High-temperature-resistant low-dielectric printable medium material and preparation method thereof

Abstract

The invention relates to a high-temperature-resistant low-dielectric printable dielectric material and a preparation method thereof, and belongs to the technical field of dielectric materials. The material comprises 10%-30% of photosensitive polyimide; 18.6% to 30% of tricyclodecane dimethyl alcohol diacrylate; 27%-35% of tris (2-hydroxyethyl) isocyanurate triacrylate; 12.7% to 18% of isobornyl methacrylate; 5 to 10% of acryloyl morpholine; 1.0 to 2.0 percent of a photoinitiator; 0.3-0.5% of a dispersant; the preparation method comprises the following steps: mixing the raw materials according to the formula, stirring, defoaming and packaging; and placing in a UV device for preforming, and then placing in an oxygen-free drying oven for stepped thermocuring forming. The material can effectively overcome the defects of poor high temperature resistance, high dielectric constant and poor mechanical property of a printable material in the prior art.

Description

Technical Field

[0001] The invention belongs to the technical field of dielectric materials, and relates to a high temperature resistant low dielectric printable medium material and a preparation method thereof. Background Art

[0002] With the development of industry and the advancement of science and technology, all walks of life have higher and higher requirements for materials. Among them, the demand for photocurable printable materials based on photocuring technology is also increasing. Photocurable materials are obtained by photopolymerization, which is a phase transition process in which photocurable monomers or copolymers undergo addition reactions under ultraviolet or visible light, and chemical polymerization of liquids transforms into non-sticky solids. In practical applications, its application has also become more and more concerned.

[0003] Low dielectric constant materials, or low-k materials (low-k materials), are a hot topic of research in the current semiconductor industry. By reducing the dielectric constant k of dielectric materials used in integrated circuits, the integrated capacitance between devices and wires can be reduced, and the circuit operation speed can be increased. In recent years, with the increasing speed of aircraft, the new generation of antenna wave-transmitting technology has developed rapidly. Not only are the temperature resistance and dielectric properties of the material system required to be higher and higher, but it can also efficiently transmit electromagnetic waves at high frequencies and ultra-wide bands, which rapidly increases the integration of integrated circuits. The operating frequency range of RF connectors, microwave devices, etc. has also been greatly improved. In order to reduce the resulting impedance delay and power loss, high-temperature resistant low dielectric constant materials are needed to protect each electronic component, thereby reducing impedance delay and meeting the needs of integrated circuit development.

[0004] Commonly used materials with high temperature resistance and low dielectric properties include polyimide and silicone materials. Polyimide is a high-performance polymer with good thermal stability and mechanical properties. Its dielectric constant is usually around 2.5-3.5; it is generally a thermosetting type with a high thermal curing temperature requirement, usually above 300°C. Silicone materials usually have a lower dielectric constant, which helps to reduce signal transmission delay and is suitable for high-frequency applications; the dielectric constant value is usually in the range of 2.5 to 3.5; but there is also the problem of low reaction activity and high polymerization temperature. In addition, although excessively high reaction temperature can promote the deep reaction of the material, it will also cause thermal oxidation aging of the material, thereby affecting the comprehensive performance of the material, and the processing window is narrow and the yield is not high. Directly applying the above materials to printing media materials has the problems of high energy consumption and poor mechanical properties. Therefore, this puts forward technical requirements for the material system such as easy operation, low dielectric constant, low dielectric loss and high temperature resistance. Summary of the invention

[0005] The technical problem solved by the present invention is: to overcome the shortcomings of the prior art and to propose a high-temperature resistant and low-dielectric printable medium material and a preparation method thereof. The material prepared by the present invention can effectively solve the defects of the printable materials in the prior art, such as poor high-temperature resistance, high dielectric constant, and poor mechanical properties.

[0006] The solution of the present invention is:

[0007] A high temperature resistant low dielectric printable medium material, comprising the following raw materials in percentage by weight:

[0008] Photosensitive polyimide 10%-30%;

[0009] Tricyclodecane dimethanol diacrylate 18.6%-30%;

[0010] Tris(2-hydroxyethyl)isocyanurate triacrylate 27%-35%;

[0011] Isobornyl methacrylate 12.7%-18%;

[0012] Acryloylmorpholine 5-10%;

[0013] Photoinitiator 1.0-2.0%;

[0014] Dispersant 0.3-0.5%.

[0015] In the above-mentioned high temperature resistant low dielectric printable medium material, the viscosity of the photosensitive polyimide is 3000-3500cps.

[0016] In the above-mentioned high temperature resistant low dielectric printable medium material, the mass ratio of tris(2-hydroxyethyl)isocyanurate triacrylate to acryloylmorpholine is 1:0.18-1:0.29.

[0017] The method for preparing the above-mentioned high temperature resistant low dielectric printable medium material comprises the following steps:

[0018] Step 1: preparing a mixture of high temperature resistant and low dielectric printable medium materials;

[0019] Step 2: Add a photoinitiator and a dispersant to the mixture under light-proof conditions and mix them evenly; and perform a decompression and degassing treatment on the mixture;

[0020] Step 3, placing the mixture under a UV device and curing it by UV radiation to obtain a preformed intermediate;

[0021] Step 4: Place the preformed intermediate in an oxygen-free oven and obtain a high-temperature resistant, low-dielectric printable medium material through thermal curing.

[0022] In the above preparation method, in the step 1, photosensitive polyimide, tricyclodecane dimethanol diacrylate, tris(2-hydroxyethyl)isocyanuric acid triacrylate, isobornyl methacrylate and acryloylmorpholine are uniformly mixed to obtain a mixture.

[0023] In the above-mentioned preparation method, in the step 2, after adding the photoinitiator and the dispersant and mixing them evenly, the mixture is kept at 40° C. to 50° C. for 0.5 to 1 h to achieve a decompression degassing treatment.

[0024] In the above preparation method, in step 3, the UV wavelength is 365 nm, the power is 20-2000 W, and the irradiation time is 10-600 s.

[0025] In the above-mentioned preparation method, in step 4, the oxygen content of the oxygen-free oven is below 20 ppm.

[0026] In the above-mentioned preparation method, in the step 4, a step-by-step temperature-raising curing method is used for heat curing.

[0027] In the above-mentioned preparation method, in step 4, the stepwise temperature rise curing is specifically as follows:

[0028] Raise the temperature to 180°C within 20-40 minutes; raise the temperature from 180°C to 250°C within 100-150 minutes; keep warm at 250°C for 20-40 minutes.

[0029] The beneficial effects of the present invention compared with the prior art are:

[0030] (1) The present invention uses low-temperature curing photosensitive polyimide as one of the raw materials. Polyimide has the advantages of low dielectric properties, high and low temperature resistance, and excellent mechanical properties. The photosensitive structure can be well compatible with UV monomers and bonded to the system to improve the mechanical properties. In addition, the low-temperature curing type can effectively reduce the thermal degradation of UV monomers during the thermal curing process, thereby improving the performance of the material.

[0031] (2) The tris(2-hydroxyethyl)isocyanuric acid triacrylate and acryloylmorpholine of the present invention are UV monomers containing a tertiary amine structure, and acryloylmorpholine is a low-viscosity monomer with better diffusibility and better antioxidant and polymerization inhibition effect;

[0032] (3) The present invention selects alicyclic structure high T through formula design. g UV monomers can make the target product's T g Reaching over 200℃, it has excellent high temperature resistance;

[0033] (4) The preformed solid obtained by the present invention after 365nm UV curing has a certain supporting effect; at the same time, the UV monomer with low molecular weight and high reactivity is quickly cured to avoid the volatilization of the UV monomer during the thermal curing process;

[0034] (5) The present invention adopts a step-by-step thermal curing process for molding. The rapid heating in the first stage is conducive to releasing certain internal stresses, avoiding the escape of UV monomers and thermal degradation of the cured parts under long-term high temperature; the slow heating in the second stage is conducive to the molecular structure thermal motion of each component to adjust the chain segment conformation, improve mechanical properties, reduce dielectric properties, etc.; the high temperature reaction in the third stage is to promote the complete reaction of unreacted groups, further promote the completion of chemical reactions, and improve the final mechanical properties, high temperature resistance and low dielectric properties;

[0035] (5) The thermal curing of the present invention is carried out in an extremely low oxygen environment, thereby avoiding thermal oxidative degradation and improving the crosslinking density and thermal stability of the material. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 The present invention is a flow chart for preparing the high temperature resistant and low dielectric printable medium material. DETAILED DESCRIPTION

[0037] The present invention will be further described below in conjunction with the embodiments.

[0038] The present invention provides a high temperature resistant and low dielectric printable medium material and a preparation method thereof. The prepared material can effectively solve the defects of the printable materials in the prior art, such as poor high temperature resistance, high dielectric constant and poor mechanical properties.

[0039] The high temperature resistant low dielectric printable media material includes the following raw materials in weight percentage:

[0040] Photosensitive polyimide 10%-30%, tricyclodecane dimethanol diacrylate 18.6%-30%, tris(2-hydroxyethyl)isocyanuric acid triacrylate 27%-35%, isobornyl methacrylate 12.7%-18%, acryloyl morpholine 5-10%, photoinitiator 1.0-2.0%, dispersant 0.3-0.5%.

[0041] The viscosity of the photosensitive polyimide is 3000-3500 cps. The mass ratio of tris(2-hydroxyethyl)isocyanuric acid triacrylate to acryloylmorpholine is 1:0.18-1:0.29.

[0042] The viscosity of the photosensitive polyimide in the present invention is 3000-3500cps, and it is a low temperature curing type; specifically, it can be 3000cps, 3100cps, 3200cps, 3300cps, 3400cps, 3500cps, or a range of any two values. In addition, the photosensitive polyimide described in the following embodiments of the present invention is purchased from Changzhou Leader Electronic New Materials Co., Ltd., model ST-2001 (viscosity 3300cps).

[0043] Tricyclodecane dimethanol diacrylate has low shrinkage, high Tg (211°C), good heat resistance, and certain toughness and wear resistance.

[0044] Tris(2-hydroxyethyl)isocyanurate triacrylate has a high Tg (272°C) and good heat resistance and weather resistance.

[0045] Acryloylmorpholine has a low molecular weight, is easy to diffuse evenly, and has a certain antioxidant and polymerization inhibition effect.

[0046] Tris(2-hydroxyethyl)isocyanurate triacrylate is a trifunctional structure. Too high a content will lead to excessive shrinkage (affecting product precision and performance) and excessive viscosity (affecting the manufacturing process).

[0047] The mass ratio of tris(2-hydroxyethyl)isocyanurate triacrylate to acryloylmorpholine is 1:0.18-0.29; too low an amount of acryloylmorpholine will affect its antioxidant inhibition; too high an amount will affect the Tg of the product, and ultimately affect the high temperature resistance.

[0048] Isobornyl methacrylate has high Tg (172°C) and low viscosity characteristics and can be used for viscosity reduction adjustment.

[0049] Benefiting from the structure of photosensitive polyimide, the photoinitiator has better photolysis efficiency at 365nm, i.e. the commonly used photoinitiator 1173, photoinitiator 184, photoinitiator TPO, photoinitiator 651, photoinitiator 369, photoinitiator ITX, etc.; and, the photoinitiator in the following embodiments of the present invention is photoinitiator 1173.

[0050] The dispersant may be Disponer 903, TEGO Dispers 686, TEGO 685 or BYKJET-9151, etc.; and, the dispersant described in the following embodiments of the present invention is Disponer 903.

[0051] Preparation method of high temperature resistant low dielectric printable medium material, such as Figure 1 As shown, the specific steps include:

[0052] Step 1: Prepare a mixture of high temperature resistant low dielectric printable medium materials. Evenly mix photosensitive polyimide, tricyclodecane dimethanol diacrylate, tris(2-hydroxyethyl)isocyanuric acid triacrylate, isobornyl methacrylate and acryloyl morpholine to obtain a mixture. Stir at 40°C and 600 r / min for 10-20 minutes to obtain a mixture.

[0053] Step 2: Add photoinitiator and dispersant to the mixture and mix them evenly under light-proof conditions; decompress and degas the mixture. After adding photoinitiator and dispersant and mixing them evenly, keep them at 40℃-50℃ for 0.5-1h, decompress and degas for 10min, and degas.

[0054] Step 3: Place the mixture under a UV device and cure it by UV radiation to obtain a preformed intermediate. The UV wavelength is 365nm, the power is 20-2000W, and the radiation time is 10-600s.

[0055] Specifically, it can be 20W, 50W, 100W, 200W, 300W, 400W, 500W, 600W, 700W, 800W, 900W, 1000W, 1200W, 1400W, 1500W, 1600W, 1800W, 2000W, or a range consisting of any two values. The radiation time is 10-600s, specifically, it can be 10s, 30s, 50s, 60s, 80s, 100s, 150s, 200s, 250s, 300s, 350s, 400s, 450s, 500s, 550s, 600s, or a range consisting of any two values.

[0056] Step 4: Place the preformed intermediate in an oxygen-free oven and obtain a high-temperature resistant, low-dielectric printable medium material through thermal curing.

[0057] The oxygen content of the oxygen-free oven is below 20 ppm, and can be 5 ppm, 10 ppm, 15 ppm, 20 ppm, or a range consisting of any two values.

[0058] The heat curing treatment is carried out by using a step-by-step temperature rise curing method. The step-by-step temperature rise curing method is as follows:

[0059] Raise the temperature to 180°C within 20-40 minutes; raise the temperature from 180°C to 250°C within 100-150 minutes; keep warm at 250°C for 20-40 minutes.

[0060] Example 1

[0061] A high temperature resistant, low dielectric printable photosensitive resin composition comprises the following raw materials in percentage by weight:

[0062] Photosensitive polyimide 25%;

[0063] Tricyclodecane dimethanol diacrylate 22%;

[0064] Tris(2-hydroxyethyl)isocyanurate triacrylate 30%;

[0065] Isobornyl methacrylate 15%;

[0066] Acryloylmorpholine 6.1%;

[0067] Photoinitiator 1.5%;

[0068] Dispersant 0.4%.

[0069] A method for preparing a high temperature resistant, low dielectric printable photosensitive resin composition comprises the following steps:

[0070] S11, ingredients, i.e.

[0071] The photosensitive polyimide, tricyclodecane dimethanol diacrylate, tris(2-hydroxyethyl)isocyanuric acid triacrylate, isobornyl methacrylate and acryloylmorpholine in the raw materials of the photosensitive resin composition are uniformly mixed, and stirred at 40° C. and 600 r / min for 15 minutes to obtain a mixture;

[0072] S12, mixing, degassing, packaging

[0073] Under light-proof conditions, add a photoinitiator and a dispersant and mix them evenly; and stir at 40° C. and 1000 r / min for 25 min, then keep at 45° C. for 0.7 h, and degas under reduced pressure for 10 min to obtain the photosensitive resin composition.

[0074] A method for preparing a high temperature resistant low dielectric printable medium material comprises the following steps:

[0075] S21, UV curing preform, i.e.

[0076] Placing the photosensitive resin composition under a UV device and curing it by UV radiation to obtain a preformed intermediate;

[0077] The UV wavelength of the UV device is 365 nm, the power is 400 W, and the irradiation time is 200 s.

[0078] S22, heat curing molding, i.e.

[0079] The intermediate in S21 is placed in an oxygen-free oven and cured by step-wise temperature increase to obtain the target product, i.e., a high-temperature resistant and low-dielectric printable medium material.

[0080] The oxygen content of the oxygen-free oven is 20 ppm.

[0081] The step-by-step temperature curing comprises heating to 180° C. within 30 minutes; heating from 180° C. to 250° C. within 120 minutes; and maintaining the temperature at 250° C. for 30 minutes.

[0082] Example 2

[0083] A high temperature resistant, low dielectric printable photosensitive resin composition comprises the following raw materials in percentage by weight:

[0084] Photosensitive polyimide 30%;

[0085] Tricyclodecane dimethanol diacrylate 18.6%;

[0086] Tris(2-hydroxyethyl)isocyanurate triacrylate 27%;

[0087] Isobornyl methacrylate 18%;

[0088] Acryloylmorpholine 5%;

[0089] Photoinitiator 2.0%;

[0090] Dispersant 0.5%.

[0091] A method for preparing a high temperature resistant, low dielectric printable photosensitive resin composition comprises the following steps:

[0092] S11, ingredients, i.e.

[0093] The photosensitive polyimide, tricyclodecane dimethanol diacrylate, tris(2-hydroxyethyl)isocyanuric acid triacrylate, isobornyl methacrylate and acryloylmorpholine in the raw materials of the photosensitive resin composition are uniformly mixed, and stirred at 40° C. and 600 r / min for 20 minutes to obtain a mixture;

[0094] S12, mixing, degassing, packaging

[0095] Under light-proof conditions, add a photoinitiator and a dispersant and mix them evenly; and stir at 40° C. and 1000 r / min for 30 min, then keep at 40° C. and stand for 1.0 h, and degas under reduced pressure for 10 min to obtain the photosensitive resin composition.

[0096] A method for preparing a high temperature resistant low dielectric printable medium material comprises the following steps:

[0097] S21, UV curing preform, i.e.

[0098] Placing the photosensitive resin composition under a UV device and curing it by UV radiation to obtain a preformed intermediate;

[0099] The UV wavelength of the UV device is 365 nm, the power is 2000 W, and the irradiation time is 10 s.

[0100] S22, heat curing molding, i.e.

[0101] The intermediate in S21 is placed in an oxygen-free oven and cured by step-wise temperature increase to obtain the target product, i.e., a high-temperature resistant and low-dielectric printable medium material.

[0102] The oxygen content of the oxygen-free oven is 20 ppm.

[0103] The step-by-step temperature curing comprises heating to 180° C. within 40 minutes; heating from 180° C. to 250° C. within 100 minutes; and keeping the temperature at 250° C. for 40 minutes.

[0104] Example 3

[0105] A high temperature resistant, low dielectric printable photosensitive resin composition comprises the following raw materials in percentage by weight:

[0106] Photosensitive polyimide 10%;

[0107] Tricyclodecane dimethanol diacrylate 30%;

[0108] Tris(2-hydroxyethyl)isocyanurate triacrylate 35%;

[0109] Isobornyl methacrylate 12.7%;

[0110] Acryloylmorpholine 10%;

[0111] Photoinitiator 1.0%;

[0112] Dispersant 0.3%.

[0113] A method for preparing a high temperature resistant, low dielectric printable photosensitive resin composition comprises the following steps:

[0114] S11, ingredients, i.e.

[0115] The photosensitive polyimide, tricyclodecane dimethanol diacrylate, tris(2-hydroxyethyl)isocyanuric acid triacrylate, isobornyl methacrylate and acryloylmorpholine in the raw materials of the photosensitive resin composition are uniformly mixed, and stirred at 40° C. and 600 r / min for 10 minutes to obtain a mixture;

[0116] S12, mixing, degassing, packaging

[0117] Under light-proof conditions, add a photoinitiator and a dispersant and mix them evenly; and stir at 40° C. and 1000 r / min for 20 min, then keep at 50° C. for 0.5 h, and degas under reduced pressure for 10 min to obtain the photosensitive resin composition.

[0118] A method for preparing a high temperature resistant low dielectric printable medium material comprises the following steps:

[0119] S21, UV curing preform, i.e.

[0120] Placing the photosensitive resin composition under a UV device and curing it by UV radiation to obtain a preformed intermediate;

[0121] The UV wavelength of the UV device is 365 nm, the power is 20 W, and the irradiation time is 600 s.

[0122] S22, heat curing molding, i.e.

[0123] The intermediate in S21 is placed in an oxygen-free oven and cured by step-wise temperature increase to obtain the target product, i.e., a high-temperature resistant and low-dielectric printable medium material.

[0124] The oxygen content of the oxygen-free oven is 20 ppm.

[0125] The step-by-step temperature curing comprises heating to 180° C. within 20 minutes; heating from 180° C. to 250° C. within 150 minutes; and keeping the temperature at 250° C. for 20 minutes.

[0126] Example 4

[0127] The rest is the same as in Example 1, except that:

[0128] A high temperature resistant, low dielectric printable photosensitive resin composition comprises the following raw materials in percentage by weight:

[0129] Photosensitive polyimide 20%;

[0130] Tricyclodecane dimethanol diacrylate 25%;

[0131] Tris(2-hydroxyethyl)isocyanurate triacrylate 32%;

[0132] Isobornyl methacrylate 14%;

[0133] Acryloylmorpholine 7.6%;

[0134] Photoinitiator 1.0%;

[0135] Dispersant 0.4%.

[0136] Example 5

[0137] The rest is the same as in Example 1, except that:

[0138] The step-by-step temperature curing comprises heating to 180° C. within 20 minutes; heating from 180° C. to 250° C. within 150 minutes; and keeping the temperature at 250° C. for 20 minutes.

[0139] Example 6

[0140] The rest is the same as in Example 1, except that:

[0141] The step-by-step temperature curing comprises heating to 180° C. within 40 minutes; heating from 180° C. to 250° C. within 100 minutes; and keeping the temperature at 250° C. for 40 minutes.

[0142] The present invention provides a high temperature resistant and low dielectric printable medium material, wherein the photosensitive resin composition is designed by formula. First, low temperature curing photosensitive polyimide is used as one of the raw materials, and the polyimide has the advantages of low dielectric properties, high and low temperature resistance, and excellent mechanical properties, and the photosensitive structure can be well compatible with UV monomers and bonded to the system to improve the mechanical properties; in addition, the low temperature curing type can effectively reduce the thermal degradation of UV monomers during the thermal curing process, and improve the performance of the material; second, tri(2-hydroxyethyl)isocyanuric acid triacrylate and acryloylmorpholine are UV monomers containing tertiary amine structures, and acryloylmorpholine is a low viscosity monomer with better diffusivity and better anti-oxidation and polymerization inhibition; third, through formula design, a UV monomer with a high Tg containing an alicyclic structure is selected, so that the Tg of the target product can reach above 200°C, and has excellent high temperature resistance.

[0143] The present invention provides a method for preparing a high-temperature resistant and low-dielectric printable medium material, which adopts a light-heat dual curing process, and the thermal curing is prepared by a step-by-step heating process. First, a preformed solid is obtained after 365nm UV curing, which has a certain supporting effect; at the same time, the UV monomer with low molecular weight and high reaction activity is quickly cured to avoid the volatilization of the UV monomer during the thermal curing process; second, the step-by-step thermal curing process is used for molding, and the rapid heating in the first stage is conducive to releasing certain internal stress, avoiding the escape of UV monomers and the thermal degradation of the cured part under long-term high temperature; the slow heating in the second stage is conducive to the thermal motion of the molecular structure of each component to adjust the chain segment conformation, improve the mechanical properties, reduce the dielectric properties, etc.; the high-temperature reaction in the third stage is to promote the complete reaction of the unreacted groups, further promote the completion of the chemical reaction, and improve the final mechanical properties, high temperature resistance and low dielectric properties; third, the thermal curing is carried out in an extremely low oxygen environment to avoid thermal oxidation degradation and improve the crosslinking density and thermal stability of the material.

[0144] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A high temperature resistant low dielectric printable medium material, characterized in that: The following raw materials are included in weight percentage: Photosensitive polyimide 10%-30%; Tricyclodecane dimethanol diacrylate 18.6%-30%; Tris(2-hydroxyethyl)isocyanurate triacrylate 27%-35%; Isobornyl methacrylate 12.7%-18%; Acryloylmorpholine 5-10%; Photoinitiator 1.0-2.0%; Dispersant 0.3-0.5%.

2. A high temperature resistant low dielectric printable medium material according to claim 1, characterized in that: The photosensitive polyimide has a viscosity of 3000-3500 cps.

3. The high temperature resistant and low dielectric printable medium material according to claim 1, characterized in that: The mass ratio of tris(2-hydroxyethyl)isocyanurate triacrylate to acryloylmorpholine is 1:0.18-1:0.

29.

4. The method for preparing a high temperature resistant and low dielectric printable medium material according to claim 1, characterized in that: The steps include: Step 1, preparing a mixture of high temperature resistant low dielectric printable medium materials; Step 2: Add a photoinitiator and a dispersant to the mixture under light-proof conditions and mix them evenly; and perform a decompression and degassing treatment on the mixture; Step 3, placing the mixture under a UV device and curing it by UV radiation to obtain a preformed intermediate; Step 4: Place the preformed intermediate in an oxygen-free oven and obtain a high-temperature resistant, low-dielectric printable medium material through thermal curing.

5. The preparation method according to claim 4, characterized in that: In the step 1, photosensitive polyimide, tricyclodecane dimethanol diacrylate, tris(2-hydroxyethyl)isocyanuric acid triacrylate, isobornyl methacrylate and acryloylmorpholine are uniformly mixed to obtain a mixture.

6. The preparation method according to claim 4, characterized in that: In the step 2, after adding the photoinitiator and the dispersant and mixing them evenly, the mixture is kept at 40° C. to 50° C. and allowed to stand for 0.5 to 1 hour to achieve a decompression and degassing treatment.

7. The preparation method according to claim 4, characterized in that: In the step 3, the UV wavelength is 365 nm, the power is 20-2000 W, and the irradiation time is 10-600 s.

8. The preparation method according to claim 4, characterized in that: In the step 4, the oxygen content of the oxygen-free oven is below 20 ppm.

9. The preparation method according to claim 4, characterized in that: In the step 4, thermal curing is performed by adopting a step-by-step temperature increase curing method.

10. The preparation method according to claim 9, characterized in that: In the step 4, the step-by-step temperature rise curing is specifically as follows: Raise the temperature to 180°C within 20-40 minutes; raise the temperature from 180°C to 250°C within 100-150 minutes; keep warm at 250°C for 20-40 minutes.

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