is H, in mm, H=0.7n, and n is the number of deposition layers of the mortise and tenon structure.

[0026] The beneficial effects of the present invention are as follows:

[0027] 1. The present invention uses red laser to deposit nickel alloy, and uses red laser and blue laser to deposit copper alloy. From one perspective, the present invention not only utilizes the characteristic that blue laser is more easily absorbed by copper to make up for the defect that copper has a low absorption rate of red laser, thereby improving the deposition quality, but also utilizes blue laser to concentrate energy, thereby alleviating the rapid diffusion of heat caused by using a single wavelength laser, thereby avoiding the formation of a large heat-affected zone, thereby significantly improving the deposition quality and bonding strength of dissimilar alloys. From another perspective, it helps to improve the utilization efficiency of laser energy and reduce unnecessary energy waste.

[0028] 2. In the additive manufacturing process, the present invention ingeniously realizes the construction of the imitation mortise and tenon structure of the interface. As a traditional connection method, the imitation mortise and tenon structure has excellent mechanical properties and stability. The present invention applies this structure to the deposition processing of heterogeneous alloys to improve the overall strength and durability of the material. At the same time, by adjusting the lens spacing to change the spot diameter, the present invention realizes quantitative and precise control of the interface mortise and tenon structure. This function allows users to flexibly adjust the size and shape of the mortise and tenon structure according to specific needs to meet the performance requirements in different application scenarios.

[0029] 3. Since the present invention performs well in the regulation of heterogeneous alloy deposition quality and interface structure, it has a wide range of application potential. It can be used in high-end manufacturing fields such as aerospace, automobile manufacturing, and medical equipment to provide high-performance and high-precision alloy materials for these industries. In addition, the present invention can also provide strong technical support for new material research and development, material modification and other fields, and promote the innovative development of related industries. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic structural diagram of the red / blue dual laser deposition device of the present invention.

[0031] Figure 2The figure is a schematic diagram of the optical paths of the red laser and the blue laser in the multi-optical path laser head of the present invention.

[0032] Figure 3 It is a structural schematic diagram of the lens height adjustment assembly of the present invention.

[0033] Figure 4 This is a schematic diagram of the change in the diameter of the light spot before and after adjustment of the lens height adjustment assembly of the present invention.

[0034] Figure 5 This is a schematic diagram of the red / blue dual laser deposition path of the present invention.

[0035] The reference numerals are as follows:

[0036] 1-Multi-optical path laser head; 2-Laser focusing lens group; 3-Fiber laser; 4-Semiconductor laser; 5-Powder feeding head; 6-Double barrel powder feeder; 7-Drive motor; 8-Screw rod; 9-Screw slider; 10-Controller. DETAILED DESCRIPTION

[0037] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments, but the protection scope of the present invention is not limited thereto.

[0038] The red / blue dual laser deposition device for nickel / copper dissimilar metals with imitation mortise and tenon structure described in this embodiment includes a fiber laser 3, a semiconductor laser 4, a multi-path laser head 1, a powder feeding component and a controller 10. Figure 1 Schematic diagram of the structure of the red / blue dual laser deposition device described in this embodiment.

[0039] The fiber laser 3 is used to emit a red laser with a wavelength of 632.8nm, and the semiconductor laser 4 is used to emit a blue laser with a wavelength of 450nm. The multi-path laser head 1 is provided with a laser inlet connected to the fiber laser 3 and the semiconductor laser 4 in the vertical direction, and a laser outlet is provided in the vertical direction below the multi-path laser head 1. The multi-path laser head 1 is provided with a laser focusing lens group 2 and a lens height adjustment component for adjusting the distance between the laser focusing lens group 2 and the laser outlet. The laser focusing lens group 2 includes two convex lenses arranged horizontally along the axis direction of the multi-path laser head. Figure 2 The figure is a schematic diagram of the optical paths of the red laser and the blue laser in the multi-optical path laser head 1 of the present invention. The lens height adjustment assembly includes a set of lead screw adjustment mechanisms for each convex lens, each set of lead screw adjustment mechanisms includes a lead screw slider 9, a lead screw 8 and a drive motor 7. Figure 3The structure diagram of the lens height adjustment assembly of the present invention is shown in FIG. The drive motor 7 is installed on the multi-path laser head 1, and its output end is connected to the lead screw 8. The lead screw slider 7 is sleeved on the lead screw 8 and is threadedly connected to the lead screw 8. The convex lens is fixed on the corresponding lead screw slider 9. The drive motors 7 in the lens height adjustment assembly are all connected to the controller 10. Figure 4 The red laser and the blue laser are focused by the laser focusing lens group 2, then emitted from the laser outlet, and focused on the processing plane to form a composite laser spot.

[0040] The powder feeding assembly includes a double-barrel powder feeder 6 and two powder feeding heads 5 connected to the outlet end of the double-barrel powder feeder 6 by separate pipelines. The powder feeding head 5 is installed on the multi-path laser head 1, and the extension line of the central axis of the powder feeding head 5 intersects with the extension line of the central axis of the multi-path laser head 1 to ensure that the laser beam from the laser outlet and the powder from the outlet of the powder feeding head 5 converge.

[0041] The controller 10 is used to control the opening and closing of the fiber laser 3 and the semiconductor laser 4, the powder feeding of the double-barrel powder feeder 6, and the operation of the lens height adjustment component to meet the designed deposition requirements of heterogeneous metals, wherein the control of the lens height adjustment component includes: according to the required width of the deposited metal and the required spot diameter on the processing plane, combined with the transmission and focusing characteristics of the laser, by synchronously controlling the drive motor 7 in the lens height adjustment component to rotate in the same direction for the same number of turns to adjust the distance between the laser focusing lens group 2 and the laser outlet.

[0042] The controller 10 determines the number of turns that the lead screw needs to rotate according to the spot diameter. Specifically, the relationship between the spot diameter and the number of turns that the lead screw needs to rotate is as follows: the lead screw 8 is located at the origin before adjustment. Assuming that the distance between the optical center of the lower convex lens in the laser focusing lens group 2 and the laser outlet is Y, the distance between the optical center of the lower convex lens and the laser outlet after adjustment is h, the number of turns that the lead screw needs to rotate is r, and the thread spacing on the lead screw is d, and h satisfies: h = Y + r * d. Assuming that the required spot diameter is a, the focal length of the convex lens is f, and the diameter of the convex lens is D, it satisfies: a = (Y + r * df) * D / f.

[0043] In the red / blue dual laser deposition device described in this embodiment, the thread pitch of the lead screw 8 is 0.1mm, the focal length f of the convex lens is 25mm, and the lens diameter D is 50mm. When the lead screw 8 is at the origin, the distance between the optical center of the lower convex lens in the laser focusing lens group 2 and the laser outlet is 25.5mm, and the diameter of the laser spot is 1mm. When the diameter of the laser spot needs to be adjusted to 2mm, h=26mm, r=5 turns; when the diameter of the laser spot needs to be adjusted to 3mm, h=26.5mm, r=10 turns; when the diameter of the laser spot needs to be adjusted to 4mm, h=27mm, r=15 turns.

[0044] Based on the above red / blue dual laser deposition equipment, the method for preparing nickel / copper dissimilar metals with imitation mortise and tenon structure of the present invention comprises the following steps:

[0045] S1: The controller 10 starts the fiber laser 3 and controls the double-barrel powder feeder 6 to feed nickel alloy powder to the powder feeder head 5, and prepares nickel alloy on the substrate by laser powder deposition as a nickel alloy matrix layer. The particle size of the nickel alloy powder is 50-150 μm, and the thickness of the nickel alloy matrix layer is 21 mm.

[0046] S2: On the surface of the formed nickel-based alloy substrate, continue to use red light laser to deposit a single pass of nickel-based alloy with a spot diameter of 1 mm and an interval of 4 mm. The laser process parameters remain unchanged. At this time, the lead screws are all located at the origin, and the distance between the optical center of the lower convex lens in the laser focusing lens group 2 and the laser outlet is Y.

[0047] S3: After completing the deposition of a single nickel-based alloy, the fiber laser is kept working, and the controller 10 turns on the semiconductor laser 4 to emit a blue laser coaxial with the red laser. The spots of the two lasers overlap, and at the same time, the controller 10 controls the powder feeding head 5 to stop conveying titanium alloy powder and instead convey copper alloy powder, wherein the particle size of the copper alloy powder is 50 to 150 μm. The controller 10 controls the lens height adjustment assembly, rotates the screw 8 clockwise for 15 turns, adjusts the spot diameter to 4 mm, and deposits a single copper alloy at the interval between adjacent single nickel-based alloys, and the duration of the blue laser is t. The working time t of the semiconductor laser in a single layer, the laser scanning speed v, the number of copper alloys in a single layer N, and the length w of a single layer satisfy a quantitative relationship: t = Nw / v. At this point, the deposition of the first layer of the interface imitation mortise and tenon structure is completed.

[0048] S4. After the first layer of deposition is completed, the lead screws 8 in the lens height adjustment assembly are driven by the corresponding drive motors 7 to return to the origin, and then rotate clockwise for 5 turns respectively, so that the distance between the optical center of the lower convex lens in the laser focusing lens group 2 and the laser outlet becomes 26mm, thereby adjusting the spot diameter of the deposited nickel-based alloy single track to 2mm. At the same time, the semiconductor laser stops working, and a single red laser is used to deposit a nickel-based alloy single track in the same manner as step S2, and the interval between the nickel-based alloy single tracks is 3mm. The spot diameter a, the number of turns r driven by the drive motor 7, the thread pitch d of the lead screw, the focal length f of the convex lens, the convex lens diameter D and the distance h between the optical center of the lower convex lens in the laser focusing lens group (2) and the laser outlet meet the quantitative relationship: h = Y + r * d, a = (Y + r * df) * D / f. The distance between the convex lens and the laser outlet increases, and the spot diameter increases.

[0049] S5. After the deposition of a single nickel-based alloy is completed, the screw rods 8 in the lens height adjustment assembly are driven by the corresponding drive motors 7 to return to the origin, and then rotate clockwise for 10 turns, so that the distance between the optical center of the lower convex lens in the laser focusing lens group 2 and the laser outlet is 26.5mm, and the spot diameter of the deposited copper alloy single track is adjusted to 3mm. At the same time, the semiconductor laser starts to work, and the copper alloy is deposited at the interval of the second nickel-based alloy layer with a spot diameter of 3mm, and the arrangement of the nickel-based alloy and the copper alloy is the same as the first layer. At this point, the second layer of the mortise and tenon structure is deposited.

[0050] S6. Repeat the step once, depositing nickel-based alloy and copper alloy with spot diameters of 1mm, 2mm, 3mm and 4mm, 3mm, 2mm, respectively, to complete the construction of the interface imitation mortise and tenon structure. The total number of layers of the mortise and tenon structure is 3, the deposition thickness of the single-layer mortise and tenon structure is 0.7mm, and the total thickness of the 3-layer mortise and tenon structure is 21mm. When depositing the nickel alloy, the laser power emitted by the fiber laser is 1800w and the scanning speed is 10mm / s. When depositing the copper alloy, the laser power emitted by the fiber laser is 800w, and the laser power emitted by the semiconductor laser is 1000w and the scanning speed is 10mm / s.

[0051] S7. After the deposition of the imitation mortise and tenon structure on the interface is completed, the blue laser remains coaxial and overlapped with the red laser to complete the deposition of the copper alloy matrix. At this point, the deposition of the nickel / copper dissimilar metals of the imitation mortise and tenon structure is completed. Figure 5 Schematic diagram of the red / blue dual laser deposition path described in this embodiment.

[0052] The nickel / copper dissimilar metal of the imitation mortise and tenon structure prepared by the above preparation method comprises a nickel alloy layer, a mortise and tenon inlay layer and a copper alloy layer stacked in sequence. In the mortise and tenon inlay layer, in the extension plane of the copper alloy layer and / or the nickel alloy layer, a single copper alloy and a single nickel alloy are alternately arranged, and from the nickel alloy layer to the copper alloy layer, the width of the single nickel alloy gradually decreases, and the width of the single copper alloy gradually increases, and the reduction and / or increase of the two are the same.

[0053] The embodiments are preferred implementations of the present invention, but the present invention is not limited to the above-mentioned implementations. Any obvious improvements, substitutions or modifications that can be made by those skilled in the art without departing from the essential content of the present invention belong to the protection scope of the present invention.

Claims

1. A red / blue dual laser deposition device, characterized in that: It comprises a fiber laser (3), a semiconductor laser (4), a multi-light path laser head (1), a powder feeding component and a controller (10); The fiber laser (3) is used to emit red laser light, and the semiconductor laser (4) is used to emit blue laser light; the multi-path laser head (1) is provided with a laser inlet connected to the fiber laser (3) and the semiconductor laser (4) at the top in the vertical direction, and a laser outlet is provided at the bottom in the vertical direction of the multi-path laser head (1); a laser focusing lens group (2) and a lens height adjustment component for adjusting the distance between the laser focusing lens group (2) and the laser outlet are provided in the multi-path laser head (1); the red laser light and the blue laser light are focused by the laser focusing lens group (2) and emitted from the laser outlet, and are focused on the processing plane to form a composite laser spot; The powder feeding assembly comprises a double-barrel powder feeder (6) and two powder feeding heads (5) connected to the outlet ends of the double-barrel powder feeder (6) by separate pipelines; the powder feeding head (5) is mounted on the multi-light path laser head (1), and the extension line of the central axis of the powder feeding head (5) intersects with the extension line of the central axis of the multi-light path laser head (1) to ensure that the laser beam from the laser outlet converges with the powder from the outlet of the powder feeding head (5); The controller (10) is used to control the start and stop of the fiber laser (3) and the semiconductor laser (4), the powder feeding of the double-barrel powder feeder (6), and the operation of the lens height adjustment component to meet the designed deposition requirements of heterogeneous metals.

2. The red / blue dual laser deposition device according to claim 1, characterized in that: The laser focusing lens group (2) comprises at least one convex lens arranged horizontally along the axis direction of the multi-path laser head; the lens height adjustment assembly comprises a set of lead screw adjustment mechanisms equipped for each convex lens, each set of lead screw adjustment mechanisms comprises a lead screw slider (9), a lead screw (8) and a drive motor (7); the drive motor (7) is mounted on the multi-path laser head (1), and its output end is connected to the lead screw (8); the lead screw slider (9) is sleeved on the lead screw (8) and is threadedly connected to the lead screw (8); the convex lens is fixed on the corresponding lead screw slider (9); the drive motors (7) in the lens height adjustment assembly are all connected to a controller (10).

3. The red / blue dual laser deposition device according to claim 2, characterized in that: The controller (10) controls the lens height adjustment component by: adjusting the distance between the laser focusing lens group (2) and the laser outlet by synchronously controlling the drive motor (7) in the lens height adjustment component to rotate in the same direction and the same number of revolutions according to the required width of the deposited metal and the required spot diameter on the processing plane, combined with the transmission and focusing characteristics of the laser.

4. The red / blue dual laser deposition device according to claim 1, characterized in that: The wavelength of the red laser emitted by the optical fiber laser is 600-700 nm, and the wavelength of the blue laser emitted by the semiconductor laser is 400-600 nm.

5. The red / blue dual laser deposition device according to claim 4, characterized in that: Before adjustment, the lead screw (8) is located at the origin. Assuming that the distance between the optical center of the lower convex lens in the laser focusing lens group (2) and the laser outlet is Y, after adjustment, the distance between the optical center of the lower convex lens and the laser outlet is h, the number of turns required by the lead screw is r, the thread spacing on the lead screw is d, and h satisfies: h=Y+r*d; assuming that the required spot diameter is a, the focal length of the convex lens is f, and the diameter of the convex lens is D, it satisfies: a=(Y+r*df)*D / f.

6. A method for preparing nickel / copper dissimilar metals with imitation mortise and tenon structure using the red / blue dual laser deposition device according to any one of claims 1 to 5, characterized in that: The following steps are involved: S1: The controller (10) starts the fiber laser (3) and controls the double-barrel powder feeder (6) to feed nickel alloy powder to the powder feeder head (5), and prepares the nickel alloy on the substrate by laser powder deposition as a nickel alloy matrix layer; S2: On the surface of the formed nickel-based alloy substrate, a single pass of nickel-based alloy with a spot diameter of a1 mm and an interval of b1 mm is continuously deposited using a red laser. The laser process parameters remain unchanged. At this time, the lead screws are all located at the origin, and the distance between the optical center of the lower convex lens in the laser focusing lens group (2) and the laser outlet is Y; S3: After the single-channel nickel-based alloy deposition is completed, the fiber laser is kept working, the controller (10) turns on the semiconductor laser (4) to emit a blue laser coaxial with the red laser, the spots of the two lasers overlap, and at the same time the controller (10) controls the powder feeding head (5) to stop conveying the titanium alloy powder and instead convey the copper alloy powder; the screw rod (8) in the lens height adjustment assembly is driven by the corresponding drive motor (7) to rotate the same number of turns r1 clockwise, adjust the spot diameter to b1 mm, and deposit a single channel of copper alloy at the interval between adjacent single channels of nickel-based alloy, and the duration of the blue laser is t; the working time t of the semiconductor laser in the single layer, the laser scanning speed v, the number of channels N of the copper alloy in the single layer, and the single channel length w satisfy the quantitative relationship: t = Nw / v; at this point, the deposition of the first layer of the interface imitation mortise and tenon structure is completed; S4. After the deposition of the first layer is completed, the lead screws (8) in the lens height adjustment assembly are driven by the corresponding drive motors (7) to return to the origin, and then rotate clockwise the same number of turns r2 to adjust the spot diameter to a2 mm; at the same time, the semiconductor laser stops working, and a single red laser is used to deposit a single nickel-based alloy track in the same manner as step S2, with a single nickel-based alloy track interval b2 mm; the spot diameter a, the number of turns r of the lead screw driven by the drive motor (7), the thread pitch d of the lead screw, the focal length f of the convex lens, the diameter D of the convex lens, and the distance h between the optical center of the lower convex lens in the laser focusing lens group (2) and the laser outlet satisfy a quantitative relationship: h = Y + r * d, a = (Y + r * df) * D / f; the distance between the convex lens and the laser outlet increases, and the spot diameter increases; S5. After the single-pass deposition of the nickel-based alloy is completed, the lead screws (8) in the lens height adjustment assembly are driven by the corresponding drive motors (7) to return to the origin, and then rotate clockwise by the same number of turns r3 to adjust the spot diameter to b2 mm; at the same time, the semiconductor laser starts to work, and deposits the copper alloy with a spot diameter of b2 at the interval of the second layer of the nickel-based alloy, and the arrangement of the nickel-based alloy and the copper alloy is the same as that of the first layer, and the second layer of the mortise and tenon structure is deposited; S6. Repeat steps (4)-(5) n-2 times, depositing nickel-based alloy and copper alloy with spot diameters a3, a4... and b3, b4..., respectively, to complete the construction of the interface imitation mortise and tenon structure; the total number of layers of the mortise and tenon structure is n; the spot diameters a1, a2, a3, a4... increase in sequence along the deposition direction, and the spot diameters b1, b2, b3, b4... decrease in sequence along the deposition direction, and satisfy the relationship: a1+b1=a2+b2=....=a n +b n ; S7. After the deposition of the simulated mortise and tenon structure on the interface is completed, the blue laser is kept coaxial and overlapping with the red laser to complete the deposition of the copper alloy matrix; at this point, the deposition of the nickel / copper dissimilar metals of the simulated mortise and tenon structure is completed.

7. The method for preparing nickel / copper dissimilar metals of imitation mortise and tenon structure according to claim 6, characterized in that: The particle size of the nickel alloy powder is 50 to 150 μm; the particle size of the copper alloy powder is 50 to 150 μm.

8. The method for preparing nickel / copper dissimilar metals of imitation mortise and tenon structure according to claim 6, characterized in that: When depositing nickel alloy, the laser power emitted by the fiber laser is 1800W and the scanning speed is 10mm / s; when depositing copper alloy, the laser power emitted by the fiber laser is 800W, and the laser power emitted by the semiconductor laser is 1000W and the scanning speed is 10mm / s.

9. The nickel / copper dissimilar metal with imitation mortise and tenon structure prepared by the preparation method of claim 6, characterized in that: It comprises a nickel alloy layer, a mortise and tenon inlay layer and a copper alloy layer stacked in sequence; in the mortise and tenon inlay layer, in the extension plane of the copper alloy layer and / or the nickel alloy layer, a single copper alloy and a single nickel alloy are alternately arranged, and from the nickel alloy layer to the copper alloy layer, the width of the single nickel alloy gradually decreases, and the width of the single copper alloy gradually increases, and the reduction and / or increase of the two are the same.

10. The nickel / copper dissimilar metal of imitation mortise and tenon structure according to claim 9, characterized in that: The width of a single nickel alloy and a single copper alloy in the mortise and tenon inlay layer is 1-4 mm; the thickness of the mortise and tenon structure is H, in mm, H=0.7n, and n is the number of deposited layers of the mortise and tenon structure.

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