Blanking apparatus and method for manufacturing electrode plate using same

Abstract

A blanking apparatus and a method of manufacturing an electrode plate using the same are provided. The blanking apparatus for a secondary battery electrode plate includes: a first mold including a mold and a first stripper, the mold surrounding the first stripper and having a structure having one open side portion, and the first stripper having a structure having one open side portion aligned with the one open side portion of the mold; and a second mold facing the first mold, the second mold including a punch and a second stripper, and the first mold being movable toward the second mold.

Description

Technical Field

[0001] The present disclosure relates to a punching device and a method for manufacturing an electrode plate using the punching device. Specifically, the present disclosure relates to a punching device having a structure in which one side portion is opened and a method for manufacturing an electrode plate using the punching device. Background Art

[0002] Secondary batteries are rechargeable batteries that can be charged and discharged multiple times. Secondary batteries are mainly used in various application fields, such as electronic devices (smart phones, laptops, tablet computers, etc.), electric vehicles, solar power generation, and emergency power supplies. For example, lithium-ion batteries have high energy density and high charge / discharge efficiency, and are used in various electronic devices and electric vehicles.

[0003] The positive electrode plate and the negative electrode plate of the lithium ion battery can be manufactured by applying the positive electrode active material to the positive electrode electron collector in the form of a metal film (e.g., aluminum foil) and by applying the negative electrode active material to the negative electrode electron collector in the form of a metal film (e.g., copper foil). For example, the electrode plate manufacturing process may include a mixing, coating and pressing process for manufacturing a roll-shaped metal film substrate coated with an active material, and a slitting and notching process for cutting the roll-shaped metal film substrate according to the battery specifications.

[0004] The above information disclosed in this Background section is for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute related (or prior) art. Summary of the invention

[0005] Aspects of an embodiment provide a punching device for a secondary battery electrode plate, the punching device comprising: a first mold, comprising a die and a first stripper, the mold surrounding the first stripper and having a structure having an open side portion, and the first stripper having a structure having an open side portion aligned with an open side portion of the mold; and a second mold facing the first mold, the second mold comprising a punch and a second stripper, and the first mold is movable toward the second mold.

[0006] According to an embodiment of the present disclosure, the first stripper may include a vertical portion perpendicular to the longitudinal direction of an open side portion of the first stripper, a first horizontal portion and a second horizontal portion extending in the longitudinal direction of an open side portion of the first stripper at both ends of the vertical portion, and a wiring piece portion protruding from an outer portion of the first horizontal portion, and the first horizontal portion and the second horizontal portion may be separated from each other, with an open side portion of the first stripper between the first horizontal portion and the second horizontal portion.

[0007] According to an embodiment of the present disclosure, the mold may surround only outer portions of the first horizontal portion, the tab portion, the vertical portion, and the second horizontal portion of the first stripper.

[0008] According to an embodiment of the present disclosure, the punch may have a closed structure when viewed in a plan view, and the first and second horizontal portions of the first stripper overlap an edge of the punch when viewed in a plan view.

[0009] According to an embodiment of the present disclosure, the second stripper may surround an outer portion of the punch.

[0010] According to an embodiment of the present disclosure, the die and the first stripper may face the second stripper and the punch, respectively.

[0011] According to an embodiment of the present disclosure, the die and the first stripper may be configured to be movable together toward the second stripper and the punch, and the die and the second stripper may be configured to be movable together toward the bottom of the punch so that the die is not aligned with the first stripper.

[0012] According to an embodiment of the present disclosure, the first mold may further include a die plate accommodating the die and the first stripper, and a first base plate coupled to the die plate.

[0013] According to an embodiment of the present disclosure, the second die may further include a punch plate accommodating the punch and the second stripper, and a second base plate coupled to the punch plate.

[0014] According to an embodiment of the present disclosure, the blanking device may further include a main guide column connecting the first substrate plate to the second substrate plate, a sub-guide column connecting the template to the second substrate plate, and a punch guide column connecting the second stripper to the second substrate plate.

[0015] According to an embodiment of the present disclosure, the main guide pillars and the sub-guide pillars may be configured to guide the first mold toward the second mold.

[0016] According to an embodiment of the present disclosure, the sub-guide pillar may be configured to guide the template and the die toward the bottom of the punch from a state in which the die and the first stripper are aligned with and contacted by the second stripper and the punch, respectively.

[0017] According to an embodiment of the present disclosure, the punch guide column may be configured to guide the second stripper toward the bottom of the punch from a state in which the die and the first stripper are aligned with and respectively contact the second stripper and the punch.

[0018] According to an embodiment of the present disclosure, the blanking device may further include an electrode plate conveying device insertable into the aligned opened side portions of the die and the first stripper.

[0019] Aspects of the embodiments also provide a method for manufacturing an electrode plate for a secondary battery, the method comprising: aligning a substrate between a first mold and a second mold of a punching device, the first mold having an open side portion in a direction in which the substrate is pulled out; lowering the first mold toward the second mold to fix the substrate; making an electrode plate by punching the substrate; and conveying the electrode plate to a subsequent process by an electrode plate conveying device, the electrode plate conveying device entering an open side portion of the first mold.

[0020] According to an embodiment of the present disclosure, one open side portion of the first mold may be parallel to a transfer direction of the substrate between the first mold and the second mold.

[0021] According to an embodiment of the present disclosure, aligning the substrate between the first and second dies of the blanking device may include supplying the substrate between the first and second dies in a direction oriented from a closed side portion of the first die toward an open side portion of the first die.

[0022] According to an embodiment of the present disclosure, aligning the substrate between the first die and the second die of the blanking device may include aligning the substrate so that cutting lines in a punching region of the blanking device are continuously formed.

[0023] According to an embodiment of the present disclosure, lowering a first mold toward a second mold to fix a substrate may include: fixing the substrate between the first mold including a mold and a first stripper and the second mold including a punch and a second stripper by lowering the first mold toward the second mold; and applying tension to the substrate by an electrode plate conveying device entering an open side portion of the first mold.

[0024] According to an embodiment of the present disclosure, manufacturing the electrode plate by punching out the substrate may include lowering a mold and a second stripper together to punch out the substrate in a state in which the substrate is fixed.

[0025] These and other aspects and features of the present disclosure will be described in or will be apparent from the following description of embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings attached to this specification illustrate embodiments of the present disclosure, and together with the detailed description of the present disclosure, further describe aspects and features of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the accompanying drawings:

[0027] Figure 1 A front view showing a blanking device according to an embodiment of the present disclosure is shown;

[0028] Figure 2 A front view showing a blanking device in a state where a first die is lowered according to an embodiment of the present disclosure is shown;

[0029] Figure 3 shows a plan view showing a first mold according to an embodiment of the present disclosure;

[0030] Figure 4 shows a plan view showing a second mold according to an embodiment of the present disclosure;

[0031] Figure 5 shows a plan view showing a first stripper according to an embodiment of the present disclosure;

[0032] Figure 6 shows a plan view showing a mold according to an embodiment of the present disclosure;

[0033] Figure 7 shows a plan view showing a punch and a second stripper according to an embodiment of the present disclosure;

[0034] Figure 8 A process of cutting a metal thin film substrate by using a punching device according to an embodiment of the present disclosure is shown;

[0035] Fig. 9 The process of extracting the electrode plate by the electrode plate conveying device when cutting the metal film substrate according to the embodiment of the present disclosure is shown;

[0036] Fig.10 A process of manufacturing an electrode plate by using a punching device according to an embodiment of the present disclosure is shown; and

[0037] Fig.11 A flowchart showing an example of a method of manufacturing an electrode plate for a secondary battery according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0038] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The terms or words used in the present specification and claims should not be interpreted as limited to the usual or dictionary meanings, but should be interpreted as meanings and concepts consistent with the technical idea of ​​the present disclosure based on the principle that the inventor can be his / her own lexicon compiler to appropriately define the concept of the term so as to interpret his / her invention in the best manner.

[0039] The embodiments described in this specification and the configurations shown in the drawings are only some embodiments of the present disclosure and do not represent all technical ideas, aspects and features of the present disclosure. Therefore, it should be understood that when submitting this application, various equivalents and modifications may be used to replace or modify the embodiments described herein.

[0040] It should be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, connected to, or coupled to the other element or layer, or one or more intervening elements or layers may also be present. When an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For example, when a first element is described as being "coupled to" or "coupled to" a second element, the first element may be directly coupled or coupled to the second element, or the first element may be indirectly coupled or coupled to the second element via one or more intervening elements.

[0041] In the figure, the size of various elements, layers, etc. may be exaggerated for clarity of illustration. The same reference numerals represent the same elements. As used herein, the term "and / or" includes any and all combinations of one or more related listed items. In addition, when describing the embodiments of the present disclosure, the use of "may" relates to "one or more embodiments of the present disclosure". Expressions such as "at least one of ... " and "any one of ... ", when after the element list, modify the entire element list without modifying the individual elements of the list. When phrases such as "at least one of A, B and C", "at least one of A, B or C", "at least one selected from the group of A, B and C" or "at least one selected from A, B and C" are used to represent the list of elements A, B and C, the phrase may refer to any and all suitable combinations or subsets of A, B and C, such as A, B, C, A and B, A and C, B and C, or A and B and C. As used herein, the terms "use", "use ... " and "being used" may be considered to be synonymous with the terms "utilize", "utilize ... " and "being utilized" respectively. As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, rather than terms of degree, and are intended to account for the inherent variations in measurements or calculations that those of ordinary skill in the art would recognize.

[0042] It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts here, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teaching of the example embodiments, the first element, component, region, layer or part discussed below can be referred to as the second element, component, region, layer or part.

[0043] For ease of description, spatial relational terms such as "below", "below", "lower", "above", "upper", etc. may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figure. It should be understood that, in addition to the orientations described in the accompanying drawings, spatial relational terms are intended to include different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as being "below" or "below" other elements or features will be oriented "above" or "above" other elements or features. Therefore, the term "below" can include both above and below orientations. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relational descriptors used here should be interpreted accordingly.

[0044] The terms used herein are for the purpose of describing the embodiments of the present disclosure and are not intended to limit the present disclosure. As used herein, the singular forms "a" and "an" are also intended to include the plural forms, unless the context clearly indicates otherwise. It will also be understood that when the terms "includes", "including", "comprises" and / or "comprising" are used in this specification, the existence of the stated features, integers, steps, operations, elements and / or components is specified, but the existence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof is not excluded.

[0045] In addition, any numerical range disclosed and / or quoted herein is intended to include all sub-ranges of the same numerical precision included in the reference range. For example, the range of "1.0 to 10.0" is intended to include all sub-ranges between the minimum value 1.0 and the maximum value 10.0 (including the minimum value 1.0 and the maximum value 10.0), that is, with a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit described in this specification is intended to include all higher numerical limits contained therein. Therefore, the applicant reserves the right to modify this specification (including claims) to clearly list any sub-ranges included in the range clearly listed herein. All these ranges are intended to be inherently described in this specification.

[0046] Referring to two compared elements, features, etc. as being "the same" may mean that they are "substantially the same." Thus, the phrase "substantially the same" may include situations with deviations that are considered low in the art, such as a deviation of 5% or less. In addition, when a parameter is referred to as being uniform over a given area, this may mean that it is uniform with respect to an average value.

[0047] Throughout the specification, unless otherwise specified, each element may be in the singular or in the plural.

[0048] Arranging an arbitrary element “on (or below)” or “over (under)” another element may mean that the arbitrary element may be disposed in contact with the upper (or lower) surface of the element, and another element may also be interposed between the element and any element disposed on (or under) the element.

[0049] Furthermore, it should be understood that when a component is referred to as being “linked,” “coupled” or “connected” to another component, these elements may be directly “linked,” “coupled” or “connected” to each other or another component may be “interposed” between these components.

[0050] Throughout the specification, unless otherwise specified, when "A and / or B" is stated, it means A, B, or A and B. That is, "and / or" includes any or all combinations of the listed multiple items. Unless otherwise specified, when "C to D" is stated, it means C or more and D or less.

[0051] Figure 1 A front view showing a blanking device according to an embodiment of the present disclosure is shown.

[0052] refer to Figure 1 The punching device 100 according to the present disclosure may be a punching die that can punch a continuously provided metal film substrate and cut the metal film substrate into electrode plates according to a predetermined standard. Figure 1 , the blanking device 100 may include a first die 110 and a second die 120. Herein, the first die 110 may be referred to as an upper die. In addition, the second die 120 may be referred to as a lower die.

[0053] The first mold 110 may include a first base plate 112, a template 114, a mold 116, and a first peeler 118. The first mold 110 may be vertically movable in a direction parallel to the gravity direction (eg, move up and down relative to the second mold 120).

[0054] The template 114 may be fixedly coupled to a lower portion of the first base plate 112, for example, the template 114 may be fixedly coupled to a portion of the first base plate 112 that faces the second mold 120. The mold 116 and the first stripper 118 may be buried (e.g., embedded) in the template 114. For example, the template 114 may have a space in which the mold 116 and the first stripper 118 may be accommodated. The mold 116 and the first stripper 118 may each be coupled to the template 114 by a connecting member (e.g., the mold 116, the first stripper 118, and the surfaces of the template 114 that face the second mold 120 may be coplanar).

[0055] The die 116 may accommodate a first stripper 118, for example, the first stripper 118 may fit into a space within or surrounded by the die 116. The first stripper 118 may correspond to (e.g., overlap) at least a portion of the profile of a punch 126 installed in the second die 120, and may fix the pulled-in metal film substrate during the blanking process.

[0056] According to an embodiment, the mold 116 and the first stripper 118 may each be designed to have an open side portion, as will be described below with reference to Figure 3 The blanking device 100 may be configured so that the substrate is supplied in the opening direction of the die 116. Figure 3 , Figure 4 , Figure 6 and Figure 7 A detailed description of the shapes of the mold 116 and the first stripper 118 is described.

[0057] The second die 120 may include a second base plate 122, a punch plate 124, a punch 126, and a second stripper 128. Figure 1 As shown, the second mold 120 may be disposed below the first mold 110 , for example, the first mold 110 and the second mold 120 may vertically overlap each other.

[0058] The punch plate 124 may be coupled to an upper portion of the second base plate 122, for example, the punch plate 124 may be coupled to a portion of the second base plate 122 that faces the first die 110. The second stripper 128 and the punch 126 may be buried (e.g., embedded) in the punch plate 124. For example, the punch plate 124 may have a space in which the second stripper 128 and the punch 126 may be accommodated. The second stripper 128 and the punch 126 may each be coupled to the punch plate 124 by a connecting member. In addition, the punch guide column 150 may connect the second stripper 128 to the second base plate 122. Here, the punch guide column 150 may guide the movement (e.g., lifting or lowering) of the second stripper 128.

[0059] The punch 126 may be formed into a shape corresponding to a predetermined standard. When the first die 110 is lowered (e.g., moved toward the second die 120), the punch 126 may contact the first stripper 118 (e.g., via the metal film substrate) and may fix the metal film substrate (e.g., between the punch 126 and the first stripper 118). In addition, the second stripper 128 may accommodate the contour of the punch 126. When the first die 110 is lowered, the second stripper 128 may contact the die 116 and may cut the metal film substrate that moves downward with the die 116.

[0060] The first die 110 and the second die 120 of the blanking device 100 may be assembled to be separated from each other (e.g., separable) and connected to each other (e.g., connectable) through the main guide pillars 130 and the sub-guide pillars 140. For example, the main guide pillars 130 may connect the first base plate 112 to the second base plate 122. The sub-guide pillars 140 may connect the template 114 to the second base plate 122.

[0061] The main guide pins 130 and the sub-guide pins 140 may be designed to guide the movement (e.g., lifting or lowering) of the first mold 110. For example, the main guide pins 130 may guide the first base plate 112 to be lifted or lowered (e.g., the first base plate 112 may be moved toward or away from the second mold 120 along the main guide pins 130), and the sub-guide pins 140 may guide the template 114 to be lifted or lowered. In another example, the main guide pins 130 and the sub-guide pins 140 may be designed to guide the first lowering of the first mold 110, so that the first mold 110 may be lifted or lowered together with the components connected to the first base plate 112 and the template 114. Figure 2 A description is made of the lowering operation of the first mold 110 .

[0062] In addition to the above components, Figure 1 The blanking device 100 shown may further include components required for manufacturing an electrode plate for a secondary battery.

[0063] Figure 2 FIG. 2 shows a front view of a blanking device 200 according to an embodiment of the present disclosure in a state where the first die is lowered. The blanking device 200 can be formed by lowering the first die (e.g., Figure 1 The first die 110 in the blanking device 200 is used to fix and cut the metal film substrate to manufacture an electrode plate for a secondary battery of a certain standard. Figure 1 The blanking device 100 is basically the same.

[0064] First, refer to Figure 2 When the first mold is lowered toward the second mold, the first mold and the second mold (for example, Figure 1 The metal film substrate between the second mold 120 in the embodiment of the present invention is as follows. Figure 2 As shown, the first mold may be lowered to fix the metal film substrate provided between the die 216 and the first stripper 218 of the first mold and the punch 226 and the second stripper 228 of the second mold. For example, at this time, the metal film substrate may be contacted by the first mold and the second mold at the same time and firmly held between the first mold and the second mold.

[0065] Thereafter, the mold 216 of the first mold and the second stripper 228 of the second mold may be lowered for a second time, thereby cutting the metal film substrate with a predetermined standard. For example, in a state where the first mold is lowered to fix the metal film substrate provided between the mold 216 and the first stripper 218 of the first mold and the punch 226 and the second stripper 228 of the second mold, the mold 216 of the first mold and the second stripper 228 of the second mold may be lowered for a second time, thereby cutting the metal film substrate with a predetermined standard. For example, when the metal film substrate is firmly held between the first mold and the second mold, the mold 216 of the first mold and the second stripper 228 of the second mold may be moved simultaneously (e.g., together and simultaneously) in a direction directed from the first mold toward the second mold, so that the portion of the metal film substrate overlapped by the mold 216 and the second stripper 228 may be cut from the rest of the metal film substrate.

[0066] The sub-guide pin 240 and the punch guide pin 250 of the blanking device 200 can guide the template 214 and the die 216 of the first die and the second stripper 228 of the second die to be raised or lowered. For example, in a state where the die 216 and the first stripper 218 are in contact with the second stripper 228 and the punch 226, respectively, the sub-guide pin 240 can guide the template 214 and the die 216 of the first die to be lowered for the second time. In addition, in a state where the die 216 and the first stripper 218 are in contact with the second stripper 228 and the punch 226, respectively, the punch guide pin 250 can guide the second stripper 228 of the second die to be lowered for the second time.

[0067] Figure 3 FIG. 2 shows a plan view of a first mold 300 according to an embodiment of the present disclosure. The first mold 300 may have Figure 1 The first mold 110 has substantially the same structure.

[0068] refer to Figure 3 , the first mold 300 may include a first base plate 310, a template 320, a mold 330, and a first stripper 340. The first mold 300 (eg, Figure 1 The first die 110 in the punching device may have an opening in the direction in which the metal film substrate provided in the punching device is discharged. For example, the first base plate 310, the template 320, the mold 330 and the first stripper 340 may be formed so that an opening is formed in the direction in which the metal film substrate is discharged. Figure 3 As shown, each of the first base plate 310, the template 320, the mold 330, and the first stripper 340 may have an opening on one side thereof when viewed in a top view. Figure 3As shown, when viewed in a top view, each of the first base plate 310, the template 320, the mold 330, and the first stripper 340 may have three sides that are perpendicular to each other and continuously connected to each other, and may include an opening in a fourth side (e.g., the fourth side may face the second side between the first side and the third side). Figure 3 As shown, the openings in the first substrate plate 310, the template 320, the mold 330, and the first stripper 340 can face the same direction and can be aligned with each other to define a single and continuous opening (i.e., an open area 350) that partially intersects with each of the first substrate plate 310, the template 320, the mold 330, and the first stripper 340.

[0069] The first base plate 310 may be coupled to the template 320. The first mold 300 is positioned in the second mold (eg, Figure 1 In the case where the template 320 is on an upper portion of the second mold 120 in the mold, the template 320 may be coupled to a lower portion of the first base plate 310 by a connecting member.

[0070] The first base plate 310 may be assembled with the main guide bushings 312a, 312b, 312c, and 312d, the main guide posts (eg, Figure 1 The main guide tubes of the main guide posts 130 in the main guide column 130 may be respectively inserted into the main guide bushings 312a, 312b, 312c and 312d. For example, the main guide bushings 312a, 312b, 312c and 312d may be fixedly coupled to the first base plate 310 by a connecting member. The main guide posts may be designed to move up and down while the main guide tubes are respectively inserted into the main guide bushings 312a, 312b, 312c and 312d. The main guide posts may be designed to allow the main guide tubes to move up and down, for example, by a plane guide method or a ball guide method.

[0071] The template 320 may be formed with sub-guide post holes 322a, 322b, 322c, and 322d, which are through holes, and the sub-guide posts (eg, Figure 1 One end of the sub-guide post 140 in the mold is fixed in each perforation. The sub-guide bushing can be installed in the second mold (for example, Figure 1 The punch plate (e.g., Figure 1 The sub-guide post may be designed to move up and down when the sub-guide tube is inserted into the sub-guide bushing. The sub-guide post may be designed to allow the sub-guide tube to move up and down, for example, by a plane guide method or a ball guide method.

[0072] In addition, the template 320 may have a space to accommodate the mold 330 and the first stripper 340, and the mold 330 and the first stripper 340 may be buried in the space. The mold 330 and the first stripper 340 may each be coupled to the template 320 by a connection member.

[0073] The die 330 may accommodate a first stripper 340. The first stripper 340 may have a shape corresponding to a punch (eg, Figure 1 The die 330 and the first stripper 340 may have an opening in a direction in which the metal thin film substrate is discharged.

[0074] According to an embodiment, the electrode plate conveying device can enter through the open area 350 of the first mold 300 to adsorb (e.g., connect to) and fix (e.g., stabilize) the metal film substrate, and convey the electrode plate obtained by punching and cutting the metal film substrate. For example, when the first mold 300 is first lowered and fixes the metal film substrate, the electrode plate conveying device can be inserted into the open area 350 to adsorb (e.g., connect to) the metal film substrate and apply tension to the metal film substrate. Thereafter, the first mold 300 can be further lowered to punch out the fixed metal film substrate. After cutting an electrode plate of a predetermined standard from the metal film substrate, the electrode plate conveying device (which was previously connected to and stabilized the portion of the metal film substrate to be cut) can immediately convey the adsorbed cut metal film substrate to an inspection device for detecting defects of the electrode plate.

[0075] By this configuration, in the punching device 100, the electrode plate conveying device enters the open area 350 of the first mold 300 while the first mold 300 for cutting the metal film substrate is lowered, and the cut metal film substrate is conveyed to the conveying device while the first mold 300 is lifted. In other words, while the first mold 300 is lowered and lifted once (e.g., during a single downward / upward cycle of the first mold 300), the electrode plate conveying device according to the example embodiment stabilizes the cut metal film substrate and moves it to the conveying device. Compared with conveying the cut metal film substrate only after the first mold has been lowered and lifted once (e.g., only after a single downward / upward cycle of the first mold 300 is completed), the time required for the conveying cycle according to the example embodiment can be reduced, thereby increasing the speed of the punching process.

[0076] In addition, when the first mold 300 is lowered, the electrode plate conveying device can enter through the open area 350 of the first mold 300, the metal film substrate can be cut in a state where the metal film substrate is adsorbed and fixed, and the cut metal film substrate adsorbed and fixed by the electrode plate conveying device can be immediately transferred to the inspection device for detecting defects of the electrode plate. Since the end of the metal film substrate is aligned to correspond to the contour of the punch, the punching process can be performed without leaving any space in the metal film substrate, and therefore, the productivity of the electrode plate relative to the area of ​​the metal film substrate can be increased.

[0077] Figure 4 FIG. 4 shows a plan view of a second mold 400 according to an embodiment of the present disclosure. The second mold 400 may have Figure 1 The second mold 120 has substantially the same structure.

[0078] refer to Figure 4 , the second mold 400 may include a second base plate 410 , a punch plate 420 , a second stripper 430 , and a punch 440 .

[0079] The second base plate 410 may be coupled to the punch plate 420. The punch plate 420 may be coupled to an upper portion of the second base plate 410 by a connection member.

[0080] The second base plate 410 may be formed with main guide post holes 412a, 412b, 412c, and 412d, which are through holes. The main guide posts (e.g., Figure 1 One end of the main guide post 130 in the main guide bushing (e.g., Figure 3 312a, 312b, 312c and 312d) can be installed in the first mold (for example, Figure 1 The first substrate plate (eg, Figure 3 At positions corresponding to the main guide post holes 412a, 412b, 412c and 412d on the first base plate 310 in the figure.

[0081] Sub-guide post (e.g. Figure 1 The sub-guide bushings 422a, 422b, 422c and 422d into which the sub-guide tubes of the sub-guide posts 140 are inserted can be assembled to the punch plate 420. For example, the sub-guide bushings 422a, 422b, 422c and 422d can be fixedly coupled to the second base plate 410 by a connecting member. The sub-guide posts can be designed to move up and down in a state where the sub-guide tubes are respectively inserted into the sub-guide bushings 422a, 422b, 422c and 422d. The sub-guide posts can be designed to allow the sub-guide tubes to move up and down by a plane guide method or a ball guide method, but are not limited thereto.

[0082] In addition, the punch plate 420 may have a space in which the second stripper 430 and the punch 440 may be accommodated, and the second stripper 430 and the punch 440 may be buried in the space. The second stripper 430 and the punch 440 may each be coupled to the punch plate 420 by a connecting member.

[0083] The second stripper 430 may receive the punch 440. The second stripper 430 may have a shape corresponding to the outline of the punch 440 having a shape corresponding to a predetermined standard.

[0084] The second stripper 430 may be formed with punch guide post holes 432a, 432b, 432c, and 432d, which are perforations, and punch guide posts (e.g., Figure 1 One end of the punch guide post 150 in the punch guide bushing is fixed in each perforation. The punch guide bushing can be installed in the first die (for example, Figure 1 The first substrate plate (eg, Figure 3 At positions on the first base plate 310) corresponding to the punch guide column holes 432a, 432b, 432c and 432d respectively.

[0085] Figure 5 FIG. 2 shows a plan view showing a first peeler 500 according to an embodiment of the present disclosure. The first peeler 500 may have Figure 3 The first stripper 340 has substantially the same structure.

[0086] refer to Figure 5 , the first stripper 500 may be formed to fix the metal film substrate pulled in during the punching process. In addition, the first stripper 500 may have a contour shape corresponding to at least a portion of the contour of a punch of a predetermined standard. For example, in the first stripper 500, the outer edge except the side portion 540 may have a shape corresponding to the outer edge of the punch.

[0087] According to an embodiment, the first stripper 500 may be designed such that the side portion 540 is open (eg, corresponding to Figure 3 The first stripper 500 may be designed to correspond to the opening direction of the mold. The opening directions of the first stripper and the mold may be parallel to the substrate conveying direction indicated by the arrow.

[0088] For example, the first stripper 500 may include a vertical portion 520 perpendicular to the substrate conveying direction and a first horizontal portion 510 and a second horizontal portion 530 extending in the substrate conveying direction at both ends of the vertical portion 520. Here, the first stripper 500 may include a tab portion 512 protruding from an outer portion of the first horizontal portion 510. The first horizontal portion 510 and the second horizontal portion 530 may be separated from each other to form an open side portion 540. The substrate conveying direction may correspond to a direction from the closed vertical portion 520 to the open side portion 540, and may be a longitudinal direction of the open side portion 540.

[0089] According to an embodiment, the metal film substrate may be provided up to the ends of the first horizontal portion 510 and the second horizontal portion 530 (for example, when viewed in a top view). In addition, after the first mold is lowered and the metal film substrate provided between the die and the first stripper 500 of the first mold and the punch and the second stripper of the second mold is fixed, the metal film substrate may be adsorbed and fixed by the electrode plate conveying device entering in the direction opposite to the substrate conveying direction through the open side portion 540.

[0090] Figure 6 FIG. 6 is a plan view showing a mold 600 according to an embodiment of the present disclosure. The mold 600 may have Figure 3 The mold 330 in the embodiment has basically the same structure.

[0091] refer to Figure 6 , the mold 600 can accommodate a first stripper (e.g., Figure 5 For example, the mold 600 may have a plurality of strippers surrounding only the first stripper (eg, Figure 5 The first horizontal portion of the first stripper 500 (eg, Figure 5 The first horizontal portion 510 of the wiring sheet (eg, Figure 5 The connecting piece portion 512), the vertical portion (e.g., Figure 5 520) and a second horizontal portion (eg, Figure 5 The structure of the outer portion of the second horizontal portion 530) (e.g., extending only along it).

[0092] According to an embodiment, the mold 600 may be designed so that the side portion 640 is open. For example, the mold 600 may include a vertical portion 620 perpendicular to the substrate conveying direction indicated by the arrow and a first horizontal portion 610 and a second horizontal portion 630 extending in the substrate conveying direction at both ends of the vertical portion 620. Here, the ends of the first horizontal portion 610 and the second horizontal portion 630 may include a first protrusion 612 and a second protrusion 632 protruding inwardly, respectively. In addition, a tab portion (e.g., a first stripper) capable of accommodating the first stripper may be provided. Figure 5 The concave portion 614 of the tab portion 512 in the first horizontal portion 610 may be formed on the inner portion of the first horizontal portion 610. The first horizontal portion 610 and the second horizontal portion 630 may be separated from each other to form an open side portion 640. The substrate transfer direction may correspond to a direction from the closed vertical portion 620 to the open side portion 640.

[0093] refer to Figure 6 , the first stripper accommodating area 500a indicated by the dotted line and the solid line is an area formed by the concave portion 614 of the first horizontal portion 610 of the mold 600, the inner portion of the first horizontal portion 610 including the first protrusion 612, the inner portion of the vertical portion 620, and the inner portion of the second horizontal portion 630 including the second protrusion 632 of the second horizontal portion 630, and in which the first stripper is accommodated. That is, the first stripper (i.e., Figure 5 The first stripper 500 of the mold 600 may be positioned in the first stripper accommodating area 500a, wherein the tab portion 512 of the first stripper 500 is fitted in the recessed portion 614 of the mold 600, and the open side portion 540 of the first stripper 500 is aligned with the open side portion 640 of the mold 600. According to an embodiment, the electrode plate conveying device may enter through the open side portion 640 of the mold 600 in a direction opposite to the substrate conveying direction.

[0094] Figure 7 FIG. 2 shows a plan view showing a punch 710 and a second stripper 720 according to an embodiment of the present disclosure. The punch 710 and the second stripper 720 may have respective Figure 4 The punch 440 and the second stripper 430 have substantially the same structure.

[0095] refer to Figure 7 , the second stripper 720 may accommodate the punch 710. The punch 710 may have a predetermined standard shape for a secondary battery electrode plate. In addition, the second stripper 720 may have an inner space in which the punch 710 may be accommodated. That is, the second stripper 720 may have a structure surrounding an outer portion of the punch 710.

[0096] For example, the punch 710 indicated by a solid line may have a structure corresponding to a closed structure in which a first stripper (eg, Figure 5 The first horizontal portion of the first stripper 500 (eg, Figure 5 The first horizontal portion 510 and the second horizontal portion (eg, Figure 5In addition, the second stripper 720 indicated by the solid line may have an internal space to accommodate all corners of the punch 710 and the outer shape of the tab portion, and the punch 710 may be buried in the internal space formed in the second stripper 720.

[0097] For ease of description, Figure 7 The dashed and solid lines corresponding to the first mold (eg, Figure 1 The first mold 110 in FIG. 1 includes a mold region 722 and a region 712 corresponding to the first stripper indicated by a dotted line and a solid line. According to an embodiment, in a state where the first mold is lowered, the mold (e.g., Figure 3 The mold 330 in the embodiment of the present invention may contact the area 722 on the second stripper 720 as the mold corresponding area, and the first stripper (eg, Figure 3 The first stripper 340 in the punch 710 may contact an area 712 on the punch 710 corresponding to the first stripper. An area 714 on the punch 710 (which does not correspond to the first stripper) may be an area open to the outside. In an embodiment, the electrode plate conveying device may enter the area 714 that does not correspond to the first stripper and open to the outside, and fix one end of the metal film substrate provided on the punch 710. In a state where the first mold is lowered for the second time, the second stripper 720 and the mold of the first mold are lowered along the contour of the punch 710 to cut the metal film substrate provided between the first mold and the second mold into the shape of the punch 710.

[0098] Figure 8 A process for cutting a metal film substrate by using a punching device according to an embodiment of the present disclosure is shown. According to an embodiment, a first die (e.g., Figure 1 The mold 816a and the first stripper 818a of the first mold 110) and the second mold (e.g., Figure 1 The metal film substrate 812 between the second stripper 816b and the punch 818b of the second die 120) can be punched and cut into an electrode plate of a predetermined shape by lowering the first die.

[0099] refer to Figure 8 , a plan view 810 shows a metal film substrate 812 provided in a blanking device (eg, Figure 1The process of punching and punching the metal film substrate 812 inside the punching device 100). The metal film substrate 812 can be punched and cut along the cutting line 814 formed between the first area 816 and the second area 818. Here, the first area 816 can indicate the area where the mold 816a of the first mold and the second stripper 816b of the second mold contact the metal film substrate 812. In addition, the second area 818 can indicate the area where the first stripper 818a of the first mold and the punch 818b of the second mold contact the metal film substrate 812. After the first mold of the punching device is lowered and lifted once, the metal film substrate 812 can be moved in the conveying direction so that the punching pattern is continuously formed. For example, the cutting line of the previous punching area 812_1 can be continuously connected to the cutting line 814 of the ongoing punching area (for example, the cutting line of the previous punching area 812_1 can be the outermost edge of the next punching area).

[0100] The cross-sectional view 820 refers to a cross-sectional view of the section A-A' of the plan view 810. As shown in the cross-sectional view 820, the punching process of the metal film substrate 812 can be performed by (after the metal film substrate 812 is stabilized between the first mold and the second mold) lowering the mold 816a of the first mold together with the second stripper 816b of the second mold more than the first stripper 818a of the first mold together with the punch 818b of the second mold (for example, so that the distance from the bottom of the mold 816a to the surface supporting the punching device is less than the distance from the bottom of the first stripper 818a to the surface supporting the punching device). Therefore, the metal film substrate 812 between the mold 816a and the second stripper 816b can be cut into the outer shape of the punch 818b. In this case, the cut metal film substrate 822 (the portion of the metal film substrate 812 between the first stripper 818a and the punch 818b) can be used as an electrode plate, and another metal film substrate 824 can be subsequently cut into an electrode plate.

[0101] Therefore, the cutting lines of the punching areas adjacent to each other are continuously formed, and the punching process can be performed without leaving an extra space on the metal thin film substrate. Therefore, the productivity of the electrode plate relative to the substrate area can be improved.

[0102] Fig. 9 A process of extracting an electrode plate 982 by an electrode plate conveying device 970 when cutting a metal thin film process substrate 980 according to an embodiment of the present invention is shown.

[0103] refer to Fig. 9 According to an embodiment, a process of extracting the electrode plate 982 by the electrode plate transfer device 970 during the cutting of the metal thin film substrate 980 may include first to fourth operations 910 to 940 . Fig. 9The first cross section 950 (i.e., the top dashed box in the first operation 910) represents an example of a cross section AA' of the mold 952 of the first mold and the first stripper 954 (e.g., the top view of the mold 952 and the first stripper 954 is shown on the left side of the operation 910 with the line AA'). In addition, Fig. 9 The second cross-section 960 (i.e., the bottom dashed box in operation 910) represents an example of a cross-section AA' of a second stripper 962 and a punch 964 of a second die (e.g., a top view of the second stripper 962 and the punch 964 is shown on the left side of the third operation 930 with line AA').

[0104] The first operation 910 represents an example of an operation in which the metal film substrate 980 moves in the conveying direction and the die 952 and the first stripper 954 are lowered toward the metal film substrate 980 (i.e., toward the second die). In this case, the electrode plate conveying device 970 can enter the blanking device through the open side portion of the die 952 and the open side portion of the first stripper 954 (i.e., viewed in the top view on the left side of the first operation 910).

[0105] The second operation 920 represents an example of a state in which the metal film substrate 980 is aligned and fixed by the mold 952, the first stripper 954, the second stripper 962, and the punch 964. Fig. 9 As shown, the lower surfaces of the die 952 and the first stripper 954 may be coplanar, the upper surfaces of the second stripper 962 and the punch 964 may be coplanar, and the metal film substrate 980 may be completely flat and in direct contact with the lower surfaces of the die 952 and the first stripper 954 and with the upper surfaces of the second stripper 962 and the punch 964. For example, the edge of the metal film substrate 980 (i.e., the outermost edge oriented in the conveying direction) may be aligned to match the boundary area between the punch 964 and the second stripper 962. The electrode plate conveying device 970 may adsorb and fix the end of the metal film substrate 980 and apply tension to the metal film substrate 980 (e.g., the electrode plate conveying device 970 may contact and stabilize the upper surface of the end of the metal film substrate 980 that faces away from the second die).

[0106] The third operation 930 represents an example of an operation in which the die 952 and the second stripper 962 are lowered a second time (e.g., lowered together in a direction oriented toward the surface supporting the second die), while the first stripper 954 and the punch 964 remain immobile, so that the metal film substrate 980 is cut (i.e., in the area between the moving second stripper 962 and the fixed punch 964). As the die 952 and the second stripper 962 are lowered toward the lower portion of the punch 964 (e.g., so that the lower surfaces of the second stripper 962 and the punch 964 are coplanar), a substrate corresponding to the shape of the punch 964, i.e., an electrode plate 982, can be cut on the punch 964. In other words, the electrode plate 982 cut from the metal film substrate 980 can have the same shape as the punch 964, because the portion of the metal film substrate 980 that does not overlap with the punch 964 is removed (e.g., cut off).

[0107] The fourth operation 940 represents an example of an operation of lifting the mold 952 and the first stripper 954. In addition, the second stripper 962 may also be lifted. In this case (e.g., at the same time), the electrode plate conveying device 970 may extract the electrode plate 982 (the electrode plate conveying device 970 has been secured to the electrode plate 982 in the second operation 920) through the open side portion of the mold 952 and the open side portion of the first stripper 954, and convey the electrode plate 982 to a subsequent process, for example, an inspection device for inspecting defects of the electrode plate.

[0108] Fig.10 A process of manufacturing an electrode plate by using a punching device 1060 according to an embodiment of the present disclosure is shown.

[0109] The supply reel 1010 can unwind the metal thin film substrate wound on the reel. For example, the supply reel 1010 can unwind the wound metal thin film substrate by using a motor.

[0110] The substrate connecting device 1020 can identify the end of the unfolded metal film substrate and connect the separated metal film substrates to each other. The tension holding device 1030 can maintain the tension of the unfolded metal film substrate. For example, the tension holding device 1030 can rotate in the direction opposite to the direction in which the metal film substrate is unfolded, thereby maintaining the tension of the metal film substrate.

[0111] The substrate alignment device 1040 may align bends of the metal thin film substrate by using information received from substrate alignment sensors 1042a and 1042b disposed on a line along which the metal thin film substrate is transferred.

[0112] The stamping oil spraying device 1050 is used for die adhesion and can spray stamping oil onto the metal film substrate corresponding to the wiring piece portion in the blanking device 1060 (for example, Figure 5 In the area of ​​the terminal piece portion 512).

[0113] The punching device 1060 can cut the provided metal film substrate into a predetermined standard shape, ie, a punch shape. For example, the punching device 1060 can align the supplied substrate, lower the first die to fix the substrate, and punch the fixed substrate to manufacture an electrode plate.

[0114] The conveyor 1070 (e.g., an electrode plate conveyor) may extract the electrode plate that is pulled in through an open side portion formed in the first mold of the punching device 1060 and cut. For example, after lowering the first mold to fix the substrate, one end of the substrate may be adsorbed and fixed through an open side portion of the first mold, and the conveyor 1070 may extract the cut substrate in a state where the substrate is cut by the first mold. The conveyor 1070 may convey the extracted substrate to the conveyor 1082.

[0115] The suction cup 1084 can suck foreign matter on the extracted substrate (ie, the electrode plate) on the conveyor 1082. The visual inspection device 1086 can capture an image of the electrode plate by using an image sensor and determine whether the electrode plate is defective. The ejector 1090 can eject the inspected electrode plate.

[0116] Fig.11 A flowchart showing an example of a method 1100 of manufacturing an electrode plate for a secondary battery according to an embodiment of the present disclosure is shown.

[0117] refer to Fig.11 According to an embodiment, method 1100 may start by aligning a supplied substrate between a first die and a second die of the blanking device by using the blanking device (S1110). For example, an end edge of the supplied substrate may be aligned with an end edge of a punch included in the second die in a discharge direction of the substrate by the blanking device.

[0118] Then, the first mold may be lowered and the substrate may be fixed (S1120). Here, the first mold may have a structure in which one side portion into which the electrode plate conveying device enters is open in a direction in which the substrate is pulled out. For example, the first mold may be lowered and the supplied substrate may be fixed between a die and a first stripper included in the first mold and a punch and a second stripper included in the second mold.

[0119] Thereafter, tension may be applied to the substrate fixed between the die and the first stripper included in the first mold and the punch and the second stripper included in the second mold by an electrode plate conveyor entering through an open side portion. For example, tension may be applied to the vacuum-adsorbed substrate by the electrode plate conveyor.

[0120] Then, the electrode plate may be manufactured by punching the fixed substrate by a punching device (S1130). For example, in a state where the substrate is fixed, the mold and the second stripper may be lowered to punch the substrate.

[0121] Then, the electrode plate can be transferred to the inspection device by the electrode plate transfer device (S1140). Thereafter, foreign matter of the electrode plate can be removed by the suction cup, defects of the electrode plate can be detected by the visual inspection device, and the electrode plate can be discharged by the ejector.

[0122] By way of summary and review, the cutting process may refer to a process for manufacturing an electrode plate that meets specifications by punching a supplied substrate using a stamping die device. The cutting process may include supplying a substrate to a stamping die device, punching the substrate by using the stamping die device, and transferring the punched substrate to an inspection device by using a conveying device. However, in this process procedure, the substrate may not be punched continuously (for example, it may be necessary to stop between punching steps) because the substrate must be transferred by using a conveying device between the punching steps.

[0123] On the contrary, the present disclosure provides a punching device and a method for manufacturing an electrode plate for a secondary battery using the punching device. That is, according to an embodiment, the punching device can be operated continuously when a conveying device is connected to a substrate while an upper mold is lowered, and a cut portion of the substrate is conveyed to the conveying device while the upper mold is lifted, thereby increasing the punching process speed.

[0124] In addition, the punching process can be performed without leaving a space on the metal film substrate, and thus the productivity of the electrode plate relative to the substrate area can be improved. In addition, the cutting lines of adjacent punching areas are continuously formed to perform the punching process without leaving an extra space on the metal film substrate, and thus the productivity of the electrode plate relative to the substrate area can be improved.

[0125] Although the present disclosure has been described above with respect to the embodiments of the present disclosure, the present disclosure is not limited thereto. Various modifications and changes may be made to it by those skilled in the art within the spirit of the present disclosure and the equivalent scope of the appended claims.

[0126] Example embodiments have been disclosed herein, and although specific terms are employed, they are used and interpreted in a general and descriptive sense only, and not for purposes of limitation. In some cases, as will be apparent to one of ordinary skill in the art when filing this application, unless otherwise specifically stated, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments. Therefore, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the invention as set forth in the appended claims.

Claims

1. A punching device for a secondary battery electrode plate, the punching device comprising: a first mold including a mold and a first stripper, the mold surrounding the first stripper and having a structure having an open side portion, and the first stripper having a structure having an open side portion aligned with the one open side portion of the mold; as well as A second die faces the first die, the second die includes a punch and a second stripper, and the first die is movable toward the second die.

2. The punching device according to claim 1, wherein: The first stripper includes a vertical portion perpendicular to the longitudinal direction of the one open side portion of the first stripper, a first horizontal portion and a second horizontal portion extending in the longitudinal direction of the one open side portion of the first stripper at both ends of the vertical portion, and a tab portion protruding from an outer portion of the first horizontal portion, and The first horizontal portion and the second horizontal portion are separated from each other, and the one open side portion of the first stripper is between the first horizontal portion and the second horizontal portion.

3. The punching device according to claim 2, wherein: The mold surrounds only the first horizontal portion, the tab portion, the vertical portion, and an outer portion of the second horizontal portion of the first stripper.

4. The punching device according to claim 3, wherein: The punch has a closed structure when viewed in a plan view, and the first horizontal portion and the second horizontal portion of the first stripper overlap an edge of the punch when viewed in the plan view.

5. The punching device according to claim 4, wherein: The second stripper surrounds an outer portion of the punch.

6. The punching device according to claim 1, wherein: The die and the first stripper face the second stripper and the punch, respectively.

7. The punching device according to claim 6, wherein: The die and the first stripper are configured to be movable together toward the second stripper and the punch, and The die and the second stripper are configured to be movable together toward a bottom of the punch such that the die is not aligned with the first stripper.

8. The punching device according to claim 1, wherein: The first mold further comprises: a template accommodating the mold and the first stripper; and A first substrate plate is bonded to the template.

9. The punching device according to claim 8, wherein: The second mold further comprises: a punch plate accommodating the punch and the second stripper; and A second base plate is bonded to the punch plate.

10. The blanking device according to claim 9, further comprising: a main guide post connecting the first substrate plate to the second substrate plate; a sub-guide post connecting the template to the second substrate plate; as well as A punch guide post connects the second stripper to the second base plate.

11. The punching device according to claim 10, wherein: The main guide pillars and the sub-guide pillars are configured to guide the first mold toward the second mold.

12. The punching device according to claim 10, wherein: The sub-guide pillars are configured to guide the template and the die toward a bottom of the punch from a state in which the die and the first stripper are aligned with and respectively contact the second stripper and the punch.

13. The punching device according to claim 10, wherein: The punch guide column is configured to guide the second stripper toward a bottom of the punch from a state in which the die and the first stripper are aligned with and contact the second stripper and the punch, respectively. 14 . The blanking device according to claim 1 , further comprising an electrode plate transfer device insertable into the aligned opened side portions of the die and the first stripper.

15. A method for manufacturing an electrode plate for a secondary battery, the method comprising: aligning a substrate between a first die and a second die of a blanking device, the first die having an open side portion in a direction in which the substrate is pulled out; lowering the first mold toward the second mold to fix the substrate; Manufacturing the electrode plate by punching the substrate; as well as The electrode plate is transferred to a subsequent process by an electrode plate transfer device that enters the one open side portion of the first mold.

16. The method according to claim 15, wherein: The one open side portion of the first mold is parallel to a transfer direction of the substrate between the first mold and the second mold.

17. The method according to claim 15, wherein: Aligning the substrate between the first and second dies of the blanking device includes supplying the substrate between the first and second dies in a direction oriented from the closed side portion of the first die toward the one open side portion of the first die.

18. The method according to claim 17, wherein: Aligning the substrate between the first die and the second die of the punching device includes aligning the substrate so that cutting lines in a punching area of ​​the punching device are continuously formed.

19. The method according to claim 15, wherein: Lowering the first mold toward the second mold to fix the substrate includes: fixing the substrate between the first mold and the second mold by lowering the first mold toward the second mold, the first mold including a mold and a first stripper, and the second mold including a punch and a second stripper; and A tension is applied to the substrate by the electrode plate conveying device entering the one open side portion of the first mold.

20. The method according to claim 19, wherein: Manufacturing the electrode plate by punching out the substrate includes lowering the die and the second peeler together to punch out the substrate in a state where the substrate is fixed.

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