Zinc oxide doped film processing equipment based on magnetron sputtering processing

Abstract

The invention relates to the technical field of film processing, in particular to magnetron sputtering processing-based zinc oxide doped film processing equipment which comprises an unwinding chamber, a processing chamber, a magnetron sputtering chamber, an evaporation chamber, a cooling chamber and a winding chamber, the magnetron sputtering chamber comprises a first magnetron coating roller, a sputtering target seat, a sputtering guide wheel, a second magnetron coating roller and a sputtering turning wheel, the sputtering guide wheel is arranged in the magnetron sputtering chamber in the conveying direction of the thin film, and the sputtering turning wheel guides the thin film to pass through the first magnetron coating roller for front coating; and carrying out reverse side coating through the second magnetic control coating roller. The equipment does not need to carry out secondary loading and unloading on a film after film coating is completed, damage to the coated film is avoided, the product quality is improved, cavity opening and secondary vacuumizing are not needed during film coating, the process can be simplified, time can be saved, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of thin film processing, and in particular to a zinc oxide doped thin film processing device based on magnetron sputtering processing. Background Art

[0002] Zinc oxide (ZnO) doped thin film is a thin film material with excellent optoelectronic properties. By doping different elements, its electrical, optical and other properties can be adjusted to meet different application requirements. There are many methods for preparing zinc oxide doped thin films, including magnetron sputtering, chemical vapor deposition (CVD), sol-gel, spray pyrolysis and pulsed laser deposition. These methods have their own characteristics and are suitable for different application scenarios and needs.

[0003] Magnetron sputtering is the most studied and mature method for preparing zinc oxide (ZnO) thin films, which is compatible with IC planar device processes. This method is suitable for the preparation of high-quality ZnO thin films for various piezoelectric, gas-sensitive and transparent conductors. The principle of magnetron sputtering coating is that positive ions are accelerated to bombard the target material under the action of the electric field, sputtering a large number of target atoms (or molecules), and the neutral target atoms (or molecules) are deposited on the film to form a coating layer. Magnetron sputtering coating devices have high film formation rate, good film uniformity and durability, so they are widely used in many fields, such as optical films, conductive films, anti-reflective films, decorative coatings, etc.

[0004] When the existing magnetron sputtering equipment is used to coat the zinc oxide (ZnO) doped film, during the transmission process from winding to unwinding of the film, after one side of the film is completely coated, the vacuum is broken, the entire roll of film is taken out, and it is placed on the coating roller in the opposite direction, and then vacuum is applied, and the above steps are repeated to complete the coating of the other side of the PET substrate. However, each time the film is coated on both sides, the film substrate needs to be reloaded and unloaded and vacuumed. The loading and unloading process is likely to cause damage to the coated film, affecting the quality of the product, and the cumbersome process will waste time, reduce production efficiency, and increase production costs. Summary of the invention

[0005] The main purpose of the present invention is to overcome the deficiencies in the prior art and provide a zinc oxide doped thin film processing device based on magnetron sputtering processing.

[0006] The technical solution adopted by the present invention to achieve its technical purpose is: a zinc oxide doped thin film processing equipment based on magnetron sputtering processing, including an unwinding chamber, a processing chamber, a magnetron sputtering chamber, an evaporation chamber, a cooling chamber and a winding chamber, wherein the unwinding chamber, the processing chamber, the magnetron sputtering chamber, the evaporation chamber, the cooling chamber and the winding chamber are connected to form a work space that is closed relative to the external environment, and the work space can be in a vacuum state during thin film coating; The unwinding chamber has an outlet downstream, the processing chamber, magnetron sputtering chamber, evaporation chamber, and cooling chamber have an inlet upstream, and the downstream has an outlet, and the upstream of the winding chamber has an inlet, wherein the unwinding chamber, processing chamber, magnetron sputtering chamber, evaporation chamber, cooling chamber, and winding chamber are all modular structures, and a detachable connection method is adopted between two adjacent modular structures. After being connected, the film can be transported in two adjacent chambers, and the connection is sealed to form a working space that is closed relative to the external environment after connection.

[0007] The magnetron sputtering chamber comprises a first magnetron coating roller, a sputtering target seat, a sputtering guide wheel, a second magnetron coating roller and a sputtering direction-changing wheel; The first magnetron coating roller and the second magnetron coating roller are symmetrically arranged in the magnetron sputtering chamber, and a plurality of sputtering target seats are arranged in the outer circumferential direction thereof, and gaps are arranged between the sputtering target seat and the first magnetron coating roller, and between the sputtering target seat and the second magnetron coating roller, so that the film can pass through; The sputtering guide wheel is arranged in the magnetron sputtering chamber along the conveying direction of the film, and the sputtering direction-changing wheel guides the film to first pass through the first magnetron coating roller for front coating, and then pass through the second magnetron coating roller for back coating; The path of the film when passing through the first magnetron coating roller and the second magnetron coating roller successively is "S" shaped; wherein, the number of the sputtering target seat, sputtering guide wheel and sputtering direction changing wheel can be designed according to needs and is not specifically limited here.

[0008] Preferably, the unwinding chamber includes an unwinding roller and an unwinding guide wheel; the unwinding roller lowers the film, and the unwinding guide wheel guides the lowered film to the processing chamber; the number of the unwinding guide wheels can be designed as needed and is not specifically limited here.

[0009] Preferably, the process chamber comprises a process guide wheel, a heating coil and an ion source; The processing guide wheel is arranged in the processing chamber to guide the film to pass through the heating coil and the ion source in sequence; the heating coil is suitable for heating the film to remove water vapor and impurities on the front and back sides of the film; the ion source is suitable for improving the surface roughness of the front and back sides of the film; the number of the processing guide wheels can be designed according to needs and is not specifically limited here.

[0010] Preferably, the evaporation chamber comprises a first evaporation coating roller, a second evaporation coating roller, an evaporation guide wheel, a crucible, an electron gun and an evaporation redirection wheel; The first evaporation coating roller and the second evaporation coating roller are respectively arranged at two ends of the evaporation chamber, and the evaporation guide wheel and the evaporation redirection wheel guide the film and switch the contact surface by cooperating with the auxiliary tension guide assembly; The number of the evaporation guide wheels, evaporation redirection wheels and auxiliary tensioning guide components can be designed as required so that the film can be guided and the contact surface can be switched conveniently.

[0011] The crucible is arranged below the first evaporation coating roller and the second evaporation coating roller, and the crucible is suitable for carrying the coating material used for coating; The electron gun is arranged on the cavity wall of the evaporation chamber, and the muzzle of the electron gun is arranged directly facing the crucible, so that the electron beam emitted by the electron gun can bombard the coating material in the crucible, so that the coating material evaporates metal atoms and deposits them on the surface of the film, thereby completing the evaporation coating.

[0012] Preferably, the cooling chamber comprises a cold air nozzle, a first cooling roller, a cooling plate seat, a second cooling roller, a cooling guide wheel and an adjusting guide wheel; The first cooling roller and the second cooling roller are arranged at both ends of the cooling chamber, and the two are located at the same horizontal height, the cooling plate seat is located below the first cooling roller and the second cooling roller, and gaps are provided between the cooling plate seat and the first cooling roller, and between the cooling plate seat and the second cooling roller, through which a film can pass; The cooling guide wheel guides the film and switches the contact surface, and the adjusting guide wheel switches the transmission direction of the film after cooling. The number of the cooling guide wheels can be designed as needed and is not specifically limited here. A group of the adjusting guide wheels is provided.

[0013] Preferably, the adjusting guide wheel switches the transmission direction of the film to a winding chamber, and a winding roller is provided in the winding chamber, and the film is wound by the winding roller.

[0014] Preferably, the auxiliary tensioning guide assembly comprises a cross plate, a sliding rod is fixed to the central part of one side of the cross plate, one end of the sliding rod is sleeved with a sliding sleeve, a screw rod is arranged inside the sliding sleeve, one end of the screw rod is threadedly connected to the inside of the sliding rod, and a knob is fixed to the other end, the knob is rotatably arranged inside one end of the sliding sleeve, and the knob also keeps synchronous movement with the sliding sleeve; The knob is set to a "earth"-shaped structure, and is rotatably clamped inside one end of the sliding sleeve. By rotating the knob, the screw rod moves inside the sliding rod, and the knob drives the sliding sleeve to move outside the sliding rod; The outer wall of the sliding sleeve is hinged with a connecting plate through a connecting piece, a bent arc plate is fixed on one side of the connecting plate, one end of the connecting plate passes through the vertical plate part of the bent arc plate and is inserted into the limiting groove opened in the page plate part of the cross plate, and the vertical plate part of the bent arc plate is in contact with the page plate part of the cross plate; The combination of the connecting plates and the bent arc plates is provided in four groups and is evenly distributed around the sliding sleeve.

[0015] The transverse plate parts of the four groups of bent arc plates are in the same cylindrical surface and move through the sliding sleeve, so that they can simultaneously drive the four groups of connecting plates and the bent arc plates to expand or gather through the connecting plates. When fully gathered, the transverse plate parts of the bent arc plates can form a complete cylindrical surface.

[0016] Preferably, a shaft seat is provided at the central part of the other side of the cross plate, the cross plate rotates on the shaft seat, and the shaft seat is fixed on the fixed plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects: The zinc oxide doped thin film processing equipment based on magnetron sputtering processing has a first magnetron coating roller and a second magnetron coating roller arranged in a magnetron sputtering chamber at intervals. After the film enters the magnetron sputtering chamber, the film is guided to pass through the first magnetron coating roller and the second magnetron coating roller successively, so that the front and back sides of the substrate are coated successively. Compared with the prior art, there is no need to perform secondary loading and unloading of the film after coating, which avoids damage to the coated film and is beneficial to improving product quality. Moreover, there is no need to open a cavity and perform secondary vacuuming during coating, which can simplify the process, save time, and is beneficial to improving production efficiency and reducing production costs.

[0018] The zinc oxide doped thin film processing equipment based on magnetron sputtering processing, by adding an evaporation coating film forming process, does not need horizontal electroplating compared to the existing technology, and the process is simpler and more environmentally friendly. By performing the first sputtering coating on the thin film, the thin film and the sputtering layer can form a dense combination, so that the subsequent evaporation coating can form a thicker electrode layer. Finally, the second sputtering coating can form an anti-oxidation protective layer on the surface of the electrode layer, thereby improving the quality of the thin film coating.

[0019] The zinc oxide doped film processing equipment based on magnetron sputtering processing is equipped with a cooling chamber, so that the film can drive the flowing gas to move in the film direction while moving. The cold air effectively pre-cools the side of the film that contacts the cooling roller. Before contacting the cooling roller, the film lowers a certain temperature. After contacting the cooling roller, it can avoid the sudden contraction of the film caused by the sudden drop in temperature, thereby solving the problem of cracks on the film surface caused by the sudden increase in film tension. At the same time, it can achieve dual-sided cooling at the same time, without the need for staff to perform two surface changes, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a processing structure flow chart of the zinc oxide doped thin film processing equipment based on magnetron sputtering.

[0021] Figure 2This is a schematic diagram of the main structure of the auxiliary tensioning guide assembly.

[0022] Figure 3 A schematic side view of a partial structure of an auxiliary tensioning guide assembly.

[0023] in: 1-unwinding chamber; 101-unwinding roller; 102-unwinding guide wheel; 2-processing chamber; 201-processing guide wheel; 202-heating coil; 203-ion source; 3-magnetron sputtering chamber; 301-first magnetron coating roller; 302-sputtering target; 303-sputtering guide wheel; 304-second magnetron coating roller; 305-sputtering direction-changing wheel; 4-evaporation chamber; 401-first evaporation coating roller; 402-second evaporation coating roller; 403-evaporation guide wheel; 404-crucible; 405 -electron gun; 406-evaporation redirecting wheel; 5-cooling chamber; 501-cold air nozzle; 502-first cooling roller; 503-cooling plate seat; 504-second cooling roller; 505-cooling guide wheel; 506-adjusting guide wheel; 6-winding chamber; 601-winding roller; 7-cross plate; 701-bending arc plate; 702-connecting plate; 703-sliding sleeve; 704-limiting groove; 705-connecting plate; 706-knob; 707-sliding rod; 708-screw rod; 709-axle seat. DETAILED DESCRIPTION

[0024] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below through the accompanying drawings and embodiments. However, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the scope of the present invention. In addition, in the following description, the description of known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention. Example 1

[0027] See also Figure 1 , a zinc oxide doped thin film processing equipment based on magnetron sputtering processing, comprising an unwinding chamber 1, a processing chamber 2, a magnetron sputtering chamber 3, an evaporation chamber 4, a cooling chamber 5 and a winding chamber 6, wherein the unwinding chamber 1, the processing chamber 2, the magnetron sputtering chamber 3, the evaporation chamber 4, the cooling chamber 5 and the winding chamber 6 are connected to form a work space that is closed relative to the external environment, and the work space can be in a vacuum state during thin film coating; The unwinding chamber 1 has an outlet downstream, the processing chamber 2, the magnetron sputtering chamber 3, the evaporation chamber 4, the cooling chamber 5 has an inlet upstream and an outlet downstream, and the winding chamber 6 has an inlet upstream, wherein the unwinding chamber 1, the processing chamber 2, the magnetron sputtering chamber 3, the evaporation chamber 4, the cooling chamber 5 and the winding chamber 6 are all modular structures, and a detachable connection method is adopted between two adjacent modular structures. After being connected, the film can be transported in two adjacent chambers, and the connection is sealed to form a working space that is closed relative to the external environment after connection.

[0028] The pump body for evacuating the vacuum can be connected to any one or more of the unwinding chamber 1, the processing chamber 2, the magnetron sputtering chamber 3, the evaporation chamber 4 and the cooling chamber 5, so that the working space can be in a vacuum state during the coating of the thin film. Example 2

[0029] See also Figure 1 On the basis of the above-mentioned embodiment, in the zinc oxide doped thin film processing equipment based on magnetron sputtering processing, the unwinding chamber 1 includes an unwinding roller 101 and an unwinding guide wheel 102; the unwinding roller 101 lowers the film, and the unwinding guide wheel 102 guides the lowered film to the processing chamber 2; the number of unwinding guide wheels 102 can be designed as needed and is not specifically limited here.

[0030] Furthermore, in the present embodiment, the processing chamber 2 includes a processing guide wheel 201, a heating coil 202 and an ion source 203; the processing guide wheel 201 is disposed in the processing chamber 2 to guide the film to pass through the heating coil 202 and the ion source 203 in sequence; the heating coil 202 is suitable for heating the film to remove water vapor and impurities on the front and back sides of the film; the ion source 203 is suitable for increasing the surface roughness of the front and back sides of the film; the number of processing guide wheels 201 can be designed as needed and is not specifically limited herein.

[0031] Furthermore, in the present embodiment, the magnetron sputtering chamber 3 comprises a first magnetron coating roller 301, a sputtering target seat 302, a sputtering guide wheel 303, a second magnetron coating roller 304 and a sputtering direction-changing wheel 305; the first magnetron coating roller 301 and the second magnetron coating roller 304 are symmetrically arranged in the magnetron sputtering chamber 3, and a plurality of sputtering target seats 302 are arranged in the outer circumferential direction thereof, and energy-saving sputtering devices are arranged between the sputtering target seat 302 and the first magnetron coating roller 301, and between the sputtering target seat 302 and the second magnetron coating roller 304. A gap is created for allowing the film to pass through; a sputtering guide wheel 303 is arranged in the magnetron sputtering chamber 3 along the conveying direction of the film, and a sputtering direction-changing wheel 305 guides the film to first pass through the first magnetron coating roller 301 for front-side coating, and then pass through the second magnetron coating roller 304 for back-side coating; the path of the film when passing through the first magnetron coating roller 301 and the second magnetron coating roller 304 successively is "S"-shaped; wherein, the number of the sputtering target 302, the sputtering guide wheel 303 and the sputtering direction-changing wheel 305 can be designed as needed and is not specifically limited herein.

[0032] Furthermore, in the present embodiment, the evaporation chamber 4 comprises a first evaporation coating roller 401, a second evaporation coating roller 402, an evaporation guide wheel 403, a crucible 404, an electron gun 405 and an evaporation redirecting wheel 406; the first evaporation coating roller 401 and the second evaporation coating roller 402 are respectively arranged at two ends of the evaporation chamber 4, and the evaporation guide wheel 403 and the evaporation redirecting wheel 406 guide the film and switch the contact surface by cooperating with the auxiliary tensioning guide assembly; the number of the evaporation guide wheel 403, the evaporation redirecting wheel 406 and the auxiliary tensioning guide assembly can be designed as needed, so that the film can be guided and the contact surface can be conveniently switched.

[0033] The crucible 404 is arranged below the first evaporation coating roller 401 and the second evaporation coating roller 402, and the crucible 404 is suitable for carrying the coating material used for coating; the electron gun 405 is arranged on the cavity wall of the evaporation chamber 4, and the muzzle of the electron gun 405 is arranged directly facing the crucible 404, so that the electron beam emitted by the electron gun 405 can bombard the coating material in the crucible 404, so that the coating material evaporates metal atoms and is deposited on the surface of the film, thereby completing the evaporation coating.

[0034] Furthermore, in the present embodiment, the cooling chamber 5 comprises a cold air nozzle 501, a first cooling roller 502, a cooling plate seat 503, a second cooling roller 504, a cooling guide wheel 505 and an adjusting guide wheel 506; the first cooling roller 502 and the second cooling roller 504 are arranged at both ends of the cooling chamber 5, and both are located at the same horizontal height, the cooling plate seat 503 is located below the first cooling roller 502 and the second cooling roller 504, and gaps through which the film can pass are provided between the cooling plate seat 503 and the first cooling roller 502, and between the cooling plate seat 503 and the second cooling roller 504; the cooling guide wheel 505 guides the film and switches the contact surface, and the adjusting guide wheel 506 switches the transmission direction of the film after cooling. The number of cooling guide wheels 505 can be designed as needed and is not specifically limited herein. A group of adjusting guide wheels 506 is provided.

[0035] Furthermore, in the present embodiment, the guide wheel 506 is adjusted to switch the transmission direction of the film to the winding chamber 6 , in which a winding roller 6 is provided, and the film is wound by the winding roller 6 .

[0036] Specifically, when in use, two magnetron sputtering film-forming processes are implemented on a single side of the film in a magnetron sputtering chamber 3, so that double-sided coating of the film 14 can be achieved in one device. There is no need to perform secondary loading and unloading of the film 14 after coating, thus avoiding damage to the coated film and helping to improve product quality. Moreover, there is no need to open a cavity or perform secondary vacuuming during coating, which can simplify the process, save time, and help to improve production efficiency and reduce production costs.

[0037] Moreover, by adding an evaporation coating film forming process, compared with the prior art, horizontal electroplating is not required, the process is simpler and more environmentally friendly, and different target materials can be installed on the sputtering target holder 302 in different magnetron sputtering chambers 3 as needed, and different coating materials can be placed in the crucible 401 in different evaporation chambers 4 as needed to form different coating layers. Moreover, the first sputtering coating of the thin film can form a dense combination between the thin film and the sputtering layer, so that the subsequent evaporation coating can form a thicker electrode layer, and finally the second sputtering coating can form an anti-oxidation protective layer on the surface of the electrode layer, thereby improving the quality of the thin film coating.

[0038] By adding a cooling chamber 5, the cold air nozzle 501 sprays cold air at the angle between the first cooling roller 501 and the film, and at the angle between the second cooling roller 504 and the film, so that the film drives the flowing gas to move in the film-moving direction while moving, and the cold air effectively precools the side of the film that contacts the cooling roller. Before contacting the cooling roller, the film lowers a certain temperature. After contacting the cooling roller, the film can avoid sudden contraction caused by a sudden drop in temperature, thereby solving the problem of cracks on the film surface caused by a sudden increase in film tension. By setting two groups of cooling plate seats and two cooling rollers, and with the guidance and commutation assistance of multiple cooling guide wheels 505 and adjusting guide wheels 506, double-sided simultaneous cooling can be achieved, eliminating the need for workers to perform two face-changing operations and improving work efficiency.

[0039] The solutions in this embodiment can be selectively combined with the solutions in other embodiments for use. Embodiment 3

[0040] Please refer to Figure 1-3 , on the basis of the above embodiment, for the zinc oxide-doped thin film processing equipment based on magnetron sputtering processing, the tension of the thin film is adjusted by an auxiliary tensioning and guiding assembly during the transmission process.

[0041] The auxiliary tensioning and guiding assembly includes a cross plate 7. A slide bar 707 is fixed at the central part on one side of the cross plate 7, and a shaft seat 709 is arranged at the central part on the other side of the cross plate 7. The cross plate 7 rotates on the shaft seat 709, and the shaft seat 709 is fixed on the fixing plate 1.

[0042] One end of the slide bar 707 is sleeved with a sliding sleeve 703. A lead screw 708 is arranged inside the sliding sleeve 703. One end of the lead screw 708 is threadedly connected inside the slide bar 707, and the other end is fixed with a knob 706. The knob 706 is rotatably arranged inside one end of the sliding sleeve 703, and at the same time, the knob 706 also moves synchronously with the sliding sleeve 703; The knob 706 is arranged in a "soil"-shaped structure and is rotationally clamped inside one end of the sliding sleeve 703. By rotating the knob 706, the lead screw 708 moves inside the slide bar 707, and the knob 706 drives the sliding sleeve 703 to move outside the slide bar 707.

[0043] One outer wall of the sliding sleeve 703 is hinged with a connecting plate 705 through a connecting piece 702. One side of the connecting plate 705 is fixed with a bent arc plate 701. One end of the connecting plate 705 passes through the vertical plate part of the bent arc plate 701 and is inserted into a limiting groove 704 opened in the page plate part of the cross plate 7. The vertical plate part of the bent arc plate 701 is attached to the page plate part of the cross plate 7; The combination of the connecting plate 705 and the bent arc plate 701 has four groups and is evenly distributed around the sliding sleeve 703; the horizontal plate parts of the four groups of bent arc plates 701 are in the same cylindrical surface. By moving the sliding sleeve 703, it drives the four groups of connecting plates 705 and bent arc plates 701 to expand or gather simultaneously through the connecting piece 702. When completely gathered, the horizontal plate parts of the bent arc plates 701 can form a complete cylindrical surface.

[0044] Specifically, during use, when the tension of the film needs to be adjusted during transmission, the knob 706 is turned to move the screw rod 708 inside the slide rod 707, and the knob 706 drives the sleeve 703 to move outside the slide rod 707. When the sleeve 703 moves, the vertical plate part of the bent arc plate 701 is supported by the leaf plate part of the cross plate 7, and one end of the connecting plate 705 is inserted into the limit groove 704. Through the connecting piece 702, the four groups of connecting plates 705 and the bent arc plate 701 can be driven to expand or gather at the same time, thereby adjusting the tension of the film.

[0045] The solution in this embodiment can be selectively combined with the solutions in other embodiments for use.

[0046] It should be noted that although the above embodiments have been described in this article, the scope of patent protection of the present invention is not limited thereby. Therefore, based on the innovative concept of the present invention, changes and modifications made to the embodiments described herein, or equivalent structures, equivalent processes or equivalent functional transformations made using the contents of the present specification and drawings, directly or indirectly applying the above technical solutions to other related technical fields are all included in the scope of protection of the patent of the present invention.

Claims

1. A zinc oxide doped thin film processing equipment based on magnetron sputtering processing, characterized in that: The invention comprises an unwinding chamber (1), a processing chamber (2), a magnetron sputtering chamber (3), an evaporation chamber (4), a cooling chamber (5) and a winding chamber (6); the unwinding chamber (1), the processing chamber (2), the magnetron sputtering chamber (3), the evaporation chamber (4), the cooling chamber (5) and the winding chamber (6) are connected to form a working space which is sealed relative to the external environment, and the working space can be in a vacuum state during thin film coating; The magnetron sputtering chamber (3) comprises a first magnetron coating roller (301), a sputtering target seat (302), a sputtering guide wheel (303), a second magnetron coating roller (304) and a sputtering direction-changing wheel (305); The first magnetron coating roller (301) and the second magnetron coating roller (304) are symmetrically arranged in the magnetron sputtering chamber (3), and a plurality of sputtering target seats (302) are arranged in the outer circumferential direction thereof, and gaps capable of allowing the thin film to pass are arranged between the sputtering target seat (302) and the first magnetron coating roller (301), and between the sputtering target seat (302) and the second magnetron coating roller (304); The sputtering guide wheel (303) is arranged in the magnetron sputtering chamber (3) along the conveying direction of the film, and the sputtering direction-changing wheel (305) guides the film to first pass through the first magnetron coating roller (301) for front coating, and then pass through the second magnetron coating roller (304) for back coating, and the path of the film when passing through the first magnetron coating roller (301) and the second magnetron coating roller (304) successively is "S" shaped.

2. The zinc oxide doped thin film processing equipment based on magnetron sputtering processing according to claim 1 is characterized in that: The unwinding chamber (1) comprises an unwinding roller (101) and an unwinding guide wheel (102); the unwinding roller (101) lowers the film, and the unwinding guide wheel (102) guides the lowered film to the processing chamber (2).

3. The zinc oxide doped thin film processing equipment based on magnetron sputtering processing according to claim 1 is characterized in that: The processing chamber (2) comprises a processing guide wheel (201), a heating coil (202) and an ion source (203); The processing guide wheel (201) is arranged in the processing chamber (2) to guide the film to pass through the heating coil (202) and the ion source (203) in sequence; the heating coil (202) is suitable for heating the film to remove water vapor and impurities on the front and back surfaces of the film; the ion source (203) is suitable for improving the surface roughness of the front and back surfaces of the film.

4. The zinc oxide doped thin film processing equipment based on magnetron sputtering processing according to claim 1 is characterized in that: The evaporation chamber (4) comprises a first evaporation coating roller (401), a second evaporation coating roller (402), an evaporation guide wheel (403), a crucible (404), an electron gun (405) and an evaporation redirection wheel (406); The first evaporation coating roller (401) and the second evaporation coating roller (402) are respectively arranged at two ends of the evaporation chamber (4), and the evaporation guide wheel (403) and the evaporation redirection wheel (406) guide the film and switch the contact surface by cooperating with the auxiliary tensioning guide assembly; The crucible (404) is arranged below the first evaporation coating roller (401) and the second evaporation coating roller (402), and the crucible (404) is suitable for carrying a coating material used for coating; The electron gun (405) is arranged on the cavity wall of the evaporation chamber (4), and the muzzle of the electron gun (405) is arranged facing the crucible (404), so that the electron beam emitted by the electron gun (405) can bombard the coating material in the crucible (404).

5. The zinc oxide doped thin film processing equipment based on magnetron sputtering processing according to claim 1 is characterized in that: The cooling chamber (5) comprises a cold air nozzle (501), a first cooling roller (502), a cooling plate seat (503), a second cooling roller (504), a cooling guide wheel (505) and an adjusting guide wheel (506); The first cooling roller (502) and the second cooling roller (504) are arranged at two ends of the cooling chamber (5), and the two are located at the same horizontal height; the cooling plate seat (503) is located below the first cooling roller (502) and the second cooling roller (504); and gaps are provided between the cooling plate seat (503) and the first cooling roller (502), and between the cooling plate seat (503) and the second cooling roller (504), through which a film can pass; The cooling guide wheel (505) guides the film and switches the contact surface, and the adjusting guide wheel (506) switches the transmission direction of the film after cooling.

6. The zinc oxide doped thin film processing equipment based on magnetron sputtering processing according to claim 5 is characterized in that: The adjusting guide wheel (506) switches the transmission direction of the film to the winding chamber (6); a winding roller (6) is provided in the winding chamber (6), and winding is performed by the winding roller (6).

7. The zinc oxide doped thin film processing equipment based on magnetron sputtering processing according to claim 4 is characterized in that: The auxiliary tensioning guide assembly comprises a cross plate (7), a sliding rod (707) is fixed to a central portion of one side of the cross plate (7), one end of the sliding rod (707) is sleeved with a sliding sleeve (703), a screw rod (708) is arranged inside the sliding sleeve (703), one end of the screw rod (708) is threadedly connected to the inside of the sliding rod (707), and the other end of the screw rod (708) is fixed with a knob (706), the knob (706) is rotatably arranged inside one end of the sliding sleeve (703), and the knob (706) also keeps synchronous movement with the sliding sleeve (703); The outer wall of the sliding sleeve (703) is hingedly connected to a connecting plate (705) via a connecting piece (702); a bent arc plate (701) is fixed to one side of the connecting plate (705); one end of the connecting plate (705) passes through the vertical plate portion of the bent arc plate (701) and is inserted into a limiting groove (704) provided on the leaf plate portion of the cross plate (7); the vertical plate portion of the bent arc plate (701) is in contact with the leaf plate portion of the cross plate (7); The combination of the connecting plate (705) and the bent arc plate (701) is provided in four groups and is evenly distributed around the sliding sleeve (703).

8. The zinc oxide doped thin film processing equipment based on magnetron sputtering processing according to claim 7 is characterized in that: An axle seat (709) is provided at the central portion of the other side of the cross plate (7), the cross plate (7) rotates on the axle seat (709), and the axle seat (709) is fixed on the fixed plate (1).

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